JP5946705B2 - Inspection apparatus and inspection method - Google Patents

Description

  The present invention relates to an inspection apparatus and an inspection method.

  Conventionally, an inspection apparatus that detects an abnormality of an inspection object from an image obtained by imaging a long inspection object is known (for example, Patent Document 1).

JP 2011-011496 A

  In an inspection apparatus that detects an abnormality from an image, for example, if uneven brightness occurs in the image, it is difficult to detect the abnormality.

  Therefore, as an example, an object of the present invention is to obtain an inspection apparatus and an inspection method that can detect an abnormality more easily.

In the inspection apparatus according to an embodiment of the present invention, the elongated test object and the first light source of the first light illuminating from one side of the longitudinal direction, the test object in the longitudinal direction from the other side a second light source of the second light illuminating alternating with the first light, in a state where the test object is being conveyed in the longitudinal direction, the first primary of the inspection object at a timing that is illuminated by the first light and acquisition of the original image, a second and an acquisition of a one-dimensional image of the inspection object in the second timing illuminated with light, an imaging unit that performs repeated alternately, said a first one-dimensional image first The third one-dimensional image obtained by combining the second one-dimensional image acquired at the adjacent timing after the one one-dimensional image is acquired is the third one-dimensional image in the order in which the first one-dimensional image is acquired. Processing to generate a two-dimensional composite image aligned in the direction orthogonal to the longitudinal direction of a one-dimensional image When, with an abnormality detection unit for detecting an abnormality of the inspection object a composite image image processing to the.

  According to the present invention, as an example, it is possible to obtain an inspection apparatus and an inspection method that can more easily detect an abnormality.

FIG. 1 is a perspective view illustrating an example of an inspection apparatus according to an embodiment. FIG. 2 is a schematic view of an example of a part of the inspection apparatus according to the embodiment as viewed from the longitudinal direction of the inspection object. FIG. 3 is a schematic diagram illustrating an example of a first image, a second image, and a composite image acquired by the inspection apparatus according to the embodiment. FIG. 4 is a schematic diagram illustrating an example of a first image (a two-dimensional image in which one-dimensional images are arranged) captured by the inspection apparatus according to the embodiment. FIG. 5 is a schematic diagram illustrating an example of a second image (a two-dimensional image in which one-dimensional images are arranged) captured by the inspection apparatus according to the embodiment. FIG. 6 is a schematic block diagram illustrating an example of the inspection apparatus according to the embodiment. FIG. 7 is a schematic block diagram illustrating an example of a control unit of the inspection apparatus according to the embodiment. FIG. 8 is a schematic diagram illustrating an example of a composite image captured by the inspection apparatus according to the embodiment. FIG. 9 is a flowchart illustrating an example of an inspection method performed by the inspection apparatus according to the embodiment. FIG. 10 is a schematic diagram illustrating an example of an image indicating an abnormality detected by the inspection apparatus according to the embodiment.

  In the present embodiment, as an example, the inspection apparatus 1 illustrated in FIG. 1 inspects the inspection object 100 based on an image obtained by imaging the inspection object 100. The inspection object 100 is, for example, a long and circular (or columnar) part (for example, a hose, a tube, a rod, etc.).

  In the present embodiment, as an example, as illustrated in FIG. 1, the inspection apparatus 1 includes a plurality of (in the present embodiment, two as an example) light sources 2U and 2D. Specifically, the light source 2U and the light source 2D are arranged apart from each other in the longitudinal direction (axial direction) of the inspection object 100. The light source 2U and the light source 2D are configured in an annular shape (for example, an annular shape). The light source 2U and the light source 2D have a plurality of LEDs (light emitted diodes) arranged in an annular shape. The elongate inspection object 100 passes through the inside (for example, the center and the center) of the annular portions of the light source 2U and the light source 2D, and extends along the axial direction of the annular portion. Further, the light source 2U and the light source 2D are arranged in plane symmetry with respect to a plane orthogonal to the longitudinal direction (axial direction) of the inspection object 100.

