JP5930982B2 - Electronic component package and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component package and a method for manufacturing the same, and more particularly to an electronic component package having an accommodation space for accommodating an electronic component.

  Electronic parts such as semiconductor elements, resistance elements, and capacitors are not excellent in moisture resistance, and their performance may not be sufficiently exhibited in an environment where airtightness is not sufficiently maintained. In particular, FET (Field Effect Transistor) elements and MMIC (Monolithic Microwave Integrated Circuit) used in pressure sensors, optical transceiver modules, crystal oscillators and high-frequency circuits have poor moisture resistance, An electronic component package that accommodates one or more of these requires a structure that maintains high airtightness.

  In general, this type of electronic component is accommodated in an accommodation space defined by a base material portion on which the electronic component is mounted and a lid disposed on the carrier substrate so as to cover the electronic component. At this time, inert gas and dry air are enclosed in the accommodation space, and high airtightness is maintained. The lid is bonded to the carrier substrate using lead-containing solder. At this time, a solder joint is formed.

  In recent years, in consideration of the environment of products, general-purpose electrical appliances and the like are required not to contain lead that is harmful to the human body and the environment, and lead-free solder is widely used. In consideration of environmental issues in electronic component packages, high-temperature solder materials that do not contain lead have been intensively developed. However, lead-free solders that satisfy all the physical properties possessed by conventional lead-containing solders have not yet been put into practical use from the viewpoint of securing bonding strength and the like. Therefore, even in the RoHS directive known as European environmental regulations, the use of conventional lead-containing solder is recognized as being partially excluded.

  In electronic component packages, lead-containing solder used for solder bonding as described above may be corroded by moisture in the atmosphere when exposed to the atmosphere in the external environment. In some cases, moisture in the atmosphere (humidity) flows into the accommodation space due to deterioration of the joint portion with time.

  As a solder paste for preventing such corrosion of the solder joint portion, Japanese Patent Application Laid-Open No. 7-80682 (Patent Document 1) discloses a solder paste composed of solder powder and flux, and soldering to a base material portion. The thing which contains the thermoplastic resin which can endure the reflow temperature which attaches in a flux is disclosed. By using the solder paste, the surface of the solder joint portion is covered with the thermoplastic resin during the reflow process, and a moisture-proof film is formed. As a result, the corrosion resistance of the solder joint can be improved.

  Japanese Patent Laid-Open No. 9-167890 (Patent Document 2) discloses a solder paste composed of solder powder and a flux, in which a thermosetting resin, an ultraviolet curable resin, or an electron curable resin is blended in the flux. Is disclosed. By applying the heat treatment, ultraviolet irradiation treatment or electron beam irradiation treatment to the thermosetting resin, ultraviolet curable resin or electron curable resin covering the surface of the solder joint using the solder paste, and curing them A moisture barrier film is formed. As a result, the corrosion resistance of the solder joint can be improved.

Japanese Patent Laid-Open No. 7-80682 JP-A-9-167890

  However, in the solder paste disclosed in Patent Document 1 or Patent Document 2, it is assumed that the resin is soluble in the flux, and it is necessary to use a special flux or a special resin. This increases the material cost and increases the manufacturing cost of electronic components. In addition, the solder paste is not limited to be stably supplied in the market, and there is a problem in the availability.

  On the other hand, as an electronic component package that can suppress deterioration of the solder joint without using the solder paste disclosed in Patent Document 1 or Patent Document 2, the entire surface of the circuit board including the mounted electronic component package is covered with a moisture-proof film. There is something with a broken structure.

  This moisture-proof film is excellent in moisture-proof property, but is not sufficiently considered for high-frequency electrical characteristics, and is made of a material having a large dielectric loss. For this reason, when the moisture-proof film contacts the transmission line formed on the circuit board in order to propagate the high-frequency signal, the high-frequency signal is attenuated by the influence of the dielectric loss of the moisture-proof film, and the design performance is reduced. It can happen that you can't meet. For this reason, the moisture-proof film is required to be formed only on the electronic component package.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic component package that can suppress the manufacturing cost and suppress the deterioration of the solder joint portion, and a manufacturing method thereof. is there.

An electronic component package according to the present invention has an accommodation space for accommodating an electronic component, and surrounds a base material portion including a mounting surface on which the electronic component is mounted, and a mounting area on which the electronic component is mounted. A first conductive pattern having an annular shape provided on the mounting surface, a top plate portion and a side plate portion, and the side plate portion is disposed on the first conductive pattern so that A lid that defines the housing space in between, a solder joint that joins the side plate portion of the lid and the first conductive pattern, and an exposed portion of the solder joint portion located along the outer periphery of the side plate portion A moisture-proof film made of a hardened liquid resin provided to cover the surface, and provided on the mounting surface so as to be spaced apart from the first conductive pattern along the outer periphery of the first conductive pattern, Solder joint side Having a stop surface dam faces and a outflow preventing portion of the annular shape capable of preventing the outflow of the liquid resin.

  According to one aspect of the present invention, there is provided a method for manufacturing an electronic component package, wherein the outflow prevention portion is disposed on the mounting surface so as to be spaced apart from the first conductive pattern along an outer periphery of the first conductive pattern. An electronic component package manufacturing method comprising: an annular second conductive pattern provided; and a solder dam provided on the second conductive pattern, wherein the substrate portion, the first conductive pattern, and the first conductive pattern Preparing a carrier substrate including two conductive patterns; arranging the side plate portion of the lid on the carrier substrate; and bonding the side plate portion and the first conductive pattern by using solder. Forming the solder portion, forming the solder dam on the second conductive pattern, and applying and curing a liquid resin on the exposed surface of the solder joint portion, thereby preventing the moisture And forming a.

  According to another aspect of the present invention, there is provided an electronic component package manufacturing method, wherein the outflow prevention portion is provided on the mounting surface so as to be positioned away from the first conductive pattern along an outer periphery of the first conductive pattern. A method for manufacturing an electronic component package comprising a stepped portion having an annular shape, the step of preparing a carrier substrate including the base material portion provided with the stepped portion and the first conductive pattern, and on the carrier substrate The side plate portion of the lid is disposed, the step of forming the solder joint portion by joining the side plate portion and the first conductive pattern using solder, and the exposed surface of the solder joint portion is liquid. Forming a moisture-proof film by applying and curing a resin.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing cost can be suppressed, and the electronic component package which can suppress deterioration of a solder joint part, and its manufacturing method can be provided.

