JP5845632B2 - Information storage medium manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing an information storage medium that performs communication using an electromagnetic induction method or an electromagnetic coupling method.

Conventionally, there has been a communication system that reads (or writes) an IC card possessed by a user by an electromagnetic induction method (for example, Patent Document 1). An IC card of such a communication system is composed of at least an IC chip having a non-contact communication function and an antenna coil, and the IC chip provided in the IC card has driving power from a signal transmitted from a reader / writer. Data is transmitted / received by receiving an analog signal sent from the reader / writer, converting it to digital, and returning a response signal. Non-contact IC cards are used in various systems such as transportation systems, electronic money, employee ID systems, and logistics management.
As a communication method using a non-contact IC card, an electromagnetic coupling method, an electrostatic coupling method, an electromagnetic induction method, and a radio wave method are used according to the communication frequency band. Guidance methods are mainstream.
However, the electromagnetic induction type communication system is expensive because the antenna coil of the IC card is formed by etching or the like.

JP 2000-123121 A

  The subject of this invention is providing the information storage medium manufacturing method which can implement | achieve the communication system which communicates by an electromagnetic induction system or an electromagnetic coupling system at low cost.

  The present invention solves the problems by the following means. In addition, in order to make an understanding easy, although the code | symbol corresponding to embodiment of this invention is attached | subjected and demonstrated, it is not limited to this. In addition, the configuration described with reference numerals may be improved as appropriate, or at least a part thereof may be replaced with another configuration.

The first invention includes a communication device-side loop antenna (21a, 521a, 621a, 721a) that performs communication by an electromagnetic induction method or an electromagnetic coupling method, and a control unit (27, 27) that performs communication processing via the communication device-side loop antenna. 527, 627, 727) and a relay loop antenna (31, 520, 720, 720) that communicates with the communication device side loop antenna by an electromagnetic induction method or an electromagnetic coupling method. 531, 631, 731) and a relay communication device (30, 530, 630, 730) including a pair of relay conductive members connected to both ends of the relay loop antenna and disposed through slits and having conductivity. Information storage used in a communication system and performing communication processing with the control unit of the electromagnetic induction communication device via the relay communication device A method for manufacturing an information storage medium, in which a body is arranged in a medium arrangement direction which is one direction, and a pair of electrically independent conductive plates (42A, 42B, 242A, 242B, 342A, 342B, 542A, 542B, 642A, 642B, 742A, 742B) and a pair of conductive plates formed in the conductive plate forming step, and a pair of conductive plates formed in the conductive plate forming step. An IC chip placement step of placing IC chips (41, 241, 341, 541) capable of communicating by an electromagnetic induction method or an electromagnetic coupling method so as to straddle a slit between a pair of conductive plates. This is an information storage medium manufacturing method.

