JP6061129B2 - 放射線検出器の製造方法 - Google Patents

放射線検出器の製造方法 Download PDF

Info

Publication number
JP6061129B2
JP6061129B2 JP2012202723A JP2012202723A JP6061129B2 JP 6061129 B2 JP6061129 B2 JP 6061129B2 JP 2012202723 A JP2012202723 A JP 2012202723A JP 2012202723 A JP2012202723 A JP 2012202723A JP 6061129 B2 JP6061129 B2 JP 6061129B2
Authority
JP
Japan
Prior art keywords
layer
heat treatment
radiation detector
conversion layer
cdte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012202723A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014059155A (ja
JP2014059155A5 (enExample
Inventor
敏 徳田
敏 徳田
吉牟田 利典
利典 吉牟田
弘之 岸原
弘之 岸原
正知 貝野
正知 貝野
聖菜 吉松
聖菜 吉松
貴弘 土岐
貴弘 土岐
佐藤 敏幸
敏幸 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Priority to JP2012202723A priority Critical patent/JP6061129B2/ja
Priority to US13/784,117 priority patent/US8895341B2/en
Publication of JP2014059155A publication Critical patent/JP2014059155A/ja
Publication of JP2014059155A5 publication Critical patent/JP2014059155A5/ja
Application granted granted Critical
Publication of JP6061129B2 publication Critical patent/JP6061129B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/128Annealing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/29Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to radiation having very short wavelengths, e.g. X-rays, gamma-rays or corpuscular radiation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/022Manufacture or treatment of image sensors covered by group H10F39/12 of image sensors having active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026Wafer-level processing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
JP2012202723A 2012-09-14 2012-09-14 放射線検出器の製造方法 Expired - Fee Related JP6061129B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012202723A JP6061129B2 (ja) 2012-09-14 2012-09-14 放射線検出器の製造方法
US13/784,117 US8895341B2 (en) 2012-09-14 2013-03-04 Method of manufacturing radiation detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012202723A JP6061129B2 (ja) 2012-09-14 2012-09-14 放射線検出器の製造方法

Publications (3)

Publication Number Publication Date
JP2014059155A JP2014059155A (ja) 2014-04-03
JP2014059155A5 JP2014059155A5 (enExample) 2015-08-20
JP6061129B2 true JP6061129B2 (ja) 2017-01-18

Family

ID=50274886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012202723A Expired - Fee Related JP6061129B2 (ja) 2012-09-14 2012-09-14 放射線検出器の製造方法

Country Status (2)

Country Link
US (1) US8895341B2 (enExample)
JP (1) JP6061129B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3281039B1 (en) * 2015-04-07 2020-03-11 Shenzhen Xpectvision Technology Co., Ltd. Semiconductor x-ray detector
US10007009B2 (en) 2015-04-07 2018-06-26 Shenzhen Xpectvision Technology Co., Ltd. Semiconductor X-ray detector
US10910432B1 (en) * 2019-07-23 2021-02-02 Cyber Medical Imaging, Inc. Use of surface patterning for fabricating a single die direct capture dental X-ray imaging sensor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4343881A (en) * 1981-07-06 1982-08-10 Savin Corporation Multilayer photoconductive assembly with intermediate heterojunction
JPH04269653A (ja) 1991-02-25 1992-09-25 Nippon Telegr & Teleph Corp <Ntt> 漏洩磁束検出装置
JPH06345598A (ja) * 1993-06-04 1994-12-20 Japan Energy Corp 放射線検出素子用CdTe結晶およびその製造方法
JPH09124310A (ja) * 1995-10-27 1997-05-13 Sumitomo Metal Mining Co Ltd CdTe結晶の製造方法
JP4269653B2 (ja) 2002-11-20 2009-05-27 株式会社島津製作所 放射線検出器の製造方法
EP2244294B1 (en) * 2008-02-12 2018-06-27 Shimadzu Corporation Method for manufacturing radiation detector
US20110155208A1 (en) * 2008-06-25 2011-06-30 Michael Wang Semiconductor heterojunction photovoltaic solar cell with a charge blocking layer
CN102460215B (zh) * 2009-04-03 2014-02-26 株式会社岛津制作所 放射线检测器的制造方法、放射线检测器以及放射线摄像装置
DE102010006452B4 (de) * 2010-02-01 2012-01-26 Siemens Aktiengesellschaft Strahlenwandlermaterial, Strahlenwandler, Strahlendetektor, Verwendung eines Strahlenwandlermaterials und Verfahren zur Herstellung eines Strahlenwandlermaterials

Also Published As

Publication number Publication date
JP2014059155A (ja) 2014-04-03
US20140080243A1 (en) 2014-03-20
US8895341B2 (en) 2014-11-25

Similar Documents

Publication Publication Date Title
Kakavelakis et al. Metal halide perovskites for high‐energy radiation detection
JP4547760B2 (ja) 放射線検出器および放射線撮像装置
CN101517751B (zh) 光或放射线检测器的制造方法及光或放射线检测器
Kabir et al. Photoconductors for x-ray image detectors
JP4269653B2 (ja) 放射線検出器の製造方法
JP4734597B2 (ja) 放射線検出器の製造方法及び、放射線検出器並びに放射線撮像装置
JP2002148342A (ja) 放射線撮像装置
Tokuda et al. Improvement of the temporal response and output uniformity of polycrystalline CdZnTe films for high-sensitivity X-ray imaging
CN102460215B (zh) 放射线检测器的制造方法、放射线检测器以及放射线摄像装置
JP6061129B2 (ja) 放射線検出器の製造方法
US20160161426A1 (en) Pillar Based Amorphous and Polycrystalline Photoconductors for X-ray Image Sensors
CN103081127B (zh) 放射线检测器的制造方法
WO2012004913A1 (ja) 放射線検出器およびそれを製造する方法
JP5812112B2 (ja) 放射線検出器およびその製造方法
JP5621919B2 (ja) 放射線検出器の製造方法および放射線検出器
Thibault Dark Current modeling and characterization of amorphous lead oxide-based x-ray photoconductive devices for applications in medical imaging
Chowdhury Electrical Properties of Grain Boundaries in Low Doped Polycrystalline Materials with Applications to Detectors
WO2013088625A1 (ja) 放射線検出器の製造方法
KR20220048792A (ko) 방사선 검출기 및 이의 제조 방법
JP2006240953A (ja) Bi12TiO20焼結体および光導電層

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150703

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150703

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160427

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160506

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160610

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20161117

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20161130

R151 Written notification of patent or utility model registration

Ref document number: 6061129

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

LAPS Cancellation because of no payment of annual fees