JP5930986B2 - Cooling device and electronic equipment - Google Patents

Description

  The present invention relates to a cooling device that cools a heat-generating component via a heat sink, and an electronic device including the cooling device.

  For example, as a conventional air-cooling device for electronic equipment, heat generating parts are attached to the back side of the base plate, and a plurality of flat fins are erected in parallel on the front side of the base plate, and a plurality of rod-like pin fins are also erected. There is a heat sink. In such a heat sink, in order to efficiently guide the cooling air between the fins, a cooling fan is disposed in front of the pin fins, and the cooling air flows in the order of the pin fins and the flat plate fins (for example, Patent Document 1). In this way, by flowing the cooling air from the pin fins toward the flat plate fins, the ventilation resistance is reduced and the cooling performance is improved.

JP 2005-166923 A

However, the air cooling device having the above-described configuration has a problem that the manufacturing cost of the heat sink increases because it is necessary to provide pin fins on the heat sink.
The present invention has been made to solve such problems. A cooling device that has efficient cooling performance and is lower in cost than conventional ones, and an electronic apparatus including the cooling device are provided. The purpose is to provide.

In order to achieve the above object, the present invention is configured as follows.
That is, the cooling device according to one aspect of the present invention is a metal device that cools the heat generating component by installing a plurality of flat fins on one surface of the base plate and attaching a heat generating component to the other surface facing the one surface. In the cooling device provided with a heat sink, the refrigerant transfer device is arranged on the heat sink outlet side in the extending direction of the flat plate fins and transfers the refrigerant along the extending direction, and is arranged on the heat sink inlet side in the extending direction. And a heat transfer promoting member for generating turbulent flow in the refrigerant flowing into the heat sink.

  According to the cooling device in one aspect of the present invention, by providing the heat transfer promotion member on the inlet side of the heat sink, a Karman vortex is generated in the wake of the heat transfer promotion member, and the generated vortex becomes a heat transfer surface. Adhere to flat fins. Therefore, heat transfer in the flat fins is promoted, and the cooling performance can be improved. Further, since it is not necessary to specially process the heat sink, it is possible to reduce the manufacturing cost.

It is a perspective view which shows the cooling device by Embodiment 1 of this invention. It is sectional drawing in the surface along the extension direction of a flat plate fin in the cooling device shown in FIG. It is sectional drawing which shows the heat-transfer promotion member with which the cooling device by Embodiment 2 of this invention is equipped. It is a perspective view which shows the cooling device by Embodiment 3 of this invention. It is a perspective view which shows the cooling device by Embodiment 4 of this invention. It is sectional drawing in a surface parallel to a base plate in the cooling device shown in FIG. It is a perspective view which shows the cooling device by Embodiment 5 of this invention. It is a perspective view which shows the modification of the cooling device shown in FIG. It is a perspective view which shows the electronic device by Embodiment 6 of this invention. It is a perspective view which shows the electronic device by Embodiment 7 of this invention.

A cooling device according to an embodiment of the present invention and an electronic apparatus including the cooling device will be described below with reference to the drawings. In each figure, the same or similar components are denoted by the same reference numerals. In addition, in order to avoid the following description from becoming unnecessarily redundant and to facilitate understanding by those skilled in the art, a detailed description of already well-known matters and a duplicate description of substantially the same configuration may be omitted. . Further, the contents of the following description and the accompanying drawings are not intended to limit the subject matter described in the claims.
In each embodiment described below, the cooling device has a configuration of an air cooling type using air as a refrigerant, but is not limited to this, and a mode of using a liquid as a refrigerant such as a water cooling type can also be adopted.

Embodiment 1 FIG.
FIG. 1 is a perspective view of a cooling device 101 according to Embodiment 1 of the present invention. FIG. 2 is a sectional view of the cooling device 101 shown in FIG.
The cooling device 101 includes a heat sink 10, a refrigerant transfer device 20, and a heat transfer promotion member 30 as basic components, and heat dissipation of a component 40 to which the heat sink 10 is attached by a component that generates heat such as an electronic component. And cool. Here, the heat sink 10 is made of, for example, a metal made of aluminum, and includes a flat base plate 11 and flat plate fins 12. The plurality of flat plate fins 12 are arranged in parallel to each other along the extending direction 51. A heat generating component 40 is attached to one surface of the base plate 11 and the other surface facing the one surface of the base plate 11. In the present embodiment, the refrigerant transfer device 20 is configured by a cooling fan that transfers air as a refrigerant, and is disposed on the heat sink outlet side 14 in the extending direction 51. The refrigerant transfer device 20 transfers air from the heat sink inlet side 13 to the heat sink outlet side 14 through the gaps 15 between the respective plate fins 12 by rotation of the fan.