-2nd invention is the information storage medium manufacturing method of 1st invention, The electroconductive thin plate formation process which forms an electroconductive thin plate (50, 250A, 250B, 350) on the said insulating base material is provided,
The conductive plate forming step includes a conductive thin plate removing step of removing a removal region which is a part of the conductive thin plate formed in the conductive thin plate forming step and separating the conductive plate. An information storage medium manufacturing method.
The third invention is the information storage medium manufacturing method of the second invention, wherein the conductive thin plate removing step cuts a removal region that is a part of the conductive thin plate (50, 250A, 250B, 350). The information storage medium manufacturing method is characterized in that it is removed by the above.
The fourth invention is the information storage medium manufacturing method according to the third invention, wherein the arrangement direction of the pair of conductive plates (42A, 42B) is an orthogonal direction (A) orthogonal to the medium arrangement direction,
In the conductive thin plate removing step, the removal region along the medium arrangement direction is removed by cutting to form the slit, and the removal region along the orthogonal direction is removed by cutting. It is an information storage medium manufacturing method characterized by including an orthogonal direction removal process.
The fifth invention is the information storage medium manufacturing method according to the third invention, wherein the pair of conductive plates are arranged in a direction (242A, 242B) perpendicular to the medium arrangement direction (A), In the conductive thin plate forming step, a pair of the conductive thin plates (250A, 250B) are formed on the insulating base material in the orthogonal direction so as to have the slits, and the conductive thin plate removing step It is an information storage medium manufacturing method characterized by including the orthogonal direction removal process of removing the removal area | region along the said orthogonal direction of the said electroconductive thin plate by cutting.
The sixth invention is the information storage medium manufacturing method of the third invention, wherein the arrangement direction (342A, 342B) of the pair of conductive plates is the medium arrangement direction (B), and the conductive thin plate removing step Is a pair of inter-plate removal step in which the removal region between the pair of conductive plates along the orthogonal direction perpendicular to the medium arrangement direction is removed by cutting to form the slit, and the step along the orthogonal direction An information storage medium manufacturing method comprising: an inter-combination removal step of removing a removal region between a plurality of combinations by cutting.
The seventh invention is the information storage medium manufacturing method according to the second invention, wherein in the conductive thin plate removing step, the removal area is removed by etching.
The eighth invention is the information storage medium manufacturing method according to any one of the first to seventh inventions, wherein the conductive plate forming step forms the conductive plate by a plating method. A storage medium manufacturing method.
The ninth invention is the information storage medium manufacturing method according to any one of the first to seventh inventions, wherein the conductive plate forming step is formed by conductive ink printing. It is a medium manufacturing method.
The tenth invention is the information storage medium manufacturing method according to any one of the first to ninth inventions, wherein the conductive plate forming step sets an interval (L5) between the conductive plates adjacent to each other in the medium arrangement direction. It is an information storage medium manufacturing method characterized by making it sufficiently larger than the slits (40a, 240a, 340a) between the pair of conductive plates.
The eleventh invention is the information storage medium manufacturing method according to any one of the first to tenth inventions, wherein the combination of the insulating substrates is cut between the combinations, and the information storage medium (40, 240, 340) is provided with an individual piece process.

According to the present invention, the following effects can be obtained.
According to a first aspect of the present invention, a relay communication device transmits signals by electrostatic coupling between a relay communication device-side loop antenna that communicates with an electromagnetic induction communication device by an electromagnetic induction method or an electromagnetic coupling method, and an information storage medium. Possible relay conductive members. As a result, drive power is transmitted to the electronic information storage medium, transmission data from the electromagnetic induction communication device can be transmitted to the electronic information storage medium, and return data from the electronic information storage medium is transmitted via the relay communication device. Can be transmitted to the electromagnetic induction communication device.
Further, according to the present invention, it is not necessary to form a loop antenna on the information storage medium, and it is only necessary to provide two conductive plates. Therefore, the conventional antenna formation process such as complicated etching is not required, and the information storage medium is low in cost. Can be manufactured. For this reason, the larger the amount of information storage media issued, the more advantageous in terms of cost compared to a conventional system, and the system can be constructed at a low cost.
Furthermore, the present invention can be constructed at low cost because a system can be constructed by diverting electromagnetic induction communication devices that are widely distributed in the market or electromagnetic coupling communication devices. That is, as an IC chip of an information storage medium, an IC chip used for a non-contact IC card of an electromagnetic induction type or an electromagnetic coupling type that is widely distributed in the market can be used, and an existing non-contact type as an electromagnetic induction communication device. A device can be configured by using a reader / writer for an IC card. As a result, a system can be constructed without the need to newly develop a special IC chip for electrostatic coupling and a reader / writer.
In addition, according to the present invention, since a pair of conductive plates may be provided on the information storage medium, the outer shape of the information storage medium can be reduced as compared with the case where a loop antenna is provided on the information storage medium. Thereby, the information recording medium can be manufactured at a lower cost.
In addition, since a plurality of IC chips are arranged by forming a plurality of combinations of a pair of electrically independent conductive plates on the insulating substrate, each combination is mutually connected after the IC chip is arranged on the substrate. Is electrically independent. For this reason, the inspection efficiency can be improved since the function inspection and the connection state inspection of each IC chip can be performed simultaneously by bringing the inspection probe into direct contact with or close to the conductive plate.
Further, in the present invention, when the information storage medium is divided into pieces, the base material in the separated portion is cut, so that it is not necessary to cut the conductive plate formed of a metal foil or the like. Can be suppressed.
Further, in the present invention, since the conductive plates are separated from each other, the conductive plate is exposed at the outer periphery of the information storage medium by cutting the base material in the separated portion between the adjacent combinations to separate the information storage medium. do not do. For this reason, when an overvoltage is applied from the outside due to static electricity or the like, damage to the IC chip can be reduced. Furthermore, when the information storage medium is touched by hand, it is possible to prevent an operation failure of the IC chip due to the connection of each conductive plate through the human body.

