JP6040852B2 - Adhesive method with adhesive - Google Patents

Description

  The present invention relates to a bonding method using an adhesive.

  When an optical device such as an optical communication module is manufactured, there is a method in which a minute optical component is bonded with an adhesive without providing a lens or a prism between the optical components. Examples of such an adhesive for bonding an optical component include those using a thermosetting resin that is cured by heat, and those using a thermosetting resin that is cured by irradiating ultraviolet rays or visible light.

  By the way, when bonding optical components, generally, after supplying an adhesive to the bonding surface of one optical component and placing the other optical component on the supplied adhesive, Adhesion is achieved by curing. An optical device manufactured by bonding optical components to each other is required to be downsized and highly integrated, and therefore, it is required to supply an adhesive without excess or deficiency. However, when an adhesive is supplied by a general dispenser or the like, it is extremely difficult to stably supply a certain amount of adhesive.

  For example, as shown in FIGS. 1 to 3, consider a case where an adhesive 930 is supplied to the adhesive surface of the optical component 910 by the nozzle 920 a of the dispenser 920. In this case, as shown in FIG. 1, the supply amount of the adhesive 930 supplied to the bonding surface of the optical component 910 is preferably an appropriate amount. FIG. 1 is an explanatory diagram in this case. That is, FIG. 1A shows the state of the dispenser 920 before supplying the adhesive 930, and FIG. 1B shows the state of the dispenser 920 after supplying the adhesive 930. ) Shows the state of the adhesive 930 supplied to the adhesive surface of the optical component 910.

  However, as shown in FIG. 2B, the adhesive 930 may be pulled excessively from the nozzle 920a of the dispenser 920. In this case, as shown in FIG. 2C, the supply amount of the adhesive 930 supplied to the bonding surface of the optical component 910 is larger than the appropriate amount. As described above, when the amount of the adhesive 930 supplied to the adhesive surface of the optical component 910 is larger than the appropriate amount, the amount of the adhesive that protrudes increases. It is necessary to design, and it becomes difficult to reduce the size of the optical device. Further, when the amount of the adhesive 930 protruding is large, the appearance and shape of the optical device are impaired, which may cause a failure, resulting in a decrease in yield. FIG. 2 is an explanatory diagram in this case. 2A shows the state of the dispenser 920 before supplying the adhesive 930, and FIG. 2B shows the state of the dispenser 920 after supplying the adhesive 930. FIG. ) Shows the state of the adhesive 930 supplied to the adhesive surface of the optical component 910.

  3B, when a part of the adhesive 930 remains in the nozzle 920a of the dispenser 920, or around the nozzle 920a of the dispenser 920, as shown in FIG. The adhesive 930 may wrap around. In this case, the supply amount of the adhesive 930 supplied to the bonding surface of the optical component 910 is less than the appropriate amount. As described above, when the supply amount of the adhesive 930 supplied to the bonding surface of the optical component 910 is smaller than the appropriate amount, the adhesion by the adhesive is not sufficient, the strength is lowered, the reliability is decreased, and the yield is decreased. Cause a decline. FIG. 3 is an explanatory diagram in this case. 3A shows the state of the dispenser 920 before the adhesive 930 is supplied, and FIGS. 3B and 3C show the state of the dispenser 920 after the adhesive 930 is supplied. FIG. 3D shows a state of the adhesive 930 supplied to the adhesive surface of the optical component 910.

JP-A-5-49999 JP-A-10-327590

  Therefore, a bonding method using an adhesive that can manufacture an optical device or the like with a high yield by using an appropriate amount of the adhesive is required.

  According to one aspect of the present embodiment, in the bonding method in which the first component and the second component are bonded with an adhesive, the surface acoustic wave generator that generates the surface acoustic wave is provided on the side surface of the first component. And a step of supplying a small amount of the adhesive in a plurality of parts to the adhesive surface of the first component, and a surface acoustic wave generated in the surface acoustic wave generator, The step of bringing the adhesives into contact with each other by moving the adhesive, and placing the second part on the adhesive that has become the mass, Curing.

  In the bonding method using the disclosed adhesive, an optical device or the like can be manufactured with a high yield.

