JP6008777B2 - Method for manufacturing electronic component unit, electronic component unit, and cooking device provided with electronic component unit - Google Patents

Description

  The present invention relates to an electronic component unit manufacturing method including an electronic component soldered to a substrate, an electronic component unit manufactured by the electronic component unit manufacturing method, and a heating cooker including the electronic component unit.

  Many electric devices are provided with an electronic component unit in which an electronic component is mounted on a substrate. As an example of the electronic component unit, there is one in which a display device such as a liquid crystal display device or a fluorescent display tube that displays an operation procedure or an operation state is mounted on a substrate. Conventionally, as an electric device equipped with this type of electronic component unit, a substrate on which a display device is mounted and a holding means (holder) that is molded from a resin material and fixes the display device are provided. A rice cooker fixed to a substrate has been proposed (see, for example, Patent Document 1).

Japanese Patent No. 5098147 (page 3, page 4, FIG. 1, FIG. 2)

  The holding means made of a resin material for fixing the display device to the substrate generally has an engaging portion with the substrate such as a claw portion. However, in Patent Document 1, no consideration is given to the engaging portion (claw portion or the like) with the substrate provided in the holding means for holding the display device, and the engaging portion is caused by the heat of the solder during the soldering process. There is a possibility that the holding means may be detached from the substrate due to deformation. If the holding means is detached from the board, when the board warps during the soldering process, electronic parts such as display devices cannot be soldered at a uniform height from the board, and the electronic parts float from the board. End up. In that case, there has been a problem that an electrode of an electronic component such as a display device is detached from a through hole of the substrate or an incomplete bonding of the electrode occurs, resulting in a substrate failure.

  The present invention has been made against the background of the above-described problems, and reduces soldering defects caused by the holding means coming off the substrate during the soldering process.

  The method of manufacturing an electronic component unit according to the present invention includes a holding unit that has a claw portion that is locked to a substrate and holds the display device on an upper surface portion, and the display device is placed on the substrate via the holding unit. A method of manufacturing an electronic component unit to be attached, the step of locking the claw portion of the fixing means to which the display device is attached to the substrate, and the conveyance direction of the substrate in a flow soldering step Inserting a solder fixing component into a through hole formed in the substrate so as to sandwich a pedestal formed on the fixing means between the upper surface of the substrate and the upper surface of the substrate; And soldering the lower surface of the substrate in which the solder fixing component is inserted into the hole.

  According to the present invention, even if the claw portion of the holding means for attaching the display device to the substrate is melted by the heat of the solder during the soldering process, the holding means attaches the solder fixing component before the claw portion is melted. And soldered to the board. For this reason, it is possible to reduce soldering defects due to the holding means being detached from the substrate during the soldering process.

2 is a plan view of the electronic component unit according to Embodiment 1. FIG. 1 is a schematic cross-sectional view of an electronic component unit according to Embodiment 1. FIG. 1 is a perspective view of an electronic component unit according to Embodiment 1. FIG. It is an enlarged view of the A section of FIG. 3 is a perspective view of a solder fixing component 5 according to Embodiment 1. FIG. It is the perspective view which looked at the heating cooker which concerns on Embodiment 2 from the front. It is the perspective view which looked at the state which opened the door of the heating cooker which concerns on Embodiment 2 from the front. It is a perspective view which removes an exterior board from the heating cooker which concerns on Embodiment 2, and shows an internal structure. It is an enlarged view of the B section of FIG. It is a schematic sectional drawing in the front-back direction of the state which removed the exterior board from the heating cooker which concerns on Embodiment 2. FIG. It is a schematic sectional drawing which shows the internal structure of the door of the heating cooker which concerns on Embodiment 2. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, this invention is not limited by the form of drawing shown below. Further, in the following description, terminology indicating directions (for example, “up”, “down”, “right”, “left”, “front”, “back”, etc.) is used as appropriate, This is for explanation and these terms do not limit the present invention. Moreover, in each figure, the same code | symbol is attached | subjected to the same structure. Moreover, in each figure, in order to simplify a drawing, description of some components may be abbreviate | omitted.

Embodiment 1 FIG.
FIG. 1 is a plan view of the electronic component unit according to the first embodiment. FIG. 2 is a schematic cross-sectional view of the electronic component unit according to the first embodiment. FIG. 3 is a perspective view of the electronic component unit according to the first embodiment. FIG. 4 is an enlarged view of a portion A in FIG. In the electronic component unit 10 of the first embodiment, an electronic component such as the display device 2 is soldered to the substrate 1. In FIG. 2, the solder tank 80 and the solder jet 81 are illustrated together, and the conveyance direction of the substrate 1 in the soldering process is indicated by an arrow.

