JP5982232B2 - Cooling system - Google Patents

Description

  The technology disclosed herein relates to a cooling device that cools a heating element.

  In Patent Document 1, as a device for cooling a heating element that is a component to be cooled, a forward path and a return path as a flow path through which cooling air flows are connected to a heat transfer plate to which a plurality of heating elements are attached. A device is provided that is laminated so that heat can be transferred to each other in the plate thickness direction. The cooling device having this configuration uniformly cools the plurality of heating elements arranged in the flow direction of the cooling air while the cooling air that has passed through the forward path is reversed and passes through the return path. That is, the temperature of the plurality of heating elements is made the same.

  Regarding the mechanism, Patent Document 1 describes the following. That is, in the cooling device having the forward path and the return path, the heat loads of the plurality of heating elements arranged in the predetermined arrangement direction are the same as each other, and therefore, as shown in FIG. In addition, the temperature of the cooling fluid flowing along the arrangement direction in the return path that receives heat from each heating element rises at a constant rate from the downstream side toward the upstream side. In other words, the temperature rise line indicating the temperature change of the cooling fluid with respect to the position in the cooling device is a straight line having a predetermined slope. On the other hand, the heat transfer state between the return path and the forward path is also set uniformly in the direction in which the heating elements are arranged, and the flow direction of the cooling fluid in the forward path is opposite to that of the return path. The temperature rise line of the cooling fluid in is reversed with the same inclination as the return path.

  Therefore, in the cooling device having the forward path and the return path, the temperature of the cooling water is the lowest near the inlet of the forward path, the temperature of the coolant is the highest near the outlet of the return path, and the communication portion between the forward path and the return path In the vicinity, the temperature difference of the cooling water between the forward path and the return path becomes small. As a result, the average temperature of the temperature of the cooling fluid flowing in the forward path and the temperature of the cooling fluid flowing in the return path is constant in the alignment direction. Therefore, in the cooling device described in Patent Document 1, It becomes possible to make the temperature of the several heat generating body of the same heat load the same mutually.

Japanese Patent No. 4913333

  The cooling device described in Patent Document 1 can uniformly cool a plurality of heating elements when the heat loads of the plurality of heating elements are the same.

  On the other hand, when the heat loads of the plurality of heating elements are different, the cooling device having the above-described configuration can not only make the temperatures of the plurality of heating elements the same, but also the plurality of heating loads are different. Depending on the arrangement order of the heating elements, the temperature of the heating element with the highest heat load is further increased, that is, the peak temperature of the plurality of heating elements is increased. I noticed.

  The technology disclosed herein has been made in view of such a point, and the object is to reduce the peak temperature in a cooling device that cools a plurality of heating elements including heating elements having different thermal loads. There is in making it possible.

  As described in Patent Document 1, when the heat loads of a plurality of heating elements are the same as each other, the heating elements may be cooled with the same cooling capacity, but the heat loads of the plurality of heating elements arranged in the arrangement direction are different. When doing so, there is no need to cool each heating element with the same cooling capacity. For the purpose of lowering the peak temperature, a heating element with a relatively high heat load is cooled with a relatively high cooling capacity, whereas a heating element with a relatively low heat load is relatively cooled. It is preferable to cool with a low cooling capacity.

  When the heat loads of a plurality of heating elements arranged in the arrangement direction are different, the amount of heat received by the cooling fluid is relatively large in the vicinity of a heating element with a relatively high heat load. In the vicinity of the heating element that is relatively high and the heat load is relatively low, the amount of heat received by the cooling fluid is relatively small, so that the temperature rise is relatively low. That is, the temperature rise line of the cooling fluid flowing in the return path does not have a constant slope.

  Further, because the temperature rise line of the cooling fluid flowing in the return path does not have a constant slope, the temperature rise line of the cooling fluid flowing in the forward path also does not have a constant slope. As a result, it is impossible to cool a heating element with a relatively high heat load with a high cooling capacity, or conversely, a heating capacity that is higher than necessary for a heating element with a relatively low heat load. Sometimes it will be cooled. This is the reason why the peak temperature becomes high when cooling a plurality of heating elements including heating elements having different thermal loads.

  Accordingly, the inventors of the present application have made cooling that flows in the forward path by appropriately changing the heat transfer state between the forward path and the backward path in the arrangement direction of the heating elements according to the distribution of the thermal load by the plurality of heating elements. By controlling the temperature rise of the working fluid and the temperature rise of the cooling fluid flowing in the return path, respectively, thereby cooling the heating element arranged at a predetermined position with the cooling capacity corresponding to the heat load. The peak temperature can be lowered.

