JP5974933B2 - Cleaning device - Google Patents

Description

  The present invention relates to a cleaning apparatus for cleaning an object to be cleaned.

  2. Description of the Related Art Conventionally, a cleaning apparatus that cleans the surface of an object to be cleaned by spraying a cleaning liquid onto the object to be cleaned in a pressurized overheating state is known. Here, the pressurized overheated state is a state where the pressure is heated and heated to the boiling point or higher under atmospheric pressure. For example, in the cleaning apparatus described in Patent Document 1, when a cleaning liquid in a pressurized and superheated state is ejected onto an object to be cleaned, the sprayed cleaning liquid instantaneously changes to saturated vapor and becomes a fine mist. Collides with the surface of the object to be cleaned in a multiphase flow. Thereby, foreign substances such as a chemical solution adhering to the surface of the object to be cleaned are wiped away. Further, on the surface of the object to be cleaned, foreign substances such as a chemical solution are solubilized and removed by a condensed water layer formed by phase change from a mist-like cleaning liquid or steam.

JP 2012-24685 A

  In the cleaning apparatus of Patent Document 1, a liquid retaining member is provided around the object to be cleaned, and the cleaning liquid is cleaned by holding the sprayed cleaning liquid while holding it in a predetermined gap between the surface of the object to be cleaned and the liquid retaining member. We are trying to reduce the amount of use. However, in the cleaning apparatus of Patent Document 1, if the object to be cleaned has a bent portion or unevenness, there is a problem that it is difficult to form a liquid retaining member that forms a predetermined gap between the object to be cleaned. Therefore, there may be a shape restriction on the object to be cleaned that can be cleaned by the cleaning apparatus.

Moreover, in the cleaning apparatus of Patent Document 1, the cleaning liquid containing foreign substances such as chemicals after cleaning the object to be cleaned falls downward in the vertical direction from the object to be cleaned, and is stored in the storage tank together with the condensed water of the cleaning liquid vapor. Collected. Although the cleaning liquid collected in the liquid storage tank is reused as a cleaning liquid for cleaning the object to be cleaned, it contains foreign substances such as a chemical solution, so that the effect of cleaning the object to be cleaned may be reduced.
Moreover, in the cleaning device of Patent Document 1, the object to be cleaned is cleaned outside the liquid storage tank and in a state positioned on the upper side in the vertical direction. Therefore, there is a possibility that the sprayed cleaning liquid scatters outside the opening of the liquid storage tank, or the vapor of the sprayed cleaning liquid flows outside the opening of the liquid storage tank. Therefore, there is a possibility that the recovery amount of the sprayed cleaning liquid is reduced.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a cleaning device capable of reducing the long-term usage of the cleaning liquid while effectively cleaning the object to be cleaned with a small amount of the cleaning liquid. There is to do.

The present invention is a cleaning apparatus that cleans an object to be cleaned, and includes a support means, an injection means, a recovery liquid tank, a condensate liquid tank, a freeboard section, and a second cooling means .
The support means can support the object to be cleaned. The spraying means can spray the cleaning liquid onto the object to be cleaned in a pressurized overheating state that is equal to or higher than the boiling point under atmospheric pressure. The recovery liquid tank has a recovery opening located on the lower side in the vertical direction of the object to be cleaned supported by the support means. The condensate tank has a condensate opening whose outer edge is located outside the recovery opening. The free board portion extends from the outer edge of the condensate opening to the upper side in the vertical direction and is formed so as to surround the periphery of the object to be cleaned supported by the support means. The second cooling means is provided in the condensate liquid tank and can cool the inside of the condensate liquid tank.

