JP5167922B2 - Case mold type capacitor - Google Patents

Description

  INDUSTRIAL APPLICABILITY The present invention is used in various electronic equipment, electrical equipment, industrial equipment, automobiles, etc., and in particular, a metallized film capacitor that is optimal for smoothing, filtering, and snubbing of a motor drive inverter circuit of a hybrid car is contained in a case. And a resin-molded case mold type capacitor.

  In recent years, from the viewpoint of environmental protection, all electric devices are controlled by inverter circuits, and energy saving and high efficiency are being promoted. In particular, in the automobile industry, hybrid vehicles (hereinafter referred to as HEVs) that run on electric motors and engines have been introduced into the market, and the development of technologies relating to energy saving and high efficiency has been activated, which is friendly to the global environment.

  Since such a HEV electric motor has a high operating voltage range of several hundred volts, a metallized film capacitor having high withstand voltage and low loss electric characteristics as a capacitor used in connection with such an electric motor. In addition, the trend of adopting metalized film capacitors with a very long life is conspicuous due to the demand for maintenance-free in the market.

  And since the metallized film capacitor used for HEVs in this way is required to have a high withstand voltage, large current, large capacity, etc., a plurality of metallized films connected in parallel by bus bars. A case mold type capacitor in which a capacitor is housed in a case and a mold resin is poured into the case has been developed and put into practical use.

  8A and 8B are a plan sectional view and a front sectional view showing the structure of this type of conventional case mold type capacitor. In FIG. 8, 11 is a resin capacitor case, and 12 is a capacitor element. Indicates. Reference numerals 13a and 13b are integrally connected connecting fittings, 13a is a part built in the capacitor case 11, and 13b is a part protruding from the capacitor case 11 to the outside. Reference numeral 14 denotes a filling resin such as an epoxy resin for fixing the capacitor element 12, 15 denotes an electrode portion, 16 denotes an attachment leg for attaching the capacitor to the outside, and 17 denotes a casting surface for casting the filling resin 14.

  And the said capacitor | condenser element 12 winds or laminates | stacks the metallized film which is not shown in figure, and has provided the electrode part 15 in the end surface. Then, the connection fitting 13a is connected to the electrode portion 15, and this connection fitting 13b (connected integrally with 13a) is electrically connected to an external device or the like.

  The capacitor case 11 includes the entire capacitor element 12 and a connection fitting 13a, and is filled with a filling resin 14 and fixed. In FIG. 8, the bottom portion (casting surface 17) of the capacitor case 11 is an opening surface before resin filling, and this surface is a surface on which the filling resin 14 is cast. Further, the connection fitting 13 b protrudes from the capacitor case 11 to the outside from the casting surface 17.

  Further, as shown in FIG. 8, the capacitor case 11 has a mounting leg 16, and can be attached to an external device or the like with a screw or the like. The capacitor case 11 is large in order to incorporate a plurality of capacitor elements 12, and the mounting legs 16 are provided at four locations from the weight of the entire capacitor and the durability in the event of a collision, and have a shape extending in all directions.

  In the conventional case mold type capacitor configured as described above, the casting surface 17 for casting the filling resin 14 is on the same side as the mounting leg 16, and the connection fitting 13 is exposed from the casting surface 17 to the outside. By doing so, the distance until the connection fittings 13a and 13b are connected to an external device or the like can be shortened, and thereby the inductance of the connection fittings 13a and 13b can be suppressed.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2003-338425 A

  However, in the above conventional case mold type capacitor, not only the inductance is increased because the connection fitting 13 for connecting to the electrode portion 15 of the capacitor element 12 and connecting to an external device is long, but the shape of the connection fitting 13 is also increased. However, there is a problem that it is difficult to reduce the size and weight because the size becomes complicated and large.

  Furthermore, not only a dedicated connection fitting 13 is required for each model, but also when connecting capacitor elements 12 of different uses and sizes, the design of the connection fitting 13 becomes extremely difficult, and there is a significant problem in terms of cost. I had it.

  An object of the present invention is to solve such a conventional problem, and to provide a case mold type capacitor capable of realizing low inductance and miniaturization and weight reduction at the same time and realizing cost reduction.

In order to solve the above problems, a case mold type capacitor of the present invention comprises an element having a pair of electrodes on both end faces, an electrode terminal having one end connected to each electrode of the element, and the other end of the electrode terminal Is connected to the double-sided board, an external terminal having one end connected to the double-sided board, a case containing them, and an insulation filled in the case with the other end of the external terminal exposed to the outside. Ri Do from sexual mold resin, these electrode terminals, double-sided board, the external terminals are provided separately, the board connecting portion which protrudes to the other side of the electrode terminal is inserted into the connection hole of the double-sided substrate The electrode terminal and the external terminal are electrically connected by inserting a board connection portion provided protruding from one end of the external terminal into the connection hole of the double-sided board .

