JP6091233B2 - Organic EL device - Google Patents

Description

  The present invention relates to an organic EL (Electro Luminescence) device that is less likely to cause luminance unevenness and has high sealing properties.

  In recent years, organic EL devices have attracted attention as a lighting device that can replace incandescent lamps and fluorescent lamps, and many studies have been made.

Here, the organic EL device is obtained by stacking an organic EL element on a base material such as a glass substrate and providing a power feeding structure to the organic EL element.
In addition, the organic EL element has two or more light-transmitting electrodes facing each other, and a light emitting layer made of an organic compound is laminated between the electrodes. The organic EL device emits light by the energy of recombination of electrically excited electrons and holes.
The organic EL device is a self-luminous device and can emit light of various wavelengths by appropriately selecting the material of the light emitting layer. Further, since the thickness is extremely thin compared to incandescent lamps and fluorescent lamps, and the light is emitted in a planar shape, there are few restrictions on the installation location.

By the way, the organic EL device has a sealing structure that blocks the organic EL element from the external atmosphere in order to prevent moisture and oxygen (hereinafter, also referred to as water) from entering the organic EL element. However, when the sealing function of the organic EL element is insufficient, when the organic EL device is used for a long time, a non-light emitting point called a dark spot is generated. The dark spot will be described in detail. When the organic EL element is not sufficiently sealed, water or the like enters the sealing structure, and the organic EL element is exposed to water or the like. When used (lighted) in this state, an electrode constituting the organic EL element or a part of the organic compound layer near the electrode interface is oxidized, and an insulating oxide film is formed on the surface. When this oxide film is formed, the formation location is partially insulated, so that the location does not emit light during lighting and a dark spot is formed.
That is, in order to prevent the formation of dark spots in the organic EL device, it is necessary to reliably prevent the entry of water or the like into the organic EL element.

On the other hand, in order to cause the organic EL device to emit light in the same manner as incandescent lamps, fluorescent lamps, and LED lighting, power is supplied from an external power source to the organic EL element inside the sealing structure, and between the two electrodes described above. It is necessary to apply a voltage.
Therefore, Patent Document 1 proposes a power supply structure for supplying power from an external power source to an organic EL element while ensuring a certain sealing property.

JP 2009-259413 A

  The organic EL element (organic EL device) described in Patent Document 1 forms a first transparent electrode and a second transparent electrode that are extended inside and outside the sealing plate, and the first transparent electrode and the anode are formed inside the sealing plate. The second transparent electrode and the cathode are connected to each other to connect to an external power source outside the sealing plate.

However, since both the first transparent electrode and the second transparent electrode are made of indium tin oxide (ITO), the internal resistance is higher than that of metal. Therefore, it is necessary to provide a solder layer on the surface as an auxiliary electrode for reducing resistance.
In addition, since a space is formed between the cathode and the sealing plate inside the sealing plate of the organic EL element (organic EL device) described in Patent Document 1, heat generated during lighting is generated in the space. I'm going to stay Therefore, the inside of the sealing plate is likely to become high temperature, and the light emitting layer may be deteriorated. Furthermore, since the reaction rate in the light emitting layer generally depends on the temperature, if a temperature distribution occurs in the light emitting surface (light emitting surface), the reaction rate may be different and uneven brightness may occur. .

  Therefore, the present invention solves the above-described problems, and provides an organic EL device in which local heat collection is unlikely to occur while ensuring sealing performance.

The invention according to claim 1 for solving the above-described problem includes a laminate including a first electrode layer, an organic light emitting layer, and a second electrode layer on a polygonal substrate, and the substrate is viewed in plan view. In the organic EL device having a light emitting region that emits light during lighting and a non-light emitting region that does not emit light, the second electrode layer has higher conductivity than the first electrode layer, and the non-light emitting region is It is provided so as to surround the light emitting region, and in the non-light emitting region, in the vicinity of at least one corner of the substrate, the first electrode layer is continuously removed and isolated from the surroundings An isolated portion is present, and has a sealing layer and a conductive member on the stacked body, and the stacked body in the light emitting region is sealed by the sealing layer, and in the non-light emitting region Part of the second electrode layer forms an exposed portion exposed from the sealing layer, and the exposed portion Is fixed to the isolated portion, and the conductive member is located outside the sealing layer on the basis of the laminate, and is provided in the entire light emitting region. On the projection surface in the thickness direction , the first electrode layer is continuously connected also to at least one corner adjacent to the corner within the non-light-emitting region and connected to the exposed portion. An isolated isolated portion exists, and the isolated portion includes a first insulating groove and a second insulating groove parallel to two sides forming a corner, and the first insulating groove and the second insulating groove. A third insulating groove that connects the grooves, and has an insulating groove for sealing that extends between the third insulating grooves that form the respective isolated portions, and the first electrode layer and the conductive member include: It is bonded via a moisture-proof adhesive, and the adhesive is filled inside the insulating groove for sealing. It is an organic EL device according to claim.
According to a second aspect of the present invention, a laminate including a first electrode layer, an organic light emitting layer, and a second electrode layer is provided on a polygonal substrate, and emits light during lighting when the substrate is viewed in plan. In an organic EL device having a light emitting region and a non-light emitting region that does not emit light, the second electrode layer has higher conductivity than the first electrode layer, and the non-light emitting region surrounds the light emitting region. In the non-light-emitting region, in the vicinity of at least one corner of the substrate, there is an isolated portion that is isolated from the surrounding area by continuously removing the first electrode layer, The laminated body has a sealing layer and a conductive member, the laminated body in the light emitting region is sealed with a sealing layer, and a part of the second electrode layer in the non-light emitting region is Forming an exposed portion exposed from the sealing layer, and the exposed portion is fixed to the isolated portion. The conductive member is positioned outside the sealing layer with respect to the laminate, and the conductive member is connected to the exposed portion on the projection surface in the thickness direction of the isolated portion, and the isolated The portion is formed by an insulating groove, and the insulating groove includes a first insulating groove and a second insulating groove parallel to two sides forming the corner portion, and the first insulating groove and the second insulating groove. The organic EL device is characterized in that the third insulating groove is connected to an intermediate portion of the first insulating groove or the second insulating groove.
That is, the above-described invention includes a laminate including a first electrode layer, an organic light emitting layer, and a second electrode layer on a polygonal substrate, and emits light when illuminated when the substrate is viewed in plan view. In the organic EL device having a non-light-emitting region that does not emit light, the second electrode layer has higher conductivity than the first electrode layer, and the non-light-emitting region is provided so as to surround the light-emitting region. In the non-light emitting region, in the vicinity of at least one corner of the substrate, the first electrode layer is continuously removed and an isolated portion isolated from the surroundings exists, and the stacked layer The body has a sealing layer and a conductive member, the laminate in the light emitting region is sealed by the sealing layer, and a part of the second electrode layer in the non-light emitting region is An exposed portion exposed from the sealing layer is formed, and the exposed portion is fixed to the isolated portion. The conductive member is located outside the sealing layer with respect to the laminate and provided in the entire light emitting region, and the conductive member is formed on the projection surface in the thickness direction of the isolated portion. The connection with the exposed portion relates to the organic EL device.

