JP5879494B2 - Method for forming wiring circuit - Google Patents

Description

  The present invention relates to a wiring circuit forming method for forming a wiring circuit on a substrate having a recess formed on an upper surface.

  As a wiring board on which electronic components are mounted, a cavity substrate in which a cavity for accommodating electronic components such as a high-frequency device is formed on an upper surface is known. In the cavity substrate, a wiring circuit is formed to connect the upper surface of the substrate, which is the main circuit surface, and the bottom surface of the cavity to which the electronic component is connected. Since there is a step between the upper surface of the substrate and the bottom surface of the cavity in the cavity substrate, it is necessary to form a wiring circuit for the step surface. As a method for forming a wiring circuit on such a substrate, a method of drawing and applying a conductive paste is known (see Patent Document 1). In such drawing application, as a paste application method when the formation surface of the wiring circuit is a three-dimensionally inclined application target, the position of the discharge nozzle that discharges the paste relative to the application target surface is controlled conventionally. A technique for applying a paste to an inclined surface is used (see Patent Document 2).

JP 63-182063 A JP 2003-39000 A

  However, in the prior art shown in the above-mentioned patent document examples, since the precise position control of the discharge nozzle is required, there are the following problems with respect to equipment cost and productivity. That is, when controlling the position of the discharge nozzle, it is necessary to maintain the interval between the discharge port of the discharge nozzle and the application target surface at a specified interval and to maintain the direction of the discharge nozzle in the normal direction with respect to the application target surface. For this reason, a complicated control mechanism such as a multi-axis servo mechanism is required for the coating apparatus, and the equipment cost is increased, and it is necessary to create control software that requires labor every time the shape of the coating target is changed. Furthermore, since such complicated position control of the application nozzle is required, there is a limit to the speeding up of the work operation, and the tact time is delayed, preventing improvement in productivity.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a wiring circuit forming method capable of improving productivity by a simple coating mechanism in forming a wiring circuit by drawing coating for a substrate having a recess formed on the upper surface. And

  According to another aspect of the present invention, there is provided a wiring circuit for forming a wiring circuit for electrically connecting the upper surface and a bottom surface of the recess through a step surface between the upper surface and the bottom surface in a substrate having a recess formed on the upper surface. The wiring circuit forming step of forming the wiring circuit by adhering a conductive viscous material discharged from the discharge nozzle to the circuit forming surface shows the upper end of the step surface on the upper surface. A first step of forming an upper surface circuit extending to the upper end of the step, and a second step of forming a step surface circuit extending from the upper end of the step to the lower end of the step indicating the lower end of the step surface. In this step, the discharge nozzle is moved in the horizontal direction by a predetermined distance corresponding to the length dimension of the step surface circuit from the upper end of the step to the recess while discharging the viscous body. Forming a filamentous body of the viscous body held by the upper end of the step and the suction nozzle in the air, and stopping discharging the viscous body from the discharge nozzle after the filamentous formation process. A filament cutting process for cutting the joint between the filament and the discharge nozzle, and the filament cut from the joint with the discharge nozzle is suspended around the upper end of the step and attached to the step surface. Including a filamentous hanging process.

  According to the present invention, in the formation of a wiring circuit that connects the upper surface and the bottom surface of the recess through the step surface in the substrate, when forming the step surface circuit from the upper end of the step to the lower end of the step, To form a viscous filamentous material that has both ends held by the upper end of the step and the suction nozzle in the air, and then stops discharging the viscous material from the ejection nozzle. For a substrate with a recess formed on the upper surface by cutting the connecting portion with the discharge nozzle, and dropping the thread-like body cut with the connecting portion with the discharge nozzle around the upper end of the step and attaching it to the step surface. Productivity can be improved by a simple coating mechanism in forming a wiring circuit by drawing coating.

The perspective view of the drawing coating device used for the formation method of the wiring circuit of one embodiment of this invention Structure explanatory drawing of the board | substrate used as the object of the formation method of the wiring circuit of one embodiment of this invention Description of shape of wiring pattern by method of forming wiring circuit of one embodiment of the present invention Process explanatory drawing of the formation method of the wiring circuit of one embodiment of the present invention Process explanatory drawing of the formation method of the wiring circuit of one embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, with reference to FIG. 1, the structure of the drawing coating apparatus 1 used for the wiring circuit forming method shown in the present embodiment will be described. The drawing coating apparatus 1 has a function of drawing and applying a conductive viscous material such as silver paste on a substrate 3 to be a wiring circuit formation target.

