JP5960531B2 - Input device, display device, and electronic device - Google Patents

Description

  The present invention relates to an input device, a display device, and an electronic device.

Conventionally, as an input device, for example, a capacitive touch panel that detects an input position by detecting a change in capacitance between a finger and a detection electrode is known (see, for example, Patent Document 1). . In such an input device, for example, the detection electrode, the first conductive layer having one end electrically connected to the detection electrode, and the other end of the first conductive layer are formed on the light-transmitting substrate. And a connected second conductive layer. The second conductive layer is electrically connected to the connection terminal of the wiring board via an adhesive member containing conductive particles. Here, the second conductive layer has translucency. For this reason, when electrically connecting a 2nd conductive layer and the connection terminal of a wiring board, the crushing state of electroconductive particle can be confirmed through a base | substrate and a 2nd conductive layer.

JP 2003-122507 A

  However, in the above conventional input device, the second conductive layer has a larger sheet resistance value than the first conductive layer. For this reason, when a voltage is supplied from the wiring board to the detection electrode, the second conductive layer may be burned out. In order to reduce the possibility that the second conductive layer would burn out, it was necessary to increase the area of the second conductive layer in plan view. However, when the area of the second conductive layer in plan view is increased, the base may be increased in size.

  The present invention has been made in view of such circumstances, and an object of the present invention is to confirm the degree of collapse of the conductive particles and to realize an input device, a display device, and a display device that can be downsized. It relates to electronic equipment.

One aspect of the input device of the present invention is a translucent base, a detection electrode provided on the base, the translucent detection electrode, and the detection electrode. A first conductive layer electrically connected to the substrate, and located between the base and the first conductive layer, and has a sheet resistance value larger than a sheet resistance value of the first conductive layer A light-transmitting second conductive layer and a wiring substrate having a connection terminal, wherein the first conductive layer is provided with an opening, and the opening of the second conductive layer is provided in the opening. A third conductive layer having translucency is further provided on the exposed portion exposed from the first conductive layer, and the third conductive layer is connected to the connection terminal of the wiring board via an adhesive member containing conductive particles. Electrically connected.

  One aspect of the display device of the present invention includes the input device according to the present invention, a display panel disposed to face the input device, and a housing that houses the display panel.

  One embodiment of the electronic device of the present invention includes the display device according to the present invention.

  INDUSTRIAL APPLICABILITY The input device, display device, and electronic apparatus according to the present invention can confirm the degree of collapse of conductive particles and can achieve downsizing.

It is a top view which shows schematic structure of the input device which concerns on this embodiment. It is a top view which shows schematic structure of the input device which concerns on this embodiment, and is the figure which saw through the base | substrate. It is the II sectional view taken on the line shown in FIG. It is the II-II sectional view taken on the line shown in FIG. It is the III-III sectional view taken on the line shown in FIG. FIG. 3 is an enlarged plan view of a region A1 surrounded by a one-dot chain line shown in FIG. It is the IV-IV sectional view taken on the line shown in FIG. It is the VV sectional view taken on the line shown in FIG. It is a top view which shows schematic structure of the display apparatus which concerns on this embodiment. It is the VI-VI sectional view taken on the line shown in FIG. It is a perspective view which shows schematic structure of the portable terminal which concerns on this embodiment. It is a top view which shows schematic structure of the input device which concerns on the modification 1, and is the figure which saw through the base | substrate. It is the top view to which area | region B1 enclosed with the dashed-dotted line shown in FIG. 12 was expanded. It is the VII-VII sectional view taken on the line shown in FIG. It is the VIII-VIII sectional view taken on the line shown in FIG. It is a top view which shows schematic structure of the input device which concerns on the modification 2, and is the figure which saw through the base | substrate. It is the top view to which the area | region C1 enclosed with the dashed-dotted line shown in FIG. 16 was expanded. It is the IX-IX sectional view taken on the line shown in FIG. It is a top view which shows schematic structure of the input device which concerns on the modification 3, and is the figure which saw through the base | substrate. It is the top view to which the area | region D1 enclosed with the dashed-dotted line shown in FIG. 19 was expanded. It is the XX sectional view taken on the line shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  However, for convenience of explanation, the drawings to be referred to below show simplified main members necessary for explaining the present invention, among the constituent members of one embodiment of the present invention. Therefore, the input device, the display device, and the electronic device according to the present invention can include arbitrary constituent members that are not shown in the drawings referred to in this specification.

