JP5998879B2 - Power generator - Google Patents

Description

  The present invention relates to a power generator.

  Recently, a power generation apparatus that attaches to a vibrating body such as a machine and generates power using vibration has attracted attention.

  A vibration unit is provided inside the power generation apparatus, and power generation is performed using the vibration of the vibration unit.

  The electric power obtained by such a power generation apparatus can be expected to be used as a power source for electronic devices, for example.

JP 2009-296734 A

  However, such a power generator cannot always obtain a sufficiently stable output.

  An object of the present invention is to provide a power generator having a stable output.

According to one aspect of the embodiment, a first substrate having a recess, an insulating layer formed on the first substrate in the recess, and a plurality of parallel layers formed on the insulating layer A lower electrode including a conductive pattern; and a common conductive pattern commonly connecting one end of the plurality of conductive patterns, wherein the plurality of conductive patterns and the common conductive pattern are formed in a comb shape. 1 is a second structure having a structure, a support formed by a through-opening formed in the second substrate, a vibration part, a spring part, and an amplitude suppressing member, The planar shape of the portion is a frame shape, the vibrating portion is provided in the frame-shaped support portion, the planar shape of the vibrating portion is a rectangle, and the vibrating portion has a plurality of conductive patterns formed in a stripe shape. The plurality of conductive layers The longitudinal direction of the turn is a direction orthogonal to the direction of displacement when the vibration part vibrates, the spring part is disposed between the vibration part and the support part, and the spring part is Four plate-like bodies are combined in a rhombus shape, and the in-plane direction of the plate-like body forming the spring portion is a normal direction of the main surface of the second substrate, and the amplitude suppression The member has a second structure disposed so as to be in contact with the vibration part within a range in which the vibration part can be displaced, and the first structure and the second structure, Are joined such that the plurality of conductive patterns included in the lower electrode of the first structure and the plurality of conductive patterns included in the upper electrode of the second structure face each other. A measuring device is provided.

  According to the disclosed power generation device, since the amplitude suppressing member that is arranged so as to be in contact with the vibrating portion and suppresses the amplitude of the vibrating portion is provided, the vibrating body can be vibrated with a stable amplitude, and the output It is possible to provide a stable power generator.

FIG. 1 is a cross-sectional view showing a power generator according to the first embodiment. It is a graph (the 1) which shows an amplitude characteristic. It is a graph (the 2) which shows an amplitude characteristic. FIG. 4 is a process diagram (part 1) illustrating the method for manufacturing the power generation device according to the first embodiment. FIG. 5 is a process diagram (part 2) illustrating the method for manufacturing the power generation device according to the first embodiment. FIG. 6 is a cross-sectional view illustrating a power generation device according to a first modification of the first embodiment. FIG. 7 is a cross-sectional view showing a power generator according to a modification (No. 2) of the first embodiment. FIG. 8 is a cross-sectional view showing the power generator according to the second embodiment. FIG. 9 is a cross-sectional view showing a power generator according to the third embodiment. FIG. 10 is a diagram (part 1) illustrating a part of the power generation device according to the third embodiment. FIG. 11: is a figure (the 2) which shows a part of electric power generating apparatus by 3rd Embodiment. FIG. 12 is a plan view showing a state in which the vibrating body is displaced. FIG. 13: is process drawing (the 1) which shows the manufacturing method of the electric power generating apparatus by 3rd Embodiment. FIG. 14 is a process diagram (part 2) illustrating the method for manufacturing the power generation device according to the third embodiment. FIG. 15 is a process diagram (part 3) illustrating the method for manufacturing the power generating device according to the third embodiment. FIG. 16 is a process diagram (part 4) illustrating the method for manufacturing the power generating device according to the third embodiment. FIG. 17 is a process diagram (part 5) illustrating the method for manufacturing the power generating device according to the third embodiment. FIG. 18 is a process diagram (part 6) illustrating the method for manufacturing the power generation device according to the third embodiment. FIG. 19 is a process diagram (part 7) illustrating the method for manufacturing the power generating device according to the third embodiment. FIG. 20 is a cross-sectional view showing a power generator according to the fourth embodiment. FIG. 21 is a diagram (part 1) illustrating a part of the power generation device according to the fourth embodiment. FIG. 22 is a diagram (part 2) illustrating a part of the power generation device according to the fourth embodiment.

  In the power generation device that vibrates the vibration part by the vibration from the outside and generates power using the vibration of the vibration part, the output greatly fluctuates according to the fluctuation of the frequency of the external vibration, and is not always sufficiently stable. No output was obtained.

  As a result of intensive studies, the inventors of the present application have come up with the idea of providing a power generator with stable output as follows.

[First Embodiment]
A power generation apparatus and a manufacturing method thereof according to the first embodiment will be described with reference to FIGS.

(Power generation device)
First, the power generator according to the present embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is a cross-sectional view showing the power generator according to the present embodiment.

  As illustrated in FIG. 1, the power generation device (vibration power generation device) according to the present embodiment includes a housing 10, a vibration unit 14 including a magnetostrictive member 12, and magnetic field application members 16 a and 16 b that apply a magnetic field to the magnetostrictive member 12. And a coil 18 wound around the magnetostrictive member 12.

  The housing 10 includes a tubular member 10a, a plate-like member 10b attached to one opening of the tubular member 10a, and a plate-like member 10c attached to the other opening of the tubular member 10a. And have. As the tubular member 10a, for example, a square tubular member is used. The plate-like members 10b and 10c are attached to the openings of the tubular member 10a, for example, with an adhesive. For example, an epoxy adhesive or a cyanoacrylate adhesive is used as the adhesive. As a material of the housing 10, for example, polycarbonate, fiber reinforced plastics (FRP), or the like is used. The outer dimension of the housing 10 is, for example, about 1 cm × 2 cm × 10 cm. The thickness (wall thickness) of the housing 10 is, for example, about 2 mm.

  A plate-like vibrating portion (vibrating body, vibrating member) 14 is disposed inside the housing 10. The vibration part 14 is supported by a housing (support body, support part) 10 in a cantilever structure. Specifically, one end portion (fixed end) of the vibration portion 14, that is, the base side of the cantilever structure is fixed to the plate-like member 10 b in the housing 10. The other end (movable end) of the vibration unit 14, that is, the front end side of the cantilever structure is not fixed to the housing 10 and can be displaced in the thickness direction of the vibration unit 14. Thus, the vibration part 14 is supported by the support part 10 so that vibration is possible.

  Fixing of the fixed end of the vibration portion 14 to the support portion 10 is reinforced by a reinforcing member 20. As the reinforcing member 20, for example, a reinforcing member having an L-shaped cross section is used. The reinforcing members 20 are arranged on both sides in the thickness direction of the vibration part. Since the reinforcing member 20 is provided, the fixed end side of the vibrating portion 14 can be reliably fixed to the support portion 10.

  For example, an adhesive (not shown) is used to fix the vibration unit 14 and the reinforcing member 20. For example, an epoxy adhesive or a cyanoacrylate adhesive is used as the adhesive.

  The vibration part 14 includes a tough member (tough layer, tough plate) 22 and a magnetostrictive member (magnetostrictive layer, magnetostrictive plate) 12 bonded to the tough member 22. The tough member 22 is for stably vibrating the magnetostrictive member 12 without causing damage to the magnetostrictive member 12.

  The material of the magnetostrictive member 12 is relatively brittle. For this reason, when the vibration part 14 is formed only by the magnetostrictive member 12, the magnetostrictive member 12 may be damaged by vibration or the like. In this embodiment, since the magnetostrictive member 12 is supported by the tough member 22, the magnetostrictive member 12 can be vibrated without causing damage to the magnetostrictive member 12.

