WO2019230490A1 - Vibration detection sensor - Google Patents

Vibration detection sensor Download PDF

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Publication number
WO2019230490A1
WO2019230490A1 PCT/JP2019/020029 JP2019020029W WO2019230490A1 WO 2019230490 A1 WO2019230490 A1 WO 2019230490A1 JP 2019020029 W JP2019020029 W JP 2019020029W WO 2019230490 A1 WO2019230490 A1 WO 2019230490A1
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WO
WIPO (PCT)
Prior art keywords
vibration detection
detection sensor
housing
sealing member
grommet
Prior art date
Application number
PCT/JP2019/020029
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French (fr)
Japanese (ja)
Inventor
恵宏 上村
Original Assignee
日本精機株式会社
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Filing date
Publication date
Application filed by 日本精機株式会社 filed Critical 日本精機株式会社
Publication of WO2019230490A1 publication Critical patent/WO2019230490A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means

Definitions

  • the present invention relates to a vibration detection sensor.
  • a vibration detection sensor In order to monitor equipment and facilities such as steam traps, motors and pumps installed in the plant, vibration is detected.
  • the generated vibration is detected by a vibration detection sensor, converted into an electrical signal, and output.
  • a vibration detection sensor is assumed to be operated outdoors, and an airtight structure is required.
  • a waterproof structure for an electronic device disclosed in Patent Document 1 is housed in a case having a wiring hole through which wiring passes, a cylindrical portion extending from the case in the axial direction of the wiring so as to surround the wiring hole, and the cylindrical portion.
  • a seal member that seals between the tube portion and the wiring, and a cap that is detachably attached to the case has a hole through which the wire passes, covers the seal member, and is fitted to the tube portion.
  • the waterproof structure for an electronic device described in Patent Document 1 requires a seal member and a cap as separate members, and a structure for fixing the cap to the case. Such a structure has a problem of increasing the number of parts and the number of manufacturing steps.
  • An object of the present invention is to provide a vibration detection sensor that has both airtightness and ease of manufacture in a vibration detection sensor having an airtight structure.
  • a vibration detection sensor comprises: A vibration detecting element for detecting vibration; A circuit board on which the vibration detection element is mounted; A housing in which the circuit board is fixed; With The housing has a cord hole into which a grommet is fitted, an injection hole of a sealing member, and an air hole, The housing is hermetically sealed by the sealing member; The grommet is fixed by the sealing member. It is characterized by that.
  • FIG. 1 It is a front view of the vibration detection sensor which concerns on the 1st aspect of this invention. It is a disassembled perspective view of the vibration detection sensor which concerns on the 1st aspect of this invention. It is a figure showing the front, right side, and bottom face of the grommet of the vibration detection sensor which concerns on the 1st aspect of this invention. It is a top view of the vibration detection sensor concerning the 1st mode of the present invention. 2 is a cross-sectional view of the vibration detection sensor according to the first embodiment of the present invention taken along the line AA. FIG. It is a BB sectional view of a vibration detection sensor concerning the 1st mode of the present invention.
  • FIG. 1 is a front view of the vibration detection sensor 1 according to the first aspect
  • FIG. 2A is an exploded perspective view of the vibration detection sensor 1 according to the first aspect
  • FIG. 2B is a vibration according to the first aspect
  • FIG. 3 is a plan view of the vibration detection sensor 1 according to the first aspect
  • FIG. 4 is a vibration detection sensor according to the first aspect
  • FIG. 5 is a sectional view taken on line AA of FIG. 1, and FIG. 5 is a sectional view taken on line BB of the vibration detection sensor 1 according to the first embodiment.
  • the vibration detection sensor 1 of the present invention includes a vibration detection element 30 that detects vibration generated by the detection target 100, a circuit board 40 on which the vibration detection element 30 is mounted, and a circuit board.
  • a housing 10 in which 40 is fixed, a bottom surface portion 20 for fixing to the detection object 100, and a grommet 60 for protecting the electric cord 50 are configured.
  • the housing 10 is for housing the vibration detection element 30 and the circuit board 40, and is formed of a metal material having excellent corrosion resistance, such as stainless steel, aluminum, titanium, or the like.
  • the housing 10 includes a substantially frustum-shaped storage portion 11 and a polygonal base portion 12.
  • a cord hole 13, an injection hole 14, an air hole 15, a wall portion 16, and a protruding portion 17 are provided above the storage portion 11.
  • the cord hole 13 is a hole for taking out the electric cord 50 connected to the circuit board 40 to the outside.
  • the injection hole 14 is a hole for injecting a sealing member 70 described later into the housing 10.
  • the air hole 15 is a hole for releasing the air pushed by the sealing member 70 to the outside of the housing 10 when the sealing member 70 is injected into the housing 10.
  • the wall portion 16 prevents the sealing member 70 overflowing from the injection hole 14 and the air hole 15 from dripping outside the housing 10 when the sealing member 70 is injected into the housing 10.
  • the apex of the wall portion 16 has a height that exceeds an end portion 62 of a grommet 60 described later.
  • the protrusion 17 is a rib provided on the outer periphery of the cord hole 13 and fits into a groove 63 of a grommet 60 described later.
  • the base portion 12 has a polygonal shape such as a hexagonal column, and is provided so that the vibration detection sensor 1 can be fixed to the detected object 100 by turning it with a wrench or spanner.
  • the upper part of the base part 12 is continuous with the storage part 11.
  • the lower part of the base part 12 is opened, and is closed by a bottom face part 20 described later.
  • the bottom surface portion 20 is for closing the lower portion of the housing 10 and connecting to the detected object 100.
  • the bottom surface portion 20 is formed of a metal material having excellent corrosion resistance, such as stainless steel, aluminum, titanium, and the like, and is integrated with the base portion 12 by welding or bonding with an adhesive.
  • the bottom surface portion 20 includes a flat plate portion 21, a substrate fixing portion 22, and an installation portion 23.
  • the flat plate portion 21 is formed in a flat plate shape or a disk shape, closes the opening below the base portion 12, contacts the detected body 100, and transmits vibration generated by the detected body 100 to the substrate fixing portion 22.
  • the board fixing part 22 is a frame formed upward to fix the circuit board 40 to the bottom face part 20, and has a screw hole.
  • the vibration transmitted to the board fixing unit 22 is transmitted to the vibration detection element 30 of the circuit board 40.
  • the installation part 23 is for fixing the vibration detection sensor 1 to the detected body 100, has a male screw formed on the side surface, and is provided so as to be connected to a female screw provided on the detected object 100.
  • the vibration detection element 30 is composed of, for example, an acceleration sensor and detects vibrations in the orthogonal X, Y, and Z directions.
  • a MEMS (Micro Electro Mechanical Systems) type acceleration sensor is used.
  • the MEMS type acceleration sensor includes a detection element unit that detects acceleration and a signal processing circuit that amplifies, adjusts, and outputs a signal from the detection element.
  • the detection element unit includes a detection element such as a capacitance type or a piezoresistive type.
  • the vibration detection element 30 may be any element as long as it is used as a sensor for grasping vibration in addition to the above-described object.
  • the vibration detection element 30 used in this aspect is preferably one having excellent horizontal vibration detection accuracy.
  • the circuit board 40 is a printed circuit board (PCB) made of glass epoxy or the like.
  • the circuit board 40 includes a vibration detection element 30 and an electronic circuit 41 substantially horizontally on a printed circuit board, and is fixed to the board fixing portion 22 by a screw 42 substantially vertically with respect to the detection target 100.
  • a vibration detection element 30 is mounted below the center of the circuit board 40 and is electrically connected to the circuit board 40 by solder. Thereby, the vibration detection element 30 can be brought close to the detected object 100, and the detection accuracy of the vibration generated by the detected object 100 can be improved.
  • the electronic circuit 41 is formed of, for example, an integrated circuit (IC), and is mounted on the center of the circuit board 40 or above, and outputs an electrical signal based on the vibration detected by the vibration detection element 30.
  • the electronic circuit 41 may output only an electric signal related to vibration in a substantially vertical direction with respect to the detection target 100 in order to reduce a load of arithmetic processing for converting the vibration into an electric signal. Further, the circuit board 40 is electrically connected to an electric cord 50 for supplying power to the vibration detecting element 30 and outputting an electric signal output from the electronic circuit 41 to the outside.
