JP6050180B2 - 積層構造体およびフレキシブルプリント配線板 - Google Patents

積層構造体およびフレキシブルプリント配線板 Download PDF

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Publication number
JP6050180B2
JP6050180B2 JP2013107519A JP2013107519A JP6050180B2 JP 6050180 B2 JP6050180 B2 JP 6050180B2 JP 2013107519 A JP2013107519 A JP 2013107519A JP 2013107519 A JP2013107519 A JP 2013107519A JP 6050180 B2 JP6050180 B2 JP 6050180B2
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Japan
Prior art keywords
bis
dianhydride
resin
resin layer
wiring board
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JP2013107519A
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Japanese (ja)
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JP2014228664A (ja
JP2014228664A5 (enExample
Inventor
宮部　英和
英和 宮部
亮 林
亮 林
横山　裕
裕 横山
直之 小池
直之 小池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
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Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Priority to JP2013107519A priority Critical patent/JP6050180B2/ja
Priority to PCT/JP2014/060986 priority patent/WO2014171525A1/ja
Priority to KR1020157028866A priority patent/KR102229343B1/ko
Priority to CN201480021937.5A priority patent/CN105164585B/zh
Priority to TW103114237A priority patent/TWI614571B/zh
Publication of JP2014228664A publication Critical patent/JP2014228664A/ja
Publication of JP2014228664A5 publication Critical patent/JP2014228664A5/ja
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Publication of JP6050180B2 publication Critical patent/JP6050180B2/ja
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  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2013107519A 2013-04-18 2013-05-21 積層構造体およびフレキシブルプリント配線板 Active JP6050180B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013107519A JP6050180B2 (ja) 2013-05-21 2013-05-21 積層構造体およびフレキシブルプリント配線板
PCT/JP2014/060986 WO2014171525A1 (ja) 2013-04-18 2014-04-17 積層構造体、フレキシブルプリント配線板及びその製造方法
KR1020157028866A KR102229343B1 (ko) 2013-04-18 2014-04-17 적층 구조체, 플렉시블 프린트 배선판 및 그의 제조 방법
CN201480021937.5A CN105164585B (zh) 2013-04-18 2014-04-17 层叠结构体、柔性印刷电路板及其制造方法
TW103114237A TWI614571B (zh) 2013-04-18 2014-04-18 層合構造物、可撓性印刷配線板及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013107519A JP6050180B2 (ja) 2013-05-21 2013-05-21 積層構造体およびフレキシブルプリント配線板

Publications (3)

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JP2014228664A JP2014228664A (ja) 2014-12-08
JP2014228664A5 JP2014228664A5 (enExample) 2016-02-12
JP6050180B2 true JP6050180B2 (ja) 2016-12-21

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JP2013107519A Active JP6050180B2 (ja) 2013-04-18 2013-05-21 積層構造体およびフレキシブルプリント配線板

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180040903A (ko) * 2016-10-13 2018-04-23 엘지전자 주식회사 공기 청정기

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6387444B1 (ja) * 2017-07-10 2018-09-05 太陽インキ製造株式会社 積層構造体、ドライフィルムおよびフレキシブルプリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005300857A (ja) * 2004-04-09 2005-10-27 Fuji Photo Film Co Ltd 感光性転写シート、感光性積層体、画像パターン形成方法、及び配線パターン形成方法
JP2009025699A (ja) * 2007-07-23 2009-02-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、および、プリント配線板の製造方法
JP2009048170A (ja) * 2007-07-24 2009-03-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、及び、プリント配線板の製造方法
JP5402332B2 (ja) * 2009-07-09 2014-01-29 東レ株式会社 感光性樹脂組成物、感光性樹脂組成物フィルムおよびそれを用いた多層配線基板
JP5740915B2 (ja) * 2010-10-28 2015-07-01 東レ株式会社 フィルム積層体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180040903A (ko) * 2016-10-13 2018-04-23 엘지전자 주식회사 공기 청정기
KR102021389B1 (ko) * 2016-10-13 2019-11-04 엘지전자 주식회사 공기 청정기

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JP2014228664A (ja) 2014-12-08

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