JP6089918B2 - Imprint mold manufacturing method and substrate - Google Patents

Description

  The present invention relates to a method for producing an imprint mold and a substrate used for producing the imprint mold.

  The nanoimprint technology as a microfabrication technology uses a mold member (imprint mold) in which a fine concavo-convex pattern is formed on the surface of a substrate, and transfers the fine concavo-convex pattern to a workpiece such as an imprint resin at the same magnification. This is a pattern formation technique (see Patent Document 1). In particular, with the progress of further miniaturization of wiring patterns and the like in semiconductor devices, nanoimprint technology is gaining more and more attention in semiconductor device manufacturing processes and the like.

  As this nanoimprint technique, an optical imprint technique and a thermal imprint technique are known, and an optical imprint technique is generally used. In optical imprinting, fine uneven patterns can be transferred at low applied pressure at room temperature, and there is no need for heating / cooling cycles like thermal imprinting, so there is no dimensional change due to the heat of the master mold or resin. Compared to thermal imprinting, it is said to be superior in terms of resolution, alignment accuracy, productivity, and the like. For this reason, a quartz substrate that can transmit exposure light in optical imprinting is mainly used as a base material constituting the imprint mold.

  As an imprint mold used in the nanoimprint technology, as shown in FIG. 10C, the first side 1100a has a first side 1100a and a second side 1100b opposite to the first side 1100a. There is known an imprint mold 1100 in which a fine uneven pattern 1200 is formed and a recess 1130 is formed on a second side 1100b (see Patent Document 2). In the imprint mold 1100, the first side 1100a is constituted by a thin region 1140 located substantially at the center of the substrate and a thick region 1150 located around the first region 1140a. And the pattern area | region 1120 in which the fine uneven | corrugated pattern 1200 of the 1st side 1100a is formed is included in the hollow part 1130 in planar view.

  According to the imprint mold 1100, the pattern area 1120 where the fine uneven pattern 1200 is formed is positioned in the thin area 1140, so that when the fine uneven pattern 1200 is pressed against the imprint resin as the workpiece, Since the convex shape can be curved toward the first side 1100a, the fine concavo-convex pattern 1200 can be transferred without trapping bubbles when the imprint resin spreads wet. Further, since the imprint mold 1100 can be similarly bent when the imprint mold 1100 is separated from the imprint resin to which the fine concavo-convex pattern 1200 has been transferred, the ease of peeling of the imprint mold 1100 from the imprint resin can be improved. it can. Therefore, the fine concavo-convex pattern 1200 can be transferred with high accuracy without causing damage to the transfer pattern formed on the imprint resin.

Such an imprint mold 1100 can be manufactured as follows.
First, a base material 1010 having a recess 1130 formed on the second side 1100b is prepared. Note that an etching mask 1160 having a predetermined opening corresponding to the fine concavo-convex pattern 1200 is provided on the first side 1100a. Then, a fine concavo-convex pattern 1200 is formed in the pattern region 1120 on the first side 1100a of the substrate 1010 by dry etching using plasma, and the etching mask 1160 is removed (see FIG. 10).

US Pat. No. 5,772,905 Special table 2009-536591 JP 2011-245787 A

  As described above, the imprint mold 1100 is formed by dry etching using reactive plasma on the first side 1100a (pattern region 1120) of the base material 1010 formed with the recess 1130 on the second side 1100b. Thus, the fine uneven pattern 1200 is formed.

When the fine concavo-convex pattern 1200 is formed by dry etching, the base material 1010 is placed between a pair of electrodes (anode and cathode) in the dry etching apparatus. At this time, the depression 1130 is formed on the second side 1100b of the base material 1010, so that the thin region 1140 portion of the base material 1010 is viewed in the thickness direction of the base material 1010. And a gas phase (air) laminate. Therefore, the dielectric constant in the thin region 1140 portion of the base material 1010 is the average dielectric constant of the material (dielectric) constituting the base material 1010 and the gas phase (air). On the other hand, the dielectric constant of the thick region 1150 portion of the substrate 1010 is the dielectric constant of the material (dielectric material) constituting the substrate. Therefore, the dielectric constants of the thin region 1140 and the thick region 1150 are different.
This deteriorates the etching selectivity in the thin region 1140 (particularly, the pattern region 1120) of the substrate 1010, and the distribution and directivity of ions and radicals on the first side 1100a (particularly, the pattern region 1120) of the substrate 1010. And the cross-sectional shape of the fine concavo-convex pattern 1200 is deteriorated (the rising angle of the side wall of the fine concavo-convex pattern 1200 (deterioration of the angle of the convex side wall with respect to the upper surface of the concave portion of the fine concavo-convex pattern 1200)). There is a problem of lowering.

  As described above, when a fine uneven pattern is formed by dry etching using plasma on one side of a substrate made of a dielectric material whose thickness is not uniform in the plane, the thickness of the substrate Due to the difference, there is a problem that a gas phase partially exists between the base material and the lower electrode of the dry etching apparatus, and the etching accuracy may be lowered due to a difference in dielectric constant caused by the gas phase.

  In view of such circumstances, the present invention provides a method for producing an imprint mold having a high-precision fine concavo-convex pattern on one side of a substrate having portions with different thicknesses in a plane by dry etching using plasma, and An object of the present invention is to provide a base material used for manufacturing the imprint mold.

  As a result of various researches, the present inventor has found a base including a first dielectric having a first side and a second side opposite to the first side and having a recess formed on the second side. In a method for manufacturing an imprint mold using a material, a support structure for supporting a dielectric constant adjusting member from the second side is formed on the base material, and the dielectric constant adjusting member including the second dielectric is formed on the base material. The present invention has been completed by finding that the above problem can be solved by forming a fine unevenness pattern on the first side of the base material after being disposed in the hollow portion.

  That is, the invention according to claim 1 of the present invention has a first side and a second side opposite to the first side, and a recess is formed on the second side. A method of manufacturing an imprint mold using a base material including a dielectric material, wherein a dielectric constant adjustment member including a second dielectric material is disposed in the recess, and the dielectric constant A pattern forming step of forming a fine concavo-convex pattern by dry etching using plasma on the first side of the base material in which the adjustment member is disposed in the depression, and in the dielectric constant adjustment member arrangement step, In the imprint mold manufacturing method, the dielectric constant adjusting member is supported from the second side by a support structure formed on the base material.