  • the electric cord 50 includes an electric wire 51 and a covering member 52.
  • the electric wire 51 is made of an electric conductor such as copper, and is electrically connected to the circuit board 40 by solder.
  • the covering member 52 is made of a vinyl material such as polyvinyl chloride or polyethylene, and protects the electric wire 51 from disconnection.
  • the grommet 60 is made of a soft member such as rubber and includes a cylindrical portion 61, an end portion 62, a groove portion 63, and a large diameter portion 64.
  • the tubular portion 61 is fitted into the cord hole 13 and protects the electric cord 50 from the end surface of the cord hole 13.
  • the end portion 62 is a flat peripheral edge provided on the outer periphery of the cylindrical portion 61 and the large-diameter portion 64 described later. The end 62 increases the contact area with the housing 10, thereby strengthening the fixing of the grommet 60 by the sealing member 70.
  • the groove 63 is formed below the grommet 60 and fits into the protrusion 17 of the storage portion 11 to position the grommet 60.
  • the large diameter portion 64 is a portion that is thicker than the cylindrical portion 61, and the groove portion 63 is formed inside the large diameter portion 64.
  • the sealing member 70 is made of, for example, an epoxy resin.
  • the sealing member 70 fills the inside of the housing 10 through the injection hole 14 and is injected until the sealing member 70 overflowing from the injection hole 14 and the air hole 15 covers the end portion 62 of the grommet 60.
  • the sealing member 70 is hardened to hermetically seal the inside of the housing 10 and fix the grommet 60.
  • FIGS. 6 is an exploded perspective view of the storage portion 11 and the grommet 60 of the vibration detection sensor 1 according to the second aspect
  • FIG. 7 is a storage portion 11 and the grommet of the vibration detection sensor 1 according to the second aspect of the present invention.
  • FIG. 8 is a plan view of 60
  • FIG. 8 is a CC cross-sectional view of the storage portion 11 and the grommet 60 of the vibration detection sensor 1 according to the second embodiment.
  • the housing 10 has no protrusion 17 and the cord hole 13 and the injection hole 14 are connected, and the grommet 60 has no end 62, groove 63, and large diameter portion 64, and the fixed piece 65, 66 and a base 67 are formed.
  • the second aspect is different from the first aspect, and is the same as the first aspect in other parts.
  • the cord hole 13 and the injection hole 14 above the storage portion 11 are connected, and the grommet 60 is slid and fitted into the cord hole 13 from the injection hole 14. Therefore, it is desirable that the injection hole 14 be formed larger than the cord hole 13.
  • the cord hole 13 and the air hole 15 may be connected to form the injection hole 14 independently.
  • the wall portion 16 prevents the sealing member 70 overflowing from the injection hole 14 and the air hole 15 from dripping outside the housing 10 when the sealing member 70 is injected into the housing 10.
  • the apex of the wall portion 16 has a height exceeding the fixing pieces 65 and 66 of the grommet 60 described later.
  • the grommet 60 has a lower fixed piece 65 and an upper fixed piece 66 formed on a base 67, and grips the end face of the cord hole 13 by elastic deformation of the fixed pieces 65 and 66.
  • the sealing member 70 fills the inside of the housing 10 from the injection hole 14 and is injected until the sealing member 70 covers at least the fixed piece 65 below the grommet 60.
  • the sealing member 70 is injected until the sealing member 70 overflowing from the injection hole 14 and the air hole 15 covers both the lower fixing piece 65 and the upper fixing piece 66, so that the grommet 60 is more reliably secured. Can be fixed to.
  • the sealing member 70 is hardened to hermetically seal the inside of the housing 10 and fix the grommet 60.
  • FIG. 9 is an exploded perspective view of the back side of the vibration detection sensor 1 according to the third aspect
  • FIG. 10 is a BB sectional view of the vibration detection sensor 1 according to the third aspect.
  • the bottom face part 20 further provides the rib 24 in the board
  • the bottom surface portion 20 is provided with a rib 24 protruding from the substrate fixing portion 22 at a position corresponding to a connection portion between the circuit substrate 40 and the electric cord 50.
  • an epoxy resin is used for the sealing member 70.
  • the sealing member 70 fills the inside of the housing 10 through the injection hole 14 and is injected until the sealing member 70 overflowing from the injection hole 14 and the air hole 15 covers the end portion 62 of the grommet 60.
  • the rib 24 supports the electric cord 50 and prevents the electric cord 50 pushed into the sealing member 70 from moving in the direction of the electronic circuit 41 and the vibration detecting element 30 below the vibration detecting sensor 1.
  • the sealing member 70 is hardened to hermetically seal the inside of the housing 10 and fix the grommet 60.
  • the circuit board 40 is screwed to the board fixing part 22 of the bottom face part 20 with screws 42.
  • the electric wire 51 of the electric cord 50 is soldered to the circuit board 40.
  • the cylindrical portion 61 of the grommet 60 is fitted into the cord hole 13, and the groove 63 is fitted into the protruding portion 17 of the housing 10.
  • the electric cord 50 is passed through the cylindrical portion 61 of the grommet 60 and the housing 10 is put on the bottom surface portion 20.
  • the housing 10 and the bottom surface portion 20 are welded and integrated.
  • the sealing member 70 is injected from the injection hole 14 to fill the inside of the housing 10 until the sealing member 70 overflowing from the injection hole 14 and the air hole 15 covers the end portion 62 of the grommet 60.
  • the sealing member 70 is injected.
  • the sealing member 70 by hardening the sealing member 70, the vibration detecting element 30 and the circuit board 40 inside the housing 10 are hermetically sealed, and the grommet 60 is also fixed.
  • the circuit board 40 is screwed to the board fixing part 22 of the bottom face part 20 with screws 42.
  • the electric wire 51 of the electric cord 50 is soldered to the circuit board 40.
  • the grommet 60 is slid and fitted into the cord hole 13 from the injection hole 14 of the housing 10, and the end face of the cord hole 13 is held by the fixing pieces 65 and 66.
  • the electric cord 50 is passed through the cylindrical portion 61 of the grommet 60 and the housing 10 is put on the bottom surface portion 20.
  • the housing 10 and the bottom surface portion 20 are welded.
  • the sealing member 70 is injected from the injection hole 14 to fill the inside of the housing 10, and the sealing member 70 overflowing from the injection hole 14 and the air hole 15 fixes the fixing pieces 65 and 66 of the grommet 60.
  • the sealing member 70 is injected until it is covered.
  • the sealing member 70 by hardening the sealing member 70, the vibration detecting element 30 and the circuit board 40 inside the housing 10 are hermetically sealed, and the grommet 60 is also fixed.
  • the circuit board 40 is screwed to the board fixing part 22 of the bottom face part 20 with screws 42.
  • the electric wires 51 of the electric cord 50 are soldered to the circuit board 40, and the electric wires 51 are routed on the ribs 24.
  • the cylindrical portion 61 of the grommet 60 is fitted into the cord hole 13, and the groove 63 is fitted into the protruding portion 17 of the housing 10.
  • the electric cord 50 is passed through the cylindrical portion 61 of the grommet 60 and the housing 10 is put on the bottom surface portion 20.
  • the housing 10 and the bottom surface portion 20 are welded and integrated.
  • the sealing member 70 is injected from the injection hole 14 to fill the inside of the housing 10 until the sealing member 70 overflowing from the injection hole 14 and the air hole 15 covers the end portion 62 of the grommet 60.
  • the sealing member 70 is injected.
  • the rib 24 supports the electric cord 50 and prevents the electric cord 50 pushed into the sealing member 70 from moving in the direction of the electronic circuit 41 and the vibration detecting element 30 below the vibration detecting sensor 1. .
  • the sealing member 70 by hardening the sealing member 70, the vibration detecting element 30 and the circuit board 40 inside the housing 10 are hermetically sealed, and the grommet 60 is also fixed.
  • the vibration detection sensor 1 fills the sealing member 70 and hermetically seals the vibration detection element 30 and the circuit board 40 inside the housing 10 to ensure airtightness and waterproofness, and also fixes the grommet 60 at the same time. And the manufacturing process becomes easy.