According to the configuration of the present invention, the first electrode layer is continuously removed in the vicinity of one corner, and there is an isolated portion isolated from the surroundings. That is, the isolated portion made of the first electrode layer is insulated from the first electrode layer in the light emitting region in the plane direction, and is also insulated from the other first electrode layers in the non-light emitting region.
According to the configuration of the invention described above, the exposed portion where a part of the second electrode layer is exposed from the sealing layer is fixed to the isolated portion. That is, since the isolated portion insulated from the stacked body in the light emitting region and the exposed portion made of the second electrode layer are integrally connected, the isolated portion functions as a base and hardly peels from each other.
And according to the structure of said invention, the electrically-conductive member is connected with the said exposed part on the thickness direction projection surface of an isolated part. That is, a conductive path from the exposed portion of the conductive member to the second electrode layer in the light emitting region is formed. In other words, that is, the conductive member is connected not by the isolated portion but by the exposed portion having higher conductivity than the isolated portion. Therefore, for example, even if the first electrode layer has a higher internal resistance than a metal such as a transparent conductive oxide, the second electrode in the light emitting region is not provided with a conductive adhesive such as solder. Power can be supplied to the electrode layer.
Furthermore, according to the structure of said invention, the electrically-conductive member is provided in the whole light emission area | region. In other words, the conductive member is located on the projection surface in the stacking direction of the stack in the light emitting region. Therefore, at the time of lighting, the heat generated in the laminated body in the light emitting region can be soaked in the conductive member. Therefore, the temperature of the stacked body in the light emitting region is uniform, and uneven brightness can be suppressed.

According to the first aspect of the present invention, there is an isolated portion in which the first electrode layer is continuously removed in the non-light-emitting region and in the vicinity of at least one corner adjacent to the corner. And the isolated portion includes a first insulating groove and a second insulating groove parallel to two sides forming a corner portion, and a third insulating groove connecting the first insulating groove and the second insulating groove. And has a sealing insulating groove extending so as to connect the third insulating grooves forming the respective isolated portions, and the first electrode layer and the conductive member are bonded via a moisture-proof adhesive. and which, the bonding material is that is filled in the sealing insulating groove.

  According to the configuration of the present invention, there are two or more isolated portions, and the first electrode layer and the conductive layer are electrically connected via the sealing insulating groove extending so as to connect the third insulating grooves of the adjacent isolated portions. The members are connected by a moisture-proof adhesive. That is, entry of water or the like from the non-light emitting area toward the light emitting area can be blocked by the moisture-proof adhesive. Therefore, water etc. are hard to touch the laminated body in a light emission area | region, and sealing property is high.

By the way, an illuminating device used in a daily space such as a house is often attached by a fixture such as a hook ceiling provided on a ceiling, and current is often supplied from a power supply line in the fixture. Such a fixture is considerably small with respect to the area of the lighting device, and is attached to the center of the lighting device to connect a power supply line so that a current is intensively supplied from the attachment site.
However, since the organic EL device emits light as described above, a current must flow from one end to the opposite end to illuminate the entire surface. Therefore, in order to apply the organic EL device to a conventional structure, it is necessary to have a power feeding structure that can supply current to the whole by power feeding from the center of the surface.

  Invention of Claim 3 has the insulating sheet which covers the whole on the said electrically-conductive member, The said insulating sheet has an opening in the center, The Claim 1 or 2 characterized by the above-mentioned. It is an organic EL device.

  According to the configuration of the present invention, most of the conductive member is insulated from the outside by the insulating sheet, and an external terminal can be connected to the conductive member via the opening provided in the center. Therefore, power can be supplied from the central part to the second electrode layer in the light emitting region. In addition, since the insulating sheet is coated on the portion other than the opening and is insulated from the outside, noise hardly enters from the outside.

  According to a fourth aspect of the present invention, there is provided a second conductive member insulated from the conductive member on the projection surface of the conductive member, and the first in the light emitting region outside the isolated portion with respect to the light emitting region. 4. The organic EL device according to claim 1, further comprising a power feeding unit that is continuous with the electrode layer, wherein the second conductive member is directly or indirectly connected to the power feeding unit. is there.

  According to the configuration of the present invention, power can be supplied to the first electrode layer in the light emitting region via the second conductive member. Therefore, the first electrode layer in the light emitting region has a different conductive path from the conductive member. It is possible to supply power.

  By the way, since power is supplied to the second electrode layer in the light emitting region through the second electrode layer on the isolated portion, power is supplied to the first electrode layer in the light emitting region in the non-light emitting region other than the isolated portion. This is done via a conductor. For example, when the first electrode layer is a positive electrode, the second electrode layer is a negative electrode, and when power is supplied to the first electrode layer through the conductor in the vicinity of the isolated portion, the light emitting area of the light emitting region is increased, Since the distance between the isolated portion and the conductor is too short, current may flow to the second electrode layer before it reaches the entire first electrode layer in the light emitting region. In that case, the inner side (center side) of the light emitting region is darker than the outer side of the light emitting region.

Therefore, according to a second aspect of the present invention, the isolated portion is formed by an insulating groove, and the insulating groove is a first insulating groove and a second insulating parallel to two sides forming the corner portion. and grooves are formed from the third insulating grooves connecting said first insulating groove and the second isolation trenches, wherein the third insulating grooves, that is connected to an intermediate portion of the first insulating groove or second insulating groove .

  According to the configuration of the invention, the third insulating groove is connected to an intermediate portion of the first insulating groove or the second insulating groove. That is, the first insulating groove or the second insulating groove has a part where an isolated part is formed and a projecting part from the isolated part with reference to a connection part with the third connection groove. In other words, the overhanging portion separates the distance between the portion that is fed to the first electrode layer in the light emitting region and the exposed portion that is the portion that is fed to the second electrode layer in the light emitting region. That is, since the current can be sufficiently distributed in the first electrode layer in the light emitting region before passing through the shortest conductive path, the entire light emitting region can emit light without uneven brightness.

The invention according to claim 5 is the organic EL device according to any one of claims 1 to 4 , wherein the isolated portion is formed by laser scribing.

  According to the configuration of the present invention, it is easy to form an isolated portion.

  According to the organic EL device of the present invention, local heat collection is difficult to occur while securing sealing properties.

1 is a perspective view of an organic EL device according to a first embodiment of the present invention. FIG. 2 is a perspective view of the organic EL device of FIG. 1 with a power supply sheet removed. It is explanatory drawing of each area | region of the organic electroluminescent apparatus of FIG. 1, and is the figure seen from the board | substrate side. It is AA sectional drawing of the organic electroluminescent apparatus of FIG. It is BB sectional drawing of the organic electroluminescent apparatus of FIG. It is CC sectional drawing of the organic electroluminescent apparatus of FIG. FIG. 2 is an exploded perspective view of the power supply sheet of FIG. 1, and is a view shown at an angle different from that of FIG. 1. It is explanatory drawing of the manufacturing process of the organic electroluminescent apparatus of FIG. 1, (a)-(d) represents each process. It is explanatory drawing of the manufacturing process of the organic electroluminescent apparatus of FIG. 1, (e)-(h) represents each process. It is explanatory drawing of the manufacturing process of the organic electroluminescent apparatus of FIG. 1, (i)-(k) represents each process. It is explanatory drawing of the flow of an electric current at the time of connecting the terminal connected to the external power supply, and flowing an electric current, and the electric current is shown by the arrow in the AA cross section of FIG. It is explanatory drawing of the flow of an electric current when the terminal connected to the external power supply is connected, and an electric current is sent, and the electric current is shown by the arrow in FIG. It is explanatory drawing of the flow of an electric current when the terminal connected to the external power supply is connected, and an electric current is sent, and the electric current is shown by the arrow in the CC cross section of FIG. In FIG. 12, it is explanatory drawing of the flow of an electric current at the time of not providing an inner side insulation horizontal groove and an inner side insulation vertical groove.

  The present invention relates to an organic EL device. FIG. 1 shows an organic EL device 1 according to the first embodiment of the present invention. Hereinafter, the positional relationship between the top, bottom, left, and right will be described based on the posture of FIG. 1 unless otherwise specified. That is, the light extraction side when the organic EL device 1 is turned on is on the bottom. In addition, the physical property described below represents the physical property in a standard state unless otherwise specified.

