JP2005221191A - Heat exchanger for electronic apparatus - Google Patents

Heat exchanger for electronic apparatus Download PDF

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Publication number
JP2005221191A
JP2005221191A JP2004031662A JP2004031662A JP2005221191A JP 2005221191 A JP2005221191 A JP 2005221191A JP 2004031662 A JP2004031662 A JP 2004031662A JP 2004031662 A JP2004031662 A JP 2004031662A JP 2005221191 A JP2005221191 A JP 2005221191A
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heat
heat radiating
heat exchanger
fan
radiating part
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Joji Sato
穣治 佐藤
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T Rad Co Ltd
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T Rad Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat exchanger for an electronic apparatus capable of saving a space and being easily installed on a laptop. <P>SOLUTION: In this heat exchanger 14 for the electronic apparatus 19 comprising a heat radiating part 15 and a fan 17 for sending the cooling air to the heat radiating part 15, the heat radiating part 15 is mounted on an outer periphery of the fan 17, and the cooling air axially flowing into the heat radiating part 15, is allowed to radially flow out and pass through the heat radiating part 15. Preferably, the heat radiating part 15 has the cylindrical shape, and the fan 17 is a centrifugal fan 17 mounted on a cavity part 16 of the heat radiating part 15. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、パソコン等の電子機器を冷却するために設けられる水冷式ヒートシンクにおいて使用される電子機器用熱交換器に関する。   The present invention relates to a heat exchanger for electronic equipment used in a water-cooled heat sink provided to cool electronic equipment such as a personal computer.

従来、パソコン等の電子機器において、ＣＰＵ（Central
Processing Unit）等の発熱部品を冷却するため、吸熱部と放熱部を一体化した空冷式ヒートシンクを発熱部品に取り付け、このヒートシンクに冷却空気を強制的に流通させていた。 Conventionally, in electronic devices such as personal computers, CPU (Central
In order to cool heat-generating parts such as processing units, an air-cooled heat sink with an integrated heat-absorbing part and heat-dissipating part was attached to the heat-generating part, and cooling air was forced to flow through the heat sink.

しかしながら、近年、電子機器の小型化の要請やＣＰＵの高性能化に伴う発熱量の増大等の理由により、冷却性能に優れた水冷式ヒートシンクが採用されるようになってきている。   However, in recent years, a water-cooled heat sink having excellent cooling performance has been adopted for reasons such as a demand for downsizing electronic devices and an increase in the amount of heat generated due to higher performance of the CPU.

この種の従来の水冷式ヒートシンクは、例えば、図７に示すように、ＣＰＵ１に取り付けられた水冷ジャケット２と、冷却水循環路３を介して水冷ジャケット２に接続された熱交換器４とを備えており、熱交換器４は放熱部５と放熱部５の前面側に対向して設けられたファン６とから構成されている。   For example, as shown in FIG. 7, this type of conventional water-cooled heat sink includes a water-cooling jacket 2 attached to the CPU 1 and a heat exchanger 4 connected to the water-cooling jacket 2 via a cooling water circulation path 3. The heat exchanger 4 includes a heat dissipating part 5 and a fan 6 provided to face the front side of the heat dissipating part 5.

そして、このような構成のもと、水冷ジャケット２においてＣＰＵ１から吸熱した冷却水は、冷却水循環路３を通って放熱部５に送られ、放熱部５において放熱すると共にファン５により送風された冷却空気によって冷却されるようになっている（例えば、特許文献１参照）。   Under such a configuration, the cooling water that has absorbed heat from the CPU 1 in the water cooling jacket 2 is sent to the heat radiating unit 5 through the cooling water circulation path 3, and radiates heat in the heat radiating unit 5 and is blown by the fan 5. It is cooled by air (see, for example, Patent Document 1).

