JP5252640B2 - Peltier cooling device - Google Patents

Peltier cooling device Download PDF

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Publication number
JP5252640B2
JP5252640B2 JP2009073724A JP2009073724A JP5252640B2 JP 5252640 B2 JP5252640 B2 JP 5252640B2 JP 2009073724 A JP2009073724 A JP 2009073724A JP 2009073724 A JP2009073724 A JP 2009073724A JP 5252640 B2 JP5252640 B2 JP 5252640B2
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fan
cooling
peltier
heat sink
heat
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JP2010226000A (en
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佳信 伊東
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日東工業株式会社
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Description

  The present invention relates to an improvement in a Peltier cooling device that is attached to an electronic equipment storage cabinet or the like to suppress a temperature rise inside the cabinet.
  Conventionally, a Peltier type cooling device using a Peltier element has been used as a cooling means for an electronic equipment storage cabinet or the like. In this Peltier cooling device, as shown in Patent Document 1 of the present applicant, a heat sink and a fan provided with fins are respectively arranged on both sides (a heat radiating side and a heat absorbing side) of the Peltier element. In a Peltier-type cooling device using a Peltier element, a larger heat exchange capacity is required on the heat dissipation side than on the heat absorption side. For this reason, it is normal for the heat-dissipation side fan to have an air blowing capacity about twice that of the heat-absorption side fan.
  Conventionally, the fan is disposed at the approximate center of the heat sink and sucks or discharges air along the heat sink. However, such a fan has a motor at the center of the rotating shaft and no blades, so the wind speed is low, and it is inevitable that the heat exchanging capacity at that portion is lower than the outer peripheral portion of the fan.
  In particular, as shown in FIG. 1, when a plurality of Peltier elements 2 are evenly joined to the heat sink 1 and the fan 3 is arranged at the center of the heat sink 1, heat is applied to the center of the heat sink 1 where the wind speed of the fan 3 is low. There is a problem that it is easy to concentrate. As one means for solving this problem, it can be considered that increasing the air volume by increasing the size of the fan 3 has a certain effect. However, since there is no blade of the fan 3 at the center of the heat sink 1, the air speed is low. In addition, the increase in the size of the fan leads to an increase in the size of the Peltier cooling device, which causes another problem that the power consumption increases. This problem is particularly noticeable on the heat dissipation side of the Peltier cooling device.
JP 2008-141089 A
  An object of the present invention is to provide a Peltier-type cooling device that solves the above-described conventional problems and that can effectively improve the cooling performance of the Peltier element by arranging a fan effectively on a heat sink. is there.
The present invention has been made to solve the above-mentioned problems. In a Peltier cooling device in which a heat sink and a fan are arranged on both sides of a Peltier element , an air flow direction regulating member is provided on both sides of the heat sink, and at least one of them is provided. The center of the fan is deviated from the center of the heat sink in the air suction direction .
  As described in claim 2, it is preferable to deviate the center of the fan in a direction parallel to the air inflow direction to the heat sink. Further, as described in claim 3, it is preferable that the center of the fan is displaced in the direction of the vent of the cooling device housing in which the Peltier cooling device is incorporated. Furthermore, as described in claim 4, the front surface of the heat sink on the side where the fan is displaced is covered with a plate, and the flange extending from the plate is directed in the direction of the vent of the cooling device housing in which the Peltier cooling device is incorporated. It is preferable to make it protrude.
According to the present invention, by deviating the center of the fan from the center of the heat sink in the air suction direction, the portion of the outer peripheral portion of the fan where the wind speed is high can be positioned at the center of the heat sink. As a result, even a fan having the same capacity can have a higher cooling capacity than the conventional one.
  Further, as described in claim 2, the range of improvement in the cooling capacity can be further increased by shifting the center of the fan in a direction parallel to the air inflow direction to the heat sink.
  Further, as in claim 3, if the center of the fan is displaced in the direction of the vent of the cooling device housing in which the Peltier cooling device is incorporated, the air sucked from the vent can be efficiently flowed to the surface of the heat sink. Can do. Furthermore, as described in claim 4, if the front surface of the heat sink on the side where the fan is displaced is covered with a plate and the flange extending from the plate protrudes in the direction of the vent, the air from the vent Flow disturbance can be prevented.
It is explanatory drawing of a prior art. It is explanatory drawing of the basic principle of this invention. It is explanatory drawing which shows the inflow direction of air. It is explanatory drawing when the direction of an air flow is controlled. It is explanatory drawing when the direction of an air flow is controlled. It is an external appearance perspective view which shows more concrete embodiment of this invention. It is explanatory drawing which shows embodiment of this invention. It is an external appearance perspective view of the state which removed the cover of FIG. It is a perspective view of the principal part. It is a side view of the principal part. It is a top view of the principal part.
Reference embodiments and embodiments of the present invention will be described below.
