JP5873312B2 - ANTENNA SHEET AND NONCONTACT TYPE DATA RECEIVING / TRANSMITTER WITH THE SAME - Google Patents

Description

 The present invention relates to a non-contact type data receiver / receiver that can receive information from the outside using electromagnetic waves or radio waves as a medium, and can transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification). The present invention relates to an antenna sheet in which an antenna made of a conductive material is formed on a base substrate and a non-contact type data receiving / transmitting body including the antenna sheet.

An IC tag, which is an example of a non-contact type data receiving / transmitting body, includes a base material, and an antenna and an IC chip that are provided on one surface and connected to each other.
An example of such an IC tag antenna is a dipole antenna.
As the dipole antenna, for example, those described in Patent Documents 1 to 3 are known.

 To manufacture an IC tag, an antenna sheet on which an antenna made of a conductive material is formed is manufactured on a base substrate, an IC chip is mounted on the antenna, and a coating for protecting the antenna and the IC chip is applied. After that, it is cut into a predetermined shape.

Design Registration No. 1271227 Design Registration No. 12771617 Design Registration No. 1311085

 In order to mount an IC chip on an antenna disclosed in Patent Documents 1 to 3, etc., after placing the IC chip on the terminal portion of the antenna via a conductive adhesive, the conductive adhesive is heated and melted. Then, the terminal portion of the antenna and the IC chip are joined. In such an IC chip mounting method, heat is not sufficiently transmitted to the conductive adhesive, and the conductive adhesive may not be sufficiently melted. In that case, since the IC chip is not firmly fixed to the terminal portion of the antenna, there is a problem that a connection failure between the antenna terminal portion and the IC chip occurs.

 The present invention has been made in view of the above circumstances, and in mounting an IC chip using a conductive adhesive, heat is not concentrated only on one point of the conductive adhesive, and the surface is sufficient. An object of the present invention is to provide an antenna sheet to which heat can be applied and a non-contact type data receiving / transmitting body including the antenna sheet.

 The antenna sheet of the present invention is an antenna sheet comprising: a base substrate made of an insulating material; and an antenna made of a conductive material formed on one surface of the base substrate. Comprises a pair of radiating elements facing each other and provided with terminal portions each having a feeding point on the opposite side, on one surface of the base substrate, in the vicinity of the terminal portions, A high heat conductive film is provided along a direction in which the terminal portion extends, and the high heat conductive film is provided so as to surround the power supply point while being separated from the power supply point.

 The non-contact type data receiving / transmitting body of the present invention is characterized by including the antenna sheet of the present invention.

 According to the antenna sheet of the present invention, in mounting an IC chip using a conductive adhesive, heat for melting the conductive adhesive can be applied as a surface to the feeding point and its vicinity. In the conductive adhesive, excessive heat does not concentrate on one point, and necessary heat can be sufficiently applied efficiently in terms of surface.

It is a schematic plan view which shows 1st embodiment of the antenna sheet | seat of this invention. It is a schematic plan view which shows 1st embodiment of the antenna sheet | seat of this invention, and is a figure which shows the area | region enclosed with the broken line (alpha) of FIG. It is a schematic plan view which shows 2nd embodiment of the antenna sheet | seat of this invention.

An embodiment of the antenna sheet of the present invention will be described.
Note that this embodiment is specifically described in order to better understand the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment FIG. 1 is a schematic plan view showing a first embodiment of the antenna sheet of the present invention. FIG. 2 is a schematic plan view showing the first embodiment of the antenna sheet of the present invention, and is a diagram showing a region surrounded by a broken line α in FIG. 1.
The antenna sheet 10 of the present embodiment is schematically configured from a base substrate 11 and an antenna 12 formed on one surface 11a of the base substrate 11.
As the antenna sheet 10, for example, as shown in FIG. 1, a plurality of antennas 12 are formed on one surface 11 a of a long base substrate 11 and arranged in rows at intervals. Used. When such an antenna sheet 10 is used, after an IC chip is mounted, it is cut into a predetermined shape and separated into individual pieces.

 The antenna 12 is opposed to each other, and a pair of radiating elements 17 and 18 provided with linear terminal portions 15 and 16 having feeding points 13 and 14 on opposite sides, respectively, and the vicinity of the feeding point 13 of the radiating element 17. And a short-circuit portion 19 that short-circuits the vicinity of the feeding point 14 of the radiating element 18. That is, the antenna 12 is a dipole antenna having a pair of radiating elements 17 and 18.

Further, on one surface 11 a of the base substrate 11, a high thermal conductive film 20 is provided in the vicinity of the terminal portions 15 and 16 along the direction in which the terminal portions 15 and 16 extend.
Further, the high thermal conductive film 20 is provided apart from the feeding points 13 and 14 so as to surround the feeding points 13 and 14 from the side and to face each other via the feeding points 13 and 14. It consists of a pair of high thermal conductive films 20A and 20B.

