JP2016115694A - Mounting structure of optical module and manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem in which, in a manufacturing step of an optical module, when a component is joined onto a substrate, a deviation in an in-plane direction is generated and a position of a product in the in-plane direction is inaccurate.SOLUTION: In an optical module including: a substrate; a pedestal joined to the substrate; a joint material joined to the substrate; and a component, being in contact with the pedestal, joined to the joint material. The pedestal includes a structure that helps to prevent the component from being deviated in an in-plane direction roughly parallel to a surface of the substrate on which the pedestal is formed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an optical module and a method for manufacturing the same, and more particularly to an optical module that performs photoelectric signal conversion by combining a semiconductor element for optical communication, an optical waveguide substrate, and the like, and a method for manufacturing the same.

  With the recent development of high-speed technology for devices such as LSI, the speed limit of electrical communication methods has become a problem. For this reason, research and development of optical communication, optical information processing, and the like are underway as an alternative to electrical communication methods. An optical module is a module composed of component parts such as an optical communication semiconductor element for converting an optical signal and an electric signal and an optical waveguide substrate having an optical waveguide as a transmission path of the optical signal. Is a functional component that accepts inputs, converts them to each other, and outputs them.

  Patent Documents 1 and 2 show examples of manufacturing methods for assembling such optical module element parts.

  The following steps are described in the method of manufacturing an optical module described in Patent Document 1. That is, when an optical element is mounted on a substrate using solder, a protrusion having a predetermined height is provided on the mounting surface side of the substrate. Then, after the position of the optical element in the in-plane direction parallel to the mounting surface of the substrate (hereinafter referred to as “in-plane direction”) is determined, the bonding solder is heated. As a result, when the solder melts and the position of the optical element comes into close contact with the direction perpendicular to the mounting surface of the substrate (hereinafter referred to as the “height direction”), the mounting surface of the optical device and the protrusions of the substrate Hits.

  Patent Document 2 discloses a method for mounting an optical element in which an optical element chip is pressed against a solder bump formed on a substrate on which a positioning table is formed, and then the solder is heated to melt the solder. . By melting the solder, the optical element chip is pressed against the positioning table, and the distance between the substrate and the optical element chip is set.

JP-A-6-120225 Japanese Patent Application Laid-Open No. 7-235666

  However, on the other hand, in recent years, there has been a demand for making it possible to cope with an increase in communication speed exceeding 25 Gbps. Therefore, for the purpose of reducing the capacitance existing in the electric circuit pattern, for example, to apply an optical element having a small area such as a light receiving and emitting region of the optical element of less than φ10 μm, for miniaturization and cost reduction, For example, application of a silicon waveguide substrate having an optical waveguide with a small diameter of φ2 μm has been studied.

  In addition, development of a hybrid optical module in which a plurality of optical elements having different functions such as laser light oscillation and modulation, optical path switching, and the like are combined is also progressing. As positioning accuracy for obtaining mutual optical coupling of the plurality of optical elements, for example, ± 0.1 μm or less, which is extremely strict accuracy compared to the conventional art, is required.

  However, in the optical module described in Patent Document 1, the position in the in-plane direction of the optical element determined before the solder melting is due to the surface tension of the solder and the difference in thermal expansion of the component parts when the solder melts. For example, there is a problem that the thickness changes by 0.5 μm or more. Moreover, since the solder after joining is in the shape of a drum whose center is narrowed, there is also a problem that the joining strength is inferior.

  Further, the optical module described in Patent Document 2 is positioned in the in-plane direction because the optical element chip hits a bump formed on the substrate before the positioning table when the optical element chip is pressed onto the substrate. There was a problem in ensuring accuracy.

  That is, in both of the manufacturing methods described in Patent Documents 1 and 2, when joining the component parts onto the substrate, the joining material melts or deforms to contact and join the electrodes on the substrate, and the component parts and the substrate In the process in which and are structurally connected, the optical element may be displaced in the in-plane direction, and there has been a problem in positional accuracy in the in-plane direction.

  An object of the present invention is to provide an optical module capable of suppressing a positional shift in the in-plane direction of a component when a bonding material is melted or deformed in a process of bonding the component on a substrate, and also ensuring a bonding strength. It is to provide a manufacturing method.

  A base, a base formed on the base, a bonding material bonded to the base, and a component that contacts the base and is bonded to the bonding material. Further, the pedestal includes a structure in which the component is less likely to be displaced in an in-plane direction substantially parallel to a surface of the base on which the pedestal is formed.

  In the optical module of the present invention, the position of the component in the in-plane direction with respect to the base body hardly changes, and the positional accuracy of the component in the in-plane direction of the product is improved. Further, since the height of the component relative to the base is ensured by installing the component on the pedestal, the accuracy in the height direction can be ensured.