  • the vibration detection sensor 1 is attached by aligning the male screw formed on the installation portion 23 of the bottom surface portion 20 with the female screw formed on the detected body 100 and turning the base portion 12 of the housing 10 with a wrench or spanner.
  • vibration is transmitted through the installation part 23 and the flat plate part 21, and the vibration detection element 30 of the circuit board 40 attached to the board fixing part 22 detects the vibration and detects it.
  • An electric signal based on the vibration is output from the vibration detection sensor 1 via the electric cord 50. Since the vibration detection element 30 is mounted at a position close to the detection target 100 of the circuit board 40, the vibration generated by the detection target 100 can be accurately detected.
  • the circuit board 40 is fixed substantially perpendicular to the detected object 100. Thereby, compared with the case where the circuit board 40 is fixed substantially horizontally with respect to the to-be-detected body 100, the area of the flat plate part 21 can be made small and the installation surface with the to-be-detected body 100 can be made small.
  • the rib 24 is provided on the substrate fixing portion 22, so that the rib 24 supports the electric cord 50 and the electric cord 50 pushed into the sealing member 70 is below the vibration detection sensor 1. 41 and the vibration detecting element 30 are prevented from moving. This facilitates handling of the electric cord 50 in the manufacturing process. Further, by ensuring the distance between the electric cord 50, the electronic circuit 41, and the vibration detecting element 30, it is possible to prevent the generation of noise.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)

Abstract

Provided is a vibration detection sensor having an airtight structure, which achieves both airtightness and ease of manufacturing. This vibration detection sensor 1 includes a vibration detection element 30 which detects vibration generated by an object 100 to be detected, a circuit board 40 on which the vibration detection element 30 is mounted, a housing 10 in which the circuit board 40 is fixed, a bottom surface portion 20 for fixing the object 100 to be detected, and a grommet 60 for protecting an electric cord 50. The housing 10 is sealed by a sealing member 70 in an airtight state, and the grommet 60 is fixed by the sealing member 70.

Description

振動検出センサVibration detection sensor
　本発明は振動検出センサに関する。 The present invention relates to a vibration detection sensor.
　プラントに設置されるスチームトラップ、モータやポンプ等の機器や設備の監視のため、振動を検出することが行われる。発生する振動は、振動検出センサで検出し、電気信号に変換して出力される。このような振動検出センサは、屋外で運用されることも想定されており、気密構造が要求される。
　例えば特許文献１に開示された電子装置用防水構造は、配線が通る配線穴を有するケースと、配線穴を囲うようにケースから配線の軸方向へ延びる筒部と、筒部に収納され、当該筒部と配線の間をシールするシール部材と、ケースに着脱可能に取付けられ、配線を通す穴を有し、シール部材を覆い筒部に嵌合されるキャップと、を備えていた。 In order to monitor equipment and facilities such as steam traps, motors and pumps installed in the plant, vibration is detected. The generated vibration is detected by a vibration detection sensor, converted into an electrical signal, and output. Such a vibration detection sensor is assumed to be operated outdoors, and an airtight structure is required.
For example, a waterproof structure for an electronic device disclosed in Patent Document 1 is housed in a case having a wiring hole through which wiring passes, a cylindrical portion extending from the case in the axial direction of the wiring so as to surround the wiring hole, and the cylindrical portion. A seal member that seals between the tube portion and the wiring, and a cap that is detachably attached to the case, has a hole through which the wire passes, covers the seal member, and is fitted to the tube portion.
再公表ＷＯ２０１２／１７６３０３号公報Republished WO2012 / 176303
　特許文献１に記載の電子装置用防水構造は、シール部材とキャップとが別の部材として必要であり、且つキャップをケースに固定するための構造が必要だった。このような構造は、部品点数と製造工数の増加という問題がある。 The waterproof structure for an electronic device described in Patent Document 1 requires a seal member and a cap as separate members, and a structure for fixing the cap to the case. Such a structure has a problem of increasing the number of parts and the number of manufacturing steps.
　本発明は、気密構造を備える振動検出センサにおいて、気密性と製造の容易性を両立させる振動検出センサを提供することを目的とする。 An object of the present invention is to provide a vibration detection sensor that has both airtightness and ease of manufacture in a vibration detection sensor having an airtight structure.
　上記目的を達成するため、本発明に係る振動検出センサは、
　振動を検出する振動検出素子と、
　前記振動検出素子が実装される回路基板と、
　前記回路基板が内部に固定されるハウジングと、
　を備え、
　前記ハウジングは、グロメットが嵌め込まれるコード孔と、封止部材の注入孔と、空気孔と、を有し、
　前記ハウジングは、前記封止部材によって気密に封止され、
　前記グロメットは、前記封止部材によって固定される、
　ことを特徴とする。 In order to achieve the above object, a vibration detection sensor according to the present invention comprises:
A vibration detecting element for detecting vibration;
A circuit board on which the vibration detection element is mounted;
A housing in which the circuit board is fixed;
With
The housing has a cord hole into which a grommet is fitted, an injection hole of a sealing member, and an air hole,
The housing is hermetically sealed by the sealing member;
The grommet is fixed by the sealing member.
It is characterized by that.
　本発明によれば、気密性と製造の容易性を両立させる振動検出センサを提供することができる。 According to the present invention, it is possible to provide a vibration detection sensor that achieves both airtightness and ease of manufacture.
本発明の第１の態様に係る振動検出センサの正面図である。It is a front view of the vibration detection sensor which concerns on the 1st aspect of this invention. 本発明の第１の態様に係る振動検出センサの分解斜視図である。It is a disassembled perspective view of the vibration detection sensor which concerns on the 1st aspect of this invention. 本発明の第１の態様に係る振動検出センサのグロメットの正面、右側面及び底面を表す図である。It is a figure showing the front, right side, and bottom face of the grommet of the vibration detection sensor which concerns on the 1st aspect of this invention. 本発明の第１の態様に係る振動検出センサの平面図である。It is a top view of the vibration detection sensor concerning the 1st mode of the present invention. 本発明の第１の態様に係る振動検出センサのＡ－Ａ断面図である。2 is a cross-sectional view of the vibration detection sensor according to the first embodiment of the present invention taken along the line AA. FIG. 本発明の第１の態様に係る振動検出センサのＢ－Ｂ断面図である。It is a BB sectional view of a vibration detection sensor concerning the 1st mode of the present invention. 本発明の第２の態様に係る振動検出センサの収納部とグロメットの分解斜視図である。It is a disassembled perspective view of the storage part and grommet of a vibration detection sensor concerning the 2nd mode of the present invention. 本発明の第２の態様に係る振動検出センサの収納部とグロメットの上面図である。It is a top view of the accommodating part and grommet of a vibration detection sensor concerning the 2nd mode of the present invention. 本発明の第２の態様に係る振動検出センサの収納部とグロメットのＣ－Ｃ断面図である。It is CC sectional drawing of the accommodating part and grommet of the vibration detection sensor which concerns on the 2nd aspect of this invention. 本発明の第３の態様に係る振動検出センサの背面側分解斜視図である。It is a back side exploded perspective view of a vibration detection sensor concerning the 3rd mode of the present invention. 本発明の第３の態様に係る振動検出センサのＢ－Ｂ断面図である。It is a BB sectional view of a vibration detection sensor concerning the 3rd mode of the present invention.
　以下に、本発明の第１の態様に係る振動検出センサ１を添付図面に基づいて説明する。
　図１は、第１の態様に係る振動検出センサ１の正面図を、図２Ａは、第１の態様に係る振動検出センサ１の分解斜視図を、図２Ｂは、第１の態様に係る振動検出センサ１のグロメット６０の正面、右側面及び底面を表す図を、図３は、第１の態様に係る振動検出センサ１の平面図を、図４は、第１の態様に係る振動検出センサ１のＡ－Ａ断面図を、図５は、第１の態様に係る振動検出センサ１のＢ－Ｂ断面図を示している。 Below, vibration detection sensor 1 concerning the 1st mode of the present invention is explained based on an accompanying drawing.
1 is a front view of the vibration detection sensor 1 according to the first aspect, FIG. 2A is an exploded perspective view of the vibration detection sensor 1 according to the first aspect, and FIG. 2B is a vibration according to the first aspect. FIG. 3 is a plan view of the vibration detection sensor 1 according to the first aspect, and FIG. 4 is a vibration detection sensor according to the first aspect. FIG. 5 is a sectional view taken on line AA of FIG. 1, and FIG. 5 is a sectional view taken on line BB of the vibration detection sensor 1 according to the first embodiment.
