JP6105333B2 - Multiple bonding head alignment method and die bonder - Google Patents

Description

  The present invention relates to a semiconductor manufacturing apparatus such as a die bonder, and more particularly to a die bonder having two or more bonding heads.

In a die bonder having two or more bonding heads and an optical system for one substrate transport lane, different bonding heads may be used to bond to one substrate.
Patent Document 1 discloses a technique regarding a bonder (composite mounting machine) that mounts a completed electronic component molded on the same substrate and a bare chip in a mixed state. And it discloses that the head unit for mounting the finished electronic component, the head unit for mounting the bare chip (die), and two types of head units are necessary. Is not disclosed.

However, each bonding head includes a bonding head table and an optical system table. Therefore, different bonding heads cannot be bonded to the same position on one target substrate due to their inherent differences.
For this reason, in order to bond at the same position of one target substrate, it is necessary to measure the substrate bonded by each bonding head by an inspection apparatus or the like and correct the positional deviation. The position correction by this alignment must be performed every time a new product type is registered.

JP 2001-320195 A

If the position correction is omitted, the bonding position is shifted for each bonding head, and the bonding position accuracy of the apparatus is lowered. The decrease in positional accuracy is a serious problem in devices such as die bonders that handle products that require precise positional accuracy.
However, as described above, each time a new product type is registered, the position of the substrate bonded by each bonding head is measured by an inspection apparatus or the like, and correction by alignment is performed from the measured position information. For this reason, another apparatus for measuring the bonding position, such as an inspection apparatus, is required, and this process is required every time the product type is registered.
In view of the above problems, the present invention provides a position correction method that does not require another apparatus such as an inspection apparatus and can shorten the position correction work time, and uses any of a plurality of bonding heads. Another object of the present invention is to provide a die bonder that can be bonded at the same position.

  In order to achieve the above object, a method for aligning a plurality of bonding heads according to the present invention includes a first bonding step of bonding a first die to a first substrate in a first area in a die bonder having a plurality of bonding heads. A first die recognition step of recognizing the position of the first die die-bonded to the first substrate in the second area and registering it in the storage unit; bonding the second die in the second area A second bonding step, a second die recognition step for recognizing the position of the second die die-bonded to the second substrate in the second area, and the first die registered in the storage unit. A difference calculating step for calculating a difference between the position and the position of the second die, and a position correcting step for adding the calculated difference to a position correction condition, That the position of the die to be bonded with one area to align the position of the die to be bonded with the second area to the first aspect of the present invention.

  In the multiple bonding head alignment method of the first feature of the present invention, the second feature of the present invention is that the first area of the die bonder is located upstream of the second area.

  In the multiple bonding head alignment method according to the first feature or the second feature of the present invention, the third feature of the present invention is to record the alignment of the die position in the product type registration data.

  In order to achieve the above object, a die bonder of the present invention includes a first bonding head that picks up a die and bonds it to a first substrate, and a first bonding head for recognizing the position of the first bonding head. A first area having a second optical system, a second bonding head for picking up a die and bonding the second substrate to a second substrate, and a second area having a second optical system for recognizing the position of the second bonding head And a die bonder for bonding the die to the substrate, wherein the control unit is configured to bond the first die to the first substrate in the first area. The step of recognizing the position of the first die die-bonded to the first substrate in the second area. A first die recognizing unit registered in a storage unit; a second bonding unit for bonding the second die in the second area; and a position of the second die bonded to the second substrate. Second die recognition means for recognizing in a second area, difference calculation means for calculating a difference between the position of the first die and the position of the second die registered in the storage unit, and the calculation A fourth feature of the present invention is that a position correction unit that adds a difference to a position correction condition is provided, and the position of a die bonded in the first area and the position of a die bonded in the second area are aligned.

In the die bonder of the fourth feature of the present invention, the fifth feature of the present invention is that the first area of the die bonder is located upstream of the second area.
In the die bonder according to the fourth feature or the fifth feature of the present invention, the control unit further records the alignment of the position of the die in the product type registration data.

  According to the present invention, a position correction method that does not require another apparatus such as an inspection apparatus and can shorten the position correction work time is realized, and any of a plurality of bonding heads can be used for bonding at the same position. A simple die bonder can be realized.

