JP5922769B2 - 試験用キャリア - Google Patents
試験用キャリア Download PDFInfo
- Publication number
- JP5922769B2 JP5922769B2 JP2014519928A JP2014519928A JP5922769B2 JP 5922769 B2 JP5922769 B2 JP 5922769B2 JP 2014519928 A JP2014519928 A JP 2014519928A JP 2014519928 A JP2014519928 A JP 2014519928A JP 5922769 B2 JP5922769 B2 JP 5922769B2
- Authority
- JP
- Japan
- Prior art keywords
- test
- wiring
- electronic device
- device under
- test carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 238000012360 testing method Methods 0.000 title claims description 121
- 239000000758 substrate Substances 0.000 claims description 56
- 239000013013 elastic material Substances 0.000 claims description 6
- 230000001629 suppression Effects 0.000 claims description 4
- 239000010408 film Substances 0.000 description 41
- 239000013039 cover film Substances 0.000 description 21
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Description
20…ベース部材
30…ベースフレーム
40…ベースフィルム
41…フィルム本体
42…配線パターン
43…外部電極
44…ボンディングワイヤ
50…多層基板
51…基板本体
52…配線
53…抵抗部
54…バンプ
60…カバー部材
70…カバーフレーム
71…開口
80…カバーフィルム
90…ダイ
91…電極パッド
Claims (8)
- 被試験電子部品を保持する第1部材と、
前記第1部材に重ねられて前記被試験電子部品を覆う第2部材を備えた試験用キャリアであって、
前記第1部材は、
前記被試験電子部品と電気的に接続する配線を有した基板及び前記被試験電子部品と電気的な接点をとる接点部を備え、
前記配線は、
所定の第1抵抗値をもつ第1配線部と、当該第1抵抗値より高い第2抵抗値をもつ第2配線部とを有し、
前記第1配線部の一端は前記接点部に接続されている
ことを特徴とする試験用キャリア。 - 請求項1記載の試験用キャリアであって、
前記第2抵抗値は、
前記被試験電子部品を試験する試験装置の所定の上限出力と、前記被試験電子部品と前記試験用キャリアとの間の電気的な接点の数に応じて設定されている
ことを特徴とする試験用キャリア。 - 請求項1又は2記載の試験用キャリアであって、
前記第1部材は前記配線の一端に電気的に接続された外部電極を備え、
前記第2配線部は、
前記外部電極より、前記被試験電子部品と前記第1部材との間の電気的な接点部分に近い側に形成されている
ことを特徴とする試験用キャリア。 - 被試験電子部品を保持する第1部材と、
前記第1部材に重ねられて前記被試験電子部品を覆う第2部材を備えた試験用キャリアであって、
前記第1部材は、前記被試験電子部品と電気的な接点をとる接点部を複数有し、
前記接点部の抵抗値は、前記被試験電子部品を試験する試験装置の所定の上限出力と、前記被試験電子部品と前記第1部材との間の電気的な接点の数に応じて設定されている
ことを特徴とする試験用キャリア。 - 請求項4記載の試験用キャリアであって、
前記接点部は、導電性の弾性材により形成され、
前記抵抗値は、前記弾性材の含有量で調整されている
ことを特徴とする試験用キャリア。 - 請求項1〜5のいずれか一項に記載の試験用キャリアであって、
前記第1部材の基板は多層基板により形成されている
ことを特徴とする試験用キャリア。 - 請求項1〜6のいずれか一項に記載の試験用キャリアであって、
前記第1部材の基板はノイズを抑制するノイズ抑制部を有する
ことを特徴とする試験用キャリア。 - 請求項7記載の試験用キャリアであって、
前記第1部材は配線の一端に電気的に接続された外部電極を備え、
前記ノイズ抑制部は、前記外部電極より、前記被試験電子部品と前記第1部材との間の電気的な接点部分に近い側に形成されている
ことを特徴とする試験用キャリア。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014519928A JP5922769B2 (ja) | 2012-06-05 | 2013-05-27 | 試験用キャリア |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012128164 | 2012-06-05 | ||
JP2012128164 | 2012-06-05 | ||
PCT/JP2013/064608 WO2013183479A1 (ja) | 2012-06-05 | 2013-05-27 | 試験用キャリア |
JP2014519928A JP5922769B2 (ja) | 2012-06-05 | 2013-05-27 | 試験用キャリア |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013183479A1 JPWO2013183479A1 (ja) | 2016-01-28 |
JP5922769B2 true JP5922769B2 (ja) | 2016-05-24 |
Family
ID=49711872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014519928A Active JP5922769B2 (ja) | 2012-06-05 | 2013-05-27 | 試験用キャリア |
Country Status (5)
Country | Link |
---|---|
US (1) | US9702901B2 (ja) |
JP (1) | JP5922769B2 (ja) |
KR (1) | KR101561451B1 (ja) |
TW (1) | TWI479164B (ja) |
WO (1) | WO2013183479A1 (ja) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2765363B2 (ja) * | 1992-04-20 | 1998-06-11 | 日本電気株式会社 | Icソケット |
US5828224A (en) | 1994-03-18 | 1998-10-27 | Fujitsu, Limited | Test carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuit |
US5986459A (en) | 1994-03-18 | 1999-11-16 | Fujitsu Limited | Semiconductor device testing carrier and method of fixing semiconductor device to testing carrier |
JP3491700B2 (ja) | 1994-03-18 | 2004-01-26 | 富士通株式会社 | 半導体集積回路装置の試験用キャリア |
US6639416B1 (en) * | 1996-07-02 | 2003-10-28 | Micron Technology, Inc. | Method and apparatus for testing semiconductor dice |
JP2877132B2 (ja) * | 1997-03-26 | 1999-03-31 | 日本電気株式会社 | 多層プリント基板とその製造方法 |
JP4955395B2 (ja) * | 2004-09-06 | 2012-06-20 | 日本電気株式会社 | テストキャリア |
US7548433B2 (en) * | 2005-05-12 | 2009-06-16 | Dell Products L.P. | Apparatus and method for setting adequate drive strength based upon DC trace resistance |
DE102008024480A1 (de) * | 2008-05-21 | 2009-12-03 | Epcos Ag | Elektrische Bauelementanordnung |
KR101085752B1 (ko) | 2010-05-10 | 2011-11-21 | 삼성전기주식회사 | 회로 기판 및 상기 회로 기판에 장착된 성분의 테스트 방법 |
-
2013
- 2013-05-22 TW TW102117998A patent/TWI479164B/zh active
- 2013-05-27 US US14/405,064 patent/US9702901B2/en active Active
- 2013-05-27 KR KR1020147023724A patent/KR101561451B1/ko active IP Right Grant
- 2013-05-27 JP JP2014519928A patent/JP5922769B2/ja active Active
- 2013-05-27 WO PCT/JP2013/064608 patent/WO2013183479A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TWI479164B (zh) | 2015-04-01 |
US20150130492A1 (en) | 2015-05-14 |
JPWO2013183479A1 (ja) | 2016-01-28 |
WO2013183479A1 (ja) | 2013-12-12 |
KR20140123970A (ko) | 2014-10-23 |
KR101561451B1 (ko) | 2015-10-19 |
TW201411153A (zh) | 2014-03-16 |
US9702901B2 (en) | 2017-07-11 |
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