  The electronic component unit 10 includes a substrate 1, a display device 2, and a holding unit 3 that fixes the display device 2 to the substrate 1. The board | substrate 1 is comprised by adhere | attaching copper foil on paper phenol material, for example. The display device 2 displays information such as setting information of an electric device such as a cooking device, an operating state of the electric device, and guidance information for a user. In the first embodiment, an example in which the display device 2 is a liquid crystal device is shown. However, the specific configuration of the display device 2 is not limited to the liquid crystal device, and for example, an organic EL device may be provided as the display device 2. The holding means 3 is a molded part made of a resin material such as PET or ABS, and holds the display device 2 at a predetermined position on the substrate 1. In the first embodiment, the holding means 3 is a thin box-like member having the same planar shape as the display device 2, holds the display device 2 on its own upper surface, and holds the substrate 1 on its lower portion. Hold. The holding means 3 may be any means as long as it can hold the display device 2, and its specific shape is not limited to a thin box shape. For example, the holding unit 3 may be a frame-like member that holds the outer periphery of the display device 2.

  As shown in FIGS. 2 and 4, the holding means 3 includes a claw portion 4 as a locking portion that positions and holds itself with respect to the substrate 1. As shown in FIG. 2, the claw portion 4 protrudes downward from the lower surface of the holding means 3 (the surface on the side facing the substrate 1) and has a tip formed in a bowl shape. The holding means 3 is positioned on the substrate 1 by the portion being caught on the lower surface of the substrate 1.

  The electronic component unit 10 is placed so as to straddle the pedestal 6 provided on the holding means 3 and the pedestal 6 as a configuration for soldering and fixing the holding means 3 to the substrate 1. And a solder fixing component 5 penetrating from the upper surface to the lower surface of the substrate 1. The pedestal 6 and the solder fixing parts 5 are provided in a number corresponding to each one-to-one.

Here, the solder fixing component 5 will be described.
FIG. 5 is a perspective view of the solder fixing component 5 according to the first embodiment. As shown in FIG. 5, the solder fixing component 5 is a gate-shaped (inverted U-shaped) member made of, for example, a metal wire, and includes a pair of leg portions 51 and one end portion of the pair of leg portions 51. It consists of the connection part 52 which connects mutually. In the present embodiment, a jumper wire is used as the solder fixing component 5.

The description of the electronic component unit 10 will be continued with reference to FIGS.
The pedestal 6 provided on the side surface of the holding means 3 is a plate-like member that protrudes outward from the side surface of the holding means 3. As shown in FIGS. 2 to 4, the lower surface of the pedestal 6 contacts the upper surface of the substrate 1 in a state where the holding means 3 is placed on the substrate 1. A through hole 7 into which a pair of leg portions 51 of the solder fixing component 5 is inserted is formed in the substrate 1 at each position where the pedestal 6 is disposed, and the connection portion 52 straddles the pedestal 6. In this manner, the leg portion 51 of the solder fixing component 5 is inserted into the through hole 7. In the first embodiment, two pairs of through-holes 7a and 7b having different pitches between holes as a pair are provided for one pedestal 6. Solder fixing components 5a and 5b having different lengths of the connecting portions 52 can be inserted into the through holes 7a and 7b, respectively. In the present specification, the through holes 7a and 7b may be collectively referred to as the through hole 7, and the solder fixing parts 5a and 5b may be collectively referred to as the solder fixing part 5.

  In a state where the pedestal 6 is disposed between the pair of through holes 7, the legs 51 of the solder fixing component 5 are inserted into the through holes 7 from above the pedestal 6, and the connection parts 52 are placed on the pedestal 6, which will be described later. As described above, the holding means 3 is fixed to the substrate 1 via the solder fixing component 5 by soldering the solder fixing component 5 on the back surface of the substrate 1.

  As shown in FIG. 2, the claw portion 4 of the holding means 3 is arranged around the pedestal 6 on which the solder fixing component 5 is placed and behind the pedestal 6 in the conveying direction of the substrate 1 during soldering. ing. Further, the claw portion 4 and the pedestal 6 are respectively provided at both ends in the longitudinal direction of the holding means 3.