  Since 2nd invention arrange | positions an electroconductive thin plate on an insulating base material, and removes a removal area | region and separates an electroconductive plate, compared with the case where the electroconductive plate isolate | separated beforehand is each arrange | positioned on a board | substrate, The process can be simplified. In addition, although it is difficult to accurately dispose the separated conductive plate on the substrate, the present invention can be easily processed because, for example, a linear removal region may be removed, and the conductive plate It is easy to improve the accuracy of the interval.

  In the third invention, the removal region is removed by cutting. Therefore, when separating into individual pieces, the insulating base portion between the combinations may be cut. For this reason, since it is not necessary to cut | disconnect an electroconductive plate, deterioration of a cutting blade can be suppressed. The etching method has many processes (resist formation process, etching process, cleaning process, etc.), whereas the cutting method is only cutting with a cutting blade, thereby shortening the process and reducing the processing cost. be able to.

In the fourth aspect of the invention, since the removal region between the pair of conductive plates along the medium arrangement direction is removed by cutting in the medium arrangement direction removing step, a plurality of combinations can be obtained by cutting along the medium arrangement direction. The slit between the pair of conductive plates can be produced in one step.
Moreover, since the removal area | region between the some combinations along an orthogonal direction is removed by cutting at a short side direction removal process, the isolation | separation part between adjacent combinations can be produced.

  In the fifth invention, since a pair of conductive thin plates are arranged on an insulating substrate so as to have a slit, a process of forming a slit between the pair of conductive plates is unnecessary, and therefore the process can be shortened. Can be planned.

  In a sixth aspect of the invention, the arrangement direction of the pair of conductive plates is the medium arrangement direction, and the cutting direction of the pair of inter-plate removal process and the cutting direction of the inter-combination removal process are both orthogonal directions. Can be processed in the same process, and the process can be shortened.

In the seventh invention, since the removal region is removed by etching, the slit width between the pair of conductive plates can be narrowed, so that even a small IC chip can be mounted. Moreover, since the space | interval between the conductive plates between adjacent combinations can be widened, the cutting precision margin at the time of cut | dividing a base material and separating an information storage medium into pieces can be expanded, and workability | operativity can be improved.
In the eighth invention, since the conductive plate is formed by a plating method, the slit width between the pair of conductive plates can be narrowed. Therefore, even a small IC chip can be mounted, and the thickness of the conductive layer is reduced and the cost is low. Can be formed. Moreover, since the space | interval between the conductive plates between adjacent combinations can be widened, the cutting precision margin at the time of cut | dividing a base material and separating an information storage medium into pieces can be expanded, and workability | operativity can be improved.
In the ninth invention, since the conductive plate is formed by conductive ink printing, the slit width between the pair of conductive plates can be narrowed. Therefore, even a small IC chip can be mounted and the thickness of the conductive layer is reduced. It can be formed by an inexpensive manufacturing method. Moreover, since the space | interval between the conductive plates between adjacent combinations can be widened, the cutting precision margin at the time of cut | dividing a base material and separating an information storage medium into pieces can be expanded, and workability | operativity can be improved.

  In the tenth aspect of the invention, since the interval between the conductive plates adjacent to each other in the medium arrangement direction is larger than the interval between each pair of conductive plates, the cutting accuracy when the information storage medium is separated into pieces by cutting the base material The margin can be widened and workability can be improved.

  In the eleventh aspect, the combination of the insulating base materials is cut into individual pieces of the information storage medium, so that the conductive plate is exposed on the outer periphery of the information storage medium as in the first aspect. Therefore, damage to the IC chip can be reduced and malfunction of the IC chip can be prevented.

