JP6070168B2 - Circuit board - Google Patents

Description

  The present invention relates to a circuit board capable of ensuring a standoff height between a land of a printed board and an electrode of an electronic component.

  Conventionally, as a circuit board capable of ensuring a standoff height between a land of a printed board and an electrode of an electronic component, for example, a circuit board described in Patent Document 1 is known.

  In the circuit board described in Patent Document 1, an insulator part is provided between the wiring part (land) of the printed circuit board and the electrode of the electronic component, and the standoff height is provided by the insulator part. Is to be secured.

JP-A-11-26910

  In Patent Document 1, a protruding portion as an insulator portion is provided on a surface of an electronic component that faces the printed board, and a tip surface of the protruding portion is brought into contact with one surface that is a land forming surface of the printed board.

  In another example, a protrusion as an insulator is provided on one surface of the printed circuit board, and the tip surface of the protrusion is brought into contact with the surface of the electronic component facing the printed circuit board.

  In another example, an insulator portion separate from the printed circuit board and the electronic component is interposed between one surface of the printed circuit board and the surface of the electronic component facing the printed circuit board.

  However, when the solder paste is applied on the land and the electronic component is positioned on the printed circuit board and then reflow soldered, the structure including the insulator portion described above causes the electronic component to be misaligned with respect to the printed circuit board. May occur. The solder is subjected to stress due to the difference in coefficient of linear expansion between the printed circuit board and the electronic component. However, when the above-mentioned positional deviation occurs, the solder thickness between the land and the electrode decreases below the desired thickness, and the stress is sufficiently increased. There is a risk that it cannot be absorbed. Therefore, in the conventional circuit board, there is a possibility that the solder life (connection reliability) cannot be sufficiently improved while having an insulator portion for increasing the standoff height.

  An object of this invention is to provide the circuit board which can improve a solder life compared with the past in view of the said problem.

In order to achieve the above object, the present invention provides a printed circuit board (11) having a land (21) on one surface (11a), a main body (30) disposed on the one surface, and one surface of the main body. A circuit board comprising an electronic component (12) having an electrode (31) provided on an opposing surface (30a), and a solder (13) for electrically connecting the land and the electrode, Of the opposite surface and one surface of the printed circuit board are formed with holes (22, 36) on one side, and the other is inserted into the hole, and in the inserted state, a member having the hole is formed. Protrusions (32, 25) that are supported in contact with each other are formed, and the protrusions are disposed outside the hole and the insertion part (27, 33) disposed in the hole, and between the land and the electrode. Spacer portions (28, 34) for securing a predetermined interval on one surface (1 In the plane along 1a), the radius of rotation of the insertion portion around the center in the state where the center of the insertion portion (27, 33) and the center of the hole portion (22, 36) in the projection portion (32, 25) coincide with each other. L1 is the maximum value and L2 is the shortest distance from the center to the wall surface of the hole, so that L1> L2 is satisfied at a predetermined position within the range where the insertion portion is arranged in the orthogonal direction perpendicular to the one surface. A hole and a protrusion are formed, the hole has a bottom surface (22a) that is a flat surface parallel to one surface, and the insertion portion is a tip that is a flat surface parallel to one surface as an insertion tip that contacts the bottom surface. A portion having a surface (32a), and a hole (22, 36) within a predetermined range from the opening end (23, 38) on the side where the protrusion (32, 25) is inserted, and insertion in the protrusion At least one of the parts (27, 33) is one side (11a) When the hole has an inclined surface that has an inclined surface (24, 26, 35, 37) that is orthogonal to the surface and is inclined with respect to one surface, the portion provided with the inclined surface in a direction perpendicular to the one surface Has a tapering shape that tapers away from the opening end, and when the protrusion has an inclined surface, the portion provided with the inclined surface in the direction perpendicular to the one surface becomes tapered toward the tip of the protrusion. It is characterized by a tapered shape .

  According to this, since the protrusions (32, 25) are inserted into the holes (22, 36) and are supported by contact with the member having the holes (22, 36), the spacer ( 28, 34), it is possible to ensure a predetermined distance between the land (21) and the electrode (31), that is, a desired standoff height.

  Further, since the protrusions (32, 25) are inserted and arranged in the holes (22, 36) and function like an anchor, compared to the conventional configuration in which the protrusions (32, 25) are not inserted and arranged in the holes (22, 36), for example, Positional deviation during reflow, particularly translational deviation along one surface (11a) can be suppressed.

  Therefore, according to the present invention, the solder is sufficiently held between the land and the electrode in which the predetermined interval is secured by suppressing the positional deviation. Thereby, a solder life can be improved compared with the past.

Further, even if the electronic component (12) tries to rotate around the center, the holes (22, 36) and the protrusions (32, 25) are formed so as to satisfy L1> L2, so the insertion portion (27 , 33) contacts the wall surface of the hole (22, 36), and the rotation of the electronic component is suppressed. In this way, positional deviation in the rotation direction can also be suppressed, so that the solder life can be further improved. In addition, the size of the circuit board can be reduced while suppressing displacement in the rotational direction.

Moreover, since it has an inclined surface and has a tapered shape as described above, even if a positional deviation occurs when the electronic component (12) is arranged on one surface (11a) of the printed board (11), the protrusion The part (32, 25) can be inserted into the hole (22, 36).