  The heat transfer promoting member 30 is a member that is disposed on the heat sink inlet side 13 and causes turbulence in the air flowing into the heat sink 10. In the present embodiment, a plurality of prismatic rods 31 are provided, and the prismatic rods 31 are arranged along an orthogonal direction 53 orthogonal to the standing direction 52 and the extending direction 51 of the flat plate fin 12. Yes. Each bar 31 is supported by a frame member 30 a constituting the heat transfer promoting member 30.

  Here, in order to obtain the effect of improving the cooling performance as described below, the gap size on the heat sink inlet side 13 constituted by the front end of the flat fin 12 and the heat transfer promoting member 30 is a flat plate in the standing direction 52. The height of the fin 12 is 0 to 20%, preferably 5 to 15%, and most preferably 10%. Moreover, about the clearance dimension between the bar materials 31, it is 40 to 80% of the standing space | interval of the flat plate fin 12, Preferably it is 55 to 65%, The best is 60%.

The cooling device 101 according to the first embodiment configured as described above operates as follows.
That is, by driving a cooling fan as the refrigerant transfer device 20, the cooling air 21 flows into the heat sink 10 from the heat sink inlet side 13 to which the heat transfer promotion member 30 is attached, passes through the gap 15 of the flat plate fin 12, and is cooled. Cooling air 22 is discharged from the heat sink outlet side 14 to which the fan is attached. At this time, since the heat transfer promotion member 30 is provided on the heat sink inlet side 13, Karman vortex is generated in the wake of the prismatic bar 31. The generated vortex adheres to the flat fins 12 serving as the heat transfer surface, whereby heat transfer is promoted and the cooling performance of the heat generating component 40 can be improved. Further, by providing the heat transfer promoting member 30, the Reynolds number can be improved on the heat sink inlet side 13, and the cooling performance can be improved by improving the heat transfer. Therefore, the temperature of the heat generating component 40 can be further reduced as compared with the case where the heat generating component 40 is cooled only by the heat sink 10.

  Conventionally, in order to improve the cooling performance, a method of improving the heat sink such as increasing the number of fins of the heat sink, arranging the fins in an offset manner, or using pin fins has been adopted. However, with this method, it is necessary to perform special processing on the heat sink, resulting in an increase in manufacturing cost, and there is a problem that there is a limit to the change of fins due to restrictions on manufacturing technology.

  On the other hand, in the cooling device 101 according to the first embodiment, the heat sink 10 is a low-cost heat sink manufactured by normal extrusion or die casting, and the heat transfer promoting member 30 is provided on the inlet side 13 thereof. Therefore, it is not necessary to perform special processing on the heat sink 10, and the cooling performance can be improved at low cost.

As an example, the effect when a 3 mm square prismatic rod 31 made of resin is arranged on the inlet side 13 of the heat sink 10 will be confirmed.
As the heat sink 10, an extruded aluminum comb heat sink having a length of 120 mm, a width of 62 mm, a fin height of 44 mm, a fin thickness of 2 mm, and a number of fins of 9 is used. . As shown in FIG. 1, a cooling fan as a refrigerant transfer device 20 is arranged on the outlet side 14 of the heat sink 10, and a 3 mm square prismatic rod 31 made of resin as the heat transfer promoting member 30 on the inlet side 13. Are arranged in a direction 53 perpendicular to the flat fins 12 with an interval between the rods 31 of 7.5 mm, and a gap between the front end of the flat plate fins 12 and the rods 31 is set to 5 mm, and temperature measurement is performed. did.
As a result, when the heat transfer promoting member 30 was attached, the temperature of the heater was reduced by 6.4% compared to when it was not attached.