  Further, in the invention according to claim 2 of the present invention, the dielectric constant adjusting member disposing step may include a part of the dielectric constant adjusting member in a concave portion side recess formed on a side surface of the concave portion of the base material. 2. The method of manufacturing an imprint mold according to claim 1, further comprising a step of supporting the dielectric constant adjusting member from the second side by inserting.

  Moreover, the invention which concerns on Claim 3 of this invention is the said dielectric constant adjustment member arrangement | positioning process from the said 2nd side by the said recessed part side surface convex part currently formed in the side surface of the said recessed part of the said base material. 3. The imprint mold manufacturing method according to claim 1, further comprising a step of supporting the dielectric constant adjusting member.

  Moreover, the invention which concerns on Claim 4 of this invention is a side surface of the said dielectric constant adjustment member to the hollow part side surface uneven | corrugated | grooved part currently formed in the side surface of the said hollow part of the said base material by the said dielectric constant adjustment member arrangement | positioning process. 2. The imprint mold according to claim 1, further comprising a step of supporting the dielectric constant adjusting member from the second side by fitting the concave and convex portions on the side surface of the dielectric constant adjusting member. It is a manufacturing method.

  Further, the invention according to claim 5 of the present invention is that the dielectric constant adjusting member disposing step is an inclined surface formed on a side surface facing in the recessed portion of the base material in a cross-sectional view, the inclined surface A step of supporting the dielectric constant adjusting member from the second side by an inclined surface formed such that a distance between the surfaces is smaller on the second side than on the first side. The imprint mold manufacturing method according to claim 1.

  The invention according to claim 6 of the present invention is a base material used for an imprint mold, and includes a first side and a second side facing the first side, A depression is formed on the second side, and a dielectric constant adjusting member disposed in the depression when the fine uneven pattern is formed on the first side by dry etching using plasma, It is a base material characterized by having a support structure supported from the side.

  The invention according to claim 7 of the present invention is the base material according to claim 6, wherein the side surface of the recessed portion has a recessed portion side surface recessed portion.

  The invention according to claim 8 of the present invention is the base material according to claim 6 or 7, characterized in that the side surface of the recessed portion has a recessed portion side surface convex portion.

  The invention according to claim 9 of the present invention is the base material according to claim 6, wherein the side surface of the recessed portion has a recessed portion side surface uneven portion.

  In the invention according to claim 10 of the present invention, the side surface of the recess has an inclined surface, and the distance between the inclined surfaces facing each other in the recess is a cross-sectional view. The substrate according to claim 6, wherein the second side is smaller than the side.

  According to the present invention, by dry etching using plasma, a method of manufacturing an imprint mold having a high-precision fine concavo-convex pattern on one side of a substrate having portions having different thicknesses in the surface, and the imprint A substrate for use in manufacturing a print mold can be provided.

It is process drawing which shows roughly an example of the manufacturing method of the imprint mold which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows an example of the base material used in the 1st Embodiment of this invention, (a) shows a cut end view, (b) shows a bottom view. It is a figure explaining the method of forming the hollow part side surface recessed part which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows an example of the dielectric constant adjustment member used in the 1st Embodiment of this invention, (a) is a cut end view, (b) shows a bottom view. It is explanatory drawing which shows an example of the base material used in the 2nd Embodiment of this invention, (a) is a cut end view, (b) shows a bottom view. It is explanatory drawing which shows an example of the dielectric constant adjustment member used in the 2nd Embodiment of this invention, (a) is a cut end view, (b) shows a bottom view. It is explanatory drawing which shows an example of the base material used in the 3rd Embodiment of this invention, and a dielectric constant adjusting member, (a) is a cut end view of a base material, (b) is a cut end view of a dielectric constant adjusting member. Indicates. It is explanatory drawing which shows an example of the base material used in the 4th Embodiment of this invention, (a) is a cut end view, (b) shows a bottom view. It is explanatory drawing which shows an example of the dielectric constant adjustment member used in the 4th Embodiment of this invention, (a) is a cut end view, (b) shows a bottom view. It is process drawing which shows the manufacturing method of the conventional imprint mold roughly.

[Imprint Mold Manufacturing Method]
First, the manufacturing method of the imprint mold concerning this invention is demonstrated, referring drawings.
The imprint mold manufacturing method according to the present invention has a first side and a second side opposite to the first side, wherein a recess is formed on the second side, A method for manufacturing an imprint mold using a base material including a dielectric, wherein a dielectric constant adjusting member including a second dielectric is disposed in the recess, and the dielectric constant adjustment Forming a fine concavo-convex pattern by dry etching using plasma on the first side of the base material in which the member is disposed in the recess, and in the dielectric constant adjustment member disposing step, The dielectric constant adjusting member is supported from the second side by a support structure formed on the base material.
According to this, it is possible to manufacture an imprint mold having a high-precision fine concavo-convex pattern, and the dielectric constant adjusting member can be removed from the depression when the substrate is transported by the support structure formed on the substrate. It can be prevented from falling off.

(First embodiment)
<Base material preparation process>
FIG. 1 is a process chart schematically showing an example of a method for producing an imprint mold according to the first embodiment of the present invention.
In this embodiment, as shown to Fig.1 (a), it has the 1st side 10a and the 2nd side 10b facing the 1st side 10a first, and a hollow part is provided in the 2nd side 10b. 13 is formed, and a base material 10 having a recess side surface recess 21a on a side surface 13b of the recess 13 is prepared.
The base material 10 is made of a first dielectric such as quartz, titanium oxide, calcium fluoride, silicon, or resin.
Further, a convex structure 11 whose upper surface is a pattern region 12 is formed on the first side 10a of the substrate 10, and in the present embodiment, a predetermined pattern (imprint mold 1 is formed in the pattern region 12). An etching mask 16 having a pattern corresponding to the fine concavo-convex pattern 2 is formed on the first side 10 a of the substrate 10.
The etching mask 16 is made of chromium, chromium oxide, chromium nitride, silicon oxide, silicon nitride, resist material, or the like.