In the organic EL device 1 of the present embodiment, an organic EL element 20 (laminated body) is laminated on a light-transmitting substrate 2 as shown in FIG. 4, and an inorganic sealing layer 7 (sealing) is formed thereon. Layer). Furthermore, the power supply sheet 11 is bonded onto the inorganic sealing layer 7 via the soft adhesive layer 8, the hard adhesive layer 10, and the first adhesive material 16.
The organic EL element 20 is formed from the first electrode layer 3, the functional layer 5, and the second electrode layer 6.
As shown in FIGS. 4 and 7, the power supply sheet 11 is formed of a first conductive member 12, an insulating sheet 13, and a second conductive member 14 in order from the substrate 2 side (upper side in FIG. 7). The sheet 13 and the second conductive member 14 are bonded by a second adhesive material 17.

  The first conductive member 12 is a foil-like or sheet-like member having conductivity and sealing properties. About the raw material of the 1st conductive member 12, what is necessary is just to have electroconductivity and sealing performance, For example, aluminum, stainless steel, silver, gold | metal | money, platinum etc. are employable. In the present embodiment, aluminum is employed from the viewpoint of good sealing performance, electrical conductivity, and heat uniformity.

  The insulating sheet 13 is a sheet-like member having insulating properties. The material of the insulating sheet 13 may be any material having insulating properties, and for example, polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), or the like can be employed. In the present embodiment, PET is employed from the viewpoint of good sealing properties in addition to insulating properties.

  As shown in FIG. 7, the insulating sheet 13 has a through hole 37 penetrating in the member thickness direction at the center in the width direction w and the length direction l (a direction orthogonal to the member thickness direction and orthogonal to the width direction w). doing. The opening shape of the through hole 37 is a square shape or a circular shape. In the present embodiment, the opening shape is a square shape.

  The second conductive member 14 is a foil-like or sheet-like member having conductivity and sealing properties. About the raw material of the 2nd conductive member 14, what is necessary is just to have electroconductivity and sealing performance, For example, aluminum, stainless steel, silver, gold | metal | money, platinum etc. are employable. In the present embodiment, aluminum is employed from the viewpoint of good sealing performance, electrical conductivity, and heat uniformity.

As shown in FIG. 7, the second conductive member 14 has a through hole 38 penetrating in the member thickness direction at the center in the width direction w and the length direction l.
The opening shape of the through hole 38 is similar to that of the insulating sheet 13. In the present embodiment, the opening shape is a square shape.

  Further, the opening area of the through hole 38 of the second conductive member 14 is larger than the opening area of the through hole 37 of the insulating sheet 13 as shown in FIG. Specifically, the opening area of the through hole 38 is preferably 1.2 to 3 times the opening area of the through hole 37. In the present embodiment, the opening area of the through hole 38 is about 1.5 times the opening area of the through hole 37.

The first adhesive 16 is an adhesive having waterproofness and adhesiveness, and is used by solidifying a solution or gel fluid.
As a specific material of the first adhesive 16, a thermosetting resin can be adopted. In the present embodiment, an epoxy resin is adopted among the thermosetting resins.
In addition, the 1st adhesive material 16 may add electroconductive particle (metal particle etc.) in resin, and may give electroconductivity.

The 2nd adhesive material 17 is an adhesive material with waterproofness and adhesiveness, and solidifies a solution or a gel-like fluid, and is used.
As a specific material of the second adhesive material 17, a thermosetting resin can be adopted. In the present embodiment, an epoxy resin is adopted among the thermosetting resins.
In addition, the 2nd adhesive material 17 may add electroconductive particle (metal particle etc.) in resin, and may give electroconductivity.

  The organic EL device 1 maintains high sealing performance and thermal uniformity by covering the power supply sheet 11 on the projection surface in the thickness direction (stacking direction) of the organic EL element 20 in the light emitting region 30 described later. ing.

  Based on this, the detailed structure of the organic EL device 1 will be described below.

When the substrate 2 is viewed in plan, the organic EL device 1 is formed of a light emitting region 30 that actually emits light and a non-light emitting region 31 that does not emit light as shown in FIG.
The light emitting region 30 is a portion where the first electrode layer 3, the functional layer 5, and the second electrode layer 6 are overlapped as shown in FIGS. 3 and 4, and has a shape in which quadrangular squares are cut off. . That is, the light emitting region 30 has an octagonal shape.
In addition, in order to distinguish the organic EL element 20 located in the light emitting region 30 from the organic EL element 20 in the non-light emitting region 31, it is also referred to as a light emitting element 18. That is, the light emitting element 18 is formed by superposing the first electrode layer 3, the functional layer 5, and the second electrode layer 6.

The non-light emitting region 31 is an annular region formed so as to surround the light emitting region 30 as shown in FIG.
The area of the non-light emitting region 31 (non-light emitting area) is preferably 1/500 or more and 1/100 or less of the area (light emitting area) of the light emitting region 30.
If it is this range, the organic EL device of a frame frame which does not care about a non-lighting site | part for a user is realizable.

  The non-light emitting region 31 has a first power feeding region 32 and a second power feeding region 33 that can feed power to the organic EL element 20 (light emitting device 18) in the light emitting region 30 by being electrically connected to an external power source. Yes.

Specifically, the non-light emitting region 31 is formed of four first power feeding regions 32a, 32b, 32c, and 32d and an annular second power feeding region 33 that surrounds the outside of the first power feeding regions 32a, 32b, 32c, and 32d.
The first power supply region 32 (32a, 32b, 32c, 32d) is a region provided adjacent to the light emitting region 30, and is a region that bears the negative electrode.
Each first power feeding region 32 a, 32 b, 32 c, 32 d is provided corresponding to each corner of the substrate 2. In addition, these first power feeding areas 32 a, 32 b, 32 c, and 32 d form a rectangular area together with the light emitting area 30. That is, these four first power supply regions 32a, 32b, 32c, and 32d are at positions that compensate for the missing portion of the light emitting region 30, and specifically, each isosceles triangular shape with the hypotenuse facing the light emitting region 30 side. I am doing.
In the present embodiment, the first power feeding regions 32a, 32b, 32c, and 32d are combined with the light emitting region 30 to form a square region.

  The second power supply region 33 is a region provided so as to surround the region composed of each of the first power supply regions 32 and the light emitting region 30 described above, and is a region that bears the positive electrode. That is, it is continuous in the circumferential direction centering on the region composed of the first power feeding region 32 and the light emitting region 30.

  Explaining the positional relationship between the regions, the light emitting region 30 is located at the center in the length direction l and the width direction w as shown in FIG. 3, and among the four first power feeding regions 32 a, 32 b, 32 c and 32 d. The two first power feeding regions 32a and 32d are at positions facing diagonally across the light emitting region 30, and the remaining first power feeding regions 32b and 32c are at positions facing the remaining diagonal. As described above, the second power feeding region 33 is located further outside the light emitting region 30 and each first power feeding region 32.

Paying attention to the cross-sectional structure of the organic EL device 1, the organic EL device 1 is divided into a plurality of grooves by a plurality of grooves having different depths as shown in FIGS.
Specifically, the organic EL device 1 includes a third insulating groove 21, a first insulating groove 22, and a second insulating groove 23 in which the first electrode layer 3 is partially removed as shown in FIGS. 2 and FIG. 4, the insulating layer 24 for sealing from which the functional layer 5, the second electrode layer 6, and the inorganic sealing layer 7 are partially removed is provided, and a plurality of partitions are formed by these grooves. Have been separated.