Embodiment 2. FIG.
FIG. 3 is a cross-sectional view of a modified example of the heat transfer promoting member 30 described above.
3A shows a heat transfer promoting member 32A having a member 321 having a cylindrical cross section, and FIG. 3B shows a heat transfer promoting member 32B having a member 322 having a triangular prism shaped cross section. Has been.
In the cooling device 102 provided with such heat transfer promotion members 32A and 32B, the heat transfer promotion members 32A and 32B are provided in the same manner as the cooling device 101 provided with the heat transfer promotion member 30 having a prismatic cross section. Karman vortices are generated in the wake, and the generated vortices adhere to the plate fins 12 serving as heat transfer surfaces. Therefore, heat transfer is promoted and the cooling performance of the heat generating component 40 can be improved. In addition, the cooling performance can be improved by improving the heat transfer by improving the Reynolds number at the heat sink inlet side 13. Further, in the heat transfer promotion members 32A and 32B, since the members 321 and 322 have a cylindrical shape and a triangular prism shape, the pressure loss is lower than that of the prismatic heat transfer promotion member 30, and the amount of air flowing into the heat sink 10 is reduced. It can be increased. As a result, it is possible to improve the cooling performance as compared with the configuration of the first embodiment.

As an example, the effect when the resin-made φ3 mm cylindrical member 321 is arranged on the heat sink inlet side 13 in the heat transfer promotion member 32A will be confirmed.
As the heat sink 10 and the cooling fan as the refrigerant transfer device 20, the same ones as in the first embodiment are used. Temperature measurement was performed by arranging four members 321 along the orthogonal direction 53 with the gap between the front ends of the plate fins 12 and the bar 321 being 5 mm, with the interval between the bars 321 being 9 mm.
As a result, when the heat transfer promoting member 32A was attached, the temperature of the heater was reduced by 6.3% compared to the case where it was not attached.

Embodiment 3 FIG.
FIG. 4 is a perspective view of the cooling device 103 according to the third embodiment of the present invention.
In FIG. 4A, the heat transfer promoting member 33A is disposed on the heat sink inlet side 13, in FIG. 4B, the heat transfer promoting member 33B is disposed, and in FIG. 4C, the heat transfer promoting member 33C is disposed. The cooling device 103 is shown. In these cooling devices 103, only the heat transfer promotion members 33 </ b> A to 33 </ b> C are different from the cooling device 101 in the first embodiment described above, and there is no difference in the other components. Therefore, the heat transfer promoting members 33A to 33C will be mainly described below.

As shown in FIG. 4A, the heat transfer promotion member 33 </ b> A is a single flat plate member in the vicinity of the center in the standing direction 52 of the flat plate fin 12 along the direction 53 orthogonal to the flat plate fin 12. 331 is arranged.
As shown in FIG. 4B, the heat transfer promoting member 33 </ b> B is a single flat plate member 331 on the upper side in the standing direction 52 of the flat fin 12 along the direction 53 orthogonal to the flat fin 12. As shown in FIG. 4C, the heat transfer promoting member 33C has a configuration in which one flat plate member 331 is arranged in the lower part in the standing direction 52 of the flat plate fin 12. .

  Here, in order to obtain the effect of improving the cooling performance as described below, the gap size on the heat sink inlet side 13 constituted by the front end of the flat fin 12 and the heat transfer promoting members 33A to 33C is set in the standing direction 52. Is 0 to 20%, preferably 5 to 15%, and most preferably 10%. The width dimension of the flat member 331 in the standing direction 52 is 25 to 50%, preferably 30 to 40%, and most preferably 35% of the height of the flat fin 12 in the standing direction 52.

In the cooling device 103 provided with the heat transfer promotion members 33A, 33B, and 33C as described above, as in the case of the cooling device 101 provided with the heat transfer promotion member 30 having the prismatic member 31 of the first embodiment, a flat plate shape is used. The Karman vortex is generated in the wake of the member 331, and the generated vortex adheres to the flat fin 12 to enhance the heat transfer, thereby improving the cooling performance. In addition, the cooling performance can be improved by improving the heat transfer by improving the Reynolds number at the heat sink inlet side 13.
Furthermore, in this Embodiment 3, compared with the structure of Embodiment 1, 2, since heat transfer promotion member 33A-33C has a simple shape, there exists an advantage that manufacture at a lower cost is attained. .