It is a side conceptual diagram showing the structure of the optical module of 1st embodiment. It is a top surface conceptual diagram showing the structure of the optical module of a second embodiment. It is a side surface conceptual diagram of the optical module of 2nd embodiment. It is a top surface conceptual diagram showing the base in the optical module of 2nd embodiment. FIG. 4 is a partial enlarged conceptual diagram showing an enlarged portion shown in FIG. 3. It is a side surface conceptual diagram showing the variation of the optical module of 2nd embodiment. It is a conceptual diagram showing the manufacturing process of the optical module of 2nd embodiment. It is a conceptual diagram showing the manufacturing process of the base in which the hollow was provided in the upper part in the optical module of 2nd embodiment. It is explanatory drawing showing a mode that a base is formed in each process shown in FIG. It is a side surface conceptual diagram showing the structure of the optical module of 3rd embodiment. It is the partial expansion conceptual diagram of the expansion part shown in FIG. It is the conceptual diagram which showed the example of the resin pattern provided in the base of the optical module of 3rd embodiment. It is a conceptual diagram showing the 1st example of the manufacturing process of the optical module of 3rd embodiment. It is a conceptual diagram showing the 2nd example of the manufacturing process of the optical module of 3rd embodiment. It is a conceptual diagram showing the 3rd example of the manufacturing process of the optical module of 3rd embodiment. It is a side surface conceptual diagram showing the structure of the upper part vicinity of the base in the optical module of 4th embodiment. It is the conceptual diagram which showed the example of the resin pattern provided in the base of the optical module of 4th embodiment. It is a conceptual diagram showing the manufacturing process of the optical module of 4th embodiment. It is a side surface conceptual diagram showing the structure near the upper part of the base in the optical module of 5th embodiment. It is a conceptual diagram showing the manufacturing process of the optical module of 5th embodiment. It is a top surface conceptual diagram showing the optical module of 6th embodiment. It is a conceptual diagram showing the manufacturing process of the optical module of 6th embodiment.

Hereinafter, modes for carrying out the present invention will be described.
[First embodiment]
The first embodiment is an embodiment of the minimum optical module of the present invention.
[Structure of optical module of this embodiment]
FIG. 1 is a conceptual side view showing the structure of the optical module of the first embodiment. FIG. 2 is a conceptual diagram assuming a case where the optical module is viewed from the in-plane direction.

  The optical module of this embodiment includes a base 110, a pedestal 210, a component 2410, and a bonding material 810.

  The pedestal 210 is formed on the base 110.

  The component 2410 is disposed on the base 110 via the base 210 and the bonding material 810. The component 2410 and the base 210 are in contact with each other.

  A structure that prevents the component 2410 from shifting in the in-plane direction is provided at or near the portion of the base 210 that contacts the component 2410.

Here, in this specification, “to make it difficult to shift” by providing a certain structure means that the force required to start shifting is greater than the case where the structure is not provided or the case where the structure is not provided. Similarly, even if the deviation starts, it means at least one of making the deviation immediately settled.
[Effect of this embodiment]
In the optical module of the present invention, since the pedestal provided on the base is provided with a structure that makes it difficult to shift the component installed on the base in the in-plane direction, the position of the component in the in-plane direction with respect to the base changes. This increases the positional accuracy in the in-plane direction of the part in the product. Further, since the height of the component relative to the base is ensured by installing the component on the pedestal, the accuracy in the height direction can be ensured.
[Second Embodiment]
The second embodiment is an embodiment of an optical module in which the structure of the pedestal that makes it difficult to shift the optical element is a step due to a recess provided in the pedestal.
[Structure of optical module of this embodiment]
FIG. 2 is a conceptual top view showing the structure of the optical module of the second embodiment, and FIG. 3 is a conceptual side view showing the optical module. FIG. 3 is a conceptual diagram assuming that the optical module of the present embodiment is viewed in the direction of the arrow 920 illustrated in FIG.

  The optical module of this embodiment includes a base 120, bases 221 to 226, base electrodes 321 to 324, bonding materials 821 to 824, and an optical element 420.

  The optical element 420 includes element electrodes 521 to 524, a light emitting / receiving unit 720, and an insulating film 620.

  The bases 221 to 226 and the base electrodes 321 to 324 are formed on the base 120.

  The optical element 420 is disposed on the base 120 via bases 221 to 226 and bonding materials 821 to 824 formed on the base electrodes 321 to 324. The optical element 420 and the bases 221 to 226 are in contact with each other. The element electrodes 521 to 524 are in contact with the bonding material 810.

  The light emitting / receiving unit 720 is a light receiving unit or a light emitting unit, and is exposed to the end face 1820 in the light incident / incident direction. Thereby, when the light emitting / receiving unit 720 is a light emitting unit, light is emitted from the portion exposed to the end surface 1820 in the light incident / incident direction of the light emitting / receiving unit 720. When the light emitting / receiving unit 720 is a light receiving unit, light is received from the same part. The light emitting / receiving unit 720 is, for example, a laser beam emitting unit, a light receiving unit of a light receiving element, or an end of an optical waveguide.