  As shown in FIGS. 1 and 2, the input device X1 according to the present embodiment is a projected capacitive touch panel, and has an input area E1 and a non-input area E2. The input area E1 is an area where the user can perform an input operation. The non-input area E2 is an area where the user cannot perform an input operation. The non-input area E2 according to the present embodiment is located outside the input area E1 so as to surround the input area E1, but is not limited thereto. For example, the non-input area E2 may be located in the input area E1.

  Note that the input device X1 is not limited to a projected capacitive touch panel, but includes, for example, a surface capacitive touch panel, a resistive touch panel, a surface acoustic wave touch panel, an optical touch panel, Alternatively, an electromagnetic induction touch panel may be used.

  As shown in FIGS. 1 to 5, the input device X <b> 1 includes a base 2.

The substrate 2 includes a first detection electrode pattern 3, a second detection electrode pattern 4, an insulator 5, a light shielding layer 6,
The cover layer 7, the first conductive layer 8, the second conductive layer 10, the first protective layer 13, and the protective sheet 14 are supported. The base 2 has a first main surface 2A and a second main surface 2B. The first main surface 2A is located closer to the user than the second main surface 2B. The second main surface 2B is located on the opposite side of the first main surface 2A. The base 2 has an insulating property and a light-transmitting property with respect to light incident in a direction intersecting the first main surface 2A and the second main surface 2B of the base 2. Note that “translucency” in the present embodiment refers to the property of transmitting part or all of visible light. Examples of the constituent material of the base 2 include glass or plastic.

  The first detection electrode pattern 3 generates capacitance between the user's finger F1 approaching the first main surface 2A of the base 2 corresponding to the input area E1, and detects the input position in the Y direction. Have A plurality of first detection electrode patterns 3 are provided side by side in the Y direction on the second main surface 2B of the base 2 corresponding to the input region E1. The first detection electrode pattern 3 includes a first detection electrode 3a and a first inter-electrode wiring 3b.

  The 1st detection electrode 3a has a role which generate | occur | produces an electrostatic capacitance between user's fingers F1. A plurality of first detection electrodes 3a are provided side by side in the X direction. The first inter-electrode wiring 3b has a role of electrically connecting the first detection electrodes 3a. The first inter-electrode wiring 3b is provided between the first detection electrodes 3a adjacent to each other.

  The second detection electrode pattern 4 generates capacitance between the user's finger F1 approaching the first main surface 2A of the base 2 corresponding to the input region E1, and detects the input position in the X direction. Have A plurality of second detection electrode patterns 4 are provided side by side in the X direction on the second main surface 2B of the base 2 corresponding to the input region E1. The second detection electrode pattern 4 includes a second detection electrode 4a and a second interelectrode wiring 4b.

  The 2nd detection electrode 4a has a role which generate | occur | produces an electrostatic capacitance between user's fingers F1. A plurality of second detection electrodes 4a are provided side by side in the Y direction. The second inter-electrode wiring 4b has a role of electrically connecting the second detection electrodes 4a. The second inter-electrode wiring 4b is provided on the insulator 5 across the insulator 5 so as to be electrically insulated from the first inter-electrode wiring 3b between the second detection electrodes 4a adjacent to each other. Yes. Here, the insulator 5 is provided on the second main surface 2B of the base 2 so as to cover the first inter-electrode wiring 3b. Examples of the constituent material of the insulator 5 include transparent resins such as acrylic resin, epoxy resin, silicone resin, silicon dioxide, or silicon nitride. In addition, illustration of the insulator 5 is abbreviate | omitted in FIG.

  As a constituent material of the first detection electrode pattern 3 and the second detection electrode pattern 4 described above, a conductive member having translucency can be cited. Examples of the light-transmitting conductive member include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), AZO (Al-Doped Zinc Oxide), tin oxide, zinc oxide, or a conductive polymer. .

As a method for forming the first detection electrode pattern 3 and the second detection electrode pattern 4, for example, the above-described materials are formed by sputtering, vapor deposition, or CVD (Chemical Vapor Deposition).
) Method to form a film on the second main surface 2B of the substrate 2. And the photosensitive resin is apply | coated to the surface of this film | membrane, the 1st detection electrode pattern 3 and the 2nd detection electrode pattern 4 are formed by patterning a film | membrane through an exposure, image development, and an etching process.