As a heat transfer promoting member, a plate-shaped member 331 having a width of 15 mm in the standing direction 52 made of resin is used as the heat transfer promoting member 33A shown in FIG. At the center of the vertical direction, the effect when the gap formed by the front end of the flat fin 12 and the heat transfer promotion member 33A is 5 mm is confirmed. In addition, the same thing as Embodiment 1 is used for the cooling fan of the heat sink 10 and the refrigerant | coolant transfer apparatus 20. FIG.
As a result of the temperature measurement, when the heat transfer promoting member 33A was attached, the temperature of the heater was reduced by 7.2% compared to the case where it was not attached. Even when the heat transfer promoting members 33B and 33C as shown in FIGS. 4B and 4C are provided, an improvement effect of 6.0 to 7.5% is obtained as compared with the case where the heat transfer promoting members 33B and 33C are not provided.

Embodiment 4 FIG.
FIG. 5 is a perspective view of cooling device 104 according to Embodiment 4 of the present invention. FIG. 6 is a cross-sectional view of the cooling device 104 in a plane parallel to the base plate 11. The cooling device 104 is different only in the configuration of the heat transfer promotion member as compared with the cooling device 101 in the first embodiment described above, and there is no difference in other components. Therefore, the heat transfer promoting member will be mainly described below.
As shown in FIG. 5, the heat transfer promoting member 34 of the cooling device 104 according to the fourth embodiment includes a plurality of prismatic bar members 341, and the prismatic bar members 341 are provided upright on the flat plate fins 12. Along the direction 52, the flat plate fins 12 are arranged in parallel to the inlet side end face. As shown in FIG. 6, the bar 341 arranged in this way is arranged corresponding to the gap 15 between the flat plate fins 12 adjacent in the orthogonal direction 53.

  Here, in order to obtain the effect of improving the cooling performance as described below, the gap size on the heat sink inlet side 13 constituted by the front end of the flat fin 12 and the heat transfer promoting member 34 is a flat plate in the standing direction 52. The height of the fin 12 is 0 to 20%, preferably 5 to 15%, and most preferably 10%. The width of the bar 341 is 30 to 70%, preferably 40 to 60%, and most preferably 50% of the gap between the flat plate fins 12.

  Also in the cooling device 104 having such a heat transfer promoting member 34, Karman vortices are generated in the wake of the prismatic bar 341 as in the case of the first to third embodiments. The generated vortex adheres to the flat fins 12 serving as the heat transfer surface, whereby heat transfer is promoted and cooling performance can be improved. In addition, the cooling performance can be improved by improving the heat transfer by improving the Reynolds number at the heat sink inlet side 13. Further, as shown in FIG. 6, the prismatic bar 341 is arranged in parallel along the standing direction 52 with respect to the inlet side end face 16 of the flat fin 12, that is, the standing direction of the flat fin 12. The cooling air 21 is placed on the inlet-side end face 16 of the flat fin 12 by arranging the bar 341 along the line 52 and by arranging the bar 341 corresponding to the gap 15 between the flat fins 12. Direct hit. As a result, the boundary layer developed from the inlet side end face 16 of the flat fin 12 can be thinned, thereby improving heat transfer and further improving the cooling performance.

  5 and 6, a prismatic bar 341 is shown as the heat transfer promoting member 34, but a cylindrical or triangular prism as shown in FIG. 3 may be used.

As an example, a heat transfer promotion member 34 having a 3 mm square prismatic bar 341 made of resin is provided on the heat sink inlet side 13, and the gap formed by the front end of the flat fin 12 and the heat transfer promotion member 34 is 5 mm. Confirm the effect of the arrangement. In addition, the same thing as Embodiment 1 is used for the cooling fan of the heat sink 10 and the refrigerant | coolant transfer apparatus 20. FIG. Further, a 3 mm square prismatic bar 341 made of resin is arranged in parallel with the flat plate fins 12 along the standing direction 52 as described above, and is arranged corresponding to the gap 15 between the flat plate fins 12. Thus, eight were provided and temperature measurement was carried out.
As a result, when the heat transfer promoting member 34 was attached, the temperature of the heater was reduced by 6.6% compared to when it was not attached.