First, the basic principle of the present invention will be described with reference to FIG. FIG. 2 is a diagram showing a reference embodiment of the present invention. FIG. 2 is an explanatory view showing a state in which four Peltier elements 2 are evenly joined to the heat sink 1 and the fan 3 is disposed so as to face the heat sink 1 in the same manner as FIG. Unlike 1, the center of the fan 3 is deviated from the center of the heat sink 1. In this figure, the amount of deviation is about half of the blade length of the fan 3, the center of the fan 3 is near the end of the right Peltier element 2, and the outer periphery of the fan 3 is the end of the left Peltier element 2. Near the club. In the embodiment of the present invention, the fan 3 is attached so as to suck air from the heat sink 1 side and exhaust air from the front side of the fan 1 as shown in FIG.
  When the fan 3 is rotated, an air flow as indicated by an arrow in FIG. 2 is generated. When attention is paid to the air flow in the left-right direction, the air flow sucked toward the fan 3 contacts the right Peltier element 2. The cooling effect is almost the same as that for the right Peltier element 2 in FIG. On the other hand, the air flow sucked toward the fan 3 contacts the left Peltier element 2 over the entire width, and a larger cooling effect than that for the left Peltier element 2 in FIG. 1 occurs. In addition, the blades of the fan 3 are also opposed to the central portion of the heat sink 1 where heat has conventionally been easily concentrated, and a large amount of air can be supplied. Note that there is no significant difference between FIG. 1 and FIG.
  For this reason, when the fan 3 having the same size and the same capacity is used, the amount of heat transfer between the fan 3 and the heat sink 1 is increased in FIG. 2 than in FIG. 1 without increasing the size of the fan. The cooling capacity can be increased by about 5% compared to the conventional case.
In the case where air flow direction regulating members such as barriers 4 (drain pans, circuit boards, etc.) exist on both the left and right sides of the heat sink 1 as in the embodiment of FIG. 3 is preferably displaced in a direction parallel to the air inflow direction to the heat sink 1. Here, the air inflow direction means a direction in which the amount of air flowing into the heat sink 1 is large, and even if air may flow in through the gap of the barrier 4, it mainly refers to the direction in which air flows in. Is. As shown in FIG. 5, the effect of shifting in a direction perpendicular to the airflow is less than that of FIG. However, even in the case of FIG. 5, the fan 3 also faces the central portion of the heat sink 1 and can supply a large amount of air, so that a cooling effect superior to that of FIG. 1 can be obtained.
More specific embodiments of the present invention will be described below.
As shown in the drawings in FIG. 6 and subsequent figures, this cooling device is obtained by attaching a body 11 and a cover 12 with a cooling unit 10 in which a Peltier element is incorporated, and the body 11 is a cabinet inner side (heat absorption side), a cover. 12 is installed on the outside of the panel (heat radiation side). Slit-like air vents 13 are formed on both side surfaces of the body 11 and the cover 12 to suck inboard air and outside air.
  The cooling unit 10 incorporated in the cooling device of the present invention has a heat sink 1a for heat dissipation, a fan 14 for heat dissipation, a heat sink 1b for heat absorption, and a fan 15 for heat absorption on both sides of the Peltier element. That is, the heat sink 1 includes a heat sink 1a and a heat sink 1b, and a plurality of (four) Peltier elements as shown in FIG. The cooling unit 10 shown below includes two substantially rectangular heat sinks 1 provided with two substantially rectangular heat sinks 1.
  FIG. 7 schematically shows an embodiment of the present invention, which is provided with a circuit board 4a and a drain pan 4b as the barrier 4, and a vent hole 13 is located in the air inflow direction so that heat is dissipated. The side fan 14 is attached so as to be shifted in a direction parallel to the air inflow direction. That is, the center of the fan 14 is displaced in the direction of the vent 13 of the cooling device housing in which the Peltier cooling device is incorporated. The fan 14 is attached so as to suck outside air from the vent hole 13 and discharge it in the direction of the central axis.
  The side where the fan 14 is displaced, that is, the front side of the heat sink on the heat dissipation side is covered with a plate 16. In this embodiment, a hole corresponding to the heat-radiating fan 14 is formed, and two fans 14 are attached to the plate 16.
  On the upper surface of the plate 16, a flange portion 17 extending from the plate is provided. The flange 17 is projected in the direction of the vent 13 of the cooling device casing. Thus, the effect which rectifies | straightens an airflow can be acquired by making the collar part 17 protrude. A power supply board 18 and a control board 19 are mounted on the upper surface of the flange portion 17. As a result, a mounting surface for the power supply board 18 and the control board 19 can be secured, and a cooling unit in which these are integrated can be configured. In addition, the collar part may protrude toward the heat sink from the vent 13 side.
  In this embodiment, only the heat dissipating side fan 14 is displaced, but the heat absorbing side fan 15 can also have the same structure. However, the power supply board 18 is assumed to be installed on the heat radiating side which is the outside of the panel in order to prevent overheating.
  The cooling device configured in this way is attached to the cabinet housing, and cooling the inside of the panel is the same as in the past, but the cooling capacity is increased more than before without increasing the size of the fan 14 as described above. Can be increased.
  In the embodiment shown in FIG. 6 and subsequent figures, the fan 14 is displaced in the direction of the vent 13 of the cooling device housing. However, the direction in which the fan 14 is displaced does not necessarily need to coincide with the air inflow direction. In the embodiment shown in FIG. 6 and subsequent figures, two cooling units are arranged. However, the number of cooling units may be one or three or more. Furthermore, the number of Peltier elements per cooling unit can be increased or decreased as appropriate.
DESCRIPTION OF SYMBOLS 1 Heat sink 2 Peltier element 3 Fan 4 Barrier 10 Cooling unit 11 Body 12 Cover 13 Ventilation hole 14 Heat-dissipation side fan 15 Heat-absorption side fan 16 Plate 17 Gutter part 18 Power supply board 19 Control board

