JP5970955B2 - Polishing table, polishing apparatus using the polishing table, and stamping apparatus for manufacturing the polishing table - Google Patents

Description

  The present invention relates to a polishing table, a polishing apparatus using the polishing table, and a stamping apparatus for manufacturing the polishing table.

  As for polishing apparatuses used for polishing the air bearing surface (ABS, etc.) of a thin bar magnetic thin film magnetic head, various structures have been proposed and put into practical use. For example, the polishing apparatus of Patent Document 1 is for a magnetic head, and has at least two polishing tables and a movable and movable polishing head. The two polishing tables differ in at least one of the relative moving speed and the surface state thereof with respect to the object to be polished, and the polishing head holds the object to be deformable and polishes the polishing surface on the polishing table. A thing is pressed.

  Patent Document 2 discloses a method for polishing a composite material, wherein grooves (grooves) that are concentric or spiral with respect to the rotational drive shaft are formed on a polishing surface of a polishing table, and the polishing surface of the polishing table is formed. A polishing method in which abrasive grains are embedded and a lubricating liquid is supplied to a surface to be polished of a composite material during polishing is disclosed.

  Patent Document 3 discloses a polishing apparatus in which grooves for holding abrasive grains are provided concentrically or spirally on a concave curved processing surface.

  In the polishing apparatus of Patent Document 4, a plurality of grinding pellets that are in contact with a specific surface of an object to be polished are embedded on the surface of the polishing table, and the specific surface of the object to be polished is in contact with the pellets for polishing. A thing is rocked.

  By the way, as disclosed in Patent Documents 2 and 3, conventionally, in this type of polishing apparatus, grooves (grooves) are formed concentrically or spirally on the polishing surface of the polishing table, and extra grooves are formed in the grooves. A technique is employed in which polishing is performed by allowing abrasive grains to escape and leaving an appropriate amount of abrasive grains on the land (surface area excluding the grooves).

  For example, in the polishing process of the air bearing surface of the thin film magnetic head, the row bar holding means performs a reciprocating motion in a substantially radial direction of a polishing table that rotates axially during polishing. Here, since the reciprocating motion of the row bar holding means is temporarily stopped at the two end points, the polishing at the stop position is performed for a long time, so that the surface of the row bar to be polished is linearly polished. Marks remain. If streaky polishing marks remain on the row bar, when the row bar is cut and divided into thin film head sliders, streaky polishing marks remain on the thin film head slider in a dispersed manner, and flying height (flying height) ) It causes a decrease in performance and a decrease in yield. Accordingly, the polishing apparatus is required to have a structure that does not leave streak-like polishing marks on the object to be polished.

  However, the inventions disclosed in Patent Documents 1 to 4 cannot sufficiently meet the above-described requirements.

JP 2002-205261 A JP-A-6-179155 Japanese Patent Laid-Open No. 2000-153452 JP-A-11-320355

  An object of the present invention is to provide a polishing table capable of minimizing the remaining polishing marks, a polishing apparatus using the polishing table, and a stamping apparatus for manufacturing the polishing table.

  Another object of the present invention is to provide a polishing table capable of improving the product yield, a polishing apparatus using the polishing table, and a stamping apparatus for manufacturing the polishing table.

  In order to solve the above-described problem, the polishing table according to the present invention includes a land and a plurality of dots. A polishing table including lands and dots, wherein the dots are bottomed holes having an open end on a polishing surface, and a plurality of dots are arranged at intervals. The land is a surface area excluding dots on the polished surface.

  As described above, since the dots constituting the polishing table according to the present invention are bottomed holes having open ends on the polishing surface, an appropriate amount of abrasive grains can be applied to the lands by letting excess abrasive grains escape to the dots. It can be left and polished.

  In the polishing table according to the present invention, since the lands appear at intervals of a plurality of dots, the area of the lands having a polishing action on the polishing surface is adjusted according to the number of established dots. As a result, for example, by providing dots at a narrow pitch on the outer peripheral side of the polishing surface having a high rotational speed, the land area can be reduced, and the same area can be used for polishing on the inner and outer periphery, thereby performing uniform polishing. It becomes possible. Therefore, the product yield can be improved.