  In the case where the light emitting / receiving unit 720 is a light emitting unit, power is supplied from the base 120 through a laminated body of the base electrode 321 / bonding material 821 / element electrode 521 or the like. Thereby, the light emitting / receiving unit 720 emits light.

  In the case where the light emitting / receiving unit 720 is a light receiving unit, the power received and converted is taken out through a laminated body of the base electrode 321 / bonding material 821 / element electrode 521 or the like.

  Steps are provided in the portions of the bases 221 to 226 that are in contact with the optical element 420 or in the vicinity thereof as a structure that makes the optical element 420 difficult to shift.

  4 is a top conceptual view of the bases 221 and 223 shown in FIG. 2, and FIG. 5 is an enlarged conceptual view of the enlarged portion 1020 shown in FIG. In the figure, the hatched portions of the bases 221 and 223 are lower than the portions not displaying the hatched lines. This lowered portion is hereinafter referred to as “recess”. The step between the indented portion and the non-displayed portion is a stepped portion.

  Here, referring to FIG. 5, there is a slight margin 1621 between the stepped portion 1421 due to the depression 1121 and the optical element end portion 1521. In other words, the stepped portion 1421 is provided in the vicinity of the contact portion 1721 where the optical element 420 contacts the pedestal 221. For this reason, when the optical element 420 is disposed on the substrate in the manufacturing process of the present optical module, the optical element can be accommodated in the recess. Further, when the optical element is shifted in the A direction shown in the figure, the optical element end portion 1521 hits the stepped portion 1421, so that the optical element is hardly displaced further. That is, the step portion 1421 has a structure that makes the optical element 420 difficult to shift.

  Here, the case where the number of pedestals is six is shown, but the number of pedestals may be any number of three or more. However, the position along the outer periphery including the four corners of the optical element 420 is more preferable. This is because, when arranged at the four corners, it is possible to make it difficult to shift the optical element 420 in all in-plane directions by arranging the steps of the depressions along the corners of the corners.

  Next, candidates for materials and manufacturing methods that can be used for each component of the optical module will be described.

  As the base 120, for example, a silicon substrate can be used.

  For the bases 221 to 226, for example, a material mainly made of quartz can be used. The material mainly composed of quartz is formed, for example, by forming a resist pattern on the substrate 120 for use in a semiconductor process, and forming the resist pattern thereon by sputtering, vapor deposition, CVD (Chemical Vapor Deposition), etc. It can be formed by a lift-off process that removes the entire quartz film formed thereon. Alternatively, a film may be formed on the substrate 120, a resist pattern may be formed, and a portion where the resist pattern is not formed may be cut by milling or etching.

  The base electrodes 321 to 324 can be formed using titanium, platinum, gold, a combination thereof, or the like, and can be formed by sputtering, vapor deposition, or the like.

  As the optical element 420, an element having a function of light emission or light reception using a compound semiconductor such as InP or GaAs or Si can be used.

  The element electrodes 521 to 524 can be formed using titanium, platinum, gold, a combination thereof, or the like, and can be formed by sputtering, vapor deposition, or the like. .

  The insulating film 620 can be formed using silicon nitride or the like, and can be formed by sputtering or the like.

  As the bonding materials 821 to 824, for example, a solder material or a thermoplastic conductive resin material that is melted or deformed by heating can be used. In particular, the bonding materials 821 to 824 are more preferably a high melting point solder or a heat resistant conductive resin, for example, having heat resistance capable of withstanding heating during mounting in a subsequent process. When the bonding materials 821 to 824 are solders, for example, a method of laminating solder with a uniform and highly accurate thickness dimension, which is well known in the semiconductor process, or a part of a planar shape while heating and melting the solder. It is possible to use a method in which the shape is corrected using a tool and cooled and cured while maintaining the shape. In the case where the bonding materials 821 to 824 are thermoplastic conductive resins, for example, the bonding material can be formed by pressurizing the optical element 420 against the base 120 using a tool partially having a planar shape.

FIG. 6 is a side conceptual view showing a variation structure of the optical module of the second embodiment. The difference from the structure shown in FIG. 2 is that the shapes of the bonding materials 825 and 826 are rounded. As described above, solder can be typically used as the bonding materials 825 and 826. When solder is used as the bonding material, a heat treatment process is performed during the production to heat the optical module to a temperature equal to or higher than the melting point of the solder in order to improve the bonding condition between the solder and the base electrodes 325 and 326. It is effective. This process may melt the solder and form a rounded shape. This variation is an example of the optical module of this embodiment in such a case.
[Manufacturing process of optical module of this embodiment]
Next, the manufacturing process of the optical module of the present embodiment will be described.

  FIG. 7 is a conceptual diagram showing the manufacturing process of the optical module of the second embodiment. In the structure shown in FIG. 6, the case where solder is used for the bonding materials 825 and 826 is shown as an example.