It is the top view which expanded a part among circuit boards concerning a 1st embodiment. It is sectional drawing which follows the II-II line of FIG. It is the top view which expanded a part among circuit boards concerning a 2nd embodiment. It is sectional drawing which follows the IV-IV line of FIG. It is a figure which shows position shift suppression of a rotation direction. It is a figure which shows a 1st modification, and respond | corresponds to FIG. It is the top view which expanded a part among circuit boards concerning a 3rd embodiment. It is sectional drawing which follows the VIII-VIII line of FIG. It is sectional drawing which shows the effect of a tapered shape. It is a figure which shows a 2nd modification, and respond | corresponds to FIG. It is sectional drawing which follows the XI-XI line of FIG. Moreover, it is also sectional drawing which follows the XI-XI line of FIG. It is a top view which shows a 3rd modification, and respond | corresponds to FIG. It is sectional drawing which shows a 4th modification, and respond | corresponds to FIG. It is the top view which expanded a part among circuit boards concerning a 4th embodiment. It is sectional drawing which follows the XV-XV line | wire of FIG. Moreover, it is also a cross-sectional view taken along line XV-XV in FIG. (B) is a figure which shows the effect of 4th Embodiment, (a) is a figure which shows the structure by which only the projection part was tapered as a comparative example. It is a top view which shows a 5th modification, and respond | corresponds to FIG. It is the top view which expanded a part among circuit boards concerning a 5th embodiment. It is sectional drawing which follows the XIX-XIX line | wire of FIG. It is the figure which expanded the XX area | region of FIG. It is the top view which expanded a part among circuit boards concerning a 6th embodiment. It is sectional drawing which follows the XXII-XXII line | wire of FIG. It is sectional drawing which shows a 6th modification, and respond | corresponds to FIG. It is sectional drawing which shows a 7th modification, and respond | corresponds to FIG. It is sectional drawing which shows an 8th modification, and respond | corresponds to FIG. It is a top view which shows a 9th modification, and respond | corresponds to FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings shown below, common or related elements are given the same reference numerals. In addition, directions that are orthogonal to each other along one surface of the printed board are defined as an X direction and a Y direction. Therefore, the direction along one surface is a direction along a surface defined by the X direction and the Y direction. In addition, the direction orthogonal to one surface, that is, the thickness direction of the printed board is defined as the Z direction. For the purpose of clarification, hatching is given to the electrodes of the electronic members, the solder, and the lands of the printed circuit board in the plan view.

(First embodiment)
As shown in FIGS. 1 and 2, the circuit board 10 includes a printed board 11, an electronic component 12, and solder 13.

  First, the schematic configuration of the circuit board 10 excluding the characteristic part will be described.

  The printed circuit board 11 has an insulating base material 20 formed using an electrical insulating material such as a resin, and wirings arranged on the insulating base material 20.

  The number of wiring layers is not particularly limited. The wiring should just be arrange | positioned at least on the surface by the side of the one surface 11a of the printed circuit board 11 in the insulating base material 20. FIG. Therefore, a single-sided board in which wiring is arranged only on one side 11a, a double-sided board in which wiring is arranged on the reverse side opposite to the one side 11a and one side 11a, and a multilayer board in which wiring is also arranged inside the insulating base 20 Either of these can be employed.

  Among the wirings, the wiring arranged on the one surface 11a of the printed board 11 has a land 21 to which the electrode 31 of the electronic component 12 is reflow soldered. The wiring including the land 21 is formed by patterning a metal foil such as copper. In FIGS. 1 and 2, only the land 21 is shown as the wiring arranged on the one surface 11a. Further, a pair of lands 21 corresponding to the two-terminal electronic component 12 is shown.

  The pair of lands 21 are arranged side by side with a predetermined interval in the X direction. The shape of the land 21 which makes a pair is not specifically limited. The same pattern may be used, or different patterns may be used. The lands 21 forming a pair in the present embodiment have a rectangular shape with substantially the same outer contour in a plane defined by the X direction and the Y direction.

  The printed circuit board 11 has a hole 22. Details of the hole 22 will be described later.

  The electronic component 12 is a surface-mount type electronic component and forms a circuit together with the wiring including the land 21 described above. The electronic component 12 has a main body 30 and an electrode 31, and at least one element is formed in the main body 30. In the present embodiment, the main body 30 is made of ceramic as a base material, and the electronic component 12 is a chip component. Such chip components include chip capacitors, chip resistors, multiple chip resistors, multiple chip capacitors, and the like.

  The electronic component 12 shown in FIGS. 1 and 2 is a two-terminal electronic component as described above. And in the main body part 30 of a substantially rectangular parallelepiped shape, the electrode 31 is arrange | positioned on the outer surface of the both ends in a X direction. Specifically, the electrode 31 is disposed across the opposing surface 30a facing the one surface 11a, the back surface 30b opposite to the opposing surface 30a, and the side surface 30c of the outer surface of the main body 30. Each electrode 31 is electrically connected to an element configured in the main body 30.

  Further, the main body 30 has a protrusion 32. Details of the protrusion 32 will be described later.

  The solder 13 is interposed between the land 21 and the electrode 31 in a state where the electronic component 12 is disposed on the one surface 11 a of the printed circuit board 11. The corresponding land 21 and the electrode 31 are electrically and mechanically connected by the solder 13. As shown in FIG. 2, in the present embodiment, the solder 13 is interposed between the portion of the facing surface 30 a of the electrode 31 and the land 21. A fillet of solder 13 is also formed on the side surface 30 c of the electrode 31.

  Next, the hole 22 of the printed circuit board 11 and the protrusion 32 of the electronic component 12 which are characteristic parts of the present embodiment will be described. In FIG. 1, for convenience, the hole 22 is indicated by a two-dot chain line, and the protrusion 32 is indicated by a broken line.

  The hole 22 opens on the one surface 11a of the printed circuit board 11, and is formed with a predetermined depth in the Z direction. The hole 22 is formed in a portion of the insulating base material 20 where no wiring is arranged. Such a hole 22 can be formed by machining such as a drill, laser light irradiation, pressing during substrate formation, or the like.

  In this embodiment, the hole 22 is a non-penetrating hole that opens only on one surface 11a, and is separated from each land 21 within the opposing region of a pair of lands 21 arranged side by side in the X direction. Is formed. The hole 22 has an in-plane opening shape defined by the X direction and the Y direction having a substantially perfect circle shape, and the opening area is constant in the Z direction. Therefore, the space in the hole 22 is substantially cylindrical. As an example, in the present embodiment, the hole 22 is formed so that the center of the perfect circle substantially coincides with the center of the opposing region of the land 21 that forms a pair. In addition, the code | symbol 23 shown in FIG. 2 has shown the opening end by the side 11a side in the hole part 22. As shown in FIG. In the present embodiment, the angle of the opening end 23 (corner portion) is substantially a right angle.