　本発明の振動検出センサ１は、図１乃至５に示すように、被検出体１００が発生させる振動を検出する振動検出素子３０と、振動検出素子３０が実装される回路基板４０と、回路基板４０が内部に固定されるハウジング１０と、被検出体１００に固定するための底面部２０と、電気コード５０を保護するためのグロメット６０と、を備えて構成される。 As shown in FIGS. 1 to 5, the vibration detection sensor 1 of the present invention includes a vibration detection element 30 that detects vibration generated by the detection target 100, a circuit board 40 on which the vibration detection element 30 is mounted, and a circuit board. A housing 10 in which 40 is fixed, a bottom surface portion 20 for fixing to the detection object 100, and a grommet 60 for protecting the electric cord 50 are configured.
　ハウジング１０は、振動検出素子３０及び回路基板４０を収納するためのものであり、耐食性に優れた金属材料、例えばステンレス、アルミ、チタンなどで形成される。ハウジング１０は、略錐台状の収納部１１と、多角形状の台部１２を備える。
　収納部１１の上方には、コード孔１３、注入孔１４、空気孔１５、壁部１６、突起部１７が備えられている。
　コード孔１３は、回路基板４０と接続された電気コード５０を外部に取りだすための穴である。
　注入孔１４は、ハウジング１０の内部に後述する封止部材７０を注入するための穴である。
　空気孔１５は、ハウジング１０の内部に封止部材７０を注入した際に、封止部材７０に押された空気をハウジング１０の外部に放出するための穴である。
　壁部１６は、ハウジング１０の内部に封止部材７０を注入した際に、注入孔１４及び空気孔１５から溢れた封止部材７０がハウジング１０の外側に垂れることを防止する。壁部１６の頂点は、後述するグロメット６０の端部６２を超える高さを有している。
　突起部１７は、コード孔１３の外周に設けられたリブであり、後述するグロメット６０の溝部６３と嵌合する。
　台部１２は、六角柱などの多角形状をしており、振動検出センサ１をレンチやスパナで回して被検出体１００に固定できるよう設けられている。台部１２の上方は収納部１１と連続している。台部１２の下方は開口しており、後述する底面部２０によって塞がれている。 The housing 10 is for housing the vibration detection element 30 and the circuit board 40, and is formed of a metal material having excellent corrosion resistance, such as stainless steel, aluminum, titanium, or the like. The housing 10 includes a substantially frustum-shaped storage portion 11 and a polygonal base portion 12.
A cord hole 13, an injection hole 14, an air hole 15, a wall portion 16, and a protruding portion 17 are provided above the storage portion 11.
The cord hole 13 is a hole for taking out the electric cord 50 connected to the circuit board 40 to the outside.
The injection hole 14 is a hole for injecting a sealing member 70 described later into the housing 10.
The air hole 15 is a hole for releasing the air pushed by the sealing member 70 to the outside of the housing 10 when the sealing member 70 is injected into the housing 10.
The wall portion 16 prevents the sealing member 70 overflowing from the injection hole 14 and the air hole 15 from dripping outside the housing 10 when the sealing member 70 is injected into the housing 10. The apex of the wall portion 16 has a height that exceeds an end portion 62 of a grommet 60 described later.
The protrusion 17 is a rib provided on the outer periphery of the cord hole 13 and fits into a groove 63 of a grommet 60 described later.
The base portion 12 has a polygonal shape such as a hexagonal column, and is provided so that the vibration detection sensor 1 can be fixed to the detected object 100 by turning it with a wrench or spanner. The upper part of the base part 12 is continuous with the storage part 11. The lower part of the base part 12 is opened, and is closed by a bottom face part 20 described later.
　底面部２０は、ハウジング１０の下方を塞ぎ、被検出体１００と接続するためのものである。底面部２０は、耐食性に優れた金属材料、例えばステンレス、アルミ、チタンなどで形成され、台部１２と溶接や接着剤による接着によって一体化される。
　底面部２０は、平板部２１、基板固定部２２、設置部２３を備える。
　平板部２１は、平板形状や円板形状で形成され、台部１２の下方の開口を塞ぐと共に、被検出体１００と接し、被検出体１００が発生させる振動を基板固定部２２に伝達する。
　基板固定部２２は、回路基板４０を底面部２０に固定するため上方に向かって形成された枠組であり、ねじ穴が形成されている。基板固定部２２に伝わった振動は、回路基板４０の振動検出素子３０に伝達される。
　設置部２３は、振動検出センサ１を被検出体１００に固定するためのものであり、側面に雄ねじが形成されており、被検出体１００に設けられた雌ねじと連結するように設けられる。 The bottom surface portion 20 is for closing the lower portion of the housing 10 and connecting to the detected object 100. The bottom surface portion 20 is formed of a metal material having excellent corrosion resistance, such as stainless steel, aluminum, titanium, and the like, and is integrated with the base portion 12 by welding or bonding with an adhesive.
The bottom surface portion 20 includes a flat plate portion 21, a substrate fixing portion 22, and an installation portion 23.
The flat plate portion 21 is formed in a flat plate shape or a disk shape, closes the opening below the base portion 12, contacts the detected body 100, and transmits vibration generated by the detected body 100 to the substrate fixing portion 22.
The board fixing part 22 is a frame formed upward to fix the circuit board 40 to the bottom face part 20, and has a screw hole. The vibration transmitted to the board fixing unit 22 is transmitted to the vibration detection element 30 of the circuit board 40.
The installation part 23 is for fixing the vibration detection sensor 1 to the detected body 100, has a male screw formed on the side surface, and is provided so as to be connected to a female screw provided on the detected object 100.
　振動検出素子３０は、例えば、加速度センサで構成され、直交するＸ，Ｙ，Ｚ方向の振動を検出するものである。例えばＭＥＭＳ（Micro Electro Mechanical Systems）型加速度センサが用いられる。ＭＥＭＳ型加速度センサは、加速度を検出する検出素子部と、検出素子からの信号を増幅、調整して出力する信号処理回路で構成される。検出素子部は、静電容量式のものやピエゾ抵抗式のものなどの検出素子で構成される。振動検出素子３０は、上記の物のほか、振動を把握するためのセンサとして用いられるものであれば良い。本態様で用いる振動検出素子３０は、水平方向の振動検出精度が優れるものが好ましい。 The vibration detection element 30 is composed of, for example, an acceleration sensor and detects vibrations in the orthogonal X, Y, and Z directions. For example, a MEMS (Micro Electro Mechanical Systems) type acceleration sensor is used. The MEMS type acceleration sensor includes a detection element unit that detects acceleration and a signal processing circuit that amplifies, adjusts, and outputs a signal from the detection element. The detection element unit includes a detection element such as a capacitance type or a piezoresistive type. The vibration detection element 30 may be any element as long as it is used as a sensor for grasping vibration in addition to the above-described object. The vibration detection element 30 used in this aspect is preferably one having excellent horizontal vibration detection accuracy.
　回路基板４０は、ガラスエポキシなどからなるプリント基板（Printed Circuit Board; PCB）である。回路基板４０は、プリント基板に略水平に振動検出素子３０、電子回路４１を備え、ねじ４２によって基板固定部２２に被検出体１００に対して略垂直に固定される。
　回路基板４０の中央より下方には、振動検出素子３０が実装され、はんだによって回路基板４０と電気的に接続されている。これにより、振動検出素子３０を被検出体１００に近づけることができ、被検出体１００が発生させる振動の検出精度を向上させることができる。
　電子回路４１は、例えば集積回路（IC）からなり、回路基板４０の中央部、又は上方に実装され、振動検出素子３０で検出した振動に基づく電気信号を出力する。電子回路４１は、振動を電気信号に変換する演算処理の負荷を小さくするため、被検出体１００に対して略垂直方向の振動に関する電気信号のみを出力してもよい。また、回路基板４０は、振動検出素子３０への電力供給及び電子回路４１が出力した電気信号を外部出力するための電気コード５０と電気的に接続されている。 The circuit board 40 is a printed circuit board (PCB) made of glass epoxy or the like. The circuit board 40 includes a vibration detection element 30 and an electronic circuit 41 substantially horizontally on a printed circuit board, and is fixed to the board fixing portion 22 by a screw 42 substantially vertically with respect to the detection target 100.