  7A is a flowchart showing a manufacturing process, FIG. 7B is a conceptual side view of an optical module in the middle of manufacturing in each process shown in FIG. 7A, and FIG. 7C is an enlarged portion 1021 shown in FIG. 7B. FIG.

  First, the optical element 421 is prepared (S201). The optical element 421 may be manufactured or purchased.

  Next, the bonding material 825 and the bonding material 826 are formed on the device electrode 525 and the device electrode 526 in the optical element 421 (S202). This formation can be performed, for example, by placing a solder chip as a bonding material on the element electrode, welding the element electrode and the solder by heating, and flattening the upper surface of the solder.

  Next, substrate electrodes 325 and 326 are formed on the substrate 121 (S203).

  Further, pedestals 227 and 228 having depressions formed in the upper part are formed on the base 121 (S204). A specific example of the method for forming the recess will be described later.

  Next, the base 121 is installed at a predetermined position (S205).

  Further, the optical element 421 is positioned at a position facing the base 121 (S206).

  Then, the optical element 421 is pressed against the bases 227 and 228 and other bases (S207). When the optical element is a compound semiconductor such as InP or GaAs, the pressing force at the time of pressing is preferably about 5 gf. With this level of pressure, the pedestals 227 and 228 and the other pedestals or the optical element 421 are damaged by the force applied to the narrow areas where the pedestals 227 and 228 and the other pedestals are in close contact with the optical element 421. This is because it is large enough to be pressed.

  Next, the entire optical module produced by the above process is heated (S208).

  By heating, the solder that is the bonding material 825 is welded to the base electrode 325 and the solder that is the bonding material 826 is welded to the base electrode 326, respectively, and the optical module is manufactured. In this state, the bonding material 825 is deformed and rounded, and the bonding material 826 is deformed and rounded.

  In the above manufacturing process, the order of steps S201 to S204 can be arbitrarily changed under the condition that the process of S202 is after the process of S201.

  As shown in (c), it is desirable to provide a gap 2320 between 326 and 825. When the optical element is pressed against the pedestal in step S207, the optical element 421 contacts the pedestals 227 and 228 in a state where the bonding material 825 does not contact the base electrode 326 and the bonding material 826 does not contact the base electrode 325, respectively. Thereby, the structure of the bases 227 and 228 that make the optical element 421 difficult to shift makes it difficult for the optical element 421 to be displaced in the in-plane direction and improves the positional accuracy of the completed optical element 421 in the in-plane direction. It is.

  When the size of the gap 2320 was set to about 0.5 to 1 micron, bonding characteristics including good bonding strength were obtained by heating in S208. However, this is a case where the dimensions of the base electrode 325 and the element electrode 525 are 200 micron squares, and the gap between the upper surface of the base electrode 326 and the lower surface of the insulating film 621 of the optical element 421 is 5 microns. In this case, the volume of the solder which is the bonding material 827 is preferably about 255,000 cubic microns.

  Next, an example of a manufacturing process of the pedestal 227 provided with a depression at the top will be described.

  FIG. 8 is a conceptual diagram showing a manufacturing process of a pedestal provided with a recess in the upper part, and FIG. 9 is an explanatory diagram showing how the pedestal is formed in each process of FIG.

  First, a resist pattern 1921 is formed on the base 121. The resist pattern 1921 can be formed by a method using resist coating, mask placement, light irradiation, and partial dissolution and removal of the resist, which are generally used in a semiconductor process.

  Next, a base material 2020 is formed on the base 121 and the resist pattern 1921. For this formation, sputtering, vapor deposition, CVD, or the like can be used.

  Then, the resist pattern 1921 is removed by dipping in a solvent or the like that dissolves the resist pattern 1921. By this removal, the base material 2020 formed on the resist pattern 1921 is removed together with the resist pattern 1921.

  Further, a resist pattern 1922 is formed.

  Next, the base material 2020 is shaved by milling to reduce the thickness of the base material where the resist pattern 1922 is not formed.

  Then, the resist pattern 1922 is removed by applying a solvent or the like that dissolves the resist pattern 1922.

  Through these steps, a base 227 provided with the recess 1124 and the stepped portion 1422 is formed on the base 121.

The manufacturing process of the pedestal 228 is the same.
[Effect of this embodiment]
First, the optical module of this embodiment has the same effect as the optical module of the first embodiment.

In addition, when the optical module of the present embodiment is compared with the optical modules of the third embodiment and the fourth embodiment described below, the optical module of the present embodiment is made of resin in the optical module in the process of heating the optical module. Since there is almost no solvent and its solvent, there are few problems caused by contamination by the resin and its solvent.
[Third embodiment]
In the third embodiment, the structure of the pedestal that makes it difficult to shift the optical element is not a step due to the depression provided in the pedestal described in the second embodiment, but a step due to the resin pattern provided in the pedestal.
[Structure of optical module of this embodiment]
FIG. 10 is a conceptual side view showing the structure of the optical module of the third embodiment. Since the top view conceptual diagram is the same as FIG. 2 of the second embodiment, it is omitted.