  According to the above configuration, in the present invention, when the cleaning liquid in a pressurized and superheated state is sprayed from the spraying means to the object to be cleaned supported by the support means, the sprayed cleaning liquid instantaneously changes to saturated vapor and is fine. It becomes a mist and collides with the surface of the object to be cleaned in a mixed phase state. Due to this physical action, foreign substances such as chemicals adhering to the surface of the object to be cleaned can be wiped away. Furthermore, on the surface of the object to be cleaned, the condensed water layer formed by the phase change from the mist-like cleaning liquid or steam solubilizes and removes foreign substances such as the chemical liquid that could not be removed by the physical action described above. . Thus, the surface of the object to be cleaned can be effectively cleaned with a small amount of cleaning liquid.

  Further, in the present invention, the cleaning liquid containing foreign substances such as a chemical solution generated on the surface of the object to be cleaned when the object to be cleaned is dropped to the lower side in the vertical direction of the object to be cleaned, and passes through the recovery opening. It is recovered in the recovery liquid tank. On the other hand, the cleaning liquid ejected from the ejecting means and not colliding with the object to be cleaned changes phase to become liquid (condensate) and is collected in the condensate liquid tank via the condensate opening. As described above, in the present invention, the cleaning liquid containing foreign substances such as the chemical liquid after washing the object to be cleaned and the cleaning liquid not containing foreign substances such as the chemical liquid can be separated and recovered into the recovery liquid tank and the condensate liquid tank. Thereby, it is possible to discard the cleaning liquid containing foreign substances such as the chemical liquid collected in the recovery liquid tank, or to reuse the chemical liquid contained in the cleaning liquid. In addition, the cleaning liquid that is collected in the condensate tank and does not contain foreign substances such as a chemical liquid can be reused as a cleaning liquid for cleaning an object to be cleaned. Therefore, waste of the cleaning liquid is suppressed, and as a result, the long-term use amount of the cleaning liquid can be reduced.

  Further, in the present invention, since the free board part is formed so as to surround the object to be cleaned supported by the supporting means, the cleaning liquid sprayed from the spraying means scatters out of the free board part, and It is possible to prevent the cleaning liquid that has become vapor from leaking out of the free board. Thereby, it can suppress that the collection amount of the washing | cleaning liquid collect | recovered by a condensate liquid tank falls.

The schematic diagram which shows the washing | cleaning apparatus by one Embodiment of this invention. II-II sectional view taken on the line of FIG.

Hereinafter, a cleaning apparatus according to an embodiment of the present invention will be described with reference to the drawings.
(One embodiment)
A cleaning apparatus according to an embodiment of the present invention and a part thereof are shown in FIGS.

  The cleaning apparatus 10 is used for cleaning a plating chemical solution adhering to the processing component 1 such as plating. The processing component 1 is, for example, a plate-shaped metal terminal (terminal) of an electrical component. After the plating process, the processing component 1 is transferred to the cleaning device 10 in a state where the plating chemical solution is attached to the surface. Here, the processing component 1 corresponds to the “object to be cleaned” in the claims.

As shown in FIG. 1, the cleaning device 10 includes a support part 11, a pipe 21, a pressure pump 22, a heat exchanger 23, a nozzle 24, a recovery liquid tank 30, a condensate liquid tank 40, a free board part 50, a gas phase. A cooling pipe 61 and a liquid phase cooling pipe 62 are provided.
The support portion 11 can support the plate-shaped processing component 1 so as to sandwich the plate-like processing component 1 from the plate thickness direction, for example. In the present embodiment, the support unit 11 supports the processing component 1 so that the thickness direction of the processing component 1 substantially matches the vertical direction. Here, the support portion 11 corresponds to “support means” in the claims.

The pipe 21 is provided so that one end is connected to the cleaning liquid supply tank 12. The cleaning liquid is stored in the cleaning liquid supply tank 12. In this embodiment, the cleaning liquid is water.
The pressurizing pump 22 is provided near the cleaning liquid supply tank 12 in the pipe 21. The pressurizing pump 22 is, for example, an electric pump, and can send out the cleaning liquid in the cleaning liquid supply tank 12 to the other end side of the pipe 21 while pressurizing the cleaning liquid.