  The display device 2 is provided with a plurality of display unit electrodes 8, and each of these display unit electrodes 8 is inserted into a display unit electrode through hole 9 formed in the substrate 1, and the upper surface of the substrate 1 (the display device 2 It is inserted downward from the surface on which it is placed.

  Next, a method for manufacturing the electronic component unit 10 according to Embodiment 1 will be described. Below, the case where the soldering process by what is called a flow soldering system is performed is demonstrated to an example with reference to FIG.

  Prior to the soldering process, the display device 2 is attached to the upper surface side of the holding means 3. And the nail | claw part 4 of the holding means 3 is latched by the predetermined site | part of the board | substrate 1. FIG. In addition, the display unit electrode 8 of the display device 2 is inserted into the display unit electrode through hole 9 formed in the substrate 1, and the electrodes of other electronic components are also inserted into the through holes formed in the substrate 1. The Further, the pair of leg portions 51 of the solder fixing component 5 is inserted into the through hole 7 so that the solder fixing component 5 straddles the base 6 of the holding means 3. In this way, the display device 2, the holding means 3, and the solder fixing component 5 are attached to the substrate 1 (temporarily fixed state), and the process proceeds to the soldering process.

As shown in FIG. 2, the solder bath 80 is heated until the solder is in a liquid state, and a jet 81 is generated on the surface of the solder in the solder bath 80.
The substrate 1 is held by an arbitrary conveying means (not shown) such that the surface (lower surface) opposite to the surface on which the display device 2 is disposed faces the solder bath 80, as shown in FIG. As indicated by the arrow, the sheet is conveyed in the upper right direction along the longitudinal direction of the holding means 3.

  When the board | substrate 1 is conveyed on the solder tank 80, the jet 81 of the solder which has arisen in the solder tank 80 is sprayed on the lower surface of the board | substrate 1, and the display part electrode of the solder fixing component 5 and the display apparatus 2 Lead wires such as 8 are soldered to the lower surface of the substrate 1. That is, in the step of soldering the display unit electrode 8 of the display device 2 and the electrodes of other electronic components to the substrate 1, the solder fixing component 5 is soldered simultaneously with the soldering of the display unit electrode 8 and the like, and the holding means 3 is fixed. It is fixed to the substrate 1.

  In the first embodiment, the claw portion 4 of the holding means 3 is arranged on the rear side (downstream side) of the solder fixing component 5 in the transport direction of the substrate 1 in the soldering process. That is, the solder fixing component 5 is disposed on the front side (upstream side) of the claw portion 4 in the conveyance direction of the substrate 1. For this reason, before the nail | claw part 4 is exposed to the jet 81 of solder, and it melt | dissolves with the heat | fever of solder and loses a positioning and holding | maintenance function, the leg part 51 of the solder fixing component 5 on the lower surface side of the board | substrate 1 1 is soldered. Then, on the upper surface side of the substrate 1, the pedestal 6 is sandwiched between the substrate 1 and the connection portion 52 of the solder fixing component 5, whereby the holding means 3 is fixed to the substrate 1. Therefore, it is possible to suppress the holding means 3 from coming off or floating from the substrate 1 in the soldering process.

  As in the prior art, when the claw portion 4 of the holding means 3 is deformed or melted by the heat of the solder in the soldering process and the holding means 3 is not positioned and held with respect to the substrate 1, the holding means 3 is moved to the substrate 1. In some cases, the holding means 3 may be lifted from the substrate 1. As a result, the display unit electrode 8 of the display device 2 is detached from the display unit electrode through-hole 9 of the substrate 1 or is incompletely bonded, resulting in a defective substrate. In addition, the holding means 3 floating from the substrate 1 and the display device 2 held by the holding means 3 may be rubbed against another device or the like in the soldering process.

  However, in the first embodiment, since the solder fixing component 5 is arranged upstream of the claw portion 4 in the conveying direction of the substrate 1 in the soldering process, before the claw portion 4 is deformed and melted. In addition, the holding means 3 of the display device 2 can be fixed to the substrate 1 by soldering. Accordingly, it is possible to reduce substrate defects caused by the display unit electrode 8 of the display device 2 being detached from the through-hole 7 of the substrate 1 or being incompletely bonded, and the display device 2 and other electronic components can be stabilized. It can be soldered to the substrate 1.

