JP5917939B2 - Capacitor module - Google Patents

Description

  The present invention relates to a capacitor module with a fuse function.

  In general, an inverter includes a semiconductor switching element and a smoothing capacitor. As the smoothing capacitor or the like, an electrolytic capacitor or a film capacitor whose capacity can be easily increased is mainly used. Semiconductor switching elements have been advanced in high speed, low loss, high temperature support, and miniaturization represented by SiC (silicon carbide).

  Similarly, capacitors are required to be miniaturized, and in an inverter for an electric vehicle or the like, a structure for reducing an installation area from an electrolytic capacitor to a film capacitor, a ceramic capacitor, or the like is disclosed (see Patent Document 1).

  A ceramic capacitor is advantageous for high temperature compatibility and downsizing, but when the ceramic capacitor breaks, it becomes a short mode, and there is a possibility that even peripheral devices may be broken.

  Therefore, conventionally, a ceramic capacitor provided with a fuse for preventing a short mode has been disclosed (see Patent Documents 1 to 9).

  Patent Document 1 describes an example in which a ceramic capacitor and an external terminal are connected in series with a single fuse on a substrate on which the ceramic capacitor and the external terminal are mounted. Patent Document 2 describes an example in which a dielectric internal electrode and an extraction electrode are connected in series with one fuse electrode. Patent Document 3 describes an example in which two extraction electrodes in a ceramic capacitor are connected in series with one fuse electrode. Patent Documents 4 and 5 describe examples in which two external electrodes formed on the surface of a ceramic capacitor are connected in series with one fuse electrode. Patent Document 6 describes an example in which an internal electrode and an external terminal of a ceramic capacitor are connected in series with one fuse electrode. Patent Document 7 discloses an example in which an external terminal formed on one side surface of a multilayer body and an internal electrode formed in the multilayer body are connected in series with one fuse electrode formed on the other side surface of the multilayer body. Have been described. In Patent Documents 8 and 9, a plurality of terminals and input / output electrodes extending from the ceramic capacitor are mounted on a substrate on which a ceramic capacitor is mounted and input / output electrodes are formed. An example of connection by a wire (fuse element) is described. The metal wire is disposed on the substrate by soldering, welding or the like.

JP 2005-243926 A JP-A 63-305505 Japanese Patent Laid-Open No. 2-153513 Japanese Utility Model Publication No. 57-132428 No. 1-334336 JP 2000-228326 A JP 2003-7568 A Japanese Patent No. 4457627 Japanese Patent No. 4457633

  However, since the ceramic capacitor with a fuse function shown in Patent Documents 2 to 7 has a configuration in which electrodes and terminals are connected in series with one fuse electrode, the resistance value and inductance value of the fuse electrode become high, As a result, there is a risk that loss increases and heat is likely to be generated.

  The ceramic capacitors with a fuse function shown in Patent Documents 1, 8 and 9 have a limitation in miniaturization because the fuses and metal wires are arranged on the substrate on which the ceramic capacitors are mounted. There is also a problem that the manufacturing cost becomes high because welding or the like is required.

  The present invention has been made in consideration of such problems, and can reduce the resistance value and inductance value of the fuse portion, can suppress an increase in loss (heat generation), and can be downsized. An object of the present invention is to provide a capacitor module capable of reducing the manufacturing cost.

[1] A capacitor module according to a first aspect of the present invention includes a ceramic substrate, a first terminal electrode and a second terminal electrode formed on the first side surface and the second side surface of the ceramic substrate, respectively, and the ceramic substrate. One or more first capacitor electrodes formed in the substrate and connected to the first terminal electrode; and one or more second capacitor electrodes formed in the ceramic substrate and connected to the second terminal electrode; Of the first capacitor electrode and the second capacitor electrode, at least one capacitor electrode has a fuse pattern, and the fuse pattern is formed at a position near the terminal electrode of the at least one capacitor electrode. In addition, a plurality of fuse electrodes having a width narrower than the width of the one capacitor electrode are arranged in parallel. And wherein the Rukoto.

[2] In the first aspect of the present invention, the first capacitor electrode has a first fuse pattern, the second capacitor electrode has a second fuse pattern, and the first fuse pattern is the first capacitor electrode. A plurality of first fuse electrodes formed at positions close to the first terminal electrodes and having a width narrower than the width of the first capacitor electrode, and the second fuse pattern Is formed at a position close to the second terminal electrode among the second capacitor electrodes, and further, a plurality of second fuse electrodes having a width narrower than the width of the second capacitor electrode are arranged in parallel. May be.

[3] In the first aspect of the present invention, the ceramic substrate may include one or more resistors formed on the surface of the ceramic substrate and connected between the first terminal electrode and the second terminal electrode.