  On the other hand, the protrusion 32 is integrally configured as a part of the main body 30, protrudes from the facing surface 30 a of the main body 30 toward the printed circuit board 11, and extends in the Z direction. Such protrusions 32 can be formed by etching or stacking plates having different lengths in the X direction. The protrusion 32 is inserted into the hole 22, and in the inserted state, contacts the printed board 11 having the hole 22 and is supported by the printed board 11. The projecting portion 32 includes an insertion portion 33 disposed in the hole portion 22 and a spacer portion 34 disposed outside the hole portion 22 to ensure a predetermined distance H1 between the land 21 and the electrode 31. Have. This interval H1 is a so-called stand-off height.

  In the present embodiment, in a state where the insertion portion 33 is inserted and arranged in the hole portion 22, the distal end surface 32 a of the projection portion 32 contacts the bottom surface 22 a among the bottom surface 22 a and the side surface 22 b that form the wall surface of the hole portion 22, As a result, the protrusion 32, and thus the electronic component 12, is supported on the printed board 11. In this contact state, the same position as the one surface 11a in the Z direction is a boundary, the electrode 31 side of the boundary is the spacer portion 34, and the opposite side is the insertion portion 33.

  In addition, the protrusion 32 is formed on the portion of the main body 30 exposed from the electrode 31 so as to be separated from each electrode 31. In other words, they are formed away from each electrode 31 in the facing region of the paired electrodes 31 arranged side by side in the X direction. The protrusion 32 has a substantially perfect circular shape in cross section along a plane defined by the X direction and the Y direction, and has a constant cross sectional area in the Z direction. Therefore, the protrusion 32 has a substantially cylindrical shape. As an example, in the present embodiment, the protrusion 32 is formed so that the center of the perfect circle coincides with the center of the main body 30. Thus, the cross-sectional shape of the protrusion 32 is similar to the opening shape of the hole 22. Further, even if the dimensions vary within manufacturing tolerances, the cross-sectional area of the protrusion 32 having a perfect cross-section is such that the opening 22 forms a perfect circle so that the insertion portion 33 is inserted and disposed in the hole 22. The opening area is slightly smaller.

  The depth of the hole 22 and the length of the protrusion 32 in the Z direction are not particularly limited. The depth of the hole 22 may be a depth that allows a part of the protrusion 32 to be inserted. In the present embodiment, as an example, the depth of the hole 22 is several hundred μm. On the other hand, the length of the protrusion 32 in the Z direction is such that the front end surface 32a is in contact with the bottom surface 22a of the hole 22 and a predetermined distance is provided between the lower surface of the electrode 31 disposed on the facing surface 30a and the land 21. What is necessary is just to set so that H1 may be ensured. In the present embodiment, the length of the insertion portion 33 matches the depth of the hole portion 22. Therefore, a predetermined distance H <b> 1 is secured between the portion of the facing surface 30 a of the electrode 31 and the land 21 depending on the length of the spacer portion 34. For this reason, it is preferable that the length of the spacer portion 34 is set to a length that takes into account the sum of the thickness of the electrode 31 and the thickness of the land 21 on the facing surface 30a, for example, 20 μm or more. In the present embodiment, the length of the spacer portion 34 is about 50 μm to 150 μm.

  Further, the opening area of the hole 22 and the cross-sectional area of the protrusion 32 are not particularly limited. However, if the hole portion 22 is too large with respect to the insertion portion 33, the gap between the two becomes large, and the region where the position can be shifted increases accordingly. Therefore, in consideration of manufacturing tolerances, the opening area of the hole 22 and the cross-sectional area of the protrusion 32 may be set so that the insertion part 33 can be inserted and arranged in the hole 22 and the gap is as small as possible. preferable. In the present embodiment, the inner diameter of the hole 22 is 1.5 mm, and the diameter of the protrusion 32 is 1.4 mm.

  A method for manufacturing the circuit board 10 will be briefly described.

  First, the printed circuit board 11 having the hole 22 and the electronic component 12 having the protrusion 32 are prepared. Then, a solder paste is applied on the land 21 of the printed circuit board 11.

  Next, the electronic component 12 is picked up by a mounting device (not shown), and the electronic component 12 is positioned with respect to the printed circuit board 11 so that the electrode 31 is positioned immediately above the corresponding land 21. In this positioning state, the electronic component 12 is brought close to the printed circuit board 11 and the protruding portion 32 is inserted into the hole portion 22, and the lower surface of the electrode 31 disposed on the facing surface 30 a comes into contact with the solder paste on the land 21. As described above, the electronic component 12 is arranged on the printed circuit board 11.

  Next, reflow is performed, and the land 21 and the electrode 31 are electrically and mechanically connected by the solder 13. Thus, the circuit board 10 described above can be obtained.

  Note that the tip end surface 32 a of the protrusion 32 and the bottom surface 22 a of the hole 22 may come into contact when the electronic component 12 is placed on the printed circuit board 11. Further, when the electronic component 12 is placed on the printed circuit board 11, the electronic component 12 may not be contacted but may be contacted when the solder 13 melts during reflow and the electronic component 12 sinks due to its own weight.

  Next, the function and effect of the characteristic portion of the circuit board 10 according to the present embodiment, in other words, the soldering structure of the electronic component 12 to the printed board 11 will be described.

  As described above, in the present embodiment, the printed circuit board 11 has the hole 22, and the electronic component 12 has the protrusion 32 that is inserted into the hole 22. The protrusion 32 is supported by the printed circuit board 11 in contact with the bottom surface 22 a of the hole 22 while being inserted into the hole 22. The protrusion 32 is arranged not only in the insertion portion 33 that is inserted into the hole 22 but also outside the hole 22, and the spacer portion 34 that secures a predetermined distance H 1 between the land 21 and the electrode 31. Also have. Therefore, a desired standoff height can be ensured in a state in which the distal end surface 32a of the protruding portion 32 is in contact with the bottom surface 22a.

