JP5866881B2 - Infrared temperature sensor - Google Patents

Description

  The present invention relates to an infrared temperature sensor for non-contact measurement of a temperature of a heat source.

Patent Document 1 discloses a temperature sensor that measures the temperature of a heat source in a non-contact manner by detecting the amount of infrared radiation radiated from the heat source. This temperature sensor has a temperature compensation thermal element and an infrared detection thermal element. The infrared detection thermal element includes an infrared absorption film that efficiently absorbs infrared rays from a heat source, and absorbs infrared rays caused by infrared reception. The temperature rise of the film is detected by a thermal element. The cavity on the infrared detecting thermal element side has an opening and infrared rays are incident thereon, whereas the cavity on the temperature compensating thermal element side has no opening and no infrared rays are directly incident thereon.

The infrared sensitive thermal element is composed of a thermal element or the like. The temperature sensing element has a temperature characteristic in which the electrical characteristics change according to the temperature, and an electric signal output from the temperature sensing element is taken out by the copper foil pattern formed on the infrared absorption film. Thus, the temperature of the heat source can be estimated. As such a temperature sensitive element, a thermistor, a thermopile, a metal temperature measuring element, etc. having resistance temperature characteristics are known. Further, as an infrared absorbing film, a polymer film such as polyimide having a characteristic of absorbing a far-infrared wavelength band is known.

  In order to extract the signal from the infrared detecting thermal element to the outside of the infrared absorbing film, a lead pattern made of copper foil is required to transmit the electrical signal. This is because the heat from the infrared detecting thermal element to the outside is required. It will also be a spill route. When heat flows out from the infrared detection thermal element, the temperature of the infrared detection thermal element decreases, and the sensitivity of the sensor decreases.

As a countermeasure against this, as can be seen in Patent Document 2, it has been generally performed to provide a fold-shaped refracting portion in a part of the lead pattern. By increasing the thermal resistance with the zigzag refracting portion, the outflow of heat from the infrared detecting heat sensitive element to the outside of the infrared absorbing film is reduced, and the temperature of the infrared detecting heat sensitive element is prevented from decreasing, thereby maintaining the sensitivity of the sensor. It is said. In this way, the zigzag refracting portion is merely the principle of preventing the outflow of heat from the infrared detecting heat sensitive element, and is not an aggressive one that raises the sensitivity by further raising the temperature of the entire infrared absorbing film. .

Further, the shape of the zigzag refracting portion has a limitation in width and length due to responsiveness to temperature changes. Therefore, a longer length is better to prevent temperature drop, but unnecessarily long is not preferable in terms of responsiveness. Increasing the width of the lead pattern decreases the thermal resistance, but the heat capacity of the lead pattern itself increases, which may cause a deterioration in responsiveness.

  A pattern such as a zigzag refracting portion, a zigzag pattern, or a meandering pattern, which is used in the above lead pattern for transmitting an electric signal, is referred to as a meander pattern herein.

JP 2003-194630 A Utility Model Registration Gazette No. 2506241

As described above, the lead pattern for transmitting the electrical signal of the thermal element for detecting infrared rays, only the conventional lead pattern including the meander pattern, the temperature characteristic in which the electrical characteristic changes according to the temperature. That is, there was a limitation in sensitivity adjustment. However, if there is a means for raising the temperature of the infrared absorption film itself, the sensitivity of the infrared temperature sensor can be improved independently of the meander pattern restriction.
The present invention has been made in consideration of the above points, and provides an infrared temperature sensor intended to improve sensitivity by further increasing the temperature of the infrared absorption film than before.

In order to solve the above-described problems, an infrared temperature sensor according to the present invention includes an infrared absorption film that generates heat by absorbing infrared rays radiated from a heat source, and detects the amount of heat of the infrared absorption film to adjust the temperature of the heat source. Infrared detecting thermosensitive element for outputting a corresponding electric signal, a lead pattern for guiding the electric signal from the infrared detecting thermosensitive element to the outside, and at least one for reflecting or absorbing infrared light transmitted through the infrared absorbing film The lead pattern and the heat effect pattern are made of copper foil and are formed on the infrared absorption film.