[4] In the first aspect of the present invention, a surface electrode formed on the surface of the ceramic substrate and connected to one of the first terminal electrode and the second terminal electrode, The surface electrode may include a third fuse pattern, and the third fuse pattern may include one or more third fuse electrodes having a width narrower than a width of the surface electrode.

[5] In this case, the third fuse pattern may be configured by arranging a plurality of the third fuse electrodes in parallel.

[6] Further, the plurality of third fuse electrodes may have different lengths and widths.

[7] In [4], one or more formed on the surface of the ceramic substrate and connected between the surface electrode and the other terminal electrode of the first terminal electrode and the second terminal electrode You may make it have a resistor.

[8] In [4], a third terminal electrode formed on a third side surface different from the first side surface and the second side surface of the ceramic substrate and electrically connected to another electronic component The surface electrode may be connected to one terminal electrode of the first terminal electrode and the second terminal electrode and the third terminal electrode.

[9] In [4], on the surface of the ceramic substrate and between the surface electrode and the other terminal electrode of the first terminal electrode and the second terminal electrode, Electronic components may be mountable.

[10] A capacitor module according to a second aspect of the present invention includes a ceramic substrate, a first terminal electrode and a second terminal electrode formed on a first side surface and a second side surface of the ceramic substrate, respectively, and the ceramic substrate. One or more first capacitor electrodes formed in the substrate and connected to the first terminal electrode; and one or more second capacitor electrodes formed in the ceramic substrate and connected to the second terminal electrode; And a surface electrode formed on the surface of the ceramic substrate and connected to one of the first terminal electrode and the second terminal electrode, and the surface electrode is a fuse. The fuse pattern is characterized in that a plurality of fuse electrodes having a width smaller than the width of the surface electrode are arranged in parallel.

[11] In the second aspect of the present invention, the plurality of fuse electrodes may have different lengths and widths.

[12] In the second aspect of the present invention, 1 formed on the surface of the ceramic substrate and connected between the surface electrode and the other terminal electrode of the first terminal electrode and the second terminal electrode You may make it have the above resistor.

[13] In the second aspect of the present invention, a third surface formed on a third side surface different from the first side surface and the second side surface of the ceramic substrate and electrically connected to another electronic component. It has a terminal electrode, The said surface electrode may be connected to any one of said 1st terminal electrode and said 2nd terminal electrode, and said 3rd terminal electrode.

[14] In the second aspect of the present invention, on the surface of the ceramic substrate and between the surface electrode and the other terminal electrode of the first terminal electrode and the second terminal electrode, Other electronic components may be mountable.

  As described above, according to the capacitor module of the present invention, the resistance value and the inductance value of the fuse portion can be reduced, an increase in loss (heat generation) can be suppressed, and the size and manufacturing can be reduced. Cost can be reduced.

It is a circuit diagram which shows the inverter with which the capacitor | condenser module which concerns on this Embodiment is applied. FIG. 2A is a perspective view showing an appearance of the capacitor module (first capacitor module) according to the first embodiment, and FIG. 2B is an equivalent circuit diagram showing the first capacitor module. 3A is an exploded perspective view with the first capacitor module partially omitted, FIG. 3B is a plan view showing an example of the pattern shape of the first capacitor electrode and the first fuse pattern, and FIG. 3C is the second capacitor. It is a top view which shows an example of the pattern shape of an electrode and a 2nd fuse pattern. FIG. 4A is a perspective view showing an appearance of the capacitor module (second capacitor module) according to the second embodiment, and FIG. 4B is an equivalent circuit diagram showing the second capacitor module. FIG. 5A is a perspective view showing the external appearance of the capacitor modules (third capacitor module and eighth capacitor module) according to the third and eighth embodiments, and FIG. 5B is an equivalent circuit diagram showing the third capacitor module. . 6A is an exploded perspective view showing the third capacitor module with a part thereof omitted, and FIG. 6B is a plan view showing an example of the pattern shape of the surface electrode and the third fuse pattern. FIG. 7A is a perspective view showing the external appearance of the capacitor modules (fourth capacitor module and ninth capacitor module) according to the fourth and ninth embodiments, and FIG. 7B is an equivalent circuit diagram showing the fourth capacitor module. . FIG. 8A is an exploded perspective view in which a part of the fourth capacitor module is omitted, and FIG. 8B is a plan view showing an example of the pattern shape of the surface electrode and the third fuse pattern. FIG. 9A is a perspective view showing an appearance of a capacitor module (fifth capacitor module) according to the fifth embodiment, and FIG. 9B is an equivalent circuit diagram showing the fifth capacitor module. It is a perspective view which shows the external appearance of the capacitor | condenser module (6th capacitor | condenser module) which concerns on 6th Embodiment. FIG. 11A is a perspective view showing an appearance of a capacitor module (seventh capacitor module) according to the seventh embodiment, and FIG. 11B is an equivalent circuit diagram showing the seventh capacitor module. FIG. 12A is an exploded perspective view showing a part of the capacitor module (eighth capacitor module) according to the eighth embodiment, and FIG. 12B is an equivalent circuit diagram showing the eighth capacitor module. FIG. 13A is an exploded perspective view in which a part of the capacitor module (9th capacitor module) according to the ninth embodiment is omitted, and FIG. 13B is an equivalent circuit diagram showing the ninth capacitor module.

