JP6019497B2 - LED lighting device - Google Patents

LED lighting device Download PDF

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JP6019497B2
JP6019497B2 JP2013141758A JP2013141758A JP6019497B2 JP 6019497 B2 JP6019497 B2 JP 6019497B2 JP 2013141758 A JP2013141758 A JP 2013141758A JP 2013141758 A JP2013141758 A JP 2013141758A JP 6019497 B2 JP6019497 B2 JP 6019497B2
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led light
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JP2015015179A (en
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贄川 潤
潤 贄川
小相澤 久
久 小相澤
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株式会社Smaco技術研究所
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Description

本発明は、LED(発光ダイオード)を用いて形成されるLED照明装置に関するものである。   The present invention relates to an LED lighting device formed using an LED (light emitting diode).

LED光源は、例えば白熱球、蛍光灯、水銀灯、メタルハライドランプ等の従来の照明装置の光源に比べて寿命が長いこともその大きな特徴である。近年、このようなLED光源が注目されるようになってきており、LED光源を用いた様々なLED照明装置が提案されている(例えば、特許文献1〜4、参照)。   The LED light source is also characterized in that it has a long life compared to the light source of conventional lighting devices such as incandescent bulbs, fluorescent lamps, mercury lamps, metal halide lamps, and the like. In recent years, such LED light sources have attracted attention, and various LED illumination devices using LED light sources have been proposed (for example, see Patent Documents 1 to 4).

特開2006−203778号公報JP 2006-203778 A 特開2011−528924号公報JP 2011-528924 A 特開2011−46675号公報JP 2011-46675 A 特表2012−502432号公報Special table 2012-502432 gazette

しかしながら、LED光源は発生する熱量が大きく、また、LED光源の電源で発生する熱量も大きいため、この熱によりLED光源そのものや電源の温度が上昇し、その結果、例えば内部の電子デバイス類に劣化を生じ、LED照明装置(LED照明器具)全体の寿命が低下するといった問題があった。また、電源内蔵型のLED照明装置は、電源が故障あるいは寿命となった場合にもLED照明装置が使用不可となってしまい、全体を交換することを余儀なくされる場合が多く、その点も寿命の低下を招く要因となっている。   However, since the amount of heat generated by the LED light source is large and the amount of heat generated by the power source of the LED light source is also large, the temperature of the LED light source itself and the power source rises due to this heat, and as a result, for example, the internal electronic devices deteriorate. And the life of the entire LED lighting device (LED lighting fixture) is reduced. In addition, the LED lighting device with a built-in power source often becomes unusable even when the power source fails or has reached the end of its life, and it is often necessary to replace the entire LED lighting device. It is a factor that causes a decline in

本発明は、前記課題を解決するために成されたものであり、その目的は、電源を内蔵してもその電源の熱により寿命低下等の影響が生じにくく、できるだけ軽量化が可能なLED照明装置を提供することにある。   The present invention has been made in order to solve the above-mentioned problems. The purpose of the present invention is to provide an LED illumination that can be reduced in weight as much as possible without being affected by a decrease in life due to the heat of the power supply even if the power supply is incorporated. To provide an apparatus.

上記目的を達成するために、本発明は次のような構成をもって課題を解決するための手段としている。すなわち、第1の発明は、貫通穴が形成された基板と、該基板の前記貫通穴を貫通する態様で設けられた筒状部位とを有して該筒状部位は前記基板の両面から突出し、前記基板の片面には複数のLED光源が互いに間隔を介して配設され、該LED光源の配設面と反対側の前記基板面側には前記LED光源からの熱を放熱するためのヒートシンクが前記筒状部位の外周側に設けられ、前記ヒートシンクの基端面が前記基板に熱的に接続されて前記LED光源の熱を放熱する構成と成し、前記筒状部位は筒軸方向の一端側が前記ヒートシンクの先端部よりも先方に突出して該突出した前記筒状部位の側周壁部に通気口が形成され、前記筒状部位の筒軸方向の他端側は前記基板のLED光源配設面よりも先方に突出して該突出先端部には開口が形成されており、前記筒状部位の筒内に前記LED光源の電源が収納可能と成していて、前記筒状部位の前記開口から該筒状部位の筒内に空気が導入されて該筒内を流れて前記通気口から導出されることにより前記電源の冷却が行われ、前記LED光源の熱によって前記基板の温度が上昇すると前記ヒートシンクの外側から該ヒートシンクの基端側に入り込んだ空気が前記筒状部位の外側の壁面側に沿って前記ヒートシンクの先端側に流れて該先端側から外部に導出される構成と成して、前記筒状部位によって前記電源の冷却の空気流と前記LED光源の冷却の空気流とが絶縁されている構成をもって課題を解決するための手段としている。   In order to achieve the above object, the present invention has the following configuration as means for solving the problems. That is, the first invention has a substrate in which a through hole is formed, and a cylindrical portion provided in a manner of penetrating the through hole of the substrate, and the cylindrical portion protrudes from both sides of the substrate. A plurality of LED light sources are disposed on one side of the substrate at intervals, and a heat sink for dissipating heat from the LED light sources on the substrate surface side opposite to the LED light source disposed surface. Is provided on the outer peripheral side of the cylindrical part, and the base end surface of the heat sink is thermally connected to the substrate to dissipate the heat of the LED light source, and the cylindrical part is one end in the cylinder axis direction. The side protrudes further forward than the tip of the heat sink, and a vent is formed in the side peripheral wall of the protruding cylindrical portion, and the other end side of the cylindrical portion in the cylindrical axis direction is provided with the LED light source of the substrate. Projecting forward from the surface, an opening is formed at the projecting tip. The power source of the LED light source can be stored in the cylinder of the cylindrical part, and air is introduced into the cylinder of the cylindrical part from the opening of the cylindrical part. When the temperature of the substrate rises due to the heat of the LED light source, the air that has entered the base end side of the heat sink from the outside of the heat sink is An air flow for cooling the power source and the LED light source are formed by the cylindrical portion and flows to the tip side of the heat sink along the outer wall surface side of the cylindrical portion and led out from the tip side. The cooling airflow is insulated from the cooling airflow as means for solving the problem.

また、第2の発明は、前記第1の発明の構成に加え、前記筒状部位の前記開口が形成されている先端部位は前記基板の前記LED光源が配設されたLED光源配設面から突出して設けられており、そのLED光源配設面からの突出長さをhとして前記基板の外径をDとしたときにh/Dが0.1〜0.5の範囲内であり、前記筒状部位の突出先端部から前記基板の周縁部にかけて形成された透明カバー部材が前記LED光源配設面と間隔を介して該LED光源配設面を覆う態様で設けられていることを特徴とする。 The second invention is, from the addition to the configuration of the first invention, the tip portion where the opening of the tubular portion is formed LED light source disposition surface of the LED light source of the substrate is provided H / D is in the range of 0.1 to 0.5 when h is the protruding length from the LED light source arrangement surface and D is the outer diameter of the substrate, A transparent cover member formed from the projecting tip of the cylindrical portion to the peripheral edge of the substrate is provided in such a manner as to cover the LED light source arrangement surface with a space from the LED light source arrangement surface. To do.

さらに、第3の発明は、前記第1または第2の発明の構成に加え、前記筒状部位は樹脂製の部材により形成されていることを特徴とする。   Further, the third invention is characterized in that, in addition to the configuration of the first or second invention, the cylindrical portion is formed of a resin member.

さらに、第4の発明は、前記第1または第2または第3の発明の構成に加え、前記筒状部位の前記ヒートシンクに囲まれた部位の外周壁には断熱層が設けられていることを特徴とする。 Further, the fourth invention, in addition to the configuration of the first or second or third invention, that the outer peripheral wall of the portion surrounded by the heat sink of the cylindrical portion is the heat insulating layer is provided Features.

さらに、第5の発明は、前記第1乃至第4のいずれか一つの発明の構成に加え、前記筒状部位の前記開口が形成されている先端部位から前記ヒートシンクの先端部にかけて前記筒状部位の外周側に沿って該筒状部位の筒軸方向に空気が通るようにする空気通路が形成されていることを特徴とする。 Further, the fifth invention, the first, in addition to the configuration of the fourth any one invention of the tubular portion from the distal end portion of the opening of the tubular portion is formed to the tip portions of the heat sink An air passage is formed to allow air to pass along the outer peripheral side of the cylindrical portion in the cylinder axis direction of the cylindrical portion.