 The high thermal conductive films 20A and 20B are substantially L-shaped with concave corners on the feeding points 13 and 14 side. And the high heat conductive film 20 comprised from the high heat conductive films 20A and 20B has comprised the substantially U shape which the feeding points 13 and 14 side opened.

 Further, on one surface 11 a of the base substrate 11, a mark 21 for locating the IC chip mounted on the feeding points 13 and 14 is located in a region surrounded by the terminal portions 15 and 16 and the short-circuit portion 19. Is provided. This mark 21 is provided separately from the high thermal conductive film 20. Thus, by providing the mark 21 apart from the high thermal conductive film 20, the IC chip positioning with reference to the mark 21 is reliably performed without hindering the positioning of the IC chip by the high thermal conductive film 20. be able to.

Although the space | interval of the high heat conductive film 20 and the terminal parts 15 and 16 is not specifically limited, For example, it shall be about 0.1-1 mm.
Moreover, although the space | interval of the high heat conductive film | membrane 20 and the feeding points 13 and 14 is not specifically limited, For example, it shall be about 0.1-1 mm.
Furthermore, although the space | interval of the high heat conductive film 20A and the high heat conductive film 20B is not specifically limited, For example, it shall be about 1-3 mm.

A thin film 22 is provided on one surface 11a of the base substrate 11 as a base for mounting an IC chip. Thus, the IC chip is mounted substantially horizontally on the one surface 11a of the base substrate 11 without being inclined.
In addition, the thin film 22 serving as a base is provided separately from the high thermal conductive film 20, so that heat applied to the high thermal conductive film 20 is not directly transmitted to the thin film 22.

 As the base substrate 11, a substrate made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), Base material made of polyolefin resin such as polypropylene (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; From polyamide resin such as nylon 6, nylon 6,6 Base material made of polyvinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polya Substrates made of acrylic resin such as butyl acrylate; base materials made of polystyrene; substrates made of polycarbonate (PC); substrates made of polyarylate; substrates made of polyimide; fine paper, thin paper, glassine paper, sulfuric acid A substrate made of paper such as paper is used.

 The antenna 12 is formed on one surface 11a of the base substrate 11 using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or etching the conductive foil. It is made by metal plating.

Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.
As the polymer type conductive ink, known ones such as a thermosetting type, a photosetting type, a penetration drying type, and a solvent volatile type are used.

Examples of the conductive foil forming the antenna 12 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 12 include copper plating, silver plating, gold plating, and platinum plating.

 Is the high thermal conductive film 20 formed on one surface 11a of the base substrate 11 by a printing method such as screen printing or ink jet printing on a predetermined pattern using a polymer type conductive ink, like the antenna 12? Alternatively, it is formed by etching a conductive foil or metal plating.

 Like the antenna 12, the mark 21 is formed on one surface 11a of the base substrate 11 in a predetermined pattern using a polymer-type conductive ink by a printing method such as screen printing or ink jet printing, or One obtained by etching a conductive foil or one obtained by metal plating.

 The antenna 12, the high thermal conductive film 20, and the mark 21 are preferably formed of the same material. In this way, the antenna 12, the high thermal conductive film 20, and the mark 21 can be formed in the same process by the above-described method, so that the manufacturing process can be simplified.

 The high thermal conductive film 20 is a film having a higher thermal conductivity than the base substrate 11. Specifically, the base substrate 11 is made of the material as described above, and the high thermal conductive film 20 is made of the material as described above.

In order to mount an IC chip on such an antenna sheet 10, an IC chip is disposed on the feeding points 13 and 14 of the terminal portions 15 and 16 of the antenna 12 via a conductive adhesive, and then conductive bonding is performed. The agent is heated and melted to join the feeding points 13 and 14 of the antenna 12 and the IC chip.
Examples of the conductive adhesive include ACP (Anisotropic Conductive Paste) and NCP (Non Conductive Resin Paste).

 Here, in order to heat and melt the conductive adhesive, heat is applied to the IC chip and its vicinity. The temperature at which the conductive adhesive is heated and melted is 130 to 200 ° C. At this time, the heat applied to the IC chip and the vicinity thereof, that is, the feeding points 13 and 14 of the antenna 12 and the vicinity thereof does not diffuse to the entire base substrate 11 and has a thermal conductivity higher than that of the base substrate 11. It is transmitted to the high heat conductive film 20. As a result, since the high thermal conductive film 20 is provided so as to surround the feeding points 13 and 14, heat can be concentrated at the feeding points 13 and 14 and the vicinity thereof. Excessive heat is not concentrated, and necessary heat can be sufficiently applied efficiently in terms of area. Therefore, the IC chip can be firmly fixed to the feeding points 13 and 14 of the antenna 12 by the conductive adhesive.