It is a schematic cross section which shows the state by which the electronic component package which concerns on Embodiment 1 of this invention was mounted in the circuit board. It is a model perspective view of the electronic component package shown in FIG. FIG. 2 is a schematic plan view of the electronic component package shown in FIG. 1. FIG. 2 is a schematic side view of the electronic component package shown in FIG. 1. It is principal part sectional drawing of the broken line part V vicinity shown in FIG. It is a top view of the lid shown in FIG. It is sectional drawing along the VII-VII line shown in FIG. 6 of the lid shown in FIG. It is a schematic plan view which shows the structure of the carrier substrate shown in FIG. It is sectional drawing along the IX-IX line | wire shown in FIG. 8 of the carrier board | substrate shown in FIG. It is principal part sectional drawing of the broken line part X vicinity shown in FIG. It is a schematic cross section which shows the process of supplying a solder paste in the manufacturing method of the electronic component package which concerns on Embodiment 1 of this invention. It is a schematic cross section which shows the state at the time of completion | finish of the process which supplies a solder paste in the manufacturing method of the electronic component package which concerns on Embodiment 1 of this invention. It is a schematic cross section which shows the 1st process of the process of forming a solder joint in the manufacturing method of the electronic component package which concerns on Embodiment 1 of this invention. It is a schematic cross section which shows the 2nd process of the process of forming a solder joint part in the manufacturing method of the electronic component package which concerns on Embodiment 1 of this invention. It is a schematic cross section which shows the 3rd process of the process of forming a solder joint part in the manufacturing method of the electronic component package which concerns on Embodiment 1 of this invention. It is a schematic cross section which shows the process of mounting an electronic component in the manufacturing method of the electronic component package which concerns on Embodiment 1 of this invention. It is a schematic cross section which shows the process of welding a top-plate part to a side-plate part in the manufacturing method of the electronic component package which concerns on Embodiment 1 of this invention. It is a schematic cross section which shows the process of apply | coating liquid resin in the manufacturing method of the electronic component package which concerns on Embodiment 1 of this invention. It is a schematic cross section which shows the state at the time of completion | finish of the process of forming a moisture-proof film | membrane in the manufacturing method of the electronic component package which concerns on Embodiment 1 of this invention. It is a schematic cross section which shows the process of attaching a solder ball in the manufacturing method of the electronic component package which concerns on Embodiment 1 of this invention. It is a schematic plan view which shows the layout in the mother board | substrate at the time of manufacturing the electronic component package which concerns on Embodiment 1 of this invention by multiple picking. It is sectional drawing along the XXII-XXII line | wire of the mother board | substrate shown in FIG. It is a schematic cross section which shows the state by which the electronic component package which concerns on the comparative example was mounted in the circuit board. FIG. 24 is a partial cross-sectional view in the vicinity of a broken line portion XXIV shown in FIG. 23 and shows a deterioration initial state of the solder joint portion shown in FIG. 23. It is a figure which shows the deterioration middle state of the solder joint part shown in FIG. It is a figure which shows the deterioration final state of the solder joint part shown in FIG. It is a schematic cross section which shows the state by which the electronic component package which concerns on Embodiment 2 of this invention was mounted in the circuit board. It is principal part sectional drawing of the broken line part XXVIII vicinity shown in FIG. It is principal part sectional drawing of the carrier substrate shown in FIG. It is a schematic cross section which shows the state at the time of completion | finish of the process of forming a moisture-proof film | membrane in the manufacturing method of the electronic component package which concerns on Embodiment 2 of this invention. It is a schematic plan view which shows the layout in the mother board | substrate at the time of manufacturing the electronic component package which concerns on Embodiment 2 of this invention by multiple picking. FIG. 32 is a cross-sectional view of the mother board shown in FIG. 31 taken along line XXXII-XXXII. It is a schematic cross section which shows the state by which the electronic component package which concerns on Embodiment 3 of this invention was mounted in the circuit board. It is principal part sectional drawing of the broken line part XXXIV vicinity shown in FIG. It is principal part sectional drawing of the carrier substrate shown in FIG. It is a schematic cross section which shows the state at the time of completion | finish of the process of forming a moisture-proof film | membrane in the manufacturing method of the electronic component package which concerns on Embodiment 3 of this invention. It is a schematic plan view which shows the layout in the mother board | substrate at the time of manufacturing the electronic component package which concerns on Embodiment 3 of this invention by multiple picking. It is sectional drawing along the XXXVIII-XXXVIII line of the mother board | substrate shown in FIG. It is a schematic cross section which shows the state with which the electronic component package which concerns on Embodiment 4 of this invention was mounted in the circuit board.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following embodiments, the same or common parts are denoted by the same reference numerals in the drawings, and description thereof will not be repeated.

(Embodiment 1)
FIG. 1 is a schematic cross-sectional view showing a state where an electronic component package according to Embodiment 1 of the present invention is mounted on a circuit board. FIG. 2 is a schematic perspective view of the electronic component package shown in FIG. FIG. 3 is a schematic plan view of the electronic component package shown in FIG. FIG. 4 is a schematic side view of the electronic component package shown in FIG. FIG. 5 is a cross-sectional view of the main part in the vicinity of the broken line portion V shown in FIG. The electronic component package 1 according to the first embodiment will be described with reference to FIGS.

  As shown in FIGS. 1 to 5, the electronic component package 1 according to the present embodiment is mounted on a circuit board 90. The electronic component package 1 includes a semiconductor element 2 as an electronic component, a carrier substrate 10, a lid 30, a solder joint portion 40, a solder dam 46 as an outflow prevention portion, and a moisture-proof film 60.

  The carrier substrate 10 includes a base material portion 11, a pad electrode 20 as a first conductive pattern formed on the mounting surface 12 side of the base material portion 11, and a BGA (Ball Grid Array) formed on the back surface 13 side of the base material portion 11. : Ball grid array) including a pad electrode 21, a solder dam electrode 22 as a second conductive pattern, and a glass coat 50.

  The semiconductor element 2 is mounted on the mounting surface 12, and an annular pad electrode 20 is formed on the base material portion 11 so as to surround the mounting region 4 where the semiconductor element 2 is mounted.

  The lid 30 includes a side plate portion 31 and a top plate portion 32. The lid 30 defines the accommodation space 3 between the base member 11 and the semiconductor element 2 is accommodated in the accommodation space 3. The accommodation space 3 is filled with an inert gas or dry air, and prevents the semiconductor element 2 from being corroded by moisture from the outside. The detailed structure of the lid 30 will be described later.

  The solder dam 46 is annularly arranged along the outer periphery so as to surround the lid 30, and is formed so as to protrude from the mounting surface 12 of the base material portion 11. The solder dam 46 has a damming surface 46a facing the solder joint 40 (see FIG. 5).

  The moisture-proof film 60 is formed so as to cover the exposed surface of the solder joint portion 40 located along the outer periphery of the side plate portion 31. At least a part of the end portion of the moisture-proof film 60 located on the opposite side of the side plate portion 31 is in contact with the damming surface 46a (see FIG. 5).

  The glass coat 50 includes an inner glass coat 51, a central glass coat 52 and an outer glass coat 53. Details thereof will be described later.

  The circuit board 90 includes a circuit board pad electrode 91. The circuit board pad electrode 91 and the BGA pad electrode 21 are connected via a solder ball 92. Thereby, the electronic component package 1 and the circuit board 90 are electrically connected.

  FIG. 6 is a top view of the lid shown in FIG. 7 is a cross-sectional view of the lid shown in FIG. 1 taken along the line VII-VII shown in FIG. The detailed structure of the lid 30 will be described with reference to FIGS. 6 and 7.

  As shown in FIGS. 6 and 7, the side plate portion 31 of the lid 30 is an annular member having openings on the upper surface and the lower surface, and one opening is covered by the top plate portion 32, and the top plate portion is at the contact portion. 32 is fixed to the side plate portion 31 by seam welding. Thereby, the lid 30 is configured in a flat box shape having an open space in one direction. Since the lid 30 is positioned on the carrier substrate 10 so as to cover the semiconductor element 2, the open space described above becomes the accommodation space 3.

  FIG. 8 is a schematic plan view showing the configuration of the carrier substrate shown in FIG. 9 is a cross-sectional view of the carrier substrate shown in FIG. 1 along the line IX-IX shown in FIG. FIG. 10 is a cross-sectional view of the main part in the vicinity of the broken line part X shown in FIG. A detailed configuration of the carrier substrate 10 will be described with reference to FIGS.

  As shown in FIGS. 8 and 9, an annular pad electrode 20 is formed on the mounting surface 12 so as to surround the mounting region 4 on which the semiconductor element 2 is mounted. An annular solder dam electrode 22 is formed on the mounting surface 12 so as to be positioned away from the pad electrode 20 along the outer periphery of the pad electrode 20.

