JP5896697B2 - Microscope imaging device - Google Patents

Description

  The present invention relates to a microscope imaging apparatus used in a microscope.

  In microscopic observation, high-definition images are required for performing pathological diagnosis in which diagnosis is performed based on cell morphology, imaging for measuring changes in a sample by weak fluorescence, and the like. As means for obtaining an image, an imaging apparatus using an imaging element such as a CCD is used instead of a conventional imaging apparatus using a silver salt film as an imaging medium.

An imaging device disclosed in Patent Document 1 is arranged between an imaging device for imaging an observation object, and between the imaging device and a heat dissipation member, and conducts heat from the imaging device to the heat dissipation member to capture the image pickup device. An electronic cooling element that cools the substrate, a substrate on which the imaging element is disposed and fixed to the heat radiating member, and a heat insulating member that is disposed between the heat radiating member and the substrate and insulates the heat radiating member and the substrate. .
And the electronic cooling element is being fixed to the image pick-up element with the heat conductive double-sided tape.

  In the imaging device disclosed in Patent Document 2, a cooling element that cools the imaging element is in close contact with or adhered to the internal housing via a heat transfer sheet.

  Furthermore, the imaging apparatus disclosed in Patent Document 3 includes an imaging element that captures an image of a subject, a Peltier element that contacts the imaging element and absorbs heat from the imaging element, and a first casing and a second casing. The image sensor and the Peltier element are accommodated in a space surrounded by the first casing and the second casing, and an inner fixing portion for fixing the image sensor and the Peltier element in the space is provided in the first casing. The camera housing is provided between the Peltier element and the second housing, and contacts the second housing to transfer heat from the Peltier element to the second housing. A heat transfer member having a sealing member that forms a sealed space around the imaging element and the Peltier element between the body and the body.

  The heat transfer member includes an external force absorber that is interposed between the heat transfer member and the second housing and absorbs external force applied to the camera housing from acting on the Peltier element and the image sensor. ing. Further, the Peltier element penetrates the center of the built-in substrate, and the horizontal position is regulated by the substrate.

JP 2009-182922 A JP 2008-187264 A Japanese Patent No. 4341260

In recent years, there has been an increasing demand for high sensitivity for microscopic observation in order to perform pathological diagnosis in which diagnosis is performed according to cell morphology and fluorescence imaging in which changes in specimens are measured by weak fluorescence.
For this reason, the microscope camera needs to reduce the dark current as much as possible, and a heat exchange element such as a Peltier element is disposed inside the camera to cool the imaging element. At this time, it is desirable that the heat absorption surface and the heat radiation surface of the heat exchange element are in close contact with another member, for example, a metal member with high thermal conductivity, and it is desirable to interpose heat conduction grease in the gap with the metal member.

  Furthermore, in order to prevent the cooling performance from deteriorating, the heat exchange element is fixed with a holding force that does not reduce the heat absorption surface of the heat exchange element and the contact area between the heat dissipation surface and other members even when an external force is applied. It is desirable that

  The imaging device disclosed in Patent Document 1 uses a heat-conductive double-sided tape for fixing a cooling element. However, if the material of the double-sided tape is acrylic, the thermal conductivity is generally deteriorated, and cooling is performed. Since there is a possibility that the gap between the element and the image sensor is in a very small range, there is a problem that the cooling performance of the cooling element is deteriorated.

  The imaging device disclosed in Patent Document 2 uses a heat transfer sheet for fixing the cooling element. However, since the adhesive force on the surface of the sheet material is generally low, the cooling element is easily displaced by an external force. There is a problem. Further, there is a similar problem when the heat transfer sheet is made of grease.

  The imaging device disclosed in Patent Document 3 uses a substrate for the horizontal position regulation of the Peltier element. However, when the gap between the Peltier element and the substrate is small, the Peltier element is positioned in the thrust direction during assembly. In addition, if the heat absorbing surface and the heat generating surface of the Peltier element are in contact with the substrate, there is a problem that the cooling performance of the cooling element is deteriorated.