The third insulating groove 21 is a groove for separating the first electrode layer 3 stacked on the substrate 2 as shown in FIGS. 6 and 8A, and the light emitting region 30 and the first power feeding are described in detail. A groove for separating the region 32.
A part of the functional layer 5 has entered the third insulating groove 21 as shown in FIG. 6, and the functional layer 5 is in direct contact with the substrate 2 at the bottom of the third insulating groove 21. That is, the first electrode layer 3 in the light emitting region 30 and the first electrode layer 3 in the first power feeding region 32 are electrically separated by the functional layer 5.

The first insulating groove 22 and the second insulating groove 23 are grooves that separate the first electrode layer 3 stacked on the substrate 2 as shown in FIGS. 6 and 8A. It is a groove | channel which isolate | separates the 2 electric power feeding area | region 33 and the light emission area | region 30, and the 2nd electric power feeding area | region 33, respectively.
The first insulating groove 22 extends in the lateral direction (width direction) as shown in FIG. 8A, and is connected to the third insulating groove 21 in the middle thereof.
The second insulating groove 23 extends in the vertical direction (length direction) as shown in FIG. 8A, and is connected to the third insulating groove 21 in the middle thereof.
That is, the third insulating groove 21, the first insulating groove 22, and the second insulating groove 23 form the outer shape of the first power feeding region 32, and the island-like isolation made of the first electrode layer 3 is formed therein. A portion 35 is formed.

As shown in FIG. 3, the first insulating groove 22 has an inner insulating lateral groove 25 positioned on the inner side (center side in the lateral direction w) and an outer side (end in the lateral direction w) with reference to the connection portion with the third insulating groove 21. The outer insulating lateral groove 26 is located on the part side. Similarly, the second insulating groove 23 has an inner insulating vertical groove 27 located on the inner side (center side in the vertical direction l) and an outer side (end portion in the vertical direction l) with respect to the connection portion with the third insulating groove 21. The outer insulating vertical groove 28 located on the side).
That is, the isolated portion 35 is separated from the other first electrode layer 3 in a continuous line by the third insulating groove 21, the outer insulating lateral groove 26 and the outer insulating vertical groove 28.

The sealing insulating groove 24 extends over three layers of the functional layer 5, the second electrode layer 6, and the inorganic sealing layer 7 stacked on the first electrode layer 3 as shown in FIGS. 4 and 9 (e). The removed groove is a groove that improves the adhesion of the power supply sheet 11 to the first electrode layer 3. The inside of the sealing insulating groove 24 is filled with the hard adhesive layer 10, and the first electrode layer 3 and the first conductive member 12 of the power supply sheet 11 are bonded via the hard adhesive layer 10.
That is, the hard adhesive layer 10 directly adheres the first electrode layer 3 and the power supply sheet 11 without the functional layer 5 containing organic matter, and the power supply sheet 11 is difficult to peel off from the substrate 2.

When each groove is seen in the organic EL device 1 as a whole, as shown in FIG. 3, the adjacent inner insulating lateral grooves 25, 25 are arranged at a predetermined interval in the lateral direction w. The distance between the inner insulating lateral grooves 25 adjacent to the lateral direction w is preferably not less than 1/3 and not more than 5/6 of the lateral length of the entire substrate 2. Moreover, it is preferable that the length of the inner side insulation lateral groove 25 is 0.1 mm or more and 10 mm or less.
In the longitudinal direction l, the adjacent inner insulating longitudinal grooves 27, 27 are arranged at a predetermined interval. The distance between the inner insulating longitudinal grooves 27 adjacent to the longitudinal direction l is preferably not less than 1/3 and not more than 5/6 of the longitudinal length of the entire substrate 2. The length of the inner insulating longitudinal groove 27 is preferably 0.1 mm or more and 10 mm or less.

The first insulating grooves 22 and 22 adjacent in the horizontal direction w are aligned on the same straight line, and the first insulating grooves 22 and 22 adjacent in the vertical direction l are parallel to each other.
The second insulating grooves 23 and 23 adjacent in the horizontal direction w are parallel to each other, and the second insulating grooves 23 and 23 adjacent in the vertical direction l are aligned on the same straight line.
The third insulating grooves 21 and 21 that face each other across the light emitting region 30 in the oblique direction s (diagonal direction in the present embodiment) are parallel to each other.

Then, the positional relationship of each member is demonstrated.
The functional layer 5 positioned on the first electrode layer 3 extends from the inner side (center side of the substrate 2) to the outer side as shown in FIGS. It is provided across.
Specifically, as shown in FIGS. 5 and 8B, the functional layer 5 extends outward from the inside of the light emitting region 30 beyond the inner insulating vertical groove 27 in the lateral direction. It has reached a part. Further, the functional layer 5 extends from the light emitting region 30 to the outside beyond the inner insulating lateral groove 25 in the vertical direction, and reaches a part of the second power feeding region 33. As shown in FIG. 6, the functional layer 5 extends outward from the light emitting region 30 beyond the third insulating groove 21 in an oblique direction (diagonal direction of the substrate 2), and the isolated portion 35 in the first power feeding region 32. Has reached a part of.

The second electrode layer 6 located on the functional layer 5 extends from the inside (the center side of the substrate 2) to the outside as shown in FIGS. It is provided across a part of the region 32. However, the second electrode layer 6 does not reach the second power feeding region 33.
Specifically, the second electrode layer 6 extends outward from the light emitting region 30 to the vicinity of the inner insulating vertical groove 27 in the lateral direction as shown in FIG. The second electrode layer 6 extends outward from the light emitting region 30 to the vicinity of the inner insulating lateral groove 25 in the vertical direction.
That is, the second electrode layer 6 does not reach the inner insulating vertical groove 27 and the inner insulating horizontal groove 25 in the horizontal direction and the vertical direction.
3 and 6, the second electrode layer 6 extends outward from the light emitting region 30 beyond the third insulating groove 21 in the oblique direction (diagonal direction of the substrate 2), It extends to the vicinity of the intersection with the outer insulating vertical groove 28. That is, the second electrode layer 6 does not reach the outer insulating lateral groove 26 and the outer insulating longitudinal groove 28 in the first power feeding region 32.

The inorganic sealing layer 7 located on the second electrode layer 6 extends from the inner side (center side of the substrate 2) toward the outer side and is provided across the light emitting region 30 and a part of the non-light emitting region 31. It has been.
Specifically, the inorganic sealing layer 7 has inner insulating vertical grooves 27 extending from the light emitting region 30 toward the second power feeding region 33 in the lateral direction as shown in FIGS. 4, 5, and 8 (d). It extends beyond and covers the end of the functional layer 5. The inorganic sealing layer 7 extends beyond the inner insulating lateral groove 25 from the light emitting region 30 toward the second power feeding region 33 in the vertical direction, and further covers the end of the functional layer 5. The inorganic sealing layer 7 extends beyond the projection surface of the third insulating groove 21 from the light emitting region 30 toward the first power feeding region 32 in the oblique direction as shown in FIGS. . However, the inorganic sealing layer 7 covers a part of the second electrode layer 6 in the first feeding region 32 in the oblique direction, but most of the second electrode layer 6 is exposed.

  The soft adhesive layer 8 located on the inorganic sealing layer 7 is located in the light emitting region 30 as shown in FIGS. 2, 4, and 9 (f) and does not reach the second power feeding region 33. Further, the soft adhesive layer 8 remains on the inorganic sealing layer 7 and does not protrude from the inorganic sealing layer 7. That is, the soft adhesive layer 8 spreads in a planar shape and covers most of the inorganic sealing layer 7.