The light shielding layer 6 has a role of shielding the non-input area E2 of the input device X1. For this reason, the light shielding layer 6 is provided on the second main surface 2B of the base 2 corresponding to the non-input area E2. The light shielding layer 6 is not located in the conduction region G1. That is, the light shielding layer 6 is opened corresponding to the conduction region G1. Here, the conduction region G <b> 1 is a region where the second conductive layer 10 is electrically connected to the connection terminal 11 c of the wiring substrate 11 through the adhesive member 12. Examples of the constituent material of the light shielding layer 6 include a resin material containing a coloring material. Examples of the resin material include acrylic resins, epoxy resins, and silicone resins. Examples of the coloring material include carbon, titanium, and chromium. Examples of the method for forming the light shielding layer 6 include a screen printing method, a sputtering method, a CVD method, and a vapor deposition method.

  The covering layer 7 has a role of protecting the light shielding layer 6. Here, the role of protecting the light shielding layer 6 includes, for example, the role of protecting the light shielding layer 6 from corrosion due to moisture absorption, or the role of reducing the possibility that the material of the light shielding layer 6 is altered. . The covering layer 7 is provided on the second main surface 2B of the base 2 corresponding to the non-input area E2, and covers the light shielding layer 6. Examples of the constituent material of the coating layer 7 include an acrylic resin, a silicone resin, a rubber resin, a urethane resin, and an inorganic compound containing silicon. Examples of the method for forming the coating layer 7 include a transfer printing method, a spin coating method, and a slit coating method.

  The first conductive layer 8 has a role of detecting a change in capacitance generated between the first detection electrode pattern 3 and the second detection electrode pattern 4 and the finger F1. The first conductive layer 8 is located on the covering layer 7. One end of the first conductive layer 8 is electrically connected to the first detection electrode pattern 3 and the second detection electrode pattern 4. The other end of the first conductive layer 8 is located in the conduction region G1.

  The first conductive layer 8 is formed of a metal thin film so as to be hard and have high shape stability. Examples of the constituent material of the metal thin film include an aluminum film, an aluminum alloy film, a laminated film of a chromium film and an aluminum film, a laminated film of a chromium film and an aluminum alloy film, a silver film, a silver alloy film, or a gold alloy film. Can be mentioned. Examples of the method for forming the metal thin film include a sputtering method, a CVD method, and a vapor deposition method.

  Here, the opening 9, the second conductive layer 10, the wiring substrate 11, and the adhesive member 12 will be specifically described with reference to FIGS. FIG. 6 is an enlarged plan view of the area A1 shown in FIG. In FIG. 6, illustration of the protective sheet 14 is omitted for convenience of explanation. FIG. 7 is a sectional view taken along line IV-IV shown in FIG. FIG. 8 is a cross-sectional view taken along line VV shown in FIG.

  The opening 9 is provided in the first conductive layer 8. Specifically, the opening 9 is provided so that a part of the first conductive layer 8 located on the second main surface 2B of the base 2 corresponding to the conduction region G1 is opened in plan view. , Refers to the entire open area. The opening 9 is provided at the center of the first conductive layer 8 located in the conduction region G1. That is, the widths W1 and W2 of the first conductive layer 8 located on both sides of the opening 9 are substantially the same.

  The second conductive layer 10 has a role of electrically connecting the first conductive layer 8 and the wiring board 11. The second conductive layer 10 is located between the first conductive layer 8 located in the conduction region G1 and the second main surface 2B of the base 2. That is, the first conductive layer 8 is located on the second conductive layer 10. The second conductive layer 10 has an exposed portion 10 a that is exposed from the first conductive layer 8 in the opening 9. Parts of the second conductive layer 10 other than the exposed portion 10 a are positioned so as to overlap the first conductive layer 8. That is, the second conductive layer 10 is not located outside the first conductive layer 8 in plan view. Note that the second conductive layer 10 may be located outside the first conductive layer 8 in plan view.

