JP2020031087A - Electronic device module and manufacturing method thereof - Google Patents

Abstract

To provide an electronic device module or the like having a lead wire that is more firmly fixed by further improving vibration resistance and shock resistance against stress from all directions without using a soldering process.SOLUTION: An electronic device module includes an electronic device and a case that houses the electronic device, and the electronic device includes a lead wire, and the lead wire is locked to the case so as to be pressed from different directions by first locking means and second locking means disposed on the case.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device module in which a plurality of electronic devices such as capacitors are mounted in a case, a method of manufacturing the same, and the like.

  Various types are conventionally known as a method for arranging, mounting, and fixing an electronic device having a lead wire in a case. As a typical typical example of a substrate mounting method, there is a connection fixing method by soldering. In general, it is known that, in the connection fixing method by soldering, the quality tends to vary due to complicated processes, and the work management thereof is also complicated, and the mounting cost tends to increase.

  On the other hand, Patent Literature 1 below discloses a method for mounting an electronic component without using a soldering process, which includes a stopper for inserting a lead wire between busbar terminals for electrical connection and preventing a terminal from being disconnected. A method of mechanically securing is also disclosed.

JP-A-51-69166

  In the method disclosed in Patent Document 1, the lead wire is fixed by press-fitting the lead wire from above into the gap of the stopper, but since the press-fitting is configured to be able to operate in the opposite direction, the lead wire is connected to the lead wire. When an upward force is applied, it is considered that the lock is released from the gap at the insertion site.

  For this reason, in the method described in Patent Document 1, it is considered that the fixing and the stable holding in the insertion direction of the lead wire are insufficient for the demand for high vibration resistance and high shock resistance for in-vehicle use and the like. Conceivable.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and has a more secure vibration and impact resistance against stresses and loads from all directions without using a soldering process. It is an object of the present invention to provide an electronic device module or the like having a lead wire provided.

  An electronic device module according to the present invention is an electronic device module including an electronic device and a case that houses the electronic device, wherein the electronic device includes a lead wire, and the lead wire includes a first locking unit disposed on the case and a second locking unit. The two locking means presses and locks the case from different directions.

  The electronic device module according to the present invention is preferably characterized in that the first locking means and the second locking means each include a configuration in which the first locking means and the second locking means are sandwiched by press-fitting or press-fitting.

  Further, the electronic device module of the present invention is further preferably characterized in that at least one of the locking means is provided at two places, and the other locking means is provided between the two locking means.

  Further, the electronic device module of the present invention is further preferably characterized in that one of the two locking means is a terminal block for pressing the terminal.

  Further, the electronic device module of the present invention is further preferably characterized in that the second locking means is a lead wire receiving recess provided on the bus bar.

  Further, the electronic device module of the present invention is further preferably characterized in that the first locking means is provided on the case, and the second locking means is provided on the bus bar.

  Further, the electronic device module of the present invention is more preferably characterized in that the direction in which the terminal block supports the lead wire is opposite to the direction in which the lead wire is inserted into the clip portion.

  Further, the electronic device module of the present invention is further preferably characterized in that the insertion direction of the lead wire into the bus bar is the same as the direction in which the terminal block supports the lead wire.

  Further, the electronic device module of the present invention is further preferably characterized in that the case includes a partition wall for separating the electronic devices from each other.

  Further, the electronic device module of the present invention is further preferably characterized in that at least a lead wire of the electronic device is resin-molded.

  Further, a method for manufacturing an electronic device module according to the present invention is a method for manufacturing an electronic device module including an electronic device and a case for accommodating the electronic device, wherein a lead wire of the electronic device module is disposed on the case. The method is characterized in that it has a step of locking the case by being sandwiched by the locking means and the second locking means.

  It is possible to provide an electronic device module or the like including a lead wire which is further improved in vibration resistance and impact resistance against stresses and loads from all directions without using a soldering step and which is firmly fixed.