特開２００３−２８３１７３号公報JP 2003-283173 A

ところが、上記した従来の電子機器用熱交換器では、放熱部５に対する冷却空気は軸方向に沿って放熱部５の背面側に排出されるように構成されていたため、排気の流れが阻害されないように放熱部５を壁７等の障害物から十分な距離、離間させる必要があった。そのため、電子機器８の設置スペースが増大し、使い勝手が悪いといった問題があった。   However, in the above-described conventional heat exchanger for electronic equipment, the cooling air for the heat radiating portion 5 is configured to be discharged to the back side of the heat radiating portion 5 along the axial direction, so that the flow of exhaust air is not hindered. In addition, it is necessary to separate the heat dissipating part 5 from the obstacle such as the wall 7 by a sufficient distance. For this reason, there is a problem that the installation space of the electronic device 8 is increased and the usability is poor.

また、ノート型パソコンにおいては、放熱部５やファン６の設置スペースがさらに制限され、しかも、放熱部５の背面側に排気用の大きな開口部を設けることは事実上不可能であるため、上記した従来の電子機器用熱交換器によりノート型パソコンの水冷化を図ることは極めて困難であった。   Further, in the notebook computer, the installation space for the heat dissipating part 5 and the fan 6 is further limited, and it is practically impossible to provide a large exhaust opening on the back side of the heat dissipating part 5. It has been extremely difficult to cool a notebook computer with a conventional heat exchanger for electronic equipment.

本発明は、上記した課題を解決すべくなされたものであり、省スペース化が可能で、ノート型パソコンにも容易に設置可能な電子機器用熱交換器を提供しようとするものである。   The present invention has been made to solve the above-described problems, and is intended to provide a heat exchanger for electronic equipment that can save space and can be easily installed in a notebook computer.

本発明は、放熱部１５と、放熱部１５に冷却空気を送風するファン１７とを備えた電子機器１９用熱交換器１４であって、放熱部１５はファン１７の外周に設けられ、放熱部１５に軸方向から流入した前記冷却空気が径方向に流出し、放熱部１５を通過可能なように構成されていることを特徴とする。   The present invention is a heat exchanger 14 for an electronic device 19 that includes a heat radiating portion 15 and a fan 17 that blows cooling air to the heat radiating portion 15, and the heat radiating portion 15 is provided on the outer periphery of the fan 17. The cooling air that has flowed into the shaft 15 from the axial direction flows out in the radial direction and can pass through the heat radiating portion 15.

そして、好ましくは、放熱部１５は円筒形状に形成されており、ファン１７は放熱部１５の空洞部１６に設けられた遠心ファン１７である。   Preferably, the heat radiating part 15 is formed in a cylindrical shape, and the fan 17 is a centrifugal fan 17 provided in the cavity 16 of the heat radiating part 15.

本発明によれば、冷却空気は放熱部の径方向に排気されるように構成されているため、放熱部の背面側を障害物から離間させる必要がない。したがって、電子機器の設置スペースの省スペース化が可能となり、また、ノート型パソコンにも容易に収容可能となる等、種々の優れた効果を得ることができる。   According to the present invention, since the cooling air is configured to be exhausted in the radial direction of the heat radiating portion, it is not necessary to separate the back side of the heat radiating portion from the obstacle. Therefore, it is possible to save the space for installing the electronic device, and it is possible to obtain various excellent effects such as being easily accommodated in a notebook personal computer.

以下、図面を参照しつつ、本発明の実施の形態について説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

先ず、図１を参照しつつ、本発明の実施の形態に係る電子機器用熱交換器を備えた水冷式ヒートシンクについて概略説明する。   First, a water-cooled heat sink provided with a heat exchanger for electronic equipment according to an embodiment of the present invention will be schematically described with reference to FIG.

水冷式ヒートシンクは、ＣＰＵ１１に取り付けられた水冷ジャケット１２と、冷却水循環路１３を介して水冷ジャケット１２に接続された熱交換器１４とを備えており、熱交換器１４は円筒形状の放熱部１５と放熱部５の空洞部１６に同心に設けられた遠心ファン１７とから構成されている。   The water-cooled heat sink includes a water-cooling jacket 12 attached to the CPU 11 and a heat exchanger 14 connected to the water-cooling jacket 12 via a cooling water circulation path 13. The heat exchanger 14 is a cylindrical heat radiating portion 15. And a centrifugal fan 17 provided concentrically in the cavity 16 of the heat dissipating part 5.

