JP5925356B2 - Method for manufacturing waterproof electronic device - Google Patents

Method for manufacturing waterproof electronic device Download PDF

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JP5925356B2
JP5925356B2 JP2015079833A JP2015079833A JP5925356B2 JP 5925356 B2 JP5925356 B2 JP 5925356B2 JP 2015079833 A JP2015079833 A JP 2015079833A JP 2015079833 A JP2015079833 A JP 2015079833A JP 5925356 B2 JP5925356 B2 JP 5925356B2
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gap
housing
electronic device
connector member
sealing resin
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JP2015211220A (en
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亮二 ▲崎▼
亮二 ▲崎▼
英也 西川
英也 西川
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Mitsubishi Electric Corp
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Description

本発明は、電子装置を収納した防水型電子装置の製造方法に関するものである。   The present invention relates to a method for manufacturing a waterproof electronic device containing an electronic device.

例えば、従来の車載用の防水型制御ユニットとして、回路基板に固定されるコネクタハウジングとカバーとを別体構造として、回路基板の一辺に設けられたコネクタハウジングの端面を外部に覗かせながら、筐体の第一部分となるベースと、筐体の第二部分となるカバーと、コネクタハウジングが一体成形され筐体の第三部分となる端蓋とによって回路基板を水密収納してなる構造は公知である。この形態の防水型制御ユニットはコネクタハウジングとカバーとを一体成形した形式のものに比べて、コネクタ部分の標準化を行うのに適しているが、カバーとベース間における防水シール構造に加えて、カバーと端蓋間及び端蓋とベース間の防水構造が必要となる。   For example, as a conventional waterproof control unit for in-vehicle use, a connector housing fixed to a circuit board and a cover are separated from each other, and the end face of the connector housing provided on one side of the circuit board is looked out to the outside. A structure in which a circuit board is watertightly accommodated by a base that is a first part of a body, a cover that is a second part of a housing, and an end lid that is integrally formed with a connector housing and is a third part of the housing is known. is there. This type of waterproof control unit is suitable for standardization of the connector part compared to the type in which the connector housing and cover are integrally molded, but in addition to the waterproof seal structure between the cover and the base, the cover And a waterproof structure between the end cover and between the end cover and the base are required.

例えば、従来の防水型電子装置として、回路基板に接続された外部接続端子を有するコネクタ部材と、上記回路基板の裏面及び上記コネクタ部材の外周シール部の下部を、上記外部接続端子を外部に覗かせた状態で覆うように配置されて筐体の第一部分を構成するベースと、上記回路基板の表面及び上記コネクタ部材の外周シール部の残部を覆うように配置されて上記筐体の第二部分を構成するカバーとを備え、上記ベースと上記カバーの外周部相互が、直接対向されて水密シールされる第1シール部と、上記コネクタ部材の外周シール部を介して水密シールされ、上記第1シール部に対して2つの交点部をもつ第2シール部を有し、上記水密シールは何れも対向面にそれぞれ形成された凹溝部と凸部からなる凹凸面がシール材を介して互いにかみ合うように密着されてなる構造が示されている(例えば特許文献1参照)。
また、液晶表示パネルのセル領域の周囲にシール材を塗布し、このシール材で部品間の隙間を密着させる技術が示されている(例えば特許文献2参照)。
For example, as a conventional waterproof electronic device, a connector member having an external connection terminal connected to a circuit board, a back surface of the circuit board and a lower part of the outer peripheral seal portion of the connector member, and the external connection terminal are viewed outside. A base that constitutes the first part of the casing disposed so as to cover in a covered state, and a second part of the casing that is disposed so as to cover the surface of the circuit board and the remainder of the outer peripheral seal portion of the connector member The base and the outer peripheral part of the cover are directly opposed to each other and are watertight sealed, and the outer peripheral seal part of the connector member is watertightly sealed, and the first A second seal portion having two intersections with respect to the seal portion, and each of the watertight seals has a concave and convex surface formed by a concave groove portion and a convex portion formed on the opposing surface, respectively, with a sealant interposed therebetween. Adhesion is made by structure to engage is shown (for example, see Patent Document 1).
In addition, a technique is disclosed in which a sealing material is applied around the cell region of a liquid crystal display panel, and a gap between components is adhered with the sealing material (see, for example, Patent Document 2).

特開2012−69611号公報JP 2012-69611 A 特許第4854728号公報Japanese Patent No. 4854728

例えば、コネクタ部材とハウジングを防水シールする場合、シール材をあらかじめハウジングのコネクタ部材の組み合わせ部に充填する必要があった。しかし、このコネクタ部材の組み付けにより、ハウジングに設けられた凹溝からシール材が掻き出されてしまう。そのため、筐体部品の組み合わせ部におけるシール性の確保が難しかった。また、シール材がはみ出しても十分シール材が充填できているように管理する必要があった。さらに、ハウジングにコネクタ部材を組み付け後に、シール性を視覚的に確認することができないという問題があった。   For example, when the connector member and the housing are waterproof-sealed, it has been necessary to fill the combination of the connector members of the housing in advance with a sealing material. However, the assembly of the connector member causes the sealing material to be scraped out from the concave groove provided in the housing. For this reason, it has been difficult to ensure the sealing performance in the combination part of the casing parts. Further, it is necessary to manage the sealing material so that the sealing material is sufficiently filled even if the sealing material protrudes. Further, there is a problem that the sealing performance cannot be visually confirmed after the connector member is assembled to the housing.

この発明は、上記のような問題を解決するためになされたものであり、部品の組み付けによるシール材の掻き出しがなく、筐体を構成する部品の組み付け後におけるシール材の充填状況を確認可能な防水型電子装置の製造方法を提供することを目的とする。   The present invention has been made to solve the above-described problems, and there is no scraping of the sealing material due to the assembly of the components, and the state of filling of the sealing material after the assembly of the components constituting the housing can be confirmed. An object of the present invention is to provide a method for manufacturing a waterproof electronic device.