  The heat exchanger 23 is provided on the side opposite to the cleaning liquid supply tank 12 with respect to the pressure pump 22 of the pipe 21. The heat exchanger 23 has a heater 231 arranged along the pipe 21. The heater 231 exchanges heat with the cleaning liquid in the pipe 21. In the present embodiment, the heater 231 heats the cleaning liquid in the pipe 21 pressurized by the pressure pump 22 to, for example, about 130 ° C. (0.3 MPa) to 200 ° C. (1.5 MPa). Thereby, the cleaning liquid in the pipe 21 becomes a pressurized superheated liquid having an atmospheric pressure boiling point (saturation temperature) or higher, or a superheated liquid near the boiling point at the pressure, that is, a so-called subcritical water state.

The nozzle 24 is provided at the other end of the pipe 21. The nozzle 24 has a nozzle hole 241. In this embodiment, the nozzle hole diameter of the nozzle hole 241 is set to φ0.3 to 1.0, for example. The nozzle 24 is provided so that the nozzle hole 241 faces the processing component 1 supported by the support portion 11 from the horizontal direction. The nozzle 24 has an opening / closing means (not shown) that can open and close the nozzle hole 241. As a result, when the opening / closing means opens the nozzle hole 241, the cleaning liquid that is in the state of pressurized overheated liquid in the pipe 21 is jetted from the nozzle hole 241 toward the processing component 1.
Thus, the piping 21, the pressurizing pump 22, the heat exchanger 23, and the nozzle 24 constitute “injection means” in the claims.

The recovery liquid tank 30 has a side wall part 31, a bottom wall part 32, an upper wall part 33, a cylinder part 34, and a recovery opening part 35.
The side wall portion 31 is formed in a rectangular cylindrical shape, for example. The bottom wall portion 32 is formed integrally with the side wall portion 31 so as to close one end of the side wall portion 31. The upper wall portion 33 is formed integrally with the side wall portion 31 so as to close the other end of the side wall portion 31. A hole 331 is formed in the center of the upper wall 33 so as to penetrate the upper wall 33 in the plate thickness direction.

The cylindrical portion 34 is formed in a cylindrical shape, and is provided so that one end thereof is connected to the outer edge portion of the hole portion 331 of the upper wall portion 33. Here, the cylinder part 34 is provided in a state where the axis is along the vertical direction.
The collection opening 35 is formed at the other end of the cylindrical portion 34. That is, the collection opening 35 coincides with the other end opening of the cylindrical portion 34. Here, the collection liquid tank 30 is formed so that the collection opening 35 is positioned on the lower side in the vertical direction of the processing component 1 supported by the support unit 11. The recovery liquid tank 30 is provided in a state where the axis of the side wall portion 31 is along the vertical direction.

The condensate tank 40 has a side wall 41 and a condensate opening 42.
The side wall 41 is formed in, for example, a rectangular cylindrical shape, like the side wall 31 of the recovery liquid tank 30. The side wall part 41 is formed so as to be coaxial with the side wall part 31 and connected to the other end of the side wall part 31 at one end. As a result, the side wall 41 is in a state where one end is closed by the upper wall 33 of the recovery liquid tank 30. The condensate opening 42 is formed at the other end of the side wall 41. That is, the condensate opening 42 coincides with the other end opening of the side wall 41. Here, the condensate tank 40 is formed so that the outer edge of the condensate opening 42 is located outside the recovery opening 35 (see FIG. 2). Moreover, the collection | recovery opening part 35 is located in the support part 11 side rather than the condensate opening part 42 (refer FIG. 1).