  A plurality of dots are arranged spaced apart from each other, and the land is a surface area excluding the dots on the polished surface. According to this configuration, since the lands appear at intervals between dots, when the polishing table is rotated, the dots and lands appear alternately on the object to be polished. In other words, the land is not a continuous ring, but is provided intermittently (discontinuously), so that it is possible to contact the object to be polished intermittently. The generation of the shape polishing marks can be minimized.

  The polishing apparatus according to the present invention includes the above-described polishing table and a rotating body, and the polishing table is attached to the rotating body. According to this configuration, the polishing apparatus according to the present invention can have all the advantages of the above-described polishing table.

  The stamping apparatus according to the present invention is used for manufacturing the above-described polishing table, and includes a stamping head. The stamping head has a solenoid coil and a mover. The mover has a punch at the tip and is lifted and lowered by the solenoid coil, so that the above-described polishing table can be manufactured.

As described above, according to the present invention, the following effects can be obtained.
(1) It is possible to provide a polishing table capable of minimizing residual polishing marks, a polishing apparatus using the polishing table, and a stamping apparatus for manufacturing the polishing table.
(2) It is possible to provide a polishing table capable of improving the product yield, a polishing apparatus using the polishing table, and a stamping apparatus for manufacturing the polishing table.

  Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. The accompanying drawings are merely examples.

It is a top view which shows typically the polishing table which concerns on embodiment of this invention. It is a partial expanded sectional view of FIG. It is a figure which simplifies and shows a part of polishing table of FIG. It is a figure which simplifies and shows a part of polishing table of FIG. It is a front view of the polish device concerning another embodiment of the present invention. It is a top view which takes out and shows a part of polishing apparatus of FIG. FIG. 4 is an enlarged cross-sectional view showing a part of the polishing step of FIG. 3 omitted. FIG. 4 is a development view in which a part of the polishing step of FIG. 3 is omitted. It is a top view which abbreviate | omits and shows a to-be-polished surface formed by the grinding | polishing process of FIG. It is an expanded view which abbreviate | omits and shows a part of grinding | polishing process by the grinding | polishing apparatus based on a prior art. It is a top view which abbreviate | omits and shows a to-be-polished surface formed by the grinding | polishing process of FIG. It is a front view of the embossing device concerning another embodiment of the present invention. It is a partial expanded sectional view which abbreviate | omits and shows a part of stamping apparatus of FIG. It is a top view of the polishing table obtained by the process shown in FIG. It is a table | surface which shows the correlation with the space | interval of the dot and the radius which are stamped by the stamping apparatus which concerns on another embodiment of this invention. It is a fragmentary sectional view which abbreviate | omits and shows a part about the position calculation method by the marking apparatus which concerns on another embodiment of this invention. FIG. 17 is a plan view showing a state after the step shown in FIG. 16. FIG. 18 is a partial cross-sectional view showing a state after the step shown in FIG. 17. It is a top view which shows the state after the process shown in FIG. It is a top view which shows typically the polishing table which concerns on another embodiment of this invention. It is a partial expanded sectional view of FIG.

  1 to 21, the same reference numerals indicate the same or corresponding parts. In addition, in FIGS. 1 to 21, the size is exaggerated from the actual size in consideration of easy viewing. The polishing table 1 of FIGS. 1 to 4 is used for a polishing apparatus for polishing an air bearing surface (ABS, etc.) of a thin-film magnetic head in a low bar state. It includes dots 11 and lands 12.

  The base portion 10 is a disk-shaped body (plate) made of a soft metal of tin or an alloy containing tin as a main component, and the surface side is a surface (polishing surface) 15 used for polishing. Yes. The polishing surface 15 in FIG. 1 has a plurality of dot formation regions L1 to L11 defined by alternate long and short dash lines. An alternate long and short dash line indicates the boundaries of the dot formation regions L1 to L11 and the arrangement of the dots 11, and is attached for convenience of explanation.