この発明に係わる防水型電子装置の製造方法は、筐体本体部に筐体構成部が組み付けられ、上記筐体本体部と上記筐体構成部が協同して電子装置を収納するステップ、上記筐体本体部の上記筐体構成部との突き合わせ面に形成された第一の嵌合部と、上記筐体構成部の上記筐体本体部との突き合わせ面に形成された、上記第一の嵌合部に嵌合する第二の嵌合部の間の間隙部に、封止樹脂を加圧注入するとともに、上記間隙部の空気を吸引するステップ、上記電子装置を封止する筐体蓋部を上記筐体本体部および上記筐体構成部に組み付けるステップを含むことを特徴とするものである。   The waterproof electronic device manufacturing method according to the present invention includes a step in which a housing component is assembled to a housing body, and the housing body and the housing component cooperate to house the electronic device. The first fitting portion formed on the abutting surface of the body main body portion with the housing main body portion and the first fitting portion formed on the abutting surface of the housing main body portion with the housing main body portion. A step of pressure-injecting sealing resin into a gap between the second fitting parts fitted into the joint part and sucking air in the gap part; a housing lid part for sealing the electronic device Including a step of assembling to the housing body and the housing component.

この発明の防水型電子装置の製造方法によれば、筐体本体部と筐体構成部の突き合わせ面に形成された、第一の嵌合部と第二の嵌合部の間の間隙部に、封止樹脂を加圧注入するとともに、間隙部の空気を吸引するステップを含むため、間隙部への封止樹脂の十分な充填が可能であり、間隙部の空気を吸引する端部を樹脂充填の確認窓として用いることが可能である。   According to the waterproof electronic device manufacturing method of the present invention, the gap between the first fitting portion and the second fitting portion, which is formed on the abutting surface of the casing main body portion and the casing component portion, is formed. In addition, the step of injecting the sealing resin under pressure and sucking the air in the gap portion includes a step of sufficiently filling the gap portion with the sealing resin, and the end portion for sucking the air in the gap portion is made of resin. It can be used as a filling confirmation window.

本発明の実施の形態1による防水型電子装置の筐体全体の外観を示す斜視図である。It is a perspective view which shows the external appearance of the whole housing | casing of the waterproof type electronic device by Embodiment 1 of this invention. 実施の形態1の防水型電子装置の筐体本体部の斜視図である。FIG. 3 is a perspective view of a casing main body portion of the waterproof electronic device according to the first embodiment. 図2のA領域の拡大平面図であり、実施の形態1の筐体本体部のコネクタ部材組み付け部の要部平面図である。FIG. 3 is an enlarged plan view of a region A in FIG. 図2のB領域の拡大図であり、実施の形態1の筐体本体部のコネクタ部材組み付け部の要部斜視図である。FIG. 3 is an enlarged view of a region B of FIG. 実施の形態1の防水型電子装置のコネクタ部材の斜視図である。3 is a perspective view of a connector member of the waterproof electronic device according to Embodiment 1. FIG. 実施の形態1の防水型電子装置のコネクタ部材の断面図である。FIG. 3 is a cross-sectional view of the connector member of the waterproof electronic device according to the first embodiment. 実施の形態1の防水型電子装置の筐体蓋部を示す斜視図である。FIG. 3 is a perspective view illustrating a housing lid portion of the waterproof electronic device according to the first embodiment. 実施の形態1の防水型電子装置の筐体本体部にコネクタ部材を組み付けた状態を示す斜視図である。FIG. 3 is a perspective view illustrating a state in which a connector member is assembled to the housing body of the waterproof electronic device according to the first embodiment. 実施の形態1の防水型電子装置の筐体本体部にコネクタ部材を組み付けた状態を示す断面図である。FIG. 3 is a cross-sectional view illustrating a state in which a connector member is assembled to the housing main body of the waterproof electronic device according to the first embodiment. コネクタ部材と筐体本体部との組み付け部にシール材を注入する場合の概略斜視図である。It is a schematic perspective view in case a sealing material is inject | poured into the assembly | attachment part of a connector member and a housing body part. 実施の形態1の防水型電子装置の筐体本体部裏面側を示す平面図である。FIG. 3 is a plan view showing the back side of the casing main body of the waterproof electronic device according to the first embodiment. 実施の形態1の防水型電子装置の要部断面図である。1 is a cross-sectional view of a main part of a waterproof electronic device according to a first embodiment. 本発明の実施の形態2による防水型電子装置のコネクタ部材と筐体本体部との組み付け部にシール材を注入する場合の概略斜視図である。It is a schematic perspective view in the case of inject | pouring a sealing material into the assembly | attachment part of the connector member and housing | casing main-body part of the waterproof electronic device by Embodiment 2 of this invention. 本発明の実施の形態3による防水型電子装置の筐体本体部の斜視図である。It is a perspective view of the housing | casing main-body part of the waterproof electronic device by Embodiment 3 of this invention. 実施の形態3の防水型電子装置の筐体本体部の要部断面図である。FIG. 10 is a main-portion cross-sectional view of a housing main body portion of a waterproof electronic device according to a third embodiment.

実施の形態1.
本発明の実施の形態1の防水型電子装置について図1から図12を用いて説明する。
図1に示すように、制御ユニットである防水型電子装置100は、アルミダイキャスト製の筐体本体部1と、筐体本体部1内部の平面部1a上面側に実装された電子装置(図示せず)と、筐体本体部1の平面部1aから立ち上がる側面部1bの開口部を密閉し、側面部1bと協同して筒形側面部を構成し電子装置を取り囲むとともに外部接続端子を有するコネクタ部材2(筐体構成部に相当する。)と、筐体本体部1の側面部1bとコネクタ部材2とで構成される筒形側面部の開口側の同一面(上面)に組み付けられ、電子装置を実装した筐体内部の空間を密閉する筐体蓋部3によって主に構成されている。つまり、防水型電子装置100の筐体は、筐体本体部1、コネクタ部材(筐体構成部)2、筐体蓋部3によって構成される。筐体本体部1の平面部(底面部)1aと側面部1bは一体構造である。
Embodiment 1 FIG.
A waterproof electronic device according to a first embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, a waterproof electronic device 100, which is a control unit, includes an aluminum die-cast housing main body 1 and an electronic device (see FIG. 1) mounted on the upper surface side of a flat portion 1a inside the housing main body 1. Not shown) and the opening of the side surface portion 1b rising from the flat surface portion 1a of the housing main body portion 1 are sealed, and the cylindrical side surface portion is formed in cooperation with the side surface portion 1b to surround the electronic device and has an external connection terminal. It is assembled to the same surface (upper surface) on the opening side of the cylindrical side surface portion constituted by the connector member 2 (corresponding to the housing constituent portion), the side surface portion 1b of the housing main body portion 1 and the connector member 2, It is mainly configured by a casing lid portion 3 that seals a space inside the casing on which the electronic device is mounted. That is, the casing of the waterproof electronic device 100 includes the casing main body 1, the connector member (housing component) 2, and the casing lid 3. The flat surface portion (bottom surface portion) 1a and the side surface portion 1b of the housing main body 1 have an integral structure.

図2に防水型電子装置100の筐体本体部1の斜視図を示すように、筐体本体部1のコネクタ部材2が組み付けられる開口部には、その突き合わせ面に凹形状の第一の嵌合部となる溝部4a、4bが設けられている。筐体本体部1の側面部1bの端部にはテーパー面に凹形状の溝部4aが、平面部1aの突き合わせ面には凹形状の溝部4bが形成されている。それら第一の嵌合部である溝部4a、4bは、コネクタ部材2の凸形状の第二の嵌合部に組み付けられる部分であるため、コネクタ部材2側の第二の嵌合部である凸形状部と同じ外形形状の突き合わせ面を持つように形成されている。
また、平面部1aの凹形状の溝部4bの中央部分には、平面部1aの裏面側まで到達する穴部4cが形成されている。この穴部4cは、溝部4a、4bに樹脂が注入される場合に、充填空間の空気を吸引する吸引口となるとともに、樹脂充填を確認する確認窓となる。
なお、筐体本体部1の側面部1b上端には、筐体蓋部3を嵌合させるための凸形状部4dが形成されている。
As shown in a perspective view of the housing main body 1 of the waterproof electronic device 100 in FIG. 2, a concave first fitting is formed on the abutment surface of the opening in which the connector member 2 of the housing main body 1 is assembled. Groove portions 4a and 4b are provided as joint portions. A concave groove 4a is formed on the tapered surface of the end portion of the side surface 1b of the housing body 1, and a concave groove 4b is formed on the abutting surface of the flat surface 1a. Since these groove portions 4a and 4b which are the first fitting portions are parts assembled to the convex second fitting portion of the connector member 2, the convex portions which are the second fitting portions on the connector member 2 side. It is formed so as to have a butt surface having the same outer shape as the shape portion.
Moreover, the hole 4c which reaches | attains the back surface side of the plane part 1a is formed in the center part of the concave groove part 4b of the plane part 1a. The hole 4c serves as a suction port for sucking air in the filling space when resin is poured into the grooves 4a and 4b, and also serves as a confirmation window for confirming resin filling.
A convex shaped portion 4 d for fitting the case lid 3 is formed at the upper end of the side face 1 b of the case body 1.

図3は、図2の領域Aの拡大平面図であり、実施の形態1の筐体本体部1のコネクタ部材2組み付け部の要部平面図を示す図である。図3に示すように、筐体本体部1の開口部にはコネクタ部材2を組み付けるために凹形状の溝部4a、4bを有しており、側面部1bの傾斜した突き合わせ面部5aの中央部分には溝部4aが、平面部1aには溝部4bが形成されている。側面部1bとコネクタ部材2によって、略円筒形の筒形側面部が構成される場合、平面部1aに形成される溝部4bは円弧形状となるように形成される。   FIG. 3 is an enlarged plan view of region A in FIG. 2, and is a diagram illustrating a plan view of a main part of the connector member 2 assembly portion of the housing main body 1 according to the first embodiment. As shown in FIG. 3, the opening of the housing body 1 has concave grooves 4 a and 4 b for assembling the connector member 2, and a central portion of the inclined butted surface 5 a of the side 1 b. The groove portion 4a is formed on the flat surface portion 1a. When the substantially cylindrical cylindrical side surface portion is constituted by the side surface portion 1b and the connector member 2, the groove portion 4b formed in the flat surface portion 1a is formed to have an arc shape.

図4に、図2のB領域の拡大図であり、実施の形態1の筐体本体部1のコネクタ部材2組み付け部の要部斜視図を示すように、コネクタ部材2を組み付ける筐体本体部1の側面部1bの突き合わせ面部5aは、テーパー形状に形成されており、筐体本体部1の開口部が、筐体蓋部3を組み付ける側面部1b上端側から下端側(電子装置の実装面となる平面部1a上面)に向かって開口幅が小さくなるような傾斜となっている。   FIG. 4 is an enlarged view of region B in FIG. 2, and shows a perspective view of the main part of the connector member 2 assembly portion of the housing body portion 1 according to the first embodiment. The abutting surface portion 5a of the side surface portion 1b is formed in a taper shape, and the opening portion of the housing body portion 1 extends from the upper end side to the lower end side (the mounting surface of the electronic device). The opening width is inclined toward the upper surface of the flat portion 1a).