  As described above, the case mold type capacitor according to the present invention has a configuration in which the electrode of the element and the external terminal are connected using the double-sided substrate, so that the routing from the electrode of the element to the external terminal is extremely short, and the double-sided substrate Since the inductance canceling effect can be obtained when the opposite poles face each other, not only can the inductance be greatly reduced, but it is also possible to realize a small size, light weight and low cost simultaneously with a simple configuration. The effect that it can be obtained.

(Embodiment 1)
Hereinafter, the invention described in the first to fourth aspects of the present invention will be described using the first embodiment.

  1 is an exploded perspective view showing a configuration of a case mold type capacitor according to Embodiment 1 of the present invention, FIG. 2 is a cross sectional view thereof, and FIGS. 3A to 3C are used for the case mold type capacitor. It is the top view which showed the double-sided board, the front view, and the bottom view.

  1 to 3, reference numeral 1 denotes a metallized film capacitor element (hereinafter referred to as "element 1"). This element 1 is a metal in which a metal vapor-deposited electrode is formed on one side or both sides of a dielectric film made of polypropylene film or the like. P is formed as a pair of extraction electrodes by forming a pair of metallized films, winding the metal vapor-deposited electrodes facing each other through a dielectric film (not shown), and forming metallized electrodes sprayed with zinc on both end faces. The electrode 1a and the electrode Nb 1b are provided respectively.

Reference numeral 2 denotes an electrode terminal made of a metal plate. The electrode terminal 2 includes a P-electrode 1a and an N-electrode 1b in which an element connecting portion 2a provided at one end serves as a pair of extraction electrodes provided on both end faces of the element 1. The board connection portion 2b provided at the other end of the electrode terminal 2 protrudes from the outer peripheral portion of the element 1 after soldering.

  3 is a double-sided substrate made of glass-filled epoxy resin, etc. The double-sided substrate 3 is provided with an insulating part 3b on both the front side and the back side, and a copper foil is attached to the part excluding the insulating part 3b. A conductive portion 3a for forming a connection pattern is formed, and the conductive portion 3a and the insulating portion 3b are asymmetrically arranged on the front and back surfaces. Reference numeral 3c denotes a connection hole provided in the double-sided substrate 3. The connection hole 3c is provided at a position where one of the front and back surfaces is connected to the conductive portion 3a and the other is connected to the insulating portion 3b.

  Reference numeral 4 denotes an external terminal made of a metal plate. The external terminal 4 is provided with a connection hole 4a for connection to an external device or the like at one end and a substrate connection portion 4b at the other end. The substrate connection portion 4b Is inserted into the connection hole 3c provided in the double-sided board 3 from the front side and soldered on the back side of the double-sided board 3, so that either one of the conductive portions 3a provided on the front and back sides of the double-sided board 3 is provided. This is electrically connected to the conductive portion 3a on the surface.

  Similarly, the board connection portion 2b of the electrode terminal 2 connected to each electrode of the element 1 is inserted into the connection hole 3c provided in the double-sided board 3 from the back side and soldered on the front side of the double-sided board 3 By doing so, it is configured to be electrically connected to the conductive portion 3a on either one of the conductive portions 3a provided on the front and back surfaces of the double-sided board 3, respectively. One P-electrode 1a is connected to the conductive portion 3a on the front surface side of the double-sided substrate 3, and the N-pole electrode 1b of the element 1 is connected to the conductive portion 3a on the back surface side of the double-sided substrate 3.

  5 is a resin case, 6 is an insulating mold resin made of epoxy resin or the like filled in the case 5, and the mold resin 6 places the element 1 connected to the double-sided substrate 3 in the case 5. It is housed and resin-molded with a part of the external terminal 4 exposed (on the side of the connection hole 4a). In this state, the double-sided substrate 3 is disposed on the top of the element 1 and is viewed from above. The double-sided substrate 3 is formed in such a size as to cover the entire element 1.

  The case mold type capacitor according to the present embodiment configured as described above has a configuration in which the P-electrode 1a and the N-electrode 1b of the device 1 are connected to the external terminal 4 using the double-sided substrate 3, respectively. Since the lead from the first P-pole electrode 1a and the N-pole electrode 1b to the external terminal 4 is extremely shortened and the opposite polarity is opposed to the front and back surfaces of the double-sided board 3, an inductance canceling effect is obtained. In addition to being able to greatly reduce, it has a special effect that it is possible to simultaneously realize a reduction in size and weight and a reduction in cost with a simple configuration.

