JP5912367B2 - measuring device - Google Patents

Description

  The present invention relates to a measuring apparatus that measures the position of an electronic component mounted on a substrate for inspection.

  An inspection apparatus for measuring the position of an electronic component mounted on an inspection-dedicated jig substrate is disclosed in Patent Document 1, for example. In the electronic component mounting apparatus that measures the position of the mounted electronic component in this way and mounts the electronic component on the board, it is used as offset data for the mounting position of the suction nozzle with respect to the mounting head. The mounting accuracy of electronic parts is increased.

Japanese Patent Publication

  However, in order to inspect the position of the electronic component mounted on the substrate, when the electronic component is imaged by a camera, an illumination lamp for performing backlight illumination is necessary and expensive.

  Therefore, in order to inspect the position of an electronic component mounted on a substrate for inspection, an object of the present invention is to enable measurement without taking backlight illumination when imaging the electronic component with a camera. To do.

The first invention is a measuring device for measuring the position of the electronic components mounted on a substrate for inspection, using a substrate to diffuse the light emitted from the light source as the base plate inside, and this irregular reflection with images the transmission images of the positioning mark provided on the transmission image and board surface by that electronic components on the light with the camera, the light from the light source to the substrate is irradiated from an oblique, in the electronic component and the positioning marks The irradiated light is reflected and is not imaged by the lens, and the light incident on the inside of the substrate and irregularly reflected is imaged by the lens .

  According to the present invention, in order to inspect the position of an electronic component mounted on a substrate for inspection, when the electronic component is imaged with a camera, measurement can be performed without requiring backlight illumination. it can.

It is a top view of an electronic component mounting apparatus. It is a simplified explanatory view of a state where an illumination lamp is turned on and an electronic component mounted on an inspection substrate is irradiated with inclined light. It is a top view of the board | substrate for a test | inspection with which the electronic component was mounted | worn. It is explanatory drawing of the state which irradiated the light from an illuminating lamp on the test | inspection board | substrate diagonally.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and component supply devices 3A, 3B, 3C, and 3D are divided into four blocks on the front and rear of the apparatus main body 2 of the electronic component mounting apparatus 1, and a plurality of them are arranged in parallel. It is installed. The component supply device 3A has a lane number (component supply unit arrangement number) in the 100s, the component supply device 3B has a lane number in the 200s, and the component supply device 3C has a lane number in the 300s. 3D has lane numbers in the 400s.

  Each of the component supply devices 3A, 3B, 3C, and 3D includes a plurality of component supply units 5 arranged in parallel on a feeder base of a cart base that is a mounting base, and a printed circuit board having a tip on the component supply side as a substrate. It is detachably disposed on the apparatus main body 2 via a connector (not shown) so as to face the conveyance path of P, and can be moved by a caster provided on the lower surface when the connector is released and the handle is pulled. It is a configuration.

  Each of the component supply devices 3A, 3B, 3C, and 3D is disposed so that the tip on the component supply side faces the pickup region (component extraction region) of the mounting head 6, and each component supply unit 5 includes The storage tape is rotated by a predetermined angle by rotating a feed sprocket whose teeth are fitted to feed holes opened at predetermined intervals on a storage tape that is sequentially wound in a state of being wound around a supply reel that is rotatably mounted on the cart table. A tape feed mechanism that intermittently feeds the electronic component to the component pickup / extraction position by a feed motor, and a cover tape release mechanism for peeling the cover tape from the carrier tape in front of the pickup / extraction position by driving the peeling motor. The cover tape is peeled off by the peeling mechanism, and the electronic parts loaded in the carrier tape storage section are sequentially supplied to the component pick-up / removal position. It can be taken out by the suction nozzle as a retainer to be described later from.