  As shown in FIG. 1, the drawing coating apparatus 1 includes a substrate transfer mechanism 2 that transfers a substrate 3 on which a wiring circuit is formed in the X direction (substrate transfer direction) and positions the substrate 3 at a drawing work position. Above the substrate transport mechanism 2, an orthogonal drive mechanism including a Y-axis table 4 and an X-axis table 5 is disposed. The X-axis table 5 includes a first motor MA and a second motor MB. A Z-axis table 6 is mounted. The Z-axis table 6 is provided with a work head 7 having a first coating head 8A and a second coating head 8B in a vertical posture, and is disposed below the first coating head 8A and the second coating head 8B. Are equipped with a first discharge nozzle 9A and a second discharge nozzle 9B, respectively.

  By driving the Y-axis table 4 and the X-axis table 5, the work head 7 moves horizontally in the XY direction above the substrate transport mechanism 2. In the Z-axis table 6, by driving the first motor MA and the second motor MB individually, the first application head 8A and the second application head 8B are provided with the first discharge nozzle 9A and the second discharge head 9B. It goes up and down individually with the discharge nozzle 9B.

  Each of the first application head 8A and the second application head 8B includes a syringe for storing a viscous body and an ejection mechanism for ejecting the viscous body, and the first ejection nozzle 9A and the second ejection nozzle 9B are provided as substrates. By driving the discharge mechanism in a state where it is lowered with respect to 3, the viscous material is applied to the application surface of the substrate 3 from the first discharge nozzle 9A and the second discharge nozzle 9B. At this time, a predetermined drawing coating pattern is formed on the substrate 3 by discharging the viscous material while moving the work head 7 along a predetermined locus.

  Next, the substrate 3 on which the wiring circuit is formed will be described with reference to FIG. As shown in FIG. 2A, a plurality of recesses 10 for accommodating electronic components such as a high-frequency device are formed in a lattice shape on the upper surface 3a of the substrate 3. As shown in FIG. 2B, the recess 10 has a planar bottom surface 11, and the upper surface 3 a and the bottom surface 11 of the substrate 3 are connected by a step surface 12. The step surface 12 and the upper surface 3a are separated through a step upper end portion 12a, and the step surface 12 and the bottom surface 11 are separated through a step lower end portion 12b.

  FIG. 3 shows an example in which a wiring circuit 13 that connects the upper surface 3 a and the bottom surface 11 of the substrate 3 is formed for the concave portion 10 of the substrate 3. As shown in FIG. 3A, wiring circuits 13 are formed at both ends in the X direction in the respective concave portions 10 by drawing application for applying the viscous material P along a predetermined path set in the X direction. The That is, as shown in FIG. 3 (b), on the upper surface 3a, the upper surface circuit 13a extending from the application starting point 3s to the step upper end 12a, and the step surface 12, the step surface extending from the step upper end 12a to the step lower end 12b. On the bottom surface 11, the circuit 13b and the bottom surface circuit 13c from the step lower end 12b to the application end point 11e are formed by the viscous material P.

  Next, a method for forming a wiring circuit will be described with reference to FIGS. In this wiring circuit forming method, as shown in FIG. 3, in the substrate 3 having the recess 10 formed on the upper surface 3 a, the wiring circuit 13 that conducts the upper surface 3 a and the bottom surface 11 of the recess 10 via the step surface 12. Form. That is, the wiring circuit forming process for forming the wiring circuit 13 is started by attaching the conductive viscous material P discharged from the first discharge nozzle 9A (or the second discharge nozzle 9B) to the circuit forming surface. Is done.

  First, as shown in FIG. 4A, the first discharge nozzle 9A is moved to the application starting point 3s set on the upper surface 3a on the right side of the recess 10 to start the discharge of the viscous material P. The first discharge nozzle 9A is moved horizontally toward the arrow (arrow a). When the first discharge nozzle 9A reaches the step upper end portion 12a, as shown in FIG. 4B, an upper surface circuit 13a extending to the step upper end portion 12a indicating the upper end of the step surface 12 is formed on the upper surface 3a. (First step). Thereafter, a step surface circuit 13b extending from the step upper end portion 12a to the step lower end portion 12b indicating the lower end of the step surface 12 is formed (second step).

  Details of the second step will be described. Here, as shown in FIG. 4B, the step surface circuit 13b formed on the step surface 12 in the direction from the step upper end portion 12a to the recess 10 while discharging the viscous body P from the first discharge nozzle 9A. It is moved in the horizontal direction by a predetermined distance corresponding to the length dimension 12L (arrow b). Thus, viscous thread-like bodies P * whose both ends are respectively held by the step upper end 12a and the first discharge nozzle 9A are formed in the air (thread-like body forming step).