The present invention further increases the temperature of the infrared absorbing film. Conventionally, the temperature of the infrared detecting thermal element is prevented from being lowered by the thermal resistance due to the zigzag meander pattern, but the present invention further increases the temperature of the infrared absorbing film itself, thereby increasing the temperature of the infrared detecting thermal element. The sensitivity of the infrared temperature sensor is improved.
In addition, in the conventional non-contact temperature sensor, as shown in Patent Document 1, a sensor module has a temperature-compensating thermal element for detecting the ambient temperature, and as shown in Patent Document 2, the sensor module However, since the present invention raises the temperature of the infrared absorption film itself, any method is effective in improving the sensitivity.

The lead pattern for transmitting an electrical signal of the present invention is provided with a meander pattern, and by increasing the thermal resistance, the outflow of heat from the infrared detection thermal element to the outside of the infrared absorption film is reduced, and the infrared detection thermal element Prevents temperature drop.

The thermal effect pattern is dispersed throughout the infrared absorption film, and is distributed in islands in the infrared absorption film.

The lead pattern transmits an electrical signal and has a meander pattern to increase the thermal resistance, thereby reducing the outflow of heat from the infrared detection thermal element to the outside of the infrared absorption film and preventing the temperature of the infrared detection thermal element from decreasing. .

The thermal effect pattern is for reflecting or absorbing the infrared light transmitted through the infrared absorption film, and is not related to transmission of an electric signal, that is, a pattern not transmitting an electric signal. Therefore, the thermal effect pattern may be connected to the lead pattern as long as an electrical signal is not transmitted. Further, the thermal effect patterns may be separated from each other or may be connected to each other. In addition to the thermal effect pattern,

In addition to the lead pattern and the heat effect pattern, a heat collecting pattern may be further provided. The heat collection pattern is formed radially on the infrared absorption film starting from the infrared detection thermal element, and collects the amount of heat distributed in the infrared absorption film at a short distance to the infrared detection thermal element. The responsiveness of the infrared sensor with respect to a change in the amount of infrared rays can be increased.

As described above, since the temperature of the infrared absorption film can be increased by the thermal effect pattern, the sensitivity of the infrared temperature sensor can be improved. If a heat collection pattern is added, the temperature rise of the infrared absorption film can be quickly transmitted to the infrared detection thermal element, and if a meander pattern is added to the lead pattern, the outflow of heat from the infrared detection element can be suppressed. Infrared temperature sensor with excellent sensitivity and responsiveness can be realized. In this way, the thermal effect pattern exhibits the effect of increasing the sensitivity by combining with the meander pattern. However, when combined with the heat collection pattern, the responsiveness is improved and a comprehensively excellent infrared temperature sensor can be realized. .

The present invention further increases the temperature of the infrared ray absorbing film itself by the thermal effect pattern for reflecting or absorbing the infrared ray that has passed through the infrared ray absorbing film, thereby increasing the temperature of the infrared detecting thermal element. The sensitivity can be improved.

3 is a top view of the infrared temperature sensor according to Embodiment 1. FIG. It is sectional drawing of the infrared rays absorption film and copper foil pattern in Embodiment 1. It is an expanded sectional view of the infrared rays absorption film and copper foil pattern in Embodiment 1. It is a graph which shows the wavelength characteristic of the permeation | transmission ratio of infrared rays. It is a top view of the infrared temperature sensor in Embodiment 2. It is a top view of the infrared temperature sensor in Embodiment 3. It is a top view of the infrared temperature sensor in Embodiment 4. It is a top view of the infrared temperature sensor in Embodiment 5. It is a top view of the infrared temperature sensor in Embodiment 6.

A preferred embodiment of the present invention will be described with reference to the drawings. In addition, this invention is not limited to the following embodiment. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the constituent elements described below can be appropriately combined. The same members are denoted by the same reference numerals, and redundant description is omitted. The drawings are schematic, and the ratio of dimensions between members, the shape of the members, and the like may be different from the actual sensor structure within a range where the effects of the present invention can be obtained.