The hard adhesive layer 10 is provided along most edges of the soft adhesive layer 8 in the light emitting region 30 and the edge of the second electrode layer 6 in the first power feeding region 32 as shown in FIGS. 4 and 9G. It has been. That is, the hard adhesive layer 10 surrounds the soft adhesive layer 8. However, the hard adhesive layer 10 does not cover most or all of the soft adhesive layer 8 and the second electrode layer 6.
The hard adhesive layer 10 supports the first conductive member 12 so that the first conductive member 12 does not approach the organic EL element 20 side. That is, the hard adhesive layer 10 forms a wall surrounding the light emitting region 30.

The first conductive member 12 covers at least the entire soft adhesive layer 8 as shown in FIGS. 3 and 9, and further covers a part or all of the hard adhesive layer 10. That is, as shown in FIG. 4, the power supply sheet 11 covers at least the light emitting region 30, and further extends to the first power supply region 32 across the light emitting region 30. That is, the first conductive member 12 covers most or all of the projection surface of the second electrode layer 6 and is integrated with the substrate 2 by the soft adhesive layer 8 and the hard adhesive layer 10.
Therefore, the heat of the light emitting element 18 can be made uniform by the heat equalizing function of the first conductive member 12, and uneven brightness of the light emitting element 18 located in the light emitting region 30 can be prevented.

As shown in FIG. 4, the insulating sheet 13 is provided across the light emitting region 30 and a part of the non-light emitting region 31.
Specifically, the insulating sheet 13 is provided over the entire region of the light emitting region 30 and the first power feeding region 32 as shown in FIGS. 6 and 10 (i), and further to a part of the second power feeding region 33. It extends. In addition, the insulating sheet 13 does not reach the end of the substrate 2, and the organic EL device 1 has a power feeding unit 36 in which the first electrode layer 3 is exposed from the insulating sheet 13 in the vicinity of the end of the substrate 2. .

  As shown in FIGS. 4, 6, and 10 (k), the second conductive member 14 extends from a part of the light emitting region 30 to the entire non-light emitting region 31. That is, the second conductive member 14 is located in the entire area of the first power supply region 32 and the second power supply region 33. In other words, it reaches the end of the substrate 2 in any direction.

The through-hole 37 of the insulating sheet 13 and the through-hole 38 of the second conductive member 14 are in communication with each other as shown in FIG. 2 and form one communication hole.
As described above, since the through hole 38 of the second conductive member 14 has an opening area larger than the through hole 37 of the insulating sheet 13, when the power supply sheet 11 is viewed in plan, the through hole of the second conductive member 14 is penetrated as shown in FIG. 2. In the opening of the hole 38, a first terminal portion 39 where the first conductive member 12 is exposed and a separation portion 40 where the insulating sheet 13 is exposed are formed.
Further, the second conductive member 14 is exposed around the through hole 38 of the second conductive member 14, thereby forming a second terminal portion 41. Further, the opening center of the through hole 37 of the insulating sheet 13 and the opening center of the through hole 38 of the second conductive member 14 are the same center. That is, when the power supply sheet 11 is viewed in plan, the separation portion 40 is located around the first terminal portion 39, and the second terminal portion 41 is located around the separation portion 40.

As described above, the first terminal portion 39 is an exposed portion of the first conductive member 12 and is a portion that can be connected to an external terminal that is electrically connected to an external power source.
The separation part 40 is an exposed part of the insulating sheet 13 as described above, and is a part that separates the first terminal part 39 and the second terminal part 41.
As described above, the second terminal portion 41 is an exposed portion of the second conductive member 14 and is a portion that can be connected to an external terminal that is electrically connected to an external power source.
The first terminal portion 39 can supply power to the second electrode layer 6 in the first power supply region 32 via the first conductive member 12 by connecting an external terminal. By connecting the terminals, power can be supplied to the first electrode layer 3 in the second power supply region 33 via the second conductive member 14.

  As shown in FIGS. 4, 5, and 6, the second conductive member 14 is bonded to the first electrode layer 3 by the first adhesive 16 in the second power feeding region 33, and in the light emitting region 30, The insulating sheet 13 is bonded by the second adhesive 17.

When attention is paid to the bonding portion between the second conductive member 14 and the first electrode layer 3 in the second power feeding region 33, the first adhesive 16 is formed on the lower surface (surface on the substrate 2 side) of the second conductive member 14 as shown in FIG. ) And provided annularly along the outer edge of the second conductive member 14.
As shown in FIGS. 4 and 6, the application portion of the first adhesive 16 is the second power feeding region 33 and is applied to a region within 5 mm from the outer end portion of the second conductive member 14.
And in the 2nd electric power feeding area | region 33, the electric power feeding part 36 which is the site | part exposed from the 1st adhesive material 16 exists in the 1st electrode layer 3 like FIG. 5, FIG.
A part of the second conductive member 14 is in direct contact with the power feeding unit 36. In other words, the first electrode layer 3 and the second conductive member 14 in the second power supply region 33 are electrically connected by the contact between the power supply portion 36 made of the first electrode layer 3 and the second conductive member 14. .

The area of the power feeding unit 36 occupies most of the second power feeding region 33. The area of the power feeding part 36 is particularly preferably 50% or more and 90% or less of the area of the second power feeding region 33, and more preferably 70% or more and 90% or less.
If the area of the power feeding unit 36 is less than 50%, the contact area with the second conductive member 14 may be too small to provide sufficient conduction. If it exceeds 90 percent, the bonding area of the first adhesive 16 may be too small to obtain sufficient bonding strength.

  When attention is paid to the bonding site between the second conductive member 14 and the insulating sheet 13 in the light emitting region 30, the second adhesive 17 is the lower surface (surface on the substrate 2 side) of the second conductive member 14 as shown in FIG. The second conductive member 14 is provided in an annular shape along the inner edge. The second adhesive 17 is applied to an area within 5 mm from the inner end of the second conductive member 14.

  As described above, the second conductive member 14 is coated with the first adhesive 16 and the second adhesive 17 along the outer edge and the inner edge, so that a relatively small amount of the adhesive is applied. Thus, the second conductive member 14 can be bonded, and the second conductive member 14 can be prevented from separating from the substrate 2.

Next, a method for manufacturing the organic EL device 1 according to this embodiment will be described.
The organic EL device 1 is manufactured by forming a film using a vacuum vapor deposition device and a CVD device (not shown), and patterning using a patterning device (not shown) (laser scribing device in the present embodiment).

First, the organic EL element formation process which laminates | stacks the organic EL element 20 is performed.
Specifically, the first electrode layer 3 is formed on part or all of the substrate 2 by sputtering or CVD, and then a laser scribing device is applied to the substrate on which the first electrode layer 3 is formed. Thus, the third insulating groove 21, the first insulating groove 22, and the second insulating groove 23 are formed (FIG. 8A).
At this time, the first insulating groove 22 is provided in parallel with the horizontal side of the substrate 2, and the second insulating groove 23 is provided in parallel with the vertical side of the substrate 2. The third insulating groove 21 is provided in a direction intersecting both the vertical side and the horizontal side.
In addition, the third insulating grooves 21, the first insulating grooves 22, and the second insulating grooves 23 are respectively provided in the same number as the number of corners of the substrate 2 (four in this embodiment).

Next, an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, a hole injection layer, and the like are sequentially stacked on this substrate by a vacuum deposition apparatus to form a functional layer 5 (FIG. 8B). ).
At this time, the functional layer 5 is laminated on almost the entire light emitting region 30, and is further laminated beyond the inner insulating lateral groove 25, the inner insulating vertical groove 27, and the third insulating groove 21, respectively. A part is on the side. That is, the functional layer 5 is laminated inside each of the inner insulating horizontal groove 25, the inner insulating vertical groove 27, and the third insulating groove 21, and each of the inner insulating horizontal groove 25, the inner insulating vertical groove 27, and the third insulating groove 21. The functional layer 5 is filled.