  Next, the discharge of the viscous body P from the first discharge nozzle 9A is stopped after the filamentous body forming step. As a result, the joint between the filament P * and the first discharge nozzle 9A is cut (filament cutting step), and the joint with the first discharge nozzle 9A is cut as shown in FIG. 4C. The formed filamentous body P * is suspended around the step upper end portion 12a (arrow c) and attached to the stepped surface 12 (filamentous body suspension step). As a result, as shown in FIG. 4D, a step surface circuit 13b is formed on the step surface 12 from the step upper end portion 12a to the step lower end portion 12b.

  Thereafter, as shown in FIG. 5 (a), the first discharge nozzle 9A is moved onto the upper surface 3a on the right side of the recess 10 and shown in FIGS. 4 (a) to 4 (d) (first step) and (Second step) is executed to similarly form the upper surface circuit 13a and the step surface circuit 13b. Next, the bottom circuit 13c is formed. That is, as shown in FIG. 5 (b), the first discharge nozzle 9A is moved onto the lower step lower end 12b on the left side of the recess 10, and the first discharge nozzle 9A is moved to the coating end point 11e while discharging the viscous material P. After moving (arrow e), the discharge of the viscous body P is stopped.

  As a result, a bottom surface circuit 13c is formed on the bottom surface 11 from the step lower end portion 12b to the coating end point 11e (third step). Then, the first discharge nozzle 9A is similarly moved (arrow f) from above the right step lower end portion 12b, and (third step) is executed to form the right bottom circuit 13c. As described above, as shown in FIG. 5D, the wiring circuit 13 that connects the upper surface 3a and the bottom surface 11 via the step surface 12 is formed.

  As described above, in the present embodiment, in the formation of the wiring circuit 13 that electrically connects the upper surface 3a and the bottom surface 11 of the recess 10 via the step surface 12 in the substrate 3, from the step upper end portion 12a to the step lower end portion 12b. When forming the stepped surface circuit 13b, the first discharge nozzle 9A is moved in the horizontal direction while discharging the viscous material P, and both ends of the viscous material respectively held by the step upper end portion 12a and the first discharge nozzle 9A. The filamentous body P * is formed in the air, and then the discharge of the viscous body P from the first ejection nozzle 9A is stopped to cut the coupling portion between the filamentous body P * and the first ejection nozzle 9A. The filamentous body P * is suspended around the upper end portion 12a of the step so as to adhere to the step surface 12.

  Thereby, in the formation of the wiring circuit 13 by drawing coating for the substrate 3 having the recess 10 formed on the upper surface 3a, drawing coating by a simple coating mechanism is possible without requiring complicated nozzle position control. Productivity can be improved. In the above-described embodiment, an example in which the wiring direction of the wiring circuit 13 is limited to only one direction (X direction) has been shown for the sake of simplification. However, when the wiring circuit is wired in two directions within the XY plane. The present invention can also be applied to.

  The method for forming a wiring circuit of the present invention has the effect that productivity can be improved by a simple coating mechanism in the formation of a wiring circuit by drawing coating for a substrate having a recess formed on the upper surface, This is useful for applications in which a wiring circuit is formed in which a top surface and a bottom surface of a recess are made conductive through a step surface on a substrate.

DESCRIPTION OF SYMBOLS 1 Drawing coating device 3 Substrate 3a Upper surface 7 Working head 8A 1st coating head 8B 2nd coating head 9A 1st discharge nozzle 9B 2nd discharge nozzle 10 Recess 11 Bottom surface 12 Step surface 12a Step top part 12b Step bottom part 13a Top surface circuit 13b Stepped surface circuit 13c Bottom surface circuit P Viscous material P * Filamentous material

Claims (1)

A wiring circuit forming method for forming a wiring circuit for electrically connecting the upper surface and the bottom surface of the recess through a step surface between the upper surface and the bottom surface in a substrate having a recess formed on an upper surface,
A wiring circuit forming step of forming the wiring circuit by attaching a conductive viscous material discharged from the discharge nozzle to the circuit forming surface,
A first step of forming an upper surface circuit extending from the upper end of the step surface to the upper end of the step indicating the upper end of the step surface; and a first step of forming a step surface circuit extending from the upper end of the step to the lower end of the step indicating the lower end of the step surface. 2 processes,
In the second step, the discharge nozzle is moved in the horizontal direction by a predetermined distance corresponding to the length dimension of the step surface circuit from the upper end of the step to the recess while discharging the viscous body. A filamentous body forming step for forming the filamentous body of the viscous body in the air, both ends of which are respectively held by the upper end of the step and the discharge nozzle;
A filamentous cutting process for stopping the discharge of the viscous body from the discharge nozzle after the filamentous forming step and cutting the coupling portion between the filamentous and the discharge nozzle;
A method of forming a wiring circuit, comprising: a thread-like body hanging step in which the thread-like body having a cut portion connected to the discharge nozzle is suspended around the upper end portion of the step and adhered to the step surface.

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