JP5940361B2 - Superconducting current lead manufacturing method, superconducting current lead, and superconducting magnet device - Google Patents

Description

  The present invention relates to a method of manufacturing a superconducting current lead, a superconducting current lead, and a superconducting magnet device.

  For example, Patent Document 1 discloses a superconducting current composed of a current lead support and a plurality of tape-shaped oxide superconductor wires connected to the current terminals at both ends and connected between the current terminals. Lead is disclosed.

JP 2009-230913 A

  By the way, the superconductor wire has a low mechanical strength, and the characteristics are deteriorated by the occurrence of strain. Since the superconducting current lead disclosed in Patent Document 1 has a configuration in which a superconductor wire is provided on the surface of the current lead support, an external force is applied and distortion is likely to occur. For this reason, the superconducting current lead disclosed in Patent Document 1 may cause mechanical distortion in the superconducting wire at the time of assembling the superconducting current lead, and there is a problem that the assembling property and the yield are lowered. .

  The present invention has been made in view of the above points, and an object thereof is to provide a superconducting current lead manufacturing method, a superconducting current lead, and a superconducting magnet device that are easy to handle at low cost.

An aspect of the present invention provides:
A method of manufacturing a superconducting current lead having a load support, a pair of electrodes disposed at both ends of the load support, and a superconductor that electrically connects the pair of electrodes,
A first step of fixing the electrodes to both ends of the load support;
A second step carried out after performing the first step and fixing the superconductor between the electrodes;
And have a,
The method of manufacturing a superconducting current lead, further comprising a step of disposing a pressing member for pressing the superconductor toward the electrode on the electrode .

  According to this aspect, since the superconductor is fixed to the electrode fixed to the load support, the electrode is fixed when the superconducting current lead is assembled. Can be prevented.

Another aspect of the present invention is:
A superconducting current lead having a load support, a pair of electrodes disposed at both ends of the load support, and a superconductor electrically connecting the pair of electrodes;
The load support and the electrode are fixed by a first bonding material,
The superconductor and the electrode are fixed by a second bonding material having a melting temperature lower than that of the first bonding material , and a pressing member that presses the superconductor toward the electrode is provided. Is a superconducting current lead.

  According to this aspect, since the superconductor is fixed to the electrode fixed to the load support, the electrode is fixed when the superconducting current lead is assembled. Can be prevented.

  In addition, since the melting temperature of the second bonding material for bonding the superconductor and the electrode is lower than the melting temperature of the first bonding material for fixing the load support and the electrode, the bonding time of the superconductor and the electrode is low. The electrode is kept fixed to the load support. Therefore, the electrode does not move when the superconductor is fixed, and the superconductor can be prevented from being distorted.

  According to the present invention, since the superconductor is fixed to the electrode fixed to the load support, the electrode is in a fixed state when the superconducting current lead is assembled. Can be prevented.

FIG. 1 is a configuration diagram of a superconducting magnet apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of a superconducting current lead according to an embodiment of the present invention. FIG. 3 is an enlarged perspective view showing a main part of the superconducting current lead according to the embodiment of the present invention. FIG. 4 is a perspective view showing a state in which the load support of the superconducting current lead according to the embodiment of the present invention is removed. FIG. 5 is a diagram for explaining a method of manufacturing a superconducting current lead according to an embodiment of the present invention. FIG. 6 is an enlarged perspective view of a main part showing a state in which one electrode half and a superconductor are arranged on the load support. FIG. 7 is an exploded perspective view for explaining that a superconductor is sandwiched between a pair of electrode halves. FIG. 8 is an essential part enlarged perspective view showing a state in which a pair of electrode halves and a superconductor are arranged in a load support body.

  Next, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a superconducting magnet apparatus 1 to which a superconducting current lead 8 according to an embodiment of the present invention is applied. The superconducting magnet device 1 includes a vacuum vessel 2, a superconducting coil 3, a heat transfer member 4, a Gifford-McMahon (hereinafter abbreviated as GM) refrigerator 5, a heat shield plate 6, a one-stage current line 7, superconductivity A current lead 8 and a two-stage current line 9 are provided.

  The vacuum vessel 2 has a substantially cylindrical shape. A GM refrigerator 5 is fixed to the vacuum container 2. Superconducting coil 3 is formed of a superconducting wire.