Next, the second electrode layer 6 is formed on the substrate on which the functional layer 5 is formed by a vacuum vapor deposition apparatus (FIG. 8C).
At this time, the second electrode layer 6 is laminated on the functional layer 5, and in the first power supply region 32, as described above, a part of the second electrode layer 6 protrudes from the functional layer 5 and is exposed. 42 is formed. The exposed portion 42 is stacked on the isolated portion 35 made of the first electrode layer 3 and is in direct contact with the isolated portion 35. The second electrode layer 6 remains inside the outer insulating lateral groove 26 and the outer insulating longitudinal groove 28 and does not reach the second power feeding region 33.
The above is the organic EL element forming step.

Then, the inorganic sealing layer lamination process which forms the inorganic sealing layer 7 is performed.
Specifically, first, a part of the substrate is covered with a mask, and the first inorganic sealing layer 50 (see FIG. 4) is formed by a CVD apparatus.
At this time, the first inorganic sealing layer 50 covers at least the second electrode layer 6 in the light emitting region 30, and further reaches a part of the first power feeding region 32 and the second power feeding region 33.
Moreover, the 1st inorganic sealing layer 50 of this embodiment has covered the edge part of the functional layer 5 in any direction.
At this time, the exposed portion 42 made of the second electrode layer 6 is located outside the first inorganic sealing layer 50 and is not covered.

Thereafter, the first inorganic sealing layer 50 is taken out from the CVD apparatus, and the second inorganic sealing layer 51 is applied to the first inorganic sealing layer 50 with the second inorganic sealing layer 51 (FIG. 4). The inorganic sealing layer 7 is formed (see FIG. 8D).
At this time, the second inorganic sealing layer 51 covers the entire surface of the first inorganic sealing layer 50.
In this manner, the inorganic sealing layer 7 is formed by laminating the second inorganic sealing layer 51 formed by the wet method on the first inorganic sealing layer 50 formed by the dry method.
At this time, the exposed portion 42 made of the second electrode layer 6 is located outside the second inorganic sealing layer 51 and is not covered.

Subsequently, a power feeding sheet bonding step is performed in which the power feeding sheet 11 is bonded to the inorganic sealing layer 7 formed by the above-described procedure.
In the power supply sheet bonding step, the soft adhesive layer 8 and the hard adhesive layer 10 are formed on the inorganic sealing layer 7 to bond the power supply sheet 11.
Specifically, first, a sealing insulating groove 24 is formed on a substrate formed by the above-described procedure by a laser scribing device (FIG. 9E).
At this time, the sealing insulating groove 24 is formed along the outer peripheral edge of the second electrode layer 6. The first electrode layer 3 is exposed at the bottom of the sealing insulating groove 24.

Subsequently, the soft adhesive layer 8 is bonded to the inorganic sealing layer 7 with a vacuum laminator (FIG. 9F).
At this time, when the soft adhesive layer 8 is formed, an insulating separator coated on both sides of the soft adhesive layer 8 is used. At the time of bonding, the separator on one side of the soft adhesive layer 8 is peeled off, and the peeled surface is bonded onto the inorganic sealing layer 7.
In this bonded state, the soft adhesive layer 8 covers at least the entire light emitting element 18 as shown in FIGS. The soft adhesive layer 8 does not reach the sealing insulating groove 24. That is, the soft insulating layer 8 is not covered in the sealing insulating groove 24, and the first electrode layer 3 is exposed at the bottom of the sealing insulating groove 24.

Thereafter, the separator on the surface opposite to the peeling surface is peeled off, the raw material of the hard adhesive layer 10 is applied by a dispenser, and the first conductive member 12 is placed on the soft adhesive layer 8 and the hard adhesive layer 10. And the hard adhesive layer 10 is formed into a film by drying / curing the raw material of the hard adhesive layer 10 (FIG. 9 (g) to FIG. 9 (h)).
At this time, in the light emitting region 30 and the second power feeding region 33, the hard adhesive layer 10 covers a part of the soft adhesive layer 8 and is applied across the soft adhesive layer 8 and the inorganic sealing layer 7. Is formed. In the first power feeding region 32, the hard adhesive layer 10 is formed by being applied along the end portion of the second electrode layer 6.
The first conductive member 12 covers the entire upper surface of the soft adhesive layer 8 and the hard adhesive layer 10 as shown in FIG. 4, and the inorganic sealing layer 7 and the second encapsulating layer 7 are bonded by the adhesive function of the soft adhesive layer 8 and the hard adhesive layer 10. It is integrated with the electrode layer 6.
In the second power supply region 33, the first conductive member 12 is not covered. That is, in the second power supply region 33, there is a power supply part 36 where the first electrode layer 3 is exposed.

  Subsequently, the insulating sheet 13 is placed on the first conductive member 12 of the substrate, and bonded together with a vacuum laminator (FIG. 10 (i)).

At this time, the insulating sheet 13 covers the entire exposed portion of the first conductive member 12 as shown in FIG. 10I, and the opening of the through hole 37 of the insulating sheet 13 is located at the center. The first conductive member 12 is exposed from the opening of the through hole 37 of the insulating sheet 13 to form the first terminal portion 39.
In addition, in the second power feeding region 33, the insulating sheet 13 is hardly covered. That is, there is a power feeding portion 36 where the first electrode layer 3 is exposed.

  Subsequently, the raw materials of the first adhesive 16 and the second adhesive 17 are applied by a dispenser on the substrate on which the insulating sheet 13 is provided, and the second conductive member 14 is placed on the insulating sheet 13. Then, the second conductive member 14 is bonded by drying / curing the raw materials of the first adhesive 16 and the second adhesive 17 (FIG. 10 (j) to FIG. 10 (k)).

At this time, the second conductive member 14 is in contact with the power supply portion 36 where the first electrode layer 3 is exposed, passing between the first adhesive 16 and the inorganic sealing layer 7.
Further, the through hole 38 of the second conductive member 14 does not overlap the through hole 37 of the insulating sheet 13 in the member thickness direction. A part of the insulating sheet 13 is exposed from the opening of the through hole 38 of the second conductive member 14 to form a separation portion 40. A second terminal portion 41 is formed around the opening of the through hole 38 of the second conductive member 14.

  In this way, the power feeding sheet adhering step is completed, and the organic EL device 1 is completed.

  Next, the flow of current when an external power supply terminal is attached to the organic EL device 1 and power is supplied will be described. That is, the case where the positive terminal is attached to the second terminal portion 41 of the second conductive member 14 and the negative terminal is attached to the first terminal portion 39 of the first conductive member 12 as shown in FIG.

As shown in FIG. 11, the current supplied from the external power source is transmitted from the central second terminal portion 41 to the first electrode layer 3 in the second power feeding region 33 through the second conductive member 14. Then, the current transmitted to the first electrode layer 3 in the second power feeding region 33 is inside the inner insulating lateral groove 25 and the second insulating groove 23 in the first insulating groove 22 in the second power feeding region 33 as shown in FIG. The first electrode layer 3 in the light emitting region 30 passes through the first electrode layer 3 between the adjacent first insulating grooves 22, 22 or between the adjacent second insulating grooves 23, 23, bypassing the insulating vertical groove 27. To.
The current reaching the first electrode layer 3 in the light emitting region 30 reaches the second electrode layer 6 via the functional layer 5 in the light emitting region 30 as shown in FIG. At this time, an electric current passes through the functional layer 5 and exhibits a desired emission color.
The current reaching the second electrode layer 6 in the light emitting region 30 is diffused to the second electrode layer 6 in the first power feeding region 32 as shown in FIG. The current reaching the second electrode layer 6 (exposed portion 42) in the first power supply region 32 is directly transmitted to the first conductive member 12 without passing through the isolated portion 35, and returns from the first terminal portion 39 to the external power source.
Thus, the current supplied from the external power source enters from the center of the organic EL device 1, the entire functional layer 5 in the light emitting region 30 emits light, and returns to the center of the organic EL device 1 again.