  Further, the double-sided substrate 3 has copper foils attached to the front and back surfaces. The double-sided substrate 3 is disposed on the top of the element 1 and is large enough to cover the entire element 1 when viewed from above. Therefore, the moisture absorbed from the mold resin 6 in the opening of the case 5 can be blocked by the double-sided substrate 3, and an excellent effect of excellent moisture resistance is achieved.

  Further, the double-sided substrate 3 exhibits high insulation because the different electrodes are insulated by the substrate, and can be reduced in size because it is not necessary to route the inside of the case 5, and the conductive portion 3a. Thus, it is possible to easily change the arrangement of the external terminals 4 or increase the number of external terminals 4 simply by changing the pattern. An example in which the number of external terminals 4 is increased is shown in FIG.

  The electrode terminal 2 connected to the P-electrode 1a and the N-electrode 1b of the element 1 has a pair of element connecting portions 2a at one end and a pair at the other end, as shown in detail in FIG. Since the substrate connection portions 2b are provided, and the pitch of the pair of substrate connection portions 2b is smaller than the pitch of the pair of element connection portions 2a, the electrode terminal 2 is formed by punching a strip-shaped plate material. In addition to being able to produce with a high yield, it has the special effect of being standardized and being shared by different models.

(Embodiment 2)
Hereinafter, the invention according to claim 5 of the present invention will be described using the second embodiment.

  The present embodiment is different from the first embodiment in that a plurality of case-molded capacitor elements described with reference to FIGS. 1 to 5 are connected in parallel, and other configurations are the same as in the first embodiment. Therefore, the same parts are denoted by the same reference numerals and detailed description thereof will be omitted, and only different parts will be described in detail below with reference to the drawings.

  FIG. 6 is an exploded perspective view showing the configuration of the case mold type capacitor according to Embodiment 2 of the present invention. In FIG. 6, reference numeral 7 denotes a double-sided board, and the surface of the connection hole 7c provided in the double-sided board 7 One of the conductive portions 7a provided on the front and back surfaces of the double-sided board 7 by inserting the board connecting part 4b of the external terminal 4 from the side and soldering this board-connecting part 4b on the back side of the double-sided board 7 It is intended to be electrically connected to the conductive portion 7a on one surface.

  Similarly, the substrate connection portion 2b of the electrode terminal 2 connected to each electrode of a plurality of elements 1 (three in the present embodiment, but the present invention is not limited to this) is provided. Is inserted into the connection hole 7c provided in the double-sided substrate 7 from the back surface side and soldered on the front surface side of the double-sided substrate 7, so that one of the conductive portions 7a provided on the front and back surfaces of the double-sided substrate 7 respectively. Thus, the P-electrode 1a of the element 1 is connected to the conductive part 7a on the surface side of the double-sided substrate 7 in FIG. The electrode 1b is connected to the conductive portion 7a on the back side of the double-sided substrate 7, respectively.

  8 is a resin case, and 6 is a mold resin filled in the case 8. The mold resin 6 accommodates a plurality of elements 1 connected to the double-sided substrate 7 in the case 8. A part of the external terminal 4 (connection hole 4a side) is resin-molded so that the double-sided substrate 7 is disposed above the plurality of elements 1 in this state. The substrate 7 is formed in such a size as to cover the entire plurality of elements 1.

  In addition to the effect obtained by the case mold type capacitor according to the first embodiment, the case mold type capacitor according to the present embodiment configured as described above can be obtained by simply changing the pattern of the conductive portion 7a of the double-sided substrate 7. Thus, it is possible to freely change the arrangement of the elements 1 and to use elements having different widths.

(Embodiment 3)
The third aspect of the present invention will be described below with reference to the third embodiment.

  The present embodiment is different in that a plurality of elements having different uses are connected in parallel as the elements of the case mold type capacitor described with reference to FIGS. 1 to 5 in the first embodiment. Since the configuration is the same as that of the first embodiment, the same reference numerals are given to the same portions and the detailed description thereof is omitted, and only different portions will be described in detail below with reference to the drawings.