  On the other hand, in the imaging device disclosed in Patent Document 3, when the gap between the Peltier element and the substrate is large, the Peltier element moves in the horizontal direction, and the heat absorption surface and heat dissipation surface of the Peltier element and other members There is a problem that the contact area is reduced and the cooling performance of the cooling element is deteriorated.

  Further, as shown in FIG. 11, a protrusion 702 having a height approximately equal to the heat absorption surface of the Peltier element 700 is formed on the heat transfer member 701 with which the heat absorption surface of the Peltier element 700 is in contact so that the Peltier element 700 does not shift in the horizontal direction. It is conceivable to provide simply.

  The Peltier element 700 placed on the heat transfer member 701 is covered with the sealed container 703, and thus is disposed in a sealed state in the sealed container 703. The sealed container 703 is generally made of an opaque component such as aluminum from the viewpoint of processability and thermal conductivity.

  However, since the Peltier element 700 needs to apply a high voltage and the space inside the sealed container is generally small, the connected cable is thick and short, so it is pulled by the cable during assembly, There is a risk that it will be placed on the protrusion 702.

  When the Peltier element 700 is covered with the sealed container 703, the state cannot be visually confirmed by the opaque sealed container 703, and the Peltier element 700 is assembled on the projection 702 and may be damaged.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide an imaging apparatus for a microscope that can be easily assembled without degrading the cooling performance of the heat exchange element.

In order to achieve the above object, an imaging apparatus for a microscope according to a first aspect of the present invention includes an imaging element for imaging a subject, a heat exchange element that cools the imaging element, and an abutment that abuts on the heat exchange element. and the member, provided the abutment member, and a protrusion having a positioning surface which faces a side surface other than the heat absorbing surface and the heat generating surface of the heat exchange element, the positioning surface of the protrusion, the protrusion The tip has a gentle continuous slope from the front end to the base end, and a distance α between the heat absorbing surface or the heat generating surface that is in contact with the contact member is applied to the contact member. It was shorter than the distance β between the heat generating surface or the heat absorbing surface not in contact.

  The microscope imaging apparatus according to a second invention is the microscope imaging apparatus according to the first invention, wherein at least a part of the positioning surface is in contact with the contact member or the heat absorbing surface or the heat generation. Touching the surface.

  Furthermore, the microscope imaging apparatus according to a third aspect of the invention is the microscope imaging apparatus according to the first or second aspect of the invention, further comprising a sealed container that hermetically accommodates the periphery of the imaging element.

A microscope imaging apparatus according to a fourth invention is the microscope imaging apparatus according to any one of the first to third inventions, wherein the contact member includes a first contact member that contacts the heat absorbing surface and the first contact member. A second abutting member that abuts the heat generating surface, and the height of the protrusion is shorter than the distance between the first abutting member and the second abutting member.
A microscope imaging apparatus according to a fifth invention is the microscope imaging apparatus according to the fourth invention, wherein the contact member is a heat sink interposed between the imaging element and the heat exchange element.
A microscope imaging apparatus according to a sixth invention is the microscope imaging apparatus according to any one of the first, third to fifth inventions, wherein the positioning surface of the protrusion is in contact with the contact member. It has a gap of the distance α with respect to the heat absorption surface or the heat generation surface.

  According to the microscope imaging apparatus of the present invention, there is an effect that the assembly can be easily performed without deteriorating the cooling performance by the heat exchange element.

It is a schematic block diagram of a microscope provided with the camera which concerns on each embodiment of this invention. 1 is a longitudinal sectional view showing a schematic configuration of a camera according to a first embodiment of the present invention. It is the elements on larger scale of the A section of FIG. FIG. 4 is a partial plan view of FIG. 3. It is the elements on larger scale which concern on the modification of 1st Embodiment. It is the elements on larger scale of the camera which concerns on the 2nd Embodiment of this invention. FIG. 7 is a partial plan view of FIG. 6. It is the elements on larger scale which concern on the modification of 2nd Embodiment. It is a longitudinal cross-sectional view which shows schematic structure of the camera which concerns on the 3rd Embodiment of this invention. It is the elements on larger scale of the B section of FIG. It is a longitudinal cross-sectional view which shows the assembly of the camera which concerns on a prior art.

