JP6101557B2 - Cutting equipment - Google Patents

Description

  The present invention relates to a cutting device that divides a plate-like workpiece, and particularly to a cutting device that divides a package substrate.

  Electronic devices such as mobile phones and personal computers are required to be lighter and smaller, and package technologies called CSP (Chip Size Package) and QFN (Quad Flat Non-leaded Package) have also been developed for semiconductor chip packages. Has been. Such a package substrate is divided into individual package devices by being processed along a division line by a cutting blade while being placed on the holding surface of the holding table. In this case, the holding surface of the holding table is formed with a relief groove for escaping the cutting blade of the cutting blade at a position corresponding to the planned dividing line, and the suction port for holding each package device in each region partitioned by the relief groove Is formed.

  Conventionally, as such a cutting apparatus, in addition to a mechanism for cutting a package substrate, an apparatus having an accommodation mechanism for accommodating individual package devices divided by a cutting blade in a tray is known (for example, a patent). Reference 1). In the storage mechanism described in Patent Document 1, when individually divided package devices are placed on a pickup table, the package devices are picked up one by one by transfer means and are arranged and stored in a tray in a tray storage place. . Further, the tray in which the individual package devices are accommodated is conveyed toward the accommodation rack of the cutting apparatus by the conveyance table.

JP 2001-023936 A

  However, the cutting apparatus described in Patent Document 1 must be provided with a pickup table for the accommodation mechanism in addition to the holding table used during cutting. In addition, a transfer means for transferring the package device from the pickup table to the tray and a transfer means for transferring the tray from the tray storage place to the transport table are required, resulting in a problem that the apparatus configuration is complicated and large, and the equipment cost increases. is there. Further, in the above-described cutting apparatus, since the package devices are picked up one by one and accommodated in the tray, the work time when the package devices are transferred increases.

  This invention is made | formed in view of this point, and it aims at providing the cutting device which can accommodate each device after a division | segmentation in a short time by a simple and cheap structure.

  The cutting apparatus according to the present invention includes a holding table that holds a back surface side of a workpiece in which a plurality of devices are partitioned on a surface by dividing lines, and the workpiece held on the holding table along the dividing lines. A cutting device comprising: a cutting means that divides and divides the device into a plurality of devices that are cut into pieces by the cutting means and sucked from the holding table. An ejector having a supply port, an air discharge port, and a vacuum suction port, the air discharge port and the vacuum suction port being arranged in a straight line, and a tube made of a flexible material, and one end of the ejector A flexible tubular member having an opening connected to the vacuum suction port and having the other end opened downward; a storage box for storing the plurality of devices discharged from the air discharge port of the ejector; flexible The opening of the tubular member and a moving section for moving and brought close to the upper over the workpiece entire workpiece is suction-held on the upper surface of the holding table.

  According to this configuration, the workpiece is divided into individual devices by the cutting means on the holding table, and a plurality of devices singulated on the holding table are sucked into the opening of the flexible tubular member and accommodated. Housed in a box. Thus, since the individual devices on the holding table are sent out to the storage box by the suction force, the collection time can be shortened as compared with the configuration in which the individual devices are collected by the pickup operation. In addition, since individual devices are collected directly from the holding table into the storage box, a storage mechanism equipped with a pick-up table or the like is not required, simplifying the device configuration, reducing costs, and saving space in the device. Can be achieved.

  Further, in the cutting apparatus of the present invention, the holding table is to be processed in a state in which a holding tape attached to an annular frame is attached to the back surface of the workpiece in which a plurality of devices are partitioned on the front surface by a division line. The back side of the object is sucked and held, and after the cutting process, the opening of the flexible tubular member is brought close to the plurality of devices after cutting on the holding tape, and the holding tape is used as the device. By sucking the device with a suction force that overcomes the adhesive force, the device is peeled from the holding tape and stored in the storage box.

  Further, in the cutting apparatus of the present invention, the holding table includes a plurality of suction holes for sucking and holding the back surfaces of the plurality of devices each having a plurality of devices defined on the front surface by division lines, and the plurality of suction holes. A plurality of escape grooves formed along the planned dividing line, and a suction source communicating with the suction hole via a solenoid valve, and the opening is sucked and held by the holding table after the cutting process. Further, the device is brought close to the upper side of the plurality of devices and the suction of the back surface of the device is released, and the device is sucked into the opening and the device is accommodated in the accommodation box.