A vibration detection element 30 is mounted below the center of the circuit board 40 and is electrically connected to the circuit board 40 by solder. Thereby, the vibration detection element 30 can be brought close to the detected object 100, and the detection accuracy of the vibration generated by the detected object 100 can be improved.
The electronic circuit 41 is formed of, for example, an integrated circuit (IC), and is mounted on the center of the circuit board 40 or above, and outputs an electrical signal based on the vibration detected by the vibration detection element 30. The electronic circuit 41 may output only an electric signal related to vibration in a substantially vertical direction with respect to the detection target 100 in order to reduce a load of arithmetic processing for converting the vibration into an electric signal. Further, the circuit board 40 is electrically connected to an electric cord 50 for supplying power to the vibration detecting element 30 and outputting an electric signal output from the electronic circuit 41 to the outside.
　電気コード５０は、電線５１と被覆部材５２からなる。
　電線５１は、銅などの電気伝導体からなり、はんだによって回路基板４０と電気的に接続されている。
　被覆部材５２は、ポリ塩化ビニルやポリエチレンなどのビニール素材からなり、電線５１を断線から保護する。 The electric cord 50 includes an electric wire 51 and a covering member 52.
The electric wire 51 is made of an electric conductor such as copper, and is electrically connected to the circuit board 40 by solder.
The covering member 52 is made of a vinyl material such as polyvinyl chloride or polyethylene, and protects the electric wire 51 from disconnection.
　グロメット６０は、ゴムなどの軟性部材からなり、筒部６１、端部６２、溝部６３、径大部６４を備える。
　筒部６１は、コード孔１３に嵌め込まれ、コード孔１３の端面から電気コード５０を保護する。
　端部６２は、筒部６１及び後述する径大部６４の外周に設けられた平らな周縁である。端部６２は、ハウジング１０との接触面積を大きくすることで、封止部材７０によるグロメット６０の固定を強固にする。
　溝部６３は、グロメット６０の下方に形成され、収納部１１の突起部１７に嵌合し、グロメット６０の位置決めをする。
　径大部６４は、筒部６１よりも太くなっている部分であり、径大部６４の内部に溝部６３が形成される。 The grommet 60 is made of a soft member such as rubber and includes a cylindrical portion 61, an end portion 62, a groove portion 63, and a large diameter portion 64.
The tubular portion 61 is fitted into the cord hole 13 and protects the electric cord 50 from the end surface of the cord hole 13.
The end portion 62 is a flat peripheral edge provided on the outer periphery of the cylindrical portion 61 and the large-diameter portion 64 described later. The end 62 increases the contact area with the housing 10, thereby strengthening the fixing of the grommet 60 by the sealing member 70.
The groove 63 is formed below the grommet 60 and fits into the protrusion 17 of the storage portion 11 to position the grommet 60.
The large diameter portion 64 is a portion that is thicker than the cylindrical portion 61, and the groove portion 63 is formed inside the large diameter portion 64.
　封止部材７０は、例えばエポキシ樹脂などが用いられる。封止部材７０は、注入孔１４からハウジング１０の内部を充填し、注入孔１４及び空気孔１５から溢れた封止部材７０がグロメット６０の端部６２を覆うまで注入される。封止部材７０は、硬化することでハウジング１０の内部を気密に封止し、且つグロメット６０を固定する。 The sealing member 70 is made of, for example, an epoxy resin. The sealing member 70 fills the inside of the housing 10 through the injection hole 14 and is injected until the sealing member 70 overflowing from the injection hole 14 and the air hole 15 covers the end portion 62 of the grommet 60. The sealing member 70 is hardened to hermetically seal the inside of the housing 10 and fix the grommet 60.
　以下に、本発明の第２の態様に係る振動検出センサ１を図６乃至８に基づいて説明する。
　図６は、第２の態様に係る振動検出センサ１の収納部１１とグロメット６０の分解斜視図を、図７は、本発明の第２の態様に係る振動検出センサ１の収納部１１とグロメット６０の平面図を、図８は、第２の態様に係る振動検出センサ１の収納部１１とグロメット６０のＣ－Ｃ断面図を示す。 The vibration detection sensor 1 according to the second aspect of the present invention will be described below with reference to FIGS.
6 is an exploded perspective view of the storage portion 11 and the grommet 60 of the vibration detection sensor 1 according to the second aspect, and FIG. 7 is a storage portion 11 and the grommet of the vibration detection sensor 1 according to the second aspect of the present invention. FIG. 8 is a plan view of 60, and FIG. 8 is a CC cross-sectional view of the storage portion 11 and the grommet 60 of the vibration detection sensor 1 according to the second embodiment.
　第２の態様において、ハウジング１０は、突起部１７がなくなり、コード孔１３と注入孔１４が繋がっており、グロメット６０は、端部６２、溝部６３、径大部６４がなくなり、固定片６５、６６と基部６７が形成されている。上述の点で、第２の態様は、第１の態様と異なり、他の部分では第１の態様と同様である。 In the second aspect, the housing 10 has no protrusion 17 and the cord hole 13 and the injection hole 14 are connected, and the grommet 60 has no end 62, groove 63, and large diameter portion 64, and the fixed piece 65, 66 and a base 67 are formed. In the above point, the second aspect is different from the first aspect, and is the same as the first aspect in other parts.
　ハウジング１０は、収納部１１の上方のコード孔１３と注入孔１４が繋がっており、注入孔１４からコード孔１３へグロメット６０をスライドして嵌め込む。そのため、注入孔１４は、コード孔１３よりも大きく形成されていることが望ましい。あるいは、コード孔１３と空気孔１５を繋げて形成し、注入孔１４を独立させてもよい。
　壁部１６は、ハウジング１０の内部に封止部材７０を注入した際に、注入孔１４及び空気孔１５から溢れた封止部材７０がハウジング１０の外側に垂れることを防止する。壁部１６の頂点は、後述するグロメット６０の固定片６５、６６を超える高さを有している。 In the housing 10, the cord hole 13 and the injection hole 14 above the storage portion 11 are connected, and the grommet 60 is slid and fitted into the cord hole 13 from the injection hole 14. Therefore, it is desirable that the injection hole 14 be formed larger than the cord hole 13. Alternatively, the cord hole 13 and the air hole 15 may be connected to form the injection hole 14 independently.
The wall portion 16 prevents the sealing member 70 overflowing from the injection hole 14 and the air hole 15 from dripping outside the housing 10 when the sealing member 70 is injected into the housing 10. The apex of the wall portion 16 has a height exceeding the fixing pieces 65 and 66 of the grommet 60 described later.
　グロメット６０は、基部６７に下方の固定片６５、上方の固定片６６が形成されており、固定片６５、６６の弾性変形によりコード孔１３の端面を把持する。 The grommet 60 has a lower fixed piece 65 and an upper fixed piece 66 formed on a base 67, and grips the end face of the cord hole 13 by elastic deformation of the fixed pieces 65 and 66.
　封止部材７０は、注入孔１４からハウジング１０の内部を充填し、封止部材７０が少なくともグロメット６０の下方の固定片６５を覆うまで注入される。なお、封止部材７０は、注入孔１４及び空気孔１５から溢れた封止部材７０が下方の固定片６５及び上方の固定片６６の両方を覆うまで注入されることで、グロメット６０をより確実に固定することができる。封止部材７０は、硬化することでハウジング１０の内部を気密に封止し、且つグロメット６０を固定する。 The sealing member 70 fills the inside of the housing 10 from the injection hole 14 and is injected until the sealing member 70 covers at least the fixed piece 65 below the grommet 60. The sealing member 70 is injected until the sealing member 70 overflowing from the injection hole 14 and the air hole 15 covers both the lower fixing piece 65 and the upper fixing piece 66, so that the grommet 60 is more reliably secured. Can be fixed to. The sealing member 70 is hardened to hermetically seal the inside of the housing 10 and fix the grommet 60.