It is a top view for demonstrating the block structure of one Example of the 2 head die bonder of this invention. It is a top view for demonstrating the problem of the position alignment in 2 head die bonding. It is a top view for demonstrating the problem of the position alignment in 2 head die bonding. It is a top view for demonstrating the problem of the position alignment in 2 head die bonding. It is a top view for demonstrating the problem of the position alignment in 2 head die bonding. It is a top view for demonstrating the block structure of one Example of the multiple head die bonder of this invention. It is a flowchart for demonstrating the procedure of the 2 bonding head alignment process which aligns two heads in the 2 head die bonder of this invention. It is a block diagram which shows one Example of a structure of the control system of the multiple head die bonder of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In addition, the following description is for describing one embodiment of the present invention, and does not limit the scope of the present invention. Accordingly, those skilled in the art can employ embodiments in which these elements or all of the elements are replaced with equivalent ones, and these embodiments are also included in the scope of the present invention.
Further, in this document, in the description of each drawing, components having common functions are denoted by the same reference numerals and description thereof is omitted.

The configuration of an embodiment of the die bonder of the present invention will be described with reference to FIG. FIG. 1 is a plan view for explaining a block configuration of an embodiment of a two-head die bonder according to the present invention. 100 is a die bonder, 10 is a transfer lane, 20 is a first area, 21 is a bonding head for the first area 10, 22 is an optical system for the first area 10, 30 is a second area, 31 is a bonding head for the second area, Reference numeral 32 denotes an optical system in the second area, and reference numeral 70 denotes a control unit that controls each device in the die bonder.
In the die bonder 100 of FIG. 1, the transfer lane 10 loads the substrate 50 into the first area 20 and the second area 20 from the upstream side, and unloads the mounted substrate from the downstream side. That is, the substrate 50 is unloaded from the first area 20 on the upstream side through the second area 30 on the downstream side. The board 50 is, for example, a multi-piece work board in which a plurality of sub boards are arranged uniformly.

The first area 20 includes a bonding head 21 that picks up a die and bonds the die to the substrate 50. The first area 20 has an optical system 22 for accurately positioning the die by performing position recognition for bonding and position recognition of the die 50 and the substrate 50 for bonding.
Further, the second area 30 is downstream of the first area 20, a bonding head 31 that picks up a die and bonds the die to the substrate 50, die position recognition and substrate 50 position recognition, and bonding. For this purpose, an optical system 32 is provided to accurately position the die by correcting the position.

  2 to 5 are plan views for explaining the problem of alignment in the two-head die bonding. 50, 50-0, 50-1, and 50-2 are substrates, 51 is a substrate of the substrate 50, 50-1, or 50-1, and 41 is die-bonded to the substrate 50-1 by the first bonding system 20. The dies 42 are dies bonded to the substrate 50-1 by the second bonding system 30. Reference numeral 50-1 ′ denotes a substrate die-bonded to the substrate 50-1 die bonded by the first bonding system 20 and further to the second bonding system 30.

In the two-head die bonder 100, first, the substrate 50 is on standby before being carried into the first area 20. The substrate 50 is not yet mounted with a die. In the first area 20, there is another substrate 50-1, and die bonding is in progress. Further, another substrate 50-2 is also being die-bonded in the second area 30.
In the two-head die bonder, when the bonding work in the second area (second bonding system) 30 that is the downstream bonding system is completed, even if the work is still in progress in the first area 20 that is the upstream bonding system, The substrate 5 in the first area (first bonding system) 20 is transferred to the second area.

Therefore, as shown in FIG. 2, when the bonding operation in the second area (second bonding system) 30 is completed, the substrate 50-2 after the bonding is carried out downstream. At this time, as shown in FIG. 3, in the substrate 50-1 in the first area (first bonding system) 20, as shown in the enlarged view of the substrate 50-1 indicated by the arrow 301, the die 41 is formed on the child substrate 51. All are not bonded.
However, as shown in FIG. 3, when the substrate 50-2 in the second area has been bonded and carried out, the substrate 50-1 indicated by the arrow 301 is transferred to the second area. .
In the first area 20, when the substrate 50-1 is carried out to the second area 30, as shown in FIG. 4, the substrate 50 waiting upstream is carried in (substrate 50-0).
In this way, the stop time for waiting the substrate of the second bonding system 30 is shortened as much as possible to increase productivity.

However, for this reason, the die bonded by the first bonding system 20 and the die bonded by the second bonding system 30 are mixedly mounted on the same substrate 50, and the ratio of the mixed mounting is not constant. Therefore, in order to realize bonding with high accuracy, alignment between the first bonding system 20 and the second bonding system 30 is necessary.
FIG. 5 is a diagram showing the bonding result of the die of the substrate 50-1 described with reference to FIGS. As shown in FIG. 5, the bonding position of the die 41 on the daughter board 50-1 bonded in the first area 20 and the bonding position of the die 42 on the daughter board 50-1 bonded in the second area 30 are as follows. Shift.