図5に防水型電子装置100のコネクタ部材2の斜視図を、図6にコネクタ部材2の断面図を示すように、コネクタ部材2は、筐体本体部1の側面部1bに組み付けられる突き合わせ面部(図5の左右方向)がテーパー形状に形成され、筐体本体部1側の溝部4aに嵌合する凸形状部6aを有している。また、コネクタ部材2の上側には筐体蓋部3に組み付けられる凸形状部6bが、コネクタ部材2の下側には筐体本体部1の平面部1aに組み付けられる凸形状部6cがそれぞれ形成されている。これら凸形状部6a、6b、6cが形成された面部が、筐体本体部1または筐体蓋部3に組み付けられる突き合わせ面である。
なお、コネクタ部材2は、凸形状部6a、6cの外周部に十分柔軟性のあるシリコンゴムのような部品(図示せず)が取り付けられており、この部品によって筐体本体部1の開口部にコネクタ部材2が組み付けられた場合に、接触面(突き合わせ面)間の隙間を完全に封止する。
FIG. 5 is a perspective view of the connector member 2 of the waterproof electronic device 100, and FIG. 6 is a cross-sectional view of the connector member 2. The connector member 2 is a butted surface portion assembled to the side surface portion 1b of the housing body 1. (The left-right direction in FIG. 5) is formed in a tapered shape, and has a convex portion 6a that fits into the groove portion 4a on the housing body 1 side. Further, a convex shape portion 6b to be assembled to the housing lid portion 3 is formed on the upper side of the connector member 2, and a convex shape portion 6c to be assembled to the flat portion 1a of the housing main body portion 1 is formed on the lower side of the connector member 2, respectively. Has been. The surface portion on which the convex portions 6 a, 6 b, and 6 c are formed is a butting surface that is assembled to the housing body 1 or the housing lid 3.
The connector member 2 is provided with a sufficiently flexible part (not shown) such as silicon rubber on the outer peripheral part of the convex parts 6a and 6c. When the connector member 2 is assembled, the gap between the contact surfaces (butting surfaces) is completely sealed.

次に、図7に、筐体蓋部3を筐体内部側から見た斜視図を示すように、筐体蓋部3は、筐体本体部1の側面部1bとコネクタ部材2とを組み合わせた筒形側面部の上端側の突き合わせ面にシール材をためるとともに、筒形側面部上端の凸形状の嵌合部である凸形状部4d、6bを嵌合させるための凹形状の溝部7aを有している。   Next, as shown in FIG. 7, a perspective view of the housing lid 3 viewed from the inside of the housing, the housing lid 3 is a combination of the side surface portion 1 b of the housing body 1 and the connector member 2. A concave groove portion 7a for fitting convex portions 4d and 6b, which are convex fitting portions at the upper end of the cylindrical side surface portion, is provided on the abutting surface on the upper end side of the cylindrical side surface portion. Have.

図8は、防水型電子装置100の筐体本体部1の開口部にコネクタ部材2を組み付けた状態を示す斜視図である。筐体本体部1の平面部1aに実装された電子装置は、平面部1aから立ち上がる筒型側面部(側面部1bおよびコネクタ部材2によってなる。)によって取り囲まれた状態となる。
そして、筐体本体部1にコネクタ部材2を組み付けた状態では、突き合わせ面に後述する間隙部が形成される。その間隙部には封止樹脂が加圧注入されるが、封止樹脂を注入する注入口8a、8bが間隙部の端部によって構成される。
FIG. 8 is a perspective view showing a state in which the connector member 2 is assembled to the opening of the housing main body 1 of the waterproof electronic device 100. The electronic device mounted on the flat surface portion 1a of the housing main body portion 1 is surrounded by a cylindrical side surface portion (consisting of the side surface portion 1b and the connector member 2) rising from the flat surface portion 1a.
And in the state which assembled | attached the connector member 2 to the housing | casing main-body part 1, the gap | interval part mentioned later is formed in a butt | matching surface. Sealing resin is injected under pressure into the gap, but injection ports 8a and 8b for injecting the sealing resin are constituted by the end of the gap.

図9に、筐体本体部1にコネクタ部材2を組み付けた状態の断面図を示すように、筐体本体部1の平面部1aに形成された凹形状の溝部4bに、コネクタ部材2の凸形状部6cを嵌合させた状態で、図示しないネジにより例えば2カ所の位置決め固定を行う。この時、溝部4aと凸形状部6cが嵌合する突き合わせ面においては、凸形状部6cが溝部4b内壁に接触することはなく、封止樹脂が注入される間隙部9a、9b、9cが形成される。ここで、凹形状の溝部4b内の間隙部9aは、凸形状部6cよりも内周側の空隙、間隙部9bは凸形状部6cよりも外周側の空隙、間隙部9cは凸形状部6cよりも下方部側の空隙をそれぞれ示している。このように、突き合わせ面と封止樹脂との接着面積を稼ぐことで接着性を向上させることができる。   FIG. 9 shows a cross-sectional view of the state in which the connector member 2 is assembled to the housing main body 1, and the concave groove 4 b formed in the flat surface 1 a of the housing main body 1 projects into the convex portion of the connector member 2. In a state where the shape portion 6c is fitted, for example, two positions are fixed with screws (not shown). At this time, on the abutting surface where the groove 4a and the convex portion 6c are fitted, the convex portion 6c does not contact the inner wall of the groove 4b, and gap portions 9a, 9b, 9c into which the sealing resin is injected are formed. Is done. Here, the gap 9a in the concave groove 4b is a gap on the inner peripheral side than the convex part 6c, the gap 9b is a gap on the outer peripheral side than the convex part 6c, and the gap 9c is a convex part 6c. The gaps on the lower part side are shown. Thus, adhesiveness can be improved by earning the adhesion area of a butting surface and sealing resin.

また、溝部4bの中央部には、後述する吸引口となる穴部4cが、平面部1aの裏面側から溝部4bに到達するように開口されている。なお、側面部1bに形成された溝部4aにおいても、同様の間隙部が形成され、平面部1a側の間隙部9a、9b、9cと一続きとなっている。
さらに、コネクタ部材2の凸部外周を覆う十分柔軟性のあるシリコンゴムのような部品(図示せず)により筐体本体部1とコネクタ部材2間の隙間部は密閉された状態となる。
Further, a hole 4c serving as a suction port to be described later is opened at the center of the groove 4b so as to reach the groove 4b from the back surface side of the flat surface 1a. A similar gap is also formed in the groove 4a formed in the side surface 1b, and is continuous with the gaps 9a, 9b, 9c on the flat surface 1a side.
Further, the gap between the housing body 1 and the connector member 2 is hermetically sealed by a sufficiently flexible part (not shown) such as silicon rubber that covers the outer periphery of the convex portion of the connector member 2.