  The glass coat 50 includes the inner glass coat 51, the central glass coat 52, and the outer glass coat 53 as described above. The inner glass coat 51 is disposed so as to fill a gap between the mounting region 4 for mounting the semiconductor element 2 and the pad electrode 20, and the central glass coat 52 is disposed between the pad electrode 20 and the solder dam electrode 22. The outer glass coat 53 is disposed along the outer periphery so as to contact the solder dam electrode 22. The glass coat 50 functions as a solder resist in a step of forming a solder joint described later. In addition, when the base material part 11 itself has a function as a solder resist, the glass coat 50 may not be particularly provided.

  As shown in FIG. 10, when the configuration of the carrier substrate 10 is further detailed, the carrier substrate 10 includes a pad electrode 20, a solder dam electrode 22 and a glass coat 50 formed on the surface of the base material portion 11, and a base material portion. 11 and the via hole 23 which is a columnar conductor wiring connecting the pad electrode 20 and the inner layer wiring 24.

  The carrier substrate 10 is applied so that the conductive paste layer serving as an electrode pattern such as the pad electrode 20 and the solder dam electrode 22 is applied to the mounting surface 12 side of the base material portion 11 and then overlaps the outer peripheral portion of the conductive paste layer. It is manufactured by applying a glass paste layer to be a glass coat, and simultaneously pressing and baking them using a press device. For this reason, the pad electrode 20, the solder dam electrode 22, and the glass coat 50 are formed so as not to have a step, and the carrier substrate 10 has the flat mounting surface 12. Further, a region of the conductor paste layer where the glass paste layer is applied so as to overlap the outer peripheral portion corresponds to the portion 25 covered with the glass coat 50 and submerged.

  Subsequently, a specific configuration or material of each member will be described. The external dimensions of the carrier substrate 10 are, for example, 15 mm (vertical width) × 15 mm (horizontal width) × 0.7 mm (height), and the base material part 11 is LTCC (Low Temperature Co-fired Ceramic). A substrate can be employed. As the pad electrode 20 and the solder dam electrode 22, a metal conductor mainly composed of silver can be employed. The surfaces of the pad electrode 20 and the solder dam electrode 22 are preferably plated with Ni, Au or the like so as to increase the wettability of the solder and to fix the solder easily. Further, in the inner layer wiring 24 and the via hole 23, a metal conductor containing silver as a main component can be adopted as the material in the same manner as the pad electrode 20 and the solder dam electrode 22.

  The external dimensions of the lid 30 are, for example, 10 mm (vertical width) × 10 mm (horizontal width) × 1.5 mm (height), and the side plate portion 31 and the top plate portion 32 constituting the lid 30 are ceramics of the base material portion 11. A metal material such as a Kovar material having a linear expansion coefficient combined with the substrate can be used. The surfaces of the side plate portion 31 and the top plate portion 32 are preferably plated with Ni, Au or the like in consideration of the bondability and corrosion resistance during welding. Further, when the lid 30 is not made of a metal material, a member made of ceramic, resin, or the like whose surface is metal-plated so as to be solderable can be employed.

  As materials for the solder joint portion 40 and the solder dam 46, the solder joint portion 40 and the solder dam 46 are not remelted when the solder ball 92 is reflowed to solder the electronic component package 1 to the circuit board 90. As described above, high-temperature solder having a melting point higher than that of the solder used for the solder ball 92 is employed. As the high-temperature solder, for example, 10Sn-Pb (liquidus temperature 301 ° C.), 8Sn-2Ag-Pb (liquidus temperature 296 ° C.) can be employed. As 8Sn-2Ag-Pb, OZ295-374F (manufactured by Senju Metal Industry Co., Ltd.) can be employed. On the other hand, for example, 3Ag-0.5Cu-Sn (liquidus temperature 220 ° C.) can be adopted as the solder used for the solder balls 92.

  As a material for the glass coat 50, a mixture of borosilicate glass and alumina can be employed. As the liquid resin that is the material of the moisture-proof film 60, a volatile solvent (solution) in which a polyolefin resin, an acrylic resin, a polyurethane resin, an epoxy resin, or a silicone resin is dissolved can be used. As such a volatile solvent (solution), for example, HumiSeal (registered trademark) manufactured by Chase Corporation can be employed.

  In the electronic component package 1 according to the present embodiment described above, a portion of the solder joint portion 40 located on the outer periphery of the lid 30 is provided with the moisture-proof film 60 as described above. Since it is possible to prevent moisture from the external environment from adhering to the solder, deterioration of the solder joint 40 can be suppressed. Thereby, the airtightness of the electronic component package 1 can be remarkably improved. Moreover, since the electronic component package 1 is mounted on the circuit board 90 with the moisture-proof film 60 provided, it is not necessary to apply a liquid resin to the entire circuit board 90. As a result, the transmission line of the circuit board is not affected by the dielectric loss from the liquid resin, the attenuation of the high frequency signal can be prevented, and the normal operation of the circuit board 90 can be maintained.

  Further, in the electronic component package 1 according to the present embodiment, the solder dam 46 is provided as described above, so that the outflow of the liquid resin 61 constituting the moisture-proof film 60 during the manufacture of the solder is prevented. Deterred by dam 46. Thereby, it is possible to prevent the liquid resin 61 having a low viscosity from spreading randomly and wrapping around the back side of the carrier substrate 10. As a result, mounting on a circuit board 90 to be described later can be performed reliably.

  Further, in the electronic component package 1 according to the present embodiment, a special flux that can be held in a state in which the resin is melted as in the prior art and a special resin that is soluble in the flux are not used. Since the moisture-proof film 60 can be easily formed, an electronic component package can be manufactured at low cost without increasing the manufacturing cost.

  Next, a method for manufacturing an electronic component package according to the present embodiment will be described with reference to FIGS.

  FIG. 11 is a schematic cross-sectional view showing a step of supplying a solder paste in the method of manufacturing an electronic component package according to the present embodiment. FIG. 12 is a schematic cross-sectional view showing a state at the end of the step of supplying the solder paste in the electronic component package manufacturing method according to Embodiment 1 of the present invention.

  First, an annular pad electrode 20 that surrounds the mounting region 4 on which the semiconductor element 2 is mounted, and a solder dam electrode 22 that is annularly disposed along the outer periphery of the pad electrode 20 so as to be spaced apart from the pad electrode 20. The carrier substrate 10 formed on the mounting surface 12 of the base material portion 11 is prepared. Thereby, the carrier substrate 10 including the base material part 11, the pad electrode 20, and the solder dam electrode 22 is prepared.

  Subsequently, as shown in FIG. 11, a solder paste 47 containing high-temperature solder powder and flux is supplied to the carrier substrate 10 using a screen printing mask 71. The screen printing mask 71 is provided with openings at positions corresponding to the pad electrode 20 and the solder dam electrode 22. As the squeegee 72 moves on the screen printing mask 71, the solder paste 47 is supplied onto the pad electrode 20 and the solder dam electrode 22 through the opening.

  As shown in FIG. 12, when the screen printing mask 71 is removed, the solder paste 47 is not supplied on the inner glass coat 51, the central glass coat 52, and the outer glass coat 53, but on the pad electrode 20 and the solder. The solder paste 47 is laminated on the dam electrode 22.

  13 to 15 are schematic cross-sectional views showing first to third steps of the step of forming the solder joint in the method of manufacturing the electronic component package according to the present embodiment.

  Next, as shown in FIG. 13, the side plate portion 31 of the lid 30 is positioned using a component mounting device (not shown). The component mounting apparatus mounts the side plate 31 on the solder paste 47 on the pad electrode 20 by lowering the side plate 31 toward the carrier substrate 10 (see the arrow in the figure). The component mounting apparatus preferably includes an image processing unit. In this case, since the positional relationship between the side plate 31 and the solder paste 47 on the pad electrode 20 can be corrected using the image processing unit, ± 50 μm. The side plate portion 31 can be mounted on the solder paste 47 on the pad electrode 20 with a certain degree of accuracy.

