JP5918926B2 - 保護膜形成用フィルムおよび半導体チップの製造方法 - Google Patents

保護膜形成用フィルムおよび半導体チップの製造方法 Download PDF

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JP5918926B2
JP5918926B2 JP2010230826A JP2010230826A JP5918926B2 JP 5918926 B2 JP5918926 B2 JP 5918926B2 JP 2010230826 A JP2010230826 A JP 2010230826A JP 2010230826 A JP2010230826 A JP 2010230826A JP 5918926 B2 JP5918926 B2 JP 5918926B2
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protective film
film
forming
copper ion
back surface
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JP2012084744A5 (https=
JP2012084744A (ja
Inventor
智則 篠田
智則 篠田
高野　健
健 高野
瑠紗加 山下
瑠紗加 山下
洋司 若山
洋司 若山
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Lintec Corp
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Lintec Corp
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  • Formation Of Insulating Films (AREA)
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JP2010230826A 2010-10-13 2010-10-13 保護膜形成用フィルムおよび半導体チップの製造方法 Active JP5918926B2 (ja)

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JP2010230826A JP5918926B2 (ja) 2010-10-13 2010-10-13 保護膜形成用フィルムおよび半導体チップの製造方法

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JP2010230826A JP5918926B2 (ja) 2010-10-13 2010-10-13 保護膜形成用フィルムおよび半導体チップの製造方法

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JP2014260263A Division JP6085288B2 (ja) 2014-12-24 2014-12-24 保護膜形成用フィルムおよび半導体チップの製造方法

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JP2012084744A JP2012084744A (ja) 2012-04-26
JP2012084744A5 JP2012084744A5 (https=) 2013-09-05
JP5918926B2 true JP5918926B2 (ja) 2016-05-18

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6411142B2 (ja) * 2014-09-09 2018-10-24 株式会社ディスコ 保護被膜の被覆方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226308A (ja) * 1992-02-18 1993-09-03 Sony Corp 半導体ウエハの裏面処理方法及びその装置
JP2000124177A (ja) * 1998-10-15 2000-04-28 Sony Corp 半導体装置の製造方法
JP3544362B2 (ja) * 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
JP2008218930A (ja) * 2007-03-07 2008-09-18 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
US20100007007A1 (en) * 2008-07-08 2010-01-14 Samsung Electronics Co., Ltd Semiconductor package

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