Embodiment 5 FIG.
FIG. 7 shows a cooling device 105 according to Embodiment 5 of the present invention. FIG. 7A shows a cooling device 105A, and FIG. 7B shows a cooling device 105B. These cooling devices 105 are the same as the cooling devices 101 to 104 described in the first to fourth embodiments, but the heat sink 10 and a cooling fan as the refrigerant transfer device 20 are made of, for example, a metal frame made of aluminum. It has the structure fixed to the chassis 60 which is an example as a body. Therefore, in the cooling device 105, only the chassis 60 is a new component.
Such a chassis 60 has at least a pair of side walls 61 that are disposed along the extending direction 51 with the heat sink 10 sandwiched from the left and right in the orthogonal direction 53, and further includes a heat transfer promoting member provided in the cooling devices 101 to 104. 30, 32 </ b> A, 32 </ b> B, 33 </ b> A to 33 </ b> C, or 34 is formed integrally with the chassis 60 corresponding to the heat sink inlet side 13. Further, the chassis 60 has a connecting member 62 on the heat sink outlet side 14 in the cooling device 105. The connecting member 62 is a member that is installed along the orthogonal direction 53 and connects the pair of left and right side walls 61 to fix the refrigerant transfer device 20. The chassis 60 forms a frame body by the side wall 61, the heat transfer promotion members 30, 32 </ b> A, 32 </ b> B, 33 </ b> A to 33 </ b> C or 34, and the connecting member 62.

In the cooling device 105A configured as described above, for example, the heat transfer promoting member 30 is provided on the heat sink inlet side 13 as in the above-described cooling device 101. Occurs. The generated vortex adheres to the flat plate fins 12 serving as the heat transfer surface, whereby heat transfer is promoted and cooling performance can be improved. In addition, the cooling performance can be improved by improving the heat transfer by improving the Reynolds number at the heat sink inlet side 13.
Furthermore, since the chassis 60 is made of metal, the heat of the heat generating component 40 is also transmitted to the chassis 60 including the prismatic bar 31. Therefore, the cooling device 105 of the fifth embodiment has a further increased heat radiation area compared to the cooling devices 101 to 104 described in the first to fourth embodiments, and can further improve the cooling performance.

  Further, by manufacturing the chassis 60 by, for example, an aluminum die casting method, the chassis 60 and the bar 31 can be integrally and simultaneously molded. Therefore, when fixing the heat sink 10 and the cooling fan using the chassis 60, compared to the configuration in which the heat transfer promotion member 30 and the like are separately provided as in the cooling devices 101 to 104 of the first to fourth embodiments. The effect of promoting heat transfer can be obtained at low cost.

  In FIG. 7A, the structure using the prismatic rod 31 of the heat transfer promoting member 30 is used, and in FIG. 7B, the structure using the flat plate member 331 of the heat transfer promoting member 33C is used. Although each is illustrated as an example, as described above, the cooling device 105 includes the cylindrical member 321 shown in FIG. 3, the triangular prism shaped member 322, the heat transfer promotion members 33 </ b> A and 33 </ b> B shown in FIG. 4, In addition, the configuration of the heat transfer promoting member 34 shown in FIG. 5 can be used.

Further, the chassis 60 is not limited to the shape shown in FIG. 7, but may be any shape as long as the heat sink 10 and the refrigerant transfer device 20 can be fixed and the heat transfer promoting member is integrally formed on the inlet side of the cooling air 21 of the heat sink 10. Any form is acceptable.
Furthermore, in FIG. 7, the heat sink 10 and the chassis 60 are configured as separate members, but the heat sink 10, the chassis 60, and the heat transfer promoting member may be integrally formed by an aluminum die casting method or the like.

Furthermore, the structure which combined each heat-transfer promotion member shown in each above-mentioned embodiment can also be taken.
Furthermore, as in the cooling device 105C shown in FIG. 8, the chassis 60 is not limited to the pair of side walls 61, but two or more pillars 64 are connected by the connecting member 62, and the heat transfer promoting members 30, 32 </ b> A, 32 </ b> B, A frame body may be formed by 33A to 33C or 34.

Embodiment 6 FIG.
In the sixth embodiment, an electronic apparatus provided with the cooling device 105A in the above-described fifth embodiment will be described as an example. FIG. 9 is a perspective view of the electronic apparatus 201 according to the sixth embodiment.
As described above, the electronic device 201 includes the cooling device 105A according to the fifth embodiment, a power module corresponding to the heat generating component 40 attached to the base plate 11 of the cooling device 105A, and a circuit configuration such as drive control of the electronic device 201. Part 70 and resin casing 71 arranged to cover chassis 60 and circuit configuration part 70 of cooling device 105A. Here, the electronic device 201 is a servo amplifier that controls the rotation of a servo motor as an example.