  In the present embodiment, as an example, the imaging region A of the inspection object 100 is set between the light source 2U and the light source 2D (in the present embodiment, an intermediate position as an example). The light from the light source 2U is applied to the imaging region A from one side in the longitudinal direction (left side in FIG. 1) of the inspection object 100, and the light from the light source 2D is from the other side in the longitudinal direction (right side in FIG. 1). The imaging area A is irradiated.

  In the present embodiment, as an example, the inspection object 100 is transported in the longitudinal direction (axial direction) by the transport device 30 (see FIG. 6) during the inspection. That is, the inspection apparatus 1 inspects the inspection object 100 that is transported and moved by the transport apparatus 30. Therefore, the imaging region A moves along the longitudinal direction of the inspection object 100 as the inspection object 100 moves. In the present embodiment, as an example, the inspection object 100 moves from the light source 2U side to the light source 2D side. That is, the light source 2U is positioned upstream in the transport direction with respect to the imaging region A, and the light source 2D is positioned downstream in the transport direction with respect to the imaging region A.

  In the present embodiment, as an example, the imaging unit 3 (for example, a camera or the like) is positioned on the radially outer side of the inspection target 100 and is an image of the surface 100a (outer surface, peripheral surface, side surface) of the inspection target 100. To get. That is, the imaging region A is a part of the surface 100a of the inspection target 100.

  In the present embodiment, as an example, the imaging unit 3 acquires an image of the imaging region A via the optical component 4. In the present embodiment, as an example, the optical component 4 is a plurality of (in the present embodiment, two as an example) mirrors 4L and 4R. Specifically, as shown in FIG. 2, the mirrors 4L and 4R are arranged in a V shape with a line of sight from the axial direction on the opposite side of the inspection object 100 from the imaging unit 3. The mirrors 4L and 4R are arranged in a posture that is at an angle of 120 ° to each other (an angle of 60 ° on the opposite side with respect to the line L connecting the imaging unit 3 and the inspection object 100). Each of the mirrors 4L and 4R has a planar reflecting surface 4a (mirror surface) facing (opposed) to the surface 100a of the inspection object 100. The reflection surface 4a extends along a surface substantially orthogonal to the radial direction of the inspection object 100. The mirrors 4L and 4R extend in a strip shape along a plane orthogonal to the longitudinal direction (axial direction) of the inspection object 100. In such a configuration, the imaging area A is an area of approximately half a circumference of the surface 100a of the inspection object 100 facing the mirrors 4L and 4R. In the present embodiment, as an example, the adjacent mirrors 4L and 4R are integrated, but may be separated.

  Moreover, in this embodiment, the test | inspection part 10 (10U, 10D) containing the light sources 2U and 2D, the imaging part 3, and the optical component 4 as an example is the longitudinal direction (an axial direction, a conveyance direction) of the test target object 100. It is provided at a plurality of places (in this embodiment, two places as an example) at intervals. In these inspection units 10, the arrangement of the imaging unit 3 and the optical component 4 is different. In the present embodiment, as an example, in the inspection unit 10U located on the upstream side (left side in FIG. 1) in the transport direction, the imaging unit 3 is located on the upper side in FIG. 1 and the optical component 4 is located on the lower side. Therefore, the imaging unit 3 of the inspection unit 10U acquires an image of the lower region (imaging region A) in FIG. On the other hand, in the inspection unit 10D located on the downstream side (right side in FIG. 1), the imaging unit 3 is located on the lower side of FIG. 1 and the optical component 4 is located on the upper side. Therefore, the imaging unit 3 of the inspection unit 10D acquires an image of the upper region (imaging region A) in FIG. That is, each of the plurality of imaging units 3 images different regions (parts, positions) of the surface 100a of the inspection object 100.