It is a figure explaining the basic composition of communications system 10 of a 1st embodiment. It is a top view explaining the manufacturing method of IC card 40 of a 1st embodiment. It is a top view explaining the manufacturing method of IC card 240 of a 2nd embodiment. It is a top view explaining the manufacturing method of IC card 340 of a 3rd embodiment. It is a perspective view of the lamination apparatus 460 utilized for the lamination process of 4th Embodiment. It is a block diagram of the ticket gate system 501 of 5th Embodiment. It is a perspective view of the communication system 510 of 5th Embodiment. It is a figure explaining the internal structure of the relay communication apparatus 530 of 5th Embodiment. It is a top view of IC card 540 of a 5th embodiment, and a top view explaining shift of IC card 540. It is a top view which shows typically the conveying apparatus 560, the insertion port 534, and the discharge port 535 of 5th Embodiment. It is a flowchart of operation | movement of the communication system 510 of 5th Embodiment. It is a block diagram of the ticket gate system 601 of 6th Embodiment. It is a figure explaining the internal structure of the relay communication apparatus 630 of 6th Embodiment. It is a block diagram of the communication system 710 of 7th Embodiment. It is a figure explaining the internal structure of the relay communication apparatus 730 of 7th Embodiment.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings and the like.
In the following description and drawings, the normal direction of the card surface and the surface of the conductive member is defined as the vertical direction Z, a view seen from the vertical direction Z is referred to as a plan view as appropriate, and the shape of the plan view is referred to as a plane shape as appropriate.
Further, in the coordinate system of the transport device, the direction in which the IC card is transported is the transport direction Y, and the direction orthogonal to the transport direction Y in the plan view is the left-right direction X. In the coordinate system of the IC card, a direction in which a plurality of IC cards are arranged (medium arrangement direction) is a vertical direction B during manufacture, and a direction orthogonal to the vertical direction B is a horizontal direction A in the plan view.

(Basic configuration)
First, the basic configuration of the communication system 10 according to the first embodiment will be described.
FIG. 1 is a diagram illustrating a basic configuration of a communication system 10 according to the first embodiment.
FIG. 1A is a perspective view illustrating a communication method of the electromagnetic induction communication device 20, the reader / writer 21, the relay communication device 30, and the IC card 40.
FIG. 1B is a conceptual diagram for explaining the basic configuration of the communication system 10 (a diagram corresponding to the cross-sectional view taken along the line BB in FIG. 1A).

The communication system 10 includes an electromagnetic induction communication device 20, a relay communication device 30, and an IC card 40 (information storage medium).
The electromagnetic induction communication device 20 is originally a device capable of directly transmitting and receiving information to and from an IC card including an electromagnetic induction type loop antenna. In the embodiment, the electromagnetic induction communication device 20 is electrostatically connected via the relay communication device 30. Information is transmitted / received to / from an IC card 40 including coupling-type conductive plates 42A and 42B (described later).
The electromagnetic induction communication device 20 includes a reader / writer 21, a storage unit 26, and a control unit 27.
The reader / writer 21 includes an R / W loop antenna 21a (communication device side loop antenna).
The R / W loop antenna 21a is, for example, a loop antenna of about 3 turns and has a size of about 40 mm × 40 mm. The R / W loop antenna 21a is formed by wiring a copper pattern on a printed wiring board by a technique such as etching. Terminals at both ends of the R / W loop antenna 21 a are connected to the control unit 27.

The storage unit 26 is a storage device such as a semiconductor memory element for storing a program, information, and the like necessary for the operation of the electromagnetic induction communication device 20. The storage unit 26 stores information to be written to the IC card 40, information to be collated with the IC card 40, and the like.
The control unit 27 is a control unit for controlling the electromagnetic induction communication device 20 in an integrated manner, and includes, for example, a CPU. The control unit 27 reads out and executes various programs stored in the storage unit 26 as appropriate, thereby realizing various functions according to the present invention in cooperation with the hardware described above.

The relay communication device 30 is a device that enables communication between the reader / writer 21 and the IC card 40. The relay communication device 30 includes a relay loop antenna 31 and conductive members 32A and 32B.
The relay loop antenna 31 is an antenna that communicates (couples) with the R / W loop antenna 21a by an electromagnetic induction method. The relay loop antenna 31 is, for example, a loop antenna having about three turns and has a size of about 40 mm × 40 mm. The relay loop antenna 31 is formed by wiring a copper pattern on a printed wiring board by, for example, a technique such as etching.