  The planar shape of the vibration unit 14 is, for example, a rectangle (rectangle). The longitudinal direction of the vibrating portion 14 is the left-right direction on the paper surface in FIG. The length of the vibration part 14, that is, the dimension in the longitudinal direction of the vibration part 14 is, for example, about 8 cm. The width of the vibration part 14, that is, the dimension of the vibration part 14 in the direction orthogonal to the longitudinal direction of the vibration part 14 is, for example, about 7 mm.

  As a material of the magnetostrictive member 12, for example, an Fe—Ga alloy (Galfenol) or the like is used. Galfenol is a material that is relatively brittle.

  The material of the magnetostrictive member 12 is not limited to Galfenol, and any magnetostrictive material can be used as appropriate.

  As the material of the tough member 22, a material having higher toughness than the magnetostrictive member 12 is used. In other words, a material having higher tensile strength than the magnetostrictive member 12 is used as the material of the tough member 22. For example, polycarbonate or the like is used as the material of the tough member 22.

  The vibrating part 14 is preferably formed relatively thin. This is so that even a relatively weak vibration can be vibrated easily. The thickness of the vibration part 14 shall be about 0.7 mm, for example.

  The thickness of the tough member 22 is preferably set to be greater than the thickness of the magnetostrictive member 12. This is because a strain neutral surface that does not generate strain when the vibrating portion 14 is bent is positioned in the tough member 12. When the strain neutral surface is located in the magnetostrictive member 12, a tensile strain and a compressive strain are generated in the magnetostrictive member 12 with the strain neutral surface serving as a boundary. Will be offset. On the other hand, if the thickness of the tough member 22 is set to be greater than the thickness of the magnetostrictive member 12, the strain neutral surface is positioned in the tough member 22. For this reason, when the vibration part 14 bends to the lower side in the drawing in FIG. 1, only the tensile strain is generated in the magnetostrictive member 12. In addition, when the vibrating portion 14 is bent upward in FIG. 1, only the compressive strain is generated in the magnetostrictive member 12. For this reason, when the vibration part 14 bends, it becomes possible to fully change the magnetization intensity of the magnetostrictive member 12. The thickness of the magnetostrictive member 12 is about 0.2 mm, for example. The thickness of the tough member 22 is, for example, about 0.5 mm.

  The magnetostrictive member 12 is bonded to the tough member 22 with an adhesive, for example. For example, an epoxy adhesive or a cyanoacrylate adhesive is used as the adhesive.

  In addition, although the case where the magnetostrictive member 12 and the toughness member 22 are bonded together was demonstrated here as an example, it is not limited to this. For example, the magnetostrictive member (magnetostrictive layer) 12 can be deposited on the tough member 22 by sputtering or the like.

  Here, the case where polycarbonate or the like is used as the material of the tough member 22 has been described as an example, but the material is not limited to this. As a material of the tough member 22, FRP or the like may be used.

  An amplitude suppression member 24 capable of contacting the vibrating portion 14 is attached to the inside of the cylindrical member 10a of the housing 10 within a range in which the vibrating portion 14 can be displaced. The amplitude suppressing member 24 contacts the vibrating portion 14 when the amplitude of the vibrating portion 14 increases to some extent, and suppresses the amplitude of the vibrating portion 14. The amplitude suppressing member 24 is disposed so as to be separated from the vibrating portion 14 by a predetermined dimension in a state where the vibrating portion 14 is not displaced, that is, in a state where the amplitude of the vibrating portion 14 is zero. The amplitude suppression member 24 on the upper side in FIG. 1 is arranged so that the amplitude suppression member 24 and the vibration unit 14 come into contact with each other when the vibration unit 14 is displaced by a predetermined dimension or more on the upper side in FIG. Further, the amplitude suppression member 24 on the lower side of the paper surface of FIG. 1 is arranged so that the amplitude suppression member 24 and the vibration portion 14 come into contact when the vibration portion 14 is displaced by a predetermined dimension or more on the lower side of the paper surface in FIG. ing. The dimension between the vibration part 14 and the amplitude suppression member 24 in a state where the vibration part 14 is not displaced is, for example, about 2 mm. As the amplitude suppressing member 24, an elastic body that can be bent in the vibration direction of the vibrating portion 14 is used. For example, a spring is used as the elastic body 24. As the spring 24, for example, a leaf spring or the like is used. A nonmagnetic material is used as the material of the spring 24. Here, as the material of the spring 24, for example, a spring steel material is used. For example, the amplitude suppression member 24 is disposed on both sides of the vibration unit 14 in the vibration direction. The amplitude suppression member 24 is fixed to the inside of the cylindrical member 10a of the housing 10 by, for example, an adhesive. For example, an epoxy adhesive or a cyanoacrylate adhesive is used as the adhesive. The outer dimension of the amplitude suppressing member 24 is, for example, about 5 mm × 8 cm. The thickness (wall thickness) of the amplitude suppression member 24 is, for example, about 0.5 mm.

  The amplitude suppressing member 24 may not be disposed on both sides in the vibration direction of the vibration unit 14. For example, the amplitude suppression member 24 may be disposed only on one side in the vibration direction of the vibration unit 14.

  Magnetic field applying members 16 a and 16 b for applying a magnetic field to the magnetostrictive member 12 are disposed in the vibrating portion 14. For example, permanent magnets are used as the magnetic field applying members 16a and 16b. As the permanent magnets 16a and 16b, permanent magnets having magnetic anisotropy in the thickness direction are used. The dimensions of the permanent magnets 16a and 16b are, for example, about 6 mm × 6 mm × 4.5 mm. As a material of the permanent magnets 16a and 16b, for example, neodymium or the like is used. The permanent magnets 16a and 16b are disposed, for example, on the movable end side and the fixed end side of the vibration unit 14, respectively. The permanent magnets 16a and 16b have opposite polarities. The permanent magnets 16a and 16b are fixed to the vibration part 14 using an adhesive, for example. The magnet disposed on the movable end side of the vibration unit 14 also functions as a weight. The magnetic flux density of the permanent magnets 16a and 16b is, for example, about 450 to 500 mT.

  Here, the case where the magnetization applying members 16a and 16b are bonded to the vibrating portion 14 has been described as an example, but the present invention is not limited to this. For example, the magnetic field applying members 16a and 16b can be deposited on the vibrating portion 14 by sputtering or the like.

  A coil 18 is disposed around the magnetostrictive member 12. The coil 18 is wound around the cylindrical member 10a of the housing 10. As a material of the coil 18, for example, a copper wire with an insulating film is used.

  The inside of the housing 10 may be vacuum sealed. If the inside of the housing 10 is vacuum-sealed, the attenuation of vibration of the vibration unit 14 is suppressed, so that power generation efficiency can be improved.

  Note that the inside of the housing 10 may be sealed under reduced pressure instead of vacuum sealing. Even when sealed under reduced pressure, it is possible to suppress the vibration attenuation of the vibration part 14.

  Thus, the power generator according to the present embodiment is formed.

  The power generator according to the present embodiment is attached to a vibration source (not shown) such as a machine (not shown) to generate power.

  Since the vibration unit 14 has a cantilever structure as described above, the fixed end side of the vibration unit 14 is fixed, while the movable end side of the vibration unit 14 can move in the thickness direction. For this reason, the vibration part 14 vibrates by the vibration transmitted from the vibration source.