(Embodiment 1)
FIG. 1 is a top view of an infrared temperature sensor 1 according to the first embodiment. The infrared temperature sensor 1 includes an infrared absorption film 100, and detects an amount of heat of the infrared absorption film 100 to output an electrical signal corresponding to the temperature of the heat source, and an infrared detection thermal element 10. Lead patterns 31 and 32 for transmitting and outputting electrical signals and a large number of thermal effect patterns 50 are provided.

The material of the infrared absorption film 100 may be any material that generates heat by absorbing radiant infrared rays from a heat source. For example, a material having an absorption spectrum for light in a wavelength band of 4 μm to 10 μm called far infrared rays is desirable. As such a material, a resin made of a polymer material such as fluorine, silicone, polyester, polyimide, polyethylene, polycarbonate, PPS (polyphenylene sulfide) is preferable.

The infrared detecting thermal element 10 is not particularly limited as long as it has a temperature-sensitive element whose electrical characteristics change according to temperature. For example, a thermistor, thermopile, metal thermometer having resistance temperature characteristics, and the like. Etc. are suitable. The infrared detecting thermal element 10 includes electrodes 11 and 12 connected to the lead patterns 31 and 32, respectively. The change in electrical characteristics corresponding to the temperature change of the infrared detecting thermal element 10 corresponds to the temperature of the heat source. It is transmitted from the lead patterns 31 and 32 as an electric signal and taken out to the outside.

The lead patterns 31 and 32 are made of copper foil and are meandered to reduce the amount of heat flowing out to the outside. That is, the lead patterns 31 and 32 have the meander pattern 33 shown in FIG. 1 to increase the thermal resistance. When the infrared detecting thermal element 10 is, for example, a thermistor having a resistance temperature characteristic, the temperature change of the infrared detecting thermal element 10 appears as a resistance value change. By causing a current to flow through the infrared detecting thermal element 10, a change in resistance value of the infrared detecting thermal element 10 is detected as a voltage change divided by a fixed resistor (not shown) connected in series outside. The output voltage of the infrared detecting thermal element 10 is signal-processed as an electrical signal corresponding to the temperature of the heat source. However, the meander pattern 33 is not always essential.

The heat effect pattern 50 is made of copper foil, and is formed on the surface of the infrared absorption film 100 opposite to the heat source. The surface of the heat effect pattern 50 that is in contact with the infrared absorption film 100 transmits the infrared absorption film 100 of infrared rays. By reflecting or absorbing the frequency component at a certain ratio and further increasing the temperature of the infrared absorbing film 100 itself, the temperature of the infrared detecting thermal element 10 is also increased, and the sensitivity of the infrared temperature sensor is improved.

The thermal effect pattern 50 is dispersed throughout the infrared absorption film 100 and distributed in islands in the infrared absorption film. The island pattern is not to transmit the electrical signal of the infrared detecting thermal element detected by a thermosensitive element such as a thermistor, but to absorb or reflect the infrared ray transmitted through the infrared absorbing film. The film is formed on the surface opposite to the heat source of the film, and is formed simultaneously by the same process as the lead pattern for transmitting an electric signal. It is not necessary to add a special process to the formation of the lead pattern made of copper foil on the infrared absorption film and the thermal effect patterns.

The thermal effect pattern 50 is for reflecting or absorbing infrared light transmitted through the infrared absorbing film 100, and is a pattern related only to heat conduction regardless of transmission of an electric signal. It is a pattern that does not involve, that is, does not transmit electrical signals. Therefore, the thermal effect pattern 50 may be connected to the lead patterns 31 and 32 as long as an electrical signal is not transmitted. Further, the thermal effect patterns 50 may be separated from each other or may be connected to each other.

2a and 2b are cross-sectional views of a copper foil pattern that is a material of the infrared absorption film 100 and the thermal effect pattern 50 of FIG. Incident infrared ray L1 passes through infrared absorbing film 100 at a certain rate. The transmission ratio is determined by the wavelength characteristics depending on the material of the infrared absorption film 100 as shown in FIG. The transmitted infrared rays are in contact with the infrared absorbing film 100 of the copper foil pattern that is the material of the thermal effect pattern 50, and a certain proportion is reflected as in the infrared ray L2 in FIG. 2a, and the rest is copper as in the infrared ray L3 in FIG. Absorbed by the foil pattern. This ratio depends on the state of the surface of the copper foil pattern in contact with the infrared absorption film 100. If the surface in contact, that is, the interface state is smooth, the infrared ray is reflected more frequently, and if the interface state is rough, it is absorbed by the copper foil pattern. The rate of being increased.