そして、冷却水循環路１３を循環する冷却水は、水冷ジャケット１２においてＣＰＵ１から吸熱した後、放熱部１５において放熱し、遠心ファン１７によって冷却される。この場合、放熱部１５に対する冷却空気は、軸方向から流入し、図１中の矢印で示すように、径方向に流出するように構成されているため、放熱部１５の背面側を壁１８等の障害物から所定距離、離間させる必要はない。そのため、電子機器１９の設置スペースの省スペース化が可能となり、電子機器１９の使い勝手を向上させることができる。   The cooling water circulating in the cooling water circulation path 13 absorbs heat from the CPU 1 in the water cooling jacket 12, then dissipates heat in the heat radiating unit 15 and is cooled by the centrifugal fan 17. In this case, the cooling air with respect to the heat radiating portion 15 flows in from the axial direction and flows out in the radial direction as shown by the arrows in FIG. There is no need to be spaced a predetermined distance from the obstacle. Therefore, the installation space of the electronic device 19 can be saved, and the usability of the electronic device 19 can be improved.

次に、図２及び図３を参照しつつ、本実施の形態に係る電子機器用熱交換器１４について説明する。ここで、図２はその熱交換器１４をノート型パソコンに設置した状態を示す斜視図、図３は熱交換器１４の放熱部１５を示す斜視図である。   Next, the electronic apparatus heat exchanger 14 according to the present embodiment will be described with reference to FIGS. 2 and 3. Here, FIG. 2 is a perspective view showing a state in which the heat exchanger 14 is installed in a notebook computer, and FIG. 3 is a perspective view showing a heat radiating portion 15 of the heat exchanger 14.

電子機器用熱交換器１４は、放熱部１５と放熱部１５に冷却空気を送風する遠心ファン１７とから成り、図２に示すように、ノート型パソコン２０の隅部に収容されている。そして、放熱部１５は、両端部を所定距離、離間させて略円形状に形成させた扁平チューブ２１を積層させると共に各扁平チューブ２１間にフィン２２を介装させて成るコア２３と、扁平チューブ２１と連通するようにコア２３の両端部に接続された一対のタンク２４，２５と、コア２３の上面及び下面にそれぞれ設けられた各補強プレート２６，２７とから構成され、各タンク２４，２５の側面にはそれぞれ冷却水入口２８、及び冷却水出口２９が突設されている。   The electronic device heat exchanger 14 includes a heat radiating portion 15 and a centrifugal fan 17 that blows cooling air to the heat radiating portion 15, and is accommodated in a corner portion of the notebook computer 20 as shown in FIG. 2. The heat radiating section 15 includes a core 23 formed by laminating flat tubes 21 having both ends separated by a predetermined distance and having a substantially circular shape, and fins 22 interposed between the flat tubes 21, and a flat tube. 21, a pair of tanks 24 and 25 connected to both ends of the core 23 so as to communicate with the core 23, and reinforcing plates 26 and 27 provided on the upper and lower surfaces of the core 23, respectively. A cooling water inlet 28 and a cooling water outlet 29 are provided so as to protrude from the side surfaces.

次に、上記した電子機器用熱交換器１４の作用について説明する。   Next, the effect | action of the above-mentioned heat exchanger 14 for electronic devices is demonstrated.

冷却水入口２８から扁平チューブ２１内に流入した冷却水は、フィン２２を介して放熱し、遠心ファン１７により送風された冷却空気によって冷却される。この場合、放熱部１５に対する冷却空気は、軸方向に沿ってノート型パソコン２０の上方から放熱部１５に流入し、図２の矢印で示すように、径方向に排出される。なお、図２では、冷却空気は２方向に排出されているが、一方向に排出されるようにしてもよい。   The cooling water flowing into the flat tube 21 from the cooling water inlet 28 radiates heat through the fins 22 and is cooled by the cooling air blown by the centrifugal fan 17. In this case, the cooling air for the heat radiating portion 15 flows into the heat radiating portion 15 from above the notebook computer 20 along the axial direction, and is discharged in the radial direction as indicated by the arrows in FIG. In FIG. 2, the cooling air is discharged in two directions, but may be discharged in one direction.