次に、図10に、コネクタ部材2と筐体本体部1との組み付け部に封止樹脂(シール材)を注入する場合の概略斜視図を示す。また、図11に、筐体本体部1の平面部1a裏面側の平面図を示す。図10に示すように、筐体構成部品の突き合わせ面に形成された間隙部の端部である注入口8a、8bには、それぞれ治具10aが配置される。治具10aは、封止樹脂の注入器の先端にウレタン素材のように柔軟性があり、かつ強度のあるものを用い、この治具10aを注入口8a、8bの周囲の接触面に押し当て密着させることにより、樹脂注入時の圧力逃げによる封止樹脂の外部への漏れを防止する。   Next, FIG. 10 shows a schematic perspective view in the case of injecting a sealing resin (seal material) into the assembly portion of the connector member 2 and the housing body 1. FIG. 11 is a plan view of the back surface side of the flat surface portion 1 a of the housing body 1. As shown in FIG. 10, jigs 10 a are respectively disposed at the inlets 8 a and 8 b that are the ends of the gaps formed on the abutting surfaces of the casing components. The jig 10a is made of a flexible and strong material such as a urethane material at the tip of the sealing resin injector, and the jig 10a is pressed against the contact surface around the injection ports 8a and 8b. By adhering to each other, leakage of the sealing resin to the outside due to pressure escape during resin injection is prevented.

封止樹脂は、注入口8a、8b(一続きの間隙部の両端部)より、2カ所から同時に加圧注入され、この樹脂注入と同時に、筐体本体部1に設けられた穴部4c(筋状の間隙部の中央部に繋がる穴部)を吸引口として、吸引設備により間隙部9a、9b、9cの空気を吸引する。穴部4cから空気を吸引することによって、筐体本体部1の溝部4a、4b、コネクタ部材2の凸形状部6a、6cの周囲の空隙が負圧状態となり、粘性のある液体の封止樹脂が充填されることにより第1シール部が形成される。
ここで、穴部4cに封止樹脂が到達することにより、間隙部9a、9b、9cへの封止樹脂充填を確認することができる。つまり、穴部4cは樹脂充填を確認する確認窓としての役割を果たす。
Sealing resin is pressurized and injected simultaneously from two locations through the injection ports 8a and 8b (both ends of the continuous gap). Simultaneously with this resin injection, the hole 4c ( The air in the gaps 9a, 9b, 9c is sucked by the suction equipment using the suction port as a suction hole) connected to the central part of the streaky gap. By sucking air from the hole 4c, the gaps around the grooves 4a and 4b of the housing body 1 and the convex portions 6a and 6c of the connector member 2 are in a negative pressure state, and a viscous liquid sealing resin Is filled with the first seal portion.
Here, when the sealing resin reaches the hole 4c, the filling of the sealing resin into the gaps 9a, 9b, and 9c can be confirmed. That is, the hole 4c serves as a confirmation window for confirming resin filling.

図12に、防水型電子装置100の要部断面図を示すように、電子装置を実装した筐体本体部1とコネクタ部材2との円筒形側面部の上端部となる開口面部には、筐体蓋部3が被せられ、電子装置が封止された状態を得ることができる。ここで、筐体本体部1の凸形状部4dと、コネクタ部材2の凸形状部6bが組み合わされて環状の凸形状部が形成されている。この環状の凸形状部は、筐体蓋部3の裏面側に設けられた環状の溝部7aに嵌合するが、筐体蓋部3を組み付けた状態で、溝部7aと凸形状部6bの間に形成される間隙部9d、9e、9fは図示しない封止樹脂が充填された状態となる。なお、間隙部9dは、凸形状部6bよりも内周側の空隙、間隙部9eは、凸形状部6bよりも外周側の空隙、間隙部9fは、凸形状部6bよりも上方側の空隙を示している。   As shown in a cross-sectional view of the main part of the waterproof electronic device 100 in FIG. 12, the opening surface portion serving as the upper end portion of the cylindrical side surface portion of the housing main body 1 and the connector member 2 on which the electronic device is mounted is provided on the housing. A state in which the body lid portion 3 is covered and the electronic device is sealed can be obtained. Here, the convex-shaped part 4d of the housing body 1 and the convex-shaped part 6b of the connector member 2 are combined to form an annular convex-shaped part. This annular convex portion fits into an annular groove 7a provided on the back side of the housing lid portion 3, but in a state where the housing lid portion 3 is assembled, between the groove portion 7a and the convex portion 6b. The gap portions 9d, 9e, and 9f formed in are filled with a sealing resin (not shown). The gap portion 9d is a gap on the inner peripheral side of the convex shape portion 6b, the gap portion 9e is a gap on the outer peripheral side of the convex shape portion 6b, and the gap portion 9f is a gap on the upper side of the convex shape portion 6b. Is shown.

筐体蓋部3の組み付け時においては、まず、筐体本体部1およびコネクタ部材2の上端部側に形成された凸形状部4d、6bを含む突き合わせ面部(凹凸面)に封止樹脂を塗布しておき、同様に、筐体蓋部3の溝部7aを含む突き合わせ面部(凹凸面)にも封止樹脂を塗布しておく。その後、対向する突き合わせ面部同士を重ね合わせて組み付けることによって、凸部と凹部が互いにかみ合うように係合し、間隙部9d、9e、9f内に封止樹脂が充填され第2シール部が形成される。
このように、第1シール部、第2シール部によって、防水型電子装置100の各部品間の接合面が水密シールされ防水機能を有するユニットを得ることができる。
When assembling the case lid 3, first, a sealing resin is applied to the abutting surface (uneven surface) including the convex portions 4d and 6b formed on the upper ends of the case body 1 and the connector member 2. Similarly, the sealing resin is also applied to the abutting surface portion (uneven surface) including the groove portion 7 a of the housing lid portion 3. Thereafter, the opposing butted surface portions are overlapped and assembled so that the convex portions and the concave portions engage with each other, and the gap portions 9d, 9e, and 9f are filled with sealing resin to form the second seal portion. The
As described above, a unit having a waterproof function can be obtained in which the joint surfaces between the components of the waterproof electronic device 100 are watertightly sealed by the first seal portion and the second seal portion.