  When the vibration unit 14 vibrates, the magnetostrictive member 12 is elastically deformed, and mechanical strain is applied to the magnetostrictive member 12. A magnetic field is applied to the magnetostrictive member 12 by the magnetization applying means 16a and 16b. When mechanical strain occurs in the magnetostrictive member 12 in a state where a magnetic field is applied, the magnetization intensity in the magnetostrictive member 12 changes. Specifically, when the vibrating portion 14 is bent downward in the drawing and a tensile strain is generated in the magnetostrictive member 12, the magnetic flux density in the magnetostrictive member 12 increases when the magnetostrictive member 12 is a positive magnetostrictive material, for example ( Inverse magnetostriction phenomenon, billari effect). On the other hand, when the vibrating portion 14 is bent upward in the drawing and compressive strain is generated in the magnetostrictive member 12, when the magnetostrictive member 12 is, for example, a positive magnetostrictive material, the magnetic flux density in the magnetostrictive member 12 decreases. As described above, the magnetic flux density in the magnetostrictive member 12 periodically increases and decreases with the vibration of the vibration unit 14. In other words, the magnetostrictive member 12 is elastically deformed with the vibration of the vibration unit 14, and the magnetization in the magnetostrictive member 12 changes periodically.

  When the magnetic flux density in the magnetostrictive member 12 changes, an induced current flows through the coil 18 so as to prevent the magnetic flux density from changing. Since a current flows through the coil 18, power generation can be performed.

  For example, a rectification power storage circuit (not shown) is connected to both ends of the coil 18. The rectifying power storage circuit rectifies a current obtained by power generation and stores power. The stored charge can be used as a power source for an electronic device (not shown).

  If the amplitude suppressing member 24 that abuts on the vibrating portion 14 when the amplitude of the vibrating portion 14 becomes larger than a certain level is provided, the reason why the amplitude of the vibrating portion 14 is stabilized is considered as follows.

  That is, in the power generator according to the present embodiment, the following equation of motion (1) is considered to hold. Expression (1) is a differential equation of forced vibration of a vibration system with resistance.

d ² X / dt ² + 2γ · dX / dt + ω ₀ ² X = (F (t) / m) · sin ωX (1)
Here, m is the mass of the magnet 16b functioning as a weight, X = X (t) is a vibration displacement, ω ₀ is a natural frequency, and γ is a damping coefficient. The second term on the left side relates to damping resistance, and the right side is external force vibration.

When the external force is constant, that is, when the equation (1) is transformed with the amplitude when ω = 0 as A ₀ , the following equation (2) is established.

A / A ₀ = {(1-ξ ² ) ² +4 (γ / ω ₀ ) ² } ^−0.5 (2)
Note that ξ = ω / ω ₀ and ω ₀ = √ (K / m).

  When the amplitude suppressing member 24 is not provided, or when the vibrating portion 14 vibrates without coming into contact with the amplitude suppressing member 24, the amplitude characteristic is as shown in FIG.

FIG. 2 is a graph (part 1) showing the amplitude characteristic. The horizontal axis in FIG. 2 indicates the frequency ratio (ω / ω ₀ ), and the vertical axis in FIG. 2 indicates the amplitude ratio (A / A ₀ ).

  As can be seen from FIG. 2, in the case of (I), that is, when the amplitude suppressing member 24 is not provided, or when the vibrating part 14 vibrates without contacting the amplitude suppressing member 24, the frequency ratio. In the range of 0.91 to 1.07, the amplitude ratio is 4 or more.

  It can be considered that the spring constant when the vibration part 14 abuts on the amplitude suppression member 24 is a combination of the spring constant of the vibration part 14 and the spring constant of the amplitude suppression member 24. Assuming that the spring constant when the vibrating portion 14 is in contact with the amplitude suppressing member 24 is (a · K), the following equation (3) is established.

A / A ₀ = {(1-ξ ² ) ² +4 (γ / ω _0a ) ² } ^−0.5 (2)
Note that ξ = ω / ω _0a and ω _0a = √ (a · K / m).

  When the vibration part 14 contacts the amplitude suppressing member 24, that is, when the spring constant is a · K, the amplitude characteristic is as shown in (II) of FIG.

When the vibration portion 14 is set to contact the amplitude suppressing member 24 when the amplitude ratio (A / A ₀ ) is 4 or more, the actual amplitude ratio is as indicated by a dotted line in FIG.

That is, the amplitude ratio (A / A ₀ ) is in the range of 4 or less, that is, the frequency ratio (ω / ω ₀ ) is in the range of 0.91 or less, and the frequency ratio (ω / ω ₀ ) is in the range of, for example, 1 In the range of .07 or more, the amplitude ratio is (I) (see FIGS. 2 and 3).

On the other hand, when the amplitude ratio (A / A ₀ ) is in the range of 4 or more, that is, the frequency ratio (ω / ω ₀ ) is, for example, in the range of 0.99 to 1.07, the amplitude ratio is (II) (FIG. 2 and FIG. 3).

When the frequency ratio (ω / ω ₀ ) is in the range of 0.91 to 0.99, the amplitude ratio (A / A ₀ ) is constant, for example, 4 (see FIG. 3).

Thus, in the present embodiment, a frequency range in which the amplitude ratio (A / A ₀ ) is stable is generated.

Therefore, for example, if the design is made so that the intermediate value of the frequency range in which the amplitude ratio (A / A ₀ ) is stable and the average value of the frequency of the external vibration match, the frequency of the vibration applied from the outside varies to some extent. However, the vibration part 14 can be vibrated with a stable amplitude. Even if the frequency of the external vibration varies to some extent, the vibration unit 14 can be vibrated with a stable amplitude, and thus a power generator with a stable output can be obtained.

(Method for producing power generation device)
Next, the method for manufacturing the power generation device according to the present embodiment will be described with reference to FIGS. 4 and 5 are process diagrams showing the method of manufacturing the power generation device according to the present embodiment. 4A is a perspective view, FIG. 4B is a side view, and FIGS. 4C, 5A, and 5C are cross-sectional views.

  First, the magnetostrictive member 12 and the tough member 22 are bonded together using, for example, an adhesive (see FIG. 4A). As a material of the tough member 22, for example, polycarbonate or the like is used. The dimension of the tough member 22 is, for example, about 7 mm × 8 cm × 0.5 mm. As a material of the magnetostrictive member 12, for example, an Fe—Ga alloy (Galfenol) or the like is used. The dimension of the magnetostrictive member 12 is, for example, about 7 mm × 8 cm × 0.2 mm. As the adhesive, for example, an epoxy adhesive or a cyanoacrylate adhesive is used. Thus, the vibration part 14 including the tough member 22 and the magnetostrictive member 12 is formed.

  In addition, although the case where the magnetostrictive member 12 and the toughness member 22 are bonded together was demonstrated here as an example, it is not limited to this. For example, the magnetostrictive member (magnetostrictive layer) 12 may be deposited on the tough member 22 by sputtering or the like.

  Next, the magnetic field applying members 16a and 16b are bonded to the magnetostrictive layer 12 on the movable end side and the fixed end side of the vibration unit 14 using, for example, an adhesive. For example, permanent magnets are used as the magnetic field applying members 16a and 16b. The dimensions of the permanent magnets 16a and 16b are, for example, about 6 mm × 6 mm × 4.5 mm. As a material of the permanent magnets 16a and 16b, for example, neodymium or the like is used. The permanent magnets 16a and 16b have opposite polarities. The magnetic flux density of the permanent magnets 16a and 16b is, for example, about 450 to 500 mT.

  Next, the pair of reinforcing members 20 are bonded to the plate-like member 10 b that is a part of the housing 10. As the reinforcing member 20, for example, a reinforcing member having an L-shaped cross section is used. The distance between the pair of reinforcing members 20 is equal to the thickness of the vibrating portion 14. As the adhesive, for example, an epoxy adhesive or a cyanoacrylate adhesive is used.

  Next, an adhesive is applied to the location between the pair of reinforcing members 20 or the fixed end side of the vibrating portion 14, and the fixed end side of the vibrating portion 14 is inserted into the location between the pair of reinforcing members 20 ( (Refer FIG.4 (b)).

  Thereafter, when the adhesive is cured, the fixed end side of the vibration portion 14 is securely fixed to the support portion 10.