In the present embodiment, a predetermined amount of condensate 2 (water) is stored inside the side wall 41 of the condensate tank 40. As a result, a “liquid phase” is formed inside the side wall 41 of the condensate tank 40.
Further, in the condensate liquid tank 40, a step portion 13 that forms a step from the condensate opening portion 42 to the lower side in the vertical direction is formed in a part of the inner edge portion of the condensate opening portion 42 in the circumferential direction. Accordingly, when the condensate 2 in the condensate tank 40 overflows beyond the condensate opening 42, the overflowed condensate 2 flows to the step portion 13. One end of a condensate drain 14 is connected to the step portion 13. The other end of the condensate drain 14 is connected to the cleaning liquid supply tank 12. Therefore, the condensate liquid 2 that has flowed to the stepped portion 13 is collected in the cleaning liquid supply tank 12 via the condensate liquid drain 14.

The free board part 50 has a side wall part 51 and an opening part 52.
The side wall 51 is formed in, for example, a rectangular tube shape, similar to the side wall 31 of the recovery liquid tank 30 and the side wall 41 of the condensate liquid tank 40 (see FIGS. 1 and 2). The side wall portion 51 is formed so as to be coaxial with the side wall portion 41 and has one end connected to the other end of the side wall portion 41. That is, the side wall 51 is formed so as to extend vertically upward from the outer edge of the condensate opening 42. Here, the side wall part 51 is formed so as to surround the periphery of the processing component 1 supported by the support part 11. That is, the support part 11 is located between both end faces of the side wall part 51. The opening 52 is formed at the other end of the side wall 51. That is, the opening 52 coincides with the other end opening of the side wall 51.
Here, since the opening part 52 of the free board part 50 is open | released by air | atmosphere, air exists inside the side wall part 51. FIG. As a result, a “vapor phase” is formed inside the side wall portion 51 of the free board portion 50.

  The gas phase cooling pipe 61 is provided on the inner wall of the side wall 51 of the free board part 50. The vapor phase cooling pipe 61 is provided so as to be annularly wound in the circumferential direction along the inner wall surface of the side wall 51. In the present embodiment, the gas-phase cooling pipe 61 is provided such that the lower end is located at a position away from the condensate opening 42 by a predetermined distance in the vertical direction (see FIG. 1).

  The gas phase cooling pipe 61 is formed so that a cooling fluid can flow therethrough. Thereby, the gas-phase cooling pipe 61 performs heat exchange between the internal cooling fluid and the air outside the gas-phase cooling pipe 61, that is, the air inside the side wall part 51, so that the air inside the side wall part 51 is exchanged. (Gas phase) can be cooled. Here, the gas phase cooling pipe 61 corresponds to “first cooling means” in the claims.

  The liquid phase cooling pipe 62 is provided on the inner wall of the side wall portion 41 of the condensate liquid tank 40. The liquid phase cooling pipe 62 is provided so as to be annularly wound in the circumferential direction along the inner wall surface of the side wall portion 41. In the present embodiment, the liquid-phase cooling pipe 62 is provided such that the upper end is located at a position that is a predetermined distance vertically downward from the condensate opening 42 (see FIG. 1).

  The liquid phase cooling pipe 62 is formed so that a cooling fluid can flow therethrough. Thereby, the liquid phase cooling pipe 62 exchanges heat between the internal cooling fluid and the liquid outside the liquid phase cooling pipe 62, that is, the condensate 2 inside the side wall 41, thereby The inner condensate 2 (liquid phase) can be cooled. Here, the liquid phase cooling pipe 62 corresponds to the “second cooling means” in the claims.

  In this embodiment, the opening part 52 of the free board part 50 is formed in the substantially rectangular shape (refer FIG. 2). Here, the vertical length of the free board portion 50, that is, the axial length of the side wall portion 51 is L1 (see FIG. 1), and the long side length of the opening 52 of the free board portion 50 is L2 (see FIG. 1). 1 and 2), and assuming that the length of the short side is L3 (see FIG. 2), the free board portion 50 is formed to satisfy the relationship of L1 / L3 ≧ 1. That is, the free board portion 50 is formed so that a so-called free board ratio (L1 / L3) is 1 or more.