Also in the electronic device 201 configured in this way, as described above, the cooling device 105A has a further improved cooling performance, so that the cooling performance of the electronic device 201 can be improved.
Further, as described in the fifth embodiment, the heat transfer promoting member 30 is integrally formed with the chassis 60 in the cooling device 105A. Instead, in the sixth embodiment, a resin is formed on the heat sink inlet side 13. You may integrally mold with the housing | casing 71 made from. In this way, by integrally molding the heat transfer promotion member 30 with the resin casing 71, it is possible to obtain the effect of promoting heat transfer at a lower cost than when the heat transfer promotion member 30 is configured separately. It becomes possible.

Of course, the heat transfer promotion member is not limited to the heat transfer promotion member 30 shown in the first embodiment, and the heat transfer promotion members 32A, 32B, 33A to 33C, or 34 provided in the cooling devices 102 to 104 may be used. Good.
Further, the resin casing 71 is not limited to the shape shown in FIG. 9, and may be disposed so as to cover the chassis 60, and the heat transfer promoting member is integrally formed on the heat sink inlet side 13. Also good.
In addition, the heat sink 10 and the chassis 60 may be configured as separate members, or may be integrally formed by an aluminum die casting method or the like.

Embodiment 7 FIG.
In the seventh embodiment, an electronic device 202 configured by arranging one or more electronic devices 201 described in the sixth embodiment will be described.
FIG. 10 is a perspective view of the electronic device 202 according to the seventh embodiment. The electronic device 202 includes, for example, three electronic devices 201. In the electronic device 201 according to the seventh embodiment, the chassis 60 is not entirely covered by the resin casing 71 but has an exposed surface 63 that is one side surface exposed from the casing 71. Other configurations of the electronic apparatus 201 in the seventh embodiment are the same as those of the electronic apparatus 201 described in the sixth embodiment.

  The plurality of electronic devices 201 can be arranged on the mounting plate 250 by fixing the exposed surface 63 to the mounting plate 250 by, for example, screwing or the like. The mounting plate 250 corresponds to, for example, the inner wall of the control panel. At this time, by configuring the chassis 60 with a metal such as aluminum die cast, high rigidity can be obtained, and the electronic device 201 can be securely fixed to the mounting plate 17. Further, according to such fixing, the heat sink 10 and the chassis 60 are thermally connected to the mounting plate 250. Therefore, the heat generated in the heat generating component 40 also moves to the mounting plate 250 via the exposed surface 63 of the chassis 60 and is radiated from the mounting plate 250 into the air, so that the heat dissipation characteristics are further improved.

10 heat sink, 11 base plate, 12 flat fin,
13 heat sink inlet side, 14 heat sink outlet side, 20 refrigerant transfer device,
30, 32A, 32B, 33A to 33C, 34 Heat transfer promoting member, 40 Heat generating component,
51 extending direction, 52 standing direction, 53 orthogonal direction, 60 chassis,
61 side walls, 70 circuit components, 71 housings,
101-104, 105A, 105B Cooling device, 201, 202 Electronic equipment.

Claims (5)

In a cooling device provided with a metal heat sink that cools the heat generating component by installing a plurality of flat fins on one surface of the base plate and attaching a heat generating component on the other surface facing the one surface,
A refrigerant transfer device that is disposed on the heat sink outlet side in the extending direction of the flat plate fin and transfers the refrigerant along the extending direction;
A heat transfer facilitating member that is disposed on the heat sink inlet side in the extending direction and causes turbulent flow in the refrigerant flowing into the heat sink;
Equipped with a,
The heat transfer facilitating member further includes a metal frame having at least a pair of side walls or a plurality of pillars arranged along the extending direction and sandwiching the heat sink to which the refrigerant transfer device is attached. Correspondingly formed integrally with the frame,
A cooling device characterized by that.   The cooling device according to claim 1, wherein the heat transfer promoting member extends in a direction orthogonal to the flat fins or in a direction parallel to a standing direction of the flat fins.   The cooling device according to claim 1 or 2, wherein the heat transfer promoting member has a prismatic shape, a cylindrical shape, a triangular prism shape, or a flat plate shape. The cooling device according to any one of claims 1 to 3,
A resin casing that surrounds and attaches the frame,
A circuit component housed in the housing,
The heat transfer facilitating member provided in the cooling device is formed integrally with the housing corresponding to the heat sink inlet side. The electronic device according to claim 4 , wherein the frame has an exposed surface exposed from the housing.

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