[First Embodiment]
The microscope imaging apparatus according to the first embodiment of the present invention will be described below with reference to FIGS.
FIG. 1 is a schematic configuration diagram showing a microscope 100 equipped with a camera 1 as an imaging apparatus for a microscope according to the first embodiment of the present invention.
The microscope 100 according to the present embodiment includes a microscope main body 201, a stage 202, an objective lens 203, an eyepiece lens 204, a lens barrel 205, an imaging lens 207, and the camera 1.

  The microscope main body 201 is provided with an objective lens 203 that is disposed to face the stage 202 and that enlarges the specimen image. The microscope body 201 is provided with a stage 202 on which a specimen (subject) 206 is placed and movable up and down in the direction of the optical axis 900 of the objective lens 203. With such a configuration, the specimen 206 is positioned in the direction along the optical axis 900 of the objective lens 203 with respect to the objective lens 203 by moving the stage 202 up and down.

  The microscope body 201 is provided with a lens barrel 205 on which an imaging lens 207 that forms an image of the specimen 206 on the image sensor 301 in the camera 1 and an eyepiece lens 204 for visual observation. Yes. The camera 1 is provided at the subsequent stage of the imaging lens 207 (the direction along the optical axis 900 of the objective lens 203).

  2 is a diagram showing an internal configuration of the camera 1 in the present embodiment, FIG. 3 is an enlarged view (part A) of FIG. 2 showing a component relationship around a Peltier element described later, and FIG. It is the enlarged view which showed the component relationship around a Peltier device from upper direction.

  As shown in FIGS. 2 and 3, the camera 1 includes an imaging element 301 (for example, a CCD) for imaging the specimen 206, a sealed container 307 that hermetically accommodates the image sensor 301, and a camera body that accommodates the hermetic container 307. (Housing) 208 and a displacement member 309 provided on the outer surface (left and right direction in FIG. 1) of the sealed container 307 in the camera body 208.

  The connection unit 300 is fixed to the camera body 208 and connects the camera body 208 and the lens barrel 205. The connection unit 300 is provided with an opening 300a so that observation light can enter. ing. The camera body 208 is also provided with an opening 208b for the same reason.

  Reference numeral 302 denotes a Peltier element (heat exchange element), and reference numeral 303 denotes a heat sink (first contact member) that thermally connects the imaging element 301 and the Peltier element 302. The substrate 304 mounts the image sensor 301 and operates the image sensor 301 by an electric signal from the drive substrate 305 via the cable 304a. An opening 304 b for arranging the heat sink 303 is provided in the center of the substrate 304.

  The Peltier element 302 and the substrate 304 are connected by a cable 302a (see FIG. 4). The cable 302a is sufficiently thick because a high voltage is applied to the Peltier element 302. The image pickup element 301 includes a metal pin 301 a for signal transmission and position fixing, and the pin 301 a is soldered to the substrate 304.

  Between the lower surface of the heat sink 303 and the imaging element 301, between the upper surface 303b of the heat sink 303 and the heat absorbing surface 302c of the Peltier element 302, and between the heat generating surface 302h of the Peltier element 302 and the upper part 307a of the sealed container 307. The heat conductive grease (heat transfer member) is filled.

  A leaf spring (elastic member) 601 is provided between the heat generating surface 302 h of the Peltier element 302 and the upper part 307 a of the sealed container 307, and the thickness of the Peltier element 302 is changed by the leaf spring 601. It is biased in the direction (vertical direction in FIG. 3).