Further, in this embodiment, assuming that the projection area in the vertical direction of the processing component 1 supported by the support portion 11 is A1, the opening area of the recovery opening 35 is A2, and the opening area of the condensate opening 42 is A3 (FIG. 2), the recovery liquid tank 30 and the condensate liquid tank 40 are formed so as to satisfy the relationship of A3>A2> A1.
Moreover, in this embodiment, the collection | recovery liquid tank 30 is formed so that the collection | recovery opening part 35 may be located in the center of the condensate opening part 42 (refer FIG. 2).

Next, an example of a process related to cleaning of the processing component 1 by the cleaning device 10 of the present embodiment will be described.
Before starting the cleaning of the processing component 1, the gas-liquid phase in the free board section 50 and the condensate liquid tank 40 is cooled to, for example, 10 ° C. or less, preferably 5 ° C. or less by the gas phase cooling pipe 61 and the liquid phase cooling pipe 62. Keep it. That is, the air inside the free board section 50 is cooled by the vapor phase cooling pipe 61, and the condensate 2 inside the condensate liquid tank 40 is cooled by the liquid phase cooling pipe 62. In addition, by operating the pressurizing pump 22 and the heat exchanger 23, the cleaning liquid in a pressurized superheated liquid (subcritical water) state (about 130 ° C. (0.3 MPa) to 200 ° C. (1.5 MPa)) is obtained. It is generated in the pipe 21.

(Support process)
After the plating process, the processing component 1 having the plating chemical solution attached to the surface is transferred to the inside of the free board part 50 and supported by the support part 11. At this time, the support unit 11 supports the processing component 1 such that the thickness direction of the processing component 1 substantially matches the vertical direction.

(Washing process)
Subsequently, the nozzle 24 is opened by the opening / closing means of the nozzle 24, thereby injecting a cleaning liquid in a pressurized overheated liquid state from the nozzle hole 241 onto the processing component 1. The cleaning liquid ejected from the nozzle hole 241 becomes saturated vapor of the cleaning liquid and fine cleaning liquid mist (“gas-liquid mixed phase flow”) by releasing the pressure, and collides with the surface of the processing component 1. The plating chemical solution adhering to the surface of the processing component 1 is wiped off by the physical action of the collision of the gas-liquid mixed phase flow. The plating chemical liquid that has been wiped off is scattered and dropped into the recovery liquid tank 30 via the recovery opening 35 located on the lower side in the vertical direction of the processing component 1.

  Furthermore, the surface of the processing component 1 is formed with a condensed water layer that is phase-changed from the adhesion of the cleaning liquid mist and steam, and the plating chemical residue that cannot be removed by the physical action described above is solubilized and condensed in condensed water. The water falls along with the water through the recovery opening 35 to the recovery liquid tank 30. Thereby, the condensed water containing the plating solution is recovered and stored in the recovery liquid tank 30 as the recovery liquid 3.

  In the present embodiment, the recovery liquid drain 15 is connected to the recovery liquid tank 30 (see FIG. 1). Thereby, the recovered liquid 3 stored in the recovered liquid tank 30 can be recovered via the recovered liquid drain 15, and the recovered liquid 3 containing the plating chemical liquid can be disposed of. Alternatively, the plating chemical liquid contained in the collected recovery liquid 3 can be reused as the chemical liquid for the plating step.

  On the other hand, the saturated vapor and the fine cleaning liquid mist which are ejected from the nozzle 24 and are not used for removing the plating chemical solution of the processing component 1 are condensed on the surface of the gas-phase cooling pipe 61 and the liquid surface of the condensate liquid 2. It is recovered as liquid 2. The recovered saturated vapor and cleaning liquid mist overflow from the condensate opening 42 as the condensate 2 and flow to the step portion 13. The condensate 2 that has flowed to the stepped portion 13 is collected in the cleaning liquid supply tank 12 via the condensate drain 14. Thereby, the recovered condensate 2 can be reused as the cleaning liquid for the processing component 1.