  In the present embodiment, as an example, the imaging unit 3 is configured as a line camera (line sensor). The imaging unit 3 has a plurality of photoelectric conversion elements (imaging elements, not shown) arranged in a line along the width direction of the inspection object 100. That is, the imaging unit 3 acquires a linear image (image data, luminance value data for each pixel corresponding to each photoelectric conversion element, luminance value data string) along the width direction of the inspection object 100. In each image sensor, luminance value data is acquired with, for example, 256 gradations. The imaging unit 3 acquires a one-dimensional image at each time (timing) when the imaging is performed. In the case of the monochrome (monochrome) imaging unit 3, one image data is acquired for each imaging device, and in the case of the color imaging unit 3, a plurality (for example, R (red) G (green) B (blue) is obtained for each imaging device. 3) of image data is acquired.

  Moreover, in this embodiment, as an example, the light irradiation to the inspection object 100 by the light sources 2U and 2D is executed alternately. Then, imaging (acquisition of images) by the imaging unit 3 and irradiation of light to the inspection object 100 by the light sources 2U and 2D (for example, light emission and switching of the light sources 2U and 2D) are synchronized. That is, in the present embodiment, as an example, as illustrated in FIG. 3, the imaging unit 3 includes a one-dimensional image IL <b> 1 (first image, first object, 100) when illuminated by light from the light source 2 </ b> U. A linear image, image data (denoted as “1” in FIG. 3), and a one-dimensional image IL2 of the inspection object 100 when illuminated with light from the light source 2D (second image, linear image, Image data (denoted as “2” in FIG. 3) are obtained alternately. The image processing unit 20d (see FIG. 7) arranges the images IL1 of the inspection object 100 when illuminated by the light from the light source 2U in the order of acquisition and arranges the two-dimensional image IA1 (first image, image data, two-dimensionally). (Data group of arranged luminance values) can be obtained, and the image IL2 of the inspection object 100 when illuminated by the light from the light source 2D is arranged in the order of acquisition to obtain a two-dimensional image IA2 (second image, image) Data, a data group of luminance values arranged two-dimensionally).

  By appropriately setting the irradiation (switching) of light from the light sources 2U and 2D, the frequency of imaging by the imaging unit 3, the conveyance speed of the inspection object 100 by the conveyance device 30, and the like are illustrated in FIGS. Such images IA1 and IA2 are obtained. The switching frequency of light from the light sources 2U and 2D, that is, the imaging frequency for each line by the imaging unit 3 is set to a relatively high value (for example, 6 kHz). Therefore, the images IA1 and IA2 can be made to be similar to an image captured by the area sensor (an imaging unit that captures a two-dimensional region) while the surface 100a (for half of the surface) of the inspection target 100 is stationary. Since the line sensor has a relatively high resolution and a relatively high response compared to the area sensor, the use of the line sensor may enable more accurate abnormality detection (inspection). In the images IA1 and IA2, the arrangement direction of data in the included images IL1 and IL2 (left and right directions in FIGS. 3 to 5) corresponds to the width direction (short direction) of the inspection object 100, and the images IA1 and IA2 The direction in which the images IL1 and IL2 are arranged (the vertical direction in FIGS. 3 to 5) corresponds to the longitudinal direction (axial direction) of the inspection object 100.

  As described above, the imaging unit 3 acquires an image of the inspection object 100 via a plurality of (in this embodiment, two as an example) mirrors 4L and 4R, as shown in FIGS. The images IA1 and IA2 obtained by the inspection apparatus 1 configured as described above include a plurality (two) of images Ia and Ib of the inspection object 100, respectively. These images Ia and Ib are lines L (see FIG. 2) connecting the imaging unit 3 and the inspection object 100 on the opposite side of the inspection object 100 from the imaging unit 3 (the side where the mirrors 4L and 4R are positioned). It is the image seen from the position deviated from. The two-dimensional images IA1 and IA2 include an image In that does not pass through the mirrors 4L and 4R of the inspection target 100 between the image Ia and the image Ib. However, in the present embodiment, as an example, the focus of the imaging unit 3 is set corresponding to the images Ia and Ib, and thus the image In is blurred. That is, in this embodiment, as an example, the image In is not used for abnormality detection. The backgrounds of these images Ia, Ib, and In are set dark. The image processing unit 20d (see FIG. 7) of the inspection apparatus 1 according to the present embodiment performs image processing based on the two-dimensional images IA1 and IA2 thus obtained, and the surface 100a of the inspection object 100 (The shape corresponding to the abnormality reflected in relation to the images Ia and Ib) is detected. For example, as shown in FIGS. 4 and 5, abnormalities to be detected by the inspection apparatus 1 include abnormalities A1 such as wrinkles and scratches generated on the surface 100a of the inspection object 100, and protrusions (threads). There are abnormalities such as A2. The inspection apparatus 1 can also detect other abnormalities. The images IL1 and IL2 also include images Ia, Ib, and In (however, for one line).