さらに、第6の発明は、前記筒状部位には前記LED光源の電源が収納されており、該電源の筐体外壁部には放熱フィンが形成されていることを特徴とする。 Further, the sixth invention, the said tubular portion is housed the power source of the LED light source, the housing outer wall of the power source, characterized in that the radiating fins are formed.

さらに、第7の発明は、前記第1乃至第6のいずれか一つの発明の構成に加え、前記筒状部位には前記LED光源の電源が収納されており、該電源にはAC入力ケーブルとDC出力ケーブルが接続されて前記電源の筐体から引き出されており、前記AC入力ケーブルとDC出力ケーブルの端部にはそれぞれ防水コネクタが接続されていることを特徴とする。 Furthermore, a seventh aspect of the present invention, in addition to the configuration of any one invention of the first to sixth, in the tubular portion is housed the power of the LED light source, the power source and the AC input cable A DC output cable is connected and pulled out from the casing of the power source, and a waterproof connector is connected to each end of the AC input cable and the DC output cable.

さらに、第8の発明は、前記第1乃至第7のいずれか一つの発明の構成に加え、前記筒状部位の筒内における前記基板の貫通穴近傍に対応する部位に、前記筒状部位の前記開口側から前記通気口側への空気の流れを強制的に生じさせる強制冷却手段が設けられていることを特徴とする。 Furthermore, an eighth aspect of the present invention, in addition to the configuration of any one invention of the first to seventh, a portion corresponding to the through hole near the substrate in the cylindrical portion of the cylinder, of the cylindrical portion characterized in that forced cooling means for creating from the opening side to force the flow of air to the vent side.

本発明によれば、貫通穴が形成された基板の前記貫通穴を貫通する態様で、筒状部位が前記基板の両面から突出して設けられているが、前記基板の片面には複数のLED光源が互いに間隔を介して配設され、該LED光源の配設面と反対側の前記基板面側には前記LED光源からの熱を放熱するためのヒートシンクが前記筒状部位の外周側に設けられて、前記ヒートシンクの基端面が前記基板に熱的に接続されているので、ヒートシンクによって前記LED光源からの熱を放熱することができる。また、前記LED光源の熱によって前記基板の温度が上昇すると、前記ヒートシンクの外側から該ヒートシンクの基端側に空気が入り込み、筒状部位の外側の壁面側に沿って前記ヒートシンクの先端側に流れて該先端側から外部に導出されるので、この空気の流れによっても前記LED光源の熱を放熱できる。   According to the present invention, the cylindrical portion is provided so as to protrude from both surfaces of the substrate in a manner of penetrating the through hole of the substrate in which the through hole is formed, and a plurality of LED light sources are provided on one surface of the substrate. Are arranged at intervals, and a heat sink for dissipating heat from the LED light source is provided on the outer peripheral side of the cylindrical portion on the substrate surface side opposite to the LED light source arrangement surface. And since the base end surface of the said heat sink is thermally connected to the said board | substrate, the heat from the said LED light source can be thermally radiated with a heat sink. Further, when the temperature of the substrate rises due to the heat of the LED light source, air enters from the outside of the heat sink to the proximal end side of the heat sink and flows to the distal end side of the heat sink along the outer wall surface side of the cylindrical portion. Thus, the heat from the LED light source can be dissipated by this air flow.

一方、前記筒状部位は、筒内に前記LED光源の電源が収納可能と成しているので、必要に応じて電源をLED照明装置に収納することができる。また、筒状部位は、筒軸方向の一端側が前記ヒートシンクの先端部よりも先方に突出しており、該突出した前記筒状部位の側周壁部には通気口が形成され、前記筒状部位の筒軸方向の他端側は前記基板のLED光源配設面よりも先方に突出して該突出先端部には開口が形成されており、例えば筒内に電源が収容されてその電源の温度の上昇により前記筒状部位の筒内の空気の温度が上昇すると、該筒状部位の前記開口から該筒状部位の筒内に空気が導入されて該筒内を流れて前記通気口から導出されることにより、前記電源の冷却を、いわゆる自然対流冷却にて行うことができる。   On the other hand, since the cylindrical part is configured such that the power source of the LED light source can be accommodated in the cylinder, the power source can be accommodated in the LED lighting device as necessary. Further, the cylindrical part has one end side in the cylinder axial direction protruding forward from the tip of the heat sink, and a vent hole is formed in a side peripheral wall part of the protruding cylindrical part. The other end side in the cylinder axis direction protrudes ahead of the LED light source arrangement surface of the substrate, and an opening is formed at the protruding tip portion. For example, a power source is accommodated in the cylinder and the temperature of the power source rises. When the temperature of the air in the cylindrical portion of the cylinder rises due to the air, air is introduced into the cylinder of the cylindrical portion from the opening of the cylindrical portion, flows through the cylinder, and is led out from the vent hole. Thus, the power supply can be cooled by so-called natural convection cooling.

このように、本発明では、LED光源の熱によってLED光源が配設されている基板の温度が上昇したときにヒートシンクの外側から空気がヒートシンクの基端側に入り込み、筒状部位の外側の壁面側に沿ってヒートシンクの先端側に流れて外部に導出されるといったLED光源冷却用の空気の流れと、筒状部位の筒内を通って電源を冷却する空気の流れとが、筒状部位によって絶縁(分離)されており、ヒートシンクを通る空気によるLED光源の冷却と筒状部位の筒内を通る空気による電源の冷却とが個別に行われるので、LED光源と電源とをそれぞれ別々の空気流によって効率的に冷却することができ、LED照明装置の長期信頼性を確保することができ、寿命を長くすることができるし、LED光源を効率的に冷却できることによって、LED光源に、より多くの電流を供給することができ、結果としてLED照明装置の全光束を高めることができる。   Thus, in the present invention, when the temperature of the substrate on which the LED light source is disposed rises due to the heat of the LED light source, air enters the base end side of the heat sink from the outside of the heat sink, and the outer wall surface of the cylindrical portion The air flow for cooling the LED light source that flows to the tip side of the heat sink along the side and is led to the outside, and the air flow that cools the power source through the inside of the cylindrical part are depending on the cylindrical part. Insulated (separated), cooling of the LED light source by the air passing through the heat sink and cooling of the power source by the air passing through the inside of the cylindrical part are performed separately. The LED lighting device can be efficiently cooled, the long-term reliability of the LED lighting device can be secured, the life can be extended, and the LED light source can be efficiently cooled. Te, the LED light source, it is possible to supply more current, it is possible to increase the total luminous flux as a result LED lighting device.

また、本発明においては、LED光源の温度が上昇したときには、その配設領域の空気の温度が上昇して生じる空気流(熱分布による自然対流)を利用して冷却することができ、さらに、筒状部位内にファン等の強制冷却手段を設けなくても、前記のように例えば収納される電源の温度の上昇により筒状部位の筒内の空気の温度が上昇すると、該筒状部位の前記開口から該筒状部位の筒内に空気が導入されて、その空気の流れ(熱分布による自然対流)により電源の冷却が行われるので、このようにファン等を設けない構成とすれば、冷却のための動力が不要であり、さらに、LED照明装置の重量が重くなることを防ぐことができ、軽量化を図ることができる。   Further, in the present invention, when the temperature of the LED light source rises, it can be cooled by utilizing the air flow (natural convection due to heat distribution) generated by the rise of the temperature of the air in the arrangement region. Even if no forced cooling means such as a fan is provided in the cylindrical portion, if the temperature of the air in the cylindrical portion of the cylindrical portion rises due to, for example, an increase in the temperature of the stored power source as described above, Since air is introduced into the cylinder of the cylindrical part from the opening and the power supply is cooled by the flow of air (natural convection due to heat distribution), if the fan is not provided in this way, Power for cooling is unnecessary, and further, it is possible to prevent the weight of the LED lighting device from becoming heavy and to reduce the weight.

さらに、本発明によれば、前記の如く、LED光源からの熱を放熱するためのヒートシンクを前記筒状部位の外周側に設け、筒状部位の筒内に前記LED光源の電源収納可能と成していることから、電源収納とその冷却構成およびLED光源の冷却構成をコンパクトにまとめた態様とすることができ、筒状部位の形成位置にヒートシンクを設けないことによりヒートシンクの軽量化も可能となり、コンパクトで軽量のLED照明装置を実現することができる。   Furthermore, according to the present invention, as described above, a heat sink for dissipating heat from the LED light source is provided on the outer peripheral side of the cylindrical part, and the power supply of the LED light source can be stored in the cylinder of the cylindrical part. Therefore, it is possible to make the power storage and its cooling configuration and the LED light source cooling configuration compact, and it is possible to reduce the weight of the heat sink by not providing a heat sink at the position where the cylindrical part is formed. A compact and lightweight LED lighting device can be realized.