  FIG. 7 is an exploded perspective view showing the configuration of the case mold type capacitor according to Embodiment 3 of the present invention. In FIG. 7, 9 is a double-sided board, and the surface of the connection hole 9c provided in this double-sided board 9 One of the conductive portions 9a provided on the front and back surfaces of the double-sided board 9 by inserting the board connecting part 4b of the external terminal 4 from the side and soldering this board-connecting part 4b on the back side of the double-sided board 9 It is intended to be electrically connected to the conductive portion 9a on one surface.

  Similarly, a plurality of electrode terminals 2 connected to the respective electrodes of the elements 1 and 10 having different uses (five in the present embodiment, but the present invention is not limited thereto). The board connection portion 2b is inserted into the connection hole 9c provided in the double-sided substrate 9 from the back side, and soldered on the front side of the double-sided substrate 9, whereby the conductive portions 9a provided on the front and back sides of the double-sided substrate 9 respectively. The P electrode 1a of the element 1 and the P electrode 10a of the element 10 are connected to the double-sided substrate 9 in FIG. The N-pole electrode 1b of the element 1 and the N-pole electrode 10b of the element 10 are connected to the conductive part 9a on the back surface side of the double-sided substrate 9, respectively.

  Reference numeral 8 denotes a resin case, and 6 denotes a mold resin filled in the case 8. The mold resin 6 includes a plurality of elements 1 and 10 connected to the double-sided substrate 9 for different purposes in the case 8. It is housed and resin-molded with a part of the external terminal 4 (on the side of the connection hole 4a) exposed. In this state, the double-sided substrate 9 is placed above the plurality of elements 1 and 10 having different uses. In addition, the double-sided substrate 9 is formed in such a size as to cover the plurality of elements 1 and 10 as viewed from above.

  The case mold type capacitor according to the present embodiment configured as described above can be used only by changing the pattern of the conductive portion 9a of the double-sided substrate 9 in addition to the effect obtained by the case mold type capacitor according to the first embodiment. Not only can a plurality of different elements 1 and 10 be freely arranged, but also there is no restriction on the arrangement of the elements, so that the current flowing in one element can be reduced by using a plurality of smaller one elements. As a result, it is possible to reduce heat generation and reduce heat generation.

  The case mold type capacitor according to the present invention has an effect of reducing inductance and simultaneously realizing a reduction in size, weight and cost, and is particularly useful as a capacitor for an automobile such as a hybrid car. is there.

1 is an exploded perspective view showing the configuration of a case mold type capacitor according to Embodiment 1 of the present invention. Cross section (A) The top view which showed the double-sided board used for the case mold type capacitor, (b) The front view, (c) The bottom view A perspective view showing another example of the case mold type capacitor Plan view showing electrode terminals used in the case mold type capacitor The disassembled perspective view which showed the structure of the case mold type capacitor | condenser by Embodiment 2 of this invention The disassembled perspective view which showed the structure of the case mold type capacitor by Embodiment 3 of this invention (A) Plan sectional drawing which showed composition of conventional case mold type capacitor, (b) Front sectional view

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 10 Element 1a, 10a P pole electrode 1b, 10b N pole electrode 2 Electrode terminal 2a Element connection part 2b, 4b Board connection part 3, 7, 9 Double-sided board 3a, 7a, 9a Conductive part 3b Insulation part 3c, 4a, 7c, 9c Connection hole 4 External terminal 5, 8 Case 6 Mold resin

Claims (6)

An element provided with a pair of electrodes on both end faces;
An electrode terminal having one end connected to each electrode of the element;
A double-sided substrate to which the other end of the electrode terminal is connected;
And external terminal whose one end is connected to the double-sided board,
A case containing these,
Ri Do from been insulative molding resin filled in the case in a state where the other end of the external terminal is exposed to the outside,
These electrode terminals, double-sided board, external terminals are provided separately,
The board connecting portion provided protruding from the other end of the electrode terminal is inserted into the connecting hole of the double-sided board, and the board connecting portion provided protruding from the one end of the external terminal is used as the connecting hole of the double-sided board. A case mold type capacitor in which the electrode terminal and the external terminal are electrically connected by being inserted . 2. The case mold type capacitor according to claim 1, wherein one electrode of the element is connected to one surface of the double-sided substrate, and the other electrode of the element is connected to the other surface of the double-sided substrate. The case mold type capacitor according to claim 1, wherein a double-sided substrate is disposed in the upper part of the element, and these are resin-molded in the case. The case mold type capacitor according to claim 3, wherein the double-sided substrate is formed so as to cover the element in a top view. The case mold type capacitor according to claim 1, wherein a plurality of elements are connected in parallel. The case mold type capacitor according to claim 1, wherein a plurality of elements having different uses are connected in parallel.

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