  In this embodiment, as an example, as illustrated in FIG. 6, the inspection apparatus 1 includes a control unit 20 (for example, a CPU (central processing unit)), a ROM 21 (read only memory), a RAM 22 (random access memory), An SSD 23 (solid state drive), a light irradiation controller 24, an imaging controller 25, a transport controller 26, a display controller 27, and the like can be provided. The light irradiation controller 24 controls light emission (ON, OFF) and the like of the light sources 2U and 2D based on a control signal from the control unit 20. Note that when a variable device such as a shutter that switches between opening and closing of light by switching between opening and closing is provided, the operation of the variable device is controlled. The imaging controller 25 controls imaging by the imaging unit 3 based on a control signal from the control unit 20. The transport controller 26 controls the transport device 30 based on the control signal received from the control unit 20 and controls transport (start, stop, speed, etc.) of the inspection object 100. The display controller 27 controls the display device 40 based on a control signal from the control unit 20. Further, the control unit 20 reads and executes a program (application) installed in the ROM 21 or the SSD 23 as a nonvolatile storage unit. The RAM 22 temporarily stores various data used when the control unit 20 executes programs and executes various arithmetic processes. Note that the hardware configuration shown in FIG. 6 is merely an example, and various modifications such as a chip or a package can be implemented. Various arithmetic processes can be performed in parallel, and the control unit 20 or the like can have a hardware configuration capable of parallel processing.

  In the present embodiment, as an example, the control unit 20 functions (operates) as at least a part of the inspection apparatus 1 in cooperation with hardware and software (program). That is, as shown in FIG. 7, the control unit 20 functions as a light irradiation control unit 20a, an imaging control unit 20b, a conveyance control unit 20c, an image processing unit 20d, a display control unit 20e, and the like. The light irradiation control unit 20 a controls the light irradiation controller 24. The imaging control unit 20b controls the imaging controller 25. The conveyance control unit 20 c controls the conveyance controller 26. The image processing unit 20d performs image processing on the image data acquired by the imaging unit 3. An abnormality of the inspection object 100 is detected by the image processing by the image processing unit 20d. Therefore, the image processing unit 20d is an example of an abnormality detection unit. The display control unit 20e controls the display device 40 (for example, an LCD (liquid crystal display), an OELD (organic electroluminescent display), etc.).

  In addition, the inspection apparatus 1 according to the present embodiment can inspect the inspection object 100 having a spiral concave portion or convex portion on the outer periphery thereof. A spiral recess or projection (groove, protrusion, step, etc.) is likely to be formed when a spiral wound (eg, tape, ribbon, wire, etc., not shown) is included. The wound product is wound at a constant pitch in the longitudinal direction. In addition, the wound material may be exposed to the outer periphery or may not be exposed. When the wound product is not exposed to the outer periphery and a wound product (for example, a wire) is provided inside the outer wall (wall portion), the portion covering the wound product protrudes in a spiral shape.