  The optical module of this embodiment includes a base 130, pedestals 231 and 232, base electrodes 331 and 332, bonding materials 831 and 832, and an optical element 430.

  The optical element 430 includes element electrodes 531 and 532, a light emitting / receiving unit 730, and an insulating film 630.

  The base 231 includes a resin pattern 1231, and the base 232 includes a resin pattern 1232. Only the point provided with the resin patterns 1231 and 1232 is different from the optical module of the second embodiment. Therefore, description of other points will be omitted, and a description focusing on this point will be given below.

  FIG. 11 is a partial enlarged conceptual view of the enlarged portion 1030 shown in FIG.

  A resin pattern 1231 is formed on the pedestal 231, and an end portion thereof is a stepped portion 1430. There may be a slight margin 1630 between the stepped portion 1430 and the optical element end portion 1531. However, in the case of this embodiment, when the resin of the resin pattern is a soft material, the pressure when pressing the optical element 430 against the pedestal 231 even if the resin is slightly below the optical element 430. In some cases, it does not become a problem due to deformation. In this case, the margin 1630 may not exist. In the drawing, the step portion 1430 is provided at or near the contact portion 1730 where the optical element 430 contacts the pedestal 231. In addition, when the optical element is shifted in the horizontal direction in the figure, the optical element end portion 1531 hits the stepped portion 1430 so that the optical element is not easily displaced further. That is, the resin pattern 1231 and the stepped portion 1430 have a structure that makes the optical element 430 difficult to shift.

  The description of the resin pattern 1232 formed on the base 232 is the same.

  The resin pattern used in the present embodiment may be any pattern as long as the optical element is not easily displaced by the stepped portion.

  FIG. 12 is a diagram showing an example of a resin pattern provided on the pedestal. The pedestal is shown as seen from above.

  The resin pattern 1233 shown in (a) is formed on substantially the entire surface of the base 233 where the optical element 431 is not disposed. The step formed by this pattern makes the optical element 431 difficult to shift in the A direction and the B direction shown in the figure.

  The resin pattern 1234 shown in (b) is one pattern formed on a part of the region on the base 234 where the optical element 432 is not disposed. The step formed by this pattern makes the optical element 432 difficult to shift in the A direction and the B direction shown in FIG.

  The resin pattern 1235 shown in (c) is three patterns formed on part of the region on the pedestal 235 where the optical element 433 is not disposed. The steps formed by these patterns make the optical element 433 difficult to shift in the A direction and the B direction shown in FIG.

  The resin pattern 1236 shown in (c) is two patterns formed in a part of the region on the base 236 where the optical element 434 is not arranged. The step formed by this pattern makes the optical element 434 difficult to shift in the A direction and the B direction shown in FIG.

  There may be various variations other than these in the resin pattern.

As the resin patterns 1231 and 1232, various organic materials such as an organic material that is deformed by heating or pressurizing such as polyimide can be used.
[Manufacturing process of optical module of this embodiment]
Examples of conceptual diagrams of the manufacturing process of the optical module of the present embodiment are shown in FIGS. As shown in FIG. 13, a resin pattern may first be formed on the pedestal (S334), and then the optical element may be pressed against the pedestal (S338). Alternatively, as shown in FIG. 14, the resin element may be formed (S358) after the optical element is first pressed against the pedestal (S357). Further, as shown in FIG. 15, the resin pattern may be formed (S379) after heating the optical module before heating (S378).

The resin pattern can be formed by placing a resin sheet cut into a pattern on the pedestal or pressing it after placement. Alternatively, the resin may be dissolved in a solvent, applied in a predetermined shape, and the solvent may be evaporated after application. Alternatively, it is possible to use a resin that is altered by light, as is commonly used in semiconductor processes, and to form such a resin by coating, setting a mask, irradiating light, or partially dissolving the resin using a solvent. Good.
[Effect of this embodiment]
The optical module of this embodiment has the same effect as the optical module of the first embodiment. When compared with the optical module of the second embodiment, the optical module of this embodiment is easier to manufacture because the indentations and steps on the pedestal are formed of resin.

[Fourth embodiment]
The fourth embodiment is an embodiment of an optical module in which the structure of the pedestal that makes it difficult to shift the optical element is a resin provided in the lower part of the region where the optical element on the pedestal is arranged.
[Structure of optical module of this embodiment]
In the optical module of this embodiment, the description of the components other than the pedestal upper part is the same as the description of the optical module of the second embodiment, so the description thereof is omitted here, and only the structure near the pedestal upper part is described. explain.

  FIG. 16 is a conceptual side view showing the structure near the upper portion of the pedestal in the optical module of the fourth embodiment.

  A resin pattern 1240 is formed on the pedestal 240. A portion in the vicinity of the end portion 1541 of the optical element 440 is disposed on the pedestal 240 via the resin pattern 1240. A lower portion of the insulating layer 640 of the optical element 440 is in contact with the resin pattern 1240 to form a contact portion 1740.