  The superconducting coil 3 is provided in a space surrounded by the heat shield plate 6. The superconducting coil 3 is connected to a low-temperature side cooling stage 5d described later via a heat transfer member 4. Therefore, the superconducting coil 3 is cooled to, for example, about 4K by the GM refrigerator 5, and thereby the superconducting coil 3 enters a superconducting state.

  The superconducting coil 3 is connected to a low temperature side of a superconducting current lead 8 to be described later. The superconducting coil 3 is supplied with electric power from a power source (not shown) provided outside the vacuum vessel 2 through a first-stage current line 7, a superconducting current lead 8, and a second-stage current line 9 described later.

  The vacuum vessel 2 supports loads such as the heat transfer member 4 and the superconducting coil 3 attached to the heat transfer member 4 via the support 10.

  The heat shield plate 6 is provided inside the vacuum vessel 2. The heat shield plate 6 is for suppressing radiant heat entering the superconducting coil 3. The heat shield plate 6 is made of a material having a high thermal conductivity such as copper or aluminum, and has, for example, a substantially cylindrical shape.

  In the present embodiment, the GM refrigerator 5 has a multi-stage cooling cylinder structure including a first-stage cooling cylinder 5a and a second-stage cooling cylinder 5b. The first-stage cooling cylinder 5 a is inserted into the vacuum vessel 2, and the second-stage cooling cylinder 5 b is inserted into a space surrounded by the heat shield plate 6.

  Connected to the top of the top plate of the heat shield plate 6 is a high temperature side cooling stage 5c cooled by the first stage cooling cylinder 5a. Therefore, the heat shield plate 6 is cooled by the high temperature side cooling stage 5c.

  A low temperature side cooling stage 5d is connected to the lower end of the second stage cooling cylinder 5b. The low temperature side cooling stage 5d is cooled by the second stage cooling cylinder 5b.

  The low temperature side cooling stage 5 d is thermally connected to the superconducting coil 3 through the heat transfer member 4. Thereby, the superconducting coil 3 is cooled to about 4K, for example. The high temperature side cooling stage 5c and the low temperature side cooling stage 5d are formed of a material having a high thermal conductivity such as copper or aluminum.

  The first-stage current line 7, the superconducting current lead 8, and the second-stage current line 9 are for supplying current to the superconducting coil 3 from a power source (not shown). The power source is connected to the first stage current line 7. The first stage current line 7 is connected to the high temperature side electrode 30A of the superconducting current lead 8 and the low temperature side electrode 30B of the superconducting current lead 8 is connected to the superconducting coil 3 via the two stage current line 9. . Therefore, the current supplied from the power source is supplied to the superconducting coil 3 via the first stage current line 7, the superconducting current lead 8, and the second stage current line 9.

  As the first stage current line 7, a material having a high conductivity such as copper or aluminum can be used. As the two-stage current line 9, a material having a high conductivity such as copper or aluminum can be used, or a superconducting material such as Bi2223, Bi2212, Y123, or MgB2 is used in combination with a material having a high conductivity. Can do.

  In this embodiment, the refrigerator-cooled superconducting magnet device 1 is taken as an example. However, instead of the refrigerator-cooled superconducting magnet device, for example, this embodiment is applied to a liquid-cooled superconducting magnet device using liquid helium as a refrigerant. The superconducting current lead 8 according to the embodiment may be applied, or may be applied to a gas-cooled superconducting magnet apparatus using, for example, liquid helium vapor as a refrigerant.

  Next, the superconducting current lead 8 according to the present embodiment will be described with reference to FIGS.

  FIG. 2 is a perspective view of a superconducting current lead 8 according to an embodiment of the present invention. FIG. 3 is a perspective view showing an enlarged main part of the superconducting current lead 8. FIG. 3 shows a load support 20 and electrodes. It is a perspective view which shows the state which removed the half body 32. FIG.

  The superconducting current lead 8 includes a load support 20, a pair of electrodes 30 (a high temperature side electrode 30A, a low temperature side electrode 30B), a superconductor 40, and external load absorbing portions 50A and 50B. The superconducting current lead 8 has a function of supplying current from the power source to the superconducting coil 3.

  The load support 20 has a function of protecting the superconductor 40 fixed inside as will be described later. The load support 20 has a cylindrical shape. A space formed inside the cylindrical load support 20 becomes a mounting space 22 in which the electrode 30 and the superconductor 40 are mounted.

