JP6066414B2 - 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 - Google Patents

感光性樹脂組成物、レジスト積層体及びそれらの硬化物 Download PDF

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Publication number
JP6066414B2
JP6066414B2 JP2013089584A JP2013089584A JP6066414B2 JP 6066414 B2 JP6066414 B2 JP 6066414B2 JP 2013089584 A JP2013089584 A JP 2013089584A JP 2013089584 A JP2013089584 A JP 2013089584A JP 6066414 B2 JP6066414 B2 JP 6066414B2
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Japan
Prior art keywords
resin composition
photosensitive resin
epoxy
mass
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013089584A
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English (en)
Japanese (ja)
Other versions
JP2014123094A (ja
Inventor
尚子 今泉
尚子 今泉
稲垣　真也
真也 稲垣
那央 本田
那央 本田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP2013089584A priority Critical patent/JP6066414B2/ja
Priority to TW102142472A priority patent/TWI637003B/zh
Priority to PCT/JP2013/081377 priority patent/WO2014080975A1/ja
Publication of JP2014123094A publication Critical patent/JP2014123094A/ja
Application granted granted Critical
Publication of JP6066414B2 publication Critical patent/JP6066414B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2013089584A 2012-11-22 2013-04-22 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 Expired - Fee Related JP6066414B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013089584A JP6066414B2 (ja) 2012-11-22 2013-04-22 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
TW102142472A TWI637003B (zh) 2012-11-22 2013-11-21 感光性樹脂組成物、阻劑層合體及彼等之硬化物
PCT/JP2013/081377 WO2014080975A1 (ja) 2012-11-22 2013-11-21 感光性樹脂組成物、レジスト積層体及びそれらの硬化物（８）

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012256122 2012-11-22
JP2012256122 2012-11-22
JP2013089584A JP6066414B2 (ja) 2012-11-22 2013-04-22 感光性樹脂組成物、レジスト積層体及びそれらの硬化物

Publications (2)

Publication Number Publication Date
JP2014123094A JP2014123094A (ja) 2014-07-03
JP6066414B2 true JP6066414B2 (ja) 2017-01-25

Family

ID=50776153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013089584A Expired - Fee Related JP6066414B2 (ja) 2012-11-22 2013-04-22 感光性樹脂組成物、レジスト積層体及びそれらの硬化物

Country Status (3)

Country Link
JP (1) JP6066414B2 (zh)
TW (1) TWI637003B (zh)
WO (1) WO2014080975A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5967824B2 (ja) * 2012-10-26 2016-08-10 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP5901070B2 (ja) 2012-10-26 2016-04-06 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP5939964B2 (ja) * 2012-11-22 2016-06-29 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP6066413B2 (ja) 2012-11-22 2017-01-25 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
US11809078B2 (en) * 2017-12-06 2023-11-07 Nippon Kayaku Kabushiki Kaisha Photosensitive resin composition, dry film resist, and cured objects obtained therefrom

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4789726B2 (ja) * 2006-07-14 2011-10-12 日本化薬株式会社 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法
JP2008026667A (ja) * 2006-07-21 2008-02-07 Nippon Kayaku Co Ltd 永久レジスト組成物、及びレジスト積層体
JP2009075261A (ja) * 2007-09-19 2009-04-09 Nippon Kayaku Co Ltd 感光性樹脂組成物、及びそれを用いて得られたマイクロチップ
KR20110042027A (ko) * 2008-06-10 2011-04-22 니폰 가야꾸 가부시끼가이샤 중공 패키지용 감광성 수지 조성물, 그 경화물 및 그 수지 조성물을 이용한 적층체 및 마이크로디바이스
KR101567131B1 (ko) * 2010-03-19 2015-11-06 세키스이가가쿠 고교가부시키가이샤 경화성 조성물, 다이싱-다이본딩 테이프, 접속 구조체 및 점접착제층을 갖는 반도체 칩의 제조 방법
KR102156990B1 (ko) * 2010-07-14 2020-09-16 닛뽄 가야쿠 가부시키가이샤 감광성 수지 조성물 및 이의 경화물

Also Published As

Publication number Publication date
TW201425368A (zh) 2014-07-01
WO2014080975A1 (ja) 2014-05-30
TWI637003B (zh) 2018-10-01
JP2014123094A (ja) 2014-07-03

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