  In the present embodiment, the insertion portion 33 of the protrusion 32 is inserted and disposed in the hole 22. Therefore, when reflow soldering, the solder 13 melts and the electronic component 12 moves along the plane defined by the X direction and the Y direction by applying an external force or the like. The insertion portion 33 contacts the side surface 22b of the hole portion 22, and further movement is suppressed. Thus, since the protrusion 32 functions like an anchor, the positional deviation during reflow, particularly in any one direction along the one surface 11a, compared to the conventional configuration in which the protrusion 32 is not inserted and arranged in the hole 22. The translational deviation, which is the movement of, can be suppressed.

  Thus, according to the present embodiment, it is possible to suppress the positional deviation of the electronic component 12. Therefore, it is possible to prevent the solder 13 interposed between the land 21 and the electrode 31 from being reduced due to the positional deviation while the predetermined interval H1 is secured. For this reason, even if the stress due to the difference in linear expansion coefficient between the printed circuit board 11 and the electronic component 12 acts on the solder 13, the stress can be absorbed by the solder 13 having a sufficient thickness. And the solder life (connection reliability of the solder 13) can be improved compared with the past.

(Second Embodiment)
In the present embodiment, description of portions common to the circuit board 10 shown in the above embodiment is omitted.

  As shown in FIG.3 and FIG.4, the opening shape of the hole 22 is a rectangular shape. As an example of the rectangle, the opening shape of the hole 22 is a rectangle having the Y direction as the long side and the X direction as the short side. Further, as in the first embodiment, the opening area is constant in the Z direction, and the space in the hole 22 has a substantially quadrangular prism shape.

  On the other hand, the cross-sectional shape of the protrusion 32 is a rectangular shape similar to the opening shape of the hole 22. Further, the cross-sectional area is constant in the Z direction, and the protrusion 32 has a substantially quadrangular prism shape. The cross-sectional area of the protrusion 32 having a rectangular cross section is set slightly smaller than the opening area of the hole 22 having a rectangular shape so that the insertion portion 33 is inserted and disposed in the hole 22. In the present embodiment, in the plane defined by the X direction and the Y direction, the gap between the projecting portion 32 and the hole portion 22 is entirely in a state where the center of the projecting portion 32 and the center of the hole portion 22 are matched. It is almost uniform around the circumference (except for the corners of the rectangle).

  As shown in FIG. 3, the protrusion 32 is formed from one end of the main body 30 to the other end in the Y direction. On the other hand, the hole 22 extends over the main body 30 to the outside of the main body 30 in the Y direction.

  Thus, in this embodiment, the opening shape of the hole 22 and the cross-sectional shape of the protrusion 32 are substantially rectangular similar shapes.

  Here, as shown in FIG. 5, the center of the insertion portion 33 in the protrusion 32 having a rectangular cross section is defined as C1 within the plane defined by the X direction and the Y direction. Then, in a state where the center of the hole 22 coincides with the center C1, the maximum value of the rotation radius of the insertion portion 33 around the center C1, that is, around the axis along the Z direction passing through the center C1, is set to L1, the center C1. The shortest distance to the side surface 22b of the hole 22 is L2. Then, in the Z direction, the hole 22 and the protrusion 32 are formed so as to satisfy L1> L2 at a predetermined position within the range where the insertion portion 33 is disposed.

  In the present embodiment, as described above, the space in the hole 22 has a substantially quadrangular prism shape, the protrusion 32 has a substantially quadrangular prism shape, and the opening shape of the hole 22 and the cross-sectional shape of the protrusion 32 are as follows. It is similar in the entire Z direction of the hole 22. Therefore, in the Z direction, the relationship of L1> L2 is satisfied at every position within the range where the insertion portion 33 is disposed.

  Specifically, as shown in FIG. 5, in the insertion section 33 having a rectangular cross section, the length from the center C <b> 1 to the corner of the rectangle is the maximum value L <b> 1 of the rotation radius of the insertion section 33. In FIG. 5, the locus of rotation of the insertion portion 33 with the rotation radius L1 is indicated by a broken line. On the other hand, in the rectangular hole portion 22 whose opening shape is long in the Y direction and short in the X direction, the length from the center C1 to the side surface 22b parallel to the Y direction is the side surface of the hole portion 22 from the center C1. The shortest distance L2 is 22b. Therefore, the relationship of L1> L2 is satisfied. In the hole portion 22, the length L3 (> L2) from the center C1 to the side surface 22b parallel to the X direction also satisfies the relationship L1> L3. For this reason, even if the electronic component 12 tries to rotate around the center C <b> 1, the rectangular corner portion of the insertion portion 33 contacts the side surface 22 b of the hole portion 22 in a slightly rotated state, and the rotation is suppressed.

  In addition, even if the electronic component 12 tries to move in any one direction along the surface defined by the X direction and the Y direction, when the electronic component 12 moves by a gap in the moving direction, the insertion portion 33 comes into contact with the side surface 22b of the hole portion 22, Further movement is suppressed. Therefore, translational deviation can also be suppressed.

  As described above, according to the present embodiment, not only the translational deviation but also the positional deviation in the rotation direction can be suppressed by the hole 22 and the protrusion 32. Therefore, it is possible to more effectively suppress the decrease in the solder 13 interposed between the land 21 and the electrode 31 due to the positional deviation while the predetermined interval H1 is secured. In particular, since the positional deviation in the rotation direction can also be suppressed, the solder life can be further improved.

  As shown in FIGS. 3 to 5, if there is one set of the hole 22 and the protrusion 32, it is possible to suppress positional deviation in the rotation direction. Therefore, the physique of the circuit board 10 can be reduced in size while suppressing the shift in the rotation direction.