  It is known that a resin generally tends to generate a large frictional force with a material placed on the resin as compared with quartz or the like. This is especially true when a highly viscous material is used as the resin.

  For this reason, due to the above structure, a large frictional force is generated in the contact portion 1740 and it is difficult to shift in the in-plane direction.

  That is, the resin pattern 1240 is a structure that is provided at or near the contact portion 1740 where the pedestal 240 and the optical element 440 are in contact with each other, and makes the optical element 440 difficult to shift in the in-plane direction.

  FIG. 17 is a diagram showing an example of a resin pattern provided on the pedestal. This figure shows the pedestal as viewed from above.

  The resin pattern 1243 shown in (a) is formed on the entire surface of the pedestal 243, and the resin pattern 2141 is also formed below the optical element 441. The resin pattern 1243 makes the optical element 441 difficult to shift in the in-plane direction.

  The resin pattern 1244 shown in (b) is one pattern formed in part on the base 244. A resin pattern 2142 is formed below the optical element 442. The resin pattern 1244 makes the optical element 442 difficult to shift in the in-plane direction.

  The resin pattern 1245 shown in (c) is three patterns formed on the pedestal 245. A resin pattern 2143 is formed below the optical element 443. The resin pattern 1245 makes the optical element 443 difficult to shift in the in-plane direction.

  The resin pattern 1246 shown in (d) is a single pattern formed on the pedestal 246. A resin pattern 1246 is formed only under the optical element 444. The resin pattern 1246 makes the optical element 444 difficult to shift in the in-plane direction.

The resin pattern can be formed by placing or pressing a resin sheet cut into a pattern on a pedestal. Alternatively, the resin may be dissolved in a solvent, applied, and the solvent may be evaporated after application.
[Manufacturing process of optical module of this embodiment]
FIG. 18 is a conceptual diagram showing manufacturing steps of the optical module of the fourth embodiment. In the manufacture of the optical module of this embodiment, after forming a resin pattern on the pedestal (S404), the optical element is pressed against the pedestal (S408). The other steps are the same as those in the second embodiment, and a description thereof will be omitted.
[Effect of this embodiment]
First, the optical module of this embodiment has the same effect as the optical module of the third embodiment. In addition, the optical module of the present embodiment has an effect of making the optical element difficult to slip in the in-plane direction if the resin pattern provided on the pedestal is below the optical element. Therefore, since the positional accuracy of the resin pattern in the in-plane direction is not required, the manufacture is easier than the optical module of the third embodiment.

[Fifth embodiment]
The fifth embodiment is an embodiment of an optical module in which the structure of the pedestal that makes it difficult to shift the optical element is a mirror surface provided on the upper surface of the pedestal.

  Since the components other than the upper surface of the pedestal are the same as those of the optical module of the second embodiment, the description thereof will be omitted, and only the structure near the upper surface of the pedestal will be described here.

  FIG. 19 is a conceptual side view showing the structure near the top of the pedestal in the optical module of the fifth embodiment.

  A mirror surface 2260 is formed on the upper surface of the base 250. In the figure, the mirror surface is indicated by a thick line, but this is intended to emphasize that it is a mirror surface and does not have a thickness.

  On the mirror surface 2260, a portion in the vicinity of the end portion 1551 of the optical element 450 is disposed. A lower portion of the insulating layer 650 of the optical element 450 is in contact with the mirror surface 2260 to form a contact portion 1750.

  A mirror surface having the same smoothness as the mirror surface 2260 is also formed on the surface of the insulating layer 650 of the optical element 450. In the case where the optical element 450 is disposed on the mirror surface 2260, the insulating layer 650 surface and the mirror surface 2260 are brought into close contact with each other, thereby generating a binding force due to static electricity. The coupling force due to the static electricity makes it difficult to shift the optical element 420 in the in-plane direction.

The mirror surface 2260 can be manufactured by, for example, performing polishing using a fine abrasive on the upper surface of the base 250 before the mirror surface 2260 is provided.
[Manufacturing process of optical module of this embodiment]
FIG. 20 is a conceptual diagram showing the manufacturing process of the optical module of the fifth embodiment. After forming the pedestal (S504), the upper surface of the pedestal is polished (S505). Since other manufacturing processes are the same as those of the optical module according to the second embodiment, the description thereof is omitted.
[Effect of this embodiment]
First, the optical module of this embodiment has the same effect as the optical module of the second embodiment. The optical module of the present embodiment can be further restrained by a strong restraining force due to static electricity at a position on the base on which the optical element is installed. Therefore, when the positioning accuracy of the optical element on the substrate can be sufficiently secured, the positional accuracy in the in-plane direction of the optical element can be secured with higher accuracy than the optical module of the second embodiment. .
[Sixth embodiment]
The sixth embodiment is an embodiment of an optical module in which a plurality of optical elements are arranged on a single substrate. The number of optical elements arranged on one substrate is arbitrary, but here, an example in which the number is two, one of which is a light emitting element and the other is a light receiving element will be described.
[Structure of optical module of this embodiment]
FIG. 21 is a top conceptual view showing the optical module of the sixth embodiment. Since the same concept as that described in the second to fifth embodiments described so far can be applied to the side view conceptual diagram, it is omitted here.