The conductive members 32A and 32B are members in which a conductive material such as copper is formed in a plate shape. The conductive members 32A and 32B are electrically connected to both ends of the relay loop antenna 31 by electric wires 31a and 31b, respectively. The conductive members 32A and 32B are arranged in parallel with an interval of, for example, a length L1 = 1 mm.
As in the embodiments described later, the conductive members 32A and 32B are attached to the belt 61 and move along the downstream side Y2 (card transport direction) in the transport direction Y in synchronization with the IC card 40. The conductive members 32A and 32B are in close contact with a pair of conductive plates 42A and 42B (described later) of the IC card 40 during movement (for example, the upper surfaces of the conductive members 32A and 32B and the lower surfaces of the conductive plates 42A and 42B). The distance between the conductive plates 42A and 42B is electrostatically coupled to the conductive plates 42A and 42B.

The IC card 40 is a non-contact card that does not include an external contact terminal. The size of the IC card 40 is not limited to the size of a credit card or the like, and can be set to an arbitrary size according to the application (for example, a ticket).
The IC card 40 includes an IC chip 41, a pair of conductive plates 42A and 42B, a lower layer 43, and an upper layer 44.
The IC chip 41 is an integrated circuit capable of communicating by an electromagnetic induction method, and is the same type as that incorporated in a conventional electromagnetic induction type IC card. The IC chip 41 comprehensively controls the IC card 40 by appropriately reading and executing a storage unit that stores programs, information, and the like necessary for the operation of the IC card 40 and various programs stored in the storage unit. And a control unit.

The IC chip 41 has a thickness of about 150 μm, for example. The IC chip 41 is disposed so as to straddle the slit 40a between the conductive plates 42A and 42B.
The input / output unit (lead frame or the like) of the IC chip 41 is electrically connected to the conductive plates 42A and 42B by a connecting member 46 such as an anisotropic conductive paste, an anisotropic conductive film, or a conductive adhesive. Connected mechanically and mechanically. Since the IC chip 41 is of an electromagnetic induction type, this input / output unit is originally connected to a loop antenna.

  The conductive plates 42A and 42B are aluminum foils each having a thickness of 10 μm and a short side × long side of 20 mm × 25 mm. The conductive plates 42 </ b> A and 42 </ b> B are attached to the lower layer 43. The conductive plates 42A and 42B are arranged in the longitudinal direction B through slits 40a that are elongated. The slit width L2 is about 0.5 mm, for example. At the time of card conveyance, the conveyance direction Y and the vertical direction B of the IC card 40 coincide.

The lower layer 43 is a base material of the IC card 40. The lower layer 43 is an insulating film substrate such as PET, PET-G, PVC, or polyimide having a thickness of 180 μm and a short side × long side of 25.0 mm × 57.5 mm.
The upper layer 44 is made of an insulating material (PET, PET-G, PVC, polyimide, paper, etc.). The upper layer 44 has a thickness of about 200 μm, for example. The upper layer 44 is affixed to the lower layer 43 with an adhesive 45 (liquid, film-like adhesive, adhesive, etc.) so as to cover the IC chip 41 and the conductive plates 42A and 42B.

(Communication method)
Next, a basic communication method of the communication system 10 according to the first embodiment will be described.
(Connection between reader / writer 21 and relay communication device 30)
The R / W loop antenna 21a and the relay loop antenna 31 are connected in a non-contact manner by an electromagnetic induction method, and can transmit and receive information. The communication system of the IC card 40 using the electromagnetic induction system is standardized by ISO / IEC 14443, 15693, 18092, and a signal frequency of 13.56 MHz is used.
In addition, although the number of turns of the R / W loop antenna 21a and the relay loop antenna 31 has been described as being about 3 turns, it is not limited thereto. What is necessary is just the number of turns by which both are connected non-contactingly by an electromagnetic induction system, and the number of turns should just be 1 or more turns, for example.

(Connection between relay communication device 30 and IC card 40)
The conductive members 32A and 32B and the conductive plates 42A and 42B function as capacitor plates, and are connected in a non-contact manner by an electrostatic coupling method to transmit information.