  In addition, the combination of the hole part 22 and the projection part 32 which can suppress the position shift of a rotation direction is not limited to the said example. In a state where the center of the hole 22 coincides with the center C1 of the insertion portion 33, the hole 22 and the protrusion are set so as to satisfy L1> L2 at a predetermined position within the range where the insertion portion 33 is disposed in the Z direction. The part 32 should just be formed. For example, L1> L2 may be satisfied only in a part in the Z direction.

  As long as the above relationship is satisfied, the opening shape of the hole 22 and the cross-sectional shape of the protrusion 32 are not limited to a rectangle. A shape other than a perfect circle shape, for example, an elliptical shape or a polygonal shape other than a rectangular shape may be employed. Moreover, even if it is the same shape (for example, rectangle), the shape which is not similar can also be employ | adopted. Furthermore, combinations of different shapes are possible.

  FIG. 6 is a first modification showing combinations of different shapes. In FIG. 6, the opening shape of the hole 22 is a square, and the cross-sectional shape of the protrusion 32 is an ellipse. However, since L1> L2 is satisfied, positional deviation in the rotation direction can be suppressed.

  However, as shown by a two-dot chain line in FIG. 6, the maximum value L1 of the rotation radius is the same, and the similar shape is obtained when compared with the protrusion 32 having a cross-sectional shape (square) similar to the opening shape of the hole 22. As a result, the portion where the insertion portion 33 is not disposed in the hole portion 22, that is, the gap becomes smaller. Therefore, even if the electronic component 12 moves randomly (for example, a combination of translational deviation and positional deviation in the rotational direction) within the plane defined by the X direction and the Y direction, the amount of movement can be reduced. . That is, if it is a similar shape, the solder life can be further improved.

(Third embodiment)
In the present embodiment, description of portions common to the circuit board 10 shown in the above embodiment is omitted.

  As shown in FIGS. 7 and 8, the feature of the present embodiment is that at least a part of the insertion portion 33 in the protrusion 32 has one surface 11 a and an inclined surface 35 that is inclined with respect to the Z direction. The taper shape is such that the taper is further away from the electrode 31. The circuit board 10 shown in FIGS. 7 and 8 has substantially the same structure as the circuit board 10 shown in the second embodiment. The difference is that an inclined surface 35 is provided from the tip surface 32a to a position in the middle of the insertion portion 33 with respect to the substantially square columnar projection 32 similar to the hole 22 shown in the second embodiment. is there.

  In the Z direction, one end of the inclined surface 35 is connected to the tip surface 32a, and the other end is connected to the side surface 32b of the protrusion 32 (insertion portion 33), and the inclined surface 35 is connected to the X direction and the Z direction. Each is inclined at a predetermined acute angle. The inclined surface 35 of this embodiment is inclined at an angle of approximately 45. Further, in the Y direction, the insertion portion 33 extends from one end to the other end. Such an inclined surface 35 is formed only on one end side in the X direction of the insertion portion 33. Then, an inclined surface 35 is provided from the distal end surface 32 a to a position in the middle of the insertion portion 33 with respect to the substantially quadrangular prism-shaped projection portion 32, and as a result, a part of the insertion portion 33 from the distal end surface 32 a is further away from the electrode 31. It has a tapered shape with a small cross-sectional area.

  In this way, when the projecting portion 32 having a tapered shape is employed, as shown in FIG. 9, when the electronic component 12 is positioned on the printed circuit board 11 by the mounting device, the inclined surface 35 with respect to the center of the hole portion 22. Even if the center C <b> 1 of the insertion portion 33 is shifted to the side having the inclined surface 35, the inclined surface 35 contacts the opening end 23 of the hole 22. Therefore, the position of the protrusion 32 can be corrected and the insertion portion 33 can be guided and inserted into the hole 22. In addition, the code | symbol 13a shown in FIG. 9 is a solder paste.

  In addition, if the protrusion part 32 is made into a taper shape, the effect of the above-described positional deviation correction can be achieved without changing the size of the hole part 22. Accordingly, the size of the circuit board 10 can be reduced.

  The formation position of the inclined surface 35 is not limited to the above example. In the X direction, it may be formed on the end side opposite to FIG. Moreover, the inclined surface 35 may be formed in the edge part in a Y direction. Below, the modification regarding a taper shape is shown.

  In the second modified example shown in FIGS. 10 and 11, the inclined surface 35 is provided not only on one end side in the X direction but also on the other end side with respect to the protrusion 32 shown in FIG. Further, from the distal end surface 32a to the midway position of the insertion portion 33, the opposing portions are inclined symmetrically to form a taper shape. According to this, it is possible to further increase the tolerance (correctable amount) of positional deviation at the time of mounting. Needless to say, inclined surfaces 35 may be provided at both ends in the Y direction.

  In the third modification shown in FIG. 12, inclined surfaces 35 are provided at both ends in the X direction and both ends in the Y direction, respectively, with respect to the substantially quadrangular prism-shaped protrusions 32, whereby the protrusions 32 are tapered. It has become. The inclined surfaces 35 of the adjacent side surfaces 32b are connected, and the tapered portion has a trapezoidal weight. Thus, the inclined surface 35 is provided on the entire circumference around the center C1. According to this, in the plane along the X direction and the Y direction, the positional deviation can be corrected even if the positional deviation occurs in any direction. Note that the cross section taken along line XI-XI in FIG. 12 corresponds to FIG.

  In the fourth modified example shown in FIG. 13, the opening area of the hole 22, not the protrusion 32, becomes smaller as the distance from the opening 31 on the side where the protrusion 32 is inserted becomes farther from the electrode 31. It has a tapered shape. In FIG. 13, the opening end 23 is chamfered and the inclined surface 24 is provided to the hole 22 having the rectangular opening shape shown in the second embodiment. In addition, inclined surfaces 24 are provided on both sides in the X direction, and the inclined surface 24 forms a tapered portion in a predetermined range from the opening end 23 in the Z direction. Also by this, the same effect as the above-mentioned taper-shaped projection part 32 can be produced. Further, the position shiftable range of the electronic component 12 can be narrowed as compared with the structure in which the opening area is increased in the entire length of the hole 22 in the Z direction. In FIG. 13, the inclined surfaces 24 are provided on both sides in the X direction, but the inclined surfaces 24 may be provided only on one side. Moreover, you may provide the inclined surface 24 in a Y direction.