Further, according to the first embodiment, since the substrate 1 and the holding means 3 are stably fixed during the soldering process, the warpage of the substrate 1 due to the heat of the solder or the like can be suppressed.
Furthermore, in this Embodiment 1, since it fixed to the board | substrate 1 via the solder fixing component 5 in the both ends of the longitudinal direction of the holding means 3, the curvature of the board | substrate 1 can be suppressed. Therefore, since the curvature of the electronic component unit 10 is suppressed, the electronic component unit 10 can be arranged in a narrow space with little space.

  In the first embodiment, since the holding means 3 is soldered to the substrate 1 via the gate-shaped solder fixing component 5, for example, when the electronic component unit 10 is replaced or repaired or discarded, the soldering device 3 is soldered. The holding means 3 can be easily removed from the substrate 1 by cutting the leg portions 51 of the fixed component 5.

  In addition, since the substrate 1 is provided with a plurality of types of through holes 7a and 7b having different pitches between the pair of holes, for example, the holding means 3 can be fixed by replacing or repairing an electronic component (not shown) mounted on the substrate 1. Once removed, the display device 2 can be reattached to the substrate 1 by reusing the same substrate 1 and holding means 3. For example, if the holding means 3 is first fixed by a combination of the through hole 7a and the solder fixing component 5a, when reattaching, as shown in FIG. 4, the through hole 7b has a different pitch from the through hole 7a. The solder fixing component 5b having a pitch different from that of the solder fixing component 5a is inserted. Then, soldering is performed on the lower surface of the substrate 1. By doing so, the holding means 3 can be fixed to the substrate 1 again. Thereby, the repair cost and disposal cost of the electronic component unit 10 can be reduced, and the environmental load regarding disposal can be reduced.

  In the first embodiment, the example in which the jumper wire shown in FIG. 5 is used as the solder fixing component 5 is shown. However, other electronic components such as a resistor having a pair of lead wires corresponding to the legs 51 (see FIG. (Not shown) may be used as the solder fixing component 5, and the same effect can be obtained. Further, a solder fixing component 5 made of an electronic component (not shown) such as a jumper wire or a resistor to which the holding means 3 is soldered may be used as a component constituting the circuit of the substrate 1. By doing in this way, since a dedicated component for fixing the holding unit 3 to the substrate 1 is not used, the number of components can be reduced, and the holding unit 3 can be efficiently fixed to the substrate 1. .

  Although not shown, in mounting the solder fixing component 5 and an electronic component (not shown) such as a resistor, the substrate 1 is inserted using a substrate component automatic insertion device such as an axial component mounting device or a radial component mounting device. You can implement them. If such a board component automatic insertion device is specified, the legs 51 of the solder fixing parts 5 and the lead wires of the electronic parts are automatically clinched to the board 1 and may be subjected to vibration before soldering. However, it is difficult to remove from the through hole 7 of the substrate 1. In addition, it is possible to reduce the mounting time of components on the substrate 1.

Embodiment 2. FIG.
In the second embodiment, an example in which the electronic component unit 10 shown in FIG. 1 is applied to a cooking device will be described.

FIG. 6 is a perspective view of the heating cooker according to the second embodiment as viewed from the front. FIG. 7: is the perspective view which looked at the state which opened the door of the heating cooker which concerns on Embodiment 2 from the front. FIG. 8 is a perspective view showing the internal structure by removing the exterior plate from the heating cooker according to the second embodiment. FIG. 9 is an enlarged view of a portion B in FIG. FIG. 10 is a schematic cross-sectional view in the front-rear direction with the exterior plate removed from the heating cooker according to the second embodiment. FIG. 11 is a schematic cross-sectional view showing the internal structure of the door of the heating cooker according to the second embodiment.
In addition, in FIGS. 6-11, in order to simplify a drawing, the lead wire for electrical connection and the screw which fixes components may be abbreviate | omitted.

  The heating cooker 100 has a main body 11 formed in a rectangular parallelepiped shape, for example, and the front surface of the main body 11 is an opening 12. The opening 12 is covered with a door 13 having a window 14 and a handle 15 and attached to the main body 11 via a hinge 69 so as to be freely opened and closed. A front plate 12a is attached to the front surface of the main body 11 and around the opening 12, and when the door 13 is closed, the inner surface of the door 13 comes into contact with the front plate 12a. The main body 11 has an outer surface covered with an exterior plate 16, and a heating chamber 17 is formed inside the main body 11. The heating chamber 17 is formed in a box shape by a bottom plate 181, left and right side plates 182, a rear plate 183, and a top plate 184. The bottom plate 181, the left and right side plates 182, the rear plate 183, and the top plate 184 that form the heating chamber 17 may be collectively referred to as a face material 18. As the face material 18, for example, a steel plate having a self-cleaning layer having a self-cleaning function formed on the surface, or a steel plate having a surface coated with a fluorine coating having excellent antifouling properties can be suitably used.