  Then, the image IL1, which is obtained by imaging the inspection object 100 and processing it as described above, by the inventor's earnest research regarding the inspection of the inspection object 100 having a spiral recess or protrusion on the outer periphery. In IA1 (FIG. 4) and images IL2 and IA2 (FIG. 5), it was found that the bright area and the dark area may be different (reverse). Specifically, for example, in the image IA1 shown in FIG. 4, one side (the left side in the example of FIG. 4) of the width direction (width direction of the inspection object 100) of the images Ia and Ib of the inspection object 100 is bright. The other side (right side in the example of FIG. 4) is dark. In the image IA2 shown in FIG. 5, the other side in the width direction of the images Ia and Ib of the inspection object 100 (right side in the example of FIG. 5) is bright and one side (left side in the example of FIG. 5) is dark.

  As described above, when the images Ia and Ib to be detected include a bright region and a dark region, it is more difficult to set a threshold value when binarizing with a luminance value, and thus it is more difficult to detect an abnormality. Cheap. For example, the abnormality A1 shown in the image Ia in FIGS. 4 and 5 is difficult to detect depending on the location. Furthermore, in the method of detecting an abnormality from the difference image between the image IA1 and the image IA2, the abnormality A1 may be more difficult to detect. For example, in the case of an abnormality A1 such as a fine wrinkle or a flaw, shadows appear in both images IA1 and IA2 that are illuminated by light, and the shadows are offset depending on the difference processing, which may be difficult to detect. is there.

  Therefore, as a result of intensive research, the inventor synthesized a two-dimensional image IA1 (FIG. 4) and an image IA2 (FIG. 5) obtained by imaging the inspection object 100 and processing it as described above (see FIG. 5). It has been found that better results may be obtained by performing image processing on a two-dimensional image IC (see FIGS. 3 and 8) that has been subjected to addition and addition of luminance values of corresponding pixels. Regarding the synthesis of the image IA1 and the image IA2, the images IL1 and IL2 included in the images IA1 and IA2 and adjacent to each other are overlapped. As shown in FIG. 3, the images IL1 and IL2 that are adjacent to each other are shifted in timing by exactly one line, but particularly when the light irradiation or imaging switching frequency is relatively high, It can be regarded as an image (image data) in almost the same place. In the image IC, the data arrangement direction (left and right direction in FIGS. 3 to 5) in the included images IL1 and IL2 (“1” and “2” in FIG. 3) is the width direction (short side) of the inspection object 100. The direction in which the images IL1 and IL2 are arranged in the image IC (the vertical direction in FIGS. 3 to 5) corresponds to the longitudinal direction (axial direction) of the inspection object 100.

  FIG. 8 shows an example of an image IC obtained by combining (adding) the image IA1 (FIG. 4) and the image IA2 (FIG. 5). As shown in FIG. 8, in the images Ia and Ib of the inspection object 100 included in the combined image IC, the inspection objects included in the image IA1 (FIG. 4) and the image IA2 (FIG. 5) before combining. Compared with 100 images Ia and Ib, the uneven brightness in the width direction is reduced. Therefore, it is easier to set a threshold value when binarizing with the luminance value, and it is easier to detect the abnormality A1. Further, when the abnormality A1 is shown as a dark area (shadow), the difference (contrast) in luminance value from the general part (most area that is not abnormal) of the images Ia and Ib of the inspection object 100 Tends to be larger, and as a result, the abnormality A1 can be detected more easily.

  In the present embodiment, as an example, the control unit 20 of the inspection apparatus 1 executes image processing and abnormality detection according to a procedure as shown in FIG. The control unit 20 functions as the light irradiation control unit 20a and the imaging control unit 20b in a state where the inspection object 100 is moving at a constant speed, and the light irradiation controller 24, the imaging controller 25, and the light sources 2U and 2L, and the imaging unit. 3 is controlled to alternately obtain one-dimensional images IL1 and IL2 (step S10). Next, the control unit 20 functions as the image processing unit 20d, and arranges a plurality of columns of images IL1 and IL2 in the order obtained in a predetermined period as described above, and generates two-dimensional images IA1 and IA2. Is obtained (step S11). Next, the control unit 20 functions as the image processing unit 20d, and combines (adds) the image IA1 and the image IA2 as described above to obtain an image IC (step S12). Note that the image IC is not necessarily generated via the image IA1 and the image IA2, and may be generated from the image IL1 and the image IL2.