Explanatory drawing of the adhesive supplied by the dispenser (1) Explanatory drawing of the adhesive supplied by the dispenser (2) Explanatory drawing of adhesive supplied by dispenser (3) Explanatory drawing (1) of the method of supplying several minute amount adhesives with a dispenser Explanatory drawing of the method of supplying a plurality of minute amounts of adhesive with a dispenser (2) Explanatory drawing of misalignment caused by curing shrinkage in adhesive Explanatory drawing (1) of the adhesion | attachment apparatus in 1st Embodiment Explanatory drawing (2) of the adhesion | attachment apparatus in 1st Embodiment Explanatory drawing (3) of the adhesion | attachment apparatus in 1st Embodiment Process drawing (1) of the adhesion | attachment method by the adhesive agent in 1st Embodiment Process drawing (2) of the adhesion | attachment method by the adhesive agent in 1st Embodiment Process drawing (3) of the adhesion | attachment method by the adhesive agent in 1st Embodiment Explanatory drawing (1) at the time of supplying an adhesive agent to the 1st optical component formed by joining different materials Explanatory drawing (2) at the time of supplying an adhesive agent to the 1st optical component formed by joining different materials Explanatory drawing (3) at the time of supplying an adhesive agent to the 1st optical component formed by joining different materials Explanatory drawing of the bonding apparatus in 2nd Embodiment Process drawing (1) of the adhesion | attachment method by the adhesive agent in 2nd Embodiment Process drawing (2) of the adhesion | attachment method by the adhesive agent in 2nd Embodiment Process drawing (3) of the adhesion | attachment method by the adhesive agent in 2nd Embodiment

  The form for implementing is demonstrated below. In addition, about the same member etc., the same code | symbol is attached | subjected and description is abbreviate | omitted.

[First Embodiment]
By the way, as a method of stably supplying a predetermined amount of adhesive as much as possible, as shown in FIG. 4A, a very small amount of adhesive 30 is applied to the bonding surface of the first optical component 10 by a dispenser 40. A method may be considered in which the gas is supplied in a plurality of times. Thus, by supplying a small amount of the adhesive 30 in a plurality of times, the variation in the supplied adhesive can be reduced as compared with the case where the adhesive is supplied all at once. The adhesive can be supplied as uniformly as possible. In this case, the supplied adhesive 30 is preferably supplied at intervals of a certain length or more so that the supplied adhesives 30 do not contact each other. This is because when the adhesive 30 is supplied, if it comes into contact with the already supplied adhesive 30, the amount of the supplied adhesive 30 varies due to the influence of the surface tension of the adhesive 30. This is because it becomes easier. FIG. 4 is an explanatory diagram in this case, FIG. 4A shows a state where the adhesive 30 is supplied by the dispenser 40, and FIG. 4B shows the first optical component 10. The state of the adhesive 30 supplied to the bonding surface is shown.

  However, if a minute amount of the adhesive 30 is supplied to the adhesive surface of the first optical component 10 by a dispenser 40 in a plurality of times, bubbles or the like may be generated inside the adhesive 30 after the adhesion. In this case, since it becomes defective, the yield is reduced. Specifically, as shown in FIG. 5A, a plurality of minute amounts of adhesive 30 are supplied to the bonding surface of the first optical component 10 and the second optical component 20 is placed. When bonded, bubbles 31 may be generated inside the adhesive 30 as shown in FIGS. 5 (b) and 5 (c). As described above, when the bubbles 31 are generated in the adhesive 30, the adhesive strength is reduced by the adhesive 30, and the characteristics are deteriorated due to the bubbles 31, resulting in a decrease in yield.

  As described above, the reason why the bubbles 31 are generated inside the adhesive 30 is that a very small amount of the adhesive 30 supplied to the bonding surface of the first optical component 10 at a predetermined interval is bonded. This is thought to be because it does not spread out so that it spreads uniformly. FIG. 5 is an explanatory view in this case, FIG. 5 (a) shows a state before the first optical component 10 and the second optical component 20 are bonded, and FIG. The top view after adhesion | attachment of the 1st optical component 10 and the 2nd optical component 20, FIG.5 (c) shows the side view after adhesion | attachment.

  Further, even if the adhesive 30 supplied to the first optical component 10 is a predetermined amount, if the adhesive 30 is supplied to a position deviated from the predetermined position, the first optical component 10 and the second optical component 10 are supplied. In some cases, the adhesive strength with the optical component 20 is reduced, the position of the bonding position is shifted, and the like. Specifically, as shown in FIG. 6, when the adhesive 30 is supplied to a position shifted from a predetermined position, the bonding area of the second optical component 20 is narrowed, and the bonding strength may be reduced. is there. Further, since the second optical component 20 is pulled to the side where a large amount of the adhesive 30 is supplied due to curing shrinkage that occurs when the adhesive 30 is cured, the second optical component 20 is pulled with respect to the first optical component 10. The bonding position of the component 20 may be shifted. As described above, if the bonding position of the second optical component 20 is shifted with respect to the first optical component 10, desired characteristics cannot be obtained, resulting in a failure, resulting in a decrease in yield. FIG. 6 is an explanatory view in this case, and FIG. 6A is a top view after the first optical component 10 and the second optical component 20 are bonded in this case, and FIG. 6B. These show the side view after adhesion | attachment.