As shown in FIG. 2b, when the surface of the copper foil pattern, which is the material of the thermal effect pattern 50, in contact with the infrared absorption film 100 is viewed microscopically, the back surface of the copper foil pattern, that is, the surface in contact with the infrared absorption film 100, Innumerable minute protrusions that are distributed bite into the infrared absorption film and mesh with each other. This is called the anchor effect. Thus, since there are fine irregularities on the boundary surface, the copper foil pattern absorbs infrared rays at a certain rate. In particular, the infrared ray absorbing effect appears when the distance from the valley bottom of the concave and convex portions of the copper foil pattern to the peak of the mountain is 2 μm or more.

  The infrared frequency component absorbed on the surface of the copper foil pattern, which is the material of the thermal effect pattern 50, in contact with the infrared absorption film 100 causes the temperature of the copper foil pattern to rise. The temperature rise of the copper foil is transmitted to the infrared absorption film 100. Since the infrared component that has not been absorbed by the infrared absorbing film 100 is also absorbed by the copper foil pattern, the temperature of the copper foil rises. As a result, it contributes to the temperature rise of the infrared absorption film 100. In particular, when the copper foil has an anchor effect and one surface of the copper foil is closely meshed with the infrared absorption film, the temperature rise of the copper foil is efficiently transmitted to the infrared absorption film.

Further, since the frequency component reflected by the surface of the copper foil pattern that is the material of the thermal effect pattern 50 that is in contact with the infrared absorption film 100 passes through the infrared absorption film 100 again, it is absorbed again at a certain rate, and the infrared absorption film 100. Contributes to temperature rise. As described above, the temperature of the infrared absorption film 100 increases in the presence of the thermal effect pattern 50 in the presence of the thermal effect pattern 50. Therefore, the sensitivity of the infrared temperature sensor is increased.

This principle will be described in more detail.
If the surface reflectance of the film is r and the absorptance is a for a frequency component E (f) with infrared rays,
What is absorbed into the film
E (f) × a (Formula 1)
To reach the back of the copper foil through the film,
Since it is E (f) × (1-ar), if the absorptivity of the copper foil back surface is b,
E (f) * (1-ar) * b (Formula 2)
What is reflected by the copper foil
E (f) * (1-ar) * (1-b)
What is reflected and absorbed by the film again
E (f) * (1-ar) * (1-b) * a (Formula 3)
Therefore, the total absorbed by the film and copper foil is the sum of (Equation 1), (Equation 2), and (Equation 3).
E (f) * (a + (1-ar) * (a + b-a * b)) (Formula 4)
On the other hand, if there is no copper foil, absorption by the film is
E (f) × a (Formula 5)
Therefore, the increase in absorption by the copper foil is calculated by subtracting (Equation 5) from (Equation 4).
E (f) * (1-ar) * (a + b-a * b) (Formula 6)
Since (1-ar)> 0, a <1 and b <1, (a + b−a × b)> 0,
Therefore, (Equation 6)> 0
Therefore, the total absorption increases with the copper foil as compared to the case without the copper foil.

  Although the thermal effect pattern 50 is dispersed throughout the infrared absorption film 100, the total amount of infrared rays absorbed increases as the area occupied on the infrared absorption film increases. When the size of each thermal effect pattern 50 is large, the heat capacity increases. Further, since it takes time to generate and stabilize the heat flow in the thermal effect pattern 50, the responsiveness to a temperature change is lowered. Therefore, in Embodiment 1 of FIG. 1, the island-shaped heat effect pattern 50 is circular, is less than a certain size, and each is not connected. The diameter of the island-like circular heat effect pattern 50 is about 0.5 to 2.5 times the lead pattern width.

