JP5918278B2 - 応力に関連した温度測定誤差を除去するように構成されたマイクロワイヤ温度センサおよびそのセンサの製造方法 - Google Patents
応力に関連した温度測定誤差を除去するように構成されたマイクロワイヤ温度センサおよびそのセンサの製造方法 Download PDFInfo
- Publication number
- JP5918278B2 JP5918278B2 JP2013557828A JP2013557828A JP5918278B2 JP 5918278 B2 JP5918278 B2 JP 5918278B2 JP 2013557828 A JP2013557828 A JP 2013557828A JP 2013557828 A JP2013557828 A JP 2013557828A JP 5918278 B2 JP5918278 B2 JP 5918278B2
- Authority
- JP
- Japan
- Prior art keywords
- microwire
- temperature
- tube
- primary
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/36—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using magnetic elements, e.g. magnets, coils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K15/00—Testing or calibrating of thermometers
- G01K15/005—Calibration
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161464682P | 2011-03-09 | 2011-03-09 | |
| US61/464,682 | 2011-03-09 | ||
| US13/411,767 US9212955B2 (en) | 2011-03-09 | 2012-03-05 | Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors |
| US13/411,767 | 2012-03-05 | ||
| PCT/US2012/028058 WO2012122258A2 (en) | 2011-03-09 | 2012-03-07 | Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014507671A JP2014507671A (ja) | 2014-03-27 |
| JP2014507671A5 JP2014507671A5 (enExample) | 2015-04-02 |
| JP5918278B2 true JP5918278B2 (ja) | 2016-05-18 |
Family
ID=46795552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013557828A Active JP5918278B2 (ja) | 2011-03-09 | 2012-03-07 | 応力に関連した温度測定誤差を除去するように構成されたマイクロワイヤ温度センサおよびそのセンサの製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9212955B2 (enExample) |
| EP (1) | EP2684014B1 (enExample) |
| JP (1) | JP5918278B2 (enExample) |
| CN (1) | CN103718010B (enExample) |
| AU (1) | AU2012225525B2 (enExample) |
| CA (1) | CA2828774C (enExample) |
| ES (1) | ES2665945T3 (enExample) |
| IL (1) | IL228288B (enExample) |
| WO (1) | WO2012122258A2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7385357B2 (en) | 1999-06-21 | 2008-06-10 | Access Business Group International Llc | Inductively coupled ballast circuit |
| GB2478674B (en) | 2009-01-06 | 2014-05-07 | Access Business Group Int Llc | Smart cookware |
| KR101821904B1 (ko) | 2010-04-08 | 2018-01-24 | 액세스 비지니스 그룹 인터내셔날 엘엘씨 | Pos 유도성 시스템 및 방법 |
| FR2988172B1 (fr) * | 2012-03-19 | 2014-12-26 | Sc2N Sa | Capteur de temperature |
| ES2555542B1 (es) * | 2014-05-27 | 2016-10-19 | Consejo Superior De Investigaciones Científicas (Csic) | Sensor embebido para la medida continua de resistencias mecánicas en estructuras de material cementicio, método de fabricación del mismo, y sistema y método de medida continua de resistencias mecánicas en estructuras de material cementicio |
| DE102018222111A1 (de) * | 2018-12-18 | 2020-06-18 | Schott Ag | Ofen, insbesondere Kühlofen |
| US12304157B2 (en) | 2021-10-20 | 2025-05-20 | Tsi Technologies Llc | In-situ monitoring and control of induction welding of thermoplastic composites using amorphous or nanocrystalline microwire temperature sensors and self-centering antennae rail system |
| CN117276846B (zh) * | 2023-11-02 | 2024-03-05 | 广州博远装备科技有限公司 | 一种基于形状记忆合金的自适应短波天线 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2047539C3 (de) * | 1970-09-26 | 1973-09-20 | Gesellschaft Fuer Kernforschung Mbh, 7500 Karlsruhe | Thermoelement |
| SU832505A2 (ru) * | 1979-03-05 | 1981-05-23 | Казанский Ордена Трудового Красного Зна-Мени Авиационный Институт Им.A.H.Туполева | Нановеберметр |
| JPH0575631U (ja) * | 1992-03-17 | 1993-10-15 | ティーディーケイ株式会社 | 温度センサ |
| JPH1183641A (ja) * | 1997-09-08 | 1999-03-26 | Kurabe Ind Co Ltd | ガラス封止型サーミスタ |
| JP2000146714A (ja) * | 1998-11-06 | 2000-05-26 | Oji Paper Co Ltd | 蒸解釜用温度検出器 |
| US6208253B1 (en) * | 2000-04-12 | 2001-03-27 | Massachusetts Institute Of Technology | Wireless monitoring of temperature |
| US7794142B2 (en) | 2006-05-09 | 2010-09-14 | Tsi Technologies Llc | Magnetic element temperature sensors |
| WO2007134061A2 (en) * | 2006-05-09 | 2007-11-22 | Thermal Solutions, Inc. | Magnetic element temperature sensors |
| US8258441B2 (en) | 2006-05-09 | 2012-09-04 | Tsi Technologies Llc | Magnetic element temperature sensors |