(Adhesive device)
Next, the bonding apparatus used in the bonding method using the adhesive in the first embodiment will be described. The first optical component 10 has an adhesive surface formed in a substantially square or substantially rectangular shape, and has four side surfaces in contact with the adhesive surface. As shown in FIG. 7, the bonding apparatus according to the present embodiment has four surface acoustic wave generators that generate surface acoustic waves (SAW). That is, the first surface acoustic wave generator 110, the second surface acoustic wave generator 120, the third surface acoustic wave generator 130, and the fourth surface acoustic wave generator 140 are provided. In the case shown in FIG. 7, these are the first surface acoustic wave generator 110 on the left side of the first optical component 10, the second surface acoustic wave generator 120 on the right side, and the third surface acoustic wave on the upper side. A fourth surface acoustic wave generation unit 140 is installed on the lower side of the generation unit 130. As described above, the first surface acoustic wave generation unit 110 and the second surface acoustic wave generation unit 120 sandwich the first optical component 10 and are installed on the opposing side surfaces of the first optical component 10. The third surface acoustic wave generation unit 130 and the fourth surface acoustic wave generation unit 140 sandwich the first optical component 10 and are installed on the remaining opposing side surfaces of the first optical component 10. Incidentally, as shown in FIG. 7, a minute amount of adhesives 230a, 230b, and 230c are separately supplied to the adhesive surface of the first optical component 10 as shown in FIG.

  Next, the installation method of the 1st surface acoustic wave generation part 110, the 2nd surface acoustic wave generation part 120, the 3rd surface acoustic wave generation part 130, and the 4th surface acoustic wave generation part 140 is demonstrated. First, as shown in FIG. 8, the first surface acoustic wave generator 110, the second surface acoustic wave generator 120, the third surface acoustic wave generator 130, and the fourth surface acoustic wave generator 140. 1st optical component 10 is installed between. Next, the first surface acoustic wave generation unit 110, the second surface acoustic wave generation unit 120, the third surface acoustic wave generation unit 130, and the fourth surface acoustic wave generation unit 140 are included in the first optical component 10. By bringing them closer, each is brought into contact with the side surface of the first optical component 10. Thus, the first surface acoustic wave generator 110, the second surface acoustic wave generator 120, the third surface acoustic wave generator 130, and the fourth surface acoustic wave generator 140 are installed.

  The first surface acoustic wave generation unit 110, the second surface acoustic wave generation unit 120, the third surface acoustic wave generation unit 130, and the fourth surface acoustic wave generation unit 140 are provided on the piezoelectric substrate and the piezoelectric substrate, respectively. A comb-shaped electrode. Specifically, the first surface acoustic wave generator 110 includes a piezoelectric substrate 111 and a comb-shaped electrode 112 provided on the piezoelectric substrate 111. The second surface acoustic wave generator 120 has a piezoelectric substrate 121 and a comb-shaped electrode 122 provided on the piezoelectric substrate 121. The third surface acoustic wave generator 130 includes a piezoelectric substrate 131 and a comb-shaped electrode 132 provided on the piezoelectric substrate 131. The fourth surface acoustic wave generator 140 includes a piezoelectric substrate 141 and a comb-shaped electrode 142 provided on the piezoelectric substrate 141. In addition, the comb-shaped electrode in this Embodiment is also called the interdigital finger (IDT: Inter Digital Transducer).

  In the first surface acoustic wave generation unit 110, the second surface acoustic wave generation unit 120, the third surface acoustic wave generation unit 130, and the fourth surface acoustic wave generation unit 140, each comb electrode has a predetermined shape. By applying a voltage having a frequency, a surface acoustic wave can be generated in the piezoelectric substrate. Thus, the generated surface acoustic wave is transmitted to the contacted first optical component 10 and supplied to the surface of the first optical component 10 before being cured. It acts as a repulsive force for 230a, 230c, etc.

  Therefore, in the present embodiment, as shown in FIG. 9, the first surface acoustic wave generator 110, the second surface acoustic wave generator 120, the third surface acoustic wave generator 130, the fourth The surface acoustic wave generator 140 can separate the supplied adhesive into one lump. That is, as shown in FIG. 7, the adhesives 230a, 230b, and 230c supplied separately are moved by surface acoustic waves and brought into contact with each other. It can be a lump. In this way, by separating the adhesives 230a, 230b, and 230c supplied separately into one adhesive 230, as shown in FIGS. 5B and 5C, the inside of the adhesive 30 In addition, the generation of bubbles 31 can be prevented.

(Adhesion method)
Next, a bonding method using an adhesive according to the present embodiment will be described with reference to FIGS. In the present embodiment, the first optical component 10 is an optical component in which an optical waveguide such as a PLC (Planar Lightwave Circuit) is formed, and the second optical component 20 is a photodiode or a semiconductor. Laser, optical fiber, etc. Further, the adhesive used in this embodiment is cured by irradiating light such as ultraviolet rays and functions as an adhesive. Specifically, for example, it is called an optical path coupling adhesive.