  Hereinafter, an embodiment of a capacitor module according to the present invention will be described with reference to FIGS.

  First, for example, the inverter 100 to which the capacitor module according to the present embodiment is applied will be briefly described with reference to FIG. 1. The inverter 100 includes an across-the-line capacitor (between the battery 102 and the motor 104). EMI filter 106 having an X capacitor) and a line bypass capacitor (Y capacitor), a rectifier circuit 108 having two switching elements, for example, a discharge resistor (discharge resistor Ra), and a smoothing capacitor Ca in parallel. The connected smoothing filter unit 110 and, for example, a three-phase output inverter circuit 112 having six switching elements.

  The capacitor module according to the first embodiment (hereinafter referred to as the first capacitor module 10A) includes a plurality of dielectric layers (refer to the dielectric layers S1 to S8 in FIG. 3A) as shown in FIG. 2A. The ceramic substrate 12 is formed by laminating, and the first terminal electrode 14a and the second terminal electrode 14b formed on the first side surface 12a and the second side surface 12b facing each other of the ceramic substrate 12, respectively.

  As shown in FIG. 3A, the ceramic substrate 12 is configured by stacking a first dielectric layer S1 to an eighth dielectric layer S8 in order from the bottom. These first dielectric layer S1 to eighth dielectric layer S8 are composed of one or a plurality of layers.

  A first capacitor electrode 16a having one end connected to the first terminal electrode 14a is formed on each main surface of the second dielectric layer S2, the fourth dielectric layer S4, and the sixth dielectric layer S6. Each first capacitor electrode 16a has a first fuse pattern 18a.

  The first fuse pattern 18a is formed at a position near the first terminal electrode 14a in the first capacitor electrode 16a, and a plurality of first fuse electrodes 20a having a width Wa smaller than the width W1 of the first capacitor electrode 16a are formed. They are arranged in parallel.

  The width Wa of the first fuse electrode 20a can be selected, for example, from 1/20 to 1/10 of the width W1 of the first capacitor electrode 16a, and the length La of the first fuse electrode 20a can be selected from the width of the first capacitor electrode 16a. For example, 1/20 to 1/5 of the length L1 can be selected. Each dimension may be the same or different. 3A and 3B, the width Wa of each first fuse electrode 20a is about 1/18 of the width W1 of the first capacitor electrode 16a, and the length La of the first fuse electrode 20a is the length L1 of the first capacitor electrode 16a. An example of about 1/10 of In the example of FIGS. 3A and 3B, eight first fuse electrodes 20a are arranged, and the resistance value and the inductance value are about 1 as compared with a conventional configuration in which one fuse electrode is connected in series. / 8.

  Similarly, a second capacitor electrode 16b having one end connected to the second terminal electrode 14b is formed on each main surface of the third dielectric layer S3 and the fifth dielectric layer S5. Each second capacitor electrode 16b has a second fuse pattern 18b.

  The second fuse pattern 18b is formed near the second terminal electrode 14b in the second capacitor electrode 16b, and a plurality of second fuse electrodes 20b having a width Wb narrower than the width W2 of the second capacitor electrode 16b are formed. They are arranged in parallel.

  For example, 1/20 to 1/10 of the width W2 of the second capacitor electrode 16b can be selected as the width Wb of the second fuse electrode 20b, and the length Lb of the second fuse electrode 20b can be selected from the width of the second capacitor electrode 16b. For example, 1/20 to 1/5 of the length L2 can be selected. Each dimension may be the same or different. 3A and 3C, eight second fuse electrodes 20b are arranged, the width Wb of each second fuse electrode 20b is about 1/18 of the width W2 of the second capacitor electrode 16b, and the second fuse electrode 20b An example in which the length Lb is about 1/10 of the length L2 of the second capacitor electrode 16b is shown. Of course, the relationship of length L1 = L2, La = Lb, width W1 = W2, and Wa = Wb may be used.

  The first fuse electrode 20a and the second fuse electrode 20b are set so that the widths Wa and Wb are constant, and the lengths La and Lb are constant, so that they are blown at a preset current. Yes. The distance Da between the first fuse electrodes 20a and the distance Db between the second fuse electrodes 20b can be appropriately set from the number of the first fuse electrodes 20a and the second fuse electrodes 20b and the dimensions of the widths Wa and Wb. When it is desired to reduce the loss, it is possible to shorten the distances Da and Db and increase the number of the first fuse electrodes 20a and the second fuse electrodes 20b. In this case, the relationship of distance Da = Db may be sufficient, width Wa = distance Da, and width Wb = distance Db. Furthermore, the relationship of width Wa = Wb = distance Da = Db may be used.