  Next, the coil 18 is wound around the cylindrical member 10a of the housing 10 (see FIG. 4C). As the tubular member 10a, for example, a square tubular member is used. As a material of the housing 10, for example, polycarbonate, FRP, or the like is used. The outer dimension of the housing 10 is, for example, about 1 cm × 2 cm × 10 cm. The thickness (wall thickness) of the housing 10 is, for example, about 2 mm. As a material of the coil 18, for example, a copper wire with an insulating film is used.

  Next, the amplitude suppressing member 24 is attached to the inside of the cylindrical member 10a of the housing 10 using, for example, an adhesive. As the amplitude suppressing member 24, for example, an elastic body is used. For example, a spring is used as the elastic body 24. As the spring 24, for example, a leaf spring is used. As a material for the spring 24, a nonmagnetic material is used. Here, as the material of the spring 24, for example, spring steel is used. The amplitude suppression member 24 is disposed on both sides in the vibration direction of the vibration unit 14, for example. As the adhesive, for example, an epoxy adhesive or a cyanoacrylate adhesive is used. The outer dimension of the amplitude suppressing member 24 is, for example, about 5 mm × 8 cm. The thickness (wall thickness) of the amplitude suppression member 24 is, for example, about 0.5 mm.

  The amplitude suppressing member 24 may not be disposed on both sides in the vibration direction of the vibration unit 14. For example, the amplitude suppression member 24 may be disposed only on one side in the vibration direction of the vibration unit 14.

  Next, the plate-like member 10b that supports the vibrating portion 14 is bonded to one opening of the cylindrical member 10a using, for example, an adhesive (see FIG. 5A). As the adhesive, for example, an epoxy adhesive or a cyanoacrylate adhesive is used.

  Next, for example, an adhesive is used to bond the plate-like member 10c, which is a part of the housing 10, to the other opening of the cylindrical member 10a (see FIG. 5B). As the adhesive, for example, an epoxy adhesive or a cyanoacrylate adhesive is used. Thus, the housing 10 is formed by combining the tubular member 10a, the plate-like member 10b, and the plate-like member 10.

  Note that the inside of the housing 10 may be vacuum-sealed. Further, the inside of the housing 10 may be sealed under reduced pressure instead of vacuum sealing.

  Thus, the power generator according to the present embodiment is manufactured (see FIG. 1).

  As described above, according to the present embodiment, since the amplitude suppressing member 24 that suppresses the amplitude of the vibrating portion 14 is provided, the vibrating portion 14 can be vibrated with a stable amplitude. Since the amplitude body 14 can be vibrated with a stable amplitude, a power generator with a stable output can be provided.

(Modification (Part 1))
Next, a modification of the power generator according to the present embodiment will be described with reference to FIG. FIG. 6 is a cross-sectional view showing a power generator according to this modification.

  In the power generation device according to this modification, a winding spring is used as the amplitude suppressing member 24a.

  As shown in FIG. 6, an amplitude suppression member 24 a is attached to the inside of the cylindrical member 10 a in the housing 10. In this modification, for example, a wound spring is used as the amplitude suppressing member 24a. As a material of the coil spring 24a, for example, a spring steel material is used. For example, the winding springs 24a are arranged on both sides in the vibration direction of the vibration unit 14, that is, above and below the vibration unit 14, respectively. The coil spring 14 is fixed to the inside of the cylindrical member 10a using, for example, an adhesive. For example, an epoxy adhesive or a cyanoacrylate adhesive is used as the adhesive. The size of the coil spring 24a is, for example, about 1 cm in radius. The height of the coil spring 24a is, for example, about 5 to 6 mm.

  The winding springs 24a are not limited to be disposed on both sides in the vibration direction of the vibration unit 14. For example, the winding spring 24 a may be disposed only on one side in the vibration direction of the vibration unit 14.

  Thus, a winding spring may be used as the amplitude suppressing member 24a. Even when the coil spring 24a is used, the amplitude of the vibrating portion 14 can be suppressed, the vibrating portion 14 can be vibrated with a stable amplitude, and thus a power generator having a stable output can be provided. .

(Modification (Part 2))
Next, a modification of the power generator according to the present embodiment will be described with reference to FIG. FIG. 7 is a cross-sectional view showing a power generator according to this modification.

  In the power generator according to this modification, a material having spontaneous magnetization is used as the material of the tough member 22a.

  In this modification, a ferromagnetic shape memory alloy, a metaferromagnetic shape memory alloy, or the like is used as the material of the tough member 22a. Since the tough member 22 of such a material has spontaneous magnetization, it is not necessary to separately provide the magnetic field applying members 16a and 16b (see FIG. 1) in this modification.

  A weight 26 is provided on the movable end side of the vibration unit 14. As a material of the weight 26, for example, lead or the like is used. The mass of the weight 26 is about 5 g, for example. The weight 26 is fixed to the vibrating portion 14 using, for example, an adhesive.

  Here, the case where the weight 26 is bonded to the vibrating portion 14 has been described as an example, but the present invention is not limited to this. For example, the weight 26 can be deposited by sputtering or the like.

  Although the case where the magnetic field application members 16a and 16b are not provided has been described as an example here, the magnetic field application members 16a and 16b may be provided. If the magnetic field applying members 16a and 16b are provided, a stronger magnetic field can be obtained. When the magnetic field applying members 16a and 16b are provided, it is not necessary to provide the weight 26. This is because the magnetic field application member 16b functions as a weight.

  Thus, a material having spontaneous magnetization may be used as the material of the tough member 22a.

[Second Embodiment]
The power generator according to the second embodiment will be described with reference to FIG. FIG. 8 is a cross-sectional view showing the power generator according to the present embodiment. The same components as those of the power generator according to the first embodiment shown in FIGS. 1 to 7 are denoted by the same reference numerals, and description thereof is omitted or simplified.

  The power generation device (vibration power generation device) according to the present embodiment uses the piezoelectric element 28.

  The housing 10 includes, for example, a tubular member 10a, a plate-like member 10b attached to one opening of the tubular member 10a, and a tubular member, similar to the housing 10 according to the first embodiment. And a plate-like member 10c attached to the other opening of 10a. As a material of the housing 10, for example, polycarbonate, FRP, or the like is used. The outer dimension of the housing 10 is, for example, about 1 cm × 2 cm × 10 cm. The thickness (wall thickness) of the housing 10 is, for example, about 2 mm.

  A vibrating portion 14 a is disposed inside the housing 10. The vibration part 14a is supported by a casing (support body, support part) 10 in a cantilever structure. Thus, the vibration part 14a is supported by the support part 10 so that it can vibrate. The location where the fixed end of the vibration part 14a is fixed to the housing 10 is reinforced by a pair of reinforcing members 20 as in the power generation device according to the first embodiment.

  The vibration part 14 a includes a tough member 22 and a piezoelectric element 28 attached to the tough member 22. The piezoelectric element 28 has a plate-like piezoelectric member (piezoelectric plate, piezoelectric layer) 30 and a pair of electrodes 32 and 34 formed on the principal surfaces on both sides of the piezoelectric member 30. The tough member 22 is for vibrating the piezoelectric member 30 without causing damage to the piezoelectric member 30 of the piezoelectric element 28. The material of the piezoelectric member 30 is relatively brittle. For this reason, when the vibration part 28 is formed only by the piezoelectric member 30 and the electrodes 32 and 34, the piezoelectric member 30 may be damaged by vibration or the like. In the present embodiment, since the piezoelectric member 30 is supported by the tough member 22, the piezoelectric member 30 can be vibrated without causing damage to the piezoelectric member 30.

  The planar shape of the vibration part 14a is, for example, a rectangle. The longitudinal direction of the vibration part 14a is the left-right direction in FIG. The length of the vibration part 14a, that is, the dimension in the longitudinal direction of the vibration part 14a is, for example, about 8 cm. The width of the vibration part 14a, that is, the dimension of the vibration part in the direction orthogonal to the longitudinal direction is, for example, about 7 mm.