  The dot formation regions L1 to L11 are ring-shaped or strip-shaped, and have different radii from the rotation axis a of the polishing surface 15, so that they move from the inner side (rotation center side) to the outer side (periphery side) of the polishing surface 15. Accordingly, the length viewed in the circumferential direction c is increased. In short, in the plurality of dot formation regions L1 to L11, the area of the polishing surface 15 is wider on the outer side than on the inner side.

  The dots 11 are concave portions of the polishing surface 15 and are bottomed holes having an open end surrounded by the polishing surface 15. The plurality of dots 11 are scattered within the surface of the polishing surface 15, and more preferably are arranged concentrically or spirally when viewed from the rotation axis a of the polishing surface 15. In the polishing table 1, the plurality of dots 11 are formed in a row along the dot formation regions L1 to L11 (see FIG. 1), and the plurality of dots 11 are arranged concentrically with respect to the rotation axis a. The dots 11 constituting a plurality of rows (dot rows) in the dot formation regions L1 to L11 having the same radius are arranged at the same interval (pitch) P as seen in the circumferential direction c. On the other hand, when viewed in the dot rows in the dot formation regions L1 to L11 having different radii, the dots 11 in the different dot rows are randomly arranged.

  The plurality of dots 11 are arranged at an interval P from each other. The land 12 is a surface area on the polishing surface 15 excluding the dots 11, and appears in the interval P between adjacent dots 11 in the circumferential direction c, and the polishing surface 15 is exposed at the interval P. In other words, the land 12 is a surface region (polishing region) having a polishing action on the polishing surface 15, and the dot 11 is a surface region (non-polishing region) having no polishing action. By providing the dots 11 on the polishing table 1, the abrasive grains enter the dots 11 and the area of the lands 12 is relatively reduced. As a result, the polishing amount can be adjusted.

  Although not necessarily clear from FIGS. 1 to 4, the dots 11 constituting the polishing table 1 have a diameter of about 0.1 mm, and the interval P between the dots 11 is about 0.3 mm. The outer diameter of the polishing region of the polishing surface 15 is about 370 mm, and the inner diameter is about 170 mm. However, the dot interval P is set according to the properties of the object to be polished. For example, in the case of an air bearing surface of a thin bar magnetic head in a low bar state, the land 12 has a relatively small area by making the outer peripheral side with a high rotation speed a narrow pitch so that the air bearing surface is evenly (flatly) ground. Set less. On the other hand, when the object to be polished is cut at an angle or when a part is cut more than the other part, the area of the land 12 is relatively wide by reducing the number of dot rows at positions corresponding to the part. Is set.

  Regarding the adjustment of the polishing amount based on the correlation between the dots 11 and the lands 12 described above, for example, as shown in FIG. 3, the plurality of dots 11 constituting the dot row on the circumference having the same radius are in the circumferential direction c. When the dots are arranged at the same pitch, that is, the radii R1 and R2 of the dot formation regions L2 to L4 are R1 <R2, and the interval P1 of the dots 11 viewed on the dot formation region L2 of the radius R1; When P1 = P2, the interval P2 viewed on the dot formation region L4 having the radius R2 has a larger area of the polishing surface 15 in the outer dot formation region L4 than in the inner dot formation region L2.

  On the other hand, as shown in FIG. 4, when the interval P1 of the dots 11 seen on the dot formation region L2 on the outer peripheral side is larger than the interval P2 of the dots 11 seen on the dot formation region L4, that is, the dot formation region L2, When the radii R1 and R2 of L4 are R1 <R2 and P1 ≧ P2, the area obtained by subtracting the total area of the dots 11 from the area of the dot formation area L2 is the area of the dots 11 from the area of the dot formation area L4. The total area can be the same as the reduced area. Furthermore, by increasing the number of dots 11 in the dot formation regions L1 to L11 from the inner side (rotation center side) to the outer side of the polishing surface 15, the areas of the dot formation regions L1 to L11 are all made the same. can do.