  First, as shown in FIG. 10A, the first surface acoustic wave generator 110, the second surface acoustic wave generator 120, and the third surface acoustic wave generator 110 are in contact with the side surface of the first optical component 10. A surface acoustic wave generator 130 and a fourth surface acoustic wave generator 140 are installed. Thereafter, a plurality of minute amounts of adhesives 230 a, 230 b and 230 c are supplied to the first optical component 10. As a method for supplying the adhesives 230a, 230b, and 230c, a small amount of the adhesives 230a, 230b, and 230c are supplied in a plurality of times by the method shown in FIG.

  Next, as shown in FIG. 10B, a surface acoustic wave is generated in the second surface acoustic wave generator 120. Specifically, a surface acoustic wave is generated on the piezoelectric substrate 121 by applying a voltage having a predetermined frequency to the comb electrode 122 of the second surface acoustic wave generator 120. As described above, the surface acoustic wave generated by the second surface acoustic wave generator 120 is transmitted to the first optical component 10.

  Next, as shown in FIG. 10C, the adhesive 230c supplied to the surface of the first optical component 10 by the surface acoustic wave generated by the second surface acoustic wave generator 120 is used as the adhesive. 230b moves to contact the adhesive 230c and the adhesive 230b. Since the surface acoustic wave generated in the second surface acoustic wave generator 120 acts as a repulsive force on the liquid adhesive 230c in the first optical component 10, the adhesive 230c is moved toward the adhesive 230b. Can do. Thereby, the adhesive 230c and the adhesive 230b are made to contact. In the present embodiment, the frequency and voltage applied to the comb electrode 122 of the second surface acoustic wave generator 120 are adjusted so that the adhesive 230c and the adhesive 230b are in contact with each other.

  Next, as shown in FIG. 11A, the first surface acoustic wave generator 110 generates surface acoustic waves. Specifically, a surface acoustic wave is generated on the piezoelectric substrate 111 by applying a voltage having a predetermined frequency to the comb electrode 112 of the first surface acoustic wave generator 110. As described above, the surface acoustic wave generated by the first surface acoustic wave generator 110 is transmitted to the first optical component 10.

  Next, as shown in FIG. 11B, the adhesive 230a supplied to the surface of the first optical component 10 by the surface acoustic wave generated by the first surface acoustic wave generator 110 is used as the adhesive. It moves to the side of 230b, and the adhesive 230a and the adhesive 230b contact. Since the surface acoustic wave generated in the first surface acoustic wave generator 110 acts as a repulsive force on the liquid adhesive 230a in the first optical component 10, the adhesive 230a is moved toward the adhesive 230b. Can do. Thereby, the adhesive 230a and the adhesive 230b are made to contact. In the present embodiment, the frequency and voltage applied to the comb-shaped electrode 112 of the first surface acoustic wave generator 110 are adjusted so that the adhesive 230a and the adhesive 230b are in contact with each other.

  Next, as shown in FIG. 11C, the adhesives are in contact with each other, that is, the adhesive 230c and the adhesive 230b are in contact with each other, and the adhesive 230a and the adhesive 230b are in contact with each other. The adhesive 230b and the adhesive 230c become a single adhesive 230.

  Next, as shown in FIG. 12A, a surface acoustic wave is generated in the piezoelectric substrate 141 by applying a voltage having a predetermined frequency to the comb-shaped electrode 132 in the third surface acoustic wave generating unit 130. Alternatively, as shown in FIG. 12B, a surface acoustic wave is generated in the piezoelectric substrate 141 by applying a voltage of a predetermined frequency to the comb-shaped electrode 142 in the fourth surface acoustic wave generating unit 140. As described above, the adhesive surface of the first optical component 10 is generated by the surface acoustic wave generated in the third surface acoustic wave generation unit 130 or the surface acoustic wave generated in the fourth surface acoustic wave generation unit 140. Then, the adhesive 230 formed as one lump is moved to a predetermined position. As a result, the position of the adhesive 230 in one lump is finely adjusted on the bonding surface of the first optical component 10.

  Next, as shown in FIG. 12C, after the second optical component 20 is placed on the adhesive 230 in one lump, it is cured by irradiation with light such as ultraviolet rays. The first optical component 10 and the second optical component 20 are bonded with an adhesive 230.

  In the present embodiment, the supply amount of the adhesive can be made substantially constant by supplying a minute amount of the adhesive in a plurality of times. In addition, when the first optical component 10 and the second optical component 20 are bonded, the adhesive 230 forms one lump so that no bubbles or the like are generated inside the adhesive 230. Adhesion can be performed with a high yield.

  In the present embodiment, when the plurality of minute amounts of adhesives 230a, 230b, 230c are made into one adhesive 230, the first surface acoustic wave generator 110 and the second surface acoustic wave are used. Two surface acoustic wave generators of the generator 120 are used.