  Note that the shape of the load support 20 is not necessarily limited to a cylinder, and other shapes such as a rectangular tube shape and an elliptic tube shape can be used as long as the electrode 30 and the superconductor 40 are accommodated therein. It is.

  Further, the load support 20 is made of metal. The metal here is not limited to a single metal, but also includes an alloy, and any metal can be used as long as it is a metal. Specifically, for example, stainless steel, brass, copper, aluminum and the like can be preferably used. Among them, stainless steel having a low thermal conductivity can be preferably used, and austenitic stainless steel can be particularly preferably used.

  Thus, when a metal is used as the load support 20, the difference in thermal shrinkage with the superconductor 40 is small, so that the load applied to the superconductor 40 can be reduced when the superconductor 40 is fixed inside. The occurrence of damage can be suppressed.

  Furthermore, the material of the load support 20 is not limited to metal, and other materials can be used as long as they have a strength capable of protecting the superconductor 40. Specifically, fiber reinforced plastic (FRB) or the like can be used.

  A pair of electrodes 30 is disposed in the vicinity of both ends of the load support 20. Specifically, the electrode 30 is provided inside the high temperature side end (upper side in FIGS. 1 to 3) and inside the low temperature side end (lower side in FIGS. 1 to 3) of the load support 20. ing. The electrode 30 is made of a metal such as copper, aluminum, or brass that is a good electrical conductor.

  The pair of electrodes 30 disposed at both ends of the load support 20 have the same configuration. However, for convenience of explanation, when it is necessary to distinguish between the electrodes 30 on the high temperature side and the low temperature side, The high temperature side electrode 30 is referred to as a high temperature side electrode 30A, and the low temperature side electrode 30 is referred to as a low temperature side electrode 30B.

  The high temperature side electrode 30A is an electrode terminal provided at the end of the superconducting current lead 8 on the high temperature side (in FIG. 2 to FIG. 4, the upper side is the high temperature side). The high temperature side end 40A of the superconductor 40 is fixed (connected) to the high temperature side electrode 30A. Further, the high temperature side external load absorbing portion 50A is fixed (connected) to the high temperature side of the high temperature side electrode 30A.

  The low temperature side electrode 30B is an electrode terminal provided at the end of the superconducting current lead 8 on the low temperature side (in FIG. 2 to FIG. 4, the lower side is the high temperature side). The low temperature side end portion 40B of the superconductor 40 is connected to the low temperature side electrode 30B. Further, the low temperature side external load absorbing portion 50B is connected to the low temperature side of the low temperature side electrode 30B.

  The high temperature side and low temperature side external load absorbers 50A and 50B have superconducting current leads due to the influence of displacement caused by the contraction of each member when the superconducting magnet is cooled, the influence of Lorentz force derived from the superconducting magnet, etc. during superconducting magnet operation. This is to prevent damage.

  An elastic member is preferably used for the high temperature side and low temperature side external load absorbers 50A and 50B, and in this embodiment, an example using a leaf spring is shown. In the present embodiment, a conductive metal is used as the elastic member, and the first stage current line 7 and the high temperature side electrode 30A are connected and the low temperature side electrode 30B and the second stage current line 9 are connected. It also functions as wiring. However, the high temperature side and low temperature side external load absorbers 50A and 50B may be formed of an insulating material, and wiring may be provided separately.

  For the superconductor 40, a high-temperature superconducting material is used. In this embodiment, a superconducting tape wire is used as the superconductor 40. As this superconducting tape wire, for example, a high-temperature superconducting wire in which a multi-core wire such as Bi2223 or Bi2212 is coated with a metal such as silver as a base material, or a thin film such as Y123 is deposited on a metal tape substrate such as Hastelloy. Various superconducting tape wires such as a high-temperature superconducting wire can be used.

  The superconductor 40 is disposed between the pair of electrodes 30A and 30B. That is, the superconductor 40 has the high temperature side end 40A fixed to the high temperature side electrode 30A and the low temperature side end 40B fixed to the low temperature side electrode 30B. Accordingly, the high temperature side and low temperature side end portions 40A and 40B of the superconductor 40 are mechanically held by the high temperature side and low temperature side electrodes 30A and 30B and are electrically connected.

  In this fixed state, the superconductor 40 is fixed inside the load support 20. In this fixed state, the superconductor 40 is covered with the load support 20 and there is no portion exposed from the load support 20. Since the superconductor 40 is protected by the load support 20 in this way, no force is applied from the outside, and therefore, the superconductor 40 can be reliably prevented from being damaged by an external force.