Claims (4)

  1. In a Peltier cooling device in which a heat sink and a fan are arranged on both sides of the Peltier element , air flow direction regulating members are provided on both sides of the heat sink, and at least one fan center is deviated from the center of the heat sink in the air suction direction. A Peltier type cooling device characterized by being positioned.
  2.   2. The Peltier cooling device according to claim 1, wherein the center of the fan is deviated in a direction parallel to an air inflow direction to the heat sink.
  3.   2. The Peltier cooling device according to claim 1, wherein the center of the fan is displaced in the direction of the vent of the cooling device housing in which the Peltier cooling device is incorporated.
  4. The front surface of the heat sink on the side where the fan is displaced is covered with a plate, and a flange extending from the plate is protruded in the direction of the vent of the cooling device housing incorporating the Peltier cooling device. The Peltier cooling device according to 1.
JP2009073724A 2009-03-25 2009-03-25 Peltier cooling device Active JP5252640B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009073724A JP5252640B2 (en) 2009-03-25 2009-03-25 Peltier cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009073724A JP5252640B2 (en) 2009-03-25 2009-03-25 Peltier cooling device

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JP2010226000A JP2010226000A (en) 2010-10-07
JP5252640B2 true JP5252640B2 (en) 2013-07-31

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US10983318B2 (en) * 2018-08-02 2021-04-20 Visera Technologies Company Limited Optical elements

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2796038B2 (en) * 1993-04-28 1998-09-10 株式会社ピーエフユー Heating element cooling structure
JP3214442B2 (en) * 1998-04-14 2001-10-02 ダイキン工業株式会社 Cold heat source unit
JP2006177209A (en) * 2004-12-21 2006-07-06 Kiko Kagi Kofun Yugenkoshi Heat dissipating module equipped with hot air circulation preventing function

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