  Inside the door 13, as shown in FIG. 11, the electronic component unit 10 shown in the first embodiment is arranged. In the present embodiment, an operation unit 19 having buttons or switches is mounted on the substrate 1 of the electronic component unit 10 in addition to the display device 2, and the electronic component unit 10 is used as an operation display unit and an operation input unit. It has the function of As shown in FIG. 6, the display device 2 and the operation unit 19 are arranged on the door 13 side by side with the window 14, and the display device 2 and the operation unit 19 are visually recognized from the front side. In the second embodiment, the display device 2 displays a cooking mode setting, a cooking time setting, a cooking state such as a display at the time of menu selection, and information necessary for guidance to the user.

  The heating cooker 100 according to the second embodiment has a plurality of high-frequency heating units 30 including a top heating unit 20, a bottom heating unit 21, a magnetron 31, and a convection unit 40 as heating means for heating the heating chamber 17. Various types of heating means are provided.

First, the upper heating unit 20 and the lower heating unit 21 will be described.
As shown in FIGS. 8 and 10, an upper heating unit 20 that heats the inside of the heating chamber 17 from above is provided above the top plate 184. The upper heating unit 20 is, for example, a flat heater (a heater that is wound around mica or the like and further sandwiched between mica and insulated) disposed in close contact with the outer surface of the top plate 184. The top plate 184 is provided with an upper diaphragm portion 185 that is recessed upward so as to suppress thermal deformation and uniformly heat the top plate 184.

  Further, as shown in FIG. 10, a lower heating unit 21 that heats the inside of the heating chamber 17 from below is provided below the bottom plate 181. The lower heating section 21 is, for example, a sheathed heater (a metal pipe sealed with an insulating powder through a heater wire). A lower diaphragm 186 that is recessed downward is formed below the bottom plate 181, and the lower heating section 21 is disposed in a space formed on the lower diaphragm 186.

  Next, the high frequency heating unit 30 will be described. In the heating chamber 17, so-called microwave heating can be performed in which the object to be heated is dielectrically heated using the high-frequency heating unit 30 as a heating source. As shown in FIG. 8, the high-frequency heating unit 30 is provided in an electric chamber 32 formed in the main body 11, and a magnetron 31 that oscillates a high frequency (microwave) of 2.45 GHz. And a magnetron driving power supply means 33 for supplying driving power to the magnetron 31. As shown in FIG. 10, an antenna 34, a waveguide 35 for propagating microwaves oscillated from the magnetron 31 to the antenna 34, and an antenna motor 36 are provided below the heating chamber 17. The antenna 34 is attached to the rotation shaft of the antenna motor 36 and is driven by the antenna motor 36 to rotate the antenna 34.

  As shown in FIG. 10, the antenna 34 is disposed in a space formed on the lower diaphragm 186, and the mounting plate 37 is covered with the lower diaphragm 186 and the antenna 34. Has been placed. The mounting plate 37 is made of a material such as a dielectric material (for example, ceramic) that allows microwaves to pass therethrough. The mounting plate 37 is fixed to the upper portion of the lower diaphragm 186 with a silicon adhesive or the like. The microwave oscillated from the magnetron 31 is radiated from the antenna 34 into the heating chamber 17 through the mounting plate 37. At this time, the antenna 34 is driven to rotate by the antenna motor 36. The magnetron 31, the magnetron driving power supply means 33 and the like are cooled by an upper cooling fan 38 and a lower cooling fan 39 provided in the electric chamber 32.