The second conductive layer 10 is translucent and has a sheet resistance value that is greater than the sheet resistance value of the first conductive layer 8. Here, the sheet resistance value of the first conductive layer 8 can be obtained by dividing the volume specific resistance value of the first conductive layer 8 by the maximum thickness of the first conductive layer 8. Further, the sheet resistance value of the second conductive layer 10 can be obtained by dividing the volume specific resistance value of the second conductive layer 10 by the maximum thickness of the second conductive layer 10. Examples of the constituent material of the second conductive layer 10 include a material having a larger sheet resistance than the constituent material of the first conductive layer 8 described above. Examples of the material having a sheet resistance value larger than that of the constituent material of the first conductive layer 8 include ITO, IZO, AZO, tin oxide, and zinc oxide. Examples of the method for forming the second conductive layer 10 include the same methods as those for the first detection electrode pattern 3 and the second detection electrode pattern 4.

  The wiring board 11 has a role of electrically connecting the first detection electrode pattern 3 and the second detection electrode pattern 4 to a position detection driver (not shown). The wiring substrate 11 is covered with the insulating layer 11b so that the wiring 11a is partially exposed. In the wiring board 11, the exposed wiring 11a functions as the connection terminal 11c. The connection terminal 11c is electrically connected to the exposed portion 10a through the adhesive member 12 including the conductive particles 12a. As the wiring board 11, for example, a conventionally known flexible printed wiring board can be used. As the adhesive member 12, for example, a conventionally known anisotropic conductive film can be used.

  Here, in the input device X1, the base 2 and the second conductive layer 10 have translucency. For this reason, when electrically connecting the exposed part 10a and the connection terminal 11c of the wiring board 11 via the adhesive member 12, the conductive particles 12a contained in the adhesive member 12 via the base body 2 and the exposed part 10a. You can check the crushing condition.

  Incidentally, the second conductive layer has a larger sheet resistance value than the first conductive layer. For this reason, when power is supplied from the wiring board to the first detection electrode pattern and the second detection electrode pattern, the second conductive layer may generate heat and burn out. If the second conductive layer burns out, the wiring board, the first detection electrode pattern, and the second detection electrode pattern may not be electrically connected. In order to reduce the possibility of the second conductive layer burning out, it is necessary to relatively reduce the resistance value of the second conductive layer by relatively increasing the area of the second conductive layer in plan view. was there. However, when the area of the second conductive layer in plan view is increased, the area of the second main surface of the base corresponding to the non-input region in plan view is increased. For this reason, there was a possibility that the input device would be enlarged.

  Therefore, in the input device X1, the first conductive layer 8 has an opening 9. The second conductive layer 10 is located between the base 2 and the first conductive layer 8 and has an exposed portion 10 a exposed from the first conductive layer 8 in the opening 9. For this reason, it is possible to reduce the possibility that the resistance value is increased without relatively increasing the area of the second conductive layer 10 in plan view. The exposed portion 10a is electrically connected to the connection terminal 11c of the wiring board 11 through the adhesive member 12 including the conductive particles 12a. For this reason, when electrically connecting the exposed part 10a and the connection terminal 11c of the wiring board 11 via the adhesive member 12, the conductive particles 12a contained in the adhesive member 12 via the base body 2 and the exposed part 10a. You can check the crushing condition. Therefore, it can be confirmed whether or not the exposed portion 10 a is electrically connected to the connection terminal 11 c of the wiring board 11. As described above, in the input device X1, the degree of collapse of the conductive particles 12a can be confirmed, and downsizing can be realized.

  In the input device X1, the light shielding layer 6 is located outside the opening 9 in plan view. Specifically, the light shielding layer 6 is not provided on the second main surface 2B of the base 2 corresponding to the opening 9 in plan view. For this reason, when electrically connecting the exposed part 10a and the connection terminal 11c of the wiring board 11 via the adhesive member 12, the conductive particles 12a contained in the adhesive member 12 via the base body 2 and the exposed part 10a. You can check the crushing condition.

  In the input device X 1, a portion of the first conductive layer 8 that overlaps with the second conductive layer 10 is electrically connected to the connection terminal 11 c of the wiring board 11 through the adhesive member 12. For this reason, a connection area can be enlarged compared with the case where only the exposed part 10a is electrically connected to the connection terminal 11c. For this reason, connection reliability can be improved more.

  Further, in the input device X1, the opening 9 is rectangular in plan view, but is not limited thereto, and may be triangular or trapezoidal. Further, the outer edge of the opening 9 in plan view may be curved. When the outer edge of the opening 9 in a plan view is curved, the stress applied to the adhesive member 12 when the exposed portion 10a and the connection terminal 11c of the wiring board 11 are electrically connected via the adhesive member 12 is increased. The possibility of being concentrated on a part of the first conductive layer 8 can be reduced. For this reason, possibility that peeling will arise in the 1st conductive layer 8 can be reduced.