  Here, paying attention to the structure of the electrode 30, a description will be given below.

  The electrode 30 according to the present embodiment is constituted by an electrode half 31 and an electrode half 32 (corresponding to a pressing member described in claims) by being divided into two. Each of the electrode halves 31 and 32 has a semi-cylindrical shape, and when combined, becomes a cylindrical shape.

  Further, a mounting portion 33 for mounting the superconductor 40 is formed on one electrode half 31. The electrode half 31 in which the mounting portion 33 is formed is fixed to the load support 20 using a brazing material 60 (corresponding to the first bonding material described in the claims) (FIG. 5A, (See (B)). On the other hand, the other electrode half 32 is fixed to the electrode half 31 using a fixing screw 65 (see FIG. 5F).

  As will be described later, the superconductor 40 is fixed to the mounting portion 33 formed in the electrode half 31 using solder 61 (corresponding to the second bonding material described in the claims) (FIG. 5C). reference). At this time, the superconducting current lead 8 according to the present embodiment has a structure in which the electrode half 32 is fixed to the electrode half 31 using the fixing screw 65, and therefore the superconductor 40 is attached to the mounting portion 33 at the time of fixing. Can be pressed toward. Thereby, the thickness of the solder 61 interposed between the superconductor 40 and the mounting portion 33 can be reduced, and the electrical connection resistance between the superconductor 40 and the electrode half 31 can be reduced.

  Further, the solder 61 used to fix the superconductor 40 to the electrode half 31 (electrode 30) has a melting temperature lower than that of the brazing material 60 used to fix the electrode half 31 to the load support 20. Things are selected. Therefore, when the superconductor 40 and the electrode half 31 are joined, the electrode half 31 is maintained in a state of being fixed to the load support 20. This prevents the electrode half 31 from moving when the superconductor 40 is fixed to the electrode half 31, and prevents the superconductor 40 from being distorted when the superconductor 40 is attached.

  Next, a manufacturing method of the superconducting current lead 8 having the above configuration will be described with reference to FIGS.

  The method of manufacturing the superconducting current lead 8 according to the present embodiment is characterized by the method of fixing the electrode half 31 to the load support 20 and the method of fixing the superconductor 40 to the electrode 30, and other manufacturing methods. About the method, it is substantially the same as the past. Therefore, in the following description, a method for fixing the electrode half 31 that is a feature of the present embodiment to the load support 20 and a method for fixing the superconductor 40 to the electrode 30 will be described in detail. The explanation will be omitted.

  In order to manufacture the superconducting current lead 8, a load support 20 is prepared as shown in FIG. The load support 20 is provided with an insertion hole 21 in advance at a position where a fixing screw 65 described later is inserted.

  First, a process of fixing the electrode half 31 is performed on the load support 20 (corresponding to the first step recited in the claims). The electrode half 31 is fixed to both end portions of the load support 20.

  In order to fix the electrode half 31 to the load support 20, first, the brazing material 60 is disposed in the load support 20. The brazing material 60 is disposed on the inner wall of the load support 20 at a fixed position where the electrode half 31 is fixed. As the brazing material 60, for example, a hard solder having a melting temperature of 500 ° C. or higher can be used.

  When the brazing material 60 is disposed on the load support 20, the mounting portion 33 is subsequently mounted at the fixed position of the load support 20. Thereafter, the load support 20 is mounted on a heating device, and heat treatment is performed at a temperature at which the brazing material 60 can be melted (first heat treatment according to claims).

  FIG. 5B shows a state in which the electrode half 31 is fixed to the load support 20 by completing the heat treatment. The brazing material 60 made of hard brazing has a stronger bonding strength than a soft brazing (eg, 140 ° C. to 300 ° C.) having a low melting temperature such as the solder 61. Therefore, the electrode half 31 is firmly fixed to the load support 20.

  When the electrode half 31 is fixed to the load support 20, a process of fixing the superconductor 40 to the electrode half 31 is performed (corresponding to the second step described in the claims).

  In order to fix the superconductor 40 to the electrode half 31, first, solder 61 is disposed on the mounting portion 33 formed in the electrode half 31. In the present embodiment, the paste-like solder 61 is disposed on the mounting portion 33. As described above, a soft solder (for example, 140 ° C. to 300 ° C.) having a lower melting temperature than that of the brazing material 60 (hard solder) is selected as the solder 61.