さらに、本発明において、筒状部位の開口が形成されている先端部位を基板のLED光源配設面から突出して設け、そのLED光源配設面からの突出長さをhとして前記基板の外径をDとしたときにh/Dを0.1〜0.5の範囲内とし、筒状部位の突出先端部から基板の周縁部にかけて形成された透明カバー部材を前記LED光源配設面と間隔を介して該LED光源配設面を覆う態様で設けることにより、以下の効果を奏することができる。   Furthermore, in the present invention, the tip portion where the opening of the cylindrical portion is formed protrudes from the LED light source arrangement surface of the substrate, and the protrusion length from the LED light source arrangement surface is h, and the outer diameter of the substrate H / D is in the range of 0.1 to 0.5, and the transparent cover member formed from the protruding tip of the cylindrical portion to the peripheral edge of the substrate is spaced from the LED light source arrangement surface. By providing the LED light source in a manner that covers the LED light source arrangement surface, the following effects can be obtained.

つまり、LED光源からの熱によって透明カバー部材や筒状部位の開口近傍の空気の温度が上昇すると、筒状部位の開口から筒内に導入される空気の温度が高くなってしまい、前記のように筒内を流れる空気による電源冷却効率が低下してしまうが、筒状部位の開口が形成されている先端部位を基板のLED光源配設面から突出して設けて透明カバー部材もLED光源配設面から離すことにより筒状部位の開口近傍の空気の温度の上昇を防ぐことができ、空気流による電源冷却を効率的に行うことができる。   That is, when the temperature of the air near the opening of the transparent cover member or the cylindrical part is increased by the heat from the LED light source, the temperature of the air introduced into the cylinder from the opening of the cylindrical part becomes high, as described above. Although the cooling efficiency of the power supply due to the air flowing in the cylinder will be reduced, the tip part where the opening of the cylindrical part is formed is projected from the LED light source arrangement surface of the substrate, and the transparent cover member is also provided with the LED light source By separating from the surface, an increase in the temperature of the air near the opening of the cylindrical portion can be prevented, and power supply cooling by the airflow can be performed efficiently.

なお、筒状部位の開口が形成されている先端部位のLED光源配設面からの突出長さをhとして基板の外径をDとしたときにh/Dを0.1以上とすることにより筒状部位の開口近傍の空気の温度上昇を効率的に防ぐことができ、h/Dを0.5以下とする(つまり突出長さを基板の半径以下とする)ことにより、LED光源照明装置の大型化を防ぎ、デザイン的にも形成し易くできる。   By setting h / D to be 0.1 or more when the protrusion length from the LED light source arrangement surface of the tip part where the opening of the cylindrical part is formed is h and the outer diameter of the substrate is D The temperature rise of the air in the vicinity of the opening of the cylindrical portion can be efficiently prevented, and h / D is set to 0.5 or less (that is, the protruding length is set to be equal to or less than the radius of the substrate). Can be made easy to design.

さらに、筒状部位を樹脂製の部材により形成することによって、LED照明装置の軽量化をより一層図ることができるし、樹脂は金属等よりも熱伝導率が低いことから、ヒートシンクと筒状部位側との熱伝導がよくないため、筒状部位の外側の壁面側に沿ってヒートシンクを通って流れる空気流と筒状部位の内側を流れる空気流とをより一層熱的に分離でき、LED光源や電源の冷却効率を向上できる。また、樹脂製の筒状部位はガラス等と異なり機械的強度も高く、搬送等の際にも取り扱いがしやすい。   Furthermore, by forming the cylindrical portion with a resin member, the LED lighting device can be further reduced in weight, and the heat conductivity of the resin is lower than that of metal or the like. Since the heat conduction to the side is not good, the air flow flowing through the heat sink along the outer wall surface side of the cylindrical part and the air flow flowing inside the cylindrical part can be further thermally separated, and the LED light source And cooling efficiency of the power supply can be improved. Further, unlike a glass or the like, a resin cylindrical portion has high mechanical strength and is easy to handle during transportation.

さらに、前記筒状部位のヒートシンクに囲まれた部位の外周壁に断熱層を設けることにより、ヒートシンクと筒状部位側との熱伝導を妨げることができるので、筒状部位の外側の壁面側に沿ってヒートシンクを通って流れる空気流と筒状部位の内側を流れる空気流とをより一層熱的に分離でき、LED光源や電源の冷却効率を向上できる。 Further, by providing the heat insulating layer on the outer peripheral wall of the portion surrounded by the heat sink of the cylindrical portion, it is possible to prevent the heat conduction between the heat sink and the cylindrical portion side, the wall surface side of the outer cylindrical portion Accordingly, the airflow flowing through the heat sink along the airflow flowing inside the cylindrical portion can be further thermally separated, and the cooling efficiency of the LED light source and the power source can be improved.

さらに、前記筒状部位の開口が形成されている先端部位からヒートシンクの先端部にかけて筒状部位の外周側に沿って該筒状部位の筒軸方向に空気が通るようにする空気通路を形成することにより、空気通路によって、ヒートシンクと筒状部位との間の熱伝導を妨げることができるので、筒状部位の外側の壁面側に沿って流れる空気流と筒状部位の内側を流れる空気流の熱的な分離および冷却を行うことができるため、LED光源や電源の冷却効率を向上できる。   Furthermore, an air passage is formed to allow air to pass along the outer peripheral side of the cylindrical part from the tip part where the opening of the cylindrical part is formed to the tip part of the heat sink. As a result, the air passage can prevent heat conduction between the heat sink and the cylindrical part, so that the air flow flowing along the wall surface outside the cylindrical part and the air flow flowing inside the cylindrical part can be prevented. Since thermal separation and cooling can be performed, the cooling efficiency of the LED light source and the power source can be improved.

さらに、筒状部位にはLED光源の電源を収納することにより、電源内蔵のLED照明装置を形成でき、その電源の筐体外壁部に放熱フィンを設けることにより、該放熱フィンによっても電源の冷却を行うことができるため、電源の冷却効果をより一層向上させることができる。   Furthermore, by storing the power source of the LED light source in the cylindrical part, an LED lighting device with a built-in power source can be formed, and by providing a heat radiating fin on the outer wall of the casing of the power source, cooling of the power source can also be performed Therefore, the cooling effect of the power source can be further improved.

さらに、筒状部位にLED光源の電源を収納する構成において、電源にAC入力ケーブルとDC出力ケーブルを接続して電源の筐体から引き出し、前記AC入力ケーブルとDC出力ケーブルの端部にそれぞれ防水コネクタを接続することによって、防水コネクタによって電源をLED照明装置用のAC電源とLED光源とにそれぞれ例えばワンタッチで簡単に接続することができる。   Further, in a configuration in which the power source of the LED light source is housed in the cylindrical part, an AC input cable and a DC output cable are connected to the power source and pulled out from the casing of the power source, and each of the ends of the AC input cable and the DC output cable is waterproof. By connecting the connector, it is possible to easily connect the power source to the AC power source for the LED lighting device and the LED light source, for example, with a single touch by the waterproof connector.

さらに、筒状部位の筒内における基板の貫通穴近傍に対応する部位に、前記筒状部位の開口側から通気口側への空気の流れを強制的に生じさせる強制冷却手段を設けることにより、電源の冷却効率を向上させることができる。   Furthermore, by providing a forced cooling means for forcibly generating an air flow from the opening side of the cylindrical part to the vent side in a part corresponding to the vicinity of the through hole of the substrate in the cylinder of the cylindrical part, The cooling efficiency of the power supply can be improved.

本発明に係るLED照明装置の一実施例を示す模式的な断面図である。It is typical sectional drawing which shows one Example of the LED lighting apparatus which concerns on this invention. 実施例のLED照明装置の側面図である。It is a side view of the LED lighting apparatus of an Example. 実施例のLED照明装置の斜視図である。It is a perspective view of the LED lighting apparatus of an Example. 実施例のLED照明装置を底面側から見た図である。It is the figure which looked at the LED lighting apparatus of the Example from the bottom face side. 図1のA領域の拡大図である。It is an enlarged view of the A area | region of FIG. 実施例のLED照明装置に設けられているヒートシンクの説明図である。It is explanatory drawing of the heat sink provided in the LED lighting apparatus of an Example. LED照明装置の筒状部位開口形成端部を基板から離すことによる効果を説明するためのグラフである。It is a graph for demonstrating the effect by separating the cylindrical site | part opening formation edge part of an LED lighting apparatus from a board | substrate. 実施例のLED照明装置に生じる空気流を模式的に説明する断面説明図である。It is sectional explanatory drawing which illustrates typically the airflow which arises in the LED lighting apparatus of an Example. 実施例のLED照明装置に設けられている電源の構成を示す斜視図である。It is a perspective view which shows the structure of the power supply provided in the LED lighting apparatus of an Example.