  According to the present invention, by collecting individual devices divided by the suction force directly from the holding table, the divided individual devices can be accommodated in a short time with a simple and inexpensive configuration.

It is a perspective view of the cutting device concerning this embodiment. It is a cross-sectional schematic diagram of the suction recovery means according to the present embodiment. It is a perspective view which shows the suction state of the suction collection means which concerns on this Embodiment. It is explanatory drawing of processing operation by the cutting device which concerns on this Embodiment. It is a perspective view which shows the attraction | suction state using the holding table which concerns on a modification.

  Hereinafter, a cutting apparatus according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a cutting apparatus according to the present embodiment. FIG. 2 is a schematic cross-sectional view of the suction recovery means according to the present embodiment. FIG. 3 is a perspective view showing a suction state of the suction recovery means according to the present embodiment. Here, although the cutting device provided with a pair of cutting blade is illustrated, it is not limited to this structure. The present invention can be applied to any cutting apparatus as long as it can divide a workpiece into individual devices.

  As shown in FIG. 1, the cutting apparatus 1 divides the workpiece W on the holding table 3 into individual devices D by a pair of cutting means 5, and then holds the individual devices D by the suction recovery means 6. It is configured to recover from. As shown in FIG. 3, the workpiece W is a package substrate formed in a substantially rectangular plate shape, and is partitioned in a grid pattern by scheduled division lines 81 arranged on the surface. The workpiece W is provided with a plurality (three in the present embodiment) of device formation regions 82 for the device D in the longitudinal direction, and a peripheral region 83 serving as an end material is provided around each device formation region 82. It has been.

  A plurality of devices D are formed in the device forming region 82, and each device D is sealed with a mold resin from the back side. A holding tape 85 is attached to the back surface 84 (see FIG. 4) of the workpiece W, and an annular frame 86 is attached to the outer periphery of the holding tape 85. The workpiece W is carried into the cutting device 1 while being supported by the annular frame 86 via the holding tape 85. The workpiece W is not limited to a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate, and the strength of the device after the division is increased to the extent that it is not damaged during suction collection. Anything can be used.

  Returning to FIG. 1, the center of the upper surface of the base 2 is opened in a rectangular shape so as to extend in the X-axis direction, and a moving plate 31 and a waterproof cover 32 are provided so as to cover the opening. On the moving plate 31, the holding table 3 is provided to be rotatable around the Z axis. A ball screw type moving mechanism (not shown) for moving the holding table 3 in the X-axis direction is provided below the waterproof cover 32 and the moving plate 31. On the surface of the holding table 3, a holding surface 33 that sucks and holds the back surface of the workpiece W is formed by a porous ceramic material. The holding surface 33 is connected to a suction source (not shown) through a flow path in the holding table 3, and the workpiece W is sucked and held by the negative pressure generated on the holding surface 33.

  Around the holding table 3, four clamp portions 34 that clamp and fix the annular frame 86 around the workpiece W are provided. A gate-shaped column portion 21 is provided on the base 2 so as to stand over an opening extending in the X-axis direction. The portal-shaped column portion 21 is provided with a moving portion 4 that indexes and feeds the pair of cutting means 5 in the Y-axis direction and moves up and down in the Z-axis direction above the holding table 3. Although details will be described later, the moving unit 4 is used not only as a mechanism for moving the pair of cutting means 5 but also as a mechanism for moving the opening 611 serving as the suction port of the suction collecting means 6.

  The moving unit 4 has a pair of guide rails 41 parallel to the Y-axis direction with respect to the front surface of the column part 21 and a pair of motor-driven Y-axis tables 42 slidably installed on the pair of guide rails 41. ing. The moving unit 4 includes a pair of guide rails 43 arranged in front of each Y-axis table 42 and parallel to the Z-axis direction, and a motor-driven Z-axis table 44 slidably installed on the guide rails 43. have. Under each Z-axis table 44, cutting means 5 for cutting the workpiece W into the workpiece W and dividing it along the scheduled division line 81 is provided.