One heat effect pattern 50 absorbs only the heat of the area and the region adjacent thereto, and the heat capacity of one heat effect pattern 50 is limited. Therefore, the response is fast. A large number of such small heat effect patterns 50 are distributed throughout the infrared absorption film 100, that is, dispersed throughout. Even if the area occupied by the thermal effect pattern 50 is increased, they are finely divided and do not become a large heat capacity lump, so that there is little decrease in responsiveness.

Therefore, in Embodiment 1 of FIG. 1, the thermal effect patterns 50 are distributed as a large number of island-shaped thermal effect patterns 50. In the first embodiment, the thermal effect pattern 50 is circular and has a uniform size, but is not limited thereto, and may be polygonal or donut-shaped. Also, different shapes and sizes may be mixed.

  The effects of the first embodiment shown in FIG. That is, Table 1 shows temperature data for cases where there is no island-like circular heat effect pattern and cases where there is no island-like circular heat effect pattern. The infrared absorption film 100 was placed at a distance of 11 mm from the detection target at 180 ° C. When receiving infrared rays from the detection object, the temperature of the infrared absorption film 100 rises from the ambient temperature. In the conventional infrared absorbing film, the temperature rise from the ambient temperature was 7.6 ° C. However, when the island-shaped circular heat effect pattern 50 is added as shown in FIG. 1, the peripheral temperature rise is 8.3 ° C. Increased by 9%.

  The heat effect pattern 50 is formed by etching a film with copper foil in the same manner as the lead patterns 31 and 32 and the heat collection pattern 40 in a normal process of FPC (flexible printed circuit board). Therefore, the number of processes is not increased especially for the thermal effect pattern 50. The temperature rise can be increased simply by devising the shape of the copper foil pattern, so that the sensitivity is improved.

(Embodiment 2)
FIG. 4 is a top view of the infrared absorption film 100 of the infrared temperature sensor 2 according to the second embodiment.
A heat collecting pattern 40 is further added to the first embodiment shown in FIG.
The heat collection pattern 40 is formed of a copper foil pattern, and is formed radially on the infrared absorption film 100 starting from the infrared detection thermal element 10. The amount of heat distributed in the infrared absorption film 100 is transferred to the infrared detection thermal element 10. It is for collecting heat. This is a heat collection pattern for capturing the amount of heat distributed in various places of the infrared absorption film 100 and collecting the heat in the infrared detection thermal element 10. The outflow of heat from the infrared detecting heat sensitive element 10 to the outside of the infrared absorbing film 100 can be prevented by means for increasing the thermal resistance such as the lead patterns 31 and 32 including the meander pattern 33.

The heat collection pattern 40 is formed on the surface of the infrared absorption film 100 opposite to the heat source, and is formed simultaneously by the same process as the heat effect pattern 50 and the lead patterns 31 and 32. There is no need to add a special process to the formation of the lead, heat collection, and thermal effect patterns made of copper foil on the infrared absorption film 100.

The heat collection pattern 40 is formed radially on the infrared absorption film 100 with the electrodes 11 and 12 as starting points so that heat can be efficiently collected by the infrared detecting thermal element 10. Since the heat collection pattern 40 is not a pattern related to transmission of an electric signal but a pattern related only to heat conduction, it is terminated on the infrared absorption film 100 without being connected to an external component, that is, one end is the electrode 11, 12, the other end is an open end. That is, the heat collection pattern 40 is a pattern related only to heat conduction irrespective of transmission of an electric signal, and is terminated regardless of transmission of an external electric signal. For this reason, heat does not flow out from the heat collection pattern 40 to the outside, and heat flows in one direction from the end of the heat collection pattern 40 toward the infrared detecting thermal element 10.

The heat collection pattern 40 radiates while branching from the electrodes 11 and 12 toward the outer peripheral end of the infrared absorption film 100 in order to capture the amount of heat stored in various places of the infrared absorption film 100 evenly. Preferably it is formed. With such a configuration, the amount of heat distributed in the infrared absorption film 100 is scattered in an island shape between the branches of the heat collection pattern 40, and between the infrared absorption film 100 and the infrared detection thermal element 10. Due to the temperature gradient, a heat flow can be generated toward the infrared detecting thermal element 10.