  Next, the control unit 20 functions as the image processing unit 20d, and specifies (extracts) target areas (images Ia and Ib) for detecting the abnormality A1 (step S13). In the two-dimensional images IA1, IA2, and IC, the positions where the images Ia and Ib appear are substantially fixed and brighter than the background. Therefore, in step S13, the processing target area can be specified (extracted) by limiting the area in the images IA1, IA2, and IC, binarization processing, edge detection, and the like.

  Next, the control unit 20 functions as the image processing unit 20d (abnormality detection unit), and detects the abnormality A1 (step S14). The abnormality A1 is included as a darker part than the images Ia and Ib in the two-dimensional image IC, for example. Accordingly, in step S14, the image processing unit 20d performs binarization processing on the synthesized image IC again, for example, using the regions of the images Ia and Ib specified (extracted) in step S13 as the processing target. Further, grouping, labeling, and the like are performed on the pixels having a value lower than the threshold value. Thereby, in step S14, for example, as a group of pixels (lumps) in which the luminance value is lower than the other portions (the luminance value is lower than the threshold value) and the number is within a predetermined range in the regions of the images Ia and Ib. The abnormality A1 can be detected. Note that the binarization threshold in step S14 is lower than the threshold in step S13, unlike the binarization threshold in step S13. In addition, regarding the detection of the abnormality A1, the shape and position characteristics can be taken into consideration.

  Further, the control unit 20 functions as the image processing unit 20d, and specifies (extracts) a target region (region of the peripheral portion of the images Ia and Ib) for detecting the abnormality A2 (step S15). In this step S15, for example, the image processing unit 20d specifies the processing target region as a region having a predetermined width adjacent to the outside (in the background) of the region of the images Ia and Ib specified (extracted) in step S13 ( Extraction).

  Next, the control unit 20 functions as the image processing unit 20d (abnormality detection unit), and detects the abnormality A2 (step S16). For example, the abnormality A2 is included in the image IC as a bright portion protruding linearly from the outer edge of the images Ia and Ib. Accordingly, in step S16, the image processing unit 20d performs binarization processing on the synthesized image IC again, for example, with the area having the predetermined width specified in step S15 as a processing target, and pixels whose luminance value is higher than the threshold value. In addition, grouping and labeling are performed. Thereby, in step S16, for example, in the region of the predetermined width specified in step S15, connected to the images Ia and Ib (continuously), the luminance value is higher than the other parts (the luminance value is higher than the threshold value). ), The abnormality A2 can be detected as a pixel group (cluster) whose number is within a predetermined range. Note that the binarization threshold in step S16 is higher than the threshold in step S15, unlike the binarization threshold in step S15. In addition, regarding the detection of the abnormality A2, the shape and position characteristics can be taken into consideration.

  Next, the control unit 20 functions as the display control unit 20e. When at least one of the abnormality A1 and the abnormality A2 is detected (Yes in step S17), the control unit 20 controls the display device 40, for example, As shown in FIG. 10, an image IR indicating the detection results of the abnormalities A1 and A2 is displayed on the display screen of the display device 40 (step S18). In this case, the image IR may include an outline (outline) of the inspection object 100, a coordinate axis for identifying the position, a scale, and the like.

  As described above, in this embodiment, as an example, in the present embodiment, the inspection apparatus 1 performs image processing on the composite image IC in which the first image IA1 (IL1) and the second image IA2 (IL2) are combined, and the inspection target. An image processing unit 20d that detects an abnormality of the object 100 is provided. Therefore, according to the present embodiment, as an example, when unevenness of brightness is reduced in the composite image IC compared to the first image IA1 or the second image IA2, abnormality detection based on image processing is easier or more accurate. Easy to execute well.