  A nut portion (not shown) is formed on the back side of each Y-axis table 42, and a ball screw 45 is screwed to these nut portions. Further, nut portions (not shown) are formed on the back side of each Z-axis table 44, and ball screws (not shown) are screwed into these nut portions. Drive motors 47 and 48 are connected to one end of the ball screw 45 for the Y-axis table 42 and the ball screw for the Z-axis table 44, respectively. A ball screw 45 (Z-axis ball screw not shown) is rotationally driven by these drive motors 47 and 48, so that the pair of cutting means 5 moves in the Y-axis direction and the Z-axis direction along the guide rails 41 and 43. Is done.

  The cutting blade 51 of the cutting means 5 is provided at the tip of the spindle 52. The cutting blade 51 is covered with a blade cover 53, and the blade cover 53 is provided with an injection nozzle that injects cutting water toward the cutting portion. The cutting means 5 rotates the cutting blade 51 at high speed, and cuts the workpiece W along the planned division line 81 while spraying cutting water from a plurality of spray nozzles onto the cutting portion. One blade cover 53 is provided with an opening 611 of a suction collection means 6 for collecting the device D separated from the holding table 3. The opening 611 is connected to the base 2 side via a hose-like flexible tubular member 61 and can follow the movement of the cutting means 5.

  As shown in FIG. 2, the suction recovery means 6 is configured to position an opening 611 serving as a suction port on the holding table 3 and to send out the divided device D to the storage box 63 by the suction force generated by the ejector 62. Has been. The ejector 62 is formed in a cylindrical shape having one end on the inlet side serving as a vacuum suction port 621 and the other end on the outlet side serving as an air discharge port 622. The vacuum suction port 621 and the air discharge port 622 are arranged on a straight line, and an air supply port 623 for supplying compressed air from a direction intersecting the straight line is formed on the peripheral wall of the ejector 62. When compressed air is supplied from the supply source 66 toward the air discharge port 622 via the air supply port 623, an air flow from the vacuum suction port 621 toward the air discharge port 622 is generated.

  The vacuum suction port 621 of the ejector 62 is connected to one end of a flexible tubular member 61 that is flexible while ensuring a suction path. An opening 611 fixed to the blade cover 53 of the cutting blade 51 is provided at the other end of the flexible tubular member 61, and the other end of the flexible tubular member 61 is opened downward through the opening 611. ing. The flexible tubular member 61 is formed by winding a spiral wire around the outer surface of the tubular member, and the tubular shape is maintained without being crushed when bent. Thereby, the opening 611 and the ejector 62 are communicated with each other without closing the suction path, and the suction force necessary for sucking the device D separated into pieces is always ensured.

  One end of a tubular member 64 partially formed of mesh is connected to the air discharge port 622 of the ejector 62. Connected to the other end of the tubular member 64 is a cyclone container 65 that converts the airflow from the ejector 62 into a vortex. The cyclone container 65 is formed in a cylindrical shape with the lower end opened, and is disposed above the storage box 63. A buffer member 651 is provided on the inner peripheral surface of the cyclone container 65 at a location facing the other end of the tubular member 64. The cyclone container 65 receives the device D discharged from the tubular member 64 by the buffer member 651 and drops it spirally along the inner wall surface by the vortex.

  Thereby, in the cyclone container 65, the momentum at the time of discharge of the device D is attenuated, and the device D falls from the lower end of the cyclone container 65 and is accommodated in the accommodation box 63. In this case, since the strength of the device D is increased by packaging, the device D is not easily damaged by an impact at the time of dropping.

  In the cutting apparatus 1 configured as described above, as shown in FIG. 1, the workpiece W is held on the holding table 3 via the holding tape 85, and cutting is performed by the movement of the Y-axis table 42 in the Y-axis direction. The blade 51 is aligned with the division line 81 of the workpiece W. Next, the cutting depth of the cutting blade 51 rotated by the movement of the Z-axis table 44 in the Z-axis direction with respect to the workpiece W is adjusted. Then, when the holding table 3 is relatively moved with respect to the cutting blade 51 rotated at a high speed, the workpiece W is cut along the scheduled division line 81 and divided into individual devices D.

  After that, as shown in FIG. 3, the openings 611 of the suction collection means 6 are brought close to the top of the plurality of devices D, and a suction force is generated in the openings 611. In this case, a suction force that overcomes the force with which the holding tape 85 adheres the device D is generated in the opening 611, and the device D is peeled from the holding tape 85 and sucked into the opening 611. Then, the opening 611 is moved over the entire surface of the workpiece W by the moving unit 4 (see FIG. 1), and all the devices D are collected on the holding tape 85, leaving the peripheral region 83 of the workpiece W as an end material. Is done.

  With reference to FIG. 4, the processing operation by the cutting apparatus will be described. FIG. 4 is an explanatory diagram of the machining operation by the cutting device according to the present embodiment. The following processing operations are merely examples, and can be changed as appropriate. In FIG. 4, for convenience of explanation, the suction recovery means is shown in a cross-sectional view.

  As shown in FIG. 4A, the back surface 84 of the workpiece W is attached to the holding tape 85 stretched on the annular frame 86, and the back surface 84 side of the workpiece W is attached to the holding table 3 via the holding tape 85. Adsorption is held. The cutting blade 51 is aligned with the planned division line 81 of the workpiece W by the moving unit 4 (see FIG. 1), and the workpiece W is cut by the cutting blade 51. The cutting blade 51 is cut until the cutting blade 51 reaches the holding tape 85, and the holding table 3 is cut and fed to the cutting blade 51.

  In this case, the opening 611 of the suction recovery means 6 is also moved together with the cutting blade 51 by the moving part 4, but the height of the opening 611 of the suction recovery means 6 is such that the workpiece W is cut into the cutting blade 51. In such a state, the height is adjusted so as not to interfere with the workpiece W. For this reason, the workpiece W is not damaged by the opening 611 at the time of cutting. In this way, the workpiece W is divided into individual devices D by being cut along all the division lines 81.

  As shown in FIG. 4B, when the workpiece W is separated into devices D by cutting, the opening 611 of the suction recovery means 6 is positioned above the device D by the moving unit 4 (see FIG. 1). . Then, the opening 611 is approached above the device D with a distance so that the cutting edge of the cutting blade 51 does not contact the device D. For this reason, the device D separated by the cutting blade 51 at the time of device collection is not damaged. Thus, the opening 611 and the cutting blade 51 do not interfere with the workpiece W when the cutting blade 51 performs cutting, and the cutting blade 51 contacts the workpiece W when the device is recovered by the opening 611. The position is not adjusted.

  When the opening 611 is brought close to the device D, compressed air is supplied to the air supply port 623 of the ejector 62, and an air flow from the opening 611 toward the accommodation box 63 is generated. Due to this air flow, a suction force stronger than the adhesive force of the holding tape 85 to the device D is generated in the opening 611. The device D is peeled off from the holding tape 85 by the suction force from the opening 611, and the device D is sent out toward the storage box 63 in the air current. As described above, since the device D is recovered directly from the holding table 3 by the suction force, the recovery time can be shortened as compared with the configuration of recovering by the pickup operation.

  As shown in FIG. 4C, when the device D is sucked from the opening 611, the device D is fed into the cyclone container 65 through the flexible tubular member 61, the ejector 62, and the tubular member 64. In the cyclone container 65, the device D discharged from the tubular member 64 is received by the buffer member 651. Since a vortex is generated in the cyclone container 65, the device D received by the buffer member 651 rotates along the inner wall surface of the cyclone container 65. The device D is housed in the housing box 63 in a state where the speed of the device D is sufficiently lowered while dropping in a spiral shape along the inner wall surface of the cyclone container 65. As a result, the device D is prevented from being damaged by an impact when dropped onto the storage box 63.

  As described above, according to the cutting apparatus 1 according to the present embodiment, the workpiece W is divided into the individual devices D by the cutting means 5 on the holding table 3, and a plurality of separated devices D are obtained. It is sucked into the opening 611 of the suction recovery means 6 and stored in the storage box 63. Thus, since the individual devices D on the holding table 3 are sent out to the storage box 63 by the suction force, the collection time can be shortened as compared with the configuration in which the individual devices D are collected by the pickup operation. Further, since the individual devices D are collected directly from the holding table 3 into the storage box, a storage mechanism having a pickup table or the like is not necessary, simplifying the device configuration, reducing costs, and saving the device. Space can be achieved.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above-described embodiment, the holding table 3 is configured to form the holding surface 33 with a porous ceramic material and hold the workpiece W via the holding tape 85, but is not limited to this configuration. The holding table may have any configuration as long as it can hold the workpiece W. For example, as shown in FIG. 5A, in the holding table 71, a relief groove 73 for escaping the cutting edge of the cutting blade 51 along the division line 81 is formed in the holding surface 72, and in each region partitioned by the relief groove 73. A configuration in which a suction hole 74 for holding the separated device D may be formed. Each suction hole 74 communicates with a suction source (not shown) via an electromagnetic valve (not shown).