以下、本発明の実施の形態を図面に基づき説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図1には、本発明に係るLED照明装置の一実施例の断面図が模式的に示されている。また、第1実施例のLED照明装置の側面図が図2に示され、図1の矢印B側から見た斜視図が図3に示され、図1の矢印C側から見た図が図4に示され、図1のAの領域の拡大図が図5に示されている。   FIG. 1 schematically shows a cross-sectional view of an embodiment of an LED lighting device according to the present invention. Further, FIG. 2 shows a side view of the LED lighting device of the first embodiment, FIG. 3 shows a perspective view seen from the arrow B side in FIG. 1, and FIG. 3 shows a view seen from the arrow C side in FIG. 4 and an enlarged view of the area A of FIG. 1 is shown in FIG.

図1、図4、図5に示されるように、第1実施例のLED照明装置1は、略真円形状の貫通穴2が形成されたドーナツ型円盤状の基板3と、基板3の貫通穴2を貫通する態様で設けられた筒状部位4とを有している。筒状部位4は基板3の片面(図1、図5の下側)から突出した筒状部位4aと反対側の面(図1、図5の上面)から突出した筒状部位4bとを有して基板3の両面から突出している。筒状部位4bは、例えばポリカーボネート等の樹脂製の部材により形成されており、軽量さと機械的強度および熱を伝えにくい特性を有している。筒状部位4(4b)の筒内にはLED光源6の電源11が収納可能と成しており、図1〜5には、電源11が収納された状態が示されている。   As shown in FIGS. 1, 4, and 5, the LED lighting device 1 of the first embodiment includes a donut-shaped disk-shaped substrate 3 in which a substantially circular through hole 2 is formed, and a through-hole of the substrate 3. And a cylindrical portion 4 provided in a manner penetrating the hole 2. The cylindrical part 4 has a cylindrical part 4a protruding from one side (the lower side of FIGS. 1 and 5) of the substrate 3 and a cylindrical part 4b protruding from the opposite side (the upper surface of FIGS. 1 and 5). And protrudes from both sides of the substrate 3. The cylindrical portion 4b is formed of a resin member such as polycarbonate, for example, and has characteristics such as light weight, mechanical strength, and difficulty in transferring heat. The power source 11 of the LED light source 6 can be stored in the cylinder of the cylindrical portion 4 (4b), and FIGS. 1 to 5 show a state where the power source 11 is stored.

また、基板3の片面(図1、図5においては下側の面)はLED光源配設面5と成しており、LED光源配設面5には、図4に示されるように、複数(例えば99個)のLED光源6が互いに間隔を介して点在して配設されている。なお、同図に示されるように、LED光源6は互いに、ほぼ等間隔または等間隔で配設されているが、LED光源6の配設間隔等の配設態様は限定されるものではなく適宜設定されるものである。LED光源配設面5と反対側の基板面7側には、前記筒状部位4bの外周を覆う態様で、LED光源6からの熱を放熱するためのヒートシンク8が設けられ、ヒートシンク8の基端面26(図5、参照)が基板3に熱的に接続されてLED光源6の熱を放熱する構成と成している。   Further, one surface (the lower surface in FIGS. 1 and 5) of the substrate 3 forms an LED light source disposition surface 5, and the LED light source disposition surface 5 includes a plurality of surfaces as shown in FIG. The LED light sources 6 (for example, 99 pieces) are arranged to be interspersed at intervals. As shown in the figure, the LED light sources 6 are arranged at almost equal intervals or at equal intervals. However, the arrangement of the LED light sources 6 is not limited, and is appropriately set. Is set. A heat sink 8 for dissipating heat from the LED light source 6 is provided on the substrate surface 7 side opposite to the LED light source arrangement surface 5 so as to cover the outer periphery of the cylindrical portion 4b. The end face 26 (see FIG. 5) is thermally connected to the substrate 3 to dissipate heat from the LED light source 6.

ヒートシンク8は、例えば図6に示されるように、中央部に貫通穴22を有するドーナツ型円盤状の底板(受熱用底板)23と、底板23に対して垂直に立つ態様で貫通穴22の中心部を中心として放射状に互いに間隔を介して底板23上に設けられた複数の板状のフィン(放熱フィン)24とを有しており、底板23の下側の面がヒートシンクの基端面26と成している。なお、図6において、図を分かりやすくするために、底板23の表面に斜線を記している。   For example, as shown in FIG. 6, the heat sink 8 includes a donut-shaped disk-shaped bottom plate (heat receiving bottom plate) 23 having a through hole 22 in the center, and the center of the through hole 22 in a manner standing vertically to the bottom plate 23. And a plurality of plate-like fins (radiation fins) 24 provided on the bottom plate 23 at a distance from each other in the radial direction, with the lower surface of the bottom plate 23 being a base end surface 26 of the heat sink. It is made. In FIG. 6, the surface of the bottom plate 23 is hatched for easy understanding.

底板23とフィン24は、例えばアルミニウムまたはアルミニウム合金、マグネシウム、マグネシウム合金、あるいは熱伝導性の樹脂により形成されるもので、本実施例では、アルミニウム製の板の表面にシリコン層が形成されたクラッド材により形成されており、底板23の厚みは3mm、フィン24の厚みは0.5mmに形成されている。ヒートシンク8の外周側には図1〜図5に示されるような樹脂製のカバー部材32が設けられており、カバー部材32には複数のスリット31が互いに間隔を介して形成されている。   The bottom plate 23 and the fin 24 are made of, for example, aluminum or an aluminum alloy, magnesium, a magnesium alloy, or a heat conductive resin. In this embodiment, the clad has a silicon layer formed on the surface of an aluminum plate. The bottom plate 23 has a thickness of 3 mm, and the fins 24 have a thickness of 0.5 mm. A resin cover member 32 as shown in FIGS. 1 to 5 is provided on the outer peripheral side of the heat sink 8, and a plurality of slits 31 are formed in the cover member 32 at intervals.

複数のフィン24はそれぞれ、筒状部位4の筒軸方向(Z方向)を伸長方向として形成されて互いに間隔を介して配設されており、カバー部材32のスリット31は、この間隔の形成位置に対応させて形成されている。それぞれのフィン24は、底板23から先端側に向かうにつれて幅が狭く形成されて、先端側には丸みが形成されており、各フィン24には、図1、図5、図6に示されるように、筒状部位4の筒軸方向の中央部から先端部に至る領域に、複数の貫通の孔部25が互いに間隔を介して形成されている。   Each of the plurality of fins 24 is formed with the cylinder axis direction (Z direction) of the cylindrical portion 4 as the extending direction and is disposed with a gap therebetween, and the slit 31 of the cover member 32 is formed at the position where the gap is formed. It is formed corresponding to. Each fin 24 is formed to have a narrower width from the bottom plate 23 toward the front end side, and is rounded at the front end side, and each fin 24 is shown in FIGS. 1, 5, and 6. In addition, a plurality of through-holes 25 are formed at intervals from each other in a region from the central part of the cylindrical part 4 in the cylinder axis direction to the tip part.

図1〜図3に示されるように、筒状部位4bは、筒軸方向(図のZ軸方向)の一端側がヒートシンク8の先端部よりも先方に突出し、その突出した筒状部位4bの側周壁部には、スリット状の通気口9が形成されている。また、筒状部位4bは、その筒孔の横断面形状(XY断面形状)が真円形状を呈しているが、筒状部位4bは通気口9が形成された部位が先端側(図1、図2の上側)に向かうにつれて連続的に径が小さくなる領域と段階的に径が小さくなる領域とを有して、先端部の径がヒートシンク8の配設領域における径に比べて小さく形成されており、筒状部位4bの先端部にはLED照明装置1をその取り付け箇所に取り付けるための口金30が形成されている。   As shown in FIGS. 1 to 3, the cylindrical part 4 b has one end side in the cylinder axis direction (Z-axis direction in the figure) protruding ahead of the tip of the heat sink 8, and the protruding cylindrical part 4 b side. A slit-like vent 9 is formed in the peripheral wall portion. In addition, the cylindrical portion 4b has a perfect circular shape in the cross-sectional shape (XY cross-sectional shape) of the cylindrical hole, but the cylindrical portion 4b has a portion where the vent hole 9 is formed at the tip side (FIG. 1, FIG. It has a region where the diameter continuously decreases toward the upper side of FIG. 2 and a region where the diameter gradually decreases, and the diameter of the tip is smaller than the diameter in the region where the heat sink 8 is disposed. A base 30 for attaching the LED lighting device 1 to the attachment location is formed at the tip of the cylindrical portion 4b.