  When the solder 61 is disposed in the mounting portion 33, the superconductor 40 is inserted into the mounting space 22 of the load support 20. Specifically, the superconductor 40 is gripped with tweezers or the like and then inserted into the mounting space 22 of the load support 20. FIG. 5C shows a state in which the superconductor 40 is inserted into the mounting space 22 of the load support 20.

  Then, after aligning the mounting portion 33 formed on the electrode half 31 and the superconductor 40, the superconductor 40 is mounted on the mounting portion 33. As a result, the superconductor 40 is in a state where predetermined portions at both ends thereof are held by the pair of electrode halves 31. 5D and 6 show a state in which the superconductor 40 is mounted on the mounting portion 33 of the electrode half 31 (in FIG. 6, the insertion hole 21, the screw hole 34, the solder 61, etc. are shown). Is omitted).

  When the superconductor 40 is attached to the attachment portion 33, the electrode half 32 is attached to the load support 20. As shown in FIG. 5E, the electrode half body 32 is inserted and mounted so as to slide from the side into the mounting space 22 on the electrode half body 31. In a state where the electrode half body 32 is mounted in the load support 20, the superconductor 40 is sandwiched between the electrode half body 31 and the electrode half body 32 as shown in FIG. 7.

  On the other hand, as described above, the electrode half 31 is formed with the screw holes 34 at predetermined positions (see FIG. 4). Further, an insertion hole 36 is formed through the position corresponding to the position where the screw hole 34 of the electrode half 32 is formed (see FIG. 8). Further, an insertion hole 21 is formed at a position corresponding to the position where the screw hole 34 of the load support 20 is formed.

  In order to fix the electrode half 32 to the electrode half 31, as shown in FIG. 5 (F) and FIG. 8, the fixing screw 65 is inserted into the insertion hole 21 and the insertion hole 36 and then screwed into the screw hole 34. To do. As a result, the electrode half 32 is fixed to the electrode half 31 to form the electrode 30.

  When the electrode half 32 is fixed to the electrode half 31 by the fixing screw 65, the electrode half 32 is crimped to the electrode half 31. Therefore, the superconductor 40 mounted on the mounting portion 33 of the electrode half 31 is also pressed toward the mounting portion 33 by the electrode half 32. Thereby, the surplus portion of the solder 61 disposed between the superconductor 40 and the mounting portion 33 is pushed out from the mounting portion 33. Therefore, the thickness of the solder 61 interposed between the superconductor 40 and the mounting portion 33 can be reduced (for example, about 10 μm).

  Here, since the solder 61 also becomes a resistor when the superconductor 40 is in the superconducting state, it is desirable that the amount of the solder 61 used for the joining is small because the electric resistance can be lowered. In a method in which the solder 61 is simply disposed on the mounting portion 33 and the superconductor 40 is fixed to the mounting portion 33 without being pressed by the electrode half body 32, the thickness of the solder 61 may increase and the electrical resistance may increase. There is.

  On the other hand, the electrical connection characteristic of the superconductor 40 and the electrode half 31 (electrode 30) is improved by setting it as the structure which presses the electrode half 32 to the electrode half 31 like this embodiment. Is preferable.

  By the way, when the electrode half 32 is fixed to the electrode half 31, a pressing force acts on the superconductor 40. However, this pressing force is a force that presses the superconductor 40 perpendicularly to the electrode half 31 (mounting portion 33) and does not act in the twisting direction. Therefore, no distortion occurs in the superconductor 40 when the electrode half 32 is attached to the electrode half 31.

  Further, as described above, the electrode half 31 is firmly fixed to the load support 20 by the brazing material 60 (hard brazing) having a high bonding strength. Therefore, when the electrode half 32 is fixed to the electrode half 31 using the fixing screw 65, the electrode half 31 is detached from the load support 20, or the electrode half 31 is separated from the load support 20. There is no movement. Therefore, this can also prevent the superconductor 40 from being distorted when the electrode half 32 is fixed to the electrode half 31.

  When the electrode half 32 is fixed to the electrode half 31 as described above, and the thickness of the solder 61 interposed between the superconductor 40 and the mounting portion 33 is adjusted accordingly, the superconductor 40 The soldering process of the electrode 30 is performed (corresponding to the second heating means described in the claims). The soldering process may be performed by bringing a heating jig into contact with the electrode half 31 or may be mounted in a heating furnace to perform the heating process.