As a material of the piezoelectric member 30, for example, Pb (Zr, Ti) O ₃ (PZT, lead zirconate titanate) or the like is used. The thickness of the piezoelectric member 30 is about 0.2 mm, for example.

  As a material for the electrodes 30 and 32, for example, copper or the like is used.

  As the material of the tough member 22, a material having higher toughness than the piezoelectric member 30 is used. In other words, a material having higher tensile strength than the piezoelectric member 30 is used as the material of the tough member 22. For example, polycarbonate or the like is used as the material of the tough member 22.

  The vibrating part 14a is preferably formed relatively thin. This is so that even a relatively weak vibration can be vibrated easily. The thickness of the vibration part 14a is about 0.7 mm, for example.

  The thickness of the piezoelectric member 30 is about 0.2 mm, for example. The thickness of the tough member 22 is, for example, about 0.5 mm.

  The piezoelectric element 28 is bonded to the tough member 22 with an adhesive, for example. For example, an epoxy adhesive or a cyanoacrylate adhesive is used as the adhesive.

  Here, the case where the piezoelectric element 28 is bonded to the tough member 22 has been described as an example, but the present invention is not limited to this. For example, the piezoelectric element 28 can be formed on the tough member 22 by sputtering or the like.

  Here, the case where polycarbonate or the like is used as the material of the tough member 22 has been described as an example, but the material is not limited to this. As a material of the tough member 22, FRP or the like may be used.

  An amplitude suppression member 24 is attached to the inside of the cylindrical member 10a of the housing 10 in the same manner as the power generation device according to the first embodiment. As the amplitude suppression member 24, for example, a leaf spring is used.

  The amplitude suppressing member 24 is not limited to the case where the amplitude suppressing member 24 is disposed on both sides in the vibration direction of the vibration portion 14a. For example, the amplitude suppression member 24 may be disposed only on one side in the vibration direction of the vibration unit 14.

  The amplitude suppressing member 24 is not limited to a leaf spring. Similarly to the power generation device according to the modification (No. 1) of the first embodiment shown in FIG. 6, the winding spring 24 a may be used as the amplitude suppressing member.

  A weight 26 is disposed on the movable end side of the vibrating portion 14a. As a material of the weight 26, for example, lead is used. The mass of the weight 26 is about 5 g, for example. The weight 26 is fixed to the vibrating portion 14a using, for example, an adhesive.

  Here, the case where the weight 26 is bonded to the vibrating portion 14a has been described as an example, but the present invention is not limited to this. For example, the weight 26 can be formed by a sputtering method, a plating method, or the like.

  The inside of the housing 10 may be vacuum sealed or vacuum sealed.

  Thus, the power generator according to the present embodiment is formed.

  As described above, the piezoelectric element 28 may be used. Also in this embodiment, since the amplitude suppressing member 24 that suppresses the amplitude of the vibrating portion 14a is disposed, the vibrating portion 14a can be vibrated with a stable amplitude. Since the amplitude body 14a can be vibrated with a stable amplitude, a power generator with a stable output can be provided.

[Third Embodiment]
A power generation device and a manufacturing method thereof according to the third embodiment will be described with reference to FIGS. The same components as those of the power generation device and the manufacturing method thereof according to the first or second embodiment shown in FIGS. 1 to 8 are denoted by the same reference numerals, and description thereof is omitted or simplified.

  The power generation apparatus according to this embodiment uses an electret 44. That is, the power generator according to the present embodiment is an electret power generator.

(Power generation device)
First, the power generation apparatus (vibration power generation apparatus) according to the present embodiment will be described with reference to FIGS. 9 to 12. FIG. 9 is a cross-sectional view showing the power generator according to the present embodiment. FIG. 10 is a diagram (part 1) illustrating a part of the power generation device according to the present embodiment. FIG. 10A is a plan view, and FIG. 10B is a cross-sectional view taken along the line AA ′ of FIG. FIG. 11 is a diagram (part 2) illustrating a part of the power generation device according to the present embodiment. 11A is a plan view, and FIG. 11B is a cross-sectional view taken along the line BB ′ of FIG. 11A. FIG. 11A is a plan view seen from the lower surface side of the second substrate 46.

  As shown in FIG. 9, the power generator according to this embodiment is formed by combining a first structure 2a and a second structure 2b.

  For the first structure 2a, a first substrate (lower substrate, lower base material, support portion) 36 is used. For example, a silicon plate is used as the first substrate 36. The external dimensions of the first substrate 36 are, for example, about 5 mm × 5 mm × 1.2 mm.

  The first substrate 36 is formed with a recess (counterbore) 38. The depth of the recess 38 is, for example, about 100 μm.

  On the first substrate 36 in the recess 38, for example, an insulating layer 40 of silicon dioxide having a thickness of about 300 nm is formed. The insulating layer 40 is for insulating an electrode (lower electrode) 42 and a first substrate 36 described later.

  An electrode (lower electrode) 42 is formed on the insulating layer 40. The lower electrode 42 includes a plurality of conductive patterns 42a formed so as to be parallel to each other (see FIG. 10A). In FIG. 10A, the electret layer 44 formed on the lower electrode 42 is omitted. The lower electrode 42 includes a plurality of conductive patterns 42a formed in a stripe shape. The longitudinal direction of the plurality of conductive patterns 42a is, for example, a direction orthogonal to a direction in which a vibration part 46b described later is displaced. The plurality of conductive patterns 42a are commonly connected by a conductive pattern 42b on one end side. The lower electrode 42 is formed in a comb shape as a whole by the plurality of conductive patterns 42a and the conductive patterns 42b that commonly connect the plurality of conductive patterns 42a. A lead conductive pattern (wiring) 42c for connection to the outside is connected to the conductive pattern 42b. Thus, the lower electrode 42 including a plurality of conductive patterns 42a, conductive patterns 42b, and conductive patterns 42c is formed. The lower electrode 42 is formed of a laminated film of, for example, a Ti film, a Cu film, and an Au film. The pattern width of the lower electrode 42 is, for example, about 50 to 100 μm. The thickness of the lower electrode 42 is, for example, about 50 to 100 μm.

  An electret layer 44 is formed on the lower electrode 42. The planar shape of the pattern of the electret layer 44 is the same as the planar shape of the pattern of the electrode 42. An electret is a dielectric having a property of retaining a charge semipermanently. As a material of the electret layer 44, for example, an electret material (trade name: CYTOP CT-EGG) manufactured by Asahi Glass Co., Ltd. can be used. The thickness of the electret layer 44 shall be about 5-10 micrometers, for example. The electret layer 44 holds negative charges, for example.

  Thus, the first structure 2a in which the lower electrode 42, the electret 44 layer, and the like are formed is formed.

  A second substrate (upper substrate, upper base material) 46 is used for the second structure 2b. For example, a silicon substrate is used as the second substrate 46. The external dimensions of the second substrate 46 are, for example, about 5 mm × 5 mm × 200 μm.

  On one main surface of the second substrate 46, for example, an insulating film 48 of silicon dioxide having a thickness of about 300 nm is formed.

  A through opening (through hole) 54 is formed in the second substrate 46 by, for example, through processing, and thereby, a support portion 46a, a vibrating portion 46b, a spring portion 46c, and an amplitude suppressing member 46d are formed. . Since the fixing portion 46a, the vibration portion 46b, the spring portion 46c, and the amplitude suppression member 46d are formed by performing the penetration process, the vibration portion 46b, the spring portion 46c, and the amplitude suppression member 46d are formed integrally with the support portion 46a. Has been.

  The planar shape of the support portion 46a is, for example, a frame shape.

  The planar shape of the vibration part 46b is, for example, a rectangle. The vibration part 46b can vibrate by vibration applied from the outside. The longitudinal direction of the vibration part 46b is set to a direction orthogonal to the direction of displacement when the vibration part 46b vibrates, that is, the same direction as the longitudinal direction of the conductive pattern 42a. The dimension of the vibration part 46b shall be about 2 mm x 3 mm x 200 micrometers, for example.

  The spring part (main spring) 46c is arranged between the vibration part 46b and the support part 46a, and can be deformed according to the displacement of the vibration part 46b. The spring portions 46c are arranged in the vicinity of the four corners of the vibration portion 46b. Each spring portion 46c has a shape in which four plate-like bodies 46e are combined. The four plate-like bodies 46e forming the spring portion 46c are integrally formed. The in-plane direction of the plate-like body 46 e forming the spring portion 46 c is the normal direction of the main surface of the second substrate 46. The four plate-like bodies 46e forming the spring part 46c form a rhombus when viewed from the normal direction of the main surface of the second substrate 46. When the spring portion 46c is deformed so that the outer dimension in the horizontal direction in FIG. 11 is increased, the outer dimension in the vertical direction in FIG. 11 is decreased. Further, when the spring portion 46c is deformed so that the outer dimension in the left-right direction in FIG. 11 is reduced, the outer dimension in the vertical direction in FIG. 11 is increased.

  FIG. 12 is a plan view showing a state in which the vibrating body is displaced. FIG. 12 is a plan view seen from the lower side of the second substrate 46.

  Since the vibration part 46b is displaced to the left side in FIG. 12, the spring part 46c located on the left side in FIG. 12 with respect to the vibration part 46b has a smaller dimension in the horizontal direction in FIG. On the other hand, the spring 46c located on the right side in FIG. 12 with respect to the vibrating portion 46b has a large dimension in the horizontal direction in FIG.

  The amplitude suppression member 46d is disposed so as to be able to contact the vibration part 46b within a range in which the vibration part 46b can be displaced. The amplitude suppressing member 46d is disposed so as to be separated from the vibrating portion 46b that is not displaced. The distance between the vibrating portion 46b and the amplitude suppressing member 46d that are not displaced is, for example, about 300 μm. The amplitude suppression member 46d abuts on the vibration part 46b and suppresses the amplitude of the vibration part 46b when the amplitude of the vibration part 46b becomes larger than a certain level. The amplitude suppression member 46d is formed on both sides in the vibration direction of the vibration part 46b, for example. That is, the amplitude suppression member 46d is arranged so that the amplitude suppression member 46d and the vibration part 46b come into contact when the vibration part 46b is displaced to the right of the paper surface in FIG. In addition, the amplitude suppression member 46d is arranged so that the amplitude suppression member 46d and the vibration part 46b come into contact when the vibration part 46b is displaced by a predetermined dimension or more to the left side in FIG. The amplitude suppressing member 46d is formed in a leaf spring shape, for example.

  An electrode (upper electrode) 50a is formed on the vibration part 46b. The upper electrode 50a is formed on the insulating film 48 in the vibration part 46b. The upper electrode 50a is formed on the surface on the side facing the first structure 2a when the first structure 2a and the second structure 2b are combined. The upper electrode 50a includes a plurality of conductive patterns 50b formed in parallel with each other. In other words, the upper electrode 50a includes a plurality of conductive patterns 50b formed in a stripe shape. The longitudinal direction of the plurality of conductive patterns 50b is the same as the longitudinal direction of the vibration part 46b. In other words, the longitudinal direction of the plurality of conductive patterns 50b is a direction orthogonal to the direction of displacement when the vibrating portion 46b vibrates. The plurality of conductive patterns 50b are commonly connected by a conductive pattern 50c on one end side. The longitudinal direction of the conductive pattern 50c is a direction orthogonal to the longitudinal direction of the plurality of conductive patterns 50b. A plurality of conductive patterns 50b and conductive patterns 50c that connect them in common form a comb-shaped upper electrode 50a. The upper electrode 50a is formed of a laminated film of a Ti film, a Cu film, and an Au film, for example. The width of the conductive pattern forming the upper electrode 50a is, for example, about 50 to 100 μm. The thickness of the upper electrode 50a is, for example, about 2 to 5 μm.

  Wirings (leading lines, conductive patterns) 50d for electrically connecting the upper electrode and the outside are formed on the support portion 46a. The wiring 50d is formed on the insulating film 48 in the support portion 46a. The upper electrode 50a and one end of the wiring 50d are connected by, for example, a relay wiring (not shown). As the relay wiring, for example, an electric wire is used. The relay wiring is connected to the upper electrode 50a and the wiring 50d by, for example, soldering.

  Thus, the second structure 2b in which the support portion 46a, the vibration portion 46b, the spring portion 46c, the amplitude suppressing member 46d, and the like are formed is formed.

  The first structure 2a and the second structure 2b are joined so that the lower electrode 42a and the upper electrode 46b face each other. For example, an adhesive (adhesive layer) 52 is used to join the first structure 2a and the second structure 2b.

  Thus, the power generator according to the present embodiment is formed.

  In a state in which the vibration part 46b is not displaced, the electret layer 44 on the lower electrode 42a and the upper electrode 50a face each other. That is, the pattern of the electret layer 44 and the pattern of the upper electrode 50a overlap in plan view. In this state, the upper electrode 50a is positively charged due to electrostatic induction by the electret layer 44 that is negatively charged. The charge amount of the upper electrode 50a is the maximum value when the vibrating portion 46b is not displaced.

  When the vibration part 46b vibrates due to external vibration, the vibration part 46b is displaced. When the vibration part 46b is displaced, the relative positional relationship between the electret layer 44 and the upper electrode 50a changes. When the relative positional relationship between the electret layer 44 and the upper electrode 50a changes, the charge amount of the upper electrode 50a changes. As a result, the charge charged in the upper electrode 50a moves, and a current flows through the wirings 42c and 50d. In this way, current flows through the wirings 42c and 50d, so that power generation can be performed.

(Method for producing power generation device)
Next, the method for manufacturing the power generation apparatus according to the present embodiment will be explained with reference to FIGS. 13 to 19 are process diagrams illustrating the method for manufacturing the power generation device according to the present embodiment. (A) of FIG. 13 thru | or FIG. 19 is a top view, (b) of FIG. 13 thru | or FIG. 19 is sectional drawing corresponding to FIG. 13 thru | or FIG. 16A, 17A, and 18A are plan views viewed from the lower side of the second substrate 46. FIG.

  First, a photoresist film (not shown) is formed on the entire surface of the first substrate 36 by, eg, spin coating.

  Next, an opening pattern is formed in the photoresist film to expose the region where the recess 38 is formed.

  Next, using the photoresist film as a mask, a recess 38 is formed in the first substrate 36 by, for example, Deep-RIE (Reactive Ion Etching) method. For example, a silicon wafer of about 4 inches is used as the first substrate 36. The thickness of the silicon wafer is about 1.2 mm, for example. The depth of the recess 38 is, for example, about 100 μm.

  In the present embodiment, a plurality of power generation devices are obtained by simultaneously forming a plurality of power generation devices on a wafer and separating the wafer into individual pieces. In FIG. 13 thru | or FIG. 19, the part corresponding to one power generator among several power generators formed simultaneously is shown in figure.

  Thereafter, the photoresist film is peeled off (see FIG. 13).

  Next, an insulating layer 40 of silicon dioxide having a film thickness of, eg, about 300 nm is formed on the entire surface by, eg, CVD. For example, TEOS (Tetraethoxysilane) gas is used as the source gas.

  Next, a photoresist film (not shown) is formed on the entire surface by, eg, spin coating.

  Next, the photoresist film is patterned into a planar shape of the recess 38 by using a photolithography technique.

  Next, using the photoresist film as a mask, the portion of the insulating layer 40 exposed from the photoresist film is removed by etching.

  Thereafter, the photoresist film is peeled off.