As described above, the displacement of the bonded die in the substrate 50 becomes a serious problem in terms of product quality.
In particular, in a product in which dies are stacked over several layers, this misalignment may affect the yield as well as the product quality.
Therefore, in a die bonder having a plurality of bonding heads, position correction for correcting the bonding positions of the plurality of bonding heads to be indispensable is essential.

An embodiment of the alignment method of the present invention will be described with reference to FIGS. FIG. 6 is a plan view for explaining a simple block configuration of an embodiment of the multi-head die bonder of the present invention. FIG. 7 is a flowchart for explaining the procedure of a two-bonding head alignment process for aligning two heads in the two-head die bonder of the present invention. 600 is a die bonder, 60 is a transport lane, 20 (0) is a first area, 20 (1) is a second area, 20 (2) is a third area,..., 20 (K −1 ) is a Kth area. It is.
In the die bonder 600 of FIG. 6, the transfer lane 60 carries a substrate from the upstream side to the first area 20 ( 0 ), the second area 20 ( 1 ),..., The K area 20 (K −1 ). The mounted board is carried out from the downstream side (K is a natural number of 2 or more). That is, the substrate is unloaded from the upstream first area 20 (0) through the downstream K area 20 (K −1 ). Although not shown, the substrate is, for example, a multi-piece work substrate in which a plurality of child substrates are arranged uniformly. The first area 20 ( 0 ), the second area 20 ( 1 ),..., The K area 20 (K −1 ) are bonded to each other by picking up the die and bonding the die to the substrate. It has a head 21.

The multi-bonding head alignment method of the present invention shown in FIG. 7 will be described using the multi-head die bonder of the present invention shown in FIG. This processing operation is executed by the control unit 70 controlling each device of the die bonder 600. The board is a board for newly registering a product type.
In die bonding (0) step S701, die bonding is performed on the substrate (0) in the first area 20 (0).
Next, in the parameter N initialization step S702, the parameter N is set to 1 (N = 1).
Next, in the next bonding head presence / absence determination step S703, it is determined whether or not the parameter N is larger than the number K of bonding heads of the multi-head die bonder 600. Parameter N is the process proceeds to step S704 if Re der less number bonding head K. Parameter N is the process ends if Kere magnitude than the number of the bonding head K.
Next, in the die position recognition step S704, the substrate (0) to which the die is bonded in the die bonding (0) step S701 is subjected to image analysis processing by the optical system in the Nth area to recognize the die position and the recognized die. Are registered in a storage unit (described later) of the control unit 70.

Next, in die bonding (N) step S705, die bonding is performed on another substrate (N) in the Nth area 20 (N −1 ).
Next, in die position recognition step S706, image analysis processing is performed on the substrate (N) bonded with the die in die bonding (N) step S705 by the optical system in the Nth area to recognize the position of the die.
Next, in a difference calculation step S707, a difference between the die position recognized in the die position recognition step S706 and the die position registered in the storage unit in the die position recognition step S704 is calculated.
Next, in the correction step S708, the difference calculated in the difference calculation step S707 is added to the position correction condition at the mounting (bonding) position of the Nth area.
Next, in the product type registration step S709, the position correction condition obtained in the correction step S708 is recorded in the product type registration data.
Then, the parameter N addition step S710, 1 is added to parameter N (N = + 1), the process proceeds to the bonding head existence determination step S70 3.

  FIG. 8 is a block diagram showing an embodiment of the configuration of the control system of the multi-head die bonder of the present invention. Reference numeral 81 denotes a CPU (Central Processing Unit) of the control unit 70, 82 denotes a storage unit of the control unit 70, 83 denotes an input / output device, 84 denotes a monitor device, and 85 denotes an interface. 23 (0), 23 (1), 23 (2),..., 23 (K) are image processing units, 24 (0), 24 (1), 24 (2),. (K) is a display unit. In the description of FIG. 8 below, the area 20 represents the first area 20 (0), the second area 20 (1), the third area 20 (3),..., The Kth area 20 (K). Called. Similarly, the bonding heads 21 (0), 21 (1), 21 (2),..., 21 (K) are referred to as bonding heads 21 as representatives. Similarly, the optical systems 22 (0), 22 (1), 22 (2),..., 22 (K) are referred to as the optical system 22 as representatives. Similarly, the image processing units 23 (0), 23 (1), 23 (2),..., 23 (K) will be referred to as the image processing unit 23. Similarly, the display units 24 (0), 24 (1), 24 (2),..., 24 (K) are referred to as the display unit 24.