  The first protective layer 13 has a role of protecting the first detection electrode pattern 3, the second detection electrode pattern 4, and the first conductive layer 8. Here, as a role of protecting the first detection electrode pattern 3, the second detection electrode pattern 4, and the first conductive layer 8, for example, a role of protecting from corrosion due to moisture absorption, or a malfunction due to contamination of static electricity. The role to prevent is mentioned. The first protective layer 13 is provided on the second main surface 2b of the base 2 corresponding to the input area E1 and the non-input area E2. The first protective layer 13 covers the first detection electrode pattern 3, the second detection electrode pattern 4, and the first conductive layer 8. The first protective layer 13 is not provided in a region corresponding to the conduction region G1. As a constituent material of the 1st protective layer 13, the inorganic material which has translucency is mentioned, for example. Examples of the light-transmitting inorganic material include silicon dioxide and silicon nitride. Examples of the method for forming the first protective layer 13 include a sputtering method, an ion plating method, a screen printing method, and an ink jet printing method.

  The protective sheet 14 has a role of protecting the first main surface 2A of the base 2 from being damaged by contact with the user's finger F1. The protective sheet 14 is provided over the entire surface on the first main surface 2A of the base 2 corresponding to the input area E1 and the non-input area E2 via an adhesive material (not shown). Note that the protective sheet 14 does not have to be provided over the entire surface of the first main surface 2A of the base 2 and may be provided only on the first main surface 2A of the base 2 corresponding to the input region E1. Good. The protective sheet 14 has translucency. Examples of the constituent material of the protective sheet 14 include glass and plastic.

    Next, the detection principle of the input device X1 will be described.

  The position detection driver is electrically connected to the first conductive layer 8 and the second conductive layer 10 via the wiring board 11. Further, the position detection driver includes a power supply device. The power supply device supplies a voltage to the first detection electrode pattern 3 and the second detection electrode pattern 4 via the first conductive layer 8. Here, when the finger F1, which is a conductor, approaches, contacts, or presses the first main surface 2A of the base 2 corresponding to the input region E1 via the protective sheet 14, the finger F1 and the first detection electrode pattern 3 and A capacitance is generated between the second detection electrode pattern 4 and the second detection electrode pattern 4. The position detection driver always detects the capacitance generated in the first detection electrode pattern 3 and the second detection electrode pattern 4, and the first detection electrode pattern 3 and the second detection electrode 2 that have detected a capacitance greater than a predetermined value. The combination of the detection electrode patterns 4 detects the input position where the user has performed an input operation. In this way, the input device X1 can detect the input position.

  As described above, in the input device X1, the degree of collapse of the conductive particles 12a can be confirmed, and downsizing can be realized.

Next, the display device Y1 including the input device X1 will be described with reference to FIGS. Here, FIG. 9 is a plan view showing a schematic configuration of the display device Y1. FIG. 10 is a cross-sectional view taken along the line VI-VI shown in FIG.

  As shown in FIGS. 9 and 10, the display device Y <b> 1 according to the present embodiment includes an input device X <b> 1, a first housing 100, a display panel 200, a backlight 300, and a circuit board 400.

  The first housing 100 has a role of accommodating the input device X1, the display panel 200, the backlight 300, and the circuit board 400. The first housing 100 has a first support part 101 and a second support part 102. The first support portion 101 supports the input device X1 from the second main surface 2B side of the base 2. The second support portion 102 supports the input device X1 from the first main surface 2A side of the base 2. Here, the second support portion 102 is positioned so as to overlap the opening 9 in plan view. Specifically, the second support portion 102 is positioned so as to overlap the conduction region G1 in plan view. For this reason, in the display apparatus Y1, possibility that the inside of the 1st housing 100 will be visually recognized via the base | substrate 2 and the exposed part 10a can be reduced.

  Examples of the constituent material of the first housing 100 include a resin such as polycarbonate, or a metal such as stainless steel and aluminum.