As shown in FIGS. 3 and 4, a plurality of (four in this embodiment) protrusions (positioning portions) 401 are provided on the upper surface 303 b of the heat sink 303 at positions facing the side surface 302 s of the Peltier element 302. ing.
The upper surface 303b of the heat sink 300 has a larger area than the heat absorbing surface 302c of the Peltier element 302 so that the Peltier element 302 and the protrusion 401 can be disposed.

These protrusions 401 have a shape in which the apex portion of the cone is cut in a direction parallel to the bottom surface.
In addition, the protrusion 401 has a slope 401a (conical surface) as a smooth continuous positioning surface whose diameter increases from the distal end (vertex) to the proximal end (bottom). The inclined surface 401 a faces the side surface 302 s of the Peltier element 302.
Here, the side surface 302s of the Peltier element 302 refers to a surface other than the heat absorbing surface 302c and the heat generating surface 302h of the Peltier element 302.

The distance between the base end of the protrusion 401 and the heat absorbing surface 302c of the Peltier element 302, that is, the protrusion 401 and the Peltier element 302 in the direction perpendicular to the thickness direction of the Peltier element 302 (left and right in FIG. 3). The distance between the endothermic surface 302c and α is the distance between the tip of the projection 401 and the heat generating surface 302h of the Peltier element 302, that is, in the direction perpendicular to the thickness direction of the Peltier element 302 (the left-right direction in FIG. 3). If the distance between the protrusion 401 and the heat generating surface 302h of the Peltier element 302 is β, the relationship α <β holds.
Here, α is fixed at a desired position on the upper surface 303b of the heat sink 303 when α is less than 0.1 mm, but may be 0.1 mm or more.

The height of the protrusion 401, that is, the distance in the thickness direction is substantially the same as the thickness of the Peltier element 302. The height of the protrusion 401 may be less than the thickness of the Peltier element 302.
Further, the height of the protrusion 401 is less than the distance in the thickness direction between the upper surface 303b of the heat sink 303 and the inner surface of the upper component 307a. Thereby, a space is provided between the tip of the protrusion 401 and the inner surface of the upper part 307a.

  The heat sink 303 has a contact portion 303a with the substrate 304, and is fixed to the substrate 304 with a screw (not shown) using a tap (not shown) provided on the contact portion 303a. In order not to transmit the heat generated by the Peltier element 302 to the image sensor 301, it is desirable that the contact portion 303a and the substrate 304 be thermally insulated with a resin or the like.

  The substrate 304 is fixed to the hermetic container 307 with screws (not shown), and the drive substrate 305 is fixed to the camera body 208 with screws (not shown). The drive board 305 is connected to a control device (not shown) such as a PC (personal computer) disposed outside the camera 1 by a cable (not shown).

  As is apparent from the drawing, the imaging element 301 and the Peltier element 302 are disposed inside the sealed container 307, and a water absorbing member such as silica gel (not shown) is disposed inside the sealed container 307.

  The sealed container 307 is a sealed container for protecting electronic components such as the imaging element 301 and the Peltier element 302 arranged from the moisture from the outside. The hermetic container 307 is composed of a bottomed cylindrical shape, that is, a cup-shaped upper part 307a and a lower part 307b, and a substrate 304 is disposed between the upper part 307a and the lower part 307b. A glass 308 as a light transmitting member is disposed below the sealed container 307 so that observation light from the microscope main body 201 can be transmitted. The glass 308 is bonded and fixed with an adhesive (not shown) so that there is no gap with respect to the lower component 307b.

  A displacement member 309 is disposed on the lower side surface of the sealed container 307, and the movable portion of the displacement member 309 and the sealed container 307 are fixed by screws (not shown). A fixing portion 206a is provided on the inner side surface of the camera body 208, and the displacement member 309 and the camera body 208 are fixed at the fixing portion 206a by a screw (not shown).