  In FIG. 8, the storage unit 82 stores at least a die bonder operation program, product data for die bonding based on the operation program for each product type, and a product data registration program for registering product data. . The kind data stored as appropriate is stored as appropriate according to the operation of the operator.

The CPU 81 controls each device in the die bonder in accordance with a command from a die bonding operation program or a product data registration program or an input / output device operated by an operator based on the product registration data stored in the storage unit 82. . The monitor device 83 displays an image on the screen in accordance with the above-described operation program, seed data registration program, or a command given from the input / output device 84 according to the operation of the operator. Each area 20 includes a bonding head 21, an optical system 22, an image processing unit 23, and a display unit 24. Each image processing unit 23 analyzes an image sent from the optical system 22 to which it belongs, and transmits the processing result to the control unit 70. Each display unit 24 displays an image sent from the optical system 22, the image processing unit 23, or the control unit 70 to which the display unit 24 belongs.
The interface 85 is an interface that connects the control unit 70, the monitor device 83, the input / output device 84, and each area 20.

According to the embodiments of FIGS. 6 and 7 described above, position correction data that can be bonded to the same position can be quickly calculated in the multi-head die bonder. For this reason, no other inspection device is required. Furthermore, the time required for product type registration can be greatly reduced.
In the above embodiment, the number of dies bonded to the substrate is one, but it goes without saying that a plurality of dies may be used. Also, bonding in which dies are stacked may be used.

The present invention is an optimum alignment method for a die bonder and a flip chip bonder having a plurality of bonding heads.
Further, the present invention can be applied not only to a die bonder but also to a wire bonder, and is particularly effective when applied to a die bonder or a wire bonder in which a plurality of dies having different sizes are mounted on one substrate. Further, when applied to a die bonder for stacking dies or a wire bonder for bonding to stacked dies, the effect is great.
Furthermore, it is also optimal for alignment in the case of applying a plurality of times in an adhesive application process in a die bonder or an automatic discharge device.

  10: transport lane, 20: first area, 20 (0): first area, 20 (1): second area, 20 (2): third area, 20 (K): Nth area, 21: bonding Head: 22: Optical system, 23: Image processing unit, 24: Display unit, 30: Second area, 31: Bonding head, 32: Optical system, 41, 42: Die, 50, 50-0, 50-1, 50-2: Board, 51: Sub board, 60: Transfer lane, 70: Control unit, 81: CPU, 82: Storage unit, 83: Input / output device, 84: Monitor device, 85: Interface, 100: Die bonder, 600 : Die bonder.

Claims (6)

A method of aligning a plurality of bonding heads of a die bonder having a plurality of bonding heads ,
A first bonding step of bonding the first die to a first substrate in the first area,
A first die recognition step of registering in the storage unit the position of the first die and die-bonded to the first substrate is recognized by the second area,
A second bonding step of bonding the second die to the second substrate in the second area,
A second die recognition step recognizes in the second area of the location of the second die and die-bonded to the second substrate,
A difference calculation step of calculating a difference between the position of the second die and the position of the first die that is registered in the storage unit,
A position correction step of adding the calculated difference to the position correction condition ;
With
A method of aligning a plurality of bonding heads, wherein the position of a die to be bonded in the first area and the position of a die to be bonded in the second area are aligned.   The multiple bonding head alignment method according to claim 1, wherein the first area of the die bonder is positioned upstream of the second area.   3. The multiple bonding head alignment method according to claim 1, wherein the alignment of the die position is recorded in product type registration data. A first bonding head for picking up a first die and bonding it to a first substrate ;
A first area having a first optical system for recognizing the position of the first bonding head,
A second bonding head for picking up a second die and bonding it to a second substrate ;
A second area having a second optical system for recognizing the position of the second bonding head,
And the control section,
Bei to give a,
Before Symbol control unit,
First bonding means for bonding the first die to the first substrate in the first area;
First die recognition means for recognizing the position of the first die die-bonded to the first substrate in the second area and registering it in a storage unit;
A second bonding means for bonding the second die to said second substrate in said second area,
A second die recognizing means recognizes the position of the second die and die-bonded to the second substrate in the second area,
Difference calculating means for calculating a difference between the position of the first die and the position of the second die registered in the storage unit ;
And position correcting means for adding the difference obtained by the calculation to the position correction condition,
With
A die bonder characterized in that a position of a die bonded in the first area and a position of a die bonded in the second area are aligned.   5. The die bonder according to claim 4, wherein the first area of the die bonder is located upstream of the second area.   6. The die bonder according to claim 4, wherein the control unit further records the alignment of the position of the die in product type registration data.

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