本実施例において、口金30は、JIS口金E39に規定された大きさに形成されており、この口金30に対応する照明装置としては、50W以上(LED光源の性能によるが最大300W程度)の高ワット数のLED照明装置1を形成できる。   In the present embodiment, the base 30 is formed in a size defined in the JIS base E39, and the illumination device corresponding to the base 30 has a high power of 50 W or more (up to about 300 W depending on the performance of the LED light source). A wattage LED lighting device 1 can be formed.

なお、口金30の大きさやLED照明装置1の大きさ等は特に限定されるものではなく適宜設定されるものであるが、通常、前記のような高ワット数のLED照明装置は大きさも大きくなることから、金属製の筒状部位4を設けて形成すると、LED照明装置の重量が重くなってしまい、地震に対する落下の危険性が生じたり、施工時に一人作業ができないといったこと等が問題となったりすることが想定される。それに対し、本実施例では、筒状部位4を樹脂製にして軽量化を図っており、このような問題が生じることはない。また、筒状部位4bが軽量である分だけ筒状部位4bの長さを、収納される電源11に対応させて収納の余裕を持った長さに形成することもできる。   In addition, although the magnitude | size of the nozzle | cap | die 30, the magnitude | size of the LED lighting apparatus 1, etc. are not specifically limited, It sets suitably, Usually, the above-mentioned high-wattage LED lighting apparatus also becomes large. Therefore, when the metal cylindrical portion 4 is provided and formed, the weight of the LED lighting device becomes heavy, and there is a risk of falling due to an earthquake, or that one person cannot work alone during construction. It is assumed that On the other hand, in this embodiment, the cylindrical portion 4 is made of resin to reduce the weight, and such a problem does not occur. Further, the length of the cylindrical portion 4b corresponding to the power supply 11 to be stored can be formed to have a storage margin by the amount that the cylindrical portion 4b is lightweight.

図1、図5に示されるように、前記筒状部位4aは、基板3のLED光源配設面5側から突出して設けられ、その突出長さは、基板3の外径が250mmのときに例えば70mm位であり、突出先端部位(筒状部位4の筒軸方向の他端側)から基板3の周縁部にかけて透明カバー部材12が形成されている。透明カバー部材12は、LED光源配設面5と間隔を介してLED光源配設面5を覆う態様で設けられており、透明カバー部材12の内側には筒体15が透明カバー部材12と一体的に設けられている。   As shown in FIGS. 1 and 5, the cylindrical portion 4 a is provided so as to protrude from the LED light source arrangement surface 5 side of the substrate 3, and the protruding length is when the outer diameter of the substrate 3 is 250 mm. For example, it is about 70 mm, and the transparent cover member 12 is formed from the projecting tip portion (the other end side of the cylindrical portion 4 in the cylinder axis direction) to the peripheral edge of the substrate 3. The transparent cover member 12 is provided so as to cover the LED light source arrangement surface 5 with a space from the LED light source arrangement surface 5, and the cylindrical body 15 is integrated with the transparent cover member 12 inside the transparent cover member 12. Provided.

また、筒体15の内側には筒体15と間隔を介して前記筒状部位4aが設けられ、筒状部位4aと筒体15とは連結板部27を介して連結されて、筒状部位4aと筒体15と透明カバー部材12とが一体的に形成されている。なお、筒状部位4aと筒体15と透明カバー部材12の形成材料は特に限定されるものではないが、例えばポリカーボネート等の樹脂により形成することができる。筒状部位4aの突出先端部には開口10が形成されており、開口10の径および筒状部位4aの筒内径は30mm以上(例えば80mm)に形成されている。   In addition, the cylindrical part 4a is provided inside the cylindrical body 15 with a space from the cylindrical body 15, and the cylindrical part 4a and the cylindrical body 15 are connected via a connecting plate portion 27, so that the cylindrical part is provided. 4a, the cylindrical body 15, and the transparent cover member 12 are integrally formed. In addition, although the formation material of the cylindrical part 4a, the cylinder 15, and the transparent cover member 12 is not specifically limited, For example, it can form with resin, such as a polycarbonate. An opening 10 is formed at the protruding tip of the cylindrical portion 4a, and the diameter of the opening 10 and the cylindrical inner diameter of the cylindrical portion 4a are formed to be 30 mm or more (for example, 80 mm).

なお、図5に示されるように、本実施例において、ヒートシンク8の底板23の下面(基端面26)と透明カバー部材12の周縁部との接触部にはシール部材であるOリング33が設けられ、ヒートシンク8の底板23と筒体15との接触部にはシール部材であるOリング34が設けられており、透明カバー部材12と筒体15とに覆われたLED光源6の配設領域に水の浸入がないように、液密、かつ、大気に対して気密に形成されている。   As shown in FIG. 5, in this embodiment, an O-ring 33 as a seal member is provided at a contact portion between the lower surface (base end surface 26) of the bottom plate 23 of the heat sink 8 and the peripheral portion of the transparent cover member 12. In addition, an O-ring 34 that is a sealing member is provided at a contact portion between the bottom plate 23 of the heat sink 8 and the cylinder 15, and the LED light source 6 is covered with the transparent cover member 12 and the cylinder 15. It is formed in a liquid-tight and air-tight manner so that water does not enter.

また、筒状部位4aの筒壁は,開口10側から基板3側に向かうにつれて厚みが厚く形成されているが、筒状部位4aの底板23との接触部側には、その接触部側を開口とした溝部35が筒状部位4aの全周にかけて形成されていて、筒状部位4aとヒートシンク8の底板23との接触面積が小さくなるように形成され、ヒートシンク8の底板23側から筒状部位4a側に熱が伝わりにくいように構成されている。   The cylindrical wall of the cylindrical portion 4a is formed to increase in thickness from the opening 10 side to the substrate 3 side. However, the contact portion side of the cylindrical portion 4a with the bottom plate 23 is connected to the contact portion side. A groove portion 35 having an opening is formed over the entire circumference of the cylindrical portion 4a so that the contact area between the cylindrical portion 4a and the bottom plate 23 of the heat sink 8 is reduced. It is comprised so that heat may not be easily transmitted to the site | part 4a side.

本実施例において、LED光源6の駆動により発熱して基板3の温度が上昇すると、基板3からヒートシンク8の底板23に熱が伝わり、さらにフィン24に熱が伝わって、その熱がフィン24から放熱される。また、LED光源6の熱によって基板3の温度が上昇すると、ヒートシンク8のフィン24の間隔に上昇気流が生じて、図8の矢印Aに示されるように、ヒートシンク8の外側からヒートシンク8の基端側(この基端側におけるフィン24同士の間隔)に入り込んだ空気が筒状部位4の外側の壁面側に沿ってヒートシンク8の先端側に流れて、該先端側から外部に導出される構成と成している。なお、フィン24に貫通の孔部25が形成されていることから、孔部25を通しても空気が流れ、ヒートシンク8内を空気がより流れやすくなっている。   In this embodiment, when the LED light source 6 is driven to generate heat and the temperature of the substrate 3 rises, heat is transferred from the substrate 3 to the bottom plate 23 of the heat sink 8 and further to the fins 24. Heat is dissipated. Further, when the temperature of the substrate 3 rises due to the heat of the LED light source 6, an ascending airflow is generated in the interval between the fins 24 of the heat sink 8, and as shown by an arrow A in FIG. A structure in which the air that has entered the end side (interval between the fins 24 on the base end side) flows to the distal end side of the heat sink 8 along the outer wall surface side of the cylindrical portion 4 and is led out from the distal end side to the outside. It is made. Since the through holes 25 are formed in the fins 24, air flows through the holes 25, and the air is more likely to flow through the heat sink 8.