  Subsequently, as shown in FIG. 14, when the mounting of the side plate portion 31 is completed, the side plate portion 31 is temporarily fixed by the adhesive force of the solder paste 47. Next, as shown in FIG. 15, the carrier substrate 10 on which the side plate portion 31 is temporarily fixed is put into a reflow furnace (not shown) having a predetermined environment and a predetermined temperature profile. The high-temperature solder melts and the side plate portion 31 is joined to the pad electrode 20. Thereby, the solder joint part 40 which joins the side plate part 31 and the pad electrode 20 is formed. Simultaneously with this joining, a solder dam 46 is formed on the solder dam electrode 22. The solder dam 46 is obtained by cooling and fixing high-temperature solder melted in a reflow furnace, and has a semi-elliptical shape in sectional view. In this way, a damming surface 46a facing the solder joint 40 is formed on the solder dam 46.

  Next, the carrier substrate 10 that has been soldered is placed in a cleaning device. Thereby, the residue of the flux adhering to the surface of the solder joint portion 40 and the surface of the solder dam 46 at the time of solder joining is dissolved and removed by the predetermined cleaning liquid.

  FIG. 16 is a schematic cross-sectional view showing an electronic component mounting process in the method of manufacturing an electronic component package according to the present embodiment.

  Subsequently, as shown in FIG. 16, the semiconductor element 2 as an electronic component is mounted at a predetermined position on the mounting surface 12 of the carrier substrate 10 after cleaning. The semiconductor element 2 is mounted by die-bonding using a resinous adhesive and then connecting the electrodes with a gold wire or the like. A plurality of semiconductor elements 2 may be mounted.

  FIG. 17 is a schematic cross-sectional view showing a process of welding the top plate portion to the side plate portion in the method of manufacturing an electronic component package according to the present embodiment.

  Next, as shown in FIG. 17, the top plate portion 32 of the lid 30 is seam welded to the side plate portion 31 using a seam welder. The seam welder includes a pair of roller electrodes 73 and a bearing portion 74 that are arranged to face each other. The roller electrode 73 has a taper and is supported by the bearing portion 74 so as to be capable of rolling contact at a joint portion between the side plate portion 31 and the top plate portion 32. The seam welding machine welds the top plate portion 32 to the side plate portion 31 by energizing the roller electrode 73 and rotating the roller electrode 73 along the joint portion while pressing the roller electrode 73 against the joint portion. Thereby, the lid 30 is formed, and the semiconductor element 2 is accommodated in the accommodating space 3 formed between the lid 30 and the carrier substrate 10. Further, the seam welding is performed in an inert gas environment or a dry air environment, whereby the inside of the accommodation space 3 is hermetically sealed.

  FIG. 18 is a schematic cross-sectional view showing a step of applying a liquid resin in the method of manufacturing an electronic component package according to the present embodiment. FIG. 19 is a schematic cross-sectional view showing a state at the end of the step of forming the moisture-proof film in the method for manufacturing the electronic component package according to the present embodiment.

  Subsequently, as shown in FIG. 18, using the dispenser 75, the outer periphery of the lid 30 and the solder dam 46 are covered so as to cover the exposed surface of the solder joint portion 40 located along the outer periphery of the side plate portion 31. A liquid resin 61 that has moisture resistance after curing is applied to the gaps between them. A portion of the liquid resin 61 that flows along the slope of the exposed surface is blocked by the solder dam 46 by coming into contact with the blocking surface 46a, and the outflow is suppressed. Thereby, it is possible to prevent the liquid resin 61 having a low viscosity from spreading randomly.

  The application amount of the liquid resin 61 is adjusted so as not to exceed the solder dam 46 while covering the exposed surface. As the liquid resin 61, HumiSeal (registered trademark), product number 1B73 (acrylic resin solid content 30%) can be adopted.

  Moreover, although the method using the dispenser 75 was illustrated and demonstrated as a coating method of the liquid resin 61, it is not limited to this, The method using a jet-type dispenser, the spray coating method, the brush coating method, the method using an inkjet suitably Can be adopted.

  Next, in the step of forming the moisture-proof film 60, the carrier substrate 10 coated with the liquid resin 61 is put into a drying furnace (not shown) and held at 50 ° C. for 1 hour. Thereby, as shown in FIG. 19, the liquid resin 61 is cured and the moisture-proof film 60 is formed. Here, it is preferable that the thickness of the moisture-proof film 60 is about 40 μm. When the thickness of the moisture-proof film 60 is less than 30 μm, the liquid resin 61 is locally repelled on the exposed surface of the solder joint portion 40 or a pinhole is generated, so that the solder joint portion 40 Environmental resistance is insufficient. On the other hand, when the thickness of the moisture-proof film 60 exceeds 50 μm, the coating amount of the liquid resin 61 is increased, and a very large solder dam is required to block this. For this reason, difficult problems occur in manufacturing such as adjustment of the application amount of the liquid resin 61 or adjustment of the arrangement of the solder dam. In addition, when the thickness of the moisture-proof film 60 exceeds 50 μm, the thickness becomes too thick, so that wrinkles and unevenness occur, and the appearance quality deteriorates.

  FIG. 20 is a schematic cross-sectional view showing a process of attaching solder balls in the method of manufacturing an electronic component package according to the present embodiment.

  Subsequently, as shown in FIG. 20, a solder paste (not shown) is printed on the BGA pad electrode 21 formed on the back surface 13 side of the base material portion 11, and a separately prepared solder ball is mounted on the solder paste. The reflow process is performed in a state (normally, the reflow process is performed with the ball mounting surface facing up). Thereby, the solder paste and the solder ball 92 are melted and integrated, and the joining of the base material portion 11 and the solder ball 92 is completed.

  As described above, the electronic component package 1 in the present embodiment described above is manufactured. When the electronic component package 1 is mounted on the circuit board 90 (see FIG. 1), the electronic component package 1 with the solder balls 92 attached is mounted at a predetermined position on the circuit board 90 to which the solder paste is supplied. And reflow process. As a result, the solder paste on the circuit board and the solder balls 92 of the electronic component package 1 are fused and integrated, and the electronic component package 1 is mounted on the circuit board 90.

  FIG. 21 is a schematic plan view showing a layout in the mother board when a plurality of electronic component packages according to the present embodiment are manufactured. 22 is a cross-sectional view of the mother board shown in FIG. 21 taken along line XXII-XXII. A case where a plurality of electronic component packages 1 according to the present embodiment are manufactured simultaneously will be described with reference to FIGS.

  In the above description, the case where one electronic component package 1 is manufactured from one carrier substrate 10 has been described as an example. However, as shown in FIGS. It is also possible to manufacture a plurality of electronic component packages 1. In this case, a plurality of patterns such as the pad electrode 20, the solder dam electrode 22, and the glass coat 50 are collectively formed on one mother substrate 7, and the above-described processes are performed on each pattern. As a result, the mother substrate 7 on which the plurality of electronic component packages 1 are mounted is manufactured. Thereafter, the mother substrate 7 is cut along the cutting lines 5 and 6, whereby the plurality of electronic component packages 1 are cut out individually. Thereby, the several electronic component package 1 is manufactured simultaneously.

  As described above, by adopting the manufacturing method of the electronic component package 1 in the present embodiment, it is soluble in a special flux and flux that can be held in a state where the resin is melted as in the prior art. Since the moisture-proof film 60 can be easily formed without using a special resin, it is possible to manufacture an electronic component package capable of suppressing deterioration of the solder joint 40 at a low cost without increasing the manufacturing cost. .