FIG. 2 is an explanatory view showing an example of a substrate used in the first embodiment of the present invention, where (a) shows a cut end view and (b) shows a bottom view.
As shown in FIG. 2, a convex structure 11 called a mesa structure having a substantially square shape in plan view is provided at the approximate center of the first side 10 a of the base material 10, and the upper surface of the convex structure 11 is fine. This corresponds to a region (pattern region 12) where the uneven pattern 2 is formed.
In addition, a substantially circular recess 13 in plan view is formed in the approximate center of the second side 10b. That is, the depression 13 is formed at the approximate center of the second side 10b of the base material 10 so that the approximate center in plan view of the base material 10 is configured as the thin region 14, and the periphery thereof is the thick region 15. Composed.

Note that the thickness of the thin region 14 is approximately 1 mm and the thickness (T ₁₂ ) of the thick region 15 is approximately 6 mm, whereas the thickness T ₁₁ of the convex structure ₁₁ is approximately 30 μm. Therefore, the influence of the thickness of the convex structure 11 on the dry etching when forming the fine concavo-convex pattern can be ignored.

As shown in FIG. 2, the convex structure 11 and the depression 13 in the base material 10 are arranged in a plan view in which the second side 10 b where the depression 13 is formed is positioned upward. It has the relationship included in the bottom face part 13a of the hollow part 13. That is, the recess 13 is formed on the second side 10b so that the area of the bottom surface 13a is larger than the area defined by the outer shape of the convex structure 11.
As an example, when the outer size (L ₁₁ ) of the base material 10 is about 150 mm, the opening diameter (L ₁₂ ) of the recess 13 can be about 60 mm.

The depth D ₁₁ of the depression 13 is such that the thin region 14 of the substrate 10 can be curved convexly toward the first side 10a during imprinting (transfer, peeling, etc.). Can be set to have. For example, the depth D ₁₁ of the recess 13 can be set to about 70% to 90% of the thickness T ₁₂ of the thick region 15 portion of the substrate 10.

Further, the base material 10 has a dent portion side surface recess 21 a on a side surface 13 b of the dent portion 13.
That is, in the base material 10, the recessed portion side surface recess 21 a formed on the side surface 13 b of the recessed portion 13 corresponds to a support structure formed on the base material 10, and in this embodiment, a dielectric constant adjustment described later is performed. The dielectric constant adjusting member 30 is supported from the second side 10b by inserting a part of the member 30 into the recess side surface recess 21a.
In the present embodiment, since the support structure as described above is provided, it is possible to prevent the dielectric constant adjusting member 30 from dropping from the recessed portion 13 when the substrate 10 is conveyed.

FIG. 3 is a diagram for explaining a method of forming the depression side recess 21a.
For example, as shown in FIG. 3A, a conventional base 110 having a recess 130 is prepared, and a predetermined side surface 130b of the recess 130 is formed as a method for forming the recess recess side surface recess 21a. A method of grinding the portion using a grinding jig having a grinding disk 42 at the tip of the rotating shaft 41 can be exemplified (for example, Patent Document 3).
By using the grinding jig as described above to grind along the side surface of the recess, the recess side surface recess 21a is formed on the side surface 13b of the recess 13 as shown in FIG. The base material 10 which has can be obtained.

As an example, when the opening diameter (L ₁₂ ) of the depression 13 shown in FIG. 2 is about 60 mm, the depth (L ₁₃ ) of the depression side recess 21a can be about 5 mm. Further, the height (S ₁₁ ) of the recess side recess 21 a can be set to about 10 to 90% of the depth D ₁₁ of the recess 13.

  In this embodiment, for example, as shown in FIG. 3C, the surface on the first side 10a side (the Z-direction side shown in FIG. 2) of the recess side surface recess 21a is the recess portion. The form formed in the height position which corresponds to the bottom face part 13a of 13 may be sufficient.

<Dielectric constant adjusting member arranging step>
Next, as shown in FIG. 1B, a dielectric constant adjusting member 30 made of a second dielectric material that can reduce the dielectric constant difference in the thickness direction of the entire base material 10 is 13 is arranged. By disposing the dielectric constant adjusting member 30 in the recess 13, the dielectric constant difference between the thin region 14 portion and the thick region 15 portion of the base material 10 can be reduced, resulting from the dielectric constant difference. It is possible to suppress a decrease in etching accuracy.

The dielectric constant ε2 of the second dielectric constituting the dielectric constant adjusting member 30 is substantially equal to the dielectric constant ε1 of the first dielectric contained in the substrate 10. Specifically, it is desirable that the dielectric constant ε1 of the first dielectric and the dielectric constant ε2 of the second dielectric have a relationship represented by the following formula.
0.8 ≦ ε1 / ε2 ≦ 1.2

  In the present embodiment, the dielectric constants ε1 and ε2 of the first dielectric material and the second dielectric material included in the base material 10 and the dielectric constant adjusting member 30 are, for example, a dielectric measurement system (126096 type, Toyo Technica). It is a value measured using a

  The first dielectric and the second dielectric may be the same material or different materials. As the second dielectric, for example, quartz, silicon, anodized, PEEK (polyethyl ether ketone), polyimide, Teflon (registered trademark), vinyl chloride, or the like can be used. Of these, materials having plasma corrosion resistance (quartz, PEEK, polyimide, etc.) that generate less dust and generate gas during dry etching using plasma are preferable.

  Moreover, in this embodiment, in this dielectric constant adjustment member arrangement | positioning process, by inserting a part of dielectric constant adjustment member 30 in the recessed part side surface recessed part 21a of the base material 10, it is the 2nd side of the base material 10. The dielectric constant adjusting member 30 is supported from 10b. Thereby, it is possible to prevent the dielectric constant adjusting member 30 from dropping from the recessed portion 13 when the base material 10 is conveyed.