  Note that the inclined surface 35 described above may be provided on the protrusion 32 having a perfectly circular cross section shown in the first embodiment. For example, it may be conical from the tip to a predetermined position. Also in this case, the positional deviation at the time of mounting can be corrected. Similarly, the inclined surface 24 described above may be provided in the hole 22 having a perfect circular opening.

  Further, the shapes of the inclined surfaces 24 and 35 are not limited to shapes in which the amount of change per unit length in the Z direction, for example, the amount of change in width in the X direction, is constant. For example, it is possible to employ a slope that has a larger change amount as it approaches the electrode 31 or a slope that has a larger change amount as it moves away from the electrode 31. That is, curved surfaces can also be employed as the inclined surfaces 24 and 35.

(Fourth embodiment)
In the present embodiment, description of portions common to the circuit board 10 shown in the above embodiment is omitted.

  As shown in FIGS. 14 and 15, the feature of this embodiment is that both the hole 22 and the protrusion 32 have a tapered shape.

  14 and 15 have a structure in which the above-described second modification and fourth modification are combined. That is, inclined surfaces 35 are provided on both sides of the protrusion 32 in the X direction. Similarly, inclined surfaces 24 are provided on both sides of the hole 22 in the X direction.

  According to this, as shown in FIG. 16 (b), as compared with the structure in which the inclined surface 35 is provided only on the protrusion 32 shown as a comparative example in FIG. The degree (correctable amount) can be increased.

  In the Y direction, the same effect can be obtained even when the inclined surfaces 35 are provided on both sides of the protrusion 32 and the inclined surfaces 24 are provided on both sides of the hole 22.

  In addition, as in the fifth modification shown in FIG. 17, in the X direction, inclined surfaces 35 are provided on both sides of the protruding portion 32, and inclined surfaces 24 are provided on both sides of the hole portion 22. The inclined surface 35 may be provided on both sides of the portion 32 and the inclined surface 24 may be provided on both sides of the hole portion 22. According to this, according to this, in the plane along the X direction and the Y direction, it is possible to further increase the tolerance of the positional deviation when mounting in any direction. Note that the cross section taken along line XV-XV in FIG. 17 corresponds to FIG.

(Fifth embodiment)
In the present embodiment, description of portions common to the circuit board 10 shown in the above embodiment is omitted.

  In the present embodiment, the inclined surface 24 of the hole portion 22 and the inclined surface 35 of the projection portion 32 face each other in a state where the insertion portion 33 is inserted and disposed in the hole portion 22. And the contact part of the inclined surface 24 of the hole 22 and the inclined surface 35 of the protrusion 32 sandwiches the tip of the protrusion 32 in the first direction along the surface 11a, or the surface along the surface 11a. It is provided so that it may surround the front-end | tip of the projection part 32 inside.

  In FIG. 18 and FIG. 19 shown as specific examples, the hole portion 22 is a portion within a predetermined range from the opening end 23, and the opposing wall surface portions are symmetrically inclined to form a tapered shape. The hole 22 has inclined surfaces 24 on both sides in the X direction, the inclined surfaces 24 are connected to each other, and the shape of the hole 22 is a wedge shape (V-shaped). Note that such a hole portion 22 is formed from one end to the other end of the overlap region with the main body portion 30 in the Y direction.

  On the other hand, the protrusion 32 is at least a part of the insertion portion 33, and opposing portions are inclined symmetrically to form a taper shape. As an example, in FIG. 18 and FIG. 19, the protrusions 32 have inclined surfaces 35 on both sides in the X direction, and the inclined surfaces 35 are connected to each other at the center C1 in the X direction. However, it has a wedge shape (V shape). The inclined surface 35 is formed from the tip of the protrusion 32 to the boundary between the insertion portion 33 and the spacer portion 34. Such a protrusion 32 is formed from one end of the main body 30 to the other end in the Y direction. Further, in the present embodiment, the opening shape and opening area at the opening end 23 of the hole 22 are the same as the cross-sectional shape and cross-sectional area at the boundary, and the opening width in the X direction at the opening end 23 of the hole 22 and the protrusion The width in the X direction at the end portion on the thick side of the portion 32 is substantially the same. Note that the thick end of the protrusion 32 coincides with the boundary between the insertion portion 33 and the spacer portion 34 in this embodiment. On the other hand, the end on the narrow side of the projection 32 is the end on the tip side of the portion where the inclined surface 35 of the projection 32 is provided, and is the tip in this embodiment.

  Therefore, in a state where the insertion portion 33 is inserted and disposed in the hole portion 22, as shown in FIG. 19, the inclined surface 24 of the hole portion 22 and the inclined surface 35 of the projection portion 32 face each other. As shown in FIG. 20, assuming that the taper angle of the protrusion 32 is θ1 and the taper angle of the hole 22 is θ2, θ1> θ2 is satisfied and the hole 22 and the protrusion 32 are formed.

  By the way, when the inclined surface 24 of the hole 22 and the inclined surface 35 of the protrusion 32 are opposed to each other, if θ1 <θ2, the electronic component 12 (protrusion 32) can rotate around the Y-axis direction. The component 12 is difficult to be fixed at a predetermined position, and positional deviation is likely to occur. Further, if θ1 = θ2, the taper angles θ1 and θ2 vary within the manufacturing tolerance, and the above-described positional deviation may occur.