  The optical module of the present embodiment includes a base 160, bases 261 to 270, base electrodes 361 to 365, bonding materials 861 to 865, a first optical element 461, and a second optical element 462.

  The first optical element 461 includes element electrodes 561 to 564 and a light emitting unit 761.

  The second optical element 462 includes an element electrode 565 and a light receiving unit 762.

The first optical element 461 and the second optical element 462 are formed on the same substrate 160. The light emitting unit 761 emits light but does not receive light, and the light receiving unit 762 receives light but does not emit light. Since the description of the other components is the same as the description of the optical modules of the second to fourth embodiments, the description thereof is omitted here.
[Manufacturing process of optical module of this embodiment]
FIG. 22 is a conceptual diagram showing a manufacturing process of the optical module of the sixth embodiment.

  First, the first optical element 461 and the second optical element 462 are prepared (S601). The first optical element 461 and the second optical element 462 may be manufactured or obtained by purchase or the like.

  Next, the bonding material 827 and the bonding material 827 are formed on the device electrode 525 and the device electrode 526 in the optical element 421 (S602). This formation is performed, for example, by placing a solder chip, which is a bonding material, on the element electrode, welding the element electrode and the solder by heating, and flattening the upper surface of the solder.

  Next, substrate electrodes 361 to 365 are formed on the substrate 160 (S602). The base electrodes 361 to 365 can be formed by, for example, a method generally used in a semiconductor process.

  Further, pedestals 261 to 270 are formed on the base 160 (S603). On the upper surface of at least a part of the pedestals 261 to 270, the structure that makes it difficult to shift the optical element in the in-plane direction as described in the second to fifth embodiments is provided.

  Then, bonding materials 861 to 865 are formed on the device electrodes 561 to 565 (S604).

  Next, the base 160 is installed at a predetermined position (S605).

  Further, the first optical element 461 and the second optical element 462 are positioned on the base 160 (S606).

  Then, the first optical element 461 and the second optical element 462 are pressed against the bases 261 to 270 (S607).

  Next, the entire optical module produced by the above process is heated (S208).

  By heating, the solder as the bonding material is bonded to the corresponding base electrode, and the optical module is manufactured.

  The order of steps S601 to S603 can be arbitrarily changed.

In an optical module that combines an optical element including a light emitting unit and an optical element including a light receiving unit to make light from the light emitting unit enter the light receiving unit, an allowable range of deviation between the optical axis of the light emitting unit and the optical axis of the light receiving unit Is 0.1 μm or less. By applying the optical module of the present embodiment, it is possible to realize a small deviation of the optical axis included in such an allowable range.
[Effect of this embodiment]
In this embodiment, the optical element provided on the pedestal applied to the optical module is used depending on which structure of the optical module of the second to fifth embodiments is used as a structure that makes it difficult to shift in the in-plane direction. The same effect as the optical module of the embodiment is achieved.

  In addition, due to the structure used, the deviation of the optical axes of the plurality of optical elements can be kept to a small value within the allowable range.

  Although the present invention has been described with reference to the preferred embodiments, the present invention is not necessarily limited to the above embodiments, and various modifications can be made within the scope of the technical idea.