  Specifically, the technology disclosed herein relates to a cooling device that cools a plurality of heating elements, and a plurality of heating elements including heating elements having different thermal loads are arranged in a predetermined alignment direction with respect to the mounting surface. A heat transfer plate attached so as to be capable of transferring heat, a part of the heat transfer plate being partitioned by a section screen opposite to the mounting surface of the heat transfer plate, and the heat generation from one side of the arrangement direction to the other side A return path configured to allow a body cooling fluid to flow, disposed on the opposite side of the heat transfer plate across the return path, and one end of the arrangement direction communicating with one end of the return path In addition, the forward fluid configured to flow the cooling fluid from the other side of the arrangement direction toward the one side, the cooling fluid flowing through the backward route, and the cooling fluid flowing through the forward route A heat transferable structure configured to allow heat transfer, and Heat transfer between the cooling fluid flowing in the return path and the cooling fluid flowing in the forward path is possible at the position different from the heat transferable structure with respect to the arrangement direction. A heat transfer suppressing structure configured to suppress heat transfer in the structure.

  According to this structure, the some heat generating body attached to the heat exchanger plate along with the predetermined arrangement direction contains the heat generating body from which a thermal load differs. Specifically, when the first and second heating elements are provided, the thermal load of the first heating element and the thermal load of the second heating element are different from each other. When the first to third heating elements are provided, the heat load of the first heating element and the heat load of the second heating element are the same, while the heat load of the third heating element is the same. Is different (higher or lower), or the heat load of the first heating element, the heat load of the second heating element and the heat load of the third heating element are different from each other. . The same applies when there are four or more heating elements.

  The forward path and the backward path through which a cooling fluid (for example, a liquid such as cooling water or a gas such as cooling air) flows are arranged so as to overlap in the order of the heat transfer plate, the backward path, and the forward path. The cooling fluid flows through the forward path in the direction in which the plurality of heating elements are arranged, and then flows into the backward path. The cooling fluid flows through the return path in a direction opposite to the flow direction in the forward path. Thus, heat transfer from the heating element to the cooling fluid is performed through the heat transfer plate, and at the same time, heat transfer from the cooling fluid in the return path to the cooling fluid in the return path is performed through the boundary between the forward path and the return path. The heating element is cooled.

  The cooling device having the above configuration includes a heat transferable structure that enables heat transfer between the cooling fluid that flows in the return path and the cooling fluid that flows in the forward path, the cooling fluid that flows in the return path, and the cooling fluid that flows in the forward path And a heat transfer suppression structure that suppresses heat transfer between the forward path and the return path in a plurality of heat transfer states. It becomes different without being uniform in the arrangement direction of the heating elements. Note that the heat transfer suppression structure includes heat insulation between the forward path and the return path.

  This configuration is based on the fact that the heat loads of the plurality of heating elements are not the same, and the cooling fluid flowing in the return path has different amounts of heat received from the heating elements from the cooling fluid in the return path. By controlling the amount of heat transfer to the cooling fluid to be different in the arrangement direction, it is possible to adjust the temperature rise of the cooling fluid in the forward path so as to be in a desired state. In other words, the temperature of the cooling fluid flowing in the forward path changes (that is, rises) as the cooling fluid flows from the upstream side to the downstream side, but the temperature of the cooling fluid is desired for each position of the cooling device. It becomes possible to make it become the temperature of.

  As a result, the temperature rise of the cooling fluid in the return path can also be adjusted to a desired state. Therefore, if the temperature of the cooling fluid flowing in the vicinity of the heat generating element having a relatively high heat load is relatively low in the return path, the high load heat generating element can be cooled with a high cooling capacity. The temperature of the high load heating element can be kept low. That is, the said structure enables the fall of peak temperature in the cooling device which cools the several heat generating body containing the heat generating body from which a thermal load differs.

  The heat transferable structure and the heat transfer suppression structure may be provided so as to correspond to the positions of the respective heating elements arranged in the arrangement direction.

  Corresponding to the position of each heating element, by providing a heat transferable structure and a heat transfer suppression structure, the temperature rise of the cooling fluid flowing in the forward path and the temperature rise of the cooling fluid flowing in the return path It becomes possible to adjust according to the position of the body. This is advantageous in cooling a desired high-load heating element with a high cooling capacity, and enables the peak temperature to be efficiently reduced.

  An inflow port through which the cooling fluid flows into the forward path and an outflow port through which the cooling fluid flows out from the return path are open to the other side of the arrangement direction, and the plurality of heat generations The body includes a high load heating element having a heat load equal to or higher than a predetermined value, and a low load heating element having a heat load lower than that of the high load heating element, and the low load heating element is positioned on the most other side in the arrangement direction. The heat transfer suppression structure may be provided corresponding to the position of the low load heating element.

  According to this configuration, since the position on the most other side in the arrangement direction, in other words, the vicinity of the outlet of the return path corresponds to the downstream side of the cooling fluid, the temperature of the cooling fluid becomes the highest, while the flow of the return path The temperature of the cooling fluid is lowest in the vicinity of the inflow path adjacent to the vicinity of the exit. Therefore, if heat transfer between the vicinity of the outlet of the return path and the vicinity of the inlet of the outbound path is enabled, the temperature of the cooling fluid increases on the upstream side of the outbound path. The temperature of the cooling fluid becomes high.

  With respect to such a temperature state of the cooling fluid, the heating element disposed at a position closest to the outlet of the return path is a low-load heating element having a relatively low thermal load. Cooling is possible without much reduction. On the other hand, the high-load heating elements having a relatively high heat load are arranged on the center side in the arrangement direction or on the side away from the outlet and the inlet, so as described above, the vicinity of the outlet and the outlet Heat transfer between the vicinity of the inlet and the temperature of the cooling fluid at the downstream side of the forward path and the return path becomes high, which is disadvantageous for cooling the high-load heating element. That is, the peak temperature can be high.

  On the other hand, the above-described configuration is configured to suppress heat transfer between the vicinity of the outlet of the return path where the temperature difference becomes the largest and the vicinity of the inlet of the outbound path. It is possible to keep the temperature of the cooling fluid at low. This makes it possible to keep the temperature of the high-load heating elements arranged on the center side in the arrangement direction or on the side away from the outflow port and the inflow port low. Therefore, the peak temperature in the plurality of heating elements decreases. Although the temperature of the cooling fluid in the vicinity of the outlet of the return path can be high, the heat load of the heating element disposed here is relatively low, so that the low-load heating element can be sufficiently cooled.

  The flow path structure that can constitute the flow path through which the cooling fluid flows is laminated in three or more layers in the laminating direction orthogonal to the arrangement direction with a partition plate capable of transferring heat interposed therebetween, It is constituted by a first layer flow path structure that is partly partitioned by a heat transfer plate, and the forward path is a second layer flow path structure adjacent to the first layer flow path structure in the stacking direction, And at least a third layer channel structure adjacent to the second layer channel structure in the stacking direction, and the second layer channel structure and the third layer channel structure are Each of the regions in the alignment direction is configured to be able to distribute the cooling fluid in the alignment direction, and in the flowable region in the second-layer flow channel structure and in the third-layer flow channel structure. The flowable area is in communication with the stacking direction, thereby The cooling fluid flowing in the forward path flows in the second layer flow path structure in a part of the arrangement direction, and flows in the third layer flow path structure in the other area. The possible structure is configured by the first layer channel structure and the second layer channel structure in the region where the cooling fluid flows, and the heat transfer suppressing structure is the first layer channel structure. And the flow path structure of the third layer in the region where the cooling fluid flows.

  According to this configuration, a specific structure of the cooling device including the heat transferable structure between the forward path and the return path and the heat transfer suppression structure is obtained. In other words, only a partition plate is interposed between the cooling fluid flowing in the first layer flow path structure and the cooling fluid flowing in the second layer flow path structure. Heat transfer becomes possible. On the other hand, since the second-layer flow path structure is interposed between the cooling fluid flowing in the first-layer flow path structure and the cooling fluid flowing in the third-layer flow path structure, Heat transfer between fluids is suppressed.

  Such a laminated structure cooling device can be manufactured by, for example, laminating partition plates and side bars that partition the side portions of the flow path between the partition plates and brazing them. In order to increase the heat transfer area, a corrugated plate may be provided in the flow path structure of each layer.

  The heat transferable structure is configured to include heat conduction members interposed between the forward path and the return path so as to be capable of conducting heat, and partitioning the forward path and the return path, respectively, It is good also as including the heat insulation member interposed between the going path and the said returning path, and suppressing the heat transfer between the said going path and the returning path.

  Also by using such a heat conducting member and a heat insulating member, it is possible to realize a heat transferable structure and a heat transfer suppressing structure between the forward path and the return path.

  As described above, according to the cooling device, the temperature increase of the cooling fluid flowing in the forward path and the cooling flowing in the return path are achieved by the heat transferable structure and the heat transfer suppression structure between the forward path and the return path. It is possible to appropriately adjust the temperature rise of the heating fluid, so that the temperature of the cooling fluid in the vicinity of the heating element having a relatively high thermal load in the return path is relatively low, and the heating element is set high. By cooling with the cooling capacity, the peak temperature can be lowered.

It is sectional drawing of a cooling device. It is a disassembled perspective view of a cooling device. It is a figure which illustrates the temperature rise line which shows the temperature change with respect to the position of the cooling water which flows in the flow path, and the temperature of a heat generating body. It is a conceptual diagram which shows the cooling device of another structure. It is a conceptual diagram which shows the cooling device of another structure.

  Hereinafter, an embodiment of a cooling device will be described based on the drawings. In addition, the following description of preferable embodiment is an illustration. FIG. 1 is a sectional view of the cooling device 1, and FIG. 2 is an exploded perspective view of the cooling device 1. The cooling device 1 is a device that cools a heating element such as an IGBT (Insulated Gate Bipolar Transistor) with cooling water as a cooling fluid. Cooling air may be used in place of the cooling water. The cooling device 1 in the illustrated example is configured to cool the first to third heating elements 21, 22, and 23. However, the number of heating elements to be cooled by the cooling device 1 is not particularly limited as long as it is two or more. The first to third heating elements 21 to 23 are arranged on the mounting surface 311 of the flat heat transfer plate 31 in a predetermined arrangement direction. That is, in FIG. 1, the first to third heating elements 21 to 23 are arranged on the upper surface of the heat transfer plate 31 at equal intervals in the left-right direction on the paper surface. Each of the heating elements 21 to 23 is attached to the heat transfer plate 31 so as to be able to transfer heat. In addition, the arrangement | positioning of a several heat generating body can employ | adopt an appropriate arrangement | positioning aspect. For example, a plurality of heating elements may be arranged at unequal intervals. Although not shown in the figure, rows of a plurality of heating elements arranged in a predetermined arrangement direction may be arranged side by side in a direction orthogonal to the arrangement direction (the depth direction in the drawing in FIG. 1).

  The first to third heating elements 21 to 23 are not the same thermal load as each other, the first and second heating elements 21 and 22 have a thermal load of a predetermined value or more, and the third heating element 23 The heat load is lower than that of the second heating elements 21 and 22. That is, the first and second heating elements 21 and 22 are high-load heating elements, and the third heating element 23 is a low-load heating element. Note that the low load heating element includes a heating element having zero heat load.

  The cooling device 1 includes a return path 72 through which cooling water flows from one side of the arrangement direction (left side of the paper in FIG. 1) to the other side (right side of the paper in FIG. 1) and a flow path through which the cooling water flows. And an outward path 71 through which cooling water flows from the side toward the one side. The return path 72 is partly partitioned by the lower surface of the heat transfer plate 31 (that is, the section screen 312), while the forward path 71 is disposed on the opposite side of the heat transfer plate 31 with the return path 72 interposed therebetween. On one side of the cooling device 1, the forward path 71 and the return path 72 are in communication with each other, so that the cooling water flowing in from the inlet 14 that opens to the other side surface of the cooling device 1 flows in the forward path 71 in the other direction. After flowing from the side toward the one side, it reaches the return path 72, flows from one side in the return path 72 toward the other side, and flows out from the outlet 15 that opens to the other side surface of the cooling device 1 (FIG. 1). (See arrow on).

  The cooling device 1 includes a heat transferable structure configured to be able to transfer heat between cooling water flowing in the forward path 71 and cooling water flowing in the return path 72, and cooling water flowing in the forward path 71 and cooling flowing in the return path 72. The heat transfer suppression structure in which the heat transfer between water is suppressed rather than the heat transfer possible structure is included. In order to realize a heat transferable structure and a heat transfer suppression structure, the cooling device 1 includes first to third flow path structures 11 to 13 as flow path structures constituting the forward path 71 and the return path 72. It consists of The first to third channel structures 11 to 13 are configured by laminating a plurality of partition plates and corrugated plates in a laminating direction (that is, the vertical direction) orthogonal to the arrangement direction. Specifically, as shown in FIG. 2, in order from the heat transfer plate 31 to which the heating elements 21 to 23 are attached, the first corrugated plate 51 and the first partition plate 41 that constitute the flow path structure of the first layer, The second and third corrugated plates 52 and 53 and the second partition plate 42 constituting the flow path structure of the second layer, the fourth and fifth corrugated plates 54 and 55 constituting the flow path structure of the third layer, and the third. Partition plates 43 are stacked. In this example, a plain corrugated plate is used as the corrugated plate, but the corrugated plate used in the cooling device 1 includes a perforated type, a louvered type, a herringbone type, and a plain type. Serrated type is included. The pitch of the corrugated plate can be set to an appropriate pitch. The pitch of the corrugated plate in the forward path 71 may be different from the pitch of the corrugated plate in the return path 72. Further, the pitch of the corrugated plates disposed in the heat transferable structure described later may be different from the pitch of the corrugated plates disposed in the heat transfer suppressing structure. Reference numerals 61 and 62 are side bars for partitioning the side portions in the flow path structures 11 to 13 of the first to third layers.

  The first partition plate 41 that partitions the lower side of the first-layer flow path structure 11 is formed with a through groove 411 penetrating in the plate thickness direction at one end portion in the arrangement direction. As will be described later, the through groove 411 constitutes a communication portion that connects the forward path 71 and the return path 72. The first corrugated plate 51 is disposed between the heat transfer plate 31 and the first partition plate 41 in such a direction that the peaks and valleys extend in the direction of alignment. The first corrugated plate 51 is intended to expand the heat transfer area while allowing the cooling water to flow in the alignment direction in the first-layer flow path structure 11. The flow path structure 11 of the first layer is also opened to one side in the arrangement direction, and this opening constitutes the outlet 15.

  The second partition plate 42 that partitions the lower side of the second-layer flow path structure 12 is formed with a through-groove 421 that penetrates in the plate thickness direction at an intermediate portion in the arrangement direction. The through-groove 421 constitutes a communication portion that communicates the second-layer channel structure 12 and the third-layer channel structure 13 with each other. Of the corrugated plates constituting the second-layer flow path structure 12, the second corrugated plate 52 is oriented so that the crests and troughs extend in the arranging direction on one side of the arranging direction with respect to the through grooves 421. It is arranged. On the other hand, the third corrugated plate 53 is disposed on the other side in the arrangement direction with respect to the through grooves 421 so that the crests and troughs extend in a direction perpendicular to the arrangement direction. Thus, in the second-layer flow path structure 12, the cooling water flows in the alignment direction in the region where the second corrugated plate 52 is disposed, whereas the region where the third corrugated plate 53 is disposed. The cooling water does not flow. The second corrugated plate 52 contributes to the expansion of the heat transfer area, while the third corrugated plate 53 has a function as a spacer in configuring the second-layer flow path structure 12. A seal member 63 (a member similar to the side bar 62) is provided between the through groove 421 and the third corrugated plate 53 in order to ensure the hermeticity of the flow path structure 12 of the second layer. ing.

  Among the corrugated plates constituting the third-layer flow path structure 13, the fourth corrugated plate 54 is arranged in such a manner that the crests and troughs are arranged on one side of the arrangement direction with respect to the through grooves 421 of the second partition plate 42. The fifth corrugated plate 55 is disposed on the other side in the arrangement direction with respect to the through grooves 421, and the crests and troughs extend in the arrangement direction. It is arranged by. As a result, in the third-layer flow path structure 13, the fourth corrugated plate 54 is disposed in the region where the fifth corrugated plate 55 is disposed, whereas the cooling water flows in the alignment direction. The area does not flow cooling water. Therefore, the fifth corrugated plate 55 contributes to the expansion of the heat transfer area, while the fourth corrugated plate 54 functions as a spacer in configuring the third-layer flow path structure 13. The third-layer flow path structure 13 opens to the other side in the arrangement direction, and this opening constitutes the inflow port 14. A seal member 63 (a member similar to the side bar 62) is also provided between the through groove 421 and the fourth corrugated plate 54 in order to ensure the hermeticity of the third-layer flow path structure 13. ing.

  The cooling device 1 having such first to third layer flow path structures 11 to 13 includes, for example, an aluminum heat transfer plate 31, partition plates 41 to 43, and corrugated plates 51 to 55 which are laminated. Can be manufactured by brazing each other. The cooling device 1 can also be manufactured from other materials.

  The forward path 71 of the cooling device 1 is configured by the third-layer and second-layer flow path structures 13 and 12, and the return path 72 is configured by the first-layer flow path structure 11. That is, the opening in the third-layer flow path structure 13 becomes the inflow port 14, and the cooling water flowing in from there passes through the portion where the fifth corrugated plate 55 is disposed, and passes through the through-groove of the second partition plate 42. 421, enters the second-layer channel structure 12 through the through groove 421. Then, the second corrugated plate 52 in the second-layer flow channel structure 12 passes through the portion where the second corrugated plate 52 is disposed to reach the through groove 411 of the first partition plate 41. The cooling water that has flowed into the first layer flow path structure 11 through the through-groove 411 of the first partition plate 41 flows in the first layer flow path structure 11 toward the other side in the alignment direction, It flows out from the outflow port 15 which is an opening of the flow path structure 11 of the first layer.

  Here, since the heat transfer plate 31 defines the upper side of the first-layer flow path structure 11, cooling that flows through the heat transfer plates 31 and the first-layer flow path structure through the heat transfer plate 31. The heat transfer state with water is proportional to the heat load of the heating elements 21-23.

  Then, in a region on one side of the second partition plate 42 with respect to the through groove 421, the cooling water flowing in the return path 72 (that is, the first layer flow path structure 11) and the forward path 71 ( That is, since only the second partition plate 42 capable of transferring heat is interposed between the cooling water flowing in the second layer flow path structure 12), the cooling water flowing in the return path 72 is present in this region. And the cooling water flowing in the forward path 71 is actively conducted. This region corresponds to a heat transferable structure.