  In contrast, in the present embodiment, θ1> θ2. Further, in the present embodiment, the opening width in the X direction at the opening end 23 of the hole portion 22 and the width in the X direction at the end portion on the thick side of the protruding portion 32 substantially coincide with each other. For this reason, the open end 23 of the hole 22 contacts the thick end of the inclined surface 35 of the protrusion 32 on both sides in the X direction. A portion of the wall surface of the hole 22 that is closer to the center C <b> 1 in the X direction than the opening end 23 is not in contact with the protrusion 32. Further, the portion of the protrusion 32 that is closer to the center C1 in the X direction than the end on the thicker side is not in contact with the wall surface of the hole 22. As described above, in the present embodiment, in the X direction, there is a contact site between the wall surface of the recess 22 and the projection 32 with the tip (projection top) of the projection 32 interposed therebetween. Specifically, the contact portion extending in the Y direction exists so as to sandwich the protrusion 32 in the X direction. For this reason, the electronic component 12 is stably arranged on the printed circuit board 11 while both the wall surface of the recess 22 and the protrusion 32 have the inclined surfaces 24 and 35. Therefore, the position shift of the electronic component 12 can be suppressed, and consequently the solder life can be improved. In the present embodiment, since the protruding portion 32 has a wedge shape, the tip end of the protruding portion 32 and the center C1 of the protruding portion 32 coincide with each other in the X direction.

  The inclined surface 24 of the hole portion and the inclined surface 35 of the protrusion portion are opposed to each other, and the contact portion between the inclined surface 24 of the hole portion 22 and the inclined surface 35 of the protrusion portion 32 is the protrusion portion in the first direction along the one surface 11a. The structure provided so that the front-end | tip of 32 may be pinched | interposed or the front-end | tip of the projection part 32 may be enclosed in the surface along the one surface 11a is not limited to the said example.

  The formation range of the inclined surfaces 24 and 35 is not limited to the formation range in which, for example, in the X direction, the position of the end portion on the inclined surface 35 on the thick side coincides with the position of the opening end 23 of the hole portion 22. For example, in the X direction, the position of the end on the thick side of the inclined surface 35 may be outside the opening end 23 with respect to the wedge-shaped center C1 of the protrusion 32. In this case, the opening end 23 comes into contact with the middle portion of the inclined surface 35 of the protrusion 32. Moreover, it is good also as a position closer to the center C1 than the opening end 23. In this case, an end on the thick side of the inclined surface 35 comes into contact with the inclined surface 22. Further, the inclined surfaces 24 and 35 may be provided on both sides in the Y direction.

  Furthermore, the inclined surfaces 35 may be provided on both sides in the X direction and both sides in the Y direction, and for example, the tapered portion of the protrusion 32 may have a quadrangular pyramid shape. For example, if the space in the hole 22 is also a quadrangular pyramid, and the hole 32 is smaller than the protrusion 32, the inclined surface 35 comes into contact with the opening end 23 on the entire circumference. Also in this case, since the contact portion is provided so as to surround the tip of the protruding portion 32 in the plane along the one surface 11a, the displacement of the electronic component 12 can be suppressed, and the solder life can be improved.

  Further, a predetermined range in the Z direction from the tip of the protrusion 32 may be hemispherical, the space in the hole 22 may be cylindrical, and the radius of the perfect circle at the opening end 23 may be smaller than the radius of the hemisphere. . In this case, the inclined surface 35 comes into contact with the perfect circular opening end 23 on the entire circumference thereof. Also in this case, since the contact portion is provided so as to surround the tip of the protruding portion 32 in the plane along the one surface 11a, the displacement of the electronic component 12 can be suppressed, and the solder life can be improved.

  Further, the tapered portion of the protruding portion 32 may have a triangular pyramid shape, the space in the hole portion 22 may have a cylindrical shape, and the inclined surface 35 of the protruding portion 32 may contact the opening end 23. In this case, three contact parts exist so as to surround the tip of the protrusion 32 in the plane along the one surface 11a. Also by this, the position shift of the electronic component 12 can be suppressed, and by extension, the solder life can be improved.

(Sixth embodiment)
In the present embodiment, description of portions common to the circuit board 10 shown in the above embodiment is omitted.

  As shown in FIGS. 21 and 22, the feature of this embodiment is that it has a plurality of pairs of corresponding protrusions 32 and holes 22.

  In the example shown in FIGS. 21 and 22, two holes 22 having a substantially cylindrical space are formed side by side in the X direction between the lands 21 paired in the X direction, as in the first embodiment. Yes. As described above, the two holes 22 are formed in the printed circuit board 11.

  On the other hand, two substantially cylindrical protrusions 32 are formed side by side in the X direction on the portion of the main body 30 that is exposed from the electrode 31 as in the first embodiment. Thus, the two protrusions 32 are formed on the main body 30 of the electronic component 12. That is, there are two sets of protrusions 32 and holes 22.

  Thus, even if it is the structure which has multiple sets of the projection part 32 and the hole 22, not only translational shift but the positional shift of a rotation direction can be suppressed. Therefore, the solder life can be further improved.

  In addition, the number of sets of the projection part 32 and the hole part 22 is not limited to the said example. You may have 3 or more sets. Further, the plurality of sets of arrangements are not limited to the arrangement along the X direction. It can be arranged at an arbitrary position within the plane defined by the X direction and the Y direction.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  The number of terminals of the electronic component 12 mounted on the printed board 11 is not limited to the above example. An electronic component 12 having three or more terminals can also be employed.

  The hole 22 is not limited to a non-through hole. For example, as shown in the sixth modified example of FIG. 23, a through-hole penetrating the printed circuit board 11 can be adopted as the hole portion 22. In FIG. 23, the opening area is a constant hole 22 in the Z direction. Further, as in the fifth embodiment, the protrusion 32 has inclined surfaces 35 on both sides in the X direction, the inclined surfaces 35 are connected to each other, and the shape of the protrusion 32 is a wedge shape (V-shaped). It has become. Further, the inclined surface 35 is formed up to a part of the spacer portion 34. In the X direction, the width at the end of the inclined surface 35 on the spacer portion 34 side is wider than the width of the hole portion 22. For this reason, the inclined surface 35 of the projection part 32 contacts the opening end 23 of the hole 22 on both sides in the X direction, and the tip of the projection part 32 is positioned between the contact parts at both ends. Thereby, the electronic component 12 is supported by the printed circuit board 11.