  When the relay loop antenna 31 approaches the R / W loop antenna 21a, an electromotive force is generated, the conductive members 32A and 32B and the conductive plates 42A and 42B are electrostatically coupled, and the driving power is transmitted to the IC chip 41. Also, transmission data from the electromagnetic induction communication device 20 can be transmitted to the IC chip 41, while return data from the IC chip 41 can be transmitted to the electromagnetic induction communication device 20 via the relay communication device 30.

  As described above, the communication system 10 can perform communication processing between the control unit 27 of the electromagnetic induction communication device 20 and the IC chip 41 of the IC card 40.

(Manufacturing method of IC card 40)
Next, a method for manufacturing the IC card 40 of the first embodiment will be described.
FIG. 2 is a plan view for explaining the manufacturing method of the IC card 40 of the first embodiment.
The arrangement direction of the conductive plates 42A and 42B is the horizontal direction A (direction orthogonal to the medium arrangement direction).

The manufacturing method of the IC card 40 follows the following procedure.
(1) Conductive thin plate forming step The conductive thin plate 50 is pasted on the lower layer 43. The conductive thin plate 50 is a plate material that is processed into conductive plates 42A and 42B. The conductive thin plate 50 is shorter in the horizontal direction A than the lower layer 43 and has a planar shape that is elongated in the vertical direction B.

(2) Conductive thin plate cutting process (conductive thin plate removing process, conductive plate forming process)
In the conductive thin plate cutting step, a part of the removal region of the conductive thin plate 50 is removed by cutting or half-cutting, the conductive plates 42A and 42B of the IC card 40 are separated, and the conductive between the adjacent IC cards 40 is also removed. This is the step of separating the plates 42A and 42B. Thus, a plurality of combinations of electrically independent conductive plates 42A and 42B can be formed on the lower layer 43.
In the embodiment, a plurality of combinations of a pair of conductive plates are formed and are in a state before separation into IC cards, and combinations of conductive plates adjacent in the arrangement direction are connected by a lower layer or the like (base material). Even in such a state, it is appropriately referred to as an IC card.
The conductive thin plate cutting process includes a longitudinal cutting process (medium arrangement direction removing process) and a transverse cutting process (orthogonal direction removing process).

(2-1) Longitudinal Cutting Step As shown in FIG. 2B, the removal region along the vertical direction B is removed by cutting such as milling. Thereby, the conductive thin plate 50 is divided into two conductive plates 50A and 50B, and a long and narrow slit 50a is formed in the vertical direction B.
The cutting method is performed by a method in which the cutting blade is scanned along the vertical direction B, or the lower layer 43 is moved in the vertical direction B while the cutting blade is fixed.
The width of the slit 50a is equal to the length L2 of the slit 40a of the IC card 40, and is about 0.5 mm.
As shown in the cross-sectional view of FIG. 2B-2, the cutting depth L3 is made deeper than the surface of the lower layer 43 in order to prevent the removal of the slit 50a.
The cutting process may be a cutting process with a circular blade or the like, a cutting process with a triangular sword, a round sword, a flat circular sword, or the like, or a half cut process using a mold.

(2-2) Lateral Cutting Process As shown in FIG. 2C, the removal region between the adjacent IC cards 40, that is, the combination of the pair of conductive plates 42A and 42B is removed by cutting. The cutting method is the same as that in the vertical direction cutting step, and the horizontal direction A may be scanned a plurality of times at every scanning interval L4.
The scanning interval L4 in the vertical direction B is equal to the length of the short side of the IC card 40. The scanning width L5 in the horizontal cutting process is about 2 mm, which is larger than the scanning width L2 in the vertical cutting process. The reason for increasing the scanning width L5 in the horizontal cutting process is to prevent the conductive plates 42A and 42B from being exposed from the end face (cut surface) of the card in consideration of processing errors in the individual piece process described later. is there.

  By performing the vertical cutting process and the horizontal cutting process, a plurality of combinations of the conductive plates 42A and 42B can be produced. Note that the order of the vertical cutting process and the horizontal cutting process may be interchanged.