  When the washing process is repeated, a saturated vapor layer of the washing liquid is formed on the liquid surface of the condensate liquid 2 and the upper layer of the recovered liquid 3 (see “vapor line” in FIG. 1). The air flow is controlled so that the steam of the saturated vapor layer flows to the liquid surface of the condensate liquid 2 cooled by the gas phase cooling pipe 61 and the liquid phase cooling pipe 62.

Next, the experimental result regarding the washing | cleaning capability of the washing | cleaning apparatus 10 by this embodiment is shown.
In this experiment, a terminal (surface area 0.05 dm ² ) of an electronic component made of Cu to which a plating chemical solution of a high-speed nickel sulfamate bath (about 800 g / L) was attached was to be cleaned, and the atmospheric pressure boiling point (saturation temperature) was A cleaning liquid (water) at 100 ° C. was brought to a state of 0.5 MPa and 150 ° C., and was sprayed from a nozzle 24 having a nozzle hole diameter of 0.5 to a terminal at a distance of 10 mm. The terminal after cleaning was extracted into deionized water, and the amount of residue in the plating solution was quantified in terms of electrical conductivity. The plating was deposited 25 times in 3 seconds for the cleaning time (injection time) and 200 times in 10 seconds. It was confirmed that the chemical solution could be diluted.

  As described above, in the present embodiment, when the cleaning liquid in a pressurized and overheated state is ejected from the nozzle 24 to the processing component 1 supported by the support portion 11, the sprayed cleaning liquid instantaneously changes in phase to saturated vapor. At the same time, it becomes a fine mist and collides with the surface of the processing component 1 in a mixed phase state. The plating chemical solution adhering to the surface of the processing component 1 can be wiped off by this physical action. Further, on the surface of the processing component 1, the plating solution that could not be removed by the above-described physical action is solubilized and removed by the condensed water layer formed by the phase change from the mist-like cleaning liquid or steam. Thereby, the surface of the processing component 1 can be effectively cleaned with a small amount of cleaning liquid.

  Further, in the present embodiment, the cleaning liquid including the plating chemical liquid generated on the surface of the processing component 1 when cleaning the processing component 1 falls to the lower side in the vertical direction of the processing component 1 and passes through the recovery opening 35. It is recovered in the recovery liquid tank 30. On the other hand, the cleaning liquid sprayed from the nozzle 24 and not colliding with the processing component 1 is phase-changed to become liquid (condensate), and is collected in the condensate liquid tank 40 via the condensate opening 42. As described above, in the present embodiment, the cleaning liquid containing the plating chemical liquid after cleaning the processing component 1 and the cleaning liquid not containing the plating chemical liquid can be separated and recovered in the recovery liquid tank 30 and the condensate liquid tank 40. Thereby, it is possible to dispose of the cleaning solution (recovered solution 3) containing the plating solution recovered in the recovered solution tank 30, or to reuse the plating solution contained in the cleaning solution (recovered solution 3). It is. In addition, the cleaning liquid (condensate liquid 2) that is collected in the condensate tank 40 and does not contain the plating chemical liquid can be reused as a cleaning liquid for cleaning the processing component 1. Therefore, waste of the cleaning liquid is suppressed, and as a result, the long-term use amount of the cleaning liquid can be reduced.

  Further, in this embodiment, since the free board portion 50 is formed so as to surround the periphery of the processing component 1 supported by the support portion 11, the cleaning liquid sprayed from the nozzle 24 scatters out of the free board portion 50. It is possible to prevent the cleaning liquid that has become vapor from leaking out of the free board portion 50. Thereby, it can suppress that the collection amount of the washing | cleaning liquid collect | recovered by the condensate liquid tank 40 falls.