  The smoothing capacitor Ca shown in FIG. 2B is configured by the first capacitor electrode 16a, the second capacitor electrode 16b, and the dielectric between these electrodes 16a and 16b, and a plurality of first capacitors formed on the first capacitor electrode 16a. A first inner layer fuse 22a connected between the smoothing capacitor Ca and the first terminal electrode 14a is constituted by the first fuse pattern 18a by the fuse electrode 20a, and a plurality of second fuse electrodes 20b formed on the second capacitor electrode 16b. The second inner layer fuse 22b connected between the smoothing capacitor Ca and the second terminal electrode 14b is constituted by the second fuse pattern 18b.

  That is, in the first capacitor module 10A, as shown in FIG. 2B, in addition to the smoothing capacitor Ca in the smoothing filter unit 110, the first inner layer fuse 22a and the second inner layer fuse 22b are integrated into one ceramic substrate 12. It is configured.

  As described above, in the first capacitor module 10A, the smoothing filter unit 110 having the smoothing capacitor Ca, the first inner layer fuse 22a, and the second inner layer fuse 22b can be integrated with the ceramic substrate 12 and configured as one chip. Therefore, the heat resistance is good, the short mode can be prevented, the size of the inverter 100 can be reduced, the cost can be reduced, and the mounting space can be saved.

  In addition, the first inner layer fuse 22a is configured by the first fuse pattern 18a including the plurality of first fuse electrodes 20a formed on the first capacitor electrode 16a, and the second inner layer fuse 22b is formed on the second capacitor electrode 16b. Since the second fuse pattern 18b is composed of the plurality of second fuse electrodes 20b, the resistance value and the inductance value of the first inner layer fuse 22a and the second inner layer fuse 22b can be reduced, and loss ( Increase in heat generation) can be suppressed. This also leads to improved reliability.

  The inner layer fuse may be only the first inner layer fuse 22a (the first fuse pattern 18a formed on the first capacitor electrode 16a) connected between the smoothing capacitor Ca and the first terminal electrode 14a, or Only the second inner layer fuse 22b (second fuse pattern 18b formed on the second capacitor electrode 16b) connected between the smoothing capacitor Ca and the second terminal electrode 14b may be used.

  Next, a capacitor module according to the second embodiment (hereinafter referred to as a second capacitor module 10B) will be described with reference to FIGS. 4A and 4B.

  The second capacitor module 10B has substantially the same configuration as the first capacitor module 10A described above, but is formed on the upper surface 12u of the ceramic substrate 12 as shown in FIG. 4A, and the first terminal electrode 14a and the second terminal electrode are formed. It differs in having one resistor 24 connected between 14b. As shown in FIG. 4B, the resistor 24 constitutes a discharge resistor Ra in the smoothing filter unit 110. An electronic component 26 (for example, a part or all of the rectifier circuit 108 or the inverter circuit 112 shown in FIG. 1) is connected between the first terminal electrode 14a and the second terminal electrode 14b.

  That is, in the second capacitor module 10B, as shown in FIG. 4B, in addition to the smoothing capacitor Ca and the discharge resistor Ra in the smoothing filter unit 110, the first inner layer fuse 22a and the second inner layer fuse 22b have one ceramic substrate 12. It is integrated and configured.

  In the second capacitor module 10B, a smoothing capacitor Ca and a discharge resistor Ra are connected in parallel, and a smoothing filter section 110 having a first inner layer fuse 22a and a second inner layer fuse 22b is integrated into one ceramic substrate 12. Therefore, the heat resistance is good, the short mode can be prevented, the inverter 100 can be reduced in size, the cost can be reduced, and the mounting space can be saved. In addition, an increase in loss (heat generation) can be suppressed.

  Next, a capacitor module according to a third embodiment (hereinafter referred to as a third capacitor module 10C) will be described with reference to FIGS. 5A to 6B.

  The third capacitor module 10C has substantially the same configuration as the first capacitor module 10A described above, but a third side surface 12c different from the first side surface 12a and the second side surface 12b of the ceramic substrate 12 as shown in FIG. 5A. And the third terminal electrode 14c electrically connected to the electronic component 26 (see FIG. 5B), the upper surface 12u of the ceramic substrate 12, and the first terminal electrode 14a and the third terminal electrode. And the surface electrode 28 connected to 14c.

  The surface electrode 28 has a third fuse pattern 18c. The third fuse pattern 18c is formed near the first terminal electrode 14a in the surface electrode 28, and as shown in FIG. 6B, one or more third fuse patterns 18c having a width Wc smaller than the width W3 of the surface electrode 28. The fuse electrodes 20c are arranged in parallel.