The display panel 200 has a role of displaying an image or a moving image. The display panel 200 is disposed to face the input device X <b> 1 and is accommodated in the first housing 100. The input device X1 and the display panel 200 are arranged with a predetermined interval. However, the present invention is not limited to this, and the input device X1 may be provided on the display panel 200 via a fixing member. Examples of the fixing member include a double-sided tape, a thermosetting resin, an ultraviolet curable resin, or a stopper such as a screw. The display panel 200 according to the present embodiment is a liquid crystal panel using a liquid crystal structure, but is not limited thereto, and is not limited to a plasma display, an organic EL display, a field emission display (FED), or a surface-conduction electron (SED). emitter Display
) Or electronic paper.

  The backlight 300 has a role of entering light over the entire lower surface of the display panel 200. The backlight 300 is disposed behind the display panel 200. The backlight 300 includes a light source 301 and a light guide plate 302. The light source 301 is a member that plays a role of emitting light toward the light guide plate 302, and is composed of an LED (Light Emitting Diode). Note that the light source 301 does not need to be configured by an LED, and may be configured by, for example, a cold cathode fluorescent lamp, a halogen lamp, a xenon lamp, or an EL (Electro-Luminescence). The light guide plate 302 is a member that plays a role of guiding light from the light source 301 substantially uniformly over the entire lower surface of the display panel 200. Note that in the case where a display panel using self-luminous elements is used instead of the display panel 200, the backlight 300 may not be provided.

  The circuit board 400 has a role of supporting electronic components such as a position detection driver 401 of the input device X1, a control circuit that controls the display panel 200 and the backlight 300, a resistor, or a capacitor. The circuit board 400 is disposed behind the backlight 300. Note that the position detection driver 401 may not be disposed on the circuit board 400, and may be disposed on the wiring board 11, for example. The control circuit disposed on the circuit board 400 is electrically connected to the display panel 200 and the backlight 300 by a flexible printed wiring board (not shown).

As described above, the display device Y1 can input various kinds of information by performing an input operation on the input region E1 of the input device X1 while seeing through the display panel 200 via the input device X1. When inputting various types of information, the input device X1 may be provided with a function of presenting various tactile sensations such as a feeling of pressing, a feeling of tracing, and a feeling of touch to the user who has input the information. In this case, the base body 2 in the input device X1 includes one or more vibrating bodies (for example, piezoelectric elements), and when a predetermined input operation or a predetermined pressing load is detected, the vibrating body is detected at a predetermined frequency. It can be realized by vibrating.

  As described above, the display device Y1 includes the input device X1, and thus can be downsized.

  Next, the portable terminal Z1 provided with the display device Y1 will be described with reference to FIG.

  As shown in FIG. 11, the mobile terminal Z1 according to the present embodiment is a smartphone terminal. The mobile terminal Z1 is not limited to a smartphone terminal, and may be an electronic device such as a mobile phone, a tablet terminal, or a PDA (Personal Digital Assistant).

  The portable terminal Z1 includes a display device Y1, an audio input unit 501, an audio output unit 502, a key input unit 503, and a second housing 504.

  The voice input unit 501 has a role of inputting a user's voice and the like, and includes a microphone or the like. The audio output unit 502 has a role of outputting audio from the other party, and is configured by an electromagnetic speaker or a piezoelectric speaker. The key input unit 503 is composed of mechanical keys. The key input unit 503 may be an operation key displayed on the display screen. The second housing 504 has a role of accommodating the display device Y1, the audio input unit 501, the audio output unit 502, and the key input unit 503. The second housing 504 may not be provided, and the audio input unit 501, the audio output unit 502, and the key input unit 503 may be accommodated in the first housing 100 of the display device Y1. As a constituent material of the second housing 504, the same material as that of the first housing 100 may be used.

  In addition, the mobile terminal Z1 may include a digital camera function unit, a one-segment broadcasting tuner, a short-range wireless communication unit such as an infrared communication function unit, a wireless LAN module, various interfaces, and the like according to necessary functions. However, illustration and description of these details are omitted.

  As described above, since the mobile terminal Z1 includes the display device Y1, it is possible to reduce the size.

  Here, the display device Y1 is not limited to the portable terminal Z1 described above, but includes various devices such as an electronic notebook, a personal computer, a copying machine, a game terminal device, a television, a digital camera, or a programmable display used for industrial applications. The electronic device may be provided.

The above-described embodiment shows one specific example, and various modifications can be made. Hereinafter, some main modifications will be described.