  In the present embodiment, the freeboard unit 50 is provided with a vapor phase cooling pipe 61 that can cool the inside of the freeboard unit 50. Therefore, the air (gas phase) inside the free board portion 50 can be cooled. Thereby, the phase change of the washing | cleaning liquid of the pressurization overheating liquid state injected from the nozzle 24 can be accelerated | stimulated, and the cleaning effect of the process component 1 can be improved. Further, by cooling the air inside the free board section 50 with the gas-phase cooling pipe 61, the condensation of the saturated vapor of the cleaning liquid ejected from the nozzle 24 and not used for cleaning the processing component 1 is promoted. Can be efficiently recovered.

  Moreover, in this embodiment, the liquid phase cooling pipe 62 provided in the condensate liquid tank 40 and capable of cooling the inside of the condensate liquid tank 40 is further provided. Therefore, the condensate 2 in the condensate tank 40 can be cooled. Thereby, condensation of the vapor | steam near the liquid surface of the condensate liquid 2 is promoted, and it can collect | recover efficiently as the condensate liquid 2. FIG.

  In the present embodiment, when the cleaning process is repeated, a saturated vapor layer of the cleaning liquid is formed on the liquid surface of the condensate liquid 2 and the upper layer of the recovered liquid 3. The air flow is controlled so as to flow to the liquid surface of the condensate liquid 2 cooled by the gas phase cooling pipe 61 and the liquid phase cooling pipe 62. In this way, it is possible to control the flow of steam generated during cleaning with a relatively simple configuration.

  Moreover, in this embodiment, the free board part 50 is formed so that the opening part 52 may become a rectangular shape. When the length of the free board 50 in the vertical direction is L1, the length of the long side of the opening 52 of the free board 50 is L2, and the length of the short side is L3, the free board 50 is L1 / L1. It is formed so as to satisfy the relationship of L3 ≧ 1. That is, the free board portion 50 is formed so that a so-called free board ratio (L1 / L3) is 1 or more. Therefore, it is possible to further suppress the cleaning liquid sprayed from the nozzle 24 from scattering outside the free board section 50 and the leakage of the cleaning liquid that has become vapor from the free board section 50.

  Further, in the present embodiment, when the vertical projection area of the processing component 1 supported by the support portion 11 is A1, the opening area of the recovery opening 35 is A2, and the opening area of the condensate opening 42 is A3, the recovery The liquid tank 30 and the condensate liquid tank 40 are formed to satisfy the relationship of A3> A2> A1. As a result, the cleaning liquid containing the plating chemical after cleaning the processing part 1 can be reliably recovered as the recovery liquid 3 and the cleaning liquid that has not been used for cleaning the processing part 1 can be reliably recovered as the condensate liquid 2.

  In the present embodiment, the recovery liquid tank 30 is formed such that the recovery opening 35 is located at the center of the condensate opening 42. Therefore, it is possible to further suppress the cleaning liquid sprayed from the nozzle 24 from being scattered outside the free board section 50 and the leakage of the cleaning liquid that has become vapor from the free board section 50.

(Other embodiments)
In another embodiment of the present invention, the first cooling means may be provided outside the free board portion. The second cooling means may be provided outside the condensate liquid tank.
Moreover, in other embodiment of this invention, the 1st cooling means and the 2nd cooling means may be formed integrally. For example, the first cooling means and the second cooling means are configured by one cooling pipe.

Moreover, in other embodiment of this invention, a 1st cooling means and a 2nd cooling means are not restricted to a cooling pipe, A Peltier-type cooling plate or a chiller etc. may be sufficient. In another embodiment of the present invention, the cleaning device may not include at least one of the first cooling unit and the second cooling unit.
Moreover, in other embodiment of this invention, the opening part of the free board part may be formed in shapes other than rectangular shape. The free board ratio (L1 / L3) of the free board part may be smaller than 1.