　以下に、本発明の第３の態様に係る振動検出センサ１を図９乃至１０に基づいて説明する。
　図９は、第３の態様に係る振動検出センサ１の背面側分解斜視図を、図１０は、第３の態様に係る振動検出センサ１のＢ－Ｂ断面図を示す。 The vibration detection sensor 1 according to the third aspect of the present invention will be described below with reference to FIGS.
FIG. 9 is an exploded perspective view of the back side of the vibration detection sensor 1 according to the third aspect, and FIG. 10 is a BB sectional view of the vibration detection sensor 1 according to the third aspect.
　第３の態様において、底面部２０は、基板固定部２２にリブ２４をさらに設け、電気コード５０は、回路基板４０にリブ２４側で接続され、リブ２４に支持される。上述の点で、第３の態様は、第１の態様と異なり、他の部分では第１の態様と同様である。 3rd aspect WHEREIN: The bottom face part 20 further provides the rib 24 in the board | substrate fixing | fixed part 22, and the electric cord 50 is connected to the circuit board 40 by the rib 24 side, and is supported by the rib 24. FIG. In the above point, the third aspect is different from the first aspect, and is the same as the first aspect in other parts.
　底面部２０は、回路基板４０の電気コード５０との接続部に対応する位置に、基板固定部２２から突出するリブ２４を設けている。 The bottom surface portion 20 is provided with a rib 24 protruding from the substrate fixing portion 22 at a position corresponding to a connection portion between the circuit substrate 40 and the electric cord 50.
　封止部材７０は、例えばエポキシ樹脂などが用いられる。封止部材７０は、注入孔１４からハウジング１０の内部を充填し、注入孔１４及び空気孔１５から溢れた封止部材７０がグロメット６０の端部６２を覆うまで注入される。
　リブ２４は、電気コード５０を支持し、封止部材７０に押し込まれた電気コード５０が振動検出センサ１の下方である電子回路４１及び振動検出素子３０の方向に移動することを防止する。
　封止部材７０は、硬化することでハウジング１０の内部を気密に封止し、且つグロメット６０を固定する。 For example, an epoxy resin is used for the sealing member 70. The sealing member 70 fills the inside of the housing 10 through the injection hole 14 and is injected until the sealing member 70 overflowing from the injection hole 14 and the air hole 15 covers the end portion 62 of the grommet 60.
The rib 24 supports the electric cord 50 and prevents the electric cord 50 pushed into the sealing member 70 from moving in the direction of the electronic circuit 41 and the vibration detecting element 30 below the vibration detecting sensor 1.
The sealing member 70 is hardened to hermetically seal the inside of the housing 10 and fix the grommet 60.
　次に、第１の態様に係る振動検出センサ１の製造方法について、図２乃至５を参照して説明する。 Next, a method for manufacturing the vibration detection sensor 1 according to the first aspect will be described with reference to FIGS.
　第１の工程において、底面部２０の基板固定部２２に回路基板４０をねじ４２でねじ止めする。 In the first step, the circuit board 40 is screwed to the board fixing part 22 of the bottom face part 20 with screws 42.
　第２の工程において、電気コード５０の電線５１を回路基板４０にはんだ付けする。 In the second step, the electric wire 51 of the electric cord 50 is soldered to the circuit board 40.
　第３の工程において、グロメット６０の筒部６１をコード孔１３に嵌め込み、溝部６３をハウジング１０の突起部１７に嵌合して配置する。 In the third step, the cylindrical portion 61 of the grommet 60 is fitted into the cord hole 13, and the groove 63 is fitted into the protruding portion 17 of the housing 10.
　第４の工程において、電気コード５０をグロメット６０の筒部６１に通し、ハウジング１０を底面部２０に被せる。 In the fourth step, the electric cord 50 is passed through the cylindrical portion 61 of the grommet 60 and the housing 10 is put on the bottom surface portion 20.
　第５の工程において、ハウジング１０と底面部２０を溶接し、一体化させる。 In the fifth step, the housing 10 and the bottom surface portion 20 are welded and integrated.
　第６の工程において、注入孔１４から封止部材７０を注入し、ハウジング１０の内部を充填し、注入孔１４及び空気孔１５から溢れた封止部材７０がグロメット６０の端部６２を覆うまで封止部材７０を注入する。 In the sixth step, the sealing member 70 is injected from the injection hole 14 to fill the inside of the housing 10 until the sealing member 70 overflowing from the injection hole 14 and the air hole 15 covers the end portion 62 of the grommet 60. The sealing member 70 is injected.
　第７の工程において、封止部材７０を硬化させることにより、ハウジング１０内部の振動検出素子３０や回路基板４０を気密に封止し、且つグロメット６０も固定される。 In the seventh step, by hardening the sealing member 70, the vibration detecting element 30 and the circuit board 40 inside the housing 10 are hermetically sealed, and the grommet 60 is also fixed.
　続いて、第２の態様に係る振動検出センサ１の製造方法について、図２及び図６乃至８を参照して説明する。 Subsequently, a manufacturing method of the vibration detection sensor 1 according to the second aspect will be described with reference to FIGS. 2 and 6 to 8.
　第１の工程において、底面部２０の基板固定部２２に回路基板４０をねじ４２でねじ止めする。 In the first step, the circuit board 40 is screwed to the board fixing part 22 of the bottom face part 20 with screws 42.
　第２の工程において、電気コード５０の電線５１を回路基板４０にはんだ付けする。 In the second step, the electric wire 51 of the electric cord 50 is soldered to the circuit board 40.
　第３の工程において、グロメット６０をハウジング１０の注入孔１４からコード孔１３にスライドさせて嵌め込み、固定片６５、６６でコード孔１３の端面を把持する。 In the third step, the grommet 60 is slid and fitted into the cord hole 13 from the injection hole 14 of the housing 10, and the end face of the cord hole 13 is held by the fixing pieces 65 and 66.
　第４の工程において、電気コード５０をグロメット６０の筒部６１に通し、ハウジング１０を底面部２０に被せる。 In the fourth step, the electric cord 50 is passed through the cylindrical portion 61 of the grommet 60 and the housing 10 is put on the bottom surface portion 20.
　第５の工程において、ハウジング１０と底面部２０を溶接する。 In the fifth step, the housing 10 and the bottom surface portion 20 are welded.
　第６の工程において、注入孔１４から封止部材７０を注入し、ハウジング１０の内部を充填し、注入孔１４及び空気孔１５から溢れた封止部材７０がグロメット６０の固定片６５、６６を覆うまで封止部材７０を注入する。 In the sixth step, the sealing member 70 is injected from the injection hole 14 to fill the inside of the housing 10, and the sealing member 70 overflowing from the injection hole 14 and the air hole 15 fixes the fixing pieces 65 and 66 of the grommet 60. The sealing member 70 is injected until it is covered.
　第７の工程において、封止部材７０を硬化させることにより、ハウジング１０内部の振動検出素子３０や回路基板４０を気密に封止し、且つグロメット６０も固定される。 In the seventh step, by hardening the sealing member 70, the vibration detecting element 30 and the circuit board 40 inside the housing 10 are hermetically sealed, and the grommet 60 is also fixed.
　次に、第３の態様に係る振動検出センサ１の製造方法について、図２乃至３、図９乃至１０を参照して説明する。 Next, a method for manufacturing the vibration detection sensor 1 according to the third aspect will be described with reference to FIGS. 2 to 3 and FIGS. 9 to 10.
　第１の工程において、底面部２０の基板固定部２２に回路基板４０をねじ４２でねじ止めする。 In the first step, the circuit board 40 is screwed to the board fixing part 22 of the bottom face part 20 with screws 42.
　第２の工程において、電気コード５０の電線５１を回路基板４０にはんだ付けし、電線５１をリブ２４の上に引き回す。 In the second step, the electric wires 51 of the electric cord 50 are soldered to the circuit board 40, and the electric wires 51 are routed on the ribs 24.
　第３の工程において、グロメット６０の筒部６１をコード孔１３に嵌め込み、溝部６３をハウジング１０の突起部１７に嵌合して配置する。 In the third step, the cylindrical portion 61 of the grommet 60 is fitted into the cord hole 13, and the groove 63 is fitted into the protruding portion 17 of the housing 10.