  The width Wc of the third fuse electrode 20c can be selected from 1/20 to 1/10 of the width W3 of the surface electrode 28, and the length Lc of the third fuse electrode 20c is 1 of the length L3 of the surface electrode 28. / 25 to 1/2 can be selected. Although the number of third fuse electrodes 20c may be one, it is preferable to have a plurality of third fuse electrodes 20c. In the example of FIG. 6B, eight third fuse electrodes 20c are arranged, the width Wc of each third fuse electrode 20c is about 1/20 of the width W3 of the surface electrode 28, and the length Lc of the third fuse electrode 20c is the surface. The example which is about 1/3 of the length L3 of the electrode 28 is shown. Of course, the relationship of length La = Lb = Lc and width Wa = Wb = Wc may be used.

  As shown in FIG. 5B, the outer fuse 30 connected between the first terminal electrode 14a and the third terminal electrode 14c is formed by the third fuse pattern 18c formed by the plurality of third fuse electrodes 20c formed on the surface electrode 28. Composed.

  That is, the third capacitor module 10 </ b> C is configured by integrating the first inner layer fuse 22 a, the second inner layer fuse 22 b, and the outer layer fuse 30 in one ceramic substrate 12 in addition to the smoothing capacitor Ca in the smoothing filter unit 110. Yes. In addition, you may have the 4th terminal electrode (refer 14th terminal electrode 14d of FIG. 11A) which is not shown in the 4th side surface 12d facing the 3rd side surface 12c of the ceramic substrate 12. FIG. Thereby, the mounting balance is improved.

  In the third capacitor module 10C, the smoothing filter unit 110 having the smoothing capacitor Ca, the first inner layer fuse 22a, the second inner layer fuse 22b, and the outer layer fuse 30 is integrated into one ceramic substrate 12 and configured as one chip. Therefore, the heat resistance is good, the short mode can be prevented, the size of the inverter 100 can be reduced, the cost can be reduced, and the mounting space can be saved. An increase in (heat generation) can be suppressed.

  The width Wc of each third fuse electrode 20c may be constant, but the width Wc and length Lc of each third fuse electrode 20c may be different. In this case, it is preferable that the width Wc and the length Lc have a proportional relationship so that the fusing characteristics of the third fuse electrodes 20c are the same. As a result, various abnormal currents can be handled, and the abnormal current can be prevented from flowing into the electronic component 26. The distance Dc between the third fuse electrodes 20c may be constant or different depending on the width Wc of the third fuse electrode 20c.

  Next, a capacitor module according to a fourth embodiment (hereinafter referred to as a fourth capacitor module 10D) will be described with reference to FIGS. 7A to 8B.

  The fourth capacitor module 10D has substantially the same configuration as the above-described third capacitor module 10C, but as shown in FIG. 7A, a plurality of third capacitors constituting the third fuse pattern 18c formed on the surface electrode 28. The shape of the fuse electrode 20c is different.

  That is, the plurality of third fuse electrodes 20c have different lengths (lengths from the first terminal electrode 14a to the third terminal electrode 14c) and widths.

8A and 8B, six third fuse electrodes 20c are formed, of which the first third fuse electrode 20c is formed in a straight line and the other five (second to sixth) third fuse electrodes are formed. An example in which the fuse electrode 20c is formed in an L shape is shown. Here, when the lengths of the first to sixth third fuse electrodes 20c are Lc1 to Lc6 and the widths are Wc1 to Wc6, they have the following magnitude relationship.
Lc1 <Lc2 <Lc3 <Lc4 <Lc5 <Lc6
Wc1 <Wc2 <Wc3 <Wc4 <Wc5 <Wc6

  In this case, the lengths Lc1 to Lc6 and the widths Wc1 to Wc6 are preferably in a proportional relationship so that the fusing characteristics of the third fuse electrodes 20c are the same. Thereby, it can be made to respond | correspond to various abnormal current, and the inflow of abnormal current to an electronic component can be prevented.

  In the fourth capacitor module 10D, similarly to the second capacitor module 10B described above, the heat resistance is good, the short mode can be prevented, the size of the inverter 100 is reduced, the cost is reduced, and the mounting is performed. Space saving can be realized, and an increase in loss (heat generation) can be suppressed.

  In the example of FIGS. 8A and 8B, the example in which the six third fuse electrodes 20c are formed is shown, but in addition, two to five, or seven or more third fuse electrodes 20c may be formed. . In addition, as the third fuse pattern 18c, an example in which the linear third fuse electrode 20c and the L-shaped third fuse electrode 20c are combined has been shown, but instead of the L-shape, a linear shape or an oblique shape Or a curved shape or a combination thereof.