In addition, by forming the heat collection pattern 40 radially, it is possible to expand the heat collection range in which heat can be captured, and the heat collection efficiency can be increased. Further, since the heat transfer path from the root portion of the heat collection pattern 40 (connection portion between the heat collection pattern 40 and the electrodes 11 and 12) to each point of the infrared absorption film 100 can be shortened, the amount of heat distributed in the infrared absorption film 100 Can be quickly collected to the infrared detecting thermal element 10 through a heat transfer path having a low thermal resistance. Thereby, the thermal element 10 for infrared detection can react with high responsiveness to the temperature change of the heat source.

In this way, by combining the lead patterns 31 and 32 including the meander pattern 33 and the heat effect pattern 50 with the heat collection pattern 40, it is possible to improve the response in addition to the increase in sensitivity. In the above description, it has been described that the thermal effect pattern 50 may be connected to or separated from the lead patterns 31 and 32 including the meander pattern 33. Similarly, the thermal effect pattern 50 may be separated from the heat collection pattern 40. May be connected to each other or disconnected.

(Embodiment 3)
FIG. 5 is a top view of the infrared absorption film 100 of the infrared temperature sensor 3 according to the third embodiment.
In the third embodiment, the thermal effect pattern 50 is connected to the tip of the heat collection pattern 40.

When the heat effect pattern 50 is connected to the heat collection pattern 40 as shown in FIG. 5, the temperature of the heat effect pattern 50 can be directly transmitted to the heat collection pattern 40, so that the temperature of the infrared detecting thermal element 10 is likely to rise. Become. The thermal effect pattern 50 according to the third embodiment is a pattern related only to heat conduction regardless of transmission of an electric signal, and terminates regardless of transmission of an external electric signal.

(Embodiment 4)
FIG. 6 is a top view of the infrared absorption film 100 of the infrared temperature sensor 4 according to the fourth embodiment. FIG. 6 shows a fourth embodiment in which the heat effect patterns 50 are connected to each other by a thin copper foil pattern, that is, a connection pattern 34. Since the width of the connection pattern 34 that connects the heat effect patterns 50 is about 1/5 or less of the diameter of the heat effect pattern 50, the thermal resistance is high, so the response speed of each heat effect pattern 50 is not connected. Not much different from the case.

Since the heat effect pattern 50 is connected in a net shape, the amount of heat in a portion having a high temperature distribution called a hot spot on the infrared absorption film 100 is dispersed. Conventionally, even if a portion with a high temperature distribution occurs, the temperature remains at that place and does not contribute to the temperature increase of the entire infrared absorption film 100. However, by connecting the heat effect pattern 50 in this way, the temperature distribution is high. The temperature rise of the part can be utilized for the temperature rise of the entire infrared absorption film 100.

The connection pattern 34 may be connected to the heat collection pattern 40. The connection pattern 34 is thin but short and has a large number as a whole, so that the heat around the whole is fast. The connection pattern 34 also has an action of collecting heat in the gap region of the heat effect pattern 50. Since the heat effect pattern 50 is connected in a net shape, the temperature rise of the copper foil can be directly transmitted to the heat collecting pattern 40, and the temperature of the infrared detecting thermal element 10 is likely to rise.

(Embodiment 5)
FIG. 7 is a top view of the infrared absorption film 100 of the infrared temperature sensor 5 according to the fifth embodiment. FIG. 7 shows a further needle-like pattern 51 extracted from the thermal effect pattern 50. Since the perimeter of the boundary between the surface of the infrared absorption film 100 and the thermal effect pattern is increased, heat is transferred to and from the infrared absorption film. It becomes easy to be broken.

(Embodiment 6)
FIG. 8 is a top view of the infrared absorption film 100 of the infrared temperature sensor 6 according to the sixth embodiment. In FIG. 8, the thermal effect pattern 50 is applied to the regions other than the thermal element 10, the heat collection pattern 40, and the lead patterns 31 and 32 so that the thermal effect pattern 50 is applied to as many portions as possible on the infrared absorption film 100. It is a thing. Since there is no gap between the thermal effect patterns 50, the proportion of the thermal effect pattern 50 in the area of the infrared absorption film 100 can be further increased. However, since the thermal effect pattern 50 is not finely divided, the thermal effect pattern 50 The heat capacity becomes larger and the response becomes slower. However, when the copper foil is as thin as 25 μm or less, the heat capacity is originally small, so that the response is relatively low.