[Modification 1]
FIG. 12 is a plan view illustrating a schematic configuration of the input device X2 according to the first modification. FIG. 13 is an enlarged plan view of a region B1 surrounded by a one-dot chain line shown in FIG. 14 is a cross-sectional view taken along line VII-VII shown in FIG. 15 is a cross-sectional view taken along line VIII-VIII shown in FIG. 12 to 15, components having the same functions as those in FIGS. 2 and 6 to 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 12 to 15, the input device X <b> 2 further includes a second protective layer 21 and a third conductive layer 22.

  The second protective layer 21 is provided on the second main surface 2B of the base 2 corresponding to the conduction region G1 and covers the second conductive layer 10 exposed from the first protective layer 13. Specifically, the second protective layer 21 covers the first conductive layer 8 positioned so as to overlap the second conductive layer 10. The second protective layer 21 is located so as to surround the opening 9 in plan view. Examples of the constituent material and the forming method of the second protective layer 21 include the same materials as those of the first protective layer 13. The first protective layer 13 and the second protective layer 21 may be the same member.

  The third conductive layer 22 is provided on the exposed portion 10a. The third conductive layer 22 has translucency. Further, the third conductive layer 22 is electrically connected to the connection terminal 11 c of the wiring board 11 through the adhesive member 12. For this reason, in the input device X2, the exposed portion 10a is cracked or disconnected by the pressure applied when the exposed portion 10a and the connection terminal 11c of the wiring board 11 are electrically connected via the adhesive member 12. The possibility can be reduced. Therefore, in the input device X1, electrical connection reliability can be improved. As a constituent material and a forming method of the third conductive layer 22, the same materials as those of the second conductive layer 10 can be used.

  In the input device X2, the third conductive layer 22 extends on the second protective layer 21. The third conductive layer 22 extending on the second protective layer 21 is electrically connected to the connection terminal 11 c of the wiring board 11 through the adhesive member 12. For this reason, the electrical connection area of the 3rd conductive layer 22 and the connection terminal 11c of the wiring board 11 can be enlarged. For this reason, electrical connection reliability can be further improved.

  In the input device X <b> 2, the second protective layer 21 covers the second conductive layer 10 positioned so as to overlap the first conductive layer 8, and the third conductive layer 22 extends on the second protective layer 21. doing. That is, the first conductive layer 8 is not in contact with the third conductive layer 22. Therefore, the possibility that the first conductive layer 8 located between the first conductive layer 8 and the second conductive layer 10 is corroded due to the influence of the second conductive layer 10 and the third conductive layer 22 is reduced. Can do.

  Further, in the input device X <b> 2, the end of the second protective layer 21 on the side close to the opening 9 becomes thinner as it approaches the opening 9. For this reason, the level | step difference which arises on the surface of the 3rd conductive layer 22 can be made loose. Therefore, when the exposed portion 10a and the connection terminal 11c of the wiring board 11 are electrically connected via the adhesive member 12, the third conductive layer 22 is cracked or disconnected by the pressure applied to the adhesive member 12. The possibility of the occurrence can be reduced.

[Modification 2]
FIG. 16 is a plan view illustrating a schematic configuration of the input device X3 according to the second modification. FIG. 17 is an enlarged plan view of a region C1 surrounded by a one-dot chain line shown in FIG. 18 is a cross-sectional view taken along line IX-IX shown in FIG. 16 to 18, components having the same functions as those in FIGS. 2, 6, and 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 16 to 18, the input device X <b> 3 further includes a fourth conductive layer 31.

The fourth conductive layer 31 is provided on the connection terminal 11 c of the wiring board 11. The fourth conductive layer 31 is disposed to face the exposed portion 10a. Specifically, the fourth conductive layer 31 is positioned so as to overlap the exposed portion 10a in plan view. Here, the shortest distance from the exposed portion 10a to the fourth conductive layer 31 is D1. In addition, the first conductive layer 8 positioned so as to overlap the second conductive layer 10.
Is the shortest distance from the connection terminal 11c to D2. In the input device X3, the possibility that the difference between D1 and D2 becomes large can be reduced. For this reason, when electrically connecting the 1st conductive layer 8 and the 2nd conductive layer 10 and the connection terminal 11c of the wiring board 11 via the adhesive member 12, the electroconductive particle located on the 1st conductive layer 8 is used. 12a can reduce the possibility of being crushed too much.