FIG. 4 is an explanatory view showing an example of a dielectric constant adjusting member used in the present embodiment, where (a) shows a cut end view and (b) shows a bottom view.
For example, as shown in FIG. 4, the dielectric constant adjusting member 30 has a circular upper surface 30 a and a bottom surface 30 b, and has side convex portions 31 on the side surfaces. The dielectric constant adjusting member 30 can be supported from the second side 10b of the base material 10 by inserting the side surface convex portion 31 into the recess side surface concave portion 21a of the base material 10.

More specifically, in the arrangement step of the dielectric constant adjusting member, first, the side surface convex portion 31 of the dielectric constant adjusting member 30 is provided on the edge of the recess 13 of the base material 10 shown in FIG. The entire dielectric constant adjusting member 30 is inserted into the recessed portion 13 so as to pass through the notched portion 21b, and then the side convex portion 31 of the dielectric constant adjusting member 30 extends along the concave portion side concave portion 21a of the substrate 10. The dielectric constant adjusting member 30 is rotated so as to go around, and is arranged at a position where the side surface convex portion 31 and the notch portion 21b do not overlap each other.
Through such an arrangement step, the dielectric constant adjusting member 30 can be supported from the second side 10b of the substrate 10.

  In addition, in order to remove the dielectric constant adjusting member 30 from the base material 10, a procedure reverse to the above arrangement step may be performed. Specifically, the dielectric constant adjusting member 30 is rotated so that the side surface convex portion 31 and the cutout portion 21b overlap each other, and then the side surface convex portion 31 passes through the cutout portion 21b so that the dielectric is adjusted. What is necessary is just to take out the whole rate adjustment member 30 from the hollow part 13. FIG.

Here, each dimension of the dielectric constant adjusting member 30 is preferably configured to be slightly smaller than each dimension of the recess 13 of the base material 10.
While facilitating the placement and removal of the dielectric constant adjusting member 30 in the hollow portion 13, the volume of the gap between the hollow portion 13 and the dielectric constant adjusting member 30 when the dielectric constant adjusting member 30 is disposed in the hollow portion 13 is determined. This is because the dielectric constant difference between the thin region 14 and the thick region 15 can be further reduced by reducing the thickness.

Specifically, the diameter W ₃₁ of the top surface 30a and the bottom surface 30b of the dielectric constant adjusting member 30 shown in FIG. 4 is about 1% to 10% smaller than the diameter L ₁₂ of the opening of the recess 13 shown in FIG. Is preferred.
Further, the height H ₃₁ of the dielectric constant adjusting member 30 shown in FIG. 4 is preferably about 1% to 10% smaller than the depth D ₁₁ of the recess 13 shown in FIG.
Further, the height H ₃₂ , the depth W ₃₂ , and the width W ₃₃ of the side convex portion 31 of the dielectric constant adjusting member 30 shown in FIG. 4 are respectively the height of the concave portion side concave portion 21a of the concave portion 13 shown in FIG. It is preferably smaller by about 1% to 10% than S ₁₁ , depth L ₁₃ , and width L ₁₄ of notch 21b.

In addition, in the dielectric constant adjustment member 30 shown in FIG. 4, although the example of the form which has the two side surface convex parts 31 is shown, in this embodiment, it is not limited to this form, The side surface convex part 31 is 3 The form which has more than one may be sufficient.
In such a case, the corresponding base material 10 is also provided with the notches 21b corresponding to the number and shape of the side surface convex portions 31 of the dielectric constant adjusting member 30.

Further, in the dielectric constant adjusting member 30 shown in FIG. 4, an example of a form in which the side protrusions 31 are fixed is shown. However, in the present embodiment, the shape is not limited to this, and the side protrusions are seen from the side. You may have the elasticity (for example, movable screw mechanism) which can be expanded-contracted. In this case, when the dielectric constant adjusting member 30 is inserted into the recessed portion 13, the side surface convex portion is accommodated in the side surface of the dielectric constant adjusting member, while the dielectric constant adjusting member 30 is accommodated in the recessed portion 13. You may adjust so that a side convex part may protrude from a side surface later.
In such a case, even in the corresponding base material, it is only necessary that the concave portion side surface concave portion has a shape and size that allows the side surface convex portion of the dielectric constant adjusting member to be inserted and removed. There is no need for a circumferential groove like the recess side recess 21a. Moreover, it is not necessary to provide the notch part 21b like the base material 10 shown in FIG.

  As described above, when the dielectric constant adjusting member 30 is accommodated in and supported by the depression 13, the dielectric constant is compared between the planar projection figure of the dielectric constant adjustment member 30 and the planar projection figure of the opening of the depression 13. Since there are a plurality of portions where the planar projection graphic of the adjustment member 30 protrudes from the planar projection graphic of the opening of the recess 13, it is possible to prevent the dielectric constant adjustment member 30 from falling off the recess 13.

<Pattern formation process>
Subsequently, as shown in FIG. 1C, the base material 10 in which the dielectric constant adjusting member 30 is disposed in the hollow portion 13 is conveyed into a dry etching apparatus using plasma, and dry etching using plasma is performed. Thus, the fine uneven pattern 2 is formed in the pattern region 12. Thereafter, the etching mask 16 is removed, and the dielectric constant adjusting member 30 is removed from the inside of the recessed portion 13, whereby the imprint mold 1 in which the fine concavo-convex pattern 2 is formed in the pattern region 12 can be manufactured (FIG. 1 (d)).

The dry etching apparatus used in the present embodiment includes a chamber, and an upper electrode and a lower electrode disposed in the chamber. In this dry etching apparatus, an etching gas such as CF ₄ introduced into the chamber is ionized by reactive plasma generated in the chamber. Then, reactive species such as ions and radicals are attracted to the lower electrode side, and the fine concavo-convex pattern 2 can be formed by a reaction between the reactive species and the substrate 10 placed on the lower electrode.