As described above, the organic EL device 1 of the present embodiment feeds power to the light emitting element 18 located in the light emitting region 30 by bypassing the inner insulating lateral groove 25 and the inner insulating longitudinal groove 27.
Here, the flow of current when the inner insulating lateral groove 25 and the inner insulating vertical groove 27 are not provided will be described.
Usually, the current travels the shortest distance between the electrodes that are energized. Therefore, when the inner insulating lateral grooves 25 and the inner insulating longitudinal grooves 27 are not provided as shown in FIG. 14, the portion where the current is transmitted from the second power feeding region 33 to the light emitting region 30 is too close to the first power feeding region 32. In some cases, the light is transmitted to the first power feeding region 32 before being uniformly conducted to the entire 30, resulting in uneven brightness.
Therefore, in the organic EL device 1 of the present embodiment, by providing the inner insulating horizontal groove 25 and the inner insulating vertical groove 27, the distance between the portion that is transmitted from the second power supply region 33 to the light emitting region 30 and the first power supply region 32 is separated. As a result, it is possible to spread the current over the entire light emitting region 30 and suppress the occurrence of uneven brightness in the surface.

  Finally, the configuration of each layer of the organic EL device 1 will be described.

The board | substrate 2 has translucency and insulation, Specifically, soda-lime glass, an alkali free glass, etc. are employable.
The substrate 2 has a polygonal shape, and among them, a quadrangle is preferable. In this embodiment, a rectangular glass substrate is employed.

The material of the first electrode layer 3 is not particularly limited as long as it is transparent and has conductivity. For example, indium tin oxide (ITO), indium zinc oxide (IZO), oxidation Transparent conductive oxides such as tin (SnO ₂ ) and zinc oxide (ZnO) are employed. ITO or IZO, which has high transparency, is particularly preferable in that light generated from the light emitting layer in the functional layer 5 can be effectively extracted. In this embodiment, ITO is adopted.

  The functional layer 5 is a layer provided between the first electrode layer 3 and the second electrode layer 6 and having at least one light emitting layer. The functional layer 5 is composed of a plurality of layers mainly made of organic compounds. The functional layer 5 can be formed of a known material such as a low molecular dye material or a conjugated polymer material used in a general organic EL device. In addition, the functional layer 5 may have a multilayer structure including a plurality of layers such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer.

The material of the 2nd electrode layer 6 is not specifically limited, For example, metals, such as silver (Ag) and aluminum (Al), are mentioned. The second electrode layer 6 of this embodiment is made of Al. These materials are preferably deposited by sputtering or vacuum evaporation.
In addition, the electrical conductivity and thermal conductivity of the second electrode layer 6 are larger than those of the first electrode layer 3. In other words, the second electrode layer 6 has higher electrical conductivity and thermal conductivity than the first electrode layer 3.

As shown in FIG. 4, the inorganic sealing layer 7 includes a first inorganic sealing layer 50 formed by a dry method from the organic EL element 20 side and a second inorganic sealing layer 51 formed by a wet method in this order. Has been formed.
The first inorganic sealing layer 50 is a layer formed by chemical vapor deposition, and more specifically, a layer formed by plasma CVD using silane gas, ammonia gas, or the like as a raw material. Since the 1st inorganic sealing layer 50 can be formed into a film continuously in the formation process of the organic EL element 20 in an atmosphere with a low moisture content in the manufacturing process of the organic EL device 1 as described later, Film formation can be performed without exposure, and the occurrence of initial dark spots immediately after use can be reduced.
The material of the first inorganic sealing layer 50 is formed of a silicon alloy composed of one or more elements selected from oxygen, carbon, and nitrogen and a silicon element. It is particularly preferable to use silicon nitride or silicon oxide containing a bond such as Si—O, Si—N, Si—H, or N—H, or silicon oxynitride that is an intermediate solid solution of both.

The second inorganic sealing layer 51 is a layer formed through a chemical reaction after applying a liquid or gel material. More specifically, the second inorganic sealing layer 51 is made of dense silica. The second inorganic sealing layer 51 is preferably made from a polysilazane derivative. In the case where the second inorganic sealing layer 51 is formed by silica conversion using a polysilazane derivative, weight increase occurs during silica conversion, and volume shrinkage is small. Further, it is possible to make cracks sufficiently at a temperature that the resin can withstand when the silica film is converted (solidified).
Here, the polysilazane derivative is a polymer having a silicon-nitrogen bond, such as SiO ₂ , Si ₃ N _{4 made of} Si—N, Si—H, N—H, etc., and a ceramic such as an intermediate solid solution SiOxNy of both. It is a precursor polymer. The polysilazane derivative also includes a derivative in which a hydrogen part bonded to Si is partially substituted with an alkyl group or the like.
Among the polysilazane derivatives, perhydropolysilazane in which all side chains are hydrogen, and derivatives in which a hydrogen part bonded to silicon is partially substituted with a methyl group are particularly preferable.

  Moreover, it is preferable to apply and use this polysilazane derivative in the solution state melt | dissolved in the organic solvent. As the organic solvent to be dissolved, hydrocarbon solvents such as aliphatic hydrocarbons, alicyclic hydrocarbons and aromatic hydrocarbons, ethers such as halogenated hydrocarbon solvents, aliphatic ethers and alicyclic ethers can be used. .

  The second inorganic sealing layer 51 is formed by laminating a material different from that of the first inorganic sealing layer 50 as the sealing layer. Generation of dark spots can be prevented, and the expansion of the generated dark spots can be suppressed.

The average thickness of the inorganic sealing layer 7 is preferably 1 μm to 10 μm, and more preferably 2 μm to 5 μm.
The thickness of the first inorganic sealing layer 50 serving as a part of the inorganic sealing layer 7 is preferably 1 μm to 5 μm, and more preferably 1 μm to 2 μm.
The thickness of the second inorganic sealing layer 51 that bears a part of the inorganic sealing layer 7 is preferably 1 μm to 5 μm, and more preferably 1 μm to 3 μm.

When the eyes are moved to the soft adhesive layer 8, the soft adhesive layer 8 is a layer that has flexibility and undergoes plastic deformation or elastic deformation under a predetermined condition. In the present embodiment, when the soft adhesive layer 8 receives a compressive stress or the like of the inorganic sealing layer 7, the soft adhesive layer 8 can be plastically deformed hardly against the stress.
As for the Shore hardness of the soft adhesive layer 8 according to JIS K 6253, the Shore hardness is A30 or more and A70 or less, preferably A40 or more and A65 or less, and more preferably A45 or more and A63 or less.
When the shore hardness of the soft adhesive layer 8 is greater than A70, the rigidity of the soft adhesive layer 8 is too large to sufficiently absorb swelling and impact. Further, when, for example, a sheet having low rigidity is adopted as the power supply sheet 11, if the shore hardness of the soft adhesive layer 8 is smaller than A30, the rigidity of the soft adhesive layer 8 is too small and the shape of the power supply sheet 11 is maintained. Can not.
The flexural modulus of the soft adhesive layer 8 is preferably 3 MPa or more and 30 MPa or less, more preferably 3 MPa or more and 25 Pa or less, and particularly preferably 3.9 MPa or more and 23 MPa or less.