  Between the front-side component supply devices 3B and 3D and the rear-side component supply devices 3A and 3C, there are two supply conveyors, positioning units 8 and 8 (having a conveyor) that constitute the substrate transport mechanism, and discharge. A conveyor is provided. Each supply conveyor conveys each printed board P received from the upstream to each positioning unit 8, and electronic components are mounted on each board P positioned by a positioning mechanism (not shown) in each positioning unit 8. Then, it conveys to each discharge conveyor, and conveys to a downstream apparatus after that. The printed circuit board P is positioned in the front / rear / left / right direction (planar direction) and the vertical direction (vertical direction) by the positioning mechanism.

  Each beam 10 that moves along the guide rail 9 by the Y-axis drive motor in the Y direction is provided with a mounting head 6 that is moved by the X-axis drive motor in the longitudinal direction, that is, in the X direction. A book suction nozzle is provided. The mounting head 6 is equipped with a vertical axis drive motor for moving the suction nozzle up and down, and a θ-axis drive motor for rotating around the vertical axis. Therefore, the suction nozzle of the mounting head 6 can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

  Reference numeral 12 denotes a component recognition camera. How much each electronic component is displaced and held with respect to the suction nozzle. The electronic component sucked and held by the suction nozzle in order to recognize the position in the XY direction and the rotation angle. Take an image. Reference numeral 19 denotes a board recognition camera provided on the mounting head 6 for picking up an image of a positioning mark attached to the printed board P. The images captured by the cameras 12 and 19 are subjected to recognition processing by a recognition processing device.

  The electronic component mounting apparatus 1 described above also functions as an inspection apparatus for inspecting the mounting position of the electronic component mounted on the printed circuit board P, and the configuration thereof will be described below.

  In FIG. 2, the inspection substrate PP for the inspection is a milky white glass substrate or ceramic substrate, and when light from an illumination lamp 20 as a light source described later is irradiated obliquely onto the inspection substrate PP. These are made of a material that irregularly reflects inside the inspection substrate PP.

  Further, a substrate positioning mark M is deposited on the inspection substrate PP by vapor deposition at a peripheral position of the mounted electronic component 21 in order to recognize the position of the electronic component 21 mounted on the inspection substrate PP. (See FIG. 3). Specifically, as shown in FIG. 3, the positioning mark M is placed on the inspection substrate PP so as to straddle the electronic component 21 after mounting and at a predetermined interval from the electronic component.

  Reference numeral 20 denotes an electronic component 21 mounted on the inspection substrate PP and a plurality of illumination lamps that irradiate light (tilted light) obliquely from above to the positioning mark. The longest portion when the electronic component 21 is viewed in plan view. Are arranged at intervals longer than the length of. The plurality of illuminating lamps 20 are arranged in two rows on the mounting head 6 at an interval so as to face a group of illuminating lamps 20 arranged in a row at a predetermined interval. Alternatively, a plurality of the gaps may be arranged on the circumference having the diameter as a ring at a predetermined interval. A lens barrel 22 is attached to the lower surface of the substrate recognition camera 19 and has a lens 23 for forming a reflected image therein.

  Next, the mounting operation of the electronic component 21 for inspecting the mounting position of the mounted electronic component 21 will be briefly described. First, the inspection substrate PP, which is an inspection-dedicated jig substrate, is conveyed from the upstream device to the positioning unit 8 via the supply conveyor and positioned and fixed, and the mounting head 6 is in accordance with the mounting coordinate data of the electronic component 21 to be inspected. The electronic component 21 to be mounted by the suction nozzle corresponding to the component type of the electronic component 21 to be inspected is sucked from the predetermined component supply unit 5 and taken out.

  More specifically, in this case, it moves so as to be positioned above the component supply unit 5 that houses the target electronic component 21, but in the Y direction, the Y axis drive motor drives and the beam 10 moves, and in the X direction, the X axis drive. The motor is driven to move the mounting head 6, and the predetermined component supply unit 5 has already been driven by the feed motor and the peeling motor so that the electronic component 21 can be taken out at the component picking and taking out position. The motor lowers the predetermined suction nozzle to suck and take out the electronic component 21, and then the mounting head 6 is lifted.