In the present embodiment, since the dielectric constant adjusting member 30 is arranged in the recess 13 of the base material 10, the difference in dielectric constant between the thin region 14 portion and the thick region 15 portion of the base material 10 is reduced. ing. Therefore, it is possible to improve the directivity in the thin region 14 portion of ions or the like generated by plasma in the dry etching apparatus, and it is possible to form the fine concavo-convex pattern 2 having a favorable side wall rising angle.
Therefore, according to the present embodiment, when the fine uneven pattern is formed by dry etching using plasma, the etching selectivity in the thin region 14 (particularly, the pattern region 12) of the substrate 10 is deteriorated. Deterioration of ion and radical distribution and directivity uniformity on the first side 10a (particularly, the pattern region 12), deterioration of the cross-sectional shape of the fine concavo-convex pattern 2 (deterioration of the rising angle of the side wall of the fine concavo-convex pattern 2) Etc. can be prevented and the etching accuracy can be improved. Therefore, the imprint mold 1 having the fine concavo-convex pattern 2 can be manufactured with high accuracy.

  Moreover, according to this embodiment, in the dielectric constant adjusting member arrangement step, the second side 10b of the substrate 10 is inserted by inserting a part of the dielectric constant adjusting member 30 into the recess side surface recess 21a of the substrate 10. The dielectric constant adjusting member 30 can be supported. When the base material 10 has such a support structure, it is possible to prevent the dielectric constant adjusting member 30 from dropping from the recess 13 when the base material 10 is transported.

(Second Embodiment)
Next, a second embodiment according to the present invention will be described.
Also in the present embodiment, as in the first embodiment described above, the dielectric constant adjusting member arrangement in which the dielectric constant adjusting member including the second dielectric is arranged in the hollow portion of the substrate including the first dielectric. And a pattern forming step of forming a fine concavo-convex pattern by dry etching using plasma on the first side of the base material on which the dielectric constant adjusting member is disposed in the recess. The formed support structure, the structure of the corresponding dielectric constant adjusting member, and the method for supporting the dielectric constant adjusting member are different from those in the first embodiment.

First, the structure of the base material used in this embodiment will be described.
FIG. 5 is an explanatory view showing an example of a base material used in the second embodiment of the present invention, where (a) shows a cut end view, and (b) shows a bottom view.
As shown in FIG. 5, also in the present embodiment, as in the base material 10 in the first embodiment described above, a substantially convex shape in plan view is formed at the approximate center of the first side 50 a of the base material 50. The structure 51 is provided, and the upper surface of the convex structure 51 corresponds to a region (pattern region 52) where a fine uneven pattern is formed.
In addition, a substantially circular recess 53 in plan view is formed in the approximate center of the second side 50b. That is, by forming the recess 53 at the approximate center of the second side 50b of the base material 50, the approximate center in plan view of the base material 50 is configured as the thin region 54, and the periphery thereof is the thick region 55. Composed.

However, in this embodiment, the dent part side surface convex part 61 is formed in the side surface 53b of the dent part 53 of the base material 50, The dielectric constant mentioned later from the 2nd side 50b by this dent part side surface convex part 61. The adjustment member 70 is supported.
As a method for forming the depression side surface convex portion 61, as in the method described in the first embodiment, a grinding disk 42 is provided at the tip of the rotating shaft 41 as shown in FIG. The method of grinding using a grinding jig can be mentioned.

As an example, when the opening diameter (L ₅₂ ) of the recessed portion 53 shown in FIG. 5 is about 60 mm, the protruding length (L ₅₃ ) of the recessed portion side surface protruding portion 61 can be about 5 mm. In addition, the height (S ₅₁ ) of the depression side surface protrusion 61 can be set to about 10 to 90% of the depth D ₅₁ of the depression 53.

Next, the configuration of the dielectric constant adjusting member used in the present embodiment will be described.
FIG. 6 is an explanatory view showing an example of a dielectric constant adjusting member used in the second embodiment of the present invention, where (a) shows a cut end view and (b) shows a bottom view.
Also in this embodiment, like the dielectric constant adjusting member 30 in the first embodiment, the dielectric constant adjusting member 70 has a shape substantially similar to the outer shape of the hollow portion 53 in plan view. The planar view outer shape of the dielectric constant adjusting member 70 is substantially similar to the planar view outer shape of the recessed portion 53, so that when the dielectric constant adjusting member 70 is disposed in the recessed portion 53, the recessed portion 53 and the dielectric constant adjusting member are arranged. This is because the volume of the gap with respect to 70 can be further reduced, and the difference in dielectric constant between the thin region 54 and the thick region 55 can be further reduced.

However, while the dielectric constant adjusting member 30 in the first embodiment described above has the side convex portion 31, the dielectric constant adjusting member 70 in the present embodiment has the side concave portion 71a and the notched portion 71b. Is different.
For example, as shown in FIG. 6, the dielectric constant adjusting member 70 has a circular upper surface 70a and a bottom surface 70b, and has a notch 71b extending from the upper surface 70a to the bottom surface 70b at a part of its edge. Yes. Further, the side surface has a side recess 71a.
And the dielectric constant adjustment member 70 is supported from the 2nd side 50b of the base material 50 by inserting the hollow part side surface convex part 61 of the base material 50 in this side surface recessed part 71a.

More specifically, in the step of arranging the dielectric constant adjusting member, first, the recess side surface convex portion 61 of the base material 50 is cut at the edge of the dielectric constant adjusting member 70 shown in FIG. The entire permittivity adjusting member 70 is inserted into the recess 53 so as to pass through the notch 71 b, and then the recess side projection 61 of the base material 50 circulates along the side recess 71 a of the permittivity adjustment member 70. As described above, the dielectric constant adjusting member 70 is rotated and disposed at a position where the recessed portion side surface convex portion 61 and the notch portion 71b do not overlap each other.
Through such an arrangement process, the dielectric constant adjusting member 70 can be supported from the second side 50b of the substrate 50.

  In addition, in order to remove the dielectric constant adjusting member 70 from the base material 50, a procedure reverse to the above arrangement step may be performed. Specifically, the dielectric constant adjusting member 70 is rotated so that the recess side surface convex portion 61 and the notch portion 71b overlap each other, and then the recess portion side surface convex portion 61 passes through the notch portion 71b. Thus, the entire dielectric constant adjusting member 70 may be taken out from the recessed portion 53.