  The heating temperature at the time of the heat treatment may be a temperature at which the solder 61 can be melted. Specifically, heating at about 140 ° C. to 300 ° C., which is lower than the melting temperature of the brazing material 60 (500 ° C. or higher), is performed. Therefore, when the superconductor 40 and the electrode 30 are joined by the solder 61, the electrode half 31 does not move with respect to the load support 20. Therefore, even when the superconductor 40 and the electrode 30 are joined, the superconductor 40 is not distorted.

  As described above, according to the method for manufacturing the superconducting current lead 8 according to the present embodiment, after the superconductor 40 is mounted in the load support 20, the superconductor 40 is protected by the load support 20. Is not applied. In addition, a load that generates strain on the superconductor 40 in the process of attaching the superconductor 40 to the electrode half 31, the process of fixing the electrode half 32 to the electrode half 31, and the two heating processes. Is not applied. Therefore, the manufacturing configuration of the superconducting current lead 8 can be performed easily and with a high yield.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims. Can be modified or changed.

  For example, in the embodiment, the configuration example in which only one superconductor 40 is disposed on the superconducting current lead 8 has been shown, but the number and thickness thereof can be appropriately selected depending on the amount of current required. It is.

  In the present embodiment, the configuration in which the mounting portion 33 is formed only on the electrode half 31 is shown, but the mounting portion may be formed on the electrode half 32 as well.

DESCRIPTION OF SYMBOLS 1 Superconducting magnet apparatus 2 Vacuum vessel 3 Superconducting coil 4 Heat transfer member 5 GM refrigerator 5a First stage cooling cylinder 5b Second stage cooling cylinder 5c High temperature side cooling stage 5d Low temperature side cooling stage 6 Heat shield plate 7 First stage current line 8 Superconducting current lead 9 Two-stage current line 20 Load support body 21 Insertion hole 30 Electrode 30A High temperature side electrode 30B Low temperature side electrode 31 Electrode half body 32 Electrode half body 33 Mounting portion 34 Screw hole 36 Insertion hole 40 Superconductor 40A High temperature side end 49B Low temperature side end portion 50A High temperature side external load absorption portion 50B Low temperature side external load absorption portion 60 Brazing material 61 Solder 65 Fixing screw

Claims (8)

A method of manufacturing a superconducting current lead having a load support, a pair of electrodes disposed at both ends of the load support, and a superconductor that electrically connects the pair of electrodes,
A first step of fixing the electrodes to both ends of the load support;
A second step carried out after performing the first step and fixing the superconductor between the electrodes;
And have a,
A method of manufacturing a superconducting current lead, further comprising the step of disposing a pressing member on the electrode for pressing the superconductor toward the electrode . The load support has a mounting space in which the electrode and the superconductor are mounted,
The method of manufacturing a superconducting current lead according to claim 1, wherein the superconductor is fixed in the mounting space. In the first step, a first bonding material is disposed between the load support and the electrode, and the first heat treatment is performed on the first bonding material to thereby support the load. Fixing the body and the electrode,
In the second step, a second bonding material having a melting temperature lower than that of the first bonding material is disposed between the superconductor and the electrode, and the second bonding material is disposed on the second bonding material. 3. The method of manufacturing a superconducting current lead according to claim 1, wherein the electrode and the superconductor are fixed by performing a second heat treatment at a heating temperature lower than the heat treatment of 1. The method of manufacturing a superconducting current lead according to any one of claims 1 to 3 , wherein the superconductor is made of a superconducting tape wire. A superconducting current lead having a load support, a pair of electrodes disposed at both ends of the load support, and a superconductor electrically connecting the pair of electrodes;
The load support and the electrode are fixed by a first bonding material,
The superconductor and the electrode are fixed by a second bonding material having a melting temperature lower than that of the first bonding material , and a pressing member that presses the superconductor toward the electrode is provided. Superconducting current lead characterized by. 6. The superconducting current lead according to claim 5, wherein the superconductor is disposed inside the load support. The superconducting current lead according to any one of claims 5 and 6 , wherein the superconductor is made of a superconducting tape wire. Superconducting current lead according to any one of claims 5 to 7 ,
A superconducting magnet device having a superconducting coil connected to a low temperature side of the superconducting current lead.

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