　第４の工程において、電気コード５０をグロメット６０の筒部６１に通し、ハウジング１０を底面部２０に被せる。 In the fourth step, the electric cord 50 is passed through the cylindrical portion 61 of the grommet 60 and the housing 10 is put on the bottom surface portion 20.
　第５の工程において、ハウジング１０と底面部２０を溶接し、一体化させる。 In the fifth step, the housing 10 and the bottom surface portion 20 are welded and integrated.
　第６の工程において、注入孔１４から封止部材７０を注入し、ハウジング１０の内部を充填し、注入孔１４及び空気孔１５から溢れた封止部材７０がグロメット６０の端部６２を覆うまで封止部材７０を注入する。
　このとき、リブ２４が電気コード５０を支持し、封止部材７０に押し込まれた電気コード５０が振動検出センサ１の下方である電子回路４１及び振動検出素子３０の方向に移動することを防止する。 In the sixth step, the sealing member 70 is injected from the injection hole 14 to fill the inside of the housing 10 until the sealing member 70 overflowing from the injection hole 14 and the air hole 15 covers the end portion 62 of the grommet 60. The sealing member 70 is injected.
At this time, the rib 24 supports the electric cord 50 and prevents the electric cord 50 pushed into the sealing member 70 from moving in the direction of the electronic circuit 41 and the vibration detecting element 30 below the vibration detecting sensor 1. .
　第７の工程において、封止部材７０を硬化させることにより、ハウジング１０内部の振動検出素子３０や回路基板４０を気密に封止し、且つグロメット６０も固定される。 In the seventh step, by hardening the sealing member 70, the vibration detecting element 30 and the circuit board 40 inside the housing 10 are hermetically sealed, and the grommet 60 is also fixed.
　以上に説明した本発明は、以下の効果を奏する。 The present invention described above has the following effects.
　振動検出センサ１は、封止部材７０を充填してハウジング１０の内部の振動検出素子３０や回路基板４０を気密に封止することで気密性や防水性を確保し、且つグロメット６０も同時に固定でき製造工程も容易となる。 The vibration detection sensor 1 fills the sealing member 70 and hermetically seals the vibration detection element 30 and the circuit board 40 inside the housing 10 to ensure airtightness and waterproofness, and also fixes the grommet 60 at the same time. And the manufacturing process becomes easy.
　振動検出センサ１は、底面部２０の設置部２３に形成された雄ねじを被検出体１００に形成された雌ねじに合わせ、ハウジング１０の台部１２をレンチやスパナで回すことで取り付けられる。被検出体１００で振動が発生すると、設置部２３、平板部２１を介して振動が伝達され、基板固定部２２に取り付けられた回路基板４０の振動検出素子３０が振動を検出し、検出された振動に基づく電気信号を電気コード５０を介して振動検出センサ１から出力する。振動検出素子３０は、回路基板４０の被検出体１００に近い位置に実装されているため、被検出体１００が発生させる振動を精度よく検出することができる。 The vibration detection sensor 1 is attached by aligning the male screw formed on the installation portion 23 of the bottom surface portion 20 with the female screw formed on the detected body 100 and turning the base portion 12 of the housing 10 with a wrench or spanner. When vibration is generated in the detection object 100, vibration is transmitted through the installation part 23 and the flat plate part 21, and the vibration detection element 30 of the circuit board 40 attached to the board fixing part 22 detects the vibration and detects it. An electric signal based on the vibration is output from the vibration detection sensor 1 via the electric cord 50. Since the vibration detection element 30 is mounted at a position close to the detection target 100 of the circuit board 40, the vibration generated by the detection target 100 can be accurately detected.
　回路基板４０は、被検出体１００に対して略垂直に固定される。これにより、回路基板４０を被検出体１００に対して略水平に固定したときと比べて平板部２１の面積を小さくでき、被検出体１００との設置面を小さくすることができる。 The circuit board 40 is fixed substantially perpendicular to the detected object 100. Thereby, compared with the case where the circuit board 40 is fixed substantially horizontally with respect to the to-be-detected body 100, the area of the flat plate part 21 can be made small and the installation surface with the to-be-detected body 100 can be made small.
　振動検出センサ１は、基板固定部２２にリブ２４を設けることで、リブ２４が電気コード５０を支持し、封止部材７０に押し込まれた電気コード５０が振動検出センサ１の下方である電子回路４１及び振動検出素子３０の方向に移動することを防止する。これにより、製造工程における電気コード５０の取り扱いが容易になる。
　また、電気コード５０と電子回路４１及び振動検出素子３０の距離を確保することで、ノイズの発生を防止することができる。 In the vibration detection sensor 1, the rib 24 is provided on the substrate fixing portion 22, so that the rib 24 supports the electric cord 50 and the electric cord 50 pushed into the sealing member 70 is below the vibration detection sensor 1. 41 and the vibration detecting element 30 are prevented from moving. This facilitates handling of the electric cord 50 in the manufacturing process.
Further, by ensuring the distance between the electric cord 50, the electronic circuit 41, and the vibration detecting element 30, it is possible to prevent the generation of noise.
　なお、第３の態様において、第１の態様にリブ２４を設けたが、第２の態様に設けてもよい。 In addition, in the 3rd aspect, although the rib 24 was provided in the 1st aspect, you may provide in a 2nd aspect.
　なお、本発明は、以上の態様及び図面によって限定されるものではない。本発明の要旨を変更しない範囲で、適宜、変更（構成要素の削除も含む）を加えることが可能である。 The present invention is not limited to the above aspects and drawings. Changes (including deletion of components) can be made as appropriate without departing from the scope of the present invention.
１　　　　　振動検出センサ
１０　　　　ハウジング
１１　　　　収納部
１２　　　　台部
１３　　　　コード孔
１４　　　　注入孔
１５　　　　空気孔
１６　　　　壁部
１７　　　　突起部
２０　　　　底面部
２１　　　　平板部
２２　　　　基板固定部
２３　　　　設置部
２４　　　　リブ
３０　　　　振動検出素子
４０　　　　回路基板
５０　　　　電気コード
６０　　　　グロメット
６１　　　　筒部
６２　　　　端部
６３　　　　溝部
６４　　　　径大部
６５、６６　固定片
６７　　　　基部
７０　　　　封止部材
１００　　　被検出体 DESCRIPTION OF SYMBOLS 1 Vibration detection sensor 10 Housing 11 Storage part 12 Base part 13 Code hole 14 Injection hole 15 Air hole 16 Wall part 17 Projection part 20 Bottom face part 21 Flat plate part 22 Substrate fixing part 23 Installation part 24 Rib 30 Vibration detection element 40 Circuit board 50 Electrical cord 60 Grommet 61 Cylindrical part 62 End part 63 Groove part 64 Large diameter part 65, 66 Fixed piece 67 Base part 70 Sealing member 100 Detected object

Claims (11)

  1. 　振動を検出する振動検出素子と、
    　前記振動検出素子が実装される回路基板と、
    　前記回路基板が内部に固定されるハウジングと、
    　を備え、
    　前記ハウジングは、グロメットが嵌め込まれるコード孔と、封止部材の注入孔と、空気孔と、を有し、
    　前記ハウジングは、前記封止部材によって気密に封止され、
    　前記グロメットは、前記封止部材によって固定される、
    　ことを特徴とする振動検出センサ。     A vibration detecting element for detecting vibration;
    A circuit board on which the vibration detection element is mounted;
    A housing in which the circuit board is fixed;
    With
    The housing has a cord hole into which a grommet is fitted, an injection hole of a sealing member, and an air hole,
    The housing is hermetically sealed by the sealing member;
    The grommet is fixed by the sealing member.
    A vibration detection sensor characterized by that.
  2. 　前記グロメットは端部を有し、
    　前記ハウジングは、前記端部よりも高い壁部を有する、
    　ことを特徴とする請求項１に記載の振動検出センサ。     The grommet has an end;
    The housing has a higher wall than the end;
    The vibration detection sensor according to claim 1.
  3. 　前記ハウジングは突起部を有し、
    　前記グロメットは、前記突起部と嵌合する溝部を有する、
    　ことを特徴とする請求項２に記載の振動検出センサ。     The housing has a protrusion;
    The grommet has a groove that fits with the protrusion.
    The vibration detection sensor according to claim 2.