  Next, a capacitor module according to a fifth embodiment (hereinafter referred to as a fifth capacitor module 10E) will be described with reference to FIGS. 9A and 9B.

  As shown in FIG. 9A, the fifth capacitor module 10E has substantially the same configuration as the above-described third capacitor module 10C (see FIG. 5A), but is formed on the upper surface 12u of the ceramic substrate 12, and the surface electrode 28 ( Substantially different in that it has one resistor 24 connected between the first terminal electrode 14a) and the second terminal electrode 14b. As shown in FIG. 9B, the resistor 24 constitutes a discharge resistor Ra in the smoothing filter unit 110.

  That is, in the fifth capacitor module 10E, as shown in FIG. 9B, in addition to the smoothing capacitor Ca and the discharge resistor Ra in the smoothing filter unit 110, the first inner layer fuse 22a, the second inner layer fuse 22b, and the outer layer fuse 30 are one. The two ceramic substrates 12 are integrated.

  In the fifth capacitor module 10E, the smoothing capacitor Ca and the discharge resistor Ra are connected in parallel, and the smoothing filter unit 110 having the first inner layer fuse 22a, the second inner layer fuse 22b, and the outer layer fuse 30 is formed as one ceramic. Since it can be integrated with the substrate 12 and configured as a single chip, it has good heat resistance and can prevent a short mode, and the size of the inverter 100 can be reduced, the cost can be reduced, and the mounting space can be saved. In addition, an increase in loss (heat generation) can be suppressed.

  Next, a capacitor module according to a sixth embodiment (hereinafter referred to as a sixth capacitor module 10F) will be described with reference to FIG.

  As shown in FIG. 10, the sixth capacitor module 10F has substantially the same configuration as the above-described fourth capacitor module 10D (see FIG. 7A), but is formed on the upper surface 12u of the ceramic substrate 12, and has a first terminal electrode. The difference is that one resistor 24 is connected between 14a and the second terminal electrode 14b. As described above, the resistor 24 constitutes the discharge resistor Ra of the smoothing filter unit 110.

  In the sixth capacitor module 10F, similarly to the fifth capacitor module 10E, the smoothing capacitor Ca and the discharge resistor Ra are connected in parallel, and the first inner layer fuse 22a, the second inner layer fuse 22b, and the outer layer fuse 30 are further connected. Since the smoothing filter part 110 having one can be integrated into one ceramic substrate 12 and configured as one chip, the heat resistance is good, the short mode can be prevented, and the size and cost of the inverter 100 can be reduced. Can be realized, and the mounting space can be saved. In addition, an increase in loss (heat generation) can be suppressed.

  Next, a capacitor module according to a seventh embodiment (hereinafter referred to as a seventh capacitor module 10G) will be described with reference to FIGS. 11A and 11B.

  As shown in FIG. 11A, the seventh capacitor module 10G has substantially the same configuration as the above-described fifth capacitor module 10E (see FIG. 9A), but differs in the following points.

  That is, the first surface electrode 28 a and the second surface electrode 28 b for mounting the electronic component 26 are formed on the upper surface 12 u of the ceramic substrate 12. For example, a fourth terminal electrode 14d to which an output signal from the electronic component 26 is supplied is formed on the fourth side surface 12d of the ceramic substrate 12 facing the third side surface 12c, for example. A third surface electrode 28c that connects an output terminal (not shown) of the electronic component 26 and the fourth terminal electrode 14d is formed on the upper surface 12u of the ceramic substrate 12. Note that the third surface electrode 28c and the fourth terminal electrode 14d may each be divided into a plurality of parts depending on the specifications of the electronic component 26.

  The first surface electrode 28a is formed near the first terminal electrode 14a in the ceramic substrate 12, and one end thereof is connected to the first terminal electrode 14a. The first surface electrode 28a is formed with a third fuse pattern 18c similar to the third fuse pattern 18c formed on the surface electrode 28 of the fifth capacitor module 10E described above.

  As shown in FIG. 11B, the seventh capacitor module 10G includes a first inner layer fuse 22a, a second inner layer fuse 22b, and an outer layer fuse 30 in addition to the smoothing capacitor Ca and the discharge resistor Ra in the smoothing filter unit 110. It is integrated with the ceramic substrate 12. Further, an electronic component 26 is mounted between the first surface electrode 28a and the second surface electrode 28b on the ceramic substrate 12, and an output terminal (not shown) of the electronic component 26 and a fourth terminal electrode 14d of the ceramic substrate 12 are provided. Are electrically connected via the third surface electrode 28c, so that the smoothing capacitor Ca, the discharge resistor Ra, the first inner layer fuse 22a, the second inner layer fuse 22b, the outer layer fuse 30 and the electronic component 26 are combined into one. It is configured to be integrated with the ceramic substrate 12. This can further reduce the size of the inverter 100, reduce the cost, and save the mounting space. Moreover, the inverter 100 has good heat resistance, can prevent a short mode, and has a loss ( Increase in heat generation) can be suppressed.

  Next, a capacitor module according to an eighth embodiment (hereinafter referred to as an eighth capacitor module 10H) will be described with reference to FIGS. 12A and 12B.

  The appearance of the eighth capacitor module 10H is the same as that of the above-described third capacitor module 10C shown in FIG. 5A. However, as shown in FIG. 12A, the first fuse electrode 16a and the second capacitor electrode 16b are respectively connected to the first fuse. The difference is that the pattern 18a and the second fuse pattern 18b are not formed.

  Therefore, as shown in FIG. 12B, the eighth capacitor module 10H is configured such that the smoothing capacitor Ca and the outer layer fuse 30 in the smoothing filter unit 110 are integrated into one ceramic substrate 12.

  In the eighth capacitor module 10H, the smoothing filter unit 110 having the smoothing capacitor Ca and the outer layer fuse 30 can be integrated into one ceramic substrate 12 and configured as one chip, so that the size of the inverter 100 can be reduced. In addition, the cost can be reduced and the mounting space can be saved, and the inflow of abnormal current to the electronic component 26 can be prevented.

  Next, a capacitor module according to a ninth embodiment (hereinafter referred to as a ninth capacitor module 10I) will be described with reference to FIGS. 13A and 13B.

  The appearance of the ninth capacitor module 10I is the same as that of the above-described fourth capacitor module 10D shown in FIG. 7A. However, as shown in FIG. 13A, the first fuse electrode 16a and the second capacitor electrode 16b are respectively connected to the first fuse. The difference is that the pattern 18a and the second fuse pattern 18b are not formed.

  Also in the ninth capacitor module 10I, as shown in FIG. 13B, the smoothing capacitor Ca and the outer layer fuse 30 in the smoothing filter unit 110 are integrated into one ceramic substrate 12.

  Therefore, also in the ninth capacitor module 10I, the smoothing filter portion 110 having the smoothing capacitor Ca and the outer layer fuse 30 can be integrated into one ceramic substrate 12 and configured as one chip. A reduction in size, a reduction in cost, and a reduction in mounting space can be realized, and an abnormal current can be prevented from flowing into the electronic component 26.

  Then, in the eighth capacitor module 10H and the ninth capacitor module 10I, the upper surface 12u of the ceramic substrate 12, like the fifth capacitor module 10E (see FIG. 9A) and the sixth capacitor module 10F (see FIG. 10) described above, You may make it form the resistor 24 which comprises the discharge resistance Ra. Further, the electronic component 26 may be mounted on the upper surface 12u of the ceramic substrate 12 as in the above-described seventh capacitor module 10G (see FIG. 11A).

  Next, the various electrodes in the first capacitor module 10A to the ninth capacitor module 10I, the constituent materials of the ceramic substrate 12, and the constituent materials of the resistor 24 will be described. The first capacitor module 10 </ b> A to the ninth capacitor module 10 </ b> I are referred to as the capacitor module 10 when not distinguished from each other.

  First, in the capacitor module 10, a plurality of dielectric layers on which various electrodes are formed, a plurality of dielectric layers on which no electrodes are formed, and a dielectric layer on which a resistor 24 is formed, if necessary, are stacked. Thus, one laminated body is formed, and this laminated body is sintered to form one capacitor module 10.

When silver (Ag) is used as a constituent material for various electrodes, for example, a barium titanate-based dielectric ceramic composition that is sintered at a temperature of 1000 ° C. or lower is used as a constituent material for a plurality of dielectric layers. It is preferable (see JP 2007-290940 A). Thereby, the proven ruthenium oxide system (RnO ₂ ) can be used as the constituent material of the resistor 24.

  By using such a barium titanate-based dielectric ceramic composition as a constituent material of the dielectric layer, the laminate can be sintered at a temperature of 1000 ° C. or lower. In addition, the dielectric ceramic composition does not need to contain a component such as lead that causes an excessive burden on the environment, and it is not necessary to add a glass component for lowering the sintering temperature.

  The barium titanate-based dielectric refers to a dielectric mainly composed of barium titanate. Specifically, at the raw material stage, it may be a calcined product of barium titanate, or may be a mixture of titanium oxide and barium oxide that generates barium titanate after sintering.

  In each embodiment described above, a protective overcoat glass may be formed on the surface of the resistor 24. Further, in order to improve the accuracy of the resistance value of the resistor 24, laser trimming may be performed.

  The capacitor module according to the present invention is not limited to the above-described embodiment, but can of course have various configurations without departing from the gist of the present invention.