1, 2, 3, 4, 5, 6 Infrared temperature sensor 10 Infrared detection thermal element 11, 12 Electrode 100 Infrared absorbing film 31, 32 Lead pattern 33 Meander pattern 34 Connection pattern 40 Heat collection pattern 50 Thermal effect pattern 51 Needle-shaped Pattern L1, L2, L3 Infrared

Claims (11)

An infrared absorbing film that absorbs infrared rays radiated from a heat source and generates heat;
A thermal element for infrared detection that outputs an electrical signal corresponding to the temperature of the heat source by detecting the amount of heat of the infrared absorption film;
A lead pattern for guiding the electrical signal from the infrared sensing thermal element to the outside;
Having at least one or more thermal effect patterns for reflecting or absorbing infrared rays transmitted through the infrared absorbing film;
The thermal effect pattern is a pattern that does not transmit the electrical signal,
The lead pattern and the thermal effect pattern are made of copper foil and are formed on the infrared absorption film ,
A heat collection pattern for collecting heat distributed in the infrared absorption film on the infrared detecting thermal element;
2. The infrared temperature sensor according to claim 1, wherein the heat collection pattern is formed radially on the infrared absorption film starting from the infrared detecting thermal element . An infrared absorbing film that absorbs infrared rays radiated from a heat source and generates heat;
A thermal element for infrared detection that outputs an electrical signal corresponding to the temperature of the heat source by detecting the amount of heat of the infrared absorption film;
A lead pattern for guiding the electrical signal from the infrared sensing thermal element to the outside;
Having at least one or more thermal effect patterns for reflecting or absorbing infrared rays transmitted through the infrared absorbing film;
The thermal effect pattern is a pattern that does not transmit the electrical signal,
The lead pattern and the thermal effect pattern are made of copper foil and are formed on the infrared absorption film,
A heat collection pattern for collecting heat distributed in the infrared absorption film on the infrared detecting thermal element;
The thermal effect pattern is characterized in that the thermal effect pattern is distributed in an island shape in a region other than the region where the infrared detecting thermal element, the lead pattern, and the heat collection pattern are present . The lead pattern, infrared temperature sensor according to claim 1 or 2, characterized in that it comprises a meander pattern. 3. The infrared temperature sensor according to claim 2 , wherein the heat collection pattern is formed radially on the infrared absorption film with the infrared detection thermal element as a starting point. 4. The infrared temperature sensor according to claim 1, wherein the thermal effect pattern is dispersed throughout the infrared absorption film. The thermal effect pattern is formed on a surface opposite to the heat source of the infrared absorption film, and has minute protrusions distributed over one surface of the copper foil as the thermal effect pattern, and the protrusions are formed on the infrared absorption film. 6. The infrared temperature sensor according to claim 1, wherein the interface with the infrared absorption film is uneven by biting into and engaging with each other. 7. The infrared temperature sensor according to claim 6, wherein a distance from the valley bottom of the unevenness to the peak of the mountain at the interface with the infrared absorption film of the thermal effect pattern is 2 μm or more. The heat effect pattern, in a region other than the region where the infrared detecting thermal sensitive element and the lead pattern and the collector pattern exists, according to claim 1, characterized in that said heat effect pattern are distributed like islands Infrared temperature sensor. 9. The infrared temperature sensor according to claim 2, wherein the island-shaped heat effect pattern has a circular shape, and a diameter thereof is 0.5 to 2.5 times a width of the lead pattern. The infrared temperature sensor according to claim 1, wherein the heat effect patterns are electrically connected to each other in a linear pattern. The heat effect patterns are electrically connected by a linear pattern, and the width of the linear pattern is 1/5 or less of the diameter of the island-shaped heat effect pattern, The infrared sensor according to claim 2 or 8.

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