Moreover, in other embodiment of this invention, the structure which does not satisfy | fill the relationship of A3>A2> A1 may be sufficient as a collection | recovery liquid tank and a condensate liquid tank.
Moreover, in other embodiment of this invention, the collection | recovery liquid tank may be formed so that a collection | recovery opening part may be located other than the center of a condensate opening part.
In another embodiment of the present invention, the pressurizing pump is a pump that uses a driving method other than electric drive or pressurizes and supplies the cleaning liquid with compressed gas as long as the cleaning liquid in the pipe can be pressurized to a predetermined value or more. It may be a pressure tank.
Further, the nozzle only needs to form a gas-liquid mixed phase flow on the surface to be cleaned, and the nozzle does not necessarily have to be provided so that the nozzle hole faces the processing component supported by the support portion from the horizontal direction.

Moreover, in other embodiment of this invention, as long as the washing | cleaning liquid in piping can be heated more than predetermined value, it is good also as heating not only with a heater but with another method.
In another embodiment of the present invention, the object to be cleaned may be cleaned in a state where a plurality of objects are connected. In this case, a plurality of objects to be cleaned can be continuously cleaned while being transferred to and supported by the support means.

Moreover, in other embodiment of this invention, you may use for wash | cleaning the components etc. which not only the process component after metal-plating process but the chemical | medical solution other than plating chemical | medical solution adhered. Also, for example, parts after cutting or polishing work are cleaned with a cleaning device as an object to be cleaned, and oil such as water-soluble processing oil or water-soluble rust-preventing oil adhered to the surface, shavings, polishing powder, etc. It is good also as wiping and removing a foreign material.
In another embodiment of the present invention, the cleaning liquid is not limited to water, and a cleaning liquid other than water may be used. Examples thereof include hydrocarbon solvents, alcohols, and fluorine solvents such as PFC, HFC, HFE, HFO. In this case, a cleaning solution that is solubilized with a chemical solution other than the plating chemical solution is used.
Thus, the present invention is not limited to the above-described embodiment, and can be implemented in various forms without departing from the gist thereof.

DESCRIPTION OF SYMBOLS 10 ... Cleaning apparatus 11 ... Support part (support means)
21 ・ ・ ・ Piping (injection means)
22 ・ ・ ・ Pressure pump (injection means)
23 ... Heat exchanger (injection means)
24 ... Nozzle (jetting means)
30 ... Recovery liquid tank 35 ... Recovery opening 40 ... Condensate liquid tank 42 ... Condensate opening 50 ... Free board part

Claims (5)

A cleaning device (10) for cleaning an object to be cleaned (1),
Support means (11) capable of supporting the object to be cleaned;
An injection means (21, 22, 23, 24) capable of injecting the cleaning liquid into the object to be cleaned in a pressure overheating state having a boiling point or more under atmospheric pressure;
A recovery liquid tank (30) having a recovery opening (35) positioned on the lower side in the vertical direction of the object to be cleaned supported by the support means;
A condensate tank (40) having a condensate opening (42) whose outer edge is located outside the recovery opening;
A free board portion (50) extending from the outer edge of the condensate opening to the upper side in the vertical direction and formed to surround the object to be cleaned supported by the support means;
A second cooling means (62) provided in the condensate tank and capable of cooling the inside of the condensate tank;
A cleaning device comprising:   The cleaning apparatus according to claim 1, further comprising a first cooling means (61) provided in the free board part and capable of cooling the inside of the free board part. The free board portion is formed so that the opening has a rectangular shape,
When the length of the free board portion in the vertical direction is L1, the length of the long side of the opening of the free board portion is L2, and the length of the short side is L3, the free board portion is L1 / L3 ≧ 1. cleaning apparatus according to claim 1 or 2, characterized in that it is formed so as to satisfy the relationship. Assuming that the vertical projection area of the object supported by the support means is A1, the opening area of the recovery opening is A2, and the opening area of the condensate opening is A3, the recovery liquid tank and the water tank is, A3>A2> A1 cleaning apparatus according to any one of claims 1 to 3, characterized in that it is formed so as to satisfy the relationship. The recovery tank, the cleaning device according to any one of claims 1 to 4, characterized in that the collecting opening is formed so as to be positioned at the center of the condensate openings.

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