[Second Embodiment]
Next, a second embodiment will be described. The present embodiment is an adhesion method in the case where the first optical component 10 is formed by bonding different materials. Specifically, the first optical component 10 is a PLC or the like and is formed by joining two different materials, and the wettability of the supplied adhesive is two types. It is an adhesion method when different materials are different. Here, consider the case where the first optical component 10 is bonded to a glass 10b containing silicon 10a and silicon oxide. In this case, it is preferable that the supplied adhesive 30 is uniform as shown in FIG. 13, but actually, the wettability in the adhesive 30 is different between the silicon 10a and the glass 10b. As shown in FIG. 14, the adhesive 30 is largely biased toward the silicon 10a side. That is, since the wettability in the adhesive 30 is different between the silicon 10a and the glass 10b, the supplied adhesive 30 is repelled on the glass 10b side and increases toward the silicon 10a side and is biased. FIG. 13A is a top view, and FIG. 13B is a side view. FIG. 14A is a top view, and FIG. 14B is a side view.

  In this way, when the adhesive 30 is biased, as shown in FIG. 15, when the adhesive 30 is cured, the adhesive 30 is pulled toward the silicon 10 a side where the adhesive 30 is biased due to curing shrinkage. The optical component 20 moves. That is, even if the second optical component 20 is placed on the first optical component 10 at a predetermined position via the adhesive 30, the second optical component 20 of the second optical component 20 is caused by curing shrinkage of the adhesive 30. When the position moves, the second optical component 20 is bonded at a position shifted from a predetermined bonding position. As described above, if the first optical component 10 and the second optical component 20 are bonded at a position shifted from a predetermined bonding position, a desired characteristic cannot be obtained, resulting in a failure. FIG. 15 is an explanatory diagram in this case, FIG. 15A shows a top view after the first optical component 10 and the second optical component 20 are bonded, and FIG. The side view after adhesion | attachment is shown.

(Adhesive device)
Next, a bonding apparatus used for the bonding method using the adhesive in the second embodiment will be described. As shown in FIG. 16, the bonding apparatus according to the present embodiment has six surface acoustic wave generators that generate surface acoustic waves (SAW). That is, the first surface acoustic wave generator 310, the second surface acoustic wave generator 320, the third surface acoustic wave generator 330, the fourth surface acoustic wave generator 340, and the fifth surface acoustic wave generator. 350 and a sixth surface acoustic wave generator 360. Specifically, as shown in FIG. 16, the first surface acoustic wave generator 310 is installed on the silicon 10 a side of the first optical component 10 in contact with the left side surface of the first optical component 10. The second surface acoustic wave generator 320 is installed on the glass 10b side. Further, in contact with the right side surface of the first optical component 10, the third surface acoustic wave generator 330 is installed on the silicon 10a side of the first optical component 10, and the fourth surface elasticity is formed on the glass 10b side. A wave generator 340 is installed. Further, a fifth surface acoustic wave generator 350 is installed in contact with the upper silicon 10a side surface of the first optical component 10, and is in contact with the lower glass side 10b to provide sixth surface elasticity. A wave generator 360 is installed.

  That is, the first surface acoustic wave generation unit 310 and the third surface acoustic wave generation unit 330 are installed on the side facing the silicon 10a on the silicon 10a side of the first optical component 10. The second surface acoustic wave generator 320 and the fourth surface acoustic wave generator 340 are installed on the side facing the glass 10b on the glass 10b side of the first optical component 10. In addition, the fifth surface acoustic wave generation unit 350 and the sixth surface acoustic wave generation unit 360 are installed on the other opposing side surfaces of the first optical component 10 that sandwich the first optical component 10. FIG. 16 shows a state in which the adhesive 230 forms one lump on the bonding surface of the first optical component 10.

  A first surface acoustic wave generator 310, a second surface acoustic wave generator 320, a third surface acoustic wave generator 330, a fourth surface acoustic wave generator 340, a fifth surface acoustic wave generator 350, Each of the sixth surface acoustic wave generators 360 has a piezoelectric substrate and a comb-shaped electrode provided on the piezoelectric substrate. Specifically, the first surface acoustic wave generator 310 has a piezoelectric substrate 311 and a comb-shaped electrode 312 provided on the piezoelectric substrate 311. The second surface acoustic wave generator 320 has a piezoelectric substrate 321 and a comb-shaped electrode 322 provided on the piezoelectric substrate 321. The third surface acoustic wave generator 330 has a piezoelectric substrate 331 and a comb-shaped electrode 332 provided on the piezoelectric substrate 331. The fourth surface acoustic wave generator 340 includes a piezoelectric substrate 341 and a comb-shaped electrode 342 provided on the piezoelectric substrate 341. The fifth surface acoustic wave generator 350 includes a piezoelectric substrate 351 and a comb-shaped electrode 352 provided on the piezoelectric substrate 351. The sixth surface acoustic wave generator 360 includes a piezoelectric substrate 361 and a comb-shaped electrode 362 provided on the piezoelectric substrate 361.