  According to the polishing table 1 of FIG. 1 and FIG. 2, by having the dots 11 and the lands 12, when the abrasive grains (3) are applied to the polishing surface 15, the amount of the abrasive grains (3) entering the dots 11. The area of the land 12 having a polishing action is relatively reduced. Therefore, for example, by providing the dots 11 at a narrow pitch on the outer peripheral side of the polishing surface 15 having a high rotational speed, the area of the land 12 is reduced, and the same area is used for polishing on the inner and outer periphery, thereby performing uniform polishing. It becomes possible.

  In the polishing table 1 of FIGS. 1 to 4, the land 12 is a surface area excluding the plurality of dots 11 on the polishing surface 15, and appears at intervals P between the plurality of dots 11. According to this structure, when the polishing table 1 is rotated, the dots 11 and the lands 12 appear alternately with respect to the object to be polished in the dot formation regions (for example, L1) having the same radius on the polishing surface 15. In other words, since the lands 12 are provided not intermittently but intermittently (discontinuously), it is possible to intermittently contact the object to be polished. The generation of polishing marks can be minimized.

  The polishing table 1 of FIGS. 1 to 4 is used in a polishing apparatus by attaching abrasive grains to a polishing surface 15 and performing a rotational motion by a predetermined driving means. A polishing apparatus using the polishing table 1 of FIGS. 1 to 4 will be described with reference to FIGS.

  The polishing apparatus shown in FIGS. 5 to 9 polishes the air bearing surface of a thin-film magnetic head in a low bar state. The polishing table 1 shown in FIGS. 1 to 4 and a low bar 21 as an object to be polished are provided. The rotating body 22 and holding means (keeper) 23 are included.

  The row bar 21 is a rod-like assembly in which thin film head sliders are arranged in a line, and is cut into individual thin film head sliders in a later step. The row bar 21 is polished on the air bearing surface. In the polishing table 1, a paste-like abrasive containing abrasive particles (abrasive grains) such as diamond is applied to the polishing surface 15, and the polishing table 1 is attached to the rotating body 22 and moves relative to the row bar 21. . The rotating body 22 is connected to a drive unit (spindle) (not shown), and operates the drive unit to rotate the polishing table 1 at a predetermined rotational speed.

  A low bar 21 as an object to be polished is detachably fixed to a keeper 23. The keeper 23 reciprocates the object to be polished substantially in the X (or Y) axis direction while applying a predetermined pressure by moving in the Z axis direction. Specifically, the keeper 23 switches the movement of the keeper 23 in the Z-axis direction to torque control immediately before the row bar 21 and the polishing table 1 come into contact with each other. Pressurize. The pressurizing means may be a spring or air pressure. When pressure is applied to the object to be polished, the abrasive grains 3 are put on the lands 12 constituting the polishing surface 15 so that the object to be polished is polished. On the other hand, when the abrasive grains 3 enter the dots 11, no polishing action occurs in the portions of the dots 11 on the polishing surface 15.

  Incidentally, as already described, in the conventional polishing apparatus shown in FIGS. 10 and 11, a groove 16 is formed concentrically or spirally on the polishing surface 15 of the polishing table 1, and this groove 16 is formed. A technique is employed in which an excess amount of abrasive grains (3) is allowed to escape to leave the appropriate amount of abrasive grains (3) on the lands 12 for polishing.

  As shown in the development view of FIG. 10, in the polishing process of the air bearing surface of the thin film magnetic head, the conventional polishing table rotates in the axis during polishing, and the row bar holding means reciprocates in the substantially radial direction of the polishing table. I do. Here, one end of the reciprocating motion of the row bar holding means is the inner peripheral portion of the polishing table, and the other end is the outer peripheral portion of the polishing table. The polishing table is a circular plane and rotates at a constant angular velocity. Then, when viewed per unit time, the outer peripheral portion of the polishing table is polished over a longer stroke than the inner peripheral portion. Moreover, since the reciprocating motion of the row bar holding means is temporarily stopped at the two end points, the polishing at the stop position is performed for a long time, so that the streak polishing marks are formed on the surface to be polished of the row bar. (See FIG. 11) remains. If streaky polishing marks remain on the row bar, when the row bar is cut and divided into thin film head sliders, streaky polishing marks remain on the thin film head slider in a dispersed manner, and flying height (flying height) ) It causes a decrease in performance and a decrease in yield.