(Comparative example)
FIG. 23 is a schematic cross-sectional view showing a state where an electronic component package according to a comparative example is mounted on a circuit board. The electronic component package 101 provided on the circuit board 90 according to the comparative example will be described with reference to FIG. The electronic component package 101 according to the comparative example is used as a comparative sample for confirming the effect of the moisture-proof film 60 in an environment resistance test described later.

  As shown in FIG. 23, the electronic component package 101 according to the comparative example is different from the electronic component package 1 according to the embodiment mainly in that the moisture-proof film 60 is not formed. The difference is that the glass coat, the solder dam electrode, and the solder dam are not formed on the substrate 10C.

  Specifically, the electronic component package 101 includes a semiconductor element 2 as an electronic component, a carrier substrate 10A, a lid 30, and a solder joint portion 40.

  The carrier substrate 10 </ b> C includes a base material part 11, a pad electrode 20 formed on the mounting surface 12 side of the base material part 11, and a BGA (Ball Grid Array) pad formed on the back surface 13 side of the base material part 11. An electrode 21 is included.

  In the electronic component package 101, since the solder joint portion 40 located along the outer periphery of the side plate portion 31 is not covered with the moisture-proof film, the portion is exposed to the external environment. Here, since the high-temperature solder used when forming the solder joint portion 40 contains a large amount of Pb, when moisture in the atmosphere, which is the external environment, adheres, the following reaction occurs and contacts the adhered water. High temperature solder ionizes to lead ions.

Pb → Pb ²⁺ + 2e ⁻
Further, when the flux is not sufficiently removed when the side plate portion 31 is soldered onto the pad electrode 20, the flux contains an activator such as an acid or a halogen substance. It changes into an aqueous solution having a corrosive property by ionizing by contact with.

  When the chemical reaction as described above occurs on the surface of the solder joint portion 40, corrosion or elution of lead is promoted, and the solder joint portion 40 deteriorates with time. Specifically, the surface of the solder joint 40 loses its luster, blackness and minute irregularities are formed, and a small piece of lead peels or falls off, so that a crack progresses from the surface of the solder joint 40 to the inside. Go.

  24 is a partial cross-sectional view in the vicinity of a broken line portion XXIV shown in FIG. 23, and is a view showing an initial deterioration state of the solder joint portion shown in FIG. FIG. 25 is a diagram showing a middle deterioration state of the solder joint shown in FIG. FIG. 26 is a diagram illustrating a terminal deterioration state of the solder joint portion illustrated in FIG. With reference to FIGS. 24 to 26, the deterioration of the solder joint 40 with time will be described.

  As shown in FIG. 24, the solder joint portion 40 includes an external package solder fillet 41, an in-package solder fillet 42, and a lid lower solder joint portion 43. The package external solder fillet 41 is located outside the side plate portion 31 of the lid 30 and is exposed to the external environment. The in-package solder fillet 42 is located inside the side plate portion 31 of the lid 30 and is located in the accommodation space 3. The lid lower solder joint portion 43 is located between the side plate portion 31 and the pad electrode 20 and connects the outside package solder fillet 41 and the inside package solder fillet 42.

  In the initial state of deterioration, when the external solder fillet 41 comes into contact with high humidity outside air, the crack starting point 44 is formed by the above-described chemical reaction. On the other hand, since the solder fillet 42 in the package is located in the accommodating space 3 in which inert gas or dry air is enclosed, no change occurs in the solder fillet 42 in the package.

  Subsequently, as shown in FIG. 25, in the middle state of deterioration, the surface state of the external package solder fillet 41 is deteriorated and becomes a cracked state. Further, peeling and dropping of the lead small pieces from the crack starting point portion 44 proceed toward the inside, so that the crack 45 reaches the inside of the lid lower solder joint portion 43.

  Further, as shown in FIG. 26, in the final stage of deterioration, the surface state of the external package solder fillet 41 is further deteriorated, and a state in which many cracks can be observed. Further, the peeling and dropping of the lead small pieces in the crack 45 progress further toward the inside than the position in the intermediate state, so that the crack 45 reaches the surface of the in-package solder fillet 42. Thereby, the accommodation space 3 communicates with the external environment, and the airtightness of the electronic component package 101 is impaired.

  When the airtightness is impaired, it becomes difficult to protect the semiconductor element 2 mounted in the accommodation space 3 from moisture or the like in the external environment, and the characteristics of the semiconductor element 2 are deteriorated, Corroded. As described above, in the electronic component package 101 according to the comparative example, it is difficult to suppress the deterioration of the solder joint portion 40 over time, and it is difficult to exhibit the original electrical performance of the electronic component package 101.

(Experimental result)
In order to confirm the reliability of the moisture-proof film 60, the electronic component package 1 manufactured by the above-described manufacturing method of the electronic component package 1 according to Embodiment 1 of the present invention, and a step of applying a liquid resin in the manufacturing method An environmental resistance test was performed by actually using the electronic component package 101 according to the comparative example that was manufactured by omitting and has no moisture-proof film. As an environmental resistance test, a heat cycle test and a leak test were performed.

  The heat cycle test is a test for evaluating the electrical characteristics, mechanical characteristics, or physical characteristics of a sample with respect to temperature change by repeatedly exposing the sample at predetermined time intervals in a preset high or low temperature environment. In this experiment, the holding temperature in a low temperature environment was set to −30 ° C., and the holding temperature in a high temperature environment was set to 80 ° C. Moreover, the holding time of the sample in each environment was set to 30 minutes, and 1000 cycles were repeated.

  In addition, the leak test is a test for confirming leakage of the hermetic seal using gas. In this experiment, helium leak method was used in the following procedure. First, the sample was accommodated in a predetermined pressurizing tank, and after the inside of the pressurizing tank was evacuated, helium gas was supplied from the outside of the sample to pressurize the sample. Next, after the pressurization tank was opened to the atmosphere, the sample was taken out and again placed in a vacuum environment. At this time, the amount of released helium that entered the sample from the defect in the hermetic seal was measured.

  First, five electronic component packages 1 including the moisture-proof film 60 were prepared as samples according to the example, and five electronic component packages 101 not including the moisture-proof film 60 were prepared as samples according to the comparative example. The above heat cycle test was performed on each sample, and the exposed surface of the solder joint portion 40 located on the outer periphery of the lid 30 in the solder joint portion 40 was observed using a stereomicroscope. Since the moisture-proof film 60 is transparent, the exposed surface can be observed through the moisture-proof film 60 even in the electronic component package 1 including the moisture-proof film 60. Moreover, the above-mentioned leak test was implemented with respect to the sample after a heat cycle test. After the leak test, the sample was subjected to cross-sectional polishing so as to include the solder joint portion 40, and the solder joint portion 40 was observed using a metal microscope.

In the electronic component package 1 provided with the moisture-proof film 60, in all the five samples, there is no significant change in the exposed surface, and there is no occurrence of large cracks due to solder removal or corrosion, and high airtightness. Has been confirmed. The amount of leak detected in the leak test was about 1 × 10 ⁻⁹ (Pa · m ³ / s), and there was no problem. In the observation using the metal microscope, fine cracks were observed, but no discoloration was observed on the surface of the solder joint 40. Therefore, it was assumed that the crack was not caused by solder dropout or corrosion caused by adhesion of moisture in the external environment, but by thermal stress caused by thermal expansion or contraction during the heat cycle test. .