  In the first surface acoustic wave generation unit 310, the second surface acoustic wave generation unit 320, the third surface acoustic wave generation unit 330, and the fourth surface acoustic wave generation unit 340, each comb electrode has a predetermined By applying a voltage having a frequency, a surface acoustic wave can be generated in the piezoelectric substrate. Similarly, in the fifth surface acoustic wave generator 350 and the sixth surface acoustic wave generator 360, a surface acoustic wave is generated in the piezoelectric substrate by applying a voltage of a predetermined frequency to each comb electrode. Can be made. In this way, the generated surface acoustic wave is transmitted to the first optical component 10 that is in contact with the liquid adhesive in a state before being cured on the bonding surface of the first optical component 10 as a repulsive force. work.

  Therefore, in the present embodiment, the first surface acoustic wave generator 310, the second surface acoustic wave generator 320, the third surface acoustic wave generator 330, and the fourth surface acoustic wave generator 340, Separately supplied adhesive can be made into one lump. Further, even if there are portions where the wettability of the adhesive is different on the bonding surface of the first optical component 10, the fifth surface acoustic wave generator 350 and the sixth surface acoustic wave generator are used. 360 prevents the adhesive from being biased and makes it uniform.

(Adhesion method)
Next, a bonding method using an adhesive according to the present embodiment will be described with reference to FIGS.

  First, as shown in FIG. 17A, each surface acoustic wave generator is installed so as to be in contact with the side surface of the first optical component 10, and a plurality of surfaces are attached to the bonding surface of the first optical component 10. A small amount of adhesive 230a, 230b, 230c is supplied. Specifically, the first surface acoustic wave generator 310, the third surface acoustic wave generator 330, and the fifth surface acoustic wave are generated so as to contact the side surface of the first optical component 10 on the silicon 10a side. The part 350 is installed. Similarly, the second surface acoustic wave generation unit 320, the fourth surface acoustic wave generation unit 340, and the sixth surface acoustic wave generation unit 360 are in contact with the side surface of the first optical component 10 on the glass 10b side. Is installed. Thereafter, a plurality of minute amounts of adhesives 230a, 230b, and 230c are supplied to the bonding surface of the first optical component 10. As a method for supplying the adhesives 230a, 230b, and 230c, a small amount of the adhesives 230a, 230b, and 230c are supplied in a plurality of times by the method shown in FIG.

  Next, as shown in FIG. 17B, surface acoustic waves are generated in the third surface acoustic wave generator 330 and the fourth surface acoustic wave generator 340. Specifically, a surface acoustic wave is generated on the piezoelectric substrate 331 by applying a voltage having a predetermined frequency to the comb-shaped electrode 332 of the third surface acoustic wave generating unit 330. Further, a surface acoustic wave is generated on the piezoelectric substrate 341 by applying a voltage having a predetermined frequency to the comb-shaped electrode 342 of the fourth surface acoustic wave generating unit 340. In the present embodiment, the frequency and voltage applied to the comb electrode 332 of the third surface acoustic wave generator 330 and the frequency and voltage applied to the comb electrode 342 of the fourth surface acoustic wave generator 340 are described. It is different from voltage. That is, since the silicon 10a and the glass 10b in the first optical component 10 have different physical property values, a frequency and voltage suitable for each are applied, so that the applied frequency and voltage are different. Specifically, a frequency and voltage corresponding to silicon 10 a are applied to the comb-shaped electrode 332 of the third surface acoustic wave generating unit 330, and the comb-shaped electrode 342 of the fourth surface acoustic wave generating unit 340 is applied to glass. A frequency and voltage corresponding to 10b are applied. As described above, the surface acoustic wave generated in the third surface acoustic wave generation unit 330 is transmitted to the silicon 10 a in the first optical component 10, and the surface elasticity generated in the fourth surface acoustic wave generation unit 340. The wave is transmitted to the glass 10 b in the first optical component 10.

  Next, as shown in FIG. 17C, the surface of the first optical component 10 is caused by the surface acoustic waves generated by the third surface acoustic wave generator 330 and the fourth surface acoustic wave generator 340. The supplied adhesive 230c moves to the adhesive 230b side. Thereby, the adhesive 230c and the adhesive 230b contact. Since the surface acoustic waves generated by the third surface acoustic wave generator 330 and the fourth surface acoustic wave generator 340 act as repulsive force on the liquid adhesive 230 c in the first optical component 10, the adhesive 230 c Can be moved to the adhesive 230b side. Thereby, the adhesive 230c and the adhesive 230b are made to contact. In the present embodiment, the comb electrode 332 of the third surface acoustic wave generation unit 330 and the comb electrode 342 of the fourth surface acoustic wave generation unit 340 are arranged so that the adhesive 230c and the adhesive 230b are in contact with each other. The frequency and voltage applied to the are adjusted.