  Inside the camera body 208, an intermediate plate portion 306 that constitutes a part of the camera body 208 is disposed above the sealed container 307. Heat conduction grease is filled in the gap between the members, particularly the gap between the upper surface of the upper part 307a constituting the sealed container 307 and the lower surface of the middle plate portion 306, so that heat can be transferred without being mechanically fixed. Yes. As is apparent from the figure, the middle plate portion 306 has an opening in a part thereof, and the cable 304a and the cable 320a pass through the opening.

  The cable 320 a connects the drive substrate 305 and a piezo element as a drive unit (not shown) provided on the displacement member 309. By driving this piezo element, the displacement member 309 causes the sealed container 307 and the image sensor 301 accommodated in the sealed container 307 to be perpendicular to the optical axis of the image sensor 301 with respect to the camera body 208 ( In FIG. 3, it is moved in the left-right direction).

The assembly operation of the camera 1 having the above configuration will be described below.
First, in order to assemble the sealed container 307, as shown in FIG. 2, the heat sink 303 is fixed to the substrate 304 with a screw (not shown). Next, after applying thermal conductive grease to the image sensor 301 mounting side of the substrate 304, the image sensor 301 is soldered to the substrate 304 while being applied to the heat sink 303.

  Thereafter, after applying thermal conductive grease to the upper surface 303 b of the heat sink 303, the Peltier element 302 is inserted into a space surrounded by the plurality of protrusions 401, placed on the upper surface 303 b of the heat sink 303, and brought into contact with the heat sink 303.

  Here, the position of the Peltier element 302 may move due to the elasticity of the cable 302a (see FIG. 4). However, the desired slope of the upper surface 303b of the heat sink 303 is determined by the slope 401a of the protrusion 401 configured under the conditions described above. Positioned.

Thereafter, when the Peltier element 302 is covered with the upper part 307 a and the upper part 307 a and the substrate 304 are fixed, the Peltier element 302 is positioned at a desired position. The airtight container 307 can be assembled without raising the Peltier element 302 without being raised.
Subsequent assembly work is omitted.

  Furthermore, even when an external force is applied to the camera 1 when the assembled camera 1 is transported, the Peltier element 302 is in a direction orthogonal to the thickness direction of the Peltier element 302 (left and right direction in FIG. 3). Although there is a risk of movement, the inclined surface 401a of the protrusion 401 configured under the conditions described above is positioned at a desired position on the upper surface 303b of the heat sink 303 without detaching from the upper surface 303b of the heat sink 303.

Even if the Peltier element 302 contacts the protrusion 401, only the heat absorbing surface 302 c of the Peltier element 302 contacts the protrusion 401.
Accordingly, the heat transfer path can be prevented from circulating from the heat sink 303 via the Peltier element 302 and the protrusion 401 and back to the heat sink 303, so that the image sensor 301 can be cooled well.

The operation of the microscope 100 having the above configuration will be described below.
When acquiring a specimen image, the specimen 206 is placed on the stage 202, the stage 202 is moved up and down, and the specimen 206 is aligned with the focal position of the objective lens 203. An enlarged image of the specimen 206 can be observed.
When it is desired to observe with the image sensor 301, an optical path switching unit (not shown) arranged in the lens barrel 205 is operated to make observation light enter the camera body 208.

When it is desired to obtain an image of a low pixel of about the image sensor 301, the displacement member 309 is not particularly operated by the operation of the control device, and an image incident on the image sensor 301 is acquired.
On the other hand, when it is desired to acquire a high-pixel image, first, the controller is operated to acquire the image once. Further, by operating the control device, the displacement member 309 is operated by the pixel pitch so that the necessary number of pixels can be acquired.

  In this case, the drive signal from the control device moves the movable part of the displacement member 309 by applying a voltage to the piezo element via a cable (not shown), the drive board 305, and the cable 320a.

  Then, since the movable part of the displacement member 309 and the sealed container 307 are fixed with screws (not shown), the imaging element 301, the Peltier element 302, the heat sink 303, and the substrate 304 disposed inside the sealed container 307 and the sealed container 307. Moves relative to the camera body 208.