On the other hand, in the electronic component package 101 that does not include the moisture-proof film 60, the exposed surface is discolored in black brown in all five samples, and micro cracks, cracks due to solder removal and corrosion have occurred. Was confirmed. Moreover, the leak amount detected in the leak test was 1 × 10 ⁻⁶ (Pa · m ³ / s), and it was confirmed that the airtightness was not maintained. Further, in the observation using the metal microscope, a crack penetrating from the external environment toward the accommodation space 3 was observed in the solder joint portion 40. Thereby, it was confirmed that the external environment and the accommodation space 3 are communicated.

  From the above results, as in the electronic component package 1 according to the present embodiment described above, the moisture-proof film 60 that covers the exposed surface in the part located along the outer periphery of the side plate portion 31 in the solder joint portion 40 is formed. Thus, it has been confirmed that it is possible to prevent the solder from being detached or peeled off at the solder joint portion 40.

(Embodiment 2)
FIG. 27 is a schematic cross-sectional view showing a state in which the electronic component package according to Embodiment 2 of the present invention is mounted on a circuit board. FIG. 28 is a cross-sectional view of relevant parts in the vicinity of a broken line part XXVIII shown in FIG. 29 is a cross-sectional view of a principal part of the carrier substrate shown in FIG. The electronic component package 1A according to the present embodiment will be described with reference to FIGS.

  As shown in FIGS. 27 to 29, the electronic component package 1A according to the present embodiment is different from the electronic component package 1 according to the first embodiment in the configuration of the carrier substrate 10A. The difference is that the dam electrode 22 and the solder dam 46 are not formed, and a stepped portion as an outflow prevention means is formed on the mounting surface of the base material portion 11.

  Specifically, as shown in FIGS. 27 and 29, the carrier substrate 10 </ b> A includes a base material portion 11, a convex portion 14 as a step portion, and a pad as a first pattern formed on the mounting surface 12 side of the base material portion. The electrode 20 includes a BGA (Ball Grid Array) pad electrode 21 and a glass coat 50 </ b> A formed on the back surface 13 side of the substrate portion 11.

  The semiconductor element 2 is mounted on the mounting surface 12, and an annular pad electrode 20 is formed on the base material portion 11 so as to surround the mounting region 4 where the semiconductor element 2 is mounted.

  The convex portion 14 is located away from the pad electrode 20 and is formed in an annular shape along the periphery of the base material portion 11. The convex portion 14 is formed so as to protrude from the mounting surface 12. Furthermore, the convex part 14 is comprised by the member same as the base material part 11, and has a substantially rectangular shape in the cross section perpendicular | vertical to the direction extended in cyclic | annular form. The convex portion 14 has a damming surface 14a facing the solder joint portion 40 side.

  When the height of the convex portion 14 is higher than 100 μm, it is difficult to supply the solder paste using the screen printing mask in the step of supplying the solder paste. Therefore, the height of the convex portion 14 is 100 μm or less. Is preferred. This makes it possible to easily manufacture the electronic component package 1A.

  On the other hand, even when the height of the convex portion 14 is higher than 100 μm, by supplying the solder paste onto the pad electrode 20 using a dispenser, and at the position where the side plate portion 31 and the pad electrode 20 are in contact with each other. By printing or transferring a solder paste onto the side plate portion 31 of the lid 30 in advance, the side plate portion 31 can be soldered onto the pad electrode 20.

  The glass coat 50 </ b> A includes an inner glass coat 51 and an outer glass coat 53. The inner glass coat 51 is disposed so as to fill a gap between the mounting region 4 on which the semiconductor element 2 is mounted and the pad electrode 20, and the outer glass coat 53 is along the outer periphery so as to contact the pad electrode 20. It arrange | positions and is located inside the convex part 14. FIG.

  The moisture-proof film 60 is formed in the gap between the side plate portion 31 and the convex portion 14 so as to cover the exposed surface of the solder joint portion 40 at a portion located along the outer periphery of the side plate portion 31. At least a part of the end portion of the moisture-proof film 60 located on the opposite side of the side plate portion 31 is in contact with the damming surface 14a.

  In the electronic component package 1A according to the present embodiment, the configuration including the convex portion 14 and the moisture-proof film 60 formed on the base material portion 11 as described above is used. The same effect as the electronic component package can be obtained.

  Next, a method for manufacturing the electronic component package 1A according to the present embodiment will be described. As described above, the electronic component package 1A according to the present embodiment has a configuration having the convex portion 14, and therefore, in the manufacturing method, the state at the end of the step of applying the liquid resin is the same as that in the first embodiment. This is different from the manufacturing method of the electronic component package.

  In the electronic component package according to the present embodiment, first, carrier substrate 10A having the above-described configuration is prepared. Thereby, the carrier substrate 10A including the base material part 11 provided with the convex part 14 as the step part, the pad electrode 20, and the pad electrode 20 as the first conductive pattern is prepared. Here, the plurality of convex portions 14 are arranged such that, for example, the end portions of the plurality of green sheets corresponding to the base material portion 11 coincide with the end portions of the plurality of frame-shaped green sheets corresponding to the convex portions 14. When the green sheets are stacked and pressed, the green sheets can be formed along the periphery of the base material portion 11.

  Here, in the carrier substrate 10A, a conductor paste layer and a glass paste layer are applied to the mounting surface 12 side of the base material portion 11 on which the convex portions 14 are formed in advance, and these are simultaneously pressure-molded using a press device. Manufactured by firing.

  Subsequently, in the first to third steps of supplying the solder paste, forming the solder joint, mounting the semiconductor element, and welding the top plate, the manufacturing method according to the first embodiment Almost the same processing is performed.

  Next, in the step of applying the liquid resin, the outer periphery of the lid 30 and the convex portion 14 are covered with the dispenser 75 so as to cover the exposed surface of the solder joint portion 40 in the portion located along the outer periphery of the side plate portion 31. A liquid resin 61 is applied to the gap between them. A portion of the liquid resin 61 that flows along the slope of the exposed surface is dammed by the convex portion 14 by coming into contact with the damming surface 14a, and the outflow is suppressed. Thereby, it is possible to prevent the liquid resin 61 having a low viscosity from spreading randomly.

  FIG. 30 is a schematic cross-sectional view showing a state at the end of the step of forming the moisture-proof film in the method for manufacturing an electronic component package according to Embodiment 2 of the present invention.

  Subsequently, as shown in FIG. 30, in the step of forming the moisture-proof film 60, the same process as in the manufacturing method according to the first embodiment is performed, the liquid resin 61 is cured, and the moisture-proof film 60 is formed. Next, in the process of attaching the solder balls, the same process as in the manufacturing method according to the first embodiment is performed, and the reflow process is performed with the solder balls mounted on the solder paste. Thereby, the solder paste and the solder ball 92 are melted and integrated, and the joining of the base material portion 11 and the solder ball 92 is completed.

  As described above, the electronic component package 1A according to the present embodiment described above is manufactured. Note that the electronic component package 1A can be mounted on the circuit board 90 in the same manner as the electronic component package 1 according to the first embodiment.

  FIG. 31 is a schematic plan view showing a layout in a mother board when a plurality of electronic component packages according to Embodiment 2 of the present invention are manufactured. 32 is a cross-sectional view of the mother board shown in FIG. 31 taken along line XXXII-XXXII. A case where a plurality of electronic component packages 1 according to the present embodiment are manufactured simultaneously will be described with reference to FIGS. 31 and 32.

  Also in the present embodiment, a plurality of electronic component packages 1A can be formed simultaneously as in the case of the first embodiment. As shown in FIGS. 31 and 32, a plurality of patterns such as the pad electrode 20 and the glass coat 50A are collectively formed on a single mother substrate 7 on which the convex portions 14 are formed. By performing each process described above, the mother substrate 7 on which the plurality of electronic component packages 1A are mounted is manufactured. Thereafter, the mother substrate 7 is cut along the cutting lines 5 and 6, whereby a plurality of electronic component packages 1A are cut out. Thereby, the plurality of electronic component packages 1A are manufactured simultaneously.