  Next, as shown in FIG. 18A, surface acoustic waves are generated in the first surface acoustic wave generator 310 and the second surface acoustic wave generator 320. Specifically, a surface acoustic wave is generated on the piezoelectric substrate 311 by applying a voltage having a predetermined frequency to the comb-shaped electrode 312 of the first surface acoustic wave generator 310. Further, a surface acoustic wave is generated on the piezoelectric substrate 321 by applying a voltage having a predetermined frequency to the comb-shaped electrode 322 of the second surface acoustic wave generating unit 320. In the present embodiment, the frequency and voltage applied to the comb electrode 312 of the first surface acoustic wave generator 310 and the frequency applied to the comb electrode 322 of the second surface acoustic wave generator 320 and It is different from voltage. That is, since the silicon 10a and the glass 10b in the first optical component 10 have different physical property values, a frequency and voltage suitable for each are applied, so that the applied frequency and voltage are different. Specifically, a frequency and voltage corresponding to the silicon 10a are applied to the comb-shaped electrode 312 of the first surface acoustic wave generating unit 310, and the comb-shaped electrode 322 of the second surface acoustic wave generating unit 320 is glass. A frequency and voltage corresponding to 10b are applied. As described above, the surface acoustic wave generated in the first surface acoustic wave generation unit 310 is transmitted to the silicon 10a in the first optical component 10 and the surface elasticity generated in the second surface acoustic wave generation unit 340. The wave is transmitted to the glass 10 b in the first optical component 10.

  Next, as shown in FIG. 18B, the surface of the first optical component 10 is caused by the surface acoustic waves generated in the first surface acoustic wave generator 310 and the second surface acoustic wave generator 320. The supplied adhesive 230a moves to the adhesive 230b side. Thereby, the adhesive 230a and the adhesive 230b contact. Since the surface acoustic waves generated in the first surface acoustic wave generator 310 and the second surface acoustic wave generator 320 act as repulsive force on the liquid adhesive 230a in the first optical component 10, the adhesive 230a Can be moved to the adhesive 230b side. Thereby, the adhesive 230a and the adhesive 230b are made to contact. In the present embodiment, the comb-shaped electrode 312 of the first surface acoustic wave generator 310 and the comb-shaped electrode 322 of the second surface acoustic wave generator 320 so that the adhesive 230a and the adhesive 230b are in contact with each other. The frequency and voltage applied to the are adjusted.

  Next, as shown in FIG. 18 (c), the adhesives are brought into contact with each other, that is, the adhesive 230c and the adhesive 230b are brought into contact with each other, and the adhesive 230a and the adhesive 230b are brought into contact with each other. The adhesive 230b and the adhesive 230c become a single adhesive 230.

  Next, as shown in FIG. 19A, surface acoustic waves are generated in the fifth surface acoustic wave generator 350, and the adhesive 230 on the surface of the first optical component 10 is applied to the glass from the silicon 10a side. Apply force toward the 10b side. Thus, by applying a force to the adhesive 230 on the surface of the first optical component 10 from the silicon 10a side toward the glass 10b side, the adhesive 230 moves, and on the silicon 10a side and the glass 10b side. The adhesive 30 can be made uniform. Since the surface acoustic wave generated in the fifth surface acoustic wave generator 350 acts as a repulsive force on the liquid adhesive 230 in the first optical component 10, the adhesive on the bonding surface of the first optical component 10 A force can be applied to 230 to move it. In the present embodiment, the frequency and voltage applied to the comb-shaped electrode 352 of the fifth surface acoustic wave generator 350 are adjusted so that the adhesive 230 is in a predetermined position.

  In the adhesive 230 on the surface of the first optical component 10, when it is desired to apply a force from the glass 10 b side to the silicon 10 a side, as shown in FIG. In 360, a surface acoustic wave is generated. As described above, by generating the surface acoustic wave in the sixth surface acoustic wave generation unit 360, it is possible to apply force to the adhesive 230 in the first optical component 10 from the glass 10b side to the silicon 10a side. Since the surface acoustic wave generated in the sixth surface acoustic wave generator 360 acts as a repulsive force on the liquid adhesive 230 in the first optical component 10, the adhesive is applied to the adhesive surface of the first optical component 10. A force can be applied to 230 to move it.

  Next, as shown in FIG. 19C, the generation of surface acoustic waves in the fifth surface acoustic wave generator 350 is stopped, and immediately after this, on the adhesive 230 that has become one lump, The optical component 20 is placed and cured by irradiation with light such as ultraviolet rays. Thereby, the 1st optical component 10 and the 2nd optical component 20 can be adhere | attached with the adhesive agent 230. FIG.