  The opening area of the hole 22 is not limited to be constant in the Z direction. For example, as shown in a seventh modification of FIG. 24, a predetermined range from the opening end 23 may be tapered, that is, a shape having an inclined surface 24. In FIG. 24, the shape of the hole 22 is changed with respect to the sixth modification. In FIG. 24, as in the fifth embodiment, since θ1> θ2, the inclined surface 35 comes into contact with the opening end 23 on both sides in the X direction while having the inclined surface 24, and the contact portions at both ends are in contact with each other. The tip of the protrusion 32 is located between them. Therefore, the position shift of the electronic component 12 can be suppressed, and consequently the solder life can be improved. Note that the present invention can also be applied to the non-penetrating hole 22.

  As shown in the eighth modification of FIG. 25, the printed circuit board 11 has a protrusion 25 that protrudes from the one surface 11a toward the electronic component 12, and the main body 30 of the electronic component 12 opens to the opposing surface 30a. In addition, a configuration having a hole 36 into which a part of the protrusion 25 is inserted may be employed. In FIG. 25, in the structure of 5th Embodiment, the protrusion part and the hole part are made into the reverse arrangement | positioning. Therefore, the protrusion 25 has the inclined surfaces 26 on both sides in the X direction, the inclined surfaces 26 are connected to each other, and the shape of the protrusion 25 is a wedge shape (V-shaped). The inclined surface 26 is formed from the tip to the boundary between the insertion portion 27 and the spacer portion 28. Moreover, the hole 36 has inclined surfaces 37 on both sides in the X direction, the inclined surfaces 37 are connected to each other, and the shape of the hole 36 is a wedge shape (V-shaped). The taper angle θ1 of the protrusion 25 is larger than the taper angle θ2 of the hole 36. For this reason, on both sides in the X direction, the end on the boundary side of the inclined surface 26 contacts the opening end 38 of the hole 36, and the tip of the protrusion 25 is located between the contact portions on both ends. Therefore, the same effect as the fifth embodiment can be obtained.

  As shown in the ninth modified example of FIG. 26, the protrusions 32 of the plurality of electronic components 12 may be inserted into the common hole 22. In FIG. 26, as in the fifth embodiment, the hole 22 and the protrusion 32 have a wedge shape. In addition, the structure which makes the hole part 22 common in such a some electronic component 12 is applicable in structures other than above-described 6th Embodiment.

DESCRIPTION OF SYMBOLS 10 ... Circuit board, 11 ... Printed circuit board, 11a ... One side, 12 ... Electronic component, 13 ... Solder, 13a ... Solder paste, 20 ... Insulating base material, 21. ..Land, 22 ... hole, 22a ... bottom surface, 22b ... side, 23 ... open end, 24 ... slope, 25 ... projection, 26 ... slope 27 ... insertion part, 28 ... spacer part, 30 ... main body part, 30a ... opposite surface, 30b ... back surface, 30c ... side surface, 31 ... electrode, 32 ...・ Protruding part, 32a ... tip face, 32b ... side face, 33 ... insertion part, 34 ... spacer part, 35 ... inclined surface, 36 ... hole, 37 ... inclined Surface, 38... Open end,

Claims (5)

A printed circuit board (11) having a land (21) on one surface (11a);
An electronic component (12) having a main body (30) disposed on the one surface and an electrode (31) provided on a surface (30a) facing the one surface of the main body;
A circuit board comprising solder (13) for electrically connecting the land and the electrode,
Of the opposing surface of the main body and the one surface of the printed circuit board, one of the holes (22, 36) is formed, and the other is inserted into the hole, and in the inserted state, Protrusions (32, 25) that are supported in contact with a member having a hole are formed,
The projecting portion is an insertion portion (27, 33) disposed in the hole portion, and a spacer portion (28, 33) disposed outside the hole portion to ensure a predetermined interval between the land and the electrode. 34)
In a plane along the one surface (11a), the center of the insertion portion (27, 33) and the center of the hole portion (22, 36) in the projection (32, 25) are aligned with each other around the center. When the maximum value of the rotation radius of the insertion portion is L1, and the shortest distance from the center to the wall surface of the hole is L2,
In the orthogonal direction orthogonal to the one surface, the hole and the protrusion are formed so as to satisfy L1> L2 at a predetermined position within the range where the insertion portion is disposed,
The hole has a bottom surface (22a) that is a flat surface parallel to the one surface, and the insertion portion is a tip surface (32a) that is a flat surface parallel to the one surface as an insertion tip that contacts the bottom surface. I have a,
In the hole (22, 36), a portion within a predetermined range from the opening end (23, 38) on the side where the protrusion (32, 25) is inserted, and the insertion portion (27, At least one of a part of 33) has an orthogonal direction orthogonal to the one surface (11a) and an inclined surface (24, 26, 35, 37) inclined with respect to the one surface;
When the hole has an inclined surface, in the direction perpendicular to the one surface, the portion provided with the inclined surface has a tapered shape that tapers away from the opening end,
When the projection has an inclined surface, the portion provided with the inclined surface in a direction perpendicular to the one surface has a tapered shape that tapers toward the tip of the projection. Circuit board.   The circuit board according to claim 1, wherein the hole portion has a side surface (22b) perpendicular to the one surface, and the insertion portion has a side surface (32b) perpendicular to the one surface.   The cross-sectional shape of the insertion portion (27, 33) and the opening shape of the hole portion (22, 36) are similar in a plane along the one surface (11a). The circuit board according to claim 1 or 2. 4. The circuit board according to claim 1 , wherein both the hole (22, 36) and the protrusion (32, 25) have the tapered shape. 5. The circuit board according to any one of claims 1 to 4 , wherein the inclined surface (24, 26, 35, 37) is provided on the entire circumference around the orthogonal direction.

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