  As described above, by adopting the electronic component package 1A manufacturing method according to the present embodiment, the solder joint 40 can be deteriorated at a low cost as in the electronic component package 1 manufacturing method according to the first embodiment. An electronic component package that can be suppressed can be manufactured. In the manufacturing method of electronic component package 1A in the present embodiment, since the solder dam electrode and the solder dam are not formed, the manufacturing cost can be further reduced.

  Also in the electronic component package 1A according to the present embodiment, in order to confirm the reliability of the moisture-proof film 60, a sample under the same conditions as the sample according to the first embodiment is actually manufactured and used. An environmental resistance test was conducted. As a result, a test result almost similar to the test result according to Embodiment 1 was obtained in this test. Therefore, it was confirmed that in the electronic component package 1 </ b> A according to the present embodiment, it is possible to prevent the solder from dropping or peeling off at the solder joint portion 40 by forming the moisture-proof film 60.

(Embodiment 3)
FIG. 33 is a schematic cross-sectional view showing a state in which the electronic component package according to Embodiment 3 of the present invention is mounted on a circuit board. 34 is a main-portion cross-sectional view in the vicinity of a broken line XXXIV shown in FIG. FIG. 35 is a cross-sectional view of a principal part of the carrier substrate shown in FIG. The electronic component package 1B according to the present embodiment will be described with reference to FIGS.

  As shown in FIGS. 33 to 35, the electronic component package 1B according to the present embodiment is different in the configuration of the carrier substrate 10B from the electronic component package 1A according to the second embodiment, and the base material portion 11 in that the stepped portion formed on the mounting surface 12 is a recess 15. Regarding other configurations, the electronic component package 1B according to the present embodiment is substantially the same as the electronic component package 1A according to the second embodiment.

  The recess 15 is formed in an annular shape along the outer periphery of the pad electrode 20 at a position separated from the pad electrode 20 by a predetermined distance. The recess 15 is formed so as to be recessed from the mounting surface 12 and has a substantially rectangular shape in a cross section perpendicular to the direction extending in an annular shape. Further, the recess 15 has a damming surface 15 a facing the solder joint 40. The recess 15 is formed so that the inner layer wiring 24 is exposed. However, the present invention is not limited to this, and the recess 15 may be configured not to reach the inner layer wiring 24.

  The moisture-proof film 60 is formed in a gap between the side plate portion 31 and the concave portion 15 so as to cover the exposed surface of the solder joint portion 40 at a portion located along the outer periphery of the side plate portion 31. At least a part of the end portion of the moisture-proof film 60 located on the opposite side of the side plate portion 31 is in contact with the damming surface 15a.

  In the electronic component package 1B according to the present embodiment, the electronic device according to the second embodiment is configured by including the recess 15 and the moisture-proof film 60 formed on the base material portion 11 as described above. The same effect as the component package can be obtained.

  Next, the manufacturing method of the electronic component package 1B according to the present embodiment will be described. However, the manufacturing method of the electronic component package 1B according to the present embodiment is different only in the configuration of the carrier substrate 10B to be prepared. This is almost the same as the manufacturing method of the electronic component package 1A according to the second embodiment.

  The electronic component package 1B according to the present embodiment first includes the carrier substrate 10B having the above-described configuration, that is, the base material portion 11 and the pad electrode 20 provided with the recess 15 as the step portion. A carrier substrate 10B is prepared. Here, the recess 15 is formed by, for example, laminating and pressing a plurality of green sheets having a frame-shaped opening corresponding to the recess 15.

Subsequently, in the step of supplying a liquid resin in the step of supplying a solder paste, the first to third steps of solder bonding, the step of mounting the semiconductor element 2, and the step of welding the top plate, according to the second embodiment. Processes similar to those of the manufacturing method are performed.

  In the step of applying the liquid resin, the dispenser 75 is used to cover the exposed surface of the solder joint portion 40 along the outer periphery of the side plate portion 31 between the outer periphery of the lid 30 and the recess 15. Liquid resin 61 is applied to the gap. A portion of the liquid resin 61 that flows along the slope of the exposed surface is blocked by the recess 15 by contacting the blocking surface 15a, and the outflow is suppressed.

  FIG. 36 is a schematic cross-sectional view showing a state at the end of the step of forming the moisture-proof film in the method for manufacturing the electronic component package 1B according to Embodiment 1 of the present invention.

  Subsequently, in the step of forming the moisture-proof film 60, the same process as in the manufacturing method according to the second embodiment is performed, the liquid resin 61 is cured, and the moisture-proof film 60 is formed. Next, in the process of attaching the solder balls, the same process as in the manufacturing method according to the second embodiment is performed, and the reflow process is performed in a state where the solder balls are mounted on the solder paste. Thereby, the solder paste and the solder ball 92 are melted and integrated, and the joining of the base material portion 11 and the solder ball 92 is completed.

  Thus, the electronic component package 1B according to the present embodiment described above is manufactured. The electronic component package 1B can be mounted on the circuit board 90 in the same manner as the electronic component package 1A according to the second embodiment.

  FIG. 37 is a schematic plan view showing a layout in a mother board when a plurality of electronic component packages according to Embodiment 3 of the present invention are manufactured. FIG. 38 is a cross-sectional view of the mother board shown in FIG. 37 taken along line XXXVIII-XXXVIII. A case where a plurality of electronic component packages 1B according to the present embodiment are manufactured simultaneously will be described with reference to FIGS.

  Also in the present embodiment, a plurality of electronic component packages 1B can be formed at the same time as in the second embodiment. As shown in FIGS. 37 and 38, a plurality of patterns such as pad electrodes 20 and glass coats 50 are collectively formed on one mother substrate 7 in which the recesses 15 are formed. The mother substrate 7 on which a plurality of electronic component packages are mounted is manufactured by performing each process in the same manufacturing process. Thereafter, the mother substrate 7 is cut along the cutting lines 5 and 6 to simultaneously manufacture a plurality of electronic component packages 1B.

  As described above, by adopting the method for manufacturing the electronic component package 1B according to the present embodiment, the solder joint portion 40 can be manufactured at a low cost in substantially the same manner as the method for manufacturing the electronic component package 1 according to the second embodiment. An electronic component package capable of suppressing deterioration can be manufactured.

  Also in the electronic component package 1B according to the present embodiment, in order to confirm the reliability of the moisture-proof film 60, a sample having the same conditions as the sample according to the first embodiment is manufactured and an environmental resistance test is performed. As a result, in the test, a test result almost similar to the test result according to the first embodiment was obtained. Therefore, it has been confirmed that also in the electronic component package 1 </ b> B according to the present embodiment, it is possible to prevent the solder from dropping or peeling off at the solder joint portion 40 by forming the moisture-proof film 60.

(Embodiment 4)
FIG. 39 is a schematic cross-sectional view showing a state where an electronic component package according to Embodiment 4 of the present invention is mounted on a circuit board. With reference to FIG. 39, an electronic component package 1D according to the fourth embodiment will be described.

  As shown in FIG. 39, the electronic component package 1D according to the present embodiment differs from the electronic component package 1A according to the second embodiment only in the position of the convex portion 14D. Specifically, the convex portion 14 </ b> D is formed in an annular shape along the outer periphery of the pad electrode 20 at a position separated from the pad electrode 20 by a predetermined distance. Other configurations are the same as those of the electronic component package 1A according to the second embodiment. Thereby, the electronic component package 1D according to the present embodiment can obtain substantially the same effect as the electronic component package 1A according to the second embodiment.