Here, it is preferable that each dimension of the dielectric constant adjusting member 70 is configured to be slightly different from each dimension of the recessed portion 53 of the base material 50.
While facilitating the placement and removal of the dielectric constant adjusting member 70 in the hollow portion 53, the volume of the gap between the hollow portion 53 and the dielectric constant adjusting member 70 when the dielectric constant adjusting member 70 is disposed in the hollow portion 53 is set. This is because the dielectric constant difference between the thin region 54 and the thick region 55 can be reduced by reducing the thickness.

Specifically, the diameter W ₇₁ of the top surface 70a and the bottom surface 70b of the dielectric constant adjusting member 70 shown in FIG. 6 is about 1% to 10% smaller than the diameter L ₅₂ of the opening of the recess 53 shown in FIG. Is preferred.
Further, the height H ₇₁ of the dielectric constant adjusting member 70 shown in FIG. 6 is preferably smaller by about 1% to 10% than the depth D ₅₁ of the recessed portion 53 shown in FIG.
Further, the height S ₅₁ , the depth L ₅₃ , and the width L ₅₄ of the recess side surface convex portion 61 of the base material 50 shown in FIG. 5 are the heights of the side surface concave portions 71a of the dielectric constant adjusting member 70 shown in FIG. It is preferable that the width is smaller by about 1% to 10% than H ₇₂ , depth W ₇₂ , and width W ₇₃ of notch 71b.

In addition, in the base material 50 shown in FIG. 5, although the example of the form which has two hollow part side surface convex parts 61 is shown, in this embodiment, it is not limited to this form, The hollow part side surface convex part 61 The form which has 3 or more may be sufficient.
In such a case, the corresponding dielectric constant adjusting member 70 is also provided with notches 71b corresponding to the number and shape of the recessed portion side surface convex portions 61 of the base material 50.

Also in the present embodiment, by disposing the dielectric constant adjusting member 70 in the recess portion 53 of the base material 50, the dielectric constant difference between the thin region 54 portion and the thick region 55 portion of the base material 50 during the pattern forming process. Can be reduced.
Therefore, also in the present embodiment, as in the first embodiment described above, the etching accuracy in the pattern forming process can be improved, and an imprint mold having a fine concavo-convex pattern can be manufactured with high accuracy.

  Further, in the present embodiment, in the dielectric constant adjusting member arranging step, the second concave portion side surface convex portion 61 of the base material 50 is inserted into the side surface concave portion 71 a of the dielectric constant adjusting member 70, so The dielectric constant adjusting member 70 can be supported from the side 50b. With such a support structure, also in the present embodiment, the dielectric constant adjusting member 70 is prevented from falling off from the recessed portion 53 when the substrate 50 is transported, as in the first embodiment. be able to.

(Third embodiment)
Next, a third embodiment according to the present invention will be described.
Also in the present embodiment, as in the first and second embodiments described above, the dielectric constant adjusting member including the second dielectric is disposed in the recess of the base material including the first dielectric. A dielectric constant adjusting member arranging step, and a pattern forming step for forming a fine uneven pattern by dry etching using plasma on the first side of the base material on which the dielectric constant adjusting member is arranged in the recess. However, the support structure formed on the base material, the structure of the corresponding dielectric constant adjusting member, and the method for supporting the dielectric constant adjusting member are different from those in the first and second embodiments described above.

FIG. 7 is an explanatory view showing an example of a base material and a dielectric constant adjusting member used in the third embodiment of the present invention, wherein (a) is a cut end view of the base material, and (b) is a dielectric constant adjusting member. The cut end view of is shown.
As shown in FIG. 7, in the present embodiment, the recess side surface uneven portion 91 is formed on the side surface 83 b of the recess portion 83 of the base material 80, and the dielectric constant adjusting member side surface unevenness is formed on the side surface of the dielectric constant adjusting member 100. The portion 101 is formed, and the dielectric constant adjusting member 100 is supported from the second side 80b by fitting the dielectric constant adjusting member side uneven portion 101 to the depression side surface uneven portion 91.

  As a method for fitting the dielectric constant adjusting member side surface uneven portion 101 to the concave portion side surface concave and convex portion 91, for example, the dielectric constant adjusting member side surface concave and convex portion 101 and the concave portion side surface concave and convex portion 91 are one corresponding to each other concave and convex portion. A method of fitting the dielectric constant adjusting member 100 to the recessed portion 83 of the base material 80 by using a helical structure and fitting the bolt to the nut (screwing) is preferably used. Can do.

As a method of forming the recess side surface uneven portion 91, as in the method described in the first embodiment, grinding having a grinding disk 42 at the tip of the rotating shaft 41 as shown in FIG. A method of grinding using a jig can be mentioned. As an example, the unevenness difference (L ₉₁ ) of the recessed portion side surface uneven portion 91 can be about 5 mm.

In the example shown in FIG. 7A, a configuration in which the concave portion side surface uneven portion 91 is formed on the entire side surface 83 b of the concave portion 83 is shown, but in the present embodiment, the configuration is limited to this configuration. Alternatively, the concave portion side surface uneven portion 91 may be formed only on a part of the side surface 83 b of the concave portion 83.
Similarly, in the example shown in FIG. 7B, a form in which the dielectric constant adjusting member side surface uneven portion 101 is formed on the entire side surface of the dielectric constant adjusting member 100 is shown. It is not limited to the form, and the form in which the dielectric constant adjusting member side surface uneven portion 101 is formed only on a part of the side surface of the dielectric constant adjusting member 100 may be adopted.

Also in the present embodiment, by disposing the dielectric constant adjusting member 100 in the recess 83 of the base material 80, the difference in dielectric constant between the thin area portion and the thick area portion of the base material 80 is reduced during the pattern forming process. can do.
Therefore, also in the present embodiment, the etching accuracy in the pattern forming process can be improved as in the first embodiment and the second embodiment described above, and an imprint mold having a fine concavo-convex pattern can be formed with high accuracy. Can be manufactured.

  Further, in the present embodiment, in the dielectric constant adjusting member arranging step, the dielectric constant adjusting member side surface uneven portion 101 of the dielectric constant adjusting member 100 is fitted to the hollow portion side surface uneven portion 91 of the base material 80 to thereby form the base material. The dielectric constant adjusting member 100 can be supported from the second side 80 b of 80. Due to such a support structure, also in the present embodiment, the dielectric constant adjusting member 100 is dropped from the recessed portion 83 when the substrate 80 is transported, as in the first and second embodiments described above. Can be prevented.