以上、示したように、本発明の実施の形態1の防水型電子装置100は、筐体本体部1、この筐体本体部1に組み付けられ、筐体本体部1と協同して電子装置を収納するとともに電子装置に電気的に接続されるコネクタ部材2(筐体構成部)、筐体本体部1およびコネクタ部材2に組み付けられ、電子装置を封止する筐体蓋部3、筐体本体部1のコネクタ部材2との突き合わせ面に形成された溝部4a、4b(第一の嵌合部)、コネクタ部材2の筐体本体部1との突き合わせ面に形成され、第一の嵌合部に嵌合する凸形状部6a、6c(第二の嵌合部)、第一の嵌合部と第二の嵌合部の間に形成された間隙部に注入された封止樹脂を備えた構造である。そして、筐体本体部1(またはコネクタ部材2)に、間隙部に到達する穴部4cが吸引口として形成されている。   As described above, the waterproof electronic device 100 according to the first embodiment of the present invention is assembled to the housing main body 1 and the housing main body 1, and the electronic device is cooperated with the housing main body 1. A housing member 3 that is housed and electrically connected to the electronic device (a housing component), a housing body 1 and a connector member 2 to seal the electronic device, and a housing body Grooves 4a and 4b (first fitting portions) formed on the abutting surface of the part 1 with the connector member 2, and the first fitting portion formed on the abutting surface of the connector member 2 with the housing body 1 Convex-shaped portions 6a and 6c (second fitting portions) that fit into the first fitting portion and a sealing resin injected into a gap portion formed between the first fitting portion and the second fitting portion. Structure. And the hole 4c which reaches | attains a clearance gap is formed in the housing body part 1 (or connector member 2) as a suction port.

また防水型電子装置100の製造方法においては、筐体本体部1にコネクタ部材2が組み付けられ、筐体本体部1とコネクタ部材2が協同して電子装置を収納するステップ、筐体本体部1のコネクタ部材2との突き合わせ面に形成された溝部4a、4b(第一の嵌合部)と、コネクタ部材2の筐体本体部1との突き合わせ面に形成され、第一の嵌合部に嵌合する凸形状部6a、6c(第二の嵌合部)の間の間隙部に、封止樹脂を加圧注入するとともに、間隙部の空気を吸引するステップ、電子装置を封止する筐体蓋部3を筐体本体部1およびコネクタ部材2に組み付けるステップを含んでいる。   In the method for manufacturing the waterproof electronic device 100, the connector body 2 is assembled to the housing body 1, and the housing body 1 and the connector member 2 cooperate to house the electronic device. The groove portions 4a and 4b (first fitting portion) formed on the butting surface with the connector member 2 and the housing body portion 1 of the connector member 2 are formed on the butting surface, A step of pressure-injecting sealing resin into the gap between the convex portions 6a and 6c (second fitting portion) to be fitted and sucking air in the gap, and a housing for sealing the electronic device A step of assembling the body lid portion 3 to the housing body portion 1 and the connector member 2 is included.

この実施の形態1の防水型電子装置100およびその製造方法によれば、筐体本体部1とコネクタ部材2の嵌合部では、筐体本体部1とコネクタ部材2を突き合わせた後に、突き合わせ面の間隙部に樹脂を充填する。よって、従来のように、一方の嵌合部の溝に封止樹脂を充填後、他方の嵌合部の突起を嵌合させる構造ではないため、封止樹脂の掻き出しがなく、十分な量の封止樹脂を充填することができる。また、穴部4cに到達した封止樹脂を外部から目視確認することで、封止樹脂の充填状況を把握することができるため、シール性及び工作性を向上させることができる。   According to the waterproof electronic device 100 and the method for manufacturing the same according to the first embodiment, in the fitting portion between the housing body 1 and the connector member 2, after the housing body 1 and the connector member 2 are abutted, The gap is filled with resin. Therefore, since it is not a structure in which the projection of the other fitting portion is fitted after the sealing resin is filled in the groove of one fitting portion as in the prior art, there is no scraping of the sealing resin, and a sufficient amount The sealing resin can be filled. Moreover, since the filling condition of sealing resin can be grasped | ascertained by visually confirming the sealing resin which reached | attained the hole 4c from the outside, a sealing performance and workability | operativity can be improved.

なお、穴部4cは、筐体本体部1側に形成された例を示したが、筐体部品間の突き合わせ面に形成された間隙部の空気を吸引する吸引口や、樹脂充填を確認する確認窓として用いることが可能であれば、コネクタ部材2側に形成しても良いことは言うまでもない。
また、上述の例では、筐体本体部1に設ける第一の嵌合部を凹形状の溝部とし、コネクタ部材2に設ける第二の嵌合部を凸形状部としていたが、逆に、筐体本体部1に設ける第一の嵌合部を凸形状部とし、コネクタ部材2に設ける第二の嵌合部を凹形状の溝部とするなどの変形も可能である。
In addition, although the hole part 4c showed the example formed in the housing | casing main-body part 1 side, the suction port which attracts | sucks the air of the clearance gap formed in the abutting surface between housing | casing components, and resin filling are confirmed. Needless to say, it may be formed on the connector member 2 side as long as it can be used as a confirmation window.
In the above example, the first fitting portion provided in the housing main body 1 is a concave groove portion, and the second fitting portion provided in the connector member 2 is a convex shape portion. The first fitting portion provided on the body main body 1 may be a convex portion, and the second fitting portion provided on the connector member 2 may be a concave groove.

