JP5936199B2 - 位置検出器 - Google Patents
位置検出器 Download PDFInfo
- Publication number
- JP5936199B2 JP5936199B2 JP2013508876A JP2013508876A JP5936199B2 JP 5936199 B2 JP5936199 B2 JP 5936199B2 JP 2013508876 A JP2013508876 A JP 2013508876A JP 2013508876 A JP2013508876 A JP 2013508876A JP 5936199 B2 JP5936199 B2 JP 5936199B2
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- JP
- Japan
- Prior art keywords
- detection needle
- position detector
- support point
- support
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001514 detection method Methods 0.000 claims description 92
- 239000010409 thin film Substances 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052744 lithium Inorganic materials 0.000 claims description 3
- 150000002641 lithium Chemical group 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 39
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 6
- 238000003754 machining Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 5
- 229910003472 fullerene Inorganic materials 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 230000003252 repetitive effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- RZBCCAZHJQZKLL-UHFFFAOYSA-N 5-methoxy-12-methyl-11h-indolo[2,3-a]carbazole-6-carbonitrile Chemical compound N1C2=C3N(C)C4=CC=C[CH]C4=C3C(OC)=C(C#N)C2=C2[C]1C=CC=C2 RZBCCAZHJQZKLL-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/004—Measuring arrangements characterised by the use of mechanical techniques for measuring coordinates of points
- G01B5/008—Measuring arrangements characterised by the use of mechanical techniques for measuring coordinates of points using coordinate measuring machines
- G01B5/012—Contact-making feeler heads therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Description
2 検出針の基端
3 円筒体
4 ハウジング
5 球体
8 ねじ孔
9 ねじ
11 凸円錐面
12 受座
15 凹部
16 ばね
Claims (7)
- 検出針の静止位置を規定するための複数の支持点と、検出針の基部を当該支持点に向けて付勢することにより検出針を前記静止位置に復帰させるばねとを備えた位置検出器において、前記支持点を形成する部材の表面にDLC薄膜を形成したことを特徴とする、位置検出器。
- 検出針の静止位置を規定するための複数の支持点と、検出針の基部を当該支持点に向けて付勢することにより検出針を前記静止位置に復帰させるばねとを備えた位置検出器において、前記支持点で互いに押圧されている両方の部材の表面にDLC薄膜を形成すると共に、前記ばねの付勢力による当該支持点の押圧力を10N以下としたことを特徴とする、位置検出器。
- 検出針の静止位置を規定するための複数の支持点と、検出針の基部を当該支持点に向けて付勢することにより検出針を前記静止位置に復帰させるばねとを備えた位置検出器において、前記支持点で互いに押圧されている両方の部材の表面にDLC薄膜を形成すると共に、前記ばねの付勢力による当該支持点の押圧力を3N以下としたことを特徴とする、位置検出器。
- 検出端となっている検出針の先端と、当該先端に最も近い支持点との距離が80mmないし250mmである、請求項1、2又は3記載の位置検出器。
- 支持点を形成している部材相互の動摩擦係数が0.1以下であることを特徴とする、請求項1、2又は3記載の位置検出器。
- DLC薄膜が、導電性金属原子を分散したDLC薄膜であることを特徴とする、請求項1、2又は3記載の位置検出器。
- 導電性金属原子が、リチウム原子であることを特徴とする、請求項6記載の位置検出器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011083885 | 2011-04-05 | ||
JP2011083885 | 2011-04-05 | ||
PCT/JP2012/059056 WO2012137768A1 (ja) | 2011-04-05 | 2012-04-03 | 位置検出器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012137768A1 JPWO2012137768A1 (ja) | 2014-07-28 |
JP5936199B2 true JP5936199B2 (ja) | 2016-06-22 |
Family
ID=46969165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013508876A Active JP5936199B2 (ja) | 2011-04-05 | 2012-04-03 | 位置検出器 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5936199B2 (ja) |
WO (1) | WO2012137768A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001004312A (ja) * | 1999-06-18 | 2001-01-12 | Mitsutoyo Corp | 着座機構 |
JP2001099637A (ja) * | 1999-08-25 | 2001-04-13 | Renishaw Plc | 接触プローブのスタイラス |
JP2004506161A (ja) * | 2000-08-05 | 2004-02-26 | レニショウ パブリック リミテッド カンパニー | ベアリング装置 |
WO2008010492A1 (fr) * | 2006-07-18 | 2008-01-24 | Nisshin Sangyo Co., Ltd. | Détecteur de contact |
-
2012
- 2012-04-03 WO PCT/JP2012/059056 patent/WO2012137768A1/ja active Application Filing
- 2012-04-03 JP JP2013508876A patent/JP5936199B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001004312A (ja) * | 1999-06-18 | 2001-01-12 | Mitsutoyo Corp | 着座機構 |
JP2001099637A (ja) * | 1999-08-25 | 2001-04-13 | Renishaw Plc | 接触プローブのスタイラス |
JP2004506161A (ja) * | 2000-08-05 | 2004-02-26 | レニショウ パブリック リミテッド カンパニー | ベアリング装置 |
WO2008010492A1 (fr) * | 2006-07-18 | 2008-01-24 | Nisshin Sangyo Co., Ltd. | Détecteur de contact |
Also Published As
Publication number | Publication date |
---|---|
CN103459972A (zh) | 2013-12-18 |
JPWO2012137768A1 (ja) | 2014-07-28 |
WO2012137768A1 (ja) | 2012-10-11 |
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