  In the conventional polishing table described with reference to FIGS. 10 and 11, the abrasive grains are arranged in the longitudinal direction (circumferential direction c) when viewed on the land 12 defined in a ring shape by the grooves 16 adjacent in the radial direction. As a result, it is considered that streak-like polishing marks are formed on the object to be polished.

  On the other hand, in the polishing table 1 constituting the polishing apparatus described with reference to FIGS. 1 to 7, the plurality of dots 11 are bottomed holes having an open end on the polishing surface 15 and are spaced apart from each other by a distance P. Are arranged. The land 12 is a surface area excluding the plurality of dots 11 on the polishing surface 15 and appears at a dot interval P. According to this configuration, as shown in FIG. 8, the land 12 is irregularly arranged in the moving direction of the row bar 21, so that the state where the abrasive grains are continuously arranged in the circumferential direction c is avoided and discontinuous. Therefore, the problem of forming streak-like polishing marks as shown in FIG. 9 is avoided.

  In the polishing table 1 described with reference to FIGS. 1 to 9, the lands 12 appear at the interval P between the plurality of dots 11, so the area of the lands 12 is adjusted according to the number of dots 11 established. As a result, for example, by providing dots 11 at a narrow pitch on the outer peripheral side of the polishing surface 15 having a high rotational speed, the area of the land 12 is reduced, and the area used for polishing is made the same on the inner and outer periphery, thereby achieving uniform polishing. Can be done. Therefore, the product yield can be improved.

  Furthermore, when the polishing table 1 rotates at a constant angular velocity, it is preferable to arrange the dots 11 so as to reduce the density difference of the dots 11 as much as possible. In other words, the polishing table 1 has a constant angular velocity due to the rotational movement of the disk. However, since the peripheral speed is slow on the inner periphery and the outer periphery is fast, the number of dots 11 is arranged to minimize the difference in density between the inner periphery and the outer periphery. It is preferable to arrange in the above. Therefore, in the polishing table 1 constituting the polishing apparatus described with reference to FIGS. 1 to 7, when the dots 11 are stamped at the same interval P as viewed in the dot formation regions L1 to L11, the object to be polished 5 streak polishing marks 7 can be reduced to a minimum.

  As described above, polishing is performed in order to reduce the streak-like polishing marks 7 generated on the workpiece 5 when polishing is performed while applying abrasive grains to the polishing table 1 and reciprocating the workpiece in a substantially radial direction. The dots 11 are formed in a line on the surface 15 with a distance P, and the distance P between the dots 11 in the line is the same pitch even if the distance from the rotation axis a is separated, or the distance from the rotation axis a. Applicants have found that the solution is to narrow the pitch as the distance increases.

  The stamping apparatus of FIGS. 12 to 14 is a stamping apparatus used for manufacturing the polishing table 1 described with reference to FIGS. 1 to 9, and includes a housing, a control unit, and a position control type. The polishing table 1 is held by a rotating body 22 provided with a motor, and the X-axis 40 and a stamping head 42 held by a Z-axis 41 are provided with a position-control motor.

  The stamping head 42 includes a plurality of stamping levers 43, and each of the stamping levers 43 has a solenoid coil 44 and a mover 45. The mover 45 has a punch portion 46 at the tip, and is moved in the vertical direction by the solenoid coil 44.

  The stamping device detects a predetermined angle θ while rotating the polishing table 1 with the rotating body 22 and vertically moves the punch portion 46 to a desired position by the solenoid coil 44 to stamp the dots 11 (FIG. 13). And FIG. 14). Since the polishing table 1 is made of a soft metal, the stamping process of the dots 11 on the polishing table 1 itself is easy. Specifically, the desired dot 11 can be processed by hitting the punch 10 against the polishing table 1 with a predetermined pressure. The dots 11 have a diameter of about 0.1 mm, and the interval (P) between the dots 11 is about 0.3 mm. The outer diameter of the polishing region of the polishing table 1 is about 370 mm, and the inner diameter is about 170 mm. Then, the number of dots 11 for one polishing table 1 is calculated to exceed 2 million.