  The suction nozzle moves so as to mount the electronic component 21 at a predetermined position on the printed circuit board P positioned by the positioning unit 8. During the movement of the mounting head 6, the mounting head 6 moves. On the other hand, when passing the upper position of the component recognition camera 12, the electronic component 21 sucked and held by the suction nozzle is imaged by the component recognition camera 12 (fly recognition).

  Then, based on the imaging result, the recognition processing device recognizes how much the electronic component 21 is displaced and held with respect to the suction nozzle by the recognition processing device for the XY direction and the rotation angle. And the suction nozzle holding the electronic component 21 by driving the X-axis drive motor moves to the inspection substrate PP. Before the electronic component 21 is mounted on the inspection substrate PP, the substrate recognition camera 19 images the substrate positioning mark M attached to the inspection substrate PP, and the recognition processing device recognizes and processes the substrate positioning mark M. The position is grasped.

  Therefore, the Y axis drive motor, the X axis drive motor, and the θ axis drive motor are corrected and controlled by the control device by adding the position recognition result of the printed circuit board P and the position recognition processing result of the electronic component 21 to the mounting coordinates of the mounting data. Then, the electronic component 21 is mounted at a predetermined position on the printed circuit board P while the suction nozzle of each mounting head 6 corrects the positional deviation.

  As described above, at the stage where the electronic component 21 to be inspected is mounted on the inspection substrate PP, which is a dedicated inspection jig substrate, the following inspection is performed. That is, as described above, the mounting head 6 is moved upward to the electronic component 21 to be inspected mounted on the inspection substrate PP. When the illuminating lamp 20 is turned on, light (tilted light) is irradiated obliquely to the inspection substrate PP.

  Then, as shown in FIGS. 2 and 4, the inspection substrate PP is a milky white glass substrate or ceramic substrate, and when the inspection substrate PP is irradiated with light from the illumination lamp 20 obliquely, The light applied to the electronic component 21 and the positioning mark M is reflected and is not imaged by the lens 23, but the light incident and diffusely reflected inside the inspection substrate PP is imaged by the lens 23 to form the substrate. The recognition camera 19 takes a transmission image of the electronic component 21 and the positioning mark M.

  Then, the transmitted image is recognized by the recognition processing device, and the position of the positioning mark M is known. Therefore, the positional displacement of the mounted electronic component 21 is determined from the positional relationship of the mounted electronic component 21 with respect to the positioning mark M. Becomes clear. Therefore, the positional deviation amount is stored in the storage means provided in the electronic component mounting apparatus 1 and is used as offset data for the attachment position of the suction nozzle with respect to the mounting head 6 to mount the electronic component in the electronic component mounting apparatus 1. Accuracy can be increased. The attachment position of the suction nozzle can be dealt with even when the attachment head 6 is obliquely attached so as not to move up and down in the vertical direction.

  In addition to the positioning mark M, the printed circuit board P and the inspection board PP, in addition to the positioning mark M, recognize the position of the printed circuit board P and the inspection board PP. P and an overall recognition positioning mark for recognizing the position of the entire inspection substrate PP are also attached, so that the entire recognition positioning mark can be imaged and recognized by the above-described method. In this case, the positioning mark M and the overall recognition positioning mark may have the same shape or different shapes.

  As described above, in order to inspect the position of the electronic component 21 mounted on the inspection substrate PP, the present invention requires backlight illumination when imaging the electronic component 21 with the substrate recognition camera 19. Without being able to measure.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 6 Mounting head 19 Substrate recognition camera 20 Illumination lamp 21 Electronic component PP Inspection board

Claims (1)

A measuring device for measuring the position of an electronic component mounted on a substrate for inspection, wherein a substrate that internally diffuses light emitted from a light source is used as the substrate, and the electronic component of the electronic component by the irregularly reflected light is used. When a transmission image and a transmission image of a positioning mark provided on the surface of the substrate are picked up by a camera and light from the light source is irradiated obliquely onto the substrate, the light irradiated to the electronic component and the positioning mark is The measuring apparatus is configured such that light that is reflected and not imaged by the lens and that is incident and diffusely reflected inside the substrate is imaged by the lens.

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