In addition, you may perform the said process with the following method.
-Instead of cutting the conductive thin plate 50, the removal region may be removed by etching. A mask pattern used for etching has a feature that it can be formed finely. For this reason, in this case, the width of the slit 40a can be reduced, and the IC chip 41 can be mounted even if it is small.
Instead of attaching the conductive thin plate 50 on the lower layer 43, a conductive layer may be laminated on the lower layer 43 by a plating method to provide a layer corresponding to the conductive thin plate 50. In this case, in addition to the above effects, the thickness of the conductive layer can be reduced, so that it can be formed at low cost. Further, if masking is performed on the area corresponding to the slit 50a and the removal area between the combination of the conductive plates 42A and 42B, the conductive thin plate cutting process is not necessary, and therefore the process can be reduced.
Similarly, a conductive ink may be printed on the lower layer 43 to provide a layer corresponding to the conductive thin plate 50. Also in this case, the conductive layer can be formed by a thin manufacturing method with a low thickness. Further, if the area corresponding to the slit 50a and the removal area between the combinations of the conductive plates 42A and 42B are not printed, the conductive thin plate cutting process is not necessary, and therefore the process can be reduced.
The conductive plates 42 </ b> A and 42 </ b> B may not be formed by being cut after being stacked on the lower layer 43, but may be separated into pieces and arranged on the lower layer 43 in advance. In this case, the conductive plates 42A and 42B are stacked on the lower layer 43 to be in the state shown in FIG. 2C, and the process can be simplified.

(3) IC chip arrangement | positioning process As shown in FIG.2 (d), each IC chip 41 is arrange | positioned so that the slit 40a may be straddled with respect to each combination of conductive plate 42A, 42B.
The IC chip 41 is subjected to bump processing such as gold plating on the antenna connection terminal in advance. Then, the antenna connection terminal and the conductive plates 42A and 42B are arranged so as to face each other, and are connected via an anisotropic conductive film, an anisotropic conductive paste, an insulating paste, or the like.
In addition, the IC chip 41 mounting surface of the lower layer 43 may be provided with a mark of the mounting position of the IC chip 41 by printing or the like. This is to make the operation of mounting the IC chip 41 easy and uniform.

(4) Upper layer arrangement process As shown in Drawing 2 (d), upper layer 44 is laminated (refer to Drawing 1 (b)).
In the upper layer arranging step, the upper layer 44 is attached to the lower layer 43, the IC chip 41, and the upper side Z2 of the conductive plates 42A and 42B with an adhesive 45 (see FIG. 1). By laminating the upper layer 44, the IC chip 41 can be covered and reinforced, and the surface of the upper layer 44 can be printed.

(5) Individual piece process As shown in FIG. 2 (e), the center between adjacent IC cards 40 (the center between a plurality of combinations) of the lower layer 43 and the upper layer 44 is used as a cutting line 40b to perform IC by punching. The card 40 is divided into pieces.
In the removal step, the distance between the conductive plates 42A and 42B between adjacent combinations is increased. For this reason, in the individual piece process, the cutting accuracy margin when cutting the lower layer 43 can be widened, and workability can be improved.
Note that if at least one of the lower layer 43 and the upper layer 44 is provided with printing or the like indicating the cutting position, the cutting operation is facilitated.
The individual piece process is not limited to the punching process, and a cutting process may be performed.

As described above, the communication system 10 of the present embodiment has the following effects.
(1) A signal is transmitted by electromagnetic induction between the R / W loop antenna 21a and the relay loop antenna 31, and the conductive members 32A and 32B of the relay communication device 30 and the conductive plates 42A and 42B of the IC card 40 face each other. The signal can be transmitted by electrostatic coupling.
As a result, the IC card 40 does not require a loop antenna and only needs to be provided with the conductive plates 42A and 42B. Therefore, the conventional antenna forming step such as complicated etching is not required, and the IC card 40 can be manufactured at low cost. For this reason, as the number of issued IC cards 40 increases, the cost becomes more advantageous, and the system can be constructed at a low cost.

(2) Since the electromagnetic induction communication device 20 widely distributed in the market can be diverted, a system can be constructed easily and at low cost.
Even when a new system is introduced, an IC chip used for an electromagnetic induction IC card can be used, and an existing non-contact IC reader / writer can be used. As a result, a system can be constructed without the need to newly develop a special IC chip for electrostatic coupling and an electromagnetic induction communication device.