一方、筒状部位4に収納される電源11の温度の上昇により筒状部位4の筒内の空気の温度が上昇すると、図8の矢印Bに示されるように、筒状部位4の筒内に上昇気流が生じて筒状部位4の開口10から筒状部位4の筒内に、外部から筒内の空気よりも低温の空気が導入され、この空気が筒内を流れて通気口9から導出されることにより電源11の冷却が行われる。このように、筒状部位4によって電源11の冷却の空気流とLED光源6の冷却の空気流とが絶縁されていることが本実施例の最も特徴的な構成である。   On the other hand, when the temperature of the air in the cylinder of the cylindrical part 4 rises due to the rise in the temperature of the power supply 11 housed in the cylindrical part 4, as shown by the arrow B in FIG. Ascending airflow is generated in the tube, and air having a temperature lower than that of the air in the cylinder is introduced from the outside into the cylinder of the cylindrical part 4 through the opening 10 of the cylindrical part 4. By being derived, the power source 11 is cooled. Thus, the most characteristic configuration of the present embodiment is that the air flow for cooling the power source 11 and the air flow for cooling the LED light source 6 are insulated by the cylindrical portion 4.

また、本実施例では、図5に示されるように、前記筒状部位4bのヒートシンク8に囲まれた部位の外周壁には断熱層13が形成されており、断熱層13は例えばプラスチック発泡体によって2〜4mm程度の厚みに形成されている。本実施例では、この断熱層13を設けることによって、電源11の冷却の空気流とLED光源6の冷却の空気流とが、より一層熱的に絶縁されている。   Further, in this embodiment, as shown in FIG. 5, a heat insulating layer 13 is formed on the outer peripheral wall of the tubular portion 4b surrounded by the heat sink 8, and the heat insulating layer 13 is made of, for example, a plastic foam. Is formed to a thickness of about 2 to 4 mm. In this embodiment, by providing the heat insulating layer 13, the cooling air flow of the power source 11 and the cooling air flow of the LED light source 6 are further thermally insulated.

さらに、本実施例では、筒状部位4の開口10が形成されている先端部位からヒートシンク8の先端部にかけて筒状部位4の外周側に沿って、図8の矢印Cに示されるように、筒状部位4の筒軸方向に空気が通るようにする空気通路14が形成されている。この空気通路14は、図5に示されるように、前記筒体15と筒状部位4aの外周側との間隔により形成された空気通路14aと、ヒートシンク8のフィン24の間隔において筒状部位4bに沿って空気が流れる空気通路14bと、これらの空気通路14a,14bを連通させるために、ヒートシンク8のフィン24の間隔形成位置に対応させて連結板部27に互いに間隔を介して形成された複数の貫通孔16(図4も参照)とを有して形成されている。   Furthermore, in the present embodiment, as indicated by an arrow C in FIG. 8 along the outer peripheral side of the cylindrical portion 4 from the tip portion where the opening 10 of the cylindrical portion 4 is formed to the tip portion of the heat sink 8, An air passage 14 is formed to allow air to pass in the cylindrical axis direction of the cylindrical portion 4. As shown in FIG. 5, the air passage 14 has a cylindrical portion 4 b in the space between the air passage 14 a formed by the space between the cylindrical body 15 and the outer peripheral side of the tubular portion 4 a and the fin 24 of the heat sink 8. The air passage 14b through which air flows and the air passages 14a and 14b are connected to each other in the connecting plate portion 27 with a space between the fins 24 of the heat sink 8 so as to communicate with each other. It has a plurality of through holes 16 (see also FIG. 4).

本実施例では、このように筒状部位4の外周側に空気通路14を形成することにより、より一層、電源11の冷却の空気流とLED光源6の冷却の空気流とが絶縁される。なお、空気通路14aを通る空気の流れは、透明カバー部材12がLED光源6からの熱に起因して加熱されて周囲の大気との温度差が生じることによって発生するものであり、空気通路14aの幅(筒状部位4の外周と筒壁15の内壁との間隔)を2mm〜10mmとすることが好ましい。   In the present embodiment, by forming the air passage 14 on the outer peripheral side of the cylindrical portion 4 in this manner, the cooling air flow of the power source 11 and the cooling air flow of the LED light source 6 are further insulated. The air flow through the air passage 14a is generated when the transparent cover member 12 is heated due to heat from the LED light source 6 and a temperature difference with the surrounding atmosphere is generated, and the air passage 14a. The width (the distance between the outer periphery of the cylindrical portion 4 and the inner wall of the cylindrical wall 15) is preferably 2 mm to 10 mm.

また、透明カバー部材12と基板3との間隔が小さくて透明カバー部材12の基板3から先方に突出する筒状部位4aの突出長さが短いと、筒状部位4aの開口10が形成されている先端部位近傍の空気の温度が上昇しやすく、さらに、本実施例のようにLED光源6を互いに等間隔やほぼ等間隔で基板3に配設する構成においては、基板3の面積が大きくなるほどLED光源6の配設数も大きくなってLED光源6からの発熱量も大きくなる。例えば、本実施例においては、LED光源配設面5の近傍の空気の温度は50℃を超えて70℃にも達する。   Moreover, if the space | interval of the transparent cover member 12 and the board | substrate 3 is small and the protrusion length of the cylindrical part 4a which protrudes ahead from the board | substrate 3 of the transparent cover member 12 is short, the opening 10 of the cylindrical part 4a will be formed. In the configuration in which the LED light sources 6 are arranged on the substrate 3 at equal intervals or substantially equal intervals as in this embodiment, the temperature of the air in the vicinity of the tip portion is increased. The number of LED light sources 6 is increased and the amount of heat generated from the LED light sources 6 is also increased. For example, in this embodiment, the temperature of the air near the LED light source arrangement surface 5 exceeds 50 ° C. and reaches 70 ° C.

そこで、本発明者は、筒状部位4aのLED光源配設面5からの突出長さをhとして基板3の径をDとしたとき、h/Dの値を0.1以上に設定すると好ましいことを、表1および図7の例から導き出した。なお、表1の結果および、図7の特性線は、LED照明装置が設けられている雰囲気温度を23℃、Dの値を280mmとして、LED光源配設面5からの距離(突出長さhに対応)と、距離に応じた空気温度を求めた結果であり、ここで、距離を30mmとするとh/D=0.107148となり(つまり0.1以上)、空気温度を50℃未満にできる。また、Dの値を変えても、h/Dの値と空気温度との関係は、ほぼ同様であると想定される。   Therefore, the present inventor preferably sets the value of h / D to 0.1 or more, where h is the protruding length of the cylindrical portion 4a from the LED light source arrangement surface 5 and the diameter of the substrate 3 is D. This was derived from the example in Table 1 and FIG. In addition, the result of Table 1 and the characteristic line of FIG. 7 are the distance (protrusion length h) from the LED light source arrangement surface 5 when the ambient temperature in which the LED lighting device is provided is 23 ° C. and the value of D is 280 mm. )), And when the distance is 30 mm, h / D = 0.107148 (that is, 0.1 or more), and the air temperature can be less than 50 ° C. . Even if the value of D is changed, the relationship between the value of h / D and the air temperature is assumed to be substantially the same.

Figure 0006019497
Figure 0006019497

また、h/Dを0.5より大きくしても、筒状部位4aの開口10近傍の空気温度を下げる効果に差が生じにくいため、h/Dの範囲は、0.1〜0.5の範囲内の適宜の値とするとよい。本実施例では、前記の如く、筒状部位4aの開口10が形成されている先端部位を直径250mmの基板3のLED光源配設面5から70mm以上離してh/Dを0.28としており、表1に示されるように、Dを280mmとしてhを60mmとしてh/Dを0.214286とすると、開口10近傍の温度をLED照明装置が設けられている雰囲気温度(ここでは23℃)+17℃以下に抑えることができるため、開口10近傍の温度をさらに低くできる。そして、それに対応させて透明カバー部材12もLED光源配設面5から離して形成しており、LED光源配設面5の温度が高くなることを防ぐことができる。   In addition, even if h / D is greater than 0.5, a difference in the effect of lowering the air temperature in the vicinity of the opening 10 of the cylindrical portion 4a is unlikely to occur, so the h / D range is 0.1 to 0.5. An appropriate value within the range is preferable. In this embodiment, as described above, the tip portion where the opening 10 of the cylindrical portion 4a is formed is separated from the LED light source arrangement surface 5 of the substrate 3 having a diameter of 250 mm by 70 mm or more, and h / D is set to 0.28. As shown in Table 1, when D is 280 mm, h is 60 mm, and h / D is 0.214286, the temperature in the vicinity of the opening 10 is the ambient temperature (here 23 ° C.) in which the LED lighting device is provided + 17 Since the temperature can be suppressed to not more than ° C., the temperature near the opening 10 can be further lowered. In correspondence with this, the transparent cover member 12 is also formed away from the LED light source arrangement surface 5, and the temperature of the LED light source arrangement surface 5 can be prevented from becoming high.