  On the other hand, in the region on the other side of the second partition plate 42 in the arrangement direction from the through groove 421, the cooling water flowing in the return path 72 and the inside of the forward path 71 (that is, in the flow path structure 13 of the third layer). Since the flow path structure 12 of the second layer is interposed between the flowing cooling water, heat transfer between the cooling water flowing in the return path 72 and the cooling water flowing in the forward path 71 is performed in this region. Is rarely done. This region corresponds to the heat transfer suppression structure.

  Here, as is apparent from FIG. 1, the through groove 421 of the second partition plate 42 that serves as a boundary between the heat transferable structure and the heat transfer suppression structure is the second heating element 22, the third heating element 23, and the like. Is provided at an intermediate position. For this reason, the heat transferable structure and the heat transfer suppression structure are provided so as to correspond to the positions of the heating elements 21 to 23, respectively.

  Next, the cooling effect of the cooling device 1 including the heat transferable structure and the heat transfer suppression structure will be described with reference to FIG. FIG. 3 shows a temperature rise line (lower diagram) showing a change in cooling water temperature with respect to a position in the cooling device in the cooling device provided with the forward path 71 and the return path 72, and the first to third heating elements 21 to 23. It is a figure which illustrates temperature (upper figure). The solid line in FIG. 3 indicates the temperature rise line of the cooling water and the first to third heating elements 21 to 23 in the cooling device 1 including the heat transferable structure and the heat transfer suppression structure described with reference to FIGS. The two-dot chain line in FIG. 3 is the temperature of the conventional cooling device having the forward path 71 and the backward path 72, in other words, in the cooling apparatus not including the heat transfer suppression structure as shown in FIG. This is the temperature rise line of the cooling water and the temperatures of the first to third heating elements 21 to 23. The left-right direction in FIG. 3 corresponds to the left-right direction in FIG. In addition, the heat load of the 1st-3rd heat generating elements 21-23 is the 1st and 2nd heat generating elements 21 and 22 arrange | positioned in the position away from the inflow port 14 and the outflow port 15 as mentioned above. Is a high-load heating element, and the third heating element 23 disposed near the inlet 14 and the outlet 15 is a low-load heating element.

  In the cooling device having the forward path 71 and the return path 72, the cooling water flowing in the return path 72 receives the heat of each heating element while sequentially passing through the vicinity of the plurality of heating elements arranged in the arrangement direction. Basically, the temperature gradually rises from the downstream side to the upstream side in the flow direction, and becomes the highest at the outlet 15 (see the temperature rise line in FIG. 3). On the other hand, the cooling water flowing in the forward path 71 is at the lowest temperature immediately after the inflow of the inflow port 14 and gradually increases in response to the heat of the cooling water flowing in the return path 72 toward the upstream in the flow direction. Become. Therefore, although the temperature of the cooling water also gradually increases from the downstream side in the flow direction toward the upstream side, the flow direction of the cooling water is opposite in the forward path 71 and the return path 72, so the inclination direction of the temperature rise line is The reverse direction is opposite to that of the return path 72 (that is, in FIG. 3, the temperature rise line of the forward path 71 is an upward line, and the temperature increase line of the return path 72 is an upward line).

  Of the first, second, and third heating elements 21 to 23 arranged in order from the downstream side in the flow direction of the return path 72 to the upstream side with respect to the temperature rise of the cooling water, the first and second Since the second heating elements 21 and 22 are high-load heating elements and the third heating element 23 is a low-load heating element, the temperature of the second heating element 22 is the highest, and the first and third The temperature of the heating elements 21 and 23 is lower than the temperature of the second heating element 22.

  In the conventional cooling device, since the heat transfer state between the cooling water in the forward path 71 and the cooling water in the return path 72 is set uniformly in the alignment direction, the cooling water in the forward path 71 and the cooling of the return path 72 are cooled. In the vicinity of the inlet 14 and the outlet 15 where the temperature difference between the water and the water becomes the largest, heat transfer between the two becomes positive. As a result, the temperature of the cooling water flowing in the forward path 71 increases as indicated by the two-dot chain line in FIG.

  Therefore, in the vicinity of the second heating element 22 where the temperature is highest, the temperature of the cooling water in the forward path 71 is already high, and accordingly, the cooling water in the forward path 71 from the cooling water in the return path 72 correspondingly. The amount of heat transferred to is reduced, and the cooling performance of the second heating element 22 is reduced. As a result, the temperature of the second heating element 22 increases and the peak temperature increases (see the white circle in the upper diagram of FIG. 3).