  In the present embodiment, as an example, the inspection object 100 has a spirally wound object. Therefore, according to the present embodiment, as an example, in the inspection object 100 having a spirally wound object, the brightness unevenness of the composite image IC is larger than that of the first image IA1 or the second image IA2. In the case of reduction, abnormality detection based on image processing is easily performed with higher accuracy.

  In the present embodiment, as an example, the imaging unit 3 acquires the first image IL1 and the second image IL2 alternately and repeatedly. Therefore, according to the present embodiment, as an example, the first image IL1 and the second image IL2 acquired at timings adjacent to each other can be synthesized. Therefore, the composite image IC can be easily obtained as an image closer to the real object.

  In the present embodiment, as an example, the composite image includes two-dimensional first image IA1 arranged in the order in which linear first image IL1 is acquired, and two images arranged in the order in which linear second image IL2 is acquired. This is a composite image of the two-dimensional second image IA2. Therefore, according to the present embodiment, as an example, abnormality detection can be performed based on a higher response or higher resolution image from the line sensor. Further, according to the present embodiment, for example, the two-dimensional first image IA1 and the second image IA2 are used for abnormality detection processing based on the difference image, or the two-dimensional first image IA1 and the second image IA2 itself. Can be used for abnormality detection.

  In the present embodiment, as an example, the first image IA1 (IL1) and the second image IA2 (IL2) include images Ia and Ib of a plurality of parts of the inspection object 100, respectively. Therefore, according to the present embodiment, as an example, abnormality detection of a plurality of parts of the inspection object 100 can be executed by image processing of one image data. Therefore, as an example, the calculation time for abnormality detection is likely to be reduced.

  In the present embodiment, as an example, the composite image includes images of a plurality of parts at intervals in a direction crossing a direction corresponding to the longitudinal direction of the inspection object 100. Therefore, abnormality detection based on image processing is easily performed with higher accuracy.

  In the present embodiment, as an example, the imaging unit 3 acquires images of a plurality of parts via the optical component 4 (mirrors 4L and 4R) that refracts or reflects light. Therefore, according to the present embodiment, as an example, a configuration for acquiring images of a plurality of parts is easily obtained as a simpler configuration. When the optical component 4 in which the two mirrors 4L and 4R are integrated is used, it becomes easier to handle the mirrors 4L and 4R at the time of manufacturing and maintenance of the inspection apparatus 1.

  In the present embodiment, as an example, the inspection object 100 has a direction in which light is illuminated in a bright area and a dark area when light is illuminated from one side and when light is illuminated from the other side. Reverses in the direction of crossing. Therefore, according to the present embodiment, as an example, the abnormality of the inspection object 100 is more easily detected by the image processing using the characteristics of the first image IA1 and the second image IA2.

  In the present embodiment, as an example, the inspection object 100 is a long component having a spiral concave portion or convex portion on the outer periphery. Therefore, according to the present embodiment, as an example, when a long part having a spiral recess or projection on the outer periphery is illuminated from one side and from the other side In the case where the bright area and the dark area are components that are reversed in the direction intersecting with the direction in which the light is illuminated, the inspection object 100 is obtained by image processing using the characteristics of the first image IA1 and the second image IA2. This makes it easier to detect abnormalities.

  In the present embodiment, as an example, the image processing unit 20d detects an abnormality of the inspection object by image processing of a composite image obtained by combining the first image and the second image. Therefore, according to the present embodiment, as an example, in the composite image IC, the unevenness in brightness is reduced, and thus the abnormality of the inspection object 100 is more easily detected.

  As mentioned above, although embodiment of this invention was illustrated, the said embodiment is an example to the last. The embodiment can be implemented in various other forms, and various omissions, replacements, combinations, and changes can be made without departing from the scope of the invention. In addition, the configuration and shape of the embodiment can be partially replaced with other configurations and shapes. In addition, specifications (structure, type, direction, angle, shape, size, length, width, thickness, height, number, arrangement, position, material, etc.) of each configuration, shape, etc. are changed as appropriate. Can be implemented. For example, the inspection object may be other than an elongated part. Further, the inspection apparatus can detect an abnormality other than the abnormality described above by image processing. Further, the inspection apparatus may inspect with an image acquired in a stationary state. The optical component may be other than a mirror (for example, a lens, a prism, etc.). Further, three or more parts of the inspection object may be included in the image. Further, the imaging unit may acquire a linear image extending in a direction crossing the width direction (oblique direction). In addition, a plurality of imaging units may be provided.

  DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus, 2D ... Light source, 2U ... Light source, 3 ... Imaging part, 4 ... Optical component, 4L, 4R ... Mirror (optical component), 20b ... Imaging control part, 20d ... Image processing part (abnormality detection part), 100: Inspection object.

Claims (8)

A first light source of the first light illuminating an elongated inspection object from one side of the longitudinal direction,
A second light source of the second light illuminating the test object alternately with the first light from the other side of the longitudinal direction,
In a state in which the inspection object is being conveyed in the longitudinal direction, and the acquisition of the first one-dimensional image of the inspection object at a timing that is illuminated by said first light, illuminated by the second light An imaging unit that alternately and repeatedly obtains the second one-dimensional image of the inspection object at a predetermined timing ;
A third one-dimensional image obtained by combining the first one-dimensional image and the second one-dimensional image acquired at an adjacent timing after the first one-dimensional image is acquired is the first one-dimensional image. An image processing unit that generates a two-dimensional composite image arranged in a direction orthogonal to the longitudinal direction of the third one-dimensional image in the order in which the one-dimensional image is acquired;
An abnormality detection unit for detecting an abnormality of the inspection object by image processing the composite image,
An inspection device comprising: The inspection object is a long inspection object having a spiral recess or projection on the outer periphery, and light is emitted from one side in the longitudinal direction of the inspection object and light from the other side. The inspection apparatus according to claim 1, wherein a bright region and a dark region are inspected objects that are reversed in a direction crossing the longitudinal direction of the inspection object when the light is illuminated. The inspection apparatus according to claim 2, wherein the inspection object includes a spirally wound object. Wherein the first one-dimensional image and the second one-dimensional image, respectively, includes an image of a plurality of sites of the inspection object, the inspection apparatus according to any one of claims 1 to 3 . 5. The inspection apparatus according to claim 4 , wherein the composite image includes images of the plurality of parts at intervals in a direction crossing a direction corresponding to a longitudinal direction of the inspection object. The imaging unit acquires an image of the plurality of sites via an optical component for refracting or reflecting light, inspection apparatus according to claim 4 or 5. An inspection method using an inspection apparatus that detects an abnormality of the inspection object by performing image processing on an image obtained by imaging a long inspection object,
The light irradiation control unit is configured such that the first light source illuminates the inspection object with the first light from one side in the longitudinal direction, and the second light source alternately illuminates the inspection object with the first light source. Controlling the first light source and the second light source to illuminate a second light from the other side of the direction;
The imaging control unit acquires the first one-dimensional image of the inspection object at the timing illuminated by the first light in a state where the inspection object is conveyed in the longitudinal direction , and the second the acquisition and the second one-dimensional images of the inspected object in the illuminated timing light, to perform repeated alternately, and controlling the imaging unit,
The third one-dimensional image obtained by synthesizing the first one-dimensional image and the second one-dimensional image acquired at an adjacent timing after the first one-dimensional image is acquired by the abnormality detection unit. Abnormality of the inspection object is detected by image processing of a two-dimensional composite image in which the images are arranged in a direction orthogonal to the longitudinal direction of the third one-dimensional image in the order in which the first one-dimensional image is acquired. Steps,
Including an inspection method. The inspection object is a long inspection object having a spiral recess or projection on the outer periphery, and light is emitted from one side in the longitudinal direction of the inspection object and light from the other side. The inspection method according to claim 7, wherein the bright area and the dark area are reversed in a direction crossing the longitudinal direction of the inspection object when the light is illuminated.