実施の形態2.
本発明の実施の形態2の防水型電子装置について図13を用いて説明する。図13は、防水型電子装置100のコネクタ部材2と筐体本体部1との組み付け部に封止樹脂(シール材)を注入する場合の概略斜視図である。上述の実施の形態1では、筐体本体部1とコネクタ部材2の突き合わせ面の間隙部の両端部を封止樹脂の注入口8a、8bとし、これら二カ所の注入口8a、8bから同時に、穴部4c側に向かって封止樹脂を注入する例を示したが、ここでは、穴部4cを形成せず、一方の注入口8bを、間隙部内の空気を吸引する吸引口として用いる場合について説明する。
Embodiment 2. FIG.
A waterproof electronic device according to a second embodiment of the present invention will be described with reference to FIG. FIG. 13 is a schematic perspective view when a sealing resin (seal material) is injected into the assembly portion of the connector member 2 and the housing main body 1 of the waterproof electronic device 100. In the above-described first embodiment, both ends of the gap portion of the butting surface of the housing body 1 and the connector member 2 are the sealing resin injection ports 8a and 8b, and simultaneously from these two injection ports 8a and 8b, Although an example in which the sealing resin is injected toward the hole 4c side has been shown, here, the hole 4c is not formed, and one of the injection ports 8b is used as a suction port for sucking air in the gap portion. explain.

この実施の形態2では、図13に示すように、筐体本体部1とコネクタ部材2の突き合わせ面に形成された一続きの間隙部の一端は、封止樹脂の注入口であり、治具11aを介して矢印方向に封止樹脂が加圧注入される。そして、間隙部の他端は、間隙部の空気を吸引する吸引口であり、治具11bを介して矢印方向に間隙部内の空気が吸引され、封止樹脂の間隙部への注入を補助する。そして、治具11bを外した状態で間隙部の他端を確認窓として用い、この確認窓に封止樹脂が見えた場合、間隙部に封止樹脂が充填されたことを確認するものである。   In the second embodiment, as shown in FIG. 13, one end of the continuous gap formed on the abutting surface of the housing main body 1 and the connector member 2 is a sealing resin inlet, and a jig Sealing resin is injected under pressure in the direction of the arrow through 11a. The other end of the gap is a suction port for sucking the air in the gap, and the air in the gap is sucked in the direction of the arrow through the jig 11b to assist the injection of the sealing resin into the gap. . Then, the other end of the gap is used as a confirmation window with the jig 11b removed, and when the sealing resin is visible in the confirmation window, it is confirmed that the gap is filled with the sealing resin. .

このように、筐体本体部1とコネクタ部材2の突き合わせ面に形成された一続きの間隙部の一端は封止樹脂の注入口とし、他端は間隙部内を負圧とする吸引口および樹脂充填の確認窓として用いることで、筐体本体部1に吸引口および確認窓となる穴部4cを追加する加工費の削減になるとともに、封止樹脂の注入設備を減らすことができ、設備費の削減ができる。また、上述の実施の形態1と同様に、筐体本体部1とコネクタ部材2との嵌合部である第1シール部については封止樹脂の掻き出しがなく、吸引口となる間隙部の他端に到達した封止樹脂を外部から目視確認することで、封止樹脂の充填状況を把握することができるため、シール性及び工作性を向上させることができる。なお、筐体蓋部3と他の筐体部品との嵌合部である第2シール部については上述と同様の封止手法であり、実施の形態2の防水型電子装置100は実施の形態1と同様のシール性を得ることができる。   In this way, one end of the continuous gap portion formed on the abutting surface of the housing body 1 and the connector member 2 is a sealing resin injection port, and the other end is a suction port and a resin that creates a negative pressure in the gap portion. By using it as a confirmation window for filling, it is possible to reduce the processing cost of adding the suction port and the hole 4c to be the confirmation window to the housing body 1 and to reduce the facility for injecting the sealing resin. Can be reduced. Similarly to the first embodiment described above, the first sealing portion, which is the fitting portion between the housing body 1 and the connector member 2, does not scrape the sealing resin, and other than the gap portion serving as the suction port. By visually confirming the sealing resin that has reached the end from the outside, the filling state of the sealing resin can be grasped, so that the sealing performance and workability can be improved. Note that the second sealing portion, which is a fitting portion between the housing lid portion 3 and other housing components, is the same sealing method as described above, and the waterproof electronic device 100 according to the second embodiment is the same as the second embodiment. 1 can be obtained.

実施の形態3.
本発明の実施の形態3の防水型電子装置について図14、図15を用いて説明する。図14は防水型電子装置100の筐体本体部1の斜視図であり、図15は、筐体本体部1の平面部1aの突き合わせ面を中心とした要部断面図である。この筐体本体部1の凹形状の溝部4a、4bの両脇、つまり、溝部4aの径方向外側、内側に第一の嵌合部である溝部4a、4bよりも浅い溝部13a、13bを設けている。溝部13a、13bは、筐体本体部1の平面部1a上面から、溝部4bよりも浅く掘り下げられた溝である。そして、この溝部13a、13bには、コネクタ部材2を突き合わせる前に、あらかじめ封止樹脂を硬化させた硬化樹脂材14a、14bを配設している。筐体本体部1の凹形状の溝部13a、13bに塗布した封止樹脂を硬化させて硬化樹脂材14a、14bとした状態で、コネクタ部材2を筐体本体部1の開口部に組み付けることにより、筐体本体部1とコネクタ部材2の部品間の隙間を完全に封止することが可能となる。
Embodiment 3 FIG.
A waterproof electronic device according to a third embodiment of the present invention will be described with reference to FIGS. 14 is a perspective view of the housing main body 1 of the waterproof electronic device 100, and FIG. 15 is a cross-sectional view of the main part centering on the butting surface of the flat surface 1a of the housing main body 1. Grooves 13a and 13b that are shallower than the grooves 4a and 4b, which are the first fitting parts, are provided on both sides of the concave grooves 4a and 4b of the casing body 1, that is, on the radially outer side and the inner side of the groove 4a. ing. The groove portions 13 a and 13 b are grooves that are dug shallower than the groove portion 4 b from the upper surface of the flat surface portion 1 a of the housing main body portion 1. The groove portions 13a and 13b are provided with cured resin materials 14a and 14b in which the sealing resin is cured in advance before the connector member 2 is abutted. By assembling the connector member 2 to the opening of the casing body 1 in a state where the sealing resin applied to the concave grooves 13a and 13b of the casing body 1 is cured to be cured resin materials 14a and 14b. Thus, it becomes possible to completely seal the gap between the parts of the housing body 1 and the connector member 2.