このように、上記した電子機器用熱交換器１４では、放熱部１５の空洞部１６に遠心ファン１７が配置されるようになっているため、コンパクトに納めることができ、また、放熱部１５の背面側に排気用の開口部を設ける必要がないため、ノート型パソコンにも容易に収容可能である。   Thus, in the heat exchanger 14 for electronic devices described above, since the centrifugal fan 17 is arranged in the cavity 16 of the heat radiating portion 15, it can be stored compactly. Since there is no need to provide an opening for exhaust on the back side, it can be easily accommodated in a notebook computer.

なお、放熱部１４は、図４〜図６に示すように、１本の扁平チューブ３０を折り返しながら又は螺旋状に積層させることにより円筒形状に形成させてもよい。そして、この場合、冷却水入口３１が扁平チューブ３０の下端部に接続されると共に冷却水出口３２が扁平チューブ３０の上端部に接続され、冷却水が遠心ファン１７により送風された冷却空気と対向するように扁平チューブ３０内を上方に向かって流通するように構成されているのが好ましい。この結果、放熱部１４を一層薄型にすることができると共に放熱面積を広く確保することができるため、さらなる省スペース化を図ることができ、熱交換性能を高めることできる。   As shown in FIGS. 4 to 6, the heat radiating portion 14 may be formed in a cylindrical shape by laminating one flat tube 30 or spirally laminating it. In this case, the cooling water inlet 31 is connected to the lower end portion of the flat tube 30 and the cooling water outlet 32 is connected to the upper end portion of the flat tube 30 so that the cooling water faces the cooling air blown by the centrifugal fan 17. Thus, it is preferable that the inside of the flat tube 30 is configured to flow upward. As a result, the heat radiating portion 14 can be made thinner and a large heat radiating area can be secured, so that further space saving can be achieved and heat exchange performance can be enhanced.

また、上記した扁平チューブ２１，３０の代わりに、丸管を潰して使用したり、押し出し管（多穴管）や溶接管を使用してもよい。そして、溶接管を使用する場合には、内面側に犠牲材を備えたクラッド材を用いることができるため、水冷式の熱交換器にとって、より好適である。   Further, instead of the flat tubes 21 and 30 described above, a round tube may be crushed and an extruded tube (multi-hole tube) or a welded tube may be used. And when using a welding pipe, since the clad material provided with the sacrificial material on the inner surface side can be used, it is more suitable for a water-cooled heat exchanger.

さらに、上記実施の形態では、放熱部１４は円筒形状を成しているが、これは単なる例示に過ぎず、ファンの外周に配置可能な形状であれば、角筒形状等、他の形状であってもよい。   Furthermore, in the said embodiment, although the thermal radiation part 14 has comprised the cylindrical shape, this is only a mere illustration, and if it is a shape which can be arrange | positioned on the outer periphery of a fan, it will be in other shapes, such as a rectangular tube shape. There may be.

なお、上記実施の形態では、扁平チューブ２１，３０が複数積層された場合について説明したが、熱性能が満たされる場合には単層であっても構わない。   In the above embodiment, the case where a plurality of the flat tubes 21 and 30 are stacked has been described. However, a single layer may be used when the thermal performance is satisfied.

本発明の実施の形態に係る電子機器用熱交換器を示す概略説明図である。It is a schematic explanatory drawing which shows the heat exchanger for electronic devices which concerns on embodiment of this invention. 本発明の実施の形態に係る電子機器用熱交換器を示す斜視図である。It is a perspective view which shows the heat exchanger for electronic devices which concerns on embodiment of this invention. 本発明の実施の形態に係る電子機器用熱交換器を示す斜視図である。It is a perspective view which shows the heat exchanger for electronic devices which concerns on embodiment of this invention. 本発明の実施の形態に係る電子機器用熱交換器の別の例を示す斜視図である。It is a perspective view which shows another example of the heat exchanger for electronic devices which concerns on embodiment of this invention. 本発明の実施の形態に係る電子機器用熱交換器の別の例を示す平面図である。It is a top view which shows another example of the heat exchanger for electronic devices which concerns on embodiment of this invention. 本発明の実施の形態に係る電子機器用別交換機の別の例を示す側面図である。It is a side view which shows another example of the different exchange for electronic devices which concerns on embodiment of this invention. 従来例を示す概略説明図である。It is a schematic explanatory drawing which shows a prior art example.