  By the way, the interval (P) between the dots 11 is not constant in the radial direction but at a constant pitch in the circumferential direction c, and high-speed machining is realized when the number of dots 11 to be stamped is 2 million or more. Therefore, it is difficult to find a method for determining the dot 11 marking position. As a method for solving this problem, a method for determining the marking position of the dots 11 will be described. When the function f (Ra) = Lp of the dot pitch Lp and the radius Ra to be stamped on the polishing table 1 is calculated, the dot 11 The stamping position is expressed by the following formula.

Lp = a · R ² a + b · Ra + c
Here, by inputting constants into a, b, and c, the value of the dot pitch Lp with respect to the radius Ra can be determined. As shown in Table 1, when a = 0, b = 0, Lp = c, the dot pitch Lp is constant, and when a = 0, Lp = b · Ra + c, and the dot pitch Lp changes temporarily, and a ≠ 0. Thus, the dot pitch changes secondarily.

Further, the time stamping pitch Tp and the polishing table 1 rotation speed Pr (rpm) when the stamping device 4 stamps using the rotation of the polishing table 1 are expressed by the following equations.
Tp = 1 / 2πrRa · 60 / Pr · Lp · 1000
Here, by substituting Lp, as shown in Table 2, the cycle speed of stamping is obtained.

  On the other hand, in the engraving apparatus 4, the processing pitch in the circumferential direction c of the dots 11 can be arbitrarily set by the above formula, but there may be a case where a processing pitch curve that cannot be expressed by the above formula is desired.

  When the problem of the present invention is described again, the polishing table 1 rotates during polishing, and the keeper 23 reciprocates substantially in the radial direction of the polishing table 1. Since the keeper 23 is temporarily stopped at the end of the reciprocation, the polishing by the land 12 portion is performed for a long time, so that the streak polishing marks 7 remain on the row bar 21. This is particularly noticeable on the outer periphery of the polishing table 1 and is considered to be caused by the surface contact state of the lands 12 on which the abrasive grains 4 are placed with respect to the row bars 21.

  For example, in the case of FIG. 4 described above, the area obtained by subtracting the total area of the dots 11 from the area of the dot formation area L2 is the same as the area obtained by subtracting the total area of the dots 11 from the area of the dot formation area L4. If so, the surface contact conditions on the outer periphery and inner periphery of the polishing table 1 are considered to be equivalent. If the radii R1 and R2, the land 12 width W, and the diameter of the dot 11 are given, the pitch of the dot 11 with respect to the radius of the polishing table 1 can be obtained, but if plotted, it becomes a hyperbolic graph and cannot be approximated by the above formula. (See FIG. 15).

Therefore, the plot area is divided into two, and the number of linear functions is set to two. That is, y = −0.0975x + 10.087 described in the graph.
To a predetermined radius,
y = −0.023x + 0.5341
Is applied from a predetermined radius, the dot 11 can be stamped with an error that is practically no problem.

  FIGS. 16 to 19 are partial cross-sectional views showing a position calculation method by the engraving apparatus according to another embodiment of the present invention with a part omitted. More specifically, in the position calculation method of FIGS. 16 to 19, when it is necessary to readjust the rotation center of the polishing table 1, the dot 11 of three points is imprinted and the imprinting head before adjustment is performed. In this method, the position of 42 is grasped, and the center of rotation is determined from the marking positions of the three dots 11.

  16 to 19, at least two dots 11 having different radii are formed on the polishing surface 15 of the polishing table 1 before dot formation by the marking head 42, and the two dots 11 formed are formed. The method includes measuring each position of the mover 45 and calculating the position from the rotation center of the polishing table 1. Hereinafter, a description will be given with reference to FIGS.