  Specific materials for the soft adhesive layer 8 include acrylic rubber (ACM), ethylene propylene rubber (EPM, EPDM), silicone rubber (Q), butyl rubber (IIR), styrene-butadiene rubber (SBR), and butadiene rubber (BR). ), Fluoro rubber (FKM), nitrile rubber (NBR), isoprene rubber (IR), urethane rubber (U), chlorosulfonated polyethylene (CSM), epichlorohydrin rubber (CO, ECO), chloroprene rubber (CR), etc. One or more materials selected from acrylic rubber-based resins, ethylene-propylene rubber-based resins, silicone rubber-based resins, and butyl rubber-based resins can be used, although they have a certain water vapor barrier property and are available at low cost. In particular, butyl rubber, which is easily available as a film, is preferable. System resin is more preferable.

Moreover, the soft adhesive layer 8 of this embodiment has adhesiveness and can adhere | attach a some member mutually. Specifically, the soft adhesive layer 8 of the present embodiment is a sheet-like or plate-like member, and the surface is subjected to adhesive processing.
The average thickness of the soft adhesive layer 8 is preferably 2 μm or more and 100 μm or less, and more preferably 5 μm or more and 50 μm or less.
If the average thickness of the soft adhesive layer 8 is thinner than 2 μm, the swelling and impact of the inorganic sealing layer 7 cannot be sufficiently absorbed. If the thickness is greater than 100 μm, heat may not be transmitted to the power supply sheet 11, and heat may be accumulated in the soft adhesive layer 8.

The hard adhesive layer 10 is a harder material having higher rigidity than the soft adhesive layer 8. Specifically, the shore hardness (and the approximate value of the corresponding flexural modulus) of the hard adhesive layer 10 according to JIS K 6253 is preferably Shore A80 or higher, that is, Shore D30 or higher (25 MPa or higher). From the viewpoint of providing a highly reliable organic EL device, Shore D55 or higher (250 MPa or higher), Shore D95 or lower (6000 MPa or lower) is more preferable, Shore D80 or higher (1500 MPa or higher), Shore D90 or lower (4000 MPa or lower) More preferably.
Moreover, the hard adhesive layer 10 of this embodiment has waterproofness and adhesiveness, and a plurality of members can be bonded to each other. Specifically, the hard adhesive layer 10 of the present embodiment is formed by solidifying a solution or gel fluid.
As a specific material of the hard adhesive layer 10, a thermosetting resin can be adopted. In the present embodiment, an epoxy resin is adopted among the thermosetting resins.

  According to the organic EL device 1 of the present embodiment, the organic EL element 20 in the light emitting region 30 is primarily sealed by the inorganic sealing layer 7, and the outside is further connected to the power supply sheet 11 and hard bonding. Since the secondary sealing is performed by the layer 10 and the first adhesive 16, it is difficult for water or the like to enter the organic EL element 20 in the light emitting region 30, and it is difficult to form a dark spot.

  Further, according to the organic EL device 1 of the present embodiment, the heat generated in the organic EL element 20 in the light emitting region 30 is soaked by the first conductive member 12 and further, the soaking function by the second conductive member 14. Is increasing. Therefore, the temperatures of the light emitting elements 18 in the light emitting region 30 are equalized, and uneven brightness can be suppressed.

  In the above-described embodiment, the soft adhesive layer 8 is provided, but the present invention is not limited to this, and the soft adhesive layer 8 may not be provided.

1 Organic EL device 2 Substrate (base material)
3 First electrode layer 5 Functional layer (organic light emitting layer)
6 Second electrode layer 7 Inorganic sealing layer (sealing layer)
8 Soft adhesive layer 10 Hard adhesive layer (moisture-proof adhesive)
12 First conductive member (conductive member)
13 Insulating sheet 14 Second conductive member 18 Light emitting element 20 Organic EL element (laminated body)
21 Third insulating groove 22 First insulating groove 23 Second insulating groove 24 Sealing insulating groove 25 Inner insulating lateral groove 27 Inner insulating vertical groove 30 Light emitting region 31 Non-light emitting region 35 Isolated portion 36 Power feeding portion 37 Through hole 38 Through hole 42 Exposed part

Claims (5)

A light emitting region that emits light when the substrate is viewed in plan view, and a non-light emitting region that does not emit light when the substrate is viewed in plan, including a laminate including a first electrode layer, an organic light emitting layer, and a second electrode layer on a polygonal substrate. In an organic EL device having
The second electrode layer has higher conductivity than the first electrode layer,
The non-light emitting region is provided so as to surround the light emitting region,
In the non-light emitting region, in the vicinity of at least one corner of the substrate, there is an isolated portion that is isolated from the surroundings by continuously removing the first electrode layer,
On the laminate, it has a sealing layer and a conductive member,
The laminate in the light emitting region is sealed with a sealing layer,
A part of the second electrode layer in the non-light emitting region forms an exposed portion exposed from the sealing layer,
The exposed portion is fixed to the isolated portion,
The conductive member is located outside the sealing layer on the basis of the laminate, and is provided in the entire light emitting region,
The conductive member is connected to the exposed portion on the projection surface in the thickness direction of the isolated portion ,
In the non-light-emitting region, there is an isolated isolated portion by removing the first electrode layer continuously in the vicinity of at least one corner adjacent to the corner,
The isolated portion is formed of a first insulating groove and a second insulating groove parallel to two sides forming a corner portion, and a third insulating groove connecting the first insulating groove and the second insulating groove. ,
A sealing insulating groove extending so as to connect the third insulating grooves forming the respective isolated portions;
The first electrode layer and the conductive member are bonded via a moisture-proof adhesive,
The organic EL device , wherein the adhesive is filled in an insulating groove for sealing . A light emitting region that emits light when the substrate is viewed in plan view, and a non-light emitting region that does not emit light when the substrate is viewed in plan, with a laminate including a first electrode layer, an organic light emitting layer, and a second electrode layer on a polygonal substrate In an organic EL device having
The second electrode layer has higher conductivity than the first electrode layer,
The non-light emitting region is provided so as to surround the light emitting region,
In the non-light emitting region, in the vicinity of at least one corner of the substrate, there is an isolated portion that is isolated from the surroundings by continuously removing the first electrode layer,
On the laminate, it has a sealing layer and a conductive member,
The laminate in the light emitting region is sealed with a sealing layer,
A part of the second electrode layer in the non-light emitting region forms an exposed portion exposed from the sealing layer,
The exposed portion is fixed to the isolated portion,
The conductive member is located outside the sealing layer on the basis of the laminate,
The conductive member is connected to the exposed portion on the projection surface in the thickness direction of the isolated portion,
The isolated portion is formed by an insulating groove,
The insulating groove is formed of a first insulating groove and a second insulating groove parallel to two sides forming the corner portion, and a third insulating groove connecting the first insulating groove and the second insulating groove. And
The organic EL device, wherein the third insulating groove is connected to an intermediate portion of the first insulating groove or the second insulating groove. An insulating sheet covering the entirety of the conductive member;
The organic EL device according to claim 1, wherein the insulating sheet has an opening in the center. A second conductive member insulated from the conductive member on the projection surface of the conductive member;
With the light emitting region as a reference, outside the isolated portion, the power supply unit is continuous with the first electrode layer in the light emitting region,
4. The organic EL device according to claim 1, wherein a second conductive member is directly or indirectly connected to the power supply unit. 5. The isolated section, the organic EL device according to any one of claims 1 to 4, characterized by being formed by laser scribing.

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