  Thus, the insulating layer 40 is formed in the recess 38 (see FIG. 14).

  Next, a conductive film (laminated film) 42 is formed on the entire surface by sequentially laminating, for example, a Ti film with a thickness of 200 nm, a Cu film with a thickness of 2 μm, and an Au film with a thickness of 2 μm by sputtering, for example.

  Next, an electret layer 44 is formed on the entire surface by, eg, spin coating. As a material of the electret layer 44, for example, an electret material (trade name: Cytop CT-EGG) manufactured by Asahi Glass Co., Ltd. is used. The thickness of the electret layer 44 shall be about 5-10 micrometers, for example.

  Next, a photoresist film (not shown) is formed on the entire surface by, eg, spin coating.

  Next, the photoresist film is patterned into a planar shape of the lower electrode 42 using a photolithography technique.

  Next, the electret layer 44 and the conductive film 42 are etched by ion milling, for example, using the photoresist film as a mask. Thus, the lower electrode 42 formed of the conductive film is formed. An electret layer 44 is formed on the lower electrode 42.

  Thereafter, the photoresist film is peeled off.

  Next, charges are injected into the electret layer 44 by, for example, corona discharge. Thus, the electret layer 44 is negatively charged, for example.

  Thus, the first structure 2a in which the lower electrode 42, the electret layer 44 and the like are formed is formed (see FIG. 15).

  Next, a photoresist film (not shown) is formed on the entire surface of the second substrate 46 by, eg, spin coating. For example, a silicon wafer of about 4 inches is used as the second substrate 46. The thickness of the silicon wafer is, for example, about 200 μm.

  Next, a photoresist film is patterned into a planar pattern of the support portion 46a, the vibration portion 46b, the spring portion 46c, and the amplitude suppressing member 46d by using a photolithography technique.

  Next, by using the photoresist film as a mask, the second substrate 46 is etched by, for example, Deep-RIE to etch the second substrate 46. Thereby, a through opening (through hole) is formed in the second substrate 46, and a support portion 46a, a vibration portion 46b, a spring portion 46c, and an amplitude suppressing member 46d are formed. Since the support portion 46a, the vibration portion 46b, the spring portion 46c, and the amplitude suppression member 46d are formed by performing the penetration process, the vibration portion 46b, the spring portion 46c, and the amplitude suppression member 46d are formed integrally with the support portion 46a. Has been.

  The planar shape of the support portion 46a is, for example, a frame shape.

  The planar shape of the vibration part 46b is a rectangle. The longitudinal direction of the vibration part 46b is a direction orthogonal to the direction in which the vibration part 46b vibrates. The dimension of the vibration part 46b shall be about 2 mm x 3 mm, for example.

  The spring part 46c is formed between the vibration part 46b and the support part 46a. The spring part 46c is formed in the vicinity of the four corners of the vibration part 46b. Each spring portion 46c is shaped like a combination of four plate-like bodies 46d. The four plate-like bodies 46d forming the spring portion 46c are integrally formed. The four plate-like bodies 46d forming the spring part 46c form a rhombus when viewed from the normal direction of the main surface of the second substrate 46.

  The amplitude suppression member 46d is disposed within a range in which the vibration part 46b can be displaced. The amplitude suppression member 46d is disposed at a position separated from the vibrating portion 46b that is not displaced. The distance between the vibration part 46b and the amplitude suppression member 46d is, for example, about 300 μm. The amplitude suppression member 46d is formed on both sides in the vibration direction of the vibration part 46b, for example. The amplitude suppressing member 46d is formed into a leaf spring shape, for example (see FIG. 16).

  Next, an insulating layer 48 of silicon dioxide having a thickness of about 300 nm is formed on one main surface of the second substrate 46 by, eg, sputtering (see FIG. 17).

  Next, a conductive film (laminated film) is formed on the entire surface by sequentially laminating, for example, a 200 nm thick Ti film, a 2 μm thick Cu film, and a 2 μm thick Au film by sputtering, for example.

  Next, a photoresist film (not shown) is formed on the entire surface by, eg, spin coating.

  Next, using a photolithography technique, the photoresist film is patterned into a planar pattern of the upper electrode 50a and the wiring (leading line) 50d.

  Next, the conductive film is etched by dry etching using the photoresist film as a mask. Thereby, the upper electrode 50a and the wiring 50d formed of the conductive film are formed.

  Thereafter, the photoresist film is peeled off (see FIG. 18).

  Next, the upper electrode 50a and one end of the wiring 50d are connected by a relay wiring (not shown), for example, by soldering. For example, an electric wire is used as the relay wiring.

  Thus, the second structure 2b in which the support portion 46a, the vibration portion 46b, the spring portion 46c, and the amplitude suppressing member 46d are formed is formed.

  Next, the first structure 2a and the second structure 2b are made to face each other so that the lower electrode 42 and the upper electrode 50a face each other (see FIG. 19A).

  Next, the first structure 2a and the second structure 2b are bonded using, for example, an adhesive.

  Thus, the power generator according to the present embodiment is manufactured (see FIG. 19B).

  Thereafter, the plurality of power generation devices formed simultaneously on the wafer are separated into pieces using a dicing saw or the like.

  Thus, you may make it use an electret. Also in the present embodiment, since the amplitude suppressing member 46d that suppresses the amplitude of the vibrating portion 46b is disposed, the vibrating portion 46b can be vibrated with a stable amplitude. Since the amplitude part 46b can be vibrated with a stable amplitude, a power generator with a stable output can be provided.

[Fourth Embodiment]
A power generation apparatus according to the fourth embodiment will be described with reference to FIGS. FIG. 20 is a cross-sectional view showing the power generator according to the present embodiment. FIG. 21 is a diagram (part 1) illustrating a part of the power generation device according to the present embodiment. FIG. 21A is a plan view, and FIG. 21B is a cross-sectional view taken along the line AA ′ of FIG. FIG. 22 is a diagram (part 2) illustrating a part of the power generation device according to the present embodiment. 22A is a plan view, and FIG. 22B is a cross-sectional view taken along the line BB ′ of FIG. 22A. 22A is a plan view seen from the lower surface side of the second substrate 46. FIG. The same components as those of the power generation apparatus and the manufacturing method thereof according to the first to third embodiments shown in FIGS. 1 to 19 are denoted by the same reference numerals, and description thereof will be omitted or simplified.

  The power generator according to the present embodiment generates power by electromagnetic induction.

  As shown in the figure, the power generation device (vibration power generation device) according to the present embodiment is formed by combining a first structure 4a and a second structure 4b.

  A first substrate (lower substrate, lower base material, support portion) 36 is used for the first structure 4a. For example, a silicon plate is used as the first substrate 36. The external dimensions of the first substrate 36 are, for example, about 5 mm × 5 mm × 1.2 mm.

  A recess 38 is formed in the first substrate 36. The depth of the recess 38 is, for example, about 100 μm.

  On the first substrate 36 in the recess 38, for example, an insulating layer 40 of silicon dioxide having a thickness of about 200 nm is formed. The insulating layer 40 is for insulating a coil 56 (to be described later) from the first substrate 36.

  A coil 56 is formed on the insulating layer 40. The number of the coils 56 may be plural or singular. Here, two coils 56 are formed. For example, copper is used as the material of the coil 56.

  On the insulating layer 40 on which the coil 56 is formed, an insulating layer 58 of silicon dioxide having a thickness of, for example, about 200 nm is formed. The width of the pattern of the coil 56 is, for example, 100 μm, and the thickness of the coil 56 is, for example, 3-5 μm.

  A contact hole reaching one end of the coil is formed in the insulating layer 58.

  A wiring (leading line) 60 connected to one end of the coil 56 through a contact hole (not shown) is formed on the insulating layer. As a material of the wiring 60, for example, copper is used. The width of the pattern of the wiring 60 is, for example, 100 μm.