  Next, the convection unit 40 will be described. The convection unit 40 is a heating unit that circulates heated air in the heating chamber 17 and heats the object to be heated contained in the heating chamber 17 and the heating chamber 17. As shown in FIG. 10, a convection heating chamber 41 formed outside the rear plate 183 of the heating chamber 17 includes a rod-like hot air circulation heater 42 made of, for example, a quartz tube heater and a fan made of, for example, a centrifugal fan. 43, a motor 44 that drives the fan 43, an upper pulley 45, a lower pulley 46, and a belt 47 that transmit the rotational force of the motor 44 to the fan 43, and a heat shield unit that suppresses heat leakage to the outside of the main body 11. 48. A lower pulley 46 is connected to the rotating shaft of the motor 44, an upper pulley 45 is connected to the rotating shaft of the fan 43, and a belt 47 is stretched between the upper pulley 45 and the lower pulley 46, The fan 43 also rotates with the rotation of the rotation shaft of the motor 44.

  The air in the convection heating chamber 41 heated by the hot air circulation heater 42 is sent into the heating chamber 17 by the fan 43 and heats the object to be heated accommodated in the heating chamber 17 through an air hole (not shown). Return to the convection heating chamber 41. Thus, air circulates in the heating chamber 17 and the convection heating chamber 41. In addition, the kind and shape of the heater and fan used for each part of the convection unit 40 are not limited to those shown in the figure, and those that exhibit their functions can be selected as appropriate.

Next, a structure related to the opening and closing of the door 13 in which the electronic component unit 10 is built will be described.
As shown in FIG. 8, a pair of left and right arms 60 that support both left and right ends of the door 13 are provided on both the left and right sides of the main body 11. One end of the arm 60 protrudes from the arm moving hole 64 formed in the front plate 12 a toward the outside of the main body 11, and the door 13 is attached to one end of the protruding arm 60.

  As shown in FIG. 9, on one end side of the arm 60, a hook-like door engaging portion 61 that is locked to a pin 66 protruding from the side portion of the door 13 is formed. The other end side of the arm 60 has a shape along the outer peripheral portion of the roller 65 disposed on the roller fixing base 68 in the main body 11, and the main body side engaging portion placed on the roller 65. 62 and a spring locking portion 63 to which a spring 67 that biases the door 13 in the closing direction is connected.

  When the handle 15 of the door 13 is pulled out, the door 13 rotates in the vertical direction (vertical direction) with a hinge 69 that supports the lower portion of the door 13 as a fulcrum. Accordingly, the door engaging portion 61 locked to the pin 66 of the door 13 is pulled out in the opening direction of the door 13, the main body side engaging portion 62 moves on the roller 65, and the arm 60 moves to the main body 11. Move toward the front. Since the arm 60 is urged in the closing direction of the door 13 by the spring 67 and moves along the upper surface of the roller 65, the door 13 can perform a smooth opening / closing operation. When the door 13 is fully opened, as shown in FIG. 8, the movement of the door 13 in the opening direction is restricted by the arm 60, and the door 13 is held in a substantially horizontal state.

  The main body 11 includes door opening / closing detection means (not shown) for detecting the open / closed state of the door 13 and an oscillation stop device (not shown) for stopping heating by the high-frequency heating unit 30 when the door 13 is opened. The heating by the high frequency heating unit 30 is stopped in conjunction with the opening operation of the door 13.

As described above, in the second embodiment, the electronic component unit 10 on which the operation unit 19 and the display device 2 are mounted is disposed inside the door 13 that covers the opening on the front surface of the heating cooker 100. The inside of the door 13 having a relatively small space can be effectively used.
Further, in the electronic component unit 10 configured as shown in the first embodiment, both ends in the longitudinal direction of the holding means 3 are fixed to the substrate 1, and warpage of the substrate 1 and the electronic component unit 10 itself is suppressed. Therefore, the increase in the thickness of the door 13 by accommodating the electronic component unit 10 in the door 13 can be suppressed, and the cooking device 100 including the slim door 13 can be provided.

  Further, in the electronic component unit 10 configured as shown in the first embodiment, the display unit electrode 8 of the display device 2 and the electrode (not shown) of the operation unit 19 float from the substrate 1 or cause incomplete bonding. Therefore, it is possible to reduce defects in the heating cooker 100 caused by defects in the electronic component unit 10.

  In the second embodiment, an example in which the electronic component unit 10 is attached to the inside of the door 13 has been described. However, an operation unit storage unit in which the button or switch wiring of the operation unit 19 is stored around the heating chamber 17. And the electronic component unit 10 may be disposed in the operation unit storage unit. By doing in this way, the effect similar to the above can be acquired, and the accommodating part to which the operation part 19 is attached can be reduced in thickness.