さらに、図1〜図5、図8には図示されていないが、本実施例において、筒状部位4に収納されているLED光源6の電源11には、図9に示されるように、筐体17の外壁部に放熱フィン18が互いに間隔を介して複数形成されている。放熱フィン18の形成によって放熱面積(空気と接する面積)を拡大でき、かつ、本実施例では放熱フィン18が筒状部位4bの筒軸方向(Z軸方向)に伸長形成されているので、筒状部位4bの筒内を図8の矢印Bに示したように、図の上部側に向けて流れる空気の通路と成すことができ、より放熱効率を向上することができ、電源11に放熱フィン18を設けることにより、電源11の温度を4〜5℃程度下げることができる。なお、放熱フィン18は筐体17の一つの面に形成されているが、2つ以上の面に形成してもよいし、放熱フィン18には放熱塗料を塗布してもよい。   Further, although not shown in FIGS. 1 to 5 and FIG. 8, in this embodiment, the power source 11 of the LED light source 6 housed in the cylindrical portion 4 has a housing as shown in FIG. A plurality of heat radiating fins 18 are formed on the outer wall portion of the body 17 at intervals. Since the radiation area (area in contact with air) can be increased by forming the radiation fins 18, and in the present embodiment, the radiation fins 18 are elongated in the cylinder axis direction (Z-axis direction) of the cylindrical portion 4 b, As shown by the arrow B in FIG. 8, the inside of the cylindrical portion 4b can be formed as a passage for air flowing toward the upper side of the figure, and the heat radiation efficiency can be further improved. By providing 18, the temperature of the power source 11 can be lowered by about 4 to 5 ° C. In addition, although the radiation fin 18 is formed in one surface of the housing | casing 17, you may form in two or more surfaces, and you may apply | coat a radiation coating to the radiation fin 18. FIG.

また、電源11にはAC入力ケーブル19とDC出力ケーブ20が接続されて電源11の筐体17から引き出されており、AC入力ケーブル19とDC出力ケーブル20の端部にはそれぞれ、防水コネクタ21,22が接続されている(図1〜図5、図8には、AC入力ケーブル19と防水コネクタ21,22も図示せず)。   Further, an AC input cable 19 and a DC output cable 20 are connected to the power supply 11 and pulled out from the casing 17 of the power supply 11. A waterproof connector 21 is provided at each end of the AC input cable 19 and the DC output cable 20. , 22 are connected (the AC input cable 19 and the waterproof connectors 21 and 22 are not shown in FIGS. 1 to 5 and 8).

なお、本発明は、前記実施例に限定されることはなく、様々な実施の態様を採り得る。例えば、前記実施例では、筒状部位4bの外周側にヒートシンク8の形成位置に対応させて断熱層13を設けたが、断熱層13は省略することができる。   In addition, this invention is not limited to the said Example, Various aspects can be taken. For example, in the above-described embodiment, the heat insulating layer 13 is provided on the outer peripheral side of the cylindrical portion 4b corresponding to the position where the heat sink 8 is formed, but the heat insulating layer 13 can be omitted.

また、前記実施例では、筒状部位4の外周側に設けた空気通路14は、空気通路14aと貫通孔16と空気通路14bとにより形成したが、空気通路14bの形成に際し、例えば筒状部位4aの外周側に筒体15を設けた構成と同様に、ヒートシンク8側にも筒状部位4(4b)の外周側に筒状部位4bと間隔を介した筒体を設け、この筒体と筒状部位4bの外周側との間隔を空気通路14bとしてもよい。また、例えば貫通孔16は円形状とするとは限らず、多角形状等の他の形状としてもよい。さらに、空気通路14は省略することもできる。   Moreover, in the said Example, although the air passage 14 provided in the outer peripheral side of the cylindrical part 4 was formed of the air passage 14a, the through-hole 16, and the air passage 14b, when forming the air path 14b, for example, a cylindrical part Similarly to the configuration in which the cylindrical body 15 is provided on the outer peripheral side of 4a, the cylindrical body 4b is provided on the outer peripheral side of the cylindrical part 4 (4b) on the heat sink 8 side, and the cylindrical part 4b is spaced from the cylindrical part 4b. The space between the cylindrical portion 4b and the outer peripheral side may be used as the air passage 14b. Further, for example, the through-hole 16 is not limited to a circular shape, and may have another shape such as a polygonal shape. Furthermore, the air passage 14 can be omitted.

さらに、前記実施例では、筒状部位4の筒穴は真円形状としたが、多角形状としてもよいし、それ以外の形状としてもよい。また、その穴の大きさも特に限定されるものではなく、適宜設定されるものである。   Furthermore, in the said Example, although the cylinder hole of the cylindrical part 4 was made into perfect circle shape, it may be polygonal shape and is good also as other shapes. Further, the size of the hole is not particularly limited, and is appropriately set.

さらに、前記実施例では、筒状部位4の筒穴に電源11を収納する構成としたが、電源11を収納せずに外付けとしてもよい。   Furthermore, in the said Example, although it was set as the structure which accommodates the power supply 11 in the cylinder hole of the cylindrical site | part 4, it is good also as an external attachment, without accommodating the power supply 11. FIG.

さらに、前記実施例では、基板3およびヒートシンク8の底板23の形状を中心部に円形の貫通穴2,22を有する円盤状に形成したが、基板3や基板3に対応させて形成される底板23の形状は、貫通穴が形成されていれば、例えば角型の板状としても、その他の形状としてもよい。   Furthermore, in the said Example, although the shape of the baseplate 23 of the board | substrate 3 and the heat sink 8 was formed in the disk shape which has the circular through-holes 2 and 22 in the center part, the baseplate formed corresponding to the board | substrate 3 or the board | substrate 3 As long as the through hole is formed, the shape of 23 may be, for example, a square plate shape or other shapes.

さらに、前記実施例では、ヒートシンク8のフィン24に貫通の孔部25を形成したが、孔部25は省略することもできる。   Further, in the above embodiment, the through holes 25 are formed in the fins 24 of the heat sink 8, but the holes 25 may be omitted.

さらに、例えば図8の破線Fに示されるように、筒状部位4の筒内において、基板2の貫通穴2の近傍に対応する部位等に、筒状部位4の開口10側から通気口9側への空気の流れを強制的に生じさせるファン等の強制冷却手段を設けてもよい。この場合、ファンFの電源は、LED光源6の電源11と共通で使えるものを選定することができ、強制冷却手段の配設によって、電源11の冷却効率を向上させることができる。   Further, for example, as shown by a broken line F in FIG. 8, in the cylinder of the cylindrical part 4, a vent 9 is formed from the opening 10 side of the cylindrical part 4 to a part corresponding to the vicinity of the through hole 2 of the substrate 2. Forcible cooling means such as a fan for forcibly generating the air flow to the side may be provided. In this case, the power supply of the fan F can be selected so that it can be used in common with the power supply 11 of the LED light source 6, and the cooling efficiency of the power supply 11 can be improved by providing the forced cooling means.

また、このように、ファンF等の強制冷却手段を設ける構成において、電源11と電源筐体17の温度の少なくとも一方を検知する温度手段と、該温度検出手段により検出された温度が予め設定される強制冷却開始温度を超えたときには強制冷却手段を稼動開始する制御構成を設けてもよい。なお、強制冷却開始温度は、例えば電源11内に設けられているコンデンサ等の電子部品の耐熱温度に基づいて定められるものであり、例えば80℃に設定される。なお、ファンF等の強制冷却手段の存在は、その強制冷却手段が稼動していない時にも筒状部位4内の自然対流を妨げないものであり、また、筒状部位4内の通風とLED光源の冷却のためのヒートシンク8の放熱の空気流とが分離されているので、筒状部位4内に電源11が配設されていてファン等による強制冷却を行う場合でも、その強制冷却に要する消費電力を極めて小さいものとすることができる。   In this way, in the configuration in which the forced cooling means such as the fan F is provided, the temperature means for detecting at least one of the temperature of the power supply 11 and the power supply casing 17, and the temperature detected by the temperature detection means are set in advance. There may be provided a control configuration for starting the operation of the forced cooling means when the forced cooling start temperature is exceeded. The forced cooling start temperature is determined based on the heat resistant temperature of an electronic component such as a capacitor provided in the power source 11, and is set to 80 ° C., for example. The presence of the forced cooling means such as the fan F does not hinder natural convection in the cylindrical portion 4 even when the forced cooling means is not operating, and the ventilation and LED in the cylindrical portion 4 are not disturbed. Since the heat radiation air flow of the heat sink 8 for cooling the light source is separated, it is necessary for the forced cooling even when the power source 11 is disposed in the cylindrical portion 4 and forced cooling is performed by a fan or the like. The power consumption can be made extremely small.