  Referring to FIG. 16, as an example, the stamping head 42 has seven types of stamping levers 43. The stamping device 4 makes full use of these to process the dots 11 on the polishing table 1 as shown in FIG.

  Next, as shown in FIGS. 18 and 19, the stamping device 4 further calibrates the positions of the individual stamping levers and calculates the position of the polishing table 1 from the substantial rotation center. SA1 to SA7 in FIG. FIG. 19 shows a calibration pattern. Only SA1 is provided with patterns P11, P12, and P13. Subsequently, P10 and P11 are set so that the Y direction error is 0 mm, P10 is set to (0, 0), and each point is measured (see Table 3).

  In addition to the measurements in Table 3, the center of the polishing table 1 can be calculated from the intersection of the P10-P12 line segment and the perpendicular bisector of the P12-P13 line segment. Table 4 shows the position from P10.

  Next, the position coordinates of each SA with the center of the polishing table 1 as the origin are calculated. The notation in Table 5 is XY coordinates.

  Here, when the stamping start radius and stamping end radius are defined, the XY coordinates from SA1 to SA5 are obtained, and the rθ coordinates from SA1 to SA5 are obtained by rθ conversion. As shown in Table 6, when the stamping start radius is 185 mm and the stamping end radius is 85 mm, only seven types of stamping solenoids are used, and the pitch of the solenoid coil 44 is 25 mm in the radial direction (X It can be seen that the machining is completed if the movement is in the direction (Table 7).

  On the other hand, when processing the dots 11 on the polishing table 1, the engraving device 4 performs polishing by rotating a plurality of solenoid coils 44 arranged in a direction parallel to the X axis and punches at the tip thereof on the rotating body 22. The pitch of the dots 11 can be set for each radius with a 0th-order to quadratic function with respect to the table 1, and the position of each solenoid coil 44 is calibrated to determine the position of the polishing table 1 from the substantial rotation center. Has a function to calculate. These can be applied to any object to be polished when high-precision surface polishing is performed with a disk-shaped polishing machine.

  20 is a plan view schematically showing a polishing table according to another embodiment of the present invention, and FIG. 21 is a partially enlarged sectional view of FIG. The polishing table of FIGS. 20 and 21 has the same basic configuration as the polishing table of FIGS. 1 to 4 except that it has a groove 16. Hereinafter, the difference will be mainly described.

  20 and FIG. 21 includes dots 11, lands 12, grooves 16, and dot formation regions L1 to L11. The dots 11 are bottomed holes having an open end on the polishing surface 15, and a plurality of the dots 11 are arranged at intervals P.

  A plurality of grooves 16 are arranged concentrically or spirally with respect to the rotation axis a on the polishing surface 15. Briefly speaking, the groove 16 in FIG. 20 is formed at the position of the alternate long and short dash line indicating the boundaries of the dot formation regions L1 to L11 in FIG. Therefore, the dot formation regions L1 to L11 can be rephrased as surface regions defined by the grooves 16 adjacent in the radial direction on the polishing surface 15.

  The dots 11 are arranged in the dot formation areas L1 to L11. The land 12 is a surface area on the polishing surface 15 excluding the dots 11 and the grooves 16. The area of the land 12 for one round in the dot formation region (for example, L1) in FIG. 20 preferably matches the area of the land 12 for one round in another dot formation region (for example, L2), and more preferably all the dots are formed. The areas of the lands 12 for one turn in the regions L1 to L11 are the same. This structure is realized by providing the dots 11 at a narrower pitch in the dot formation region (for example, L11) on the outer peripheral side of the polishing surface 15 having a high rotation speed than in the dot formation region (for example, L1) on the inner peripheral side. .

  As described above, when the areas of the lands 12 for one round in all the dot formation regions L1 to L11 are matched, the areas of the lands 12 used for polishing can be the same on the inner and outer circumferences of the polishing surface 15. Therefore, uniform polishing can be performed.