  Moreover, in this Embodiment 2, although the example which attached the electronic component unit 10 of Embodiment 1 to what is called a microwave-type heating cooker 100 was shown, the specific example of the heating cooker to which the electronic component unit 10 is attached is shown. The configuration is not limited to the above. For example, the electronic component unit 10 can be attached to the rice cooker. In that case, the electronic component unit 10 can be attached to the lid of the rice cooker or the front side of the rice cooker body. Moreover, the electronic component unit 10 can also be mounted on a heating cooker that heats an object to be heated such as a pan placed on the top plate. In this case, for example, the display device 2 is mounted on the top plate. The electronic component unit 10 can be arranged so as to be visually recognized. Anyway, since the electronic component unit 10 of Embodiment 1 can be arrange | positioned in a comparatively narrow space, a heating cooker can be reduced in size, without impairing productivity and design property.

  DESCRIPTION OF SYMBOLS 1 Board | substrate, 2 Display apparatus, 3 Holding means, 4 Claw part, 5 Solder fixing component, 5a Solder fixing component, 5b Solder fixing component, 6 Base, 7 Through hole, 7a Through hole, 7b Through hole, 8 Display part electrode, 9 Display part electrode through hole, 10 Electronic component unit, 11 Main body, 12 Opening part, 12a Front plate, 13 Door, 14 Window, 15 Handle, 16 Exterior plate, 17 Heating chamber, 18 Face material, 19 Operation part, 20 Upper heating unit, 21 Lower heating unit, 30 High frequency heating unit, 31 Magnetron, 32 Electric chamber, 33 Magnetron driving power supply means, 34 Antenna, 35 Waveguide, 36 Antenna motor, 37 Mounting plate, 38 Upper cooling fan, 39 Lower cooling fan, 40 Convection unit, 41 Convection heating chamber, 42 Hot air circulation heater, 43 Fan, 4 Motor, 45 Upper pulley, 46 Lower pulley, 47 Belt, 48 Heat shield unit, 51 Leg part, 52 Connection part, 60 arm, 61 Door engagement part, 62 Body side engagement part, 63 Spring locking part, 64 arm Movement hole, 65 rollers, 66 pins, 67 springs, 68 roller fixing base, 69 hinge, 80 solder bath, 81 jet, 100 heating cooker, 181 bottom plate, 182 side plate, 183 rear plate, 184 top plate, 185 top aperture Part, 186 Lower diaphragm part.

Claims (6)

A method of manufacturing an electronic component unit having a claw portion that is locked to a substrate and holding means for holding a display device on an upper surface portion, wherein the display device is mounted on the substrate via the holding means,
Locking the claw portion of the holding means to which the display device is attached to the substrate;
A through-hole formed in the substrate so as to sandwich a pedestal formed in the holding means between the upper surface of the substrate and the upper surface of the substrate in front of the claw portion in the conveyance direction of the substrate in the flow soldering process. Inserting solder fixing parts into the holes;
And a step of soldering the lower surface of the substrate in which the solder fixing component is inserted into the through hole. An electronic component unit comprising holding means for holding a display device on an upper surface portion, wherein the display device is attached to a substrate via the holding means,
The holding means is
A claw portion locked to the substrate;
It has two sets of pedestals that protrude toward the sides ,
Holding the respective pedestals between itself and the substrate on the upper surface side of the substrate, and comprising a solder fixing component soldered to the substrate on the lower surface side of the substrate ,
One of the two sets and the other set are provided at a position sandwiching the display device,
In the direction in which the two sets are arranged, the pedestals of the one set, the claw portions of the one set, the pedestals of the other set, and the claw portions of the other set are arranged in this order. A featured electronic component unit. Wherein one set of said base is provided at one longitudinal end portion of said holding means, according to claim 2, characterized in that the other end the other set of the pedestal portion provided Electronic component unit. Cooking device including an electronic component unit according to claim 2 or claim 3. A heating chamber is formed inside, and a main body in which an opening through which an object to be heated is taken in and out is formed.
A door for opening and closing the opening of the main body,
The cooking device according to claim 4 , wherein the electronic component unit is housed in a housing portion formed in the door. A heating chamber is formed inside, and a main body in which an opening through which an object to be heated is taken in and out is formed.
An operation unit storage unit that is formed in the main body separately from the heating chamber and stores a wiring of an operation unit that receives an operation input,
The cooking device according to claim 4 , wherein the electronic component unit is accommodated in the operation portion accommodating portion.

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