JP5939812B2 - 半導体装置の作製方法 - Google Patents
半導体装置の作製方法 Download PDFInfo
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- JP5939812B2 JP5939812B2 JP2012014566A JP2012014566A JP5939812B2 JP 5939812 B2 JP5939812 B2 JP 5939812B2 JP 2012014566 A JP2012014566 A JP 2012014566A JP 2012014566 A JP2012014566 A JP 2012014566A JP 5939812 B2 JP5939812 B2 JP 5939812B2
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- oxide semiconductor
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012014566A JP5939812B2 (ja) | 2012-01-26 | 2012-01-26 | 半導体装置の作製方法 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012014566A JP5939812B2 (ja) | 2012-01-26 | 2012-01-26 | 半導体装置の作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016098751A Division JP6283710B2 (ja) | 2016-05-17 | 2016-05-17 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013157359A JP2013157359A (ja) | 2013-08-15 |
| JP2013157359A5 JP2013157359A5 (enExample) | 2014-11-13 |
| JP5939812B2 true JP5939812B2 (ja) | 2016-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012014566A Active JP5939812B2 (ja) | 2012-01-26 | 2012-01-26 | 半導体装置の作製方法 |
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| Country | Link |
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| JP (1) | JP5939812B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642186B (zh) * | 2013-12-18 | 2018-11-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| US10096489B2 (en) * | 2014-03-06 | 2018-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US9887291B2 (en) * | 2014-03-19 | 2018-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic device including the semiconductor device, the display device, or the display module |
| CN107210230B (zh) | 2015-02-12 | 2022-02-11 | 株式会社半导体能源研究所 | 氧化物半导体膜及半导体装置 |
| JPWO2023189549A1 (enExample) * | 2022-03-30 | 2023-10-05 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102329497B1 (ko) * | 2009-11-13 | 2021-11-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 이 표시 장치를 구비한 전자 기기 |
| CN105206514B (zh) * | 2009-11-28 | 2018-04-10 | 株式会社半导体能源研究所 | 层叠的氧化物材料、半导体器件、以及用于制造该半导体器件的方法 |
| WO2011070900A1 (en) * | 2009-12-08 | 2011-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR101540039B1 (ko) * | 2010-04-23 | 2015-07-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| WO2011135987A1 (en) * | 2010-04-28 | 2011-11-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| WO2011145468A1 (en) * | 2010-05-21 | 2011-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device |
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- 2012-01-26 JP JP2012014566A patent/JP5939812B2/ja active Active
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| Publication number | Publication date |
|---|---|
| JP2013157359A (ja) | 2013-08-15 |
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