It is a figure explaining the composition of the electronic device module of this embodiment, and its manufacturing method, (a) is a figure explaining signs that a plurality of electronic devices are mounted in a case, (b) is a case and an electronic device FIG. 7C is a diagram illustrating a state in which a bus bar is mounted on the case, and FIG. 4C is a diagram illustrating a state in which the bus bar mounted on the case and the electronic device is fixed to the case with bolts. It is a figure explaining composition which fixes a lead of an electronic device, (a) is a perspective view explaining one electronic device and a lead, and (b) expands and explains a lead and its circumference. FIG. FIG. 4 is a diagram illustrating a state in which the inside of the case of the electronic device module is filled with a mold resin. FIG. 2 is a diagram illustrating a state of the electronic device module in a state illustrated in FIG. 1B before mounting the bus bar, that is, a diagram illustrating a state in which the electronic device is mounted on a case. It is a figure explaining the relationship between an anode bus bar and an anode lead, and a cathode bus bar and a cathode lead. It is a figure explaining the composition outline of the electronic device module concerning a second embodiment. FIG. 8 is a schematic configuration diagram illustrating a cross-sectional state of the electronic device module according to the second embodiment, which is cut along a plane including all the lead wires.

  The electronic device module described in the present embodiment includes first locking means in which a lead wire is supported upward from the lower side of the case when mounted on the case. A plurality of first locking means may be provided, one of which may be a terminal block on which a lead wire is placed, and the other may be a clip portion between which the lead wire is sandwiched. The terminal block and the clip portion may be integrally formed at the same time when the case is formed, or may be added later after the case is formed. Further, in the electronic device module described in the present embodiment, in a state where the electronic device is locked to the case by the first locking device, the lead wire is connected to the bus bar as the second locking device inserted from above. The lead wire is sandwiched between the lead wire receiving recesses, and the lead wire is pressed downward at this location. That is, the lead wire is pressed and locked to the case by the first locking means and the second locking means from directions different from each other.

  As a result, the lead wire is securely fixed to the case, so that even if shock or vibration is applied, the lead wire is stably fixed and locked. When pressed from different directions, the movement is restricted in any direction, so that it cannot be moved, and as a result, it is securely fixed. Further, since the fixing member is fixed in a direction other than the pressing direction by the frictional force corresponding to the pressing, the vibration resistance and the shock resistance in all directions are improved.

  In addition, the first locking means and the second locking means can sandwich the lead wire by press fitting or press fitting, respectively. Here, press-fit or press-fit refers to locking by inserting a lead wire into a hole, a gap, or the like. In addition, the clip part of the case where the lead wire is sandwiched and the lead wire receiving recess of the bus bar are formed in a trench shape that sandwiches the lead wire from the left and right direction, so that the lead wire does not move even in the left and right direction and is fixed Will be done. By setting the width of the trench to be slightly smaller than the diameter of the lead wire, the lead wire sandwiched between the clip portion and the lead wire receiving recess is stably fixed without shifting or moving.

  Further, the second locking means having the lead wire receiving concave portion is disposed between the terminal block on which the lead wire is placed and the first locking means having the clip portion. That is, the lead wire is supported from below at two places by the case, and even if the lead wire is pressed from above by the bus bar therebetween, the lead wire can be fixed without being bent.

  The bus bar is electrically connected to the lead wire regardless of directly or indirectly, and has a function of supplying power to the electronic device, but the bus bar directly contacts the lead wire, and the bus bar contacts the lead wire. By pressing and fixing the lead wire at the location, the bus bar has both functions of electrical connection and mechanical fixing. By making the bus bar at the abutting portion a lead wire receiving concave portion, the lead wire is easily stored in the concave portion, and the stability when the lead wire is stored is further improved. Further, since the concave portion also has a guide function, the positioning and positioning operation for accommodating the lead wire in the concave portion is further facilitated.

(First embodiment)
FIG. 1 is a diagram illustrating a configuration of an electronic device module 1000 according to the present embodiment and a method for manufacturing the same. FIG. 1A is a diagram illustrating a configuration in which a plurality of electronic devices 1200 are mounted on a case 1100. FIG. 1B is a diagram illustrating a state where the bus bar 1300 is mounted on the case 1100 and the electronic device 1200. FIG. 1C is a diagram illustrating the bus bar 1300 mounted on the case 1100 and the electronic device 1200. It is a figure explaining the state fixed to case 1100 with bolt 1500.

  In the first embodiment, the electronic device is a polar electronic component having an anode and a cathode provided with a lead wire, and a pair of terminals is drawn out in one end face of a cylindrical case portion in the axial direction. The drawn-out lead wire is bent at a certain length so that the terminals are separated from each other in a direction perpendicular to the right angle. The electronic device includes a power storage device such as an electric double layer capacitor and a lithium ion battery, and a resistance element.