| US7736052B2 (en) | 2006-08-11 | 2010-06-15 | Beadedstream, Llc | Multipoint digital temperature acquisition system |
| US8192080B2 (en) | 2007-01-23 | 2012-06-05 | Tsi Technologies Llc | Microwire-controlled autoclave and method |
| US8033715B2 (en) * | 2007-11-08 | 2011-10-11 | Illinois Institute Of Technology | Nanoparticle based thermal history indicators |
| JP5049879B2 (ja) * | 2008-05-28 | 2012-10-17 | 株式会社デンソー | 温度センサ |
| US8286497B2 (en) | 2009-06-25 | 2012-10-16 | Tsi Technologies Llc | Strain sensor |
| US8485723B2 (en) | 2009-08-12 | 2013-07-16 | Tsi Technologies Llc | One-time sensor device |
-
2012
- 2012-03-05 US US13/411,767 patent/US9212955B2/en active Active
- 2012-03-07 EP EP12754370.0A patent/EP2684014B1/en active Active
- 2012-03-07 WO PCT/US2012/028058 patent/WO2012122258A2/en not_active Ceased
- 2012-03-07 JP JP2013557828A patent/JP5918278B2/ja active Active
- 2012-03-07 AU AU2012225525A patent/AU2012225525B2/en not_active Ceased
- 2012-03-07 CA CA2828774A patent/CA2828774C/en active Active
- 2012-03-07 CN CN201280012248.9A patent/CN103718010B/zh active Active
- 2012-03-07 ES ES12754370.0T patent/ES2665945T3/es active Active
-
2013
- 2013-09-03 IL IL228288A patent/IL228288B/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| EP2684014A4 (en) | 2015-03-04 |
| IL228288B (en) | 2018-01-31 |
| AU2012225525A1 (en) | 2013-09-26 |
| WO2012122258A3 (en) | 2012-12-13 |
| WO2012122258A2 (en) | 2012-09-13 |
| ES2665945T3 (es) | 2018-04-30 |
| CA2828774A1 (en) | 2012-09-13 |
| CN103718010B (zh) | 2016-03-16 |
| US9212955B2 (en) | 2015-12-15 |
| AU2012225525B2 (en) | 2015-03-05 |
| EP2684014A2 (en) | 2014-01-15 |
| JP2014507671A (ja) | 2014-03-27 |
| EP2684014B1 (en) | 2018-02-28 |
| CN103718010A (zh) | 2014-04-09 |
| CA2828774C (en) | 2019-04-09 |
| US20120230365A1 (en) | 2012-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5918278B2 (ja) | 応力に関連した温度測定誤差を除去するように構成されたマイクロワイヤ温度センサおよびそのセンサの製造方法 | |
| US7794142B2 (en) | Magnetic element temperature sensors | |
| US8192080B2 (en) | Microwire-controlled autoclave and method | |
| EP2446222B1 (en) | Improved strain sensor | |
| Reis et al. | Characterization of Metglas/poly (vinylidene fluoride)/Metglas magnetoelectric laminates for AC/DC magnetic sensor applications | |
| JP2014507671A5 (enExample) | ||
| Pepakayala et al. | Passive wireless strain sensors using microfabricated magnetoelastic beam elements | |
| CN103837603B (zh) | 残余应力梯度校准试块的使用方法 | |
| US20110038395A1 (en) | One-time sensor device | |
| CN108917831A (zh) | 聚合物封装光栅传感器及传感器粘弹性效应的修正方法 | |
| Leal-Junior et al. | Smartphone integrated polymer optical fiber humidity sensor: Towards a fully portable solution for healthcare | |
| Jurc et al. | Sensoric application of glass-coated magnetic microwires | |
| MD4456C1 (ro) | Senzori de temperatură cu microconductori pentru eliminarea erorilor de măsurare a temperaturii dependente de tensiune | |
| Wang et al. | A circular target flow measurement system | |
| AU2008207908B2 (en) | Microwire-controlled autoclave and method | |
| Szewczyk et al. | The temperature dependence of the magnetoelastic characteristics of cores for force sensors utilizing Fe70Ni8Si10B12 amorphous alloy | |
| HK1157861B (en) | Remote temperature sensing device and related remote temperature sensing method | |
| JPS59131105A (ja) | 高分子材料の変位検出方法および装置 | |
| HK1157861A1 (en) | Remote temperature sensing device and related remote temperature sensing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140310 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150210 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150210 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20151228 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160105 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160302 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160329 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160407 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5918278 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |