JP5915319B2 - Photospacer forming method, color filter manufacturing method, photospacer forming apparatus - Google Patents

Description

  The present invention relates to a photo spacer forming method, a color filter manufacturing method, and a photo spacer forming apparatus for forming a photo spacer provided in a color filter or the like of a liquid crystal display device.

  In a liquid crystal display device, a display side substrate such as a color filter and a liquid crystal driving side substrate are arranged to face each other, a liquid crystal layer is provided between them, and the liquid crystal driving side substrate electrically arranges liquid crystal molecules in the liquid crystal layer. The display is performed by selectively changing the amount of light emitted from the light source provided behind the liquid crystal driving side substrate and transmitted through the display side substrate.

  An example of the above color filter will be described with reference to FIG. The color filter 100 shown in FIG. 9 includes a black matrix (black colored layer) 102, a pixel formed by a red colored layer 103a, a green colored layer 103b, and a blue colored layer 103c, an overcoat layer 104, and a photo on a transparent substrate 101. A spacer 105 is formed.

The black matrix 102 is a black light shielding portion formed in a substantially lattice shape on the base material 101, and plays a role of improving the contrast of the display image.
The red coloring layer 103a, the green coloring layer 103b, and the blue coloring layer 103c are formed so as to cover the openings of the lattice of the black matrix 102 and a part of the black matrix 102, and red, green, and blue are formed in the openings. Pixels are formed.
The overcoat layer 104 is formed so as to cover the pixels of the black matrix 102 and the colored layers 103a to 103b, and serves as a protective layer for protecting them from scratches and dirt.

  The photo spacer 105 includes a color filter 100 and a liquid crystal driving side substrate (not shown) disposed on the pixel side of the color filter 100 (hereinafter, the pixel side of the color filter is the upper side and the base material side is the lower side). It is a protrusion for providing an appropriate space therebetween. The photo spacer 105 is provided at a planar position corresponding to the black matrix 102 with a width slightly smaller than the line width of the black matrix 102 so as not to affect the appearance of display. Examples of such photo spacers are described in Patent Documents 1 and 2.

  An example of a general method for forming the photo spacer 105 will be briefly described with reference to FIG. 10. First, the black matrix 102 on the substrate 101, the pixels by the colored layers 103 a to 103 c, and the overcoat layer 104 are formed. A negative-type transparent photosensitive resin composition 201 is applied so as to cover (FIG. 10A).

  Subsequently, after the photosensitive resin composition 201 is heated, UV (ultra violet) light 202 is irradiated to a portion corresponding to the formation position 201a of the photo spacer 105 through a photomask 203 having a light transmitting portion 204, The photosensitive resin composition 201 is exposed (FIG. 10B). The exposure is performed by generating parallel light with an optical system (not shown) of the exposure apparatus and irradiating the parallel light through the photomask 203. Thereby, the photosensitive resin composition 201 is photocured at the formation position 201 a of the photo spacer 105.

  Thereafter, development is performed to remove the uncured photosensitive resin composition 201, leaving the photocured photosensitive resin composition 201 as the photo spacer 105 (FIG. 10C), and cleaning and drying of the substrate 101. After that, the photo spacer 105 is baked (FIG. 10D). Through the above steps, the photo spacer 105 is formed.

JP 2006-243015 A JP 2009-265642 A

  However, in the case where the photo spacer 105 is formed by the above-described process, there is a problem that the photo spacer 105 is thickened and spreads during firing (FIG. 10D). As shown in FIG. 11, this is because a part of the photosensitive resin composition 201 of the photo spacer 105 melts and flows out to the side (melt flow) as shown in FIG.

  One of the causes is that the photosensitive resin composition 201 on the side surface and inside is not sufficiently photocured during exposure, compared to the top surface of the photo spacer 105. Even if a transparent material is used as the photosensitive resin composition 201, the side and internal photocuring progress is slower than the top surface of the photo spacer 105. Therefore, the photosensitive resin composition 201 is melted at the time of firing, and a melt flow is likely to occur.

At present, liquid crystal display devices are required to have higher definition, and to increase the pixel area and produce more vivid colors. For this reason, it is desired to make the black matrix 102 thinner, and accordingly, the photo spacer 105 also needs to be miniaturized. Therefore, it is desirable to reduce the thickness of the photo spacer 105 due to melt flow as much as possible.
In particular, when a fine photospacer is formed, the light transmitting portion 204 of the photomask 203 becomes thin. However, if the light-transmitting portion 204 becomes too thin, the light will not easily pass through the light-transmitting portion 204, so that the light intensity is reduced, the light curing is weakened, and the light curing is insufficient. The height of the photo spacer cannot be maintained sufficiently. Therefore, the size of the translucent portion 204 is required to be at least enough to maintain the height of the photo spacer. In order to form the thinnest photo spacer, it is possible to form a pattern by exposing with an appropriate exposure amount with the minimum size of the light-transmitting portion 204 capable of maintaining the height, and to suppress the melt flow during firing. Of particular importance.

  As a countermeasure against the melt flow, it is conceivable to increase the exposure amount at the time of exposure. However, if the exposure amount is increased, the photo-curing of the photosensitive resin composition 201 is performed even in an unnecessary portion around the formation position 201a of the photo spacer 105. And the photo spacer 105 itself may become thick before firing. This is a problem particularly when a fine photospacer is formed as described above. In addition, it is conceivable to suppress the melt flow by adjusting the material composition of the photosensitive resin composition 201. However, since the material cost increases and the suppression effect is limited, it is necessary to devise the process.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide a photo spacer forming method and the like that can suppress the melt flow of the photo spacer.

A first invention for achieving the above-described object is a photospacer forming method for forming a photospacer using a photosensitive resin composition, and a coating step of applying a negative photosensitive resin composition on a substrate. An exposure step of exposing the photosensitive resin composition using a photomask, a development step of performing development and leaving the exposed photosensitive resin composition, and the developed photosensitive resin composition In contrast, a re-exposure step in which exposure is performed again with diffused light so that light is applied to the side surface of the photosensitive resin composition, and a baking step in which baking of the re-exposed photosensitive resin composition is performed. only including, by performing a re-exposure by the diffused light, the difference in width of the bottom surface of the photo spacers by the photosensitive resin composition after firing the width of the bottom surface of the photo spacers by the photosensitive resin composition after development 0 .04μm or less A photo-spacer forming method characterized by suppressing.

  According to the present invention, in the re-exposure process after development, the photosensitive resin composition of the photo spacer can be exposed not only from the top surface but also from the side surface to be surely photocured, and the melt flow during firing is suppressed. can do. Unlike normal exposure, the re-exposure can be easily performed because it uses diffused light and does not require a photomask, and the apparatus configuration can be simplified.

In the re-exposure step, it is desirable to perform exposure while transporting the substrate.
This re-exposure can be performed without using a photomask, and alignment is also unnecessary, so that it is easy to perform exposure while transporting the substrate, thereby improving manufacturing efficiency without loss of time. .

The photo spacer includes a main spacer and a sub spacer lower than the main spacer. In the exposure step, the photo spacer has a first light transmitting portion in a portion corresponding to the formation position of the main spacer, and the sub spacer is formed. It is desirable that the photosensitive resin composition be exposed using a photomask having a second light-transmitting portion having a light transmittance lower than that of the first light-transmitting portion in a portion corresponding to the position.
By forming the main spacer and the sub-spacer at the same time as described above, there is an advantage that the process is simplified. However, since the exposure amount of the sub-spacer tends to be reduced, re-exposure is performed by the present invention to suppress the melt flow. Is particularly effective.

The photo spacer constitutes a color filter. In the coating step, a negative photosensitive resin composition of a color corresponding to the pixel of the color filter is applied, and in the exposure step, the photo spacer is formed. It is also desirable to expose the photosensitive resin composition using a photomask having a light-transmitting portion in a portion corresponding to a spacer and the pixel formation position.
Thus, there is an advantage that the process can be simplified by simultaneously forming the pixel and the photo spacer, but by using a colored photosensitive resin composition as the photo spacer, the progress of photocuring by exposure is slow. Therefore, it is particularly effective to suppress the melt flow by performing re-exposure according to the present invention.

According to a second aspect of the present invention, a substrate and a black matrix are formed on a base material, and a photo spacer made of a photosensitive resin composition is applied using a negative photosensitive resin composition and a photomask. An exposure process for exposing the photosensitive resin composition; a development process for performing development and leaving the exposed photosensitive resin composition; and for the developed photosensitive resin composition, the photosensitive resin composition Formed by a re-exposure step in which exposure is performed again with diffused light and a baking step in which the re-exposed photosensitive resin composition is baked so that light is irradiated onto the side surface of the object, by performing the re-exposure, to reduce the difference between the width of the bottom surface of the photo spacers by the photosensitive resin composition after firing the width of the bottom surface of the photo spacers by the photosensitive resin composition after development below 0.04μm A color filter manufacturing method characterized.
In the re-exposure step, it is desirable to perform exposure while conveying the substrate.

A third invention is a photospacer forming apparatus for forming a photospacer by a photosensitive resin composition, using a coating apparatus for applying a negative photosensitive resin composition on a substrate, and a photomask, An exposure apparatus that exposes the photosensitive resin composition; a developing apparatus that performs development and leaves the exposed photosensitive resin composition; and the photosensitive resin composition for the developed photosensitive resin composition as things light on the side surface of the irradiated, seen including a re-exposure apparatus for performing exposure again by the diffused light, and baking apparatus for performing calcination of the re-exposed the photosensitive resin composition, a, by the diffused light By performing re-exposure, the difference between the width of the bottom surface of the photo spacer by the photosensitive resin composition after development and the width of the bottom surface of the photo spacer by the photosensitive resin composition after baking is suppressed to 0.04 μm or less. Fo A spacer forming device.
Moreover, it is desirable that the re-exposure apparatus exposes the base material being conveyed.

  The present invention provides a photospacer forming method and the like that can suppress the melt flow of the photospacer.

The figure which shows the color filter 1 The figure which shows the photo spacer formation apparatus 10 The figure which shows the photo spacer formation method of 1st Embodiment. The figure shown about re-exposure of the photo spacer 105 The figure which shows the color filter which abbreviate | omitted the overcoat layer 104 The figure which shows the photo spacer formation method of 2nd Embodiment. The figure which shows the photo spacer formation method of 3rd Embodiment. The figure explaining an Example The figure which shows the color filter 100 Diagram showing conventional photospacer formation method The figure explaining the melt flow of the photo spacer 105

  Hereinafter, embodiments of the photospacer forming method of the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a diagram showing an example of a color filter 1 in which photo spacers are formed by the photo spacer forming method of the first embodiment. The color filter 1 includes a liquid crystal driving side substrate (not shown) disposed above the color filter 1 and a liquid crystal layer (not shown) formed between the color filter 1 and the liquid crystal driving side substrate. This constitutes a display device.

  Similar to the color filter 100 of FIG. 9, the color filter 1 of FIG. 1 includes a transparent substrate 101, a black matrix 102, pixels formed of a red colored layer 103a, a green colored layer 103b, and a blue colored layer 103c, an overcoat layer 104, and Although it has the photo spacer 105, the melt flow of the photo spacer 105 at the time of baking is suppressed by the process mentioned later.

  In addition, it does not specifically limit as the base material 101, The thing generally used for a color filter can be used. For example, non-flexible transparent rigid materials such as borosilicate glass, aluminoborosilicate glass, alkali-free glass, quartz glass, synthetic quartz glass, soda lime glass, white sapphire, transparent resin film, optical resin film, etc. A transparent flexible material having the following flexibility can be used. As this flexible material, acrylic such as polymethyl methacrylate, polyamide, polyacetal, polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, triacetyl cellulose, syndiotactic polystyrene, polyphenylene sulfide, polyether ketone, polyether ether ketone, Examples include fluororesin, polyether nitrile, polycarbonate, modified polyphenylene ether, polycyclohexene, polynorbornene resin, polysulfone, polyethersulfone, polyarylate, polyamideimide, polyetherimide, thermoplastic polyimide, and the like. However, those made of general plastics can also be used. In particular, alkali-free glass is a material having a small coefficient of thermal expansion, and is excellent in dimensional stability and characteristics in high-temperature heat treatment.

The black matrix 102, the red colored layer 103a, the green colored layer 103b, and the blue colored layer 103c are formed of a photosensitive resin composition in which a colorant of each color is dispersed and contained.
As the photosensitive resin composition, either a negative photosensitive resin composition or a positive photosensitive resin composition can be used. In the following description, a negative photosensitive resin composition is used. Shall.

The negative photosensitive resin composition is not particularly limited, and a commonly used photosensitive resin composition can be used. For example, a chemically amplified photosensitive resin composition based on a crosslinked resin, specifically, a chemically amplified photosensitive resin composition in which a crosslinking agent is added to polyvinylphenol and an acid generator is further added. In addition, as an acrylic negative photosensitive resin composition, a photopolymerization initiator that generates a radical component by ultraviolet irradiation, a component that has an acrylic group in the molecule, causes a polymerization reaction by the generated radical, and is cured; Those containing a functional group (for example, a component having an acidic group in the case of development with an alkaline solution) that can dissolve the unexposed portion by subsequent development can be used. Among the above-mentioned components having an acrylic group, examples of relatively low molecular weight polyfunctional acrylic molecules include dipentaerythritol hexaacrylate (DPHA), dipentaerythritol pentaacrylate (DPPA), and tetramethylpentatriacrylate (TMPTA). Can be mentioned. In addition, examples of the high molecular weight polyfunctional acrylic molecule include a polymer in which an acrylic group is introduced via an epoxy group into a part of the carboxylic acid group of the styrene-acrylic acid-benzyl methacrylate copolymer, and methyl methacrylate-styrene- An acrylic acid copolymer etc. are mentioned.
The positive type photosensitive resin composition is not particularly limited, and a commonly used one can be used. Specifically, a chemically amplified photosensitive resin composition using a novolak resin as a base resin can be used.

  The colorant contained in the photosensitive resin composition is not particularly limited, and various known materials can be appropriately selected and used including generally used pigments. For example, in the case of the black matrix 102, in addition to metal oxide powders such as titanium oxide and iron tetroxide, metal sulfide powders, metal powders, and carbon black, a mixture of pigments such as red, blue, and green is used as the light-shielding particles. What was disperse | distributed and contained in the photosensitive resin composition of this can be used.

Each of the black matrix 102, the red colored layer 103a, the green colored layer 103b, and the blue colored layer 103c is applied to a formation position of each part after applying a negative photosensitive resin composition containing a colorant of a corresponding color. It forms by patterning by exposing and developing through the photomask which has a translucent part in the corresponding part. Each process can be performed by a conventional method. For example, as a coating method of the photosensitive resin composition, spin coating method, casting method, dipping method, bar coating method, blade coating method, roll coating method, gravure coating method, flexographic printing method, spray coating method, die coating method, etc. There is.
The overcoat layer 104 can also be formed by applying the above-described negative photosensitive resin composition and performing exposure.

  In this embodiment, the photo spacer 105 is also formed using the above-described negative photosensitive resin composition. As described above, the photo spacer 105 has a suppressed melt flow during firing as compared with the conventional case. Hereinafter, formation of the photo spacer 105 will be described.

  First, the outline of the photo spacer forming apparatus 10 for forming the photo spacer 105 will be described with reference to FIG.

2 includes a coating device 11, a heating device 12, an exposure device 13, a developing device 14, a cleaning device 15, a drying device 16, a re-exposure device 17, a baking device 18, and the like. The color filter 1 is transported by the transport device 20 and processing by each device is performed.
As the coating device 11, the heating device 12, the exposure device 13, the developing device 14, the cleaning device 15, the drying device 16, and the baking device 18, known ones can be used. For example, a hot plate or the like can be used for the heating device 12 or the baking device 18, and an air knife or the like can be used for the drying device 16. Further, as the exposure apparatus 13, a proximity exposure machine that irradiates parallel UV light through a photomask can be used.

In the present embodiment, the re-exposure device 17 has a light source 171 that irradiates UV light as diffused light, whereby the photo spacer 105 after development is exposed again. The light source 171 can be a mercury lamp or the like, but is not limited thereto.
Furthermore, the light used in the re-exposure device 17 or the exposure device 13 is not limited to UV light, and may be visible light, for example.

  Next, the photo spacer formation method (color filter manufacturing method) of this embodiment is demonstrated using FIG.

  In the photo spacer formation method of the present embodiment, first, a negative type so as to cover the black matrix 102 formed on the substrate 101, the pixels formed by the colored layers 103 a to 103 c, and the overcoat layer 104 by the coating apparatus 11. The photosensitive resin composition 201 is applied (FIG. 3A). The coating thickness of the photosensitive resin composition 201 can be variously determined.

  Since the black matrix 102, each pixel, and the overcoat layer 104 can be formed by the conventional method as described above, the description thereof is omitted. In the present embodiment, the black matrix 102 is thinned, for example, formed with a line width of 20 μm or less, but is not limited thereto.

Subsequently, after the photosensitive resin composition 201 is heated by the heating device 12, the exposure device 13 is used to perform UV irradiation through a photomask 203 having a light transmitting portion 204 at a portion corresponding to the formation position 201 a of the photospacer 105. Exposure with light 202 is performed (FIG. 3B). Thereby, the photosensitive resin composition 201 is photocured at the formation position 201 a of the photo spacer 105.
The UV light 202 is parallel light as described above, and the exposure amount is appropriately determined so that unnecessary photocuring does not proceed around the formation position 201a. In this embodiment, the photo spacer 105 is formed finely. For example, the width of the light transmitting portion 204 is 10 μm or less, but the present invention is not limited to this.

  Next, development is performed by the developing device 14, the uncured photosensitive resin composition 201 is removed, and the exposed and photocured photosensitive resin composition 201 is left as the photo spacer 105 (FIG. 3C). Thereafter, the substrate 101 is cleaned by the cleaning device 15, and the substrate 101 cleaned by the drying device 16 is dried.

  The steps up to here are the same as those in the example of FIG. 10 and the like, but in this embodiment, subsequently, the re-exposure device 17 uses the light source 171 to emit the UV light 206 from above the color filter 1 of the photo spacer 105. The photosensitive resin composition 201 is irradiated and re-exposed (FIG. 3D).

This UV light 206 is diffuse light, and as shown in FIG. 4, the photosensitive resin composition 201 of the photo spacer 105 is reliably exposed not only from the top surface but also from the side surface, and is photocured. The re-exposure does not use the photomask 203 as in the normal exposure process (FIG. 3B) and does not require alignment, and the color filter 1 is transported by the transport device 20 as indicated by the arrow in FIG. Since it can be performed easily, there is no time loss.
Note that the UV light 206 may be irradiated from below the color filter 1, but in this case, pixels such as the black matrix 102 and the colored layers 103 a to 103 c exist between the substrate 101 and the photo spacer 105. It is necessary to increase the exposure amount.

Finally, the photo spacer 105 is baked using the baking device 18 (FIG. 3E). In the present embodiment, the photo-spacer 105 is reliably exposed also from the side surface by the above re-exposure, so that the melt flow can be suppressed during firing and the fine shape of the photo-spacer 105 can be maintained.
1 is formed, and the color filter 1 is manufactured.

  As described above, in the present embodiment, after the photo spacer 105 is developed, re-exposure is performed with diffused light. Therefore, the photosensitive resin composition 201 of the photo spacer 105 is reliably exposed not only from the top surface but also from the side surface. Light cure. Therefore, the melt flow during firing is suppressed, and the fine shape of the photo spacer 105 is maintained. Therefore, the photo spacer 105 can be suitably arranged on the thinned black matrix 102, and the liquid crystal display device can have high definition. Yes.

  In addition, unlike the normal exposure process, the re-exposure only needs to be irradiated with diffused light. Since the photomask 203 is not used and alignment is not required, the re-exposure device 17 can have a simple configuration, and can be transported. The apparatus 20 can be easily carried out while transporting the color filter 1, and there is no time loss.

  Further, the re-exposure is not limited to that performed while the color filter 1 is being transported. For example, the re-exposure may be performed by temporarily halting the transport of the color filter 1.

In the above example, the overcoat layer 104 is provided on the pixels of the black matrix 102 and the colored layers 103a to 103c on the substrate 101. As shown in FIG. It is possible to omit and form the photo spacer 105 directly on the black matrix 102. In addition, depending on the driving method of the liquid crystal display device, it is possible to adopt a configuration in which a transparent electrode layer is formed on the pixel by the black matrix 102 and the colored layers 103a to 103b, and the photo spacer 105 is provided thereon. It is. Further, the photo spacer 105 is not limited to the one provided in the color filter 1 but can be provided on the liquid crystal driving side substrate.
Even in these cases, the photo spacer 105 can be formed by the same process as described above, and the same effect can be obtained by performing re-exposure of the photo spacer 105.
Furthermore, this photo spacer formation method is not only applied to a color filter of a liquid crystal display device, but can also be applied to a color filter used in an organic EL (Electro-Luminescence) display device or the like.

  Thus, the present invention is not limited to the one described in the first embodiment. Hereinafter, other embodiments of the present invention will be described as second and third embodiments. In the second and third embodiments, differences from the first embodiment will be mainly described, and the same points as those in the first embodiment will be denoted by the same reference numerals in the drawings and the description thereof will be omitted. .

[Second Embodiment]
FIG. 6 is a diagram for explaining a photo spacer formation method according to the second embodiment. The second embodiment is an example in which a main spacer 105a and a lower sub-spacer 105b (see FIG. 6D) are simultaneously formed as photo spacers in the same process as the first embodiment. The sub-spacer 105b is provided, for example, so that the color filter 1 and the liquid crystal driving side substrate do not directly contact each other even when the color filter 1 is pressed in the liquid crystal display device.

In the second embodiment, as shown in FIG. 6A, the coating apparatus 11 is used to cover the black matrix 102 on the substrate 101 and the pixels formed by the colored layers 103a to 103c and the overcoat layer 104 so as to cover the negative. After the photosensitive resin composition 201 of the mold is applied, heating by the heating device 12 is performed, and subsequently, exposure by the UV light 202 is performed by the exposure device 13 through the photomask 203a (gradation mask).
This photomask 203a has a light transmitting portion 204a (first light transmitting portion) at a portion corresponding to the formation position 201a of the main spacer 105a, and a light transmission portion 204a at a portion corresponding to the formation position 201b of the sub spacer 105b. It has a semi-translucent portion 204b (second translucent portion) with lower translucency.

  Next, when development is performed using the developing device 14, as shown in FIG. 6B, the exposure amount varies through the difference between the exposure amount through the translucent portion 204a and the exposure amount through the semi-translucent portion 204b. The photocured photosensitive resin composition 201 remains as the main spacer 105a and the lower sub-spacer 105b. Thereafter, the substrate 101 is cleaned and dried by the cleaning device 15 and the drying device 16.

  In the subsequent steps, as in the first embodiment, as shown in FIG. 6C, UV light is applied to the photosensitive resin composition 201 of the main spacer 105a and the sub-spacer 105b using the re-exposure device 17. After re-exposure with 206 (diffuse light), the baking is performed by the baking apparatus 18 as shown in FIG. As a result, a main spacer 105a and a sub-spacer 105b are formed as photo spacers.

Also in the second embodiment, by performing re-exposure with diffused light, the photosensitive resin composition 201 of the main spacer 105a and the sub-spacer 105b is also reliably exposed from the side surface, and the melt flow is suppressed. The same effect as the form can be obtained.
Further, in the second embodiment, the main spacer 105a and the sub-spacer 105b can be formed at the same time, and there is an advantage that the process is simplified. However, since the exposure amount when the sub-spacer 105b is formed tends to be reduced, It is particularly effective to suppress melt flow by performing re-exposure according to the invention.

  Note that the overcoat layer 104 and the photo spacer can be formed at the same time by using a gradation mask having light-transmitting portions having different light transmittances as described above. Even in this case, by performing re-exposure in the same manner as described above, the melt flow of the photo spacer can be suppressed during firing.

[Third Embodiment]
FIG. 7 is a diagram for explaining a photospacer forming method according to the third embodiment. The third embodiment is an example in which a photo spacer 107 (laminated spacer, see FIG. 7E) is formed by overlapping colored layers.

  In the third embodiment, as shown in FIG. 7A, after forming pixels by the black matrix 102 and the red coloring layer 103a on the base material 101, a green colorant is included so as to cover them. The negative photosensitive resin composition 211 is applied by the coating device 11, heated by the heating device 12, and then exposed by the exposure device 13 to a portion corresponding to the formation position 211 a of the green pixel and the photo spacer 107. Exposure with UV light 202 is performed through a photomask 203 having

  Next, when development is performed using the developing device 14, as shown in FIG. 7B, the exposed and photocured photosensitive resin composition 211 is colored green at the green pixel and photo spacer 107 formation positions 211a. It remains as layer 103b. Subsequently, the substrate 101 is cleaned and dried by the cleaning device 15 and the drying device 16.

  Thereafter, as in the first embodiment, as shown in FIG. 7C, the re-exposure device 17 is used for the photosensitive resin composition 211 of the green colored layer 103b (particularly, the one forming the photo spacer 107). Then, re-exposure with UV light 206 (diffuse light) is performed, and then baking is performed by the baking apparatus 18 as shown in FIG. Thereby, the green coloring layer 103b is formed in the formation position 211a of the green pixel and the photo spacer 107.

  Thereafter, a blue photosensitive resin composition is further applied, and after the heating, the above exposure process to baking process are repeated. A photomask used at the time of exposure has a light-transmitting portion in a portion corresponding to a formation position of a blue pixel and a photo spacer 107. Thereby, as shown above, as shown in FIG. 7E, the blue colored layer 103c is formed at the formation position of the blue pixel and the photo spacer 107, and the blue colored layer 103c is formed on the green colored layer 103b. Laminated photo spacers 107 (laminated spacers) are formed.

Also in the third embodiment, by performing re-exposure with diffused light, the photosensitive resin composition of each colored layer forming the photo spacer 107 is also reliably exposed from the side surface, and the melt flow is suppressed. The same effect as the embodiment can be obtained.
Furthermore, in the third embodiment, the formation of the pixels and the formation of the photo spacer 107 can be performed at the same time, and there is an advantage that the process is simplified, but by using a colored photosensitive resin composition as the photo spacer 107, Since the progress of photocuring by exposure tends to be slow, it is particularly effective to suppress the melt flow by performing re-exposure according to the present invention.

  Note that the coloring layers to be stacked when the photo spacers 107 are formed, the stacking order thereof, and the like are not limited to the above. Further, the re-exposure is not limited to that performed on all the colored layers laminated as the photo spacer 107. For example, it is possible to carry out only for the lowermost colored layer or only for the uppermost colored layer.

  As an example, the present inventors examined the effect of suppressing melt flow by forming a photo spacer by the photo spacer forming method of the first embodiment described with reference to FIG. 3 and the like and performing re-exposure. . This will be described below.

[Example]
(Preparation of curable resin composition)
The polymerization tank is charged with 63 parts by weight of methyl methacrylate (MMA), 12 parts by weight of acrylic acid (AA), 6 parts by weight of 2-hydroxyethyl methacrylate (HEMA), and 88 parts by weight of diethylene glycol dimethyl ether (DMDG). After stirring and dissolving, 7 parts by weight of 2,2′-azobis (2-methylbutyronitrile) was added and dissolved uniformly. Thereafter, the mixture was stirred at 85 ° C. for 2 hours under a nitrogen stream, and further reacted at 100 ° C. for 1 hour. Further, 7 parts by weight of glycidyl methacrylate (GMA), 0.4 parts by weight of triethylamine, and 0.2 parts by weight of hydroquinone were added to the obtained solution, and the mixture was stirred at 100 ° C. for 5 hours to obtain a copolymer resin solution (solid content 50%). ) Next, the following materials were stirred and mixed at room temperature to obtain a curable resin composition.

(Composition of curable resin composition)
-Copolymer resin solution (solid content 50%): 16 parts by weight-Dipentaerythritol pentaacrylate (Sartomer SR399): 24 parts by weight- Orthocresol novolac type epoxy resin (Oka Chemical Shell Epoxy Epicoat 180S70): 4 parts by weight Parts 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one: 4 parts by weight diethylene glycol dimethyl ether: 52 parts by weight

(Formation of photo spacer 105)
Using the above curable resin composition as the negative photosensitive resin composition 201, the above-described coating process to baking process were performed to form the photo spacer 105. The photosensitive resin composition 201 was applied so as to have a thickness of about 3.5 μm after firing, and the exposure amount during exposure was 50 mJ. Moreover, heating and baking were performed for 3 minutes at 100 degreeC using the hotplate.
The planar shape of the photo spacer 105 was substantially circular, and the size and the like of the light transmitting portion 204 of the photo mask 203 were set so that the width (diameter) of the photo spacer 105 after development was about 8 μm.

(Re-exposure)
In the examples, re-exposure was performed with the re-exposure amount after development set to 4 cases of 100 mJ, 200 mJ, 500 mJ, and 1000 mJ. The re-exposure was performed by irradiating UV light as diffused light from above the color filter 1.

[Comparative example]
Except for not performing re-exposure (re-exposure amount is 0 mJ), a photo spacer 105 was formed in the same manner as in the example.

[result]
As a result, FIG. 8A shows the relationship between the re-exposure amount after development (mJ) and the thermal shift amount (μm). Here, the amount of thermal shift is obtained by measuring the difference L2-L1 between the width L1 (bottom surface) of the developed photo spacer 105 and the width L2 of the bottom surface of the photo spacer 105 after baking shown in FIG. When the melt flow occurs, the value becomes large. The width L1 is about 8 μm as described above.

As shown in FIG. 8A, when re-exposure is not performed (re-exposure amount is 0 mJ), the heat shift amount is 0.39 μm, and it can be seen that melt flow is generated.
On the other hand, when re-exposure is performed with re-exposure amounts of 100 mJ, 200 mJ, 500 mJ, and 1000 mJ, the thermal shift amounts are 0.01 μm, 0.02 μm, 0.04 μm, and −0.06 μm, respectively. It was confirmed that the heat shift amount was significantly reduced and the melt flow was suppressed to substantially zero.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

DESCRIPTION OF SYMBOLS 1,100: Color filter 10: Photo spacer formation apparatus 11: Coating apparatus 12: Heating apparatus 13: Exposure apparatus 14: Developing apparatus 15: Cleaning apparatus 16: Drying apparatus 17: Reexposure apparatus 18: Baking apparatus 20: Conveying apparatus 101 : Base material 102: Black matrix 103a: Red colored layer 103b: Green colored layer 103c: Blue colored layer 104: Overcoat layer 105, 107: Photo spacer 171: Light source 201, 211: Photosensitive resin composition 203, 203a: Photo Masks 204 and 204a: Translucent part 204b: Semi-translucent part

Claims (8)

A photospacer formation method for forming a photospacer with a photosensitive resin composition,
In the base material, an application step of applying a negative photosensitive resin composition;
An exposure step of exposing the photosensitive resin composition using a photomask;
A development step of developing and leaving the exposed photosensitive resin composition;
A re-exposure step in which the developed photosensitive resin composition is exposed again with diffused light so that light is irradiated to the side surface of the photosensitive resin composition ;
A baking step of baking the reexposed photosensitive resin composition;
Only including,
By performing re-exposure with the diffused light, the difference between the width of the bottom surface of the photo spacer by the photosensitive resin composition after development and the width of the bottom surface of the photo spacer by the photosensitive resin composition after baking is set to 0.04 μm or less. A method for forming a photospacer characterized by comprising the steps of:   The photospacer forming method according to claim 1, wherein in the re-exposure step, exposure is performed while the base material is conveyed. The photo spacer includes a main spacer and a lower sub spacer.
In the exposure step, a first light transmitting portion is provided in a portion corresponding to the formation position of the main spacer, and a light transmittance lower than that of the first light transmission portion is provided in a portion corresponding to the formation position of the sub spacer. The method for forming a photospacer according to claim 1, wherein the photosensitive resin composition is exposed using a photomask having a second light transmitting portion. The photo spacer constitutes a color filter,
In the application step, a negative photosensitive resin composition of a color corresponding to the pixel of the color filter is applied,
The exposure step includes exposing the photosensitive resin composition using a photomask having a light-transmitting portion in a portion corresponding to a formation position of the photo spacer and the pixel. The photo spacer formation method according to claim 2. In the substrate,
Forming pixels and black matrix,
A photo spacer made of a photosensitive resin composition ,
An application step of applying a negative photosensitive resin composition;
An exposure step of exposing the photosensitive resin composition using a photomask;
A development step of developing and leaving the exposed photosensitive resin composition;
A re-exposure step in which the developed photosensitive resin composition is exposed again with diffused light so that light is irradiated to the side surface of the photosensitive resin composition ;
A baking step of baking the reexposed photosensitive resin composition;
Formed by
By performing re-exposure with the diffused light, the difference between the width of the bottom surface of the photo spacer by the photosensitive resin composition after development and the width of the bottom surface of the photo spacer by the photosensitive resin composition after baking is set to 0.04 μm or less. A method for producing a color filter, comprising suppressing the color filter.   The color filter manufacturing method according to claim 5, wherein in the re-exposure step, exposure is performed while the base material is conveyed. A photo spacer forming apparatus for forming a photo spacer with a photosensitive resin composition,
In a base material, a coating device for applying a negative photosensitive resin composition;
An exposure apparatus that exposes the photosensitive resin composition using a photomask;
A developing device that performs development and leaves the exposed photosensitive resin composition;
A re-exposure device that re-exposes the developed photosensitive resin composition with diffused light so that light is irradiated onto the side surface of the photosensitive resin composition ;
A baking apparatus for baking the reexposed photosensitive resin composition;
Only including,
By performing re-exposure with the diffused light, the difference between the width of the bottom surface of the photo spacer by the photosensitive resin composition after development and the width of the bottom surface of the photo spacer by the photosensitive resin composition after baking is set to 0.04 μm or less. A photospacer forming apparatus characterized by suppressing .   The photo-spacer forming apparatus according to claim 7, wherein the re-exposure apparatus performs exposure on the substrate being conveyed.

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