JP5994501B2 - Capacitor housing unit - Google Patents

Description

  The present invention relates to a capacitor housing unit in which a capacitor and a discharge resistor connected to the capacitor are housed in a housing and the housing is filled with a sealing resin.

  In the capacitor housing unit, it is desired to suppress the temperature rise of the capacitor. Therefore, in Patent Document 1, when the discharge resistor generates heat, this heat is suppressed from reaching the capacitor, thereby suppressing the temperature rise of the capacitor.

  The capacitor accommodation unit described in Patent Document 1 accommodates a capacitor and a discharge resistor connected to the capacitor inside the housing. The discharge resistor is provided above the capacitor in the vertical direction. Between the capacitor and the discharge resistor, there is provided a radiant heat shielding plate that suppresses heat generated by the discharge resistor from reaching the capacitor. This suppresses the heat generated by the discharge resistor from reaching the capacitor.

JP 2011-151995 A

Incidentally, in the capacitor housing unit, in addition to suppressing heat conduction from the discharge resistor to the capacitor, it is desired to reduce the size of the capacitor housing unit.
The objective of this invention is providing the capacitor | condenser accommodation unit which can achieve size reduction, suppressing the conduction of the heat | fever from a discharge resistor to a capacitor | condenser.

In order to solve the above problems, the invention according to claim 1 is a capacitor in which a capacitor and a discharge resistor connected to the capacitor are housed in a housing, and the housing is filled with a sealing resin. A housing unit, the first bracket pressing the discharge resistor against the inner surface of the housing; and provided between the first bracket and the capacitor; and at least a part of the first bracket and a second bracket provided at intervals, and have a thermal insulation layer between said first bracket and said second bracket, the heat insulation layer, the said first bracket first is formed by superimposing the second bracket is summarized as Rukoto.

  According to this, since the first bracket presses the discharge resistor against the housing, the discharge resistor is brought into close contact with the inner surface of the housing, and the heat generated by the discharge resistor is easily conducted to the housing. For this reason, the amount of heat conducted to the first bracket is reduced. In addition, a heat insulating layer is formed between the first bracket and the second bracket. The heat conducted from the discharge resistor to the first bracket is insulated by the heat insulation layer and is not easily conducted to the second bracket. For this reason, it is possible to suppress heat conduction from the second bracket to the capacitor. Therefore, the heat generated by the discharge resistor is difficult to conduct to the capacitor, and the distance between the discharge resistor and the capacitor can be shortened. For this reason, size reduction of a capacitor | condenser accommodation unit is achieved.

Moreover , since the heat insulation layer is formed by overlapping the first bracket and the second bracket, it is easy to form the heat insulation layer.
Invention of Claim 2 is a capacitor | condenser accommodation unit of Claim 1, Comprising: A summary is that the said heat insulation layer is an air layer.

According to this, since air has low thermal conductivity, it is possible to more suitably suppress heat conduction to the capacitor.
The invention according to claim 3, a capacitor housing unit according to claim 1 or claim 2, wherein the first bracket and said second bracket forms a plate, wherein the first bracket, The gist of the invention is that a part thereof is in contact with the inner surface of the housing, and at least a part is thicker than the second bracket.

  According to this, since a part of the first bracket is brought into contact with the inner surface of the housing, the heat conducted from the discharge resistor to the first bracket can be conducted to the housing. The heat conducted to the first bracket can be released. For this reason, it is difficult to conduct heat toward the capacitor. Moreover, heat is easily conducted to the first bracket by making at least a part of the first bracket thicker than the second bracket. For this reason, it is easy to conduct heat to a housing | casing using a 1st bracket, and it can further suppress that the heat | fever emitted with the discharge resistor is conducted to a capacitor | condenser.

The invention according to claim 4 . It is a capacitor | condenser accommodation unit as described in any one of Claims 1-3 , Comprising: It makes it a summary to be provided in an inverter apparatus.
According to this, since the capacitor | condenser accommodation unit provided in an inverter apparatus can be reduced in size, the inverter apparatus can also be reduced in size.

  According to the present invention, downsizing can be achieved while suppressing heat conduction from the discharge resistor to the capacitor.

The circuit diagram which shows the inverter apparatus in embodiment. The schematic sectional drawing which shows the capacitor | condenser accommodation unit in embodiment. The front view which shows the relationship between the 1st bracket and 2nd bracket in embodiment. The perspective view which shows the relationship between the 1st bracket and 2nd bracket in embodiment. The schematic sectional drawing which shows the 1st bracket and 2nd bracket of another example.

Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS.
As shown in FIG. 1, the inverter device 10 has switching elements Q1 to Q6. As each of the switching elements Q1 to Q6, for example, a power semiconductor element such as an insulated gate bipolar transistor (IGBT) or a power MOSFET (metal oxide semiconductor field effect transistor) is used. The first switching element Q1 and the second switching element Q2, the third switching element Q3 and the fourth switching element Q4, and the fifth switching element Q5 and the sixth switching element Q6 are connected in series, respectively. .

  The collectors of switching elements Q1, Q3, and Q5 are connected to the positive electrode of battery B, respectively. The emitters of switching elements Q2, Q4, and Q6 are connected to the negative electrode of battery B, respectively.

  Between the emitters and collectors of the switching elements Q1 to Q6, a diode D is connected in antiparallel, that is, in a state where the cathode corresponds to the collector and the anode corresponds to the emitter.

  A connection point between the first switching element Q1 and the second switching element Q2, a connection point between the third switching element Q3 and the fourth switching element Q4, and a connection point between the fifth switching element Q5 and the sixth switching element Q6. Is connected to a load 51 (for example, a three-phase motor).

  The inverter device 10 has a capacitor housing unit 20. The capacitor housing unit 20 includes a smoothing capacitor 21 connected between the negative electrode and the positive electrode of the power source, and a discharge resistor 22 connected in parallel to the capacitor 21 and discharging the residual charge of the capacitor 21. The inverter device 10 configured as described above converts the DC power supplied from the battery B into AC power and supplies the AC power to the load 51. Hereinafter, the capacitor housing unit 20 will be described in detail.

  As shown in FIG. 2, the capacitor | condenser accommodation unit 20 has the housing | casing 23 which makes | forms square box shape. The above-described capacitor 21 and discharge resistor 22 are accommodated in the housing 23. The discharge resistor 22 is provided in contact with the inner surface of one side wall 23 a of the housing 23. The capacitor 21 is provided away from the discharge resistor 22. A first bracket 31 that presses the discharge resistor 22 against the inner surface of the housing 23 is provided between the discharge resistor 22 and the capacitor 21. A second bracket 41 is provided between the first bracket 31 and the capacitor 21. The housing 23 is filled with a sealing resin 53.

  As shown in FIGS. 3 and 4, the first bracket 31 and the second bracket 41 are formed by bending one rectangular flat plate-like member. A plate thickness t1 of the plate-like member forming the first bracket 31 is thicker than a plate-like plate thickness t2 forming the second bracket 41. Therefore, the overall thickness t1 of the first bracket 31 is greater than the thickness t2 of the second bracket 41.

  The first bracket 31 has a first base portion 32 having a rectangular flat plate shape, and a rectangular flat plate shape that is bent perpendicularly to the thickness direction of the first base portion 32 from a pair of opposed end portions of the first base portion 32. The first bent portion 33 and a first flange portion 34 bent horizontally from the tip of each first bent portion 33 in the thickness direction of the first bent portion 33.

  The second bracket 41 has a rectangular flat plate shape that is bent perpendicularly to the thickness direction of the second base portion 42 from a second base portion 42 having a rectangular flat plate shape and a pair of opposite ends of the second base portion 42. The second bent portion 43 and a second flange portion 44 bent horizontally from the tip of each second bent portion 43 in the thickness direction of the second bent portion 43. The first bracket 31 and the second bracket 41 are made of a metallic material having a high thermal conductivity. For example, it is formed from spring steel (steel such as carbon, silicon manganese, and manganese chromium).

  The length d1 between the outer surfaces of the first bent portions 33 is slightly shorter than the length d2 between the inner surfaces of the second bent portions 43. Further, a length d3 from the outer surface of the first flange portion 34 provided continuously with the outer surface of the first bent portion 33 to the outer surface of the first base portion 32 is provided continuously with the inner surface of the second bent portion 43. The length d4 from the inner surface of the second flange portion 44 to the inner surface of the second base portion 42 is slightly shorter. The length d5 in the short direction of the first base portion 32 and the length d6 in the short direction of the second base portion 42 are the same. Thereby, the first bracket 31 can be overlaid on the second bracket 41. The length d5 in the short direction of the first base portion 32 and the length d6 in the short direction of the second base portion 42 are the distance from the bottom surface (not shown) of the housing 23 to the top surface facing the bottom surface (the bottom plate). The distance from the inner surface to the inner surface of the top plate).