  On the other hand, in the cooling device 1 having the heat transfer suppression structure, the vicinity of the inlet 14 and the outlet 15 where the temperature difference between the cooling water in the forward path 71 and the cooling water in the return path 72 becomes the largest is the heat transfer suppression. Since it is a structure, the heat transfer between both is suppressed. As a result, the temperature of the cooling water flowing in the forward path 71 hardly reaches high and reaches the vicinity of the second heating element 22. By maintaining the temperature of the cooling water flowing in the outward path 71 at a low temperature in this way, the amount of heat transfer from the cooling water in the return path 72 to the cooling water in the outward path 71 increases, and the cooling capacity for the second heating element 22 increases. . As a result, the temperature of the second heating element 22 which is a high load heating element is lower than that of the conventional cooling device. This lowers the peak temperature (see the black circle in the upper diagram of FIG. 3).

  Moreover, the temperature of the 1st heat generating body 21 also falls compared with the conventional cooling device 1 because the temperature of the cooling water in the outward path 71 becomes low. On the other hand, in the conventional cooling device and also in the cooling device 1 having the heat transfer suppression structure, the temperature of the cooling water flowing in from the inlet 14 is the same, and from the first to third heating elements 21 to 23. Since the total amount of heat received is the same, the cooling water temperature at the outlet 15 is also the same. Therefore, although the cooling performance for the third heating element 23 is higher in the conventional cooling device, the third heating element 23 is a low-load heating element in the first place, so that even if the cooling performance is not so high, it is sufficient. It is possible to cool down.

  The configuration of the cooling device is not limited to the configuration shown in FIGS. An appropriate configuration can be employed according to the thermal load of the plurality of heating elements. FIG. 4 shows another configuration example of the cooling device 10. The cooling device 10 has a structure capable of transferring heat at a position where the second heat generating element 22 is disposed, and the first and third heat generating devices are arranged. Each of the positions where the bodies 21 and 23 are disposed has a heat transfer suppression structure.

  Specifically, in the cooling device 10, the first and second through grooves 421 and 422 are formed in the central portion of the second partition plate 42, and the first partition portion 42 has a first end portion on one side. 3 through-grooves 423 are formed, thereby providing three locations where the second-layer channel structure 12 and the third-layer channel structure 13 communicate with each other. Then, the third corrugated plate 53 is disposed in the second layer flow path structure 12 on the other side in the arrangement direction with respect to the first through groove 421. On the other hand, the sixth corrugated plate 56 is disposed between the first through-groove 421 and the second through-groove 422 so that the peaks and valleys extend in the alignment direction, Between the through groove 422 and the third through groove 423, the seventh corrugated plate 57 is arranged in such a direction that the crests and troughs extend in a direction perpendicular to the arrangement direction. A fifth corrugated plate 55 is disposed in the third layer flow path structure 12 on the other side of the first through groove 421 in the arrangement direction. On the other hand, between the first through-groove 421 and the second through-groove 422, the eighth corrugated plate 58 is disposed in such a direction that the peak and valley extend in a direction perpendicular to the alignment direction. The ninth corrugated plate 59 is disposed between the second through-groove 422 and the third through-groove 423 in such a direction that the peaks and valleys extend in the alignment direction.

  With such a configuration, the cooling water flowing from the opening (that is, the inflow port 14) in the third-layer flow path structure 13 passes through the portion where the fifth corrugated plate 55 is disposed and passes through the first penetration. It reaches the groove 421, passes through the first through groove 421, and enters the flow path structure 12 of the second layer. Then, through the portion where the sixth corrugated plate 56 is disposed in the flow path structure 12 of the second layer, it reaches the second through groove 422, passes through the second through groove 422, Reenters the three-layer channel structure 13. Thereafter, the cooling water passes through the portion where the ninth corrugated plate 59 is disposed in the flow path structure 13 of the third layer, reaches the third through groove 423, the third through groove 423, The flow passes through the two-layer flow path structure 12 and the through groove 411 of the first partition plate 41 in order, and flows into the first-layer flow path structure 11. The cooling water flows in the first layer flow path structure 11 toward the other side in the alignment direction, and flows out from the outlet 15 which is the opening of the first layer flow path structure 11 (see the arrow in FIG. 4). ).

  Such a cooling device 10 includes, for example, the second heating element 22 when the second heating element 22 is a high load heating element and the first and third heating elements 21 and 23 are low load heating elements. Efficiently lowering the temperature of 22 can be advantageous in reducing the peak temperature.

  Note that the heat transferable structure and the heat transfer suppressing structure do not necessarily have to be provided corresponding to the position of the heating element.

  In addition, the cooling device is not limited to the three-layer structure including the first to third channel structures 11 to 13 as illustrated in FIGS. 1 and 4. You may comprise and comprise a flow-path structure. For example, the forward path 71 may be configured by a flow path structure having three or more layers, or the return path 72 may be configured by a flow path structure having two or more layers. Also, providing a flow path structure having four or more layers means that the position of the inlet 14 is on one side of the arrangement direction and the position of the outlet 15 is on the other side of the arrangement direction, or conversely, It may be advantageous in setting the arrangement of the inflow port 14 and the outflow port 15 such that the position 14 is located on the other side of the arrangement direction and the position of the outflow port 15 is located on one side of the arrangement direction.