さらに、LED照明装置のカバー部材32またはヒートシンク8に、照明装置の触れ止めを固定する固定部を設けてもよい。   Furthermore, you may provide the fixing | fixed part which fixes the touch stop of an illuminating device in the cover member 32 or heat sink 8 of an LED illuminating device.

本発明のLED照明装置は、簡単な構成で、電源を内蔵してもその電源の熱による寿命低下等の影響が生じにくく、軽量化が可能なので、家庭用としても産業用分野の照明装置としても利用できる。   The LED lighting device of the present invention has a simple configuration, and even if it has a built-in power source, it does not easily affect the life of the power source due to its heat, and can be reduced in weight. Can also be used.

1 LED照明装置
2 貫通穴
3 基板
4(4a,4b) 筒状部位
5 LED光源配設面
6 LED光源
7 基板面
8 ヒートシンク
9 通気口
10 開口
11 電源
12 透明カバー部材
13 断熱層
14 空気通路
15 筒体
16 貫通孔
23 底板
24 フィン
DESCRIPTION OF SYMBOLS 1 LED lighting apparatus 2 Through-hole 3 Substrate 4 (4a, 4b) Cylindrical part 5 LED light source arrangement surface 6 LED light source 7 Substrate surface 8 Heat sink 9 Vent 10 Open 11 Power supply 12 Transparent cover member 13 Heat insulation layer 14 Air passage 15 Cylindrical body 16 Through hole 23 Bottom plate 24 Fin

Claims (8)

貫通穴が形成された基板と、該基板の前記貫通穴を貫通する態様で設けられた筒状部位とを有して該筒状部位は前記基板の両面から突出し、前記基板の片面には複数のLED光源が互いに間隔を介して配設され、該LED光源の配設面と反対側の前記基板面側には前記LED光源からの熱を放熱するためのヒートシンクが前記筒状部位の外周側に設けられ、前記ヒートシンクの基端面が前記基板に熱的に接続されて前記LED光源の熱を放熱する構成と成し、前記筒状部位は筒軸方向の一端側が前記ヒートシンクの先端部よりも先方に突出して該突出した前記筒状部位の側周壁部に通気口が形成され、前記筒状部位の筒軸方向の他端側は前記基板のLED光源配設面よりも先方に突出して該突出先端部には開口が形成されており、前記筒状部位の筒内に前記LED光源の電源が収納可能と成していて、前記筒状部位の筒内に空気が導入されて該筒内を流れて前記通気口から導出されることにより前記電源の冷却が行われ、前記LED光源の熱によって前記基板の温度が上昇すると前記ヒートシンクの外側から該ヒートシンクの基端側に入り込んだ空気が前記筒状部位の外側の壁面側に沿って前記ヒートシンクの先端側に流れて該先端側から外部に導出される構成と成して、前記筒状部位によって前記電源の冷却の空気流と前記LED光源の冷却の空気流とが絶縁されていることを特徴とするLED照明装置。   A substrate having a through-hole formed therein and a cylindrical portion provided in a form penetrating the through-hole of the substrate, the cylindrical portion protruding from both sides of the substrate, and a plurality of one side of the substrate are LED light sources are arranged at intervals, and a heat sink for radiating heat from the LED light sources is disposed on the outer peripheral side of the cylindrical portion on the substrate surface side opposite to the LED light source arrangement surface. The base end surface of the heat sink is thermally connected to the substrate to dissipate the heat of the LED light source, and the cylindrical portion has one end side in the cylinder axis direction than the front end portion of the heat sink. A vent hole is formed in a side wall portion of the protruding cylindrical portion protruding forward, and the other end side of the cylindrical portion in the cylindrical axis direction protrudes further forward than the LED light source arrangement surface of the substrate. An opening is formed in the protruding tip, and the cylindrical portion The power source of the LED light source can be stored in the cylinder of the tube, and air is introduced into the cylinder of the cylindrical part, flows in the cylinder, and is led out from the vent hole to cool the power source. When the temperature of the substrate rises due to the heat of the LED light source, the air that has entered the proximal end side of the heat sink from the outside of the heat sink extends along the outer wall surface side of the cylindrical portion and the distal end side of the heat sink The air flow for cooling the power source and the air flow for cooling the LED light source are insulated by the cylindrical portion. LED lighting device. 前記筒状部位の前記開口が形成されている先端部位は前記基板の前記LED光源が配設されたLED光源配設面から突出して設けられており、そのLED光源配設面からの突出長さをhとして前記基板の外径をDとしたときにh/Dが0.1〜0.5の範囲内であり、前記筒状部位の突出先端部から前記基板の周縁部にかけて形成された透明カバー部材が前記LED光源配設面と間隔を介して該LED光源配設面を覆う態様で設けられていることを特徴とする請求項1記載のLED照明装置。 The LED light source is provided to protrude from the LED light source installation surface disposed, length of projection from the LED light source arrangement surface of the tip portion in which the opening of the tubular portion is formed the substrate H / D is in the range of 0.1 to 0.5, where h is D and the outer diameter of the substrate is D, and the transparent formed from the protruding tip of the cylindrical portion to the peripheral edge of the substrate The LED lighting device according to claim 1, wherein a cover member is provided so as to cover the LED light source arrangement surface with a space from the LED light source arrangement surface. 前記筒状部位は樹脂製の部材により形成されていることを特徴とする請求項1または請求項2記載のLED照明装置。 The LED lighting device according to claim 1, wherein the cylindrical portion is formed of a resin member. 前記筒状部位の前記ヒートシンクに囲まれた部位の外周壁には断熱層が設けられていることを特徴とする請求項1または請求項2または請求項3記載のLED照明装置。 LED lighting apparatus according to claim 1 or claim 2 or claim 3, wherein the outer peripheral wall of the portion surrounded by the heat sink of the tubular portion is characterized in that the heat insulating layer is provided. 前記筒状部位の前記開口が形成されている先端部位から前記ヒートシンクの先端部にかけて前記筒状部位の外周側に沿って該筒状部位の筒軸方向に空気が通るようにする空気通路が形成されていることを特徴とする請求項1乃至請求項4のいずれか一つに記載のLED照明装置。 Air passage formed to allow passage of air in the cylinder axis direction of the cylindrical portion along an outer periphery of the tubular portion from the distal end portion of the opening of the tubular portion is formed to the tip portions of the heat sink The LED lighting device according to claim 1, wherein the LED lighting device is provided. 前記筒状部位には前記LED光源の電源が収納されており、該電源の筐体外壁部には放熱フィンが形成されていることを特徴とする請求項1乃至請求項5のいずれか一つに記載のLED照明装置。 Any one of claims 1 to 5, characterized in that the said tubular portion wherein the LED and the power is accommodated in the light source, the housing outer wall of the power source are formed radiating fins LED illuminating device of description. 前記筒状部位には前記LED光源の電源が収納されており、該電源にはAC入力ケーブルとDC出力ケーブルが接続されて前記電源の筐体から引き出されており、前記AC入力ケーブルとDC出力ケーブルの端部にはそれぞれ防水コネクタが接続されていることを特徴とする請求項1乃至請求項6のいずれか一つに記載のLED照明装置。 The said tubular portion is housed the power of the LED light source is led from the housing of the power AC input cable and DC output cable is connected to the power source, the AC input cable and DC output The LED lighting device according to claim 1, wherein a waterproof connector is connected to each end of the cable. 前記筒状部位の筒内における前記基板の貫通穴近傍に対応する部位に、前記筒状部位の前記開口側から前記通気口側への空気の流れを強制的に生じさせる強制冷却手段が設けられていることを特徴とする請求項1乃至請求項7のいずれか一つに記載のLED照明装置。 A portion corresponding to the through hole near the substrate in the cylindrical portion of the cylinder, forced cooling means for generating from the opening side of the tubular portion to force the flow of air to the vent side is provided The LED illumination device according to claim 1, wherein the LED illumination device is provided.
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