JP6049003B2 - 梨地面の形成方法、樹脂成形型及び低密着性材料 - Google Patents
梨地面の形成方法、樹脂成形型及び低密着性材料 Download PDFInfo
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- JP6049003B2 JP6049003B2 JP2012090936A JP2012090936A JP6049003B2 JP 6049003 B2 JP6049003 B2 JP 6049003B2 JP 2012090936 A JP2012090936 A JP 2012090936A JP 2012090936 A JP2012090936 A JP 2012090936A JP 6049003 B2 JP6049003 B2 JP 6049003B2
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Description
Claims (4)
- 絶縁性セラミックスにエポキシ樹脂との剥離性が良好な梨地面を形成するための梨地面の形成方法であって、絶縁性セラミックスのエポキシ樹脂との接触面を放電加工により表面粗さが0.05〜20μmで、且つ、スキューネスが+0.40〜+1.50である梨地面に形成することを特徴とする梨地面の形成方法。
- 請求項1記載の梨地面の形成方法において、前記絶縁性セラミックスの前記接触面の表面に導電性材料を設け、この絶縁性セラミックスと工具電極との間に電圧を印加して放電加工を行う補助電極法を用いて前記放電加工を行うことを特徴とする梨地面の形成方法。
- エポキシ樹脂が充填される樹脂成形型であって、型面が請求項1記載の梨地面の形成方法を用いて形成された梨地面であることを特徴とする樹脂成形型。
- エポキシ樹脂が接触する低密着性材料であって、表面が請求項1記載の梨地面の形成方法を用いて形成された梨地面であることを特徴とする低密着性材料。
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JP2012090936A JP6049003B2 (ja) | 2012-04-12 | 2012-04-12 | 梨地面の形成方法、樹脂成形型及び低密着性材料 |
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JP6049003B2 true JP6049003B2 (ja) | 2016-12-21 |
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WO2018181026A1 (ja) * | 2017-03-29 | 2018-10-04 | 京セラ株式会社 | 流路部材およびこれを用いた電気メス用ヘッド |
US20210161583A1 (en) * | 2018-08-30 | 2021-06-03 | Kyocera Corporation | Head for electrical scalpel |
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JP3536598B2 (ja) * | 1997-07-17 | 2004-06-14 | 東海ゴム工業株式会社 | トナー供給ロール及びその製造方法 |
JP5004573B2 (ja) * | 2006-12-25 | 2012-08-22 | 京セラ株式会社 | 半導体製造装置用耐食性部材およびその製造方法 |
JP6348248B2 (ja) * | 2011-12-28 | 2018-06-27 | 株式会社ブリヂストン | タイヤおよびタイヤ成形用金型 |
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