  The manufacturing method of the electronic component package 1 according to the present embodiment is different from the manufacturing method of the electronic component package 1A according to the second embodiment only in the configuration of the carrier substrate 10D to be prepared. 2 is substantially the same as the manufacturing method of the electronic component package 1A according to 2. Here, the convex portion 14D is formed by laminating a plurality of frame-shaped green sheets corresponding to the convex portion 14D on the plurality of green sheets corresponding to the base portion 11 and pressurizing them to thereby form the convex portion 14D on the base portion 11. Can be formed. Compared with the second embodiment, since the convex portion 14D is closer to the pad electrode 20 side, when it is difficult to supply the solder paste using the screen printing mask in the step of supplying the solder paste, a dispenser is used. It is preferable to use the solder paste to supply the pad electrode 20. Furthermore, since the convex portion 14D approaches the pad electrode 20 side as compared with the second embodiment, it is preferable to reduce the application amount in the step of applying the liquid resin.

  As described above, by adopting the manufacturing method of electronic component package 1D in the present embodiment, it is possible to obtain substantially the same effect as the manufacturing method of electronic component package 1A according to the second embodiment. Moreover, since convex part 14D approaches the pad electrode 20 side, even if the liquid resin applied by irregularity slightly exceeds convex part 14D, the liquid resin exceeding convex part 14D wraps around on the back side. This can be suppressed. As a result, the electronic component package 1D can be more reliably mounted on the circuit board 90.

  In the first to fourth embodiments of the present invention described above, the case where the solder dam 46, the solder dam electrode 22, the convex portions 14 and 14D, and the concave portion 15 are continuously extended and arranged in an annular shape is illustrated. However, the present invention is not limited to this, and the liquid resin 61 may be intermittently extended so as to prevent the flow of the liquid resin 61 and arranged in an annular shape.

  In the first to fourth embodiments of the present invention, in the electronic component package manufacturing method, after the side plate portion 31 of the lid 30 is soldered to the pad electrode 20, the top plate portion 32 of the lid 30 is changed to the side plate portion. However, the present invention is not limited to this, and the lid 30 is connected to the pad electrode in an inert gas environment or a dry air environment after the top plate portion 32 is seam welded to the side plate portion 31. 20 may be soldered.

  Further, in the first to fourth embodiments of the present invention, the case where the step of attaching the solder ball 92 in the method of manufacturing the electronic component package is after the step of applying the liquid resin 61 has been described as an example. Without being limited thereto, the step of attaching the solder ball 92 may be before the step of applying the liquid resin 61. In this case, there is no need to re-heat the liquid resin 61 after curing the liquid resin 61, so that the heat resistance condition is relaxed when selecting the liquid resin.

  In addition, in the first to fourth embodiments of the present invention, the mother substrate 7 is subjected to each process in each manufacturing process on a plurality of individual patterns formed on the mother substrate 7 in multi-chamfering. However, the present invention is not limited to this. The mother substrate 7 on which a plurality of individual patterns are formed is divided to manufacture a plurality of carrier substrates, and then each process is performed in each manufacturing process. May be used to manufacture a plurality of electronic component packages.

  Further, in the second to fourth embodiments of the present invention, the case where the convex portions 14 and 14D or the concave portion 15 have a rectangular shape in a cross section perpendicular to the annular extending direction has been described as an example. It is not limited to this, It is good also as a structure which has triangular shape, polygonal shape, and semicircle shape. Even in such a configuration, since it has a damming surface facing the solder joint portion 40 side, the flow of the liquid resin 61 can be suppressed when the moisture-proof film 60 is formed.

  Although the embodiments of the present invention have been described above, the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, and includes meanings equivalent to the terms of the claims and all modifications within the scope.

  1, 1A, 1B, 1D electronic component package, 2 semiconductor element, 3 accommodating space, 4 regions, 5, 6 cutting line, 7 mother substrate, 10, 10A, 10B, 10C, 10D carrier substrate, 11 base material portion, 12 Mounting surface, 13 back surface, 14, 14D convex portion, 14a damming surface, 15 concave portion, 15a damming surface, 20 pad electrode, 21 BGA pad electrode, 22 solder dam electrode, 23 via hole, 24 inner layer wiring, 30 lid, 31 side plate part, 32 top plate part, 40 solder joint part, 46 solder dam, 46a damming surface, 47 solder paste, 50, 50A glass coat, 51 inner glass coat, 52 central glass coat, 53 outer glass coat, 60 moisture proof Film, 61 liquid resin, 71 screen printing mask, 72 squeegee, 73 roller electrode, 4 Bearing part, 75 Dispenser, 90 Circuit board, 91 Circuit board pad electrode, 92 Solder ball, 101 Electronic component package, 102 Semiconductor element, 103 Housing space, 104 area, 110 Carrier board, 111 Base part, 112 Mounting surface, 113 Back surface, 120 pad electrode, 121 BGA pad electrode, 130 lid, 131 side plate portion, 132 top plate portion, 140 solder joint portion, 141 outer solder fillet, 142 inner solder fillet, 143 lower lid solder joint portion, 144 crack starting point portion 145 crack, 190 circuit board, 191 circuit board pad electrode, 192 solder ball.

Claims (8)

An electronic component package having a storage space for storing an electronic component,
A base material portion including a mounting surface on which the electronic component is mounted;
A ring-shaped first conductive pattern provided on the mounting surface so as to surround a mounting region on which the electronic component is mounted;
A lid that includes a top plate portion and a side plate portion, and the side plate portion is disposed on the first conductive pattern so as to define the accommodation space between the base portion,
A solder joint for joining the side plate portion of the lid and the first conductive pattern;
A moisture-proof film made of a cured liquid resin provided so as to cover the exposed surface of the solder joint portion of the portion located along the outer periphery of the side plate portion;
The liquid resin flows out by having a damming surface provided on the mounting surface so as to be spaced apart from the first conductive pattern along the outer periphery of the first conductive pattern and facing the solder joint side. An electronic component package comprising an annular-shaped outflow prevention portion capable of preventing   The outflow prevention portion includes an annular second conductive pattern provided on the mounting surface so as to be spaced apart from the first conductive pattern along an outer periphery of the first conductive pattern, and the second conductive The electronic component package according to claim 1, comprising a solder dam provided on the pattern.   The said outflow prevention part consists of an annular | circular shaped level | step-difference part provided in the said mounting surface so that it may be spaced apart from the said 1st conductive pattern along the outer periphery of the said 1st conductive pattern. Electronic component package.   The electronic component package according to claim 3, wherein the stepped portion is constituted by a convex portion provided on the mounting surface.   The electronic component package according to claim 4, wherein the convex portion is formed along a peripheral edge of the base material portion.   The electronic component package according to claim 3, wherein the stepped portion is configured by a recess provided on the mounting surface. A method of manufacturing an electronic component package according to claim 2,
Preparing a carrier substrate including the base material portion, the first conductive pattern, and the second conductive pattern;
Disposing the side plate portion of the lid on the carrier substrate, and forming the solder joint portion by joining the side plate portion and the first conductive pattern using solder;
Forming the solder dam on the second conductive pattern;
Forming a moisture-proof film by applying and curing a liquid resin on the exposed surface of the solder joint. It is a manufacturing method of the electronic component package according to claim 3,
A step of preparing a carrier substrate including the base material portion provided with the stepped portion and the first conductive pattern;
Disposing the side plate portion of the lid on the carrier substrate, and forming the solder joint portion by joining the side plate portion and the first conductive pattern using solder;
Forming a moisture-proof film by applying and curing a liquid resin on the exposed surface of the solder joint.

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