[Modification 3]
FIG. 19 is a plan view illustrating a schematic configuration of the input device X4 according to the third modification. FIG. 20 is an enlarged plan view of a region D1 surrounded by a one-dot chain line shown in FIG. 21 is a cross-sectional view taken along line XX shown in FIG. 19 to 21, the same reference numerals are given to configurations having the same functions as those in FIGS. 2, 6, and 8, and detailed descriptions thereof are omitted.

  As illustrated in FIGS. 19 to 21, the input device X4 includes a second conductive layer 41 instead of the second conductive layer 10 included in the input device X1.

  The second conductive layer 41 overlaps with the first conductive layer 8 and is provided on the second main surface 2B of the base 2. The second conductive layer 41 has an exposed portion 41 a exposed from the first conductive layer 8 in the opening 9. In addition, the thickness of the exposed portion 41 a is larger than the thickness of the second conductive layer 41 positioned so as to overlap the first conductive layer 8.

  Here, the shortest distance from the exposed portion 41a to the connection terminal 11c is D1. In addition, the shortest distance from the first conductive layer 8 positioned so as to overlap the second conductive layer 41 to the connection terminal 11c is D2. In the input device X4, since the thickness of the exposed portion 41a is larger than the thickness of the second conductive layer 41 positioned so as to overlap the first conductive layer 8, the possibility that the difference between D1 and D2 becomes large is reduced. be able to. For this reason, when electrically connecting the 1st conductive layer 8 and the 2nd conductive layer 41, and the connection terminal 11c of the wiring board 11 via the adhesive member 12, the electroconductive particle located on the 1st conductive layer 8 is used. The possibility that 12a is crushed too much can be reduced.

  The “thickness of the exposed portion 41a” in Modification 3 refers to the maximum thickness of the exposed portion 41a. Further, “the thickness of the second conductive layer 41 positioned so as to overlap with the first conductive layer 8” in Modification 3 refers to the maximum thickness of the second conductive layer 41 positioned so as to overlap with the first conductive layer 8.

[Modification 4]
In addition, this invention is not limited to said embodiment and the modifications 1-3, You may combine the input devices X1-X4 suitably. In the present embodiment, the display device Y1 including the input device X1 has been described. However, the present invention is not limited thereto, and the input device X2, the input device X3, or the input device X4 may be used instead of the input device X1. Good. In the present embodiment, the mobile terminal Z1 including the input device X1 has been described. However, the present invention is not limited to this, and the input device X2, the input device X3, or the input device X4 may be used instead of the input device X1. Good.

X1 to X4 Input device Y1 Display device Z1 Portable terminal (electronic device)
2 Substrate 3a First detection electrode 6 Light-shielding layer 8 First conductive layer 9 Openings 10, 41 Second conductive layers 10a, 41a Exposed portion 11 Wiring board 11c Connection terminal 12 Adhesive member 12a Conductive particles 21 Second protective layer (protection) layer)
22 3rd conductive layer 31 4th conductive layer 100 1st housing (housing)
102 2nd support part (support part)
200 Display panel

Claims (7)

A substrate having translucency;
A detection electrode provided on the substrate and having translucency;
A first conductive layer provided on the substrate and electrically connected to the detection electrode;
A second conductive layer located between the base and the first conductive layer, having a sheet resistance value greater than the sheet resistance value of the first conductive layer, and having translucency;
A wiring board having a connection terminal,
The first conductive layer is provided with an opening,
An adhesive member that further includes a light-transmitting third conductive layer on an exposed portion of the second conductive layer that is exposed from the first conductive layer in the opening, and the third conductive layer includes conductive particles. An input device that is electrically connected to the connection terminal of the wiring board via a wiring board. A protective layer covering the first conductive layer;
The input device according to claim 1 , wherein the third conductive layer extends on the protective layer. A fourth conductive layer located on the connection terminal of the wiring board;
It said fourth conductive layer are arranged opposite to the exposed portion, the input device according to claim 1 or 2. When the thickness of the exposed portion is greater than a thickness of the second conductive layer positioned overlapping with the first conductive layer, an input device according to any one of claims 1-3. The input device according to any one of claims 1 to 4 ,
A display panel disposed opposite the input device;
And a housing containing the display panel. A support portion for supporting the input device on a side opposite to the surface of the base on which the first conductive layer and the second conductive layer are provided;
The display device according to claim 5 , wherein the support portion is positioned so as to overlap with the opening portion in plan view. Electronic apparatus including the display device according to claim 5 or 6.