10A to 10I ... 1st capacitor module to 9th capacitor module 12 ... Ceramic substrate 14a ... 1st terminal electrode 14b ... 2nd terminal electrode 16a ... 1st capacitor electrode 16b ... 2nd capacitor electrodes 18a to 18c ... 1st fuse pattern ~ 3rd fuse pattern 20a-20c ... 1st fuse electrode-3rd fuse electrode 22a ... 1st inner layer fuse 22b ... 2nd inner layer fuse 24 ... Resistor 26 ... Electronic component 28 ... Surface electrode 28a ... 1st surface electrode 28b ... 1st 2 surface electrode 30 ... outer layer fuse 100 ... inverter 108 ... rectifier circuit 110 ... smoothing filter part 112 ... inverter circuit Ca ... smoothing capacitor Ra ... discharge resistance

Claims (10)

A ceramic substrate;
A first terminal electrode and a second terminal electrode respectively formed on a first side surface and a second side surface of the ceramic substrate facing each other;
One or more first capacitor electrodes formed in the ceramic substrate and connected to the first terminal electrodes;
One or more second capacitor electrodes formed in the ceramic substrate and connected to the second terminal electrode;
Of the first capacitor electrode and the second capacitor electrode, at least one capacitor electrode has a fuse pattern,
The fuse pattern is formed at a position near the terminal electrode of the at least one capacitor electrode, and further, a plurality of fuse electrodes having a width narrower than the width of the one capacitor electrode are arranged in parallel .
A surface electrode formed on the surface of the ceramic substrate and connected to one of the first terminal electrode and the second terminal electrode;
The surface electrode has a third fuse pattern;
The third fuse pattern has one or more third fuse electrodes having a width narrower than the width of the surface electrode,
The third fuse pattern includes a plurality of third fuse electrodes arranged in parallel,
The capacitor module, wherein the plurality of third fuse electrodes have different lengths and widths . The capacitor module according to claim 1,
The first capacitor electrode has a first fuse pattern;
The second capacitor electrode has a second fuse pattern;
The first fuse pattern is formed at a position closer to the first terminal electrode among the first capacitor electrodes, and a plurality of first fuse electrodes having a width narrower than the width of the first capacitor electrode are arranged in parallel. Arranged in
The second fuse pattern is formed near the second terminal electrode among the second capacitor electrodes, and a plurality of second fuse electrodes having a width smaller than the width of the second capacitor electrode are arranged in parallel. Capacitor module characterized by being arranged in an array. The capacitor module according to claim 1 or 2,
A capacitor module, comprising: one or more resistors formed on a surface of the ceramic substrate and connected between the first terminal electrode and the second terminal electrode. The capacitor module according to any one of claims 1 to 3 ,
It has one or more resistors formed on the surface of the ceramic substrate and connected between the surface electrode and the other terminal electrode of the first terminal electrode and the second terminal electrode. Capacitor module. The capacitor module according to any one of claims 1 to 4 ,
And a third terminal electrode formed on a third side surface different from the first side surface and the second side surface of the ceramic substrate and electrically connected to another electronic component,
The capacitor module, wherein the surface electrode is connected to one of the first terminal electrode and the second terminal electrode and the third terminal electrode. The capacitor module according to any one of claims 1 to 4 ,
Another electronic component can be mounted on the surface of the ceramic substrate and between the surface electrode and the other terminal electrode of the first terminal electrode and the second terminal electrode. A capacitor module characterized by comprising: A ceramic substrate;
A first terminal electrode and a second terminal electrode respectively formed on a first side surface and a second side surface of the ceramic substrate facing each other;
One or more first capacitor electrodes formed in the ceramic substrate and connected to the first terminal electrodes;
One or more second capacitor electrodes formed in the ceramic substrate and connected to the second terminal electrode;
A surface electrode formed on the surface of the ceramic substrate and connected to one of the first terminal electrode and the second terminal electrode;
The surface electrode has a fuse pattern,
The fuse pattern is configured by arranging a plurality of fuse electrodes having a width narrower than the width of the surface electrode in parallel ,
The capacitor module , wherein the plurality of fuse electrodes have different lengths and widths . The capacitor module according to claim 7 ,
It has one or more resistors formed on the surface of the ceramic substrate and connected between the surface electrode and the other terminal electrode of the first terminal electrode and the second terminal electrode. Capacitor module. The capacitor module according to claim 7 or 8 ,
And a third terminal electrode formed on a third side surface different from the first side surface and the second side surface of the ceramic substrate and electrically connected to another electronic component,
The capacitor module, wherein the surface electrode is connected to one of the first terminal electrode and the second terminal electrode and the third terminal electrode. The capacitor module according to any one of claims 7 to 9 ,
Another electronic component can be mounted on the surface of the ceramic substrate and between the surface electrode and the other terminal electrode of the first terminal electrode and the second terminal electrode. A capacitor module characterized by comprising:

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