  Thus, the first structure 4a in which the coil 56 and the like are formed is formed.

  A second substrate (upper substrate, upper base material) 46 is used for the second structure 4b. For example, a silicon substrate is used as the second substrate 46. The external dimensions of the second substrate 46 are, for example, about 5 mm × 5 mm × 200 μm.

  On one main surface of the second substrate 46, for example, an insulating film 48 of silicon dioxide having a thickness of about 200 nm is formed.

  A through opening (through hole) 54 is formed in the second substrate 46 by, for example, through processing, and thereby, a support portion 46a, a vibrating portion 46b, a spring portion 46c, and an amplitude suppressing member 46d are formed. .

  A magnetic body (magnetic layer, magnetic thin film) 62 is formed in the vibration part 46b. The magnetic layer 62 is formed on the surface on the side facing the first structure 4a when the first structure 4a and the second structure 4b are combined. The magnetic layer 62 is formed to face directly above the coil 56 in a state where the vibrating portion 46b is not displaced. As a material of the magnetic layer 62, for example, neodymium is used. The magnetic layer 62 is magnetized in the thickness direction. The length of the magnetic layer 62, that is, the dimension in the longitudinal direction of the magnetic layer 62 is, for example, about 2.7 mm. The width of the magnetic layer 62 is about 0.7 mm, for example.

  Thus, the second structure 4b in which the support portion 46a, the vibration portion 46b, the spring portion 46c, the amplitude suppressing member 46d, the magnetic body 62, and the like are formed is formed.

  The first structure 4a and the second structure 4b are joined so that the coil 56 and the magnetic body 62 face each other. For bonding the first structure 4a and the second structure 4b, for example, an adhesive (adhesive layer) 52 or the like is used.

  Thus, the power generator according to the present embodiment is formed.

  In the state in which the vibration part 46b is not displaced, the coil 56 and the magnetic layer 62 are facing each other. That is, when the vibration part 46b is not displaced, the coil 56 and the magnetic layer 62 overlap each other in plan view. The magnetic flux passing through the coil 56 is maximum when the vibrating portion 46b is not displaced.

  When the vibration part 46b vibrates due to external vibration, the vibration part 46b is displaced. When the vibration part 46b is displaced, the relative positional relationship between the magnetic layer 62 and the coil 56 changes. When the relative positional relationship between the magnetic layer 62 and the coil 56 changes, the magnetic flux penetrating the coil 56 changes, so that a current flows through the coil 56 due to electromagnetic induction. Since a current flows through the coil 56, power generation can be performed.

  Thus, you may apply to the electric power generating apparatus which produces electric power by electromagnetic induction. Also in this embodiment, since the amplitude suppressing member 46d that suppresses the amplitude of the vibrating portion 46b is provided, the vibrating portion 46b can be vibrated with a stable amplitude. Since the amplitude part 46b can be vibrated with a stable amplitude, a power generator with a stable output can be provided.

[Modified Embodiment]
The present invention is not limited to the above embodiment, and various modifications are possible.

  For example, in the above-described embodiment, a plurality of amplitude suppression members having different amplitudes when the vibrating portions 14 and 46b can come into contact with each other may be provided. In other words, another amplitude suppression member that can be in contact with the vibration suppression member 24 and 46b when the amplitude is larger than the amplitude that allows the vibration unit 14 and 46b to contact the amplitude suppression member 24 and 46d may be further provided. In addition, another amplitude suppressing member that can be brought into contact when the vibration parts 14 and 46b have an amplitude larger than an amplitude capable of coming into contact with another amplitude suppressing member may be further provided.

  Moreover, you may manufacture the electric power generating apparatus by 1st or 2nd embodiment using the semiconductor manufacturing process in which microfabrication is possible.

  In the first embodiment, the magnetostrictive member 12 is used. However, the material of the member 12 is not limited to the magnetostrictive material. A material whose magnetization is changed by elastic deformation can be appropriately used as the material of the member 12. As a material of the member 12, for example, nickel (Ni) or the like can be used. Further, an amorphous metal material or the like may be used as the material of the member 12. As such an amorphous metal material, for example, an amorphous metal material mainly composed of iron (Fe) can be used. For example, METGLAS (registered trademark), which is an amorphous metal material mainly composed of iron, may be used as the material of the member 12. Further, a giant magnetostrictive material such as Terfenol-D (registered trademark) may be used as the material of the member 12. When Terfenol-D is used as the material of the member 12, for example, a composite material obtained by solidifying powdered Terfenol-D with an epoxy resin or the like can be used. Further, a ferromagnetic shape memory alloy, a metamagnetic shape memory alloy, or the like may be used as the material of the member 12. These are materials whose magnetization changes when elastically deformed. Therefore, when the member 12 is vibrated, an induced current flows through the coil 18 and power generation can be performed.

  In the third embodiment, the case where the electret layer 40 is formed on the lower electrode 42 side is described as an example. However, the electret layer 40 may be formed on the upper electrode 50a side.

  In the third and fourth embodiments, the case where the first structures 2a and 4a and the second structures 2b and 4b are joined by the adhesive 52 has been described as an example, but the present invention is limited to the adhesive. You may join using solder etc. instead of a thing.

  In the fourth embodiment, the coil is provided on the first structure 4a side and the magnetic body 62 is provided on the second structure 4b side. However, the present invention is not limited to this. The first structure A magnetic body may be provided on the 4a side, and a coil may be provided on the second structure 4b side.

2a ... 1st structure 2b ... 2nd structure 4a ... 1st structure 4b ... 2nd structure 10 ... Case, support part 10a-10c ... Member 12 ... Magnetostrictive member 14, 14a ... Vibration part 16a, 16b ... magnetic field applying member 18 ... coil 20 ... reinforcing member 22 ... toughness member 24 ... amplitude suppressing member 26 ... weight 28 ... piezoelectric element 30 ... piezoelectric member 32 ... electrode 34 ... electrode 36 ... first substrate 38 ... concave portion 40 ... insulating layer 42 ... lower electrodes 42a and 42b ... conductive pattern 42c ... wiring 44 ... electret layer 46 ... second substrate 46a ... support 46b ... vibrating part 46c ... spring member 46d ... amplitude suppressing member 46e ... plate-like body 48 ... Insulating film 50a ... upper electrodes 50b, 50c ... conductive pattern 50d ... wiring 52 ... adhesive layer 54 ... through opening 56 ... coil 58 ... insulating layer 60 ... wiring 62 ... magnetic material

Claims (1)

A first substrate having a recess, an insulating layer formed on the first substrate in the recess, a lower electrode including a plurality of parallel conductive patterns formed on the insulating layer, and A first structure having a common conductive pattern that commonly connects one end of the plurality of conductive patterns, wherein the plurality of conductive patterns and the common conductive pattern are formed in a comb shape;
A second structure having a support portion formed by a through-opening portion formed in the second substrate, a vibration portion, a spring portion, and an amplitude suppressing member, wherein the planar shape of the support portion is a frame. The vibration part is provided in the frame-shaped support part, the planar shape of the vibration part is rectangular, and the vibration part has an upper electrode including a plurality of conductive patterns formed in a stripe shape. And the longitudinal direction of the plurality of conductive patterns is a direction orthogonal to the direction of displacement when the vibrating portion vibrates, and the spring portion is disposed between the vibrating portion and the support portion. The spring portion has a rhombus shape in which four plate-like bodies are combined, and the in-plane direction of the plate-like body forming the spring portion is a normal line of the main surface of the second substrate. Direction, and the amplitude suppressing member has the vibrating portion The position can be in the range, and a second structure is arranged contactable to said vibration unit,
The first structure and the second structure include the plurality of conductive patterns included in the lower electrode of the first structure, and the upper electrode of the second structure. A power generation device, wherein a plurality of conductive patterns are joined to face each other.

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