 By mounting an IC chip on the antenna sheet 10 using a conductive adhesive, a non-contact type data receiving / transmitting body is obtained. Further, the non-contact type data receiving / transmitting body is provided with a coating for protecting the antenna and the IC chip as necessary.

(2) Second Embodiment FIG. 3 is a schematic plan view showing a second embodiment of the antenna sheet of the present invention.
The antenna sheet 30 of the present embodiment is schematically configured from a base substrate 31 and an antenna 32 formed on one surface 31 a of the base substrate 31.

 The antenna 32 is opposed to each other, and a pair of radiating elements 37 and 38 provided with linear terminal portions 35 and 36 having feeding points 33 and 34 on opposite sides thereof, and the vicinity of the feeding point 33 of the radiating element 37. , And a short-circuit portion 39 that short-circuits the vicinity of the feeding point 34 of the radiating element 38. That is, the antenna 32 is a dipole antenna having a pair of radiating elements 37 and 38.

In addition, on one surface 31a of the base substrate 31, in the vicinity of the terminal portions 35 and 36, the terminal portions 35 and 36 are opposed to each other via the terminal portions 35 and 36 along the extending direction. A high thermal conductive film 40 is provided.
Further, the high thermal conductive film 40 is provided so as to be separated from the feeding points 33 and 34 so as to surround the feeding points 33 and 34 from the side and to face each other via the feeding points 33 and 34. It is comprised from a pair of high heat conductive film | membrane 40A, 40B.

 Further, on one surface 31 a of the base substrate 31, a mark 41 for locating the IC chip mounted on the feeding points 33 and 34 is located in a region surrounded by the terminal portions 35 and 36 and the short-circuit portion 39. Is provided. The mark 41 is provided apart from the high thermal conductive film 40.

 The high thermal conductive films 40A and 40B are substantially L-shaped with concave corners on the mark 41 side. And the high heat conductive film 40 comprised from the high heat conductive film 40A, 40B has comprised the substantially U shape which the mark 41 side opened.

Although the space | interval of the high heat conductive film 40 and the terminal parts 35 and 36 is not specifically limited, For example, it shall be about 0.1-1 mm.
Moreover, although the space | interval of the high heat conductive film 40 and the feed points 33 and 34 is not specifically limited, For example, it shall be about 0.1-1 mm.
Furthermore, although the space | interval of the high heat conductive film 40A and the high heat conductive film 40B is not specifically limited, For example, it shall be about 1-3 mm.

In addition, a thin film 42 is provided on one surface 31a of the base substrate 31 as a base for mounting an IC chip. Thereby, the IC chip is mounted substantially horizontally on the one surface 41a of the base substrate 41 without being inclined.
In addition, the thin film 42 serving as a base is provided separately from the high thermal conductive film 40, so that heat applied to the high thermal conductive film 40 is not directly transmitted to the thin film 42.

 Also with the antenna sheet 30, the same effect as the antenna sheet 10 of the first embodiment described above can be obtained.

 By mounting an IC chip on the antenna sheet 30 using a conductive adhesive, a non-contact type data receiving / transmitting body is obtained. Further, the non-contact type data receiving / transmitting body is provided with a coating for protecting the antenna and the IC chip as necessary.

In the present invention, the shape of the antenna is not limited to the first embodiment and the second embodiment described above. In the present invention, any shape may be used as long as the antenna is a dipole antenna.
In the present invention, the shape and arrangement of the high thermal conductive film and the mark are not limited to the above-described first embodiment and second embodiment. In the present invention, the high thermal conductive film is composed of one U-shaped high thermal conductive film formed so as to surround the power feeding point apart from the feeding point, and at a predetermined position of the high thermal conductive film, An opening corresponding to the above mark (a portion where the high thermal conductive film is not provided) may be provided.

10, 30 ... Antenna sheet, 11, 31 ... Base substrate, 12, 32 ... Antenna, 13, 14, 33, 34 ... Feed point, 15, 16, 35, 36 ... Terminal part, 17, 18, 37, 38 ... Radiation element, 19, 39 ... Short circuit part, 20, 40 ... High heat conduction film, 20A, 20B, 40A, 40B ... High heat conduction film, 21 , 41 ... mark.

Claims (2)

An antenna sheet comprising: a base substrate made of an insulating material; and an antenna formed on one surface of the base substrate and made of a conductive material,
The antenna has a pair of radiating elements that are opposed to each other and provided with terminal portions each having a feeding point on the opposite side,
On one surface of the base substrate, a high thermal conductive film is provided in the vicinity of the terminal portion along the direction in which the terminal portion extends,
The antenna sheet according to claim 1, wherein the high thermal conductive film is provided so as to surround the feeding point while being separated from the feeding point. A non-contact type data receiving / transmitting body comprising the antenna sheet according to claim 1.

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