Moreover, although a part or all of said embodiment may be described also as the following additional remarks, it is not restricted to the following.
(Appendix 1)
A substrate;
A pedestal formed on the substrate;
A bonding material bonded to the substrate;
A component in contact with the pedestal and joined with the joining material;
An optical module, wherein the pedestal includes a structure in which the component is not easily displaced in an in-plane direction substantially parallel to a surface of the base on which the pedestal is formed.
(Appendix 2)
The optical module according to appendix 1, wherein the structure is provided in a portion where the base and the component are in contact with each other or in the vicinity thereof.
(Appendix 3)
The optical module according to appendix 1 or 2, wherein the component is an optical element.
(Appendix 4)
The light described in any one of appendices 1 to 3, further comprising a first electrode at a portion where the bonding material is bonded to the base, and a second electrode at a portion where the bonding material is bonded to the component. module.
(Appendix 5)
The optical module according to any one of supplementary notes 1 to 4, wherein the structure is a step of the pedestal in contact with the component and a step of the pedestal provided in the vicinity thereof.
(Appendix 6)
The optical module according to any one of supplementary notes 1 to 5, wherein the step is formed from a resin pattern provided on the pedestal.
(Appendix 7)
The optical module according to any one of appendices 1 to 4, wherein the structure is a mirror surface structure provided on a surface of the pedestal.
(Appendix 8)
8. The optical module according to any one of appendices 1 to 7, wherein the bonding material is solder.
(Appendix 9)
Forming a pedestal on the substrate;
Forming a structure that makes the component that contacts the pedestal difficult to shift in an in-plane direction substantially parallel to a surface of the base on which the pedestal is formed;
Forming a bonding material between the base and the component;
Contacting the pedestal and the component;
Contacting the bonding material and the substrate;
Contacting the bonding material and the component;
An optical module manufacturing method including:
(Appendix 10)
The method for manufacturing an optical module according to appendix 9, wherein the component is an optical element.
(Appendix 11)
The method for manufacturing an optical module according to appendix 10, further comprising a step of bonding the base body and the bonding material.
(Appendix 12)
Forming a first electrode on the substrate;
The method for manufacturing an optical module according to appendix 11, wherein the bonding between the base and the bonding material is a bonding between the first electrode and the bonding material.
(Appendix 13)
The method of manufacturing an optical module according to appendix 11 or 12, wherein the bonding between the base and the bonding material is a bonding in which the base and the bonding material are bonded by heating.
(Appendix 14)
The optical module according to appendix 13, wherein the bonding for bonding the base body and the bonding material by heating is a bonding for bonding the base body and the bonding material that were not in contact before the heating by heating. Manufacturing method.
(Appendix 15)
15. The method of manufacturing an optical module according to any one of appendices 11 to 14, further including a step of bonding the bonding material and a second electrode provided in the component.
(Appendix 16)
The method for manufacturing an optical module according to appendix 15, wherein the joining for joining the joining material and the second electrode is joining for joining the joining material and the second electrode by heating.
(Appendix 17)
The method for manufacturing an optical module according to any one of appendices 9 to 16, wherein the bonding material is solder.

110, 120, 121, 130, 160 substrate 210, 221, 222, 223, 224, 225, 226, 227, 228, 231, 232, 233, 234, 235, 236, 241, 242, 243, 244, 245, 246, 261, 262, 263, 264, 265, 266, 267, 268, 269, 270 Base 321, 322, 323, 324, 325, 326, 331, 332, 361, 362, 363, 364, 365 Base electrode 420 , 421, 430, 431, 432, 433, 434, 440, 461, 462 Optical elements 521, 522, 523, 524, 525, 526, 531, 532, 561, 562, 563, 564, 565 Element electrodes 620, 621 , 630, 640 Insulating film 720, 721, 730, 7 0 Light emitting / receiving unit 761 Light emitting unit 762 Light receiving unit 810, 821, 822, 823, 824, 825, 826, 831, 832, 861, 862, 863, 864, 865 Bonding material 920 Arrow 1020, 1021, 1030 Enlarged portion 1121, 1123, 1124 Indentation 1231, 1232, 1233, 1234, 1235, 1236, 1240, 1243, 1244, 1245, 1246 Resin pattern 1421, 1422, 1430 Stepped portion 1521, 1531, 1541 Optical element end 1621, 1630 Margin 1721, 1730 , 1740, 1750 Contact portion 1820 End face in incident direction 1921, 1922 Resist pattern 2020 Base material 2141, 2142, 2143 Resin pattern under optical element 2260 Mirror surface 2320 Gap 2 10 parts

Claims (10)

A substrate;
A pedestal formed on the substrate;
A bonding material bonded to the substrate;
A component in contact with the pedestal and joined with the joining material;
An optical module, wherein the pedestal includes a structure in which the component is not easily displaced in an in-plane direction substantially parallel to a surface of the base on which the pedestal is formed.   The optical module according to claim 1, wherein the structure is provided in a portion where the base and the component are in contact with each other or in the vicinity thereof.   The optical module according to claim 1, wherein the component is an optical element.   4. The device according to claim 1, further comprising a first electrode at a portion where the bonding material is bonded to a base, and a second electrode at a portion where the bonding material is bonded to a component. Optical module.   5. The optical module according to claim 1, wherein the structure is a portion of the pedestal in contact with the component and a step of the pedestal provided in the vicinity thereof. 6.   The optical module according to claim 1, wherein the step is formed from a resin pattern provided on the pedestal.   The optical module according to claim 1, wherein the structure is a mirror surface structure provided on a surface of the pedestal. Forming a pedestal on the substrate;
Forming a structure that makes the component that contacts the pedestal difficult to shift in an in-plane direction substantially parallel to a surface of the base on which the pedestal is formed;
Forming a bonding material between the base and the component;
Contacting the pedestal and the component;
Contacting the bonding material and the substrate;
Contacting the bonding material and the component;
An optical module manufacturing method including:   The method of manufacturing an optical module according to claim 8, further comprising a step of bonding the base and the bonding material.   The optical module according to claim 9, wherein the bonding for bonding the base body and the bonding material is a bonding for bonding the base body and the bonding material that were not in contact before the heating by heating. Production method.

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