(3) A plurality of combinations of conductive plates 42A and 42B can be electrically and independently arranged on the lower layer 43 during manufacturing. For this reason, when the IC card 40 is shipped or the like, the function probes and the connection state tests of the plurality of IC chips 41 can be simultaneously performed by bringing the inspection probes into direct contact with or close to the conductive plates 42A and 42B. , Inspection efficiency can be improved.

(4) Since the conductive plates 42A and 42B are not exposed on the end surface (cut surface) of the IC card 40, damage to the IC chip 41 can be reduced when an overvoltage is applied from the outside due to static electricity or the like. Further, when the IC card 40 is touched with a hand, it is possible to prevent malfunction of the IC chip 41 due to the conductive plates 42A and 42B being connected through the human body.

(5) When the conductive plates 42A and 42B separated in advance are respectively disposed on the lower layer 42, it is difficult to accurately dispose the conductive plates 42A and 42B on the lower layer 42, but in the present embodiment, the conductive thin plate 50 is disposed. Since it arrange | positions on the lower layer 42, a removal area | region is removed and electroconductive plates 42A and 42B are spaced apart, a process is easy and can improve the dimensional accuracy of the slit 40a.

(6) In the individual piece process, it is not necessary to cut the conductive plates 42A and 42B formed of metal foil or the like, so that deterioration of the cutting blade can be suppressed. Further, by using the cutting method, the process can be shortened compared to the etching method, and the processing cost can be reduced.

(7) Since the slit 50a is provided in the longitudinal cutting step, the slits 40a of the plurality of IC cards 40 can be produced in one step.

(Second Embodiment)
Next, a second embodiment to which the present invention is applied will be described.
Note that, in the following description and drawings, the same reference numerals or the same reference numerals are given to the portions that perform the same functions as those in the first embodiment described above, and overlapping descriptions will be omitted as appropriate.
In the second embodiment, the manufacturing method of the IC card 240 is changed from the first embodiment.

FIG. 3 is a plan view for explaining the manufacturing method of the IC card 240 of the second embodiment. 3 corresponding to FIG. 2 is denoted by the same reference numerals in parentheses.
The manufacturing method of the IC card 240 follows the following procedure.
(Conductive thin plate forming process)
As shown in FIG. 3B, a pair of conductive thin plates 250A and 250B are disposed on the lower layer 243.
The length L6 in the lateral direction A of each conductive thin plate 250A, 250B is equal to the length L6 of the side in the lateral direction A of each conductive plate 242A, 242B.
The pair of conductive thin plates 250A and 250B are arranged on the lower layer 243 in the horizontal direction A so as to have the slits 250a (width L2).

(Conductive sheet cutting process)
As shown in FIG. 3 (c), the conductive thin plate cutting process has only a horizontal cutting process, and the removal regions along the horizontal direction A of the conductive thin plates 250A and 250B are removed by cutting.
Thus, since the manufacturing method of this embodiment arrange | positions the electroconductive thin plates 250A and 250B in the lower layer 243 so that it may have the slit 250a beforehand, the cutting process for forming the slit 240a is unnecessary. Shortening can be achieved.

(Third embodiment)
Next, a third embodiment to which the present invention is applied will be described.
In the third embodiment, the manufacturing method of the IC card 340 is changed from the first embodiment.
FIG. 4 is a plan view for explaining the manufacturing method of the IC card 340 of the third embodiment. 4 that correspond to FIG. 2 are given the same reference numerals in parentheses.
As shown in FIG. 4, the arrangement direction of the IC card 340 and the arrangement direction of the conductive plates 342A and 342B are both in the vertical direction B.

The manufacturing method of the IC card 340 of the present embodiment follows the following procedure.
(Conductive thin plate placement process)
As shown in FIG. 4B, a conductive thin plate 350 is disposed on the lower layer 343.
The length in the horizontal direction A of the conductive thin plate 350 is equal to the length of the side in the horizontal direction A of the conductive plates 342A and 342B.

(Conductive sheet cutting process)
The conductive thin plate cutting process includes a slit cutting process (a pair of inter-plate removal process) and an inter-card cutting process (an inter-combination removal process).
In the slit cutting process, the removal region between the pair of conductive plates 342A and 342B is removed by cutting along the lateral direction A to form the slit 340a.
In the inter-card cutting process, the removal region 340c between