  As shown in FIG. 2, when the first bracket 31 is superimposed on the second bracket 41, the outer surface of the first flange portion 34 and the second bent portion 43 that are connected to the outer surface of the first bent portion 33. The inner surface of the second flange portion 44 connected to the inner surface is in contact. A slight gap S is formed between the outer surface of the first bent portion 33 and the inner surface of the second bent portion 43 and between the first base portion 32 and the second base portion 42. In other words, the second bracket 41 is provided with the second base portion 42 and the second bent portion 43 spaced from the first bracket 31. In this embodiment, air exists in the gap S and forms an air layer. This air layer functions as a heat insulating layer. In order to cause the medium present in the gap S to function as a heat insulating layer, it is necessary to use a medium having a lower thermal conductivity than the resin 53. Further, the first bracket 31 is configured such that both end surfaces in the short direction of the first base portion 32, both end surfaces in the longitudinal direction of the first bent portion 33, and both end surfaces in the longitudinal direction of the first flange portion 34 are housings. It arrange | positions so that the upper surface which opposes the bottom face of 23 and a bottom face. The second bracket 41 has both end surfaces in the short direction of the second base portion 42, both end surfaces in the longitudinal direction of the second bent portion 43, and both end surfaces in the longitudinal direction of the second flange portion 44 of the housing 23. It arrange | positions so that the upper surface facing a bottom face and a bottom face may be touched. For this reason, there is no possibility that the resin 53 enters the gap S when the gap S is closed by the bottom surface and the upper surface of the housing 23 and filled with the resin 53.

  The first bracket 31 and the second bracket 41 overlapped as described above are provided between the side wall 23a with which the discharge resistor 22 is in contact and the two bosses 52 provided apart from the side wall 23a. It is fixed by inserting the flange portion 34 and the second flange portion 44. The separation distance from the side wall 23a to the boss 52 is the second distance provided continuously from the inner surface of the first flange portion 34 provided continuously to the inner surface of the first bent portion 33 to the outer surface of the second bent portion 43. The length to the inner surface of the flange portion 44 is the same as the length d8. Further, the separation distance between the two bosses 52 is the same as the length d7 (see FIG. 3) between the outer surfaces of the respective second bent portions 43. The movement of the first bracket 31 and the second bracket 41 in the thickness direction (plate thickness) of the first bracket 31 and the second bracket 41 is fixed by the side wall 23 a and the boss 52. The discharge resistor 22 is pressed against the inner surface of the first base 32 and is pressed against the inner surface of the side wall 23a.

Next, the operation of the capacitor housing unit 20 of this embodiment will be described.
When the inverter device 10 is driven or when the residual charge of the capacitor 21 is discharged, a current flows through the discharge resistor 22 and Joule heat is generated. When the discharge resistor 22 generates heat, this heat is conducted to the housing 23 and the first bracket 31. At this time, by pressing the discharge resistor 22 against the inner surface of the housing 23, the discharge resistor 22 and the housing 23 are in close contact with each other, and heat is easily conducted to the housing 23.

  Further, by making the plate thickness t 1 of the first bracket 31 thicker than the plate thickness t 2 of the second bracket 41, heat is easily conducted to the first bracket 31, and the heat conducted to the first bracket 31. Is preferably transmitted from the first flange portion 34 in contact with the inner surface of the housing 23 to the housing 23.

  Further, the heat conducted to the first bracket 31 tries to be conducted to the second bracket 41 through the gap S. However, since the air existing in the gap S functions as a heat insulating layer, the heat is second. It is difficult to conduct to the bracket 41.

Therefore, according to the above embodiment, the following effects can be obtained.
(1) The discharge resistor 22 and the inner surface of the housing 23 are brought into close contact with each other by pressing the discharge resistor 22 against the inner surface of the housing 23 with the first bracket 31. For this reason, when the discharge resistor 22 generates heat, this heat is easily conducted to the housing 23. Further, a gap S is formed between the first bracket 31 and the second bracket 41. In the gap S, air exists. For this reason, the air layer functions as a heat insulating layer and heat is not easily conducted to the second bracket 41. That is, the heat generated by the discharge resistor 22 is not easily conducted to the capacitor 21, and the distance between the capacitor 21 and the discharge resistor 22 can be shortened. Therefore, the size of the capacitor housing unit 20 can be reduced.

  (2) The gap S is formed when the first bracket 31 is overlapped with the second bracket 41, and air exists in the gap S. For this reason, a heat insulation layer can be formed only by superimposing the first bracket 31 on the second bracket 41. Therefore, it is easy to form a heat insulating layer.

  (3) When the first bracket 31 and the second bracket 41 are fixed between the boss 52 and the side wall 23a by allowing the first bracket 31 to overlap the second bracket 41, The first bracket 31 and the second bracket 41 can be fixed in an overlapping state.

  (4) An air layer is adopted as the heat insulating layer. Since air has low thermal conductivity, it is possible to more suitably suppress heat conduction from the first bracket 31 to the second bracket 41.