  As shown in FIG. 5B, when cutting is performed, the peripheral region 83 (end material) is skipped from the workpiece W during processing, and only the device D separated into pieces on the holding table 71 is obtained. Left behind. Thereafter, the opening 611 of the suction recovery means 6 is brought close to the upper side of the device D, and suction to the back surface of each device D by each suction hole 74 is released. Then, the opening 611 is moved over the entire surface of the workpiece W by the moving unit 4 (see FIG. 1) while a suction force is generated in the opening 611, and all the devices D are collected. Note that the suction of each suction hole 74 may be released individually, or the suction of all the suction holes 74 may be released simultaneously.

  Further, in the above-described embodiment, the workpiece W is separated by the plurality of devices D and then collected by the suction collection means 6. However, the present invention is not limited to this configuration. You may make it the structure which collect | recovers the device D separated by the suction collection | recovery means 6, dividing the workpiece W. FIG.

  In the above-described embodiment, the opening 611 of the suction recovery means 6 is moved by the moving part 4 used by the cutting means 5, but the present invention is not limited to this structure. The opening 611 of the suction recovery means 6 may be configured to be moved by a dedicated moving unit.

  In the above-described embodiment, the opening 611 of the suction recovery means 6 is attached to one side of the pair of cutting means 5. However, the present invention is not limited to this structure. You may make it the structure by which the opening part 611 of the suction collection means 6 is attached to the both sides of a pair of cutting means 5. FIG.

  As described above, the present invention has an effect that each divided device can be accommodated in a short time with a simple and inexpensive configuration, and in particular, a package substrate such as a CSP substrate or a QFN substrate can be provided. It is useful for a cutting device that divides.

DESCRIPTION OF SYMBOLS 1 Cutting device 3 Holding table 4 Moving part 5 Cutting means 6 Suction collection | recovery means 51 Cutting blade 61 Flexible tubular member 611 Opening part 62 Ejector 621 Vacuum suction port 622 Air discharge port 623 Air supply port 63 Storage box 71 Holding table 72 Holding Surface 73 Escape groove 74 Suction hole 81 Scheduled line 84 Back surface 85 Holding tape 86 Ring frame

Claims (3)

A holding table that holds the back side of a workpiece, on which a plurality of devices are partitioned by a scheduled division line, and a cutting means that divides the workpiece held by the holding table along the scheduled division line A cutting device comprising:
A suction recovery means for sucking a plurality of devices cut into pieces by the cutting means from the holding table;
The suction recovery means includes an air supply port, an air discharge port, and a vacuum suction port, and an ejector in which the air discharge port and the vacuum suction port are arranged in a straight line, and a flexible material in a tubular shape. A flexible tubular member having an opening formed at one end connected to the vacuum suction port of the ejector and having the other end opened downward; and the plurality of devices discharged from the air discharge port of the ejector And a moving part that moves the opening of the flexible tubular member close to the upper side of the workpiece sucked and held on the upper surface of the holding table and moves over the entire surface of the workpiece. Cutting device provided. The holding table sucks and holds the back side of the work piece in a state in which a holding tape attached to the annular frame is attached to the back face of the work piece on which a plurality of devices are partitioned by a line to be divided.
After the cutting, the opening of the flexible tubular member is brought close to the top of the plurality of devices after cutting on the holding tape, and the suction force that overcomes the force with which the holding tape sticks the device. 2. The cutting apparatus according to claim 1, wherein the device is detached from the holding tape and sucked into the housing box by sucking the device. The holding table is formed along the plurality of scheduled holes and the plurality of suction holes for sucking and holding the back surfaces of the plurality of devices of the workpiece, the plurality of devices being partitioned on the front surface by the planned divided lines. A plurality of escape grooves, and a suction source communicating with the suction hole via a solenoid valve,
After the cutting process, the opening is brought close to the upper side of the plurality of devices sucked and held by the holding table and the suction of the back surface of the device is released, and the device is sucked into the opening and the storage box is filled with the device. The cutting apparatus according to claim 1, wherein the device is accommodated.

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