  The case is formed of a synthetic resin, has a storage portion for storing the electronic device, and has a peripheral wall surrounding the storage portion. At the bottom of the case, a plurality of terminal blocks, which are first locking means, and a plurality of clip portions are provided. A gap of about 0.5 to 5 mm is provided between the terminal block and the clip portion so that a bus bar having a second locking means described later can be sandwiched therebetween.

  FIG. 1A is a diagram illustrating a process of housing an electronic device having a lead wire bent in a case. At this time, the electronic device is temporarily fixed to the case by the lead wire of the electronic device being sandwiched between the clip portions serving as the first locking means provided on the case and being mounted on the terminal block.

  Further, as shown in FIG. 1 (b), the bus bar is provided with a plurality of lead receiving recesses which sandwich the lead. A bus bar provided with a second locking means is mounted from above the electronic device temporarily fixed to the case, and the lead wire is provided by a first locking means provided on the case and a second locking means provided on the bus bar, The electronic device is pressed and locked to the case from different directions, and the electronic device is firmly fixed to the case. At this time, by arranging the bus bar in the gap provided between the terminal block and the clip portion, the lead wire can be supported by the clip portion and the terminal block from below with respect to pressing from above by the bus bar, so that the lead wire is bent. Without being fixed to the case. The same effect can be obtained even if the terminal block is replaced with a clip portion.

  Further, the electronic device module 1000 can be screw-fixed to another device or a housing together with the case 1100 by a plurality of bolts 1510 inserted from the bottom side of the case 1100. In FIG. 1B, a nut 1520 is an auxiliary tool when the bus bar 1300 is fixed to the case with screws.

  Further, as shown in FIG. 1C, the plurality of bus bars 1300 are fastened with bolts 1500 via the auxiliary plate 1400, and are pressed and fixed thereby, thereby electrically connecting the plurality of electronic devices and Thus, the plurality of busbars 1300 can be fixed to the case 1100 more firmly and stably.

  The configuration shown in the first embodiment is an example, and the electronic device module of the present invention and the manufacturing method thereof are not limited to the above-described configuration. Further, in the manufacturing method described in the first embodiment, the electronic device is temporarily fixed to the case by sandwiching a lead wire in a clip portion serving as a first locking means in which the electronic device is arranged in the case. A bus bar having a lead wire receiving recess serving as a double locking means is mounted from above the case, and the lead wire is pressed from different directions to fix the electronic device to the case, but the present invention is not limited to this. After inserting the lead wire of the electronic device into the lead wire receiving recess provided on the bus bar as the second locking means, the electronic device is fixed to the case by inserting the lead wire into the clip portion as the first locking means. May be. In any of the manufacturing methods described above, the lead wire provided in the electronic device can be pressed and fixed to the case from different directions by the first locking means and the second locking means. .

  FIG. 2 is a diagram illustrating a configuration for fixing the lead wire 1210 of the electronic device 1200, and FIG. 2A is a perspective view illustrating a configuration for fixing the electronic device 1200 and the lead wire 1210. 13B is an enlarged view illustrating the lead wire 1210 and its surroundings. In FIG. 2, the bus bar 1300 is shown in a semi-transmissive state for convenience of explanation.

  As can be understood from FIG. 2, the lead wire 1210 is supported upward from below the sheet by a terminal block 1110 and a clip portion 1120 which are first locking means provided on the case 1100 (indicated by an upward arrow). ). Further, the lead wire 1210 is pressed downward from above between the clip portion 1120 and the terminal block 1110 by the lead wire receiving recess 1310 which is the second locking means provided on the bus bar 1300 (downward). Arrows).

  Thereby, the lead wire 1210 is restricted from moving up and down by the vertical pressing by the first locking means and the second locking means, and is stably fixed. Further, since the lead wire 1210 is sandwiched between the clip portion 1120 and the lead wire receiving concave portion 1310, the lead wire 1210 is stably fixed also in the direction orthogonal to the axial direction of the electronic device 1200 and the bus bar 1300. Has a positional relationship sandwiched between the clip portion 1120 and the terminal block 1110 from the left and right, so that left and right movements are restricted, thereby improving vibration resistance and shock resistance.

  In addition, it is preferable that the height relationship between the concave bottom portion of the clip portion 1120 and the terminal block 1110 is equal, and the lead wire 1210 of the mounted electronic device 1200 is stably placed. When the bus bar 1300 is inserted from above, the lead wire 1210 is fixed without being bent.

Further, in the positional relationship between the clip portion 1120 as the first locking means and the terminal block 1110, it is preferable that the clip portion 1120 is arranged at least on the electronic device 1200 side. Thus, the lead wire 1210 can be locked to the case 1100 at a position closer to the electronic device 1200, and thus the lead wire 1210 can be prevented from being bent.

Further, it is preferable that the distal end of the lead wire 1210 placed on the terminal block 1110 be fitted without protruding from the top of the terminal block 1110. Accordingly, the terminal block acts as a barrier, so that contact between the lead wire 1210 and another electronic device can be avoided, so that a short circuit can be prevented.

  Further, the clip portion 1120 and the lead wire receiving recess 1310 are configured so that the width thereof is slightly smaller than the diameter of the lead wire 1210, so that the fixing to the sandwiched lead wire 1210 and the pressing force are stronger. Becomes However, without being limited to this, for example, the width of the clip portion 1120 can be set to be equal to or slightly larger than the lead wire 1210.

  FIG. 3 is a diagram illustrating a state where the inside of the case 1100 of the electronic device module 1000 is filled with the mold resin 1600. Molding can be performed without leakage of the filled resin from the peripheral wall surrounding the storage section in which the electronic device 1200 is stored. The resin is such that the terminal block 1110 and the clip portion 1120 are fixed by being substantially embedded in the lower half of the electronic device 1200, all of the lead wires 1210, and almost all of the bus bars 1300 in the mold resin 1600. In addition, the heat radiation characteristics can be improved and the vibration resistance can be further enhanced.

  In particular, by fixing the lead wire 1210 sandwiched between the clip portion 1120 and the lead wire receiving concave portion 1310 and a gap around the lead wire 1210 with resin, the fixing force to the lead wire 1210 is further improved.

  FIG. 4 is a diagram illustrating a partially enlarged configuration of the electronic device module 1000 in the state shown in FIG. 1B before the bus bar 1300 is mounted. That is, the electronic device 1200 is mounted on the case 1100. It is a figure which partially demonstrates the mounted aspect. In FIG. 4, the case 1100 is shown translucently for convenience of explanation.

  As can be understood from FIG. 4, the lead wire 1210 of the electronic device 1200 is placed on the terminal block 1110 arranged on the case 1100 and is sandwiched between the clip portions 1120. The width of the clip portion 1120 can be, for example, a tapered shape that gradually narrows with the insertion depth. Here, it is preferable that the lead wire 1210 be firmly held by the clip portion 1120, but the present invention is not limited to this.

  In addition, a regulating unit that regulates the movement of the bus bar attached to the case may be provided by disposing the convex portion 1125 provided integrally with the first locking unit. The protrusion 1125 can prevent the bus bar 1300 from being accidentally moved and separated in the case. The projection 1125 may be provided separately from the first locking means.

  FIG. 5 is a diagram in which the electronic device module is observed from above, and illustrates the relationship between the anode bus bar 1310 and the anode lead wire and the relationship between the cathode bus bar 1320 and the cathode lead wire. The bus bar 1300 attached to the case has polarity from a functional viewpoint, and includes an anode bus bar 1310 and a cathode bus bar 1320. (In this document, the anode bus bar 1310 and the cathode bus bar 1320 are collectively referred to as a bus bar 1300.) The bus bar connected to the auxiliary plate 1400 (1) arranged on the left side of FIG. The bus bar connected to the auxiliary plate 1400 (2) arranged in the column is a cathode bus bar 1320. In other words, it can be understood that the anode bus bars 1310 and the cathode bus bars 1320 are alternately mounted on the case from the upper side to the lower side of the drawing. On both sides of the anode and cathode busbars 1310, 1320, a plurality of electronic devices 1200 are arranged in a row along the busbars. At this time, electronic device 1200 is arranged so that the polarity of the lead wire of electronic device 1200 and the polarity of the bus bar match. Specifically, the cathode leads of the electronic devices arranged in a line along one side of the cathode bus bar 1320, and the cathode leads of the electronic devices arranged in a line along the other side of the cathode bus bar 1320, Similarly, the anode leads of the electronic devices 1200 arranged on both sides of the anode bus bar 1310 are also arranged and connected so as to be located on the cathode bus bar 1320 side. ing.

  In order to increase the efficiency of storing the electronic device 1200 in the case, first locking means for sandwiching the lead wires of the electronic devices arranged in a row on one side of the bus bar 1300 and a row on the other side of the bus bar 1300 By alternately installing the first locking means for sandwiching the lead wires of the arranged electronic devices along the longitudinal direction of the bus bar at the position where the bus bar is to be arranged, the electronic devices arranged in a row are arranged via the bus bar. The electronic devices are arranged in a zigzag pattern, and the mounting efficiency of the electronic device in the case can be improved.

(Second embodiment)
FIG. 6 is a diagram illustrating an outline of a configuration of an electronic device module 2000 according to the second embodiment. The electronic device module 2000 according to the second embodiment has the same configuration as that of the first embodiment except that the case 1100 includes a partition wall 1130 having an X-shape in plan view for partitioning the individual electronic devices 1200. It is.

  Providing the partition wall 1130 increases the probability that the electronic devices 1200 can be separately supported. It is preferable that the partition wall 1130 is at least half the height of the electronic device 1200. In a natural state, the partition wall 1130 does not necessarily need to be physically in contact with and support the electronic device 1200, but may have a function of separating and independently separating each electronic device 1200.

  FIG. 7 is a schematic configuration diagram illustrating a cross-sectional state of the electronic device module 2000 according to the second embodiment cut along a plane including the entire lead wire 1210, and FIG. 7A is a perspective view. FIG. 7B is a front view.

  In FIG. 7, two arrows are shown in the upward direction and one arrow is shown in the downward direction with respect to the lead wire 1210, and the arrows indicate the lead from the terminal block 1110, the lead wire receiving recess 1310 and the clip portion 1120. It shows a typical example of the direction of the force applied to the line 1210.

  As can be understood from FIG. 7, the lead wire 1210 is firmly fixed by applying both a pressing force from above and a supporting force from below in a linear portion parallel to the bottom surface of the case 1100. As a result, it is stably supported in a well-balanced manner.

  Further, for example, a convex portion 1150 serving as a stopper for positioning the height of the electronic device 1200 to be mounted may be provided in the case. Accordingly, even if the force for inserting the electronic device 1200 from above is excessive, the excessive insertion downward can be limited by supporting the electronic device 1200 on the bottom surface of the electronic device 1200. The lead wire 1210 can be prevented from being bent around the portion as a fulcrum.

  The electronic device module and the like of the present invention are not limited to the configurations, mechanisms, and methods described in the above embodiments, and the configurations may be appropriately changed within a scope obvious to those skilled in the art and within the technical idea of the present invention. It can be changed, applied in combination, and the method can be changed.

  INDUSTRIAL APPLICATION This invention is suitable for the mounting module of several electronic components which a capacitor is a typical example.

  1000 electronic device module, 1100 case, 1110 terminal block, 1120 clip part, 1130 partition wall, 1200 electronic device, 1300 busbar, 1310 lead wire receiving recess, 1400 ..Auxiliary plate, 1500..bolt, 1600..resin.

Claims (10)

An electronic device module including an electronic device and a case for housing the electronic device,
The electronic device includes a lead wire, and the lead wire is pressed and locked to the case by different first directions by a first locking unit and a second locking unit disposed on the case. An electronic device module characterized by the following. The electronic device module according to claim 1,
The electronic device module according to claim 1, wherein the first locking means and the second locking means each include a configuration in which the first locking means and the second locking means are sandwiched by press fitting or press fitting. The electronic device module according to claim 1 or 2,
An electronic device module comprising: at least two of one of the locking means; and the other locking means between the two locking means. The electronic device module according to claim 3,
An electronic device module, wherein one of the two locking means is a terminal block that presses the lead wire. The electronic device module according to claim 4,
The electronic device module according to claim 1, wherein the first locking means is provided on the case, and the second locking means is provided on a bus bar. The electronic device module according to any one of claims 1 to 5,
The plurality of electronic devices are arranged on both sides of a bus bar,
The electronic device module, wherein the lead wires of the electronic devices arranged on both sides are respectively connected to the bus bars. The electronic device module according to claim 6,
The electronic device module, wherein the plurality of electronic devices are arranged in a staggered manner in the case. The electronic device module according to any one of claims 1 to 7,
The electronic device module, wherein the case includes a partition wall separating the electronic devices from each other. The electronic device module according to any one of claims 1 to 8,
An electronic device module, wherein at least the lead wire of the electronic device is resin-molded. A method for manufacturing an electronic device module including an electronic device and a case for housing the electronic device,
A method for manufacturing an electronic device module, comprising a step of sandwiching a lead wire of the electronic device module between a first locking means and a second locking means arranged in the case and locking the lead wire to the case. .