(Fourth embodiment)
Next, a fourth embodiment according to the present invention will be described.
Also in this embodiment, the dielectric constant which arrange | positions the dielectric constant adjustment member containing a 2nd dielectric material in the hollow part of the base material containing a 1st dielectric material similarly to the above-mentioned 1st-3rd embodiment. An adjustment member arranging step and a pattern forming step of forming a fine uneven pattern by dry etching using plasma on the first side of the base material on which the dielectric constant adjusting member is arranged in the recess, The support structure formed on the base material, the structure of the corresponding dielectric constant adjusting member, and the method for supporting the dielectric constant adjusting member are different from those in the first to third embodiments.

FIG. 8 is an explanatory view showing an example of a substrate used in the fourth embodiment of the present invention, where (a) shows a cut end view, and (b) shows a bottom view. FIG. 9 is an explanatory view showing an example of a dielectric constant adjusting member used in the fourth embodiment of the present invention, where (a) shows a cut end view and (b) shows a bottom view.
As shown in FIG. 8, in the present embodiment, the side surface 113b of the recess 113 of the base 110 has an inclined surface, and the distance between the inclined surfaces facing each other in the recess 113 in the cross-sectional view is as follows. The second side 110b is smaller than the first side 110a.
On the other hand, in the dielectric constant adjusting member 130 shown in FIG. 9, the side surface of the side surface convex portion 131 has an inclined surface, and the dimension (W) of the upper surface 130 a of the dielectric constant adjusting member 130 in the cross section including the side surface convex portion 131. ₁₃₁ + W ₁₃₂ + W ₁₃₂ ) is larger than the dimension (W ₁₃₁ ) of the bottom surface 130b.

  In the present embodiment, since the base material 110 has the above-described configuration, for example, the dielectric constant adjusting member 130 having the side protrusions 131 as illustrated in FIG. Can be supported from.

More specifically, in the arrangement step of the dielectric constant adjusting member, first, the side convex portion 131 of the dielectric constant adjusting member 130 shown in FIG. 9 is formed on the depression 113 of the base 110 shown in FIG. The entire dielectric constant adjusting member 130 is inserted into the recess 113 so as to pass through the notched portion 121 provided at the edge, and then the dielectric constant adjusting member 130 is rotated so that the side convex portion 131 and the notched portion It arrange | positions in the position which 121 does not mutually overlap.
Through such an arrangement step, the dielectric constant adjusting member 130 can be supported from the second side 110b of the base 110.

  In addition, in order to remove the dielectric constant adjusting member 130 from the base material 110, a procedure reverse to the above arrangement step may be performed. Specifically, after the dielectric constant adjusting member 130 is rotated so that the side surface convex portion 131 and the notch portion 121 overlap each other, the side surface convex portion 131 passes through the notch portion 121, and the dielectric is adjusted. What is necessary is just to take out the whole rate adjustment member 130 from the hollow part 113. FIG.

  As a method of forming the inclined surface on the side surface 113b of the hollow portion 113 of the base 110, the tip of the rotating shaft 41 as shown in FIG. 3A is similar to the method described in the first embodiment. A method of grinding using a grinding jig having a grinding disk 42 can be mentioned.

As the range of the angle (θ ₁₁₀ ) of the inclined surface, 9 ° <θ ₁₁₀ <90 ° is applicable, but the depression 113 at a position below the pattern region 112 of the substrate 110 is the dielectric constant adjusting member 130. to ensure that are filled with the thick portion (the height H _130), i.e., the pattern area 112 of the substrate 110 overlaps the bottom surface 130b of the dielectric constant adjusting member 130, the considering, 23 ° <theta ₁₁₀ <90 ° is preferred.

Here, in the dielectric constant adjusting member 130 shown in FIG. 9, the side surface of the side surface convex portion 131 has an inclined surface, and the angle (θ ₁₃₀ ) is the same as that of the side surface 113 b of the recessed portion 113 of the substrate 110. It does not have to coincide with the angle (θ ₁₁₀ ) of the inclined surface, and can be applied in the range of 9 ° <θ ₁₃₀ <90 °.
Furthermore, in this embodiment, the side surface of the side surface convex portion of the dielectric constant adjusting member may not have an inclined surface, and for example, a dielectric constant adjusting member having a form as shown in FIG. 4 is also used. be able to.

However, in order to further reduce the volume of the gap between the depression 113 and the dielectric constant adjustment member when the dielectric constant adjustment member is disposed in the depression 113, the form of the dielectric constant adjustment member is shown in FIG. The angle (θ ₁₃₀ ) of the inclined surface of the side surface convex portion 131 of the dielectric constant adjusting member 130 is the same as that of the dielectric constant adjusting member 130, and the inclined surface of the side surface 113 b of the recess 113 of the substrate 110 is the same. It is preferable that the angle coincides with the angle (θ ₁₁₀ ).
Further, similarly to the first embodiment described above, it is preferable that each dimension of the dielectric constant adjusting member 130 is configured to be slightly smaller than each dimension of the recessed portion 113 of the substrate 110.

Specifically, the diameter W ₁₃₁ of the bottom surface 130b of the dielectric constant adjusting member 130 shown in FIG. 9 is preferably about 1% to 10% smaller than the diameter L ₁₁₂ of the opening of the recess 113 shown in FIG.
The height H ₁₃₀ of the dielectric constant adjustment member 130 shown in FIG. 9, than the depth D ₁₁₀ of the recess 113 shown in FIG. 8, it is preferably about 1% to 10% smaller.
Further, the depth W ₁₃₂ and the width W ₁₃₃ of the side convex portion 131 of the dielectric constant adjusting member 130 shown in FIG. 9 are respectively the depth L ₁₁₃ extending from the opening of the hollow portion 113 to the bottom surface portion 113a shown in FIG. It is preferable that the width L ₁₁₄ of the notch 121 is smaller by about 1% to 10%.