  4. 　前記封止部材は、前記端部より高く、前記壁部の頂点より低い高さまで注入される、
    　ことを特徴とする請求項２乃至３のいずれか１つに記載の振動検出センサ。     The sealing member is injected to a height higher than the end and lower than the top of the wall.
    The vibration detection sensor according to any one of claims 2 to 3, wherein
  5. 　前記グロメットは、コード孔を把持する二つの固定片を有し、
    　前記ハウジングは、前記固定片よりも高い壁部を有する、
    　ことを特徴とする請求項１に記載の振動検出センサ。     The grommet has two fixed pieces that grip the cord hole,
    The housing has a higher wall than the fixed piece.
    The vibration detection sensor according to claim 1.
  6. 　前記ハウジングにおいて、
    　前記コード孔は、前記注入孔又は前記空気孔と繋がっている、
    　ことを特徴とする請求項５に記載の振動検出センサ。     In the housing,
    The cord hole is connected to the injection hole or the air hole,
    The vibration detection sensor according to claim 5.
  7. 　前記ハウジングにおいて、
    　前記コード孔は、繋がっている前記注入孔又は前記空気孔よりも小さい、
    　ことを特徴とする請求項６に記載の振動検出センサ。     In the housing,
    The cord hole is smaller than the injection hole or the air hole connected,
    The vibration detection sensor according to claim 6.
  8. 　前記封止部材は、前記固定片より高く、前記壁部の頂点より低い高さまで注入される、
    　ことを特徴とする請求項５乃至７のいずれか１つに記載の振動検出センサ。     The sealing member is injected to a height higher than the fixed piece and lower than the apex of the wall.
    The vibration detection sensor according to any one of claims 5 to 7,
  9. 　前記注入孔から前記封止部材を注入し、
    　前記ハウジングの内部を充填して前記注入孔及び前記空気孔から溢れた前記封止部材によって前記グロメットを固定する、
    　ことを特徴とする請求項１乃至８のいずれか１つに記載の振動検出センサの製造方法。     Injecting the sealing member from the injection hole,
    The grommet is fixed by the sealing member filling the interior of the housing and overflowing from the injection hole and the air hole,
    The method for manufacturing a vibration detection sensor according to any one of claims 1 to 8,
  10. 　平板部と、基板固定部と、を有する底面部をさらに備え、
    　前記基板固定部は、前記平板部に対して略垂直に設けられて前記回路基板を固定し、
    　前記回路基板は、電気信号を外部に出力するための電気コードと接続され、
    　前記基板固定部は、前記電気コードに対応する位置にリブを設けてなる、
    　ことを特徴とする請求項１乃至８のいずれか１つに記載の振動検出センサ。     Further comprising a bottom surface portion having a flat plate portion and a substrate fixing portion,
    The board fixing part is provided substantially perpendicular to the flat plate part to fix the circuit board,
    The circuit board is connected to an electric cord for outputting an electric signal to the outside,
    The board fixing portion is provided with a rib at a position corresponding to the electric cord.
    The vibration detection sensor according to any one of claims 1 to 8.
  11. 　前記注入孔から前記封止部材を注入し、
    　前記ハウジングの内部を充填して前記注入孔及び前記空気孔から溢れた前記封止部材によって前記グロメットを固定し、
    　前記リブが前記グロメットを通した前記電気コードを支持し、前記電気コードが前記封止部材により押し込まれることを防止する、
    　ことを特徴とする請求項１０に記載の振動検出センサの製造方法。     Injecting the sealing member from the injection hole,
    The grommet is fixed by the sealing member filling the inside of the housing and overflowing from the injection hole and the air hole,
    The rib supports the electric cord through the grommet and prevents the electric cord from being pushed in by the sealing member;
    The method of manufacturing a vibration detection sensor according to claim 10.
PCT/JP2019/020029 2018-05-28 2019-05-21 Vibration detection sensor WO2019230490A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022129966A (en) * 2021-02-25 2022-09-06 株式会社ミヤワキ Measuring device

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55141639A (en) * 1979-04-20 1980-11-05 Nissan Motor Co Ltd Vibration sensor
JPS55157737U (en) * 1979-05-01 1980-11-13
JPS55165235U (en) * 1979-05-16 1980-11-27
JPS58143223A (en) * 1982-02-18 1983-08-25 アライド・コ−ポレ−シヨン Vibration detector
JPH06221906A (en) * 1992-09-18 1994-08-12 Eaton Corp Method and device for separating detector
JPH0734318U (en) * 1993-11-30 1995-06-23 株式会社ゼクセル Linear displacement sensor
JPH10249883A (en) * 1997-03-14 1998-09-22 Koganei Corp Sensor switch for positional detection for moving member of fluid pressure actuator and manufacture thereof
JP2000214176A (en) * 1999-01-26 2000-08-04 Tdk Corp Moving object detecting device
JP2004053329A (en) * 2002-07-18 2004-02-19 Hitachi Ltd Semiconductor sensor assembly body and tire monitoring sensor
JP2004184145A (en) * 2002-12-02 2004-07-02 Ngk Spark Plug Co Ltd Gas and temperature detector, and method of manufacturing gas and temperature detector
JP2006294702A (en) * 2005-04-06 2006-10-26 Fuji Electric Systems Co Ltd Semiconductor package and substrate therefor
JP2010010342A (en) * 2008-06-26 2010-01-14 Seiko Epson Corp Method of manufacturing optical module
JP2012078123A (en) * 2010-09-30 2012-04-19 Tdk Corp Position sensor, manufacturing method thereof, and positioning tool
WO2012176303A1 (en) * 2011-06-23 2012-12-27 本田技研工業株式会社 Waterproof structure for electronic device
JP2015170839A (en) * 2014-03-11 2015-09-28 スタンレー電気株式会社 Light emitting device and lighting device
JP2015211220A (en) * 2015-04-09 2015-11-24 三菱電機株式会社 Method of manufacturing waterproof electronic device
WO2017217120A1 (en) * 2016-06-16 2017-12-21 株式会社村田製作所 Grommet, battery pack, and electronic device

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55141639A (en) * 1979-04-20 1980-11-05 Nissan Motor Co Ltd Vibration sensor
JPS55157737U (en) * 1979-05-01 1980-11-13
JPS55165235U (en) * 1979-05-16 1980-11-27
JPS58143223A (en) * 1982-02-18 1983-08-25 アライド・コ−ポレ−シヨン Vibration detector
JPH06221906A (en) * 1992-09-18 1994-08-12 Eaton Corp Method and device for separating detector
JPH0734318U (en) * 1993-11-30 1995-06-23 株式会社ゼクセル Linear displacement sensor
JPH10249883A (en) * 1997-03-14 1998-09-22 Koganei Corp Sensor switch for positional detection for moving member of fluid pressure actuator and manufacture thereof
JP2000214176A (en) * 1999-01-26 2000-08-04 Tdk Corp Moving object detecting device
JP2004053329A (en) * 2002-07-18 2004-02-19 Hitachi Ltd Semiconductor sensor assembly body and tire monitoring sensor
JP2004184145A (en) * 2002-12-02 2004-07-02 Ngk Spark Plug Co Ltd Gas and temperature detector, and method of manufacturing gas and temperature detector
JP2006294702A (en) * 2005-04-06 2006-10-26 Fuji Electric Systems Co Ltd Semiconductor package and substrate therefor
JP2010010342A (en) * 2008-06-26 2010-01-14 Seiko Epson Corp Method of manufacturing optical module
JP2012078123A (en) * 2010-09-30 2012-04-19 Tdk Corp Position sensor, manufacturing method thereof, and positioning tool
WO2012176303A1 (en) * 2011-06-23 2012-12-27 本田技研工業株式会社 Waterproof structure for electronic device
JP2015170839A (en) * 2014-03-11 2015-09-28 スタンレー電気株式会社 Light emitting device and lighting device
JP2015211220A (en) * 2015-04-09 2015-11-24 三菱電機株式会社 Method of manufacturing waterproof electronic device
WO2017217120A1 (en) * 2016-06-16 2017-12-21 株式会社村田製作所 Grommet, battery pack, and electronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022129966A (en) * 2021-02-25 2022-09-06 株式会社ミヤワキ Measuring device
JP7253277B2 (en) 2021-02-25 2023-04-06 株式会社ミヤワキ Measuring device

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