  It is obvious that all the advantages described with reference to FIGS. 1 to 10 can be obtained by the polishing tables of FIGS. Furthermore, the polishing table of FIGS. 20 and 21 is a combination of the polishing table of FIGS. 1 to 9 and the conventional polishing table of FIGS. 10 and 11. Accordingly, in the polishing tables of FIGS. 20 and 21, it is possible to release the abrasive grains (3) not only to the dots 11 but also to the grooves 16, so that the abrasive grains (3) to be left on the lands 12 can be reduced. The amount can be adjusted with higher accuracy. Therefore, it is possible to provide a polishing table that can improve the product yield.

  Although the contents of the present invention have been specifically described above with reference to the preferred embodiments, it is obvious that those skilled in the art can take various modifications based on the basic technical idea and teachings of the present invention. It is. For example, the polishing table 1 described with reference to FIGS. 1 to 4 can also be used as a semiconductor wafer polishing apparatus or a camera lens polishing apparatus.

1 Polishing table 11 Dot 12 Land 15 Polishing surface 16 Groove
2 Polishing device 22 Rotating body 4 Stamping device 42 Stamping head 44 Solenoid coil 45 Mover 46 Punch part a Rotating shaft of polishing surface

Claims (8)

A polishing table including dots, lands, grooves, and dot formation regions,
The dots are bottomed holes having open ends on the polishing surface, and a plurality of them are arranged at intervals from each other,
The land is a surface area excluding the dots on the polished surface,
A plurality of the grooves are arranged concentrically or spirally with respect to the rotation axis on the polishing surface,
The dot formation region is a surface region defined by two grooves adjacent in the radial direction on the polishing surface;
The dots are arranged in the dot formation region,
The dot formation region is a plurality, and the area of the land for one round in the dot formation region matches the area of the land for one round in the other dot formation region,
Polishing table. The polishing table according to claim 1,
A plurality of the dots are arranged concentrically or spirally with respect to the rotation axis of the polishing surface to constitute a dot row,
Polishing table. A polishing table according to claim 2, wherein
The dot rows are plural, and the interval of the dots constituting the dot row on the outer peripheral side is larger than the interval of the dots constituting the dot row on the inner peripheral side when viewed in the radial direction of the polishing surface. small,
Polishing table. A polishing apparatus having a polishing table and a rotating body,
The polishing table is described in any one of claims 1 to 3 , and is attached to a rotating body.
Polishing equipment. A stamping device used for manufacturing the polishing table according to any one of claims 1 to 3, comprising a stamping head,
The engraving head has a solenoid coil and a mover,
The mover has a punch portion at the tip, and is moved in the vertical direction by the solenoid coil.
A plurality of solenoid coils and movers arranged in the marking head are set so that the pitch of the dots differs for each radius relative to the rotating polishing table.
Stamping device. A stamping device used for manufacturing the polishing table according to any one of claims 1 to 3, comprising a stamping head,
The engraving head has a solenoid coil and a mover,
The mover has a punch portion at the tip, and is moved in the vertical direction by the solenoid coil.
The stamping head has a plurality of combinations of solenoid coils and movers, calibrates the positions of the movers, and calculates a position from the rotation center of the polishing table.
Stamping device. A stamping device used for manufacturing a polishing table including dots and lands, including a stamping head,
The dots are bottomed holes having open ends on the polishing surface, and a plurality of them are arranged at intervals from each other,
The land is a surface area excluding the dots on the polished surface,
The engraving head has a solenoid coil and a mover,
The mover has a punch portion at the tip, and is moved in the vertical direction by the solenoid coil.
A plurality of solenoid coils and movers arranged in the marking head are set so that the pitch of the dots differs for each radius relative to the rotating polishing table.
Stamping device. A stamping device used for manufacturing a polishing table including dots and lands, including a stamping head,
The dots are bottomed holes having open ends on the polishing surface, and a plurality of them are arranged at intervals from each other,
The land is a surface area excluding the dots on the polished surface,
The engraving head has a solenoid coil and a mover,
The mover has a punch portion at the tip, and is moved in the vertical direction by the solenoid coil.
The stamping head has a plurality of combinations of solenoid coils and movers, calibrates the positions of the movers, and calculates a position from the rotation center of the polishing table.
Stamping device.

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