  In addition, in the example shown in FIG. 8, although the whole surface of the side surface 113b of the hollow part 113 has shown the inclined surface, in this embodiment, it is not limited to this form, The side surface of the hollow part 113 An inclined surface may be formed only on a part of 113b.

In addition, in the dielectric constant adjusting member 130 shown in FIG. 9, an example of a form having two side protrusions 131 is shown, but in the present embodiment, the shape is not limited to this, and the side protrusions 131 are three. The form which has more than one may be sufficient.
In such a case, the corresponding base material 110 is also provided with the notch portions 121 corresponding to the number and shape of the side surface convex portions 131 included in the dielectric constant adjusting member 130.

  Further, in the dielectric constant adjusting member 130 shown in FIG. 9, an example in which the side surface convex portion 131 is fixed is shown, but in the present embodiment, the shape is not limited thereto, and the side surface convex portion 131 is movable. For example, the side convex portion 131 may be housed in the side surface of the dielectric constant adjusting member 130. In such a case, it is not necessary to provide the notch 121 in the base material 110.

Also in the present embodiment, by disposing the dielectric constant adjusting member 130 in the recess 113 of the base material 110, the difference in dielectric constant between the thin area portion and the thick area portion of the base material 110 is reduced during the pattern forming process. can do.
Therefore, also in this embodiment, as in the first to third embodiments described above, the etching accuracy in the pattern forming process can be improved, and an imprint mold having a fine concavo-convex pattern can be manufactured with high accuracy. Can do.

Further, in the present embodiment, the side surface 113b of the recess 113 of the base 110 has an inclined surface, and the distance between the inclined surfaces facing each other in the recess 113 in the sectional view is the first side 110a. Since the second side 110b is smaller than the second side 110b, the dielectric constant adjusting member 130 having the side convex portion 131 as shown in FIG. Can be supported from side 110b.
Due to such a support structure, in this embodiment as well, in the same manner as in the first to third embodiments described above, the dielectric constant adjusting member 130 drops off from the recess 113 when the substrate 110 is transported. Can be prevented.

  As mentioned above, although each embodiment was described about the manufacturing method and base material of the imprint mold which concern on this invention, this invention is not limited to the said embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It falls within the technical scope of the invention.

DESCRIPTION OF SYMBOLS 1 ... Imprint mold 2 ... Fine uneven | corrugated pattern 10, 50, 80, 110 ... Base material 10a, 50a, 80a, 110a ... 1st side 10b, 50b, 80b, 110b ... Second side 11, 51, 81, 111 ... convex structure 12, 52, 82, 112 ... pattern region 13, 53, 83, 113 ... depression 13a, 53a, 83a, 113a ... Bottom portion 13b, 53b, 83b, 113b ... Side surface 14, 54, 114 ... Thin region 15, 55, 115 ... Thick region 16 ... Etching mask 21a ... Depression side surface recess 21b, 121: Notch 30, 70, 100, 130 ... Dielectric constant adjusting member 30a, 70a, 100a, 130a ... Upper surface 30b, 70b, 100b, 130b ... Bottom 31, 131... Side convex part 41... Rotating shaft 42... Grinding disk 61... Depressed part side convex part 71a .. Side surface concave part 71b ... Notch part 91. Concavity and convexity 101 ... Dielectric constant adjusting member side surface concavity and convexity 1010 ... Substrate 1100 ... Imprint mold 1100a ... First side 1100b ... Second side 1120 ... Pattern region 1130 ··· depression 1140 · · · thin region 1150 · · · thick region 1160 · · · etching mask 1200 · · · fine uneven pattern

Claims (10)

An imprint mold having a first side and a second side opposite to the first side, wherein a recess is formed on the second side, and a base material including a first dielectric is used. A method of manufacturing
A dielectric constant adjusting member disposing step of disposing a dielectric constant adjusting member including a second dielectric in the hollow portion;
A pattern forming step of forming a fine concavo-convex pattern by dry etching using plasma on the first side of the base material on which the dielectric constant adjusting member is disposed in the recess;
Including
In the dielectric constant adjusting member arranging step, the dielectric constant adjusting member is supported from the second side by a support structure formed on the base material. The dielectric constant adjusting member arranging step includes
In the recess side surface recess formed on the side surface of the recess of the substrate,
By inserting a part of the dielectric constant adjusting member,
The method for manufacturing an imprint mold according to claim 1, further comprising a step of supporting the dielectric constant adjusting member from the second side. The dielectric constant adjusting member arranging step includes
By the dent part side surface convex part formed in the side of the dent part of the base material,
The method for manufacturing an imprint mold according to claim 1, further comprising a step of supporting the dielectric constant adjusting member from the second side. The dielectric constant adjusting member arranging step includes
In the dent part side surface uneven part formed on the side surface of the dent part of the substrate,
By fitting the dielectric constant adjusting member side uneven portion formed on the side surface of the dielectric constant adjusting member,
The method for manufacturing an imprint mold according to claim 1, further comprising a step of supporting the dielectric constant adjusting member from the second side. The dielectric constant adjusting member arranging step includes
In a sectional view, the inclined surfaces are formed on the opposing side surfaces of the hollow portion of the base material, and the distance between the inclined surfaces is made smaller on the second side than on the first side. By the inclined surface that is
The method for manufacturing an imprint mold according to claim 1, further comprising a step of supporting the dielectric constant adjusting member from the second side. A base material used for an imprint mold,
Having a first side and a second side opposite the first side;
A recess is formed on the second side;
It has a support structure that supports a dielectric constant adjusting member disposed in the depression when the fine uneven pattern is formed on the first side by dry etching using plasma from the second side. Base material.   The base material according to claim 6, further comprising a concave portion side surface concave portion on a side surface of the concave portion.   The base material according to claim 6, wherein the side surface of the dent portion has a dent portion side surface convex portion.   The base material according to claim 6, wherein a concave portion side surface uneven portion is provided on a side surface of the concave portion. A side surface of the depression has an inclined surface;
The base material according to claim 6, wherein a distance between the inclined surfaces facing each other in the hollow portion is smaller on the second side than on the first side in a cross-sectional view.

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