  The force generated by the piezo element is sufficiently large with respect to the dead weight of the sealed container 307 and the components disposed therein, so that the sealed container 307 can be reliably moved to the position intended by the observer. The cables 304a and 320a are set to be sufficiently longer than the distance between the connecting portions at both ends. Therefore, the movement of the movable portion 309a does not hinder the movement of the movable portion of the displacement member 309. .

  Further, since the gap between the upper part 307a and the middle plate portion 306 constituting the sealed container 307 is filled with the heat conductive grease as described above, heat transfer is possible and mechanical fixation is not performed. These do not hinder the movement of the movable part of the displacement member 309.

  In addition, since the image pickup element 301 is connected to the heat absorbing surface 302c of the Peltier element 302 via the heat sink 303, when the Peltier element 302 operates in response to an electric signal from the driving substrate 305, the image pickup element 301 is efficiently moved. It can be cooled and dark current noise, which is a problem during shooting, can be reduced.

  Further, the gap between the heat generating surface 302h opposite to the heat absorbing surface 302c of the Peltier element 302 and the upper part 307a is filled with the heat conductive grease as described above, and the Peltier element 302 and the heat sink 303 are connected by the leaf spring 601. Since they are in close contact with each other, the heat from the Peltier element 302 is transferred to the camera body 208 via the upper part 307a and the middle plate portion 306, and is then naturally cooled (radiated) from the camera body 208.

As described above, according to the present embodiment, it is possible to easily assemble the camera without damaging the Peltier element without worrying about the position of the Peltier element and the floating of the Peltier element due to cable elasticity. .
In addition, the position of the Peltier element does not shift even when an external force such as vibration or impact is applied to the camera, so that the contact area between the Peltier element and the heat sink can be secured within a desired range, and the imaging element can be cooled well. And the influence of dark current (noise) can be minimized.

Next, a modification of the first embodiment will be described with reference to FIG.
FIG. 5 is an enlarged view showing the component relationship around the Peltier element.
In the following, with respect to the modified example of the first embodiment, the same points as those of the camera 1 of the first embodiment are denoted by the same reference numerals, description thereof is omitted, and different points are mainly described.

As shown in FIG. 5, the difference from the first embodiment is the shape of the protrusion.
The plurality of projecting portions 411 have a shape in which a member having a shape obtained by cutting a vertex portion of a cone in a direction parallel to the bottom surface and a cylindrical member are overlapped.

  These protrusions (positioning portions) 411 are a slope 411a (conical surface) as a gentle continuous positioning surface whose diameter increases from the tip (apex) to the base end (bottom) and the slope. A vertical surface 411b (cylindrical surface) extending from 411a toward the base end portion is provided, and the inclined surface 411a and the vertical surface 411b face the side surface 302s of the Peltier element 302.

The vertical surface 411 b of the protrusion 411 has a height shorter than the thickness of the Peltier element 302.
As described above, according to the modification of the first embodiment, the same effects as those of the first embodiment can be obtained.

  Further, the protruding portion may be, for example, a screw member, or may be used as a fixing member of a thermistor that measures the temperature of the heat sink by being screwed into a screw hole provided in the heat sink.

[Second Embodiment]
Next, a camera according to a second embodiment of the present invention will be described with reference to FIGS.
FIG. 6 is an enlarged view showing the component relationship around the Peltier element, and FIG. 7 is an enlarged view showing the component relationship around the Peltier element from above in FIG.
Hereinafter, regarding the camera of the present embodiment, the same points as those of the camera 1 of the first embodiment are denoted by the same reference numerals, description thereof will be omitted, and different points will be mainly described.

As shown in FIGS. 6 and 7, the differences from the first embodiment are the shape of the protrusion and the portion in which the protrusion and the heat sink are integrally formed.
The protruding portion (positioning portion) 451 has a gentle continuous planar slope (positioning surface) 451a that expands from the distal end portion (vertex) toward the proximal end portion (bottom surface). The inclined surface 451a faces the side surface 302s of the Peltier element 302.
The projecting portion 451 has a ring shape surrounding the entire side surface 302 s of the Peltier element 302, and is integrally formed on the upper surface 353 b of the heat sink (first contact member) 353.

