CA2828774C - Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors - Google Patents

Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors Download PDF

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Publication number
CA2828774C
CA2828774C CA2828774A CA2828774A CA2828774C CA 2828774 C CA2828774 C CA 2828774C CA 2828774 A CA2828774 A CA 2828774A CA 2828774 A CA2828774 A CA 2828774A CA 2828774 C CA2828774 C CA 2828774C
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Prior art keywords
microwire
temperature
primary
tube
sensor
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CA2828774A
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English (en)
French (fr)
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CA2828774A1 (en
Inventor
Brian L. Clothier
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TSI Technologies LLC
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TSI Technologies LLC
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Publication of CA2828774A1 publication Critical patent/CA2828774A1/en
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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/36Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using magnetic elements, e.g. magnets, coils
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08Protective devices, e.g. casings
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00Testing or calibrating of thermometers
    • G01K15/005Calibration

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Measuring Fluid Pressure (AREA)
CA2828774A 2011-03-09 2012-03-07 Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors Active CA2828774C (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161464682P 2011-03-09 2011-03-09
US61/464,682 2011-03-09
US13/411,767 US9212955B2 (en) 2011-03-09 2012-03-05 Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors
US13/411,767 2012-03-05
PCT/US2012/028058 WO2012122258A2 (en) 2011-03-09 2012-03-07 Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors

Publications (2)

Publication Number Publication Date
CA2828774A1 CA2828774A1 (en) 2012-09-13
CA2828774C true CA2828774C (en) 2019-04-09

Family

ID=46795552

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2828774A Active CA2828774C (en) 2011-03-09 2012-03-07 Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors

Country Status (9)

Country Link
US (1) US9212955B2 (enExample)
EP (1) EP2684014B1 (enExample)
JP (1) JP5918278B2 (enExample)
CN (1) CN103718010B (enExample)
AU (1) AU2012225525B2 (enExample)
CA (1) CA2828774C (enExample)
ES (1) ES2665945T3 (enExample)
IL (1) IL228288B (enExample)
WO (1) WO2012122258A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7385357B2 (en) 1999-06-21 2008-06-10 Access Business Group International Llc Inductively coupled ballast circuit
GB2478674B (en) 2009-01-06 2014-05-07 Access Business Group Int Llc Smart cookware
KR101821904B1 (ko) 2010-04-08 2018-01-24 액세스 비지니스 그룹 인터내셔날 엘엘씨 Pos 유도성 시스템 및 방법
FR2988172B1 (fr) * 2012-03-19 2014-12-26 Sc2N Sa Capteur de temperature
ES2555542B1 (es) * 2014-05-27 2016-10-19 Consejo Superior De Investigaciones Científicas (Csic) Sensor embebido para la medida continua de resistencias mecánicas en estructuras de material cementicio, método de fabricación del mismo, y sistema y método de medida continua de resistencias mecánicas en estructuras de material cementicio
DE102018222111A1 (de) * 2018-12-18 2020-06-18 Schott Ag Ofen, insbesondere Kühlofen
US12304157B2 (en) 2021-10-20 2025-05-20 Tsi Technologies Llc In-situ monitoring and control of induction welding of thermoplastic composites using amorphous or nanocrystalline microwire temperature sensors and self-centering antennae rail system
CN117276846B (zh) * 2023-11-02 2024-03-05 广州博远装备科技有限公司 一种基于形状记忆合金的自适应短波天线

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2047539C3 (de) * 1970-09-26 1973-09-20 Gesellschaft Fuer Kernforschung Mbh, 7500 Karlsruhe Thermoelement
SU832505A2 (ru) * 1979-03-05 1981-05-23 Казанский Ордена Трудового Красного Зна-Мени Авиационный Институт Им.A.H.Туполева Нановеберметр
JPH0575631U (ja) * 1992-03-17 1993-10-15 ティーディーケイ株式会社 温度センサ
JPH1183641A (ja) * 1997-09-08 1999-03-26 Kurabe Ind Co Ltd ガラス封止型サーミスタ
JP2000146714A (ja) * 1998-11-06 2000-05-26 Oji Paper Co Ltd 蒸解釜用温度検出器
US6208253B1 (en) * 2000-04-12 2001-03-27 Massachusetts Institute Of Technology Wireless monitoring of temperature
US7794142B2 (en) 2006-05-09 2010-09-14 Tsi Technologies Llc Magnetic element temperature sensors
WO2007134061A2 (en) * 2006-05-09 2007-11-22 Thermal Solutions, Inc. Magnetic element temperature sensors
US8258441B2 (en) 2006-05-09 2012-09-04 Tsi Technologies Llc Magnetic element temperature sensors
US7736052B2 (en) 2006-08-11 2010-06-15 Beadedstream, Llc Multipoint digital temperature acquisition system
US8192080B2 (en) 2007-01-23 2012-06-05 Tsi Technologies Llc Microwire-controlled autoclave and method
US8033715B2 (en) * 2007-11-08 2011-10-11 Illinois Institute Of Technology Nanoparticle based thermal history indicators
JP5049879B2 (ja) * 2008-05-28 2012-10-17 株式会社デンソー 温度センサ
US8286497B2 (en) 2009-06-25 2012-10-16 Tsi Technologies Llc Strain sensor
US8485723B2 (en) 2009-08-12 2013-07-16 Tsi Technologies Llc One-time sensor device

Also Published As

Publication number Publication date
EP2684014A4 (en) 2015-03-04
IL228288B (en) 2018-01-31
AU2012225525A1 (en) 2013-09-26
WO2012122258A3 (en) 2012-12-13
WO2012122258A2 (en) 2012-09-13
ES2665945T3 (es) 2018-04-30
CA2828774A1 (en) 2012-09-13
CN103718010B (zh) 2016-03-16
US9212955B2 (en) 2015-12-15
AU2012225525B2 (en) 2015-03-05
EP2684014A2 (en) 2014-01-15
JP2014507671A (ja) 2014-03-27
EP2684014B1 (en) 2018-02-28
JP5918278B2 (ja) 2016-05-18
CN103718010A (zh) 2014-04-09
US20120230365A1 (en) 2012-09-13

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