  Further, the cooling device includes a flow path structure of three or more layers, and a heat transfer suppression structure is provided by not causing a part of the flow path structure to function as a flow path. It is possible to configure other than adopting the configuration. FIG. 5 conceptually shows the cooling device 100. As shown here, the heat transfer member 81 is interposed between the forward path 71 and the backward path 72 to form a heat transferable structure, while the forward path The heat transfer suppressing structure may be configured by interposing a heat insulating member 82 between 71 and the return path 72.

  As described above, the cooling device disclosed herein can reduce the peak temperature in a cooling device that cools a plurality of heating elements including heating elements having different thermal loads, and thus various heating elements such as IGBTs. It is useful as a cooling device for cooling.

DESCRIPTION OF SYMBOLS 1 Cooling device 10 Cooling device 100 Cooling device 11 1st layer flow path structure 12 2nd layer flow path structure 13 3rd layer flow path structure 14 Inlet 15 Outlet 21-23 Heat generating body 31 Heat exchanger plate 311 Attachment Surface 312 Section screen 41 First partition plate 42 Second partition plate 43 Third partition plate 71 Outward path 72 Return path 81 Thermal conduction member 82 Thermal insulation member

Claims (5)

A plurality of heating elements including heating elements having different thermal loads are arranged in a predetermined arrangement direction, and are mounted so as to be able to transfer heat to the mounting surface,
A part of the heat transfer plate is partitioned by a partition screen opposite to the mounting surface, and a cooling fluid for the heating elements flows from one side of the arrangement direction to the other side. Return trip,
It is arranged on the opposite side of the heat transfer plate across the return path, and one end of the arrangement direction communicates with one end of the return path and extends from the other side of the arrangement direction to one side. A forward path configured to allow the cooling fluid to flow,
A heat transferable structure configured to enable heat transfer between the cooling fluid flowing in the return path and the cooling fluid flowing in the forward path; and
Heat transfer between the cooling fluid flowing in the return path and the cooling fluid flowing in the forward path is provided at a position different from the heat transferable structure with respect to the arrangement direction. The cooling device provided with the heat-transfer suppression structure comprised so that it might suppress rather than the heat transfer in a structure. The cooling device according to claim 1, wherein
The heat transferable structure and the heat transfer suppressing structure are cooling devices provided to correspond to the positions of the respective heating elements arranged in the arrangement direction. The cooling device according to claim 1 or 2,
An inlet for the cooling fluid to flow into the forward path and an outlet for the cooling fluid to flow out from the return path are each open to the other side of the alignment direction,
The plurality of heating elements include a high load heating element having a heat load of a predetermined value or more, and a low load heating element having a lower heat load than the high load heating element,
The low load heating element is disposed at least at a position on the most other side in the arrangement direction,
The said heat-transfer suppression structure is a cooling device provided corresponding to the position of the said low load heat generating body. In the cooling device according to any one of claims 1 to 3,
The flow path structure that can constitute the flow path through which the cooling fluid flows is laminated in three or more layers while interposing a partition plate capable of transferring heat in the lamination direction orthogonal to the arrangement direction,
The return path is constituted by a first-layer flow path structure partly partitioned by the heat transfer plate,
The forward path includes a second layer channel structure adjacent to the first layer channel structure in the stacking direction, and a third layer channel adjacent to the second layer channel structure in the stacking direction. Comprising at least a channel structure,
Each of the second layer flow path structure and the third layer flow path structure is configured such that a partial region in the alignment direction can flow the cooling fluid in the alignment direction, and the second layer The flowable region in the flow channel structure and the flowable region in the third layer flow channel structure communicate with each other in the stacking direction, so that the cooling fluid flowing in the forward path is one in the arrangement direction. In the region of the part flows in the flow channel structure of the second layer, and in the other region flows in the flow channel structure of the third layer,
The heat transferable structure is constituted by the flow path structure of the first layer and the flow path structure of the second layer in a region where the cooling fluid flows,
The heat transfer suppressing structure is a cooling device configured by the first-layer flow path structure and the third-layer flow path structure in a region where the cooling fluid flows. In the cooling device according to any one of claims 1 to 3,
The heat transferable structure is configured to include a heat conducting member that is interposed between the forward path and the return path so as to be capable of conducting heat, and that divides the forward path and the return path, respectively.
The heat transfer suppressing structure is a cooling device that includes a heat insulating member that is interposed between the forward path and the return path and that suppresses heat transfer between the forward path and the return path.

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