符号の説明Explanation of symbols

１４ 熱交換器
１５ 放熱部
１６ 空洞部
１７ 遠心ファン
１９ 電子機器 14 Heat Exchanger 15 Heat Dissipation Part 16 Cavity Part 17 Centrifugal Fan 19 Electronic Device

Claims (2)

放熱部と、該放熱部に冷却空気を送風するファンとを備えた電子機器用熱交換器であって、
前記放熱部は前記ファンの外周に設けられ、該放熱部に軸方向から流入した前記冷却空気が径方向に流出し、前記放熱部を通過可能なように構成されていることを特徴とする電子機器用熱交換器。 A heat exchanger for electronic equipment comprising a heat dissipating part and a fan for blowing cooling air to the heat dissipating part,
The heat dissipating part is provided on the outer periphery of the fan, and the cooling air that has flowed into the heat dissipating part from the axial direction flows out in the radial direction so as to be able to pass through the heat dissipating part. Equipment heat exchanger. 前記放熱部は円筒形状に形成されており、前記ファンは前記放熱部の空洞部に設けられた遠心ファンである請求項１に記載の電子機器用熱交換器。 The heat exchanger for electronic equipment according to claim 1, wherein the heat radiating portion is formed in a cylindrical shape, and the fan is a centrifugal fan provided in a cavity of the heat radiating portion.
JP2004031662A 2004-02-09 2004-02-09 Heat exchanger for electronic apparatus Pending JP2005221191A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007287957A (en) * 2006-04-18 2007-11-01 Matsushita Electric Ind Co Ltd Heat conveyance device and liquid cooling system using it
JP2010133642A (en) * 2008-12-04 2010-06-17 Fujitsu Ltd Radiator, cooling unit, cooling system and electronic device
JP2011237105A (en) * 2010-05-10 2011-11-24 Fujitsu Ltd Radiator, and electronic device having the same
WO2018041501A1 (en) * 2016-08-31 2018-03-08 Ebm-Papst Mulfingen Gmbh & Co. Kg Heat exchanger integration
JP2019504284A (en) * 2016-01-21 2019-02-14 エタリム インコーポレイテッド Apparatus and system for exchanging heat with a fluid
CN110594200A (en) * 2019-09-09 2019-12-20 苏州佳世达光电有限公司 Air guide structure and electronic equipment applying same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007287957A (en) * 2006-04-18 2007-11-01 Matsushita Electric Ind Co Ltd Heat conveyance device and liquid cooling system using it
JP4742965B2 (en) * 2006-04-18 2011-08-10 パナソニック株式会社 Heat transfer device and liquid cooling system using it
JP2010133642A (en) * 2008-12-04 2010-06-17 Fujitsu Ltd Radiator, cooling unit, cooling system and electronic device
JP2011237105A (en) * 2010-05-10 2011-11-24 Fujitsu Ltd Radiator, and electronic device having the same
TWI476357B (en) * 2010-05-10 2015-03-11 Fujitsu Ltd Radiator and electronic device having the same
US9921002B2 (en) 2010-05-10 2018-03-20 Fujitsu Limited Radiator and electronic device having the same
JP2019504284A (en) * 2016-01-21 2019-02-14 エタリム インコーポレイテッド Apparatus and system for exchanging heat with a fluid
WO2018041501A1 (en) * 2016-08-31 2018-03-08 Ebm-Papst Mulfingen Gmbh & Co. Kg Heat exchanger integration
CN110594200A (en) * 2019-09-09 2019-12-20 苏州佳世达光电有限公司 Air guide structure and electronic equipment applying same
CN110594200B (en) * 2019-09-09 2022-05-17 苏州佳世达光电有限公司 Air guide structure and electronic equipment applying same

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