  In the present embodiment, even when the first optical component 10 is formed by bonding two different materials, the first optical component 10 and the second optical component are bonded by the adhesive 230. The component 20 can be bonded at a predetermined position. Moreover, the supply amount of the adhesive can be made substantially constant by supplying a small amount of the adhesive in a plurality of times. In addition, when the first optical component 10 and the second optical component 20 are bonded, the adhesive 230 is a single lump so that no bubbles or the like are generated inside the adhesive. Bonding can be performed with a high yield.

  The contents other than the above are the same as in the first embodiment.

  Although the embodiment has been described in detail above, it is not limited to the specific embodiment, and various modifications and changes can be made within the scope described in the claims.

In addition to the above description, the following additional notes are disclosed.
(Appendix 1)
In the bonding method of bonding the first component and the second component with an adhesive,
A step of placing a surface acoustic wave generator for generating surface acoustic waves in contact with a side surface of the first component;
Supplying a small amount of the adhesive in a plurality to the adhesive surface of the first component;
A step of bringing the adhesive into contact with each other by moving the adhesive by a surface acoustic wave generated in the surface acoustic wave generating unit;
A step of placing a second component on the glued adhesive and curing the adhesive;
A bonding method using an adhesive, comprising:
(Appendix 2)
Two surface acoustic wave generators are provided,
The adhesive method according to appendix 1, wherein the surface acoustic wave generator is installed on each of the opposing side surfaces of the first component.
(Appendix 3)
There are four surface acoustic wave generators,
The adhesive method according to appendix 1, wherein the surface acoustic wave generator is installed on each side surface of the first component.
(Appendix 4)
The first part is formed by joining two different types of materials,
The adhesive method according to any one of appendices 1 to 3, wherein the surface acoustic wave generator is installed on each side surface corresponding to the two different types of materials.
(Appendix 5)
After the step of making the adhesive mass, the surface acoustic wave generator includes the step of moving the adhesive that has become the mass to a predetermined position,
After the glued adhesive is moved to a predetermined position, a step of placing a second component on the glued adhesive and curing the adhesive is performed. An adhesion method using the adhesive according to any one of appendices 1 to 4.
(Appendix 6)
The bonding method using an adhesive according to any one of appendices 1 to 5, wherein the step of supplying a plurality of minute amounts of the adhesive is performed by supplying the adhesive with a dispenser.
(Appendix 7)
The adhesive is cured by irradiating with ultraviolet rays,
The method for bonding with an adhesive according to any one of appendices 1 to 6, wherein the step of curing the adhesive includes a step of irradiating the adhesive with the ultraviolet rays.
(Appendix 8)
The first component is a first optical component;
The adhesion method using an adhesive according to any one of appendices 1 to 7, wherein the second component is a second optical component.
(Appendix 9)
The adhesive method according to appendix 8, wherein an optical waveguide is formed on the first optical component.

10 First optical component 20 Second optical component 30 Adhesive (small amount)
40 Dispenser 110 First surface acoustic wave generator 111 Piezoelectric substrate 112 Comb electrode 120 Second surface acoustic wave generator 121 Piezoelectric substrate 122 Comb electrode 130 Third surface acoustic wave generator 131 Piezoelectric substrate 132 Comb electrode 140 Fourth Surface acoustic wave generating part 141 Piezoelectric substrate 142 Comb electrode 230 Adhesive 230a Adhesive (small amount)
230b Adhesive (Small amount)
230c Adhesive (Small amount)

Claims (6)

In the bonding method of bonding the first component and the second component with an adhesive,
A step of placing a surface acoustic wave generator for generating surface acoustic waves in contact with a side surface of the first component;
Supplying a small amount of the adhesive in a plurality to the adhesive surface of the first component;
A step of bringing the adhesive into contact with each other by moving the adhesive by a surface acoustic wave generated in the surface acoustic wave generating unit;
A step of placing a second component on the glued adhesive and curing the adhesive;
A bonding method using an adhesive, comprising: Two surface acoustic wave generators are provided,
2. The bonding method using an adhesive according to claim 1, wherein the surface acoustic wave generator is installed on each of the opposing side surfaces of the first component. There are four surface acoustic wave generators,
The bonding method using an adhesive according to claim 1, wherein the surface acoustic wave generator is installed on each of the side surfaces of the first component. The first part is formed by joining two different types of materials,
The bonding method using an adhesive according to any one of claims 1 to 3, wherein the surface acoustic wave generator is installed on each side surface corresponding to the two different types of materials. After the step of making the adhesive mass, the surface acoustic wave generator includes the step of moving the adhesive that has become the mass to a predetermined position,
After the glued adhesive is moved to a predetermined position, a step of placing a second component on the glued adhesive and curing the adhesive is performed. The adhesion method by the adhesive agent in any one of Claim 1 to 4. The adhesive is cured by irradiating with ultraviolet rays,
The method for bonding with an adhesive according to any one of claims 1 to 5, wherein the step of curing the adhesive includes a step of irradiating the adhesive with the ultraviolet rays.

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