上述したように、溝部13a、13bに、硬化樹脂材14a、14bを配設することにより、コネクタ部材2の凸形状部6a、6b、6cの外周部にOリングまたはシール材(液体パッキン、ガスケット)等の柔軟性のあるシリコンゴムのような部品を配設することが不要となり、部品の直材費(材料費および生産に必要となる費用)を削減することができる。   As described above, by disposing the cured resin materials 14a and 14b in the grooves 13a and 13b, an O-ring or a sealing material (liquid packing, gasket) is provided on the outer peripheral portion of the convex portions 6a, 6b, and 6c of the connector member 2. It is unnecessary to dispose a part such as flexible silicon rubber such as), and the direct material cost (material cost and cost necessary for production) of the part can be reduced.

また、この実施の形態3の防水型電子装置100の製造過程において、筐体本体部1とコネクタ部材2の突き合わせ面に形成される間隙部への封止樹脂の注入は、上述の実施の形態1において示したように、筐体本体部1の平面部1aに開口した穴部4cである吸引口を用い、間隙部の両端の注入口8a、8bから封止樹脂を加圧注入するとともに穴部4cから間隙部内の空気を吸引する方法を用いることができる。また、実施の形態2において示したように、穴部4cを用いることなく、筐体本体部1とコネクタ部材2の突き合わせ面に形成される一続きの間隙部の一端を封止樹脂の注入口とし、他端を間隙部内の空気の吸引口として用いる方法を、本実施の形態3のものに適用させることも可能であることは言うまでもない。   In addition, in the manufacturing process of the waterproof electronic device 100 according to the third embodiment, the sealing resin is injected into the gap formed in the abutting surface of the housing main body 1 and the connector member 2 as described in the above embodiment. 1, using a suction port that is a hole 4 c opened in the flat surface 1 a of the housing body 1, the sealing resin is pressurized and injected from the injection ports 8 a and 8 b at both ends of the gap. A method of sucking air in the gap from the portion 4c can be used. Further, as shown in the second embodiment, without using the hole 4c, one end of a continuous gap formed on the abutting surface of the housing main body 1 and the connector member 2 is used as an injection port for sealing resin. Needless to say, the method of using the other end as an air suction port in the gap can be applied to the third embodiment.

なお、本発明は、その発明の範囲内において、各実施の形態を自由に組み合わせたり、各実施の形態を適宜、変形、省略することが可能である。   It should be noted that the present invention can be freely combined with each other within the scope of the invention, and each embodiment can be appropriately modified or omitted.

1 筐体本体部、1a 平面部、1b 側面部、2 コネクタ部材、3 筐体蓋部、4a、4b、7a、13a、13b 溝部、4c 穴部、4d、6a、6b、6c 凸形状部、5a 突き合わせ面部、8a、8b 注入口、9a、9b、9c、9d、9e、9f 間隙部、10a、11a、11b 治具、14a、14b 硬化樹脂材、100 防水型電子装置。
DESCRIPTION OF SYMBOLS 1 Housing | casing main-body part, 1a Plane part, 1b Side surface part, 2 Connector member, 3 Housing | casing cover part, 4a, 4b, 7a, 13a, 13b Groove part, 4c Hole part, 4d, 6a, 6b, 6c Convex-shaped part, 5a butt surface portion, 8a, 8b inlet, 9a, 9b, 9c, 9d, 9e, 9f gap portion, 10a, 11a, 11b jig, 14a, 14b cured resin material, 100 waterproof electronic device.

Claims (5)

筐体本体部に筐体構成部が組み付けられ、上記筐体本体部と上記筐体構成部が協同して電子装置を収納するステップ、上記筐体本体部の上記筐体構成部との突き合わせ面に形成された第一の嵌合部と、上記筐体構成部の上記筐体本体部との突き合わせ面に形成され、上記第一の嵌合部に嵌合する第二の嵌合部の間の間隙部に、封止樹脂を加圧注入するとともに、上記間隙部の空気を吸引するステップ、上記電子装置を封止する筐体蓋部を上記筐体本体部および上記筐体構成部に組み付けるステップを含むことを特徴とする防水型電子装置の製造方法。   A case in which a housing component is assembled to the housing main body, and the housing main body and the housing component cooperate to store the electronic device; a surface where the housing main body meets the housing component Between the second fitting portion formed on the abutting surface between the first fitting portion formed on the housing and the housing main body portion of the case constituting portion and fitting on the first fitting portion. A step of injecting a sealing resin into the gap of the pressure and sucking air in the gap and assembling a casing lid for sealing the electronic device to the casing body and the casing component A method for manufacturing a waterproof electronic device, comprising: a step. 上記封止樹脂は上記間隙部の端部から加圧注入し、上記間隙部の空気は、上記間隙部に到達するように、上記筐体本体部または上記筐体構成部に開口された穴部から吸引することを特徴とする請求項1記載の防水型電子装置の製造方法。   The sealing resin is pressurized and injected from the end of the gap, and the air in the gap is opened in the casing body or the casing component so as to reach the gap. The method for manufacturing a waterproof electronic device according to claim 1, wherein the suction type electronic device is sucked from a vacuum. 上記間隙部に上記封止樹脂が充填されたことを、上記穴部において確認することを特徴とする請求項2記載の防水型電子装置の製造方法。   3. The method of manufacturing a waterproof electronic device according to claim 2, wherein the hole portion is confirmed to be filled with the sealing resin in the gap portion. 上記封止樹脂は上記間隙部の一端から加圧注入し、上記間隙部の空気は、上記間隙部の他端より吸引することを特徴とする請求項1記載の防水型電子装置の製造方法。   2. The method of manufacturing a waterproof electronic device according to claim 1, wherein the sealing resin is pressurized and injected from one end of the gap, and the air in the gap is sucked from the other end of the gap. 上記間隙部に上記封止樹脂が充填されたことを、上記間隙部の他端において確認することを特徴とする請求項4記載の防水型電子装置の製造方法。



5. The method of manufacturing a waterproof electronic device according to claim 4, wherein it is confirmed at the other end of the gap that the gap is filled with the sealing resin.



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