  (5) The plate thickness t 1 of the entire first bracket 31 is thicker than the plate thickness t 2 of the second bracket 41. Further, the first flange portion 34 is in contact with the inner surface of the side wall 23a. For this reason, the heat conducted to the first bracket 31 can be conducted to the housing 23. Further, by increasing the thickness t1 of the first bracket 31, heat is easily conducted to the first bracket 31, and heat is easily conducted to the housing. For this reason, it is possible to more suitably suppress the heat generated by the discharge resistor 22 from being conducted to the capacitor 21.

(6) The capacitor housing unit 20 is provided in the inverter device 10. Since the capacitor accommodation unit 20 can be reduced in size, the inverter device 10 can also be reduced in size.
(7) When the first bracket 31 is overlapped with the second bracket 41, the first bracket 31 is continuously connected to the outer surface of the first bent portion 33 and the inner surface of the second bent portion 43. The inner surface of the second flange portion 44 is in contact. Further, the gap S is closed by the bottom surface and the top surface of the housing 23. For this reason, when the resin 53 is filled in the housing 23, the resin 53 is suppressed from flowing into the gap S. When the resin 53 flows into the gap S, the function as a heat insulating layer may be lowered by the resin 53 having a higher thermal conductivity than air. By suppressing the resin 53 from entering the gap S, it is possible to suppress a decrease in the function as the heat insulating layer.

  (8) The first bracket 31 and the second bracket 41 are fixed by inserting the first flange portion 34 and the second flange portion 44 between the boss 52 and the side wall 23a. For this reason, the boss 52 and the side wall 23 a function as a temporary presser before the inside of the housing 23 is filled with the resin 53. Therefore, there is no need to separately provide a temporary holding member.

In addition, you may change embodiment as follows.
As shown in FIG. 5, in the embodiment, a bent portion 43 a may be further formed in the second bent portion 43 of the second bracket 41. The bent portion 43 a is bent in a direction away from the first bracket 31. Since the bent portion 43a is bent in a direction away from the first bracket 31, a wide gap S between the first bracket 31 and the second bracket 41 can be secured. And the heat | fever which the discharge resistor 22 emits with the clearance gap S can be insulated appropriately.

  In the embodiment, the first bracket 31 and the second bracket 41 are fixed by the boss 52 and the side wall 23a, but the present invention is not limited to this. For example, even if the first bracket 31 and the second bracket 41 are fastened by screwing a fastening member such as a bolt or a screw penetrating the first flange portion 34 and the second flange portion 44 into the side wall 23a. Good.

In the embodiment, a heat insulating material having a lower thermal conductivity than the resin 53 may be provided in the gap S.
In the embodiment, the shapes of the first bracket 31 and the second bracket 41 may be changed. For example, a flat bracket extending between a pair of side walls that intersect the side wall 23a may be used. Further, a circular plate material, a polygonal plate material, or the like may be used.

  In the embodiment, a bracket that forms a heat insulating layer between the second bracket 41 and the capacitor 21 may be further provided between the second bracket 41 and the capacitor 21. That is, as long as two or more brackets are provided, any number of brackets may be provided.

  In the embodiment, the gap S may be formed only between the first bent portion 33 and the second bent portion 43 or between the first base portion 32 and the second base portion 42. Even in this case, each gap S functions as a heat insulating layer, and heat generated by the discharge resistor 22 is suppressed from being conducted to the capacitor 21.

In the embodiment, the first bracket 31 may be partially thicker than the second bracket 41.
(Circle) you may provide the capacitor | condenser accommodation unit 20 of embodiment other than the inverter apparatus 10. FIG. For example, you may provide in a converter apparatus etc.

  DESCRIPTION OF SYMBOLS 10 ... Inverter apparatus, 20 ... Capacitor accommodation unit, 21 ... Capacitor, 22 ... Discharge resistor, 23 ... Housing | casing, 31 ... 1st bracket, 41 ... 2nd bracket, 53 ... Resin.

Claims (4)

A capacitor housing unit in which a capacitor and a discharge resistor connected to the capacitor are housed in a housing, and the housing is filled with a sealing resin,
A first bracket for pressing the discharge resistor against the inner surface of the housing;
A second bracket provided between the first bracket and the capacitor, and at least a part of which is spaced from the first bracket; and the first bracket and the second bracket bracket and have a heat-insulating layer between the,
The heat insulation layer, capacitor housing unit, characterized that you have been formed by the superposition of said first bracket and the second bracket. The capacitor accommodation unit according to claim 1, wherein the heat insulating layer is an air layer. The first bracket and the second bracket are plate-shaped, and the first bracket is in contact with the inner surface of the housing, and at least a part thereof is thicker than the second bracket. The capacitor | condenser accommodation unit of Claim 1 or Claim 2 characterized by these. The capacitor housing unit as claimed in any one of claims 1 to 3, characterized in that provided in the inverter device.