Since the assembly operation of the camera having the above configuration and the operation of the microscope are the same as those in the above-described embodiment, the description thereof is omitted here.
As described above, according to this embodiment, the same effect as that of the first embodiment can be obtained.

Next, a modification of the second embodiment will be described with reference to FIG.
FIG. 8 is an enlarged view showing the component relationship around the Peltier element.
In the following, with respect to the modified example of the second embodiment, the same points as those of the camera of the second embodiment are denoted by the same reference numerals, description thereof is omitted, and different points are mainly described.

As shown in FIG. 8, the difference from the second embodiment is the shape of the protrusion.
The protrusion (positioning portion) 471 has a gently continuous curved slope (positioning surface) 471a that expands from the distal end (vertex) to the base end (bottom surface). The inclined surface 471a faces the side surface 302s of the Peltier element 302.

The projecting portion 471 has a ring shape surrounding the entire side surface 302 s of the Peltier element 302 and is integrally formed on the upper surface of the heat sink 373.
As described above, according to the modification of the second embodiment, the same effect as that of the second embodiment can be obtained.

[Third embodiment]
Next, a camera 3 according to a third embodiment of the present invention will be described with reference to FIGS.
FIG. 9 is a diagram showing the internal configuration of the camera 3 in the present embodiment, and FIG. 10 is an enlarged view (part B) of FIG. 9 showing the component relationship around the Peltier element.
Hereinafter, with respect to the camera 3 of the present embodiment, the same points as those of the camera 1 of the first embodiment are denoted by the same reference numerals, description thereof is omitted, and different points are mainly described.

As shown in FIGS. 9 and 10, the difference from the first embodiment is the position of the leaf spring and the position of the protrusion.
That is, the leaf spring 601 is provided between the upper surface 303 b of the heat sink 303 and the heat absorbing surface 302 c of the Peltier element 302.
In addition, a plurality (four in this embodiment) of protrusions (positioning portions) 501 are opposed to the inner surface of the upper part 307a constituting the sealed container (second contact member) 307 and to the side surface 302s of the Peltier element 302. It is provided to do.

  These protrusions 501 have a slope 501a (conical surface) as a smooth continuous positioning surface whose diameter increases from the tip (apex) toward the base (bottom). The inclined surface 501 a faces the side surface 302 s of the Peltier element 302.

  The protrusion 501 and the Peltier element 302 in the direction perpendicular to the thickness direction of the Peltier element 302 (the left-right direction in FIG. 10), that is, the distance between the base end of the protrusion 501 and the heat generating surface 302h of the Peltier element 302. The distance between the heat generation surface 302h of the Peltier element 302 and the endothermic surface 302c of the Peltier element 302, that is, in the direction perpendicular to the thickness direction of the Peltier element 302 (left and right direction in FIG. 10) is α2. When the distance between the protrusion 501 and the heat absorbing surface 302c of the Peltier element 302 is β2, the relationship α2 <β2 is established.

  Further, the height of the protrusion 501 is less than the distance in the thickness direction between the upper surface 303b of the heat sink 303 and the inner surface of the upper component 307a. Thereby, a space is provided between the tip of the protrusion 501 and the upper surface 303 b of the heat sink 303.

The assembly operation of the camera 3 having the above configuration will be described below.
First, in order to assemble the sealed container 307, as shown in FIG. 9, the heat sink 303 is fixed to the substrate 304 with a screw (not shown). Next, after applying thermal conductive grease to the image sensor 301 mounting side of the substrate 304, the image sensor 301 is soldered to the substrate 304 while being applied to the heat sink 303.

Then, after applying thermal conductive grease to the contact surface of the Peltier element 302 that is the inner surface of the upper part 307a, the upper part 307a shown in FIG. 9 is turned upside down, and the Peltier element 302 is surrounded by a plurality of protrusions 501. It is inserted into the space, placed on the inner surface of the upper part 307a, and comes into contact with the upper part 307a.
Then, the heat sink 303 in which the image pickup element 301 and the substrate 307 are integrated is brought into close contact with the Peltier element 302 via the leaf spring 601 and the heat conduction grease.

  Here, although the position of the Peltier element 302 may move due to the elasticity of the cable, the Peltier element 302 is positioned at a desired position on the upper surface 303b of the heat sink 303 by the inclined surface 501a of the projection 501 configured under the conditions described above.

After that, when the Peltier element 302 is covered with the upper part 307 a and the upper part 307 a and the substrate 304 are fixed, the Peltier element 302 is positioned at a desired position, so that the Peltier element 302 is placed on the tip surface of the protrusion 501. The airtight container 307 can be assembled without raising the Peltier element 302 without being raised.
Subsequent assembly work is omitted.

  Further, even when an external force is applied to the camera 3 when the assembled camera 3 is transported, the Peltier element 302 is in a direction perpendicular to the thickness direction of the Peltier element 302 (left and right direction in FIG. 10). Although there is a risk of movement, the inclined surface 501a of the protrusion 501 configured under the conditions described above is positioned at a desired position on the upper surface 303b of the heat sink 303 without detaching from the upper surface 303b of the heat sink 303.

Further, even if the Peltier element 302 comes into contact with the protrusion 501, only the heat generating surface 302 h of the Peltier element 302 comes into contact with the protrusion 501.
Therefore, the heat transfer path can be prevented from circulating from the heat sink 303 through the Peltier element 302 and the protrusion 501 and back to the heat sink 303, so that the image sensor 301 can be cooled well.

  As mentioned above, although each embodiment of the present invention has been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and includes design changes and the like without departing from the gist of the present invention. . For example, the present invention may be applied to an embodiment in which the above embodiments are appropriately combined.

1 Camera (microscope imaging device)
DESCRIPTION OF SYMBOLS 100 Microscope 201 Microscope main body 202 Stage 203 Objective lens 204 Eyepiece lens 205 Lens barrel 206 Sample (subject)
207 Imaging lens 208 Camera body (housing)
301 Image sensor 302 Peltier element (heat exchange element)
303 heat sink (first contact member)
304 Substrate 305 Drive substrate 306 Middle plate portion 307 Sealed container (second contact member)
308 Glass 309 Displacement member

Claims (6)

An image sensor for imaging a subject;
A heat exchange element for cooling the imaging element;
A contact member that contacts the heat exchange element;
A protrusion having a positioning surface provided on the contact member and facing a side surface other than the heat absorption surface and the heat generation surface of the heat exchange element;
With
Positioning surfaces of the protrusions, and from said distal end portion of the projecting portion toward the proximal end portion has a smooth continuous slope, the heat absorbing surface in contact with the abutment member or the heat generating surface The imaging device for a microscope in which the distance α is shorter than the distance β between the heat generating surface or the heat absorbing surface not in contact with the contact member.   The microscope imaging apparatus according to claim 1, wherein at least a part of the positioning surface is in contact with the heat absorbing surface or the heat generating surface that is in contact with the contact member.   The microscope imaging apparatus according to claim 1, further comprising a sealed container that hermetically accommodates the periphery of the imaging element. The contact member includes a first contact member that contacts the heat absorbing surface and a second contact member that contacts the heat generating surface;
4. The microscope imaging apparatus according to claim 1, wherein a height of the protrusion is shorter than a distance between the first contact member and the second contact member. 5.   The microscope imaging apparatus according to claim 4, wherein the first abutting member is a heat sink interposed between the imaging element and the heat exchange element. The positioning surface of the protrusion has a gap of the distance α with respect to the heat absorbing surface or the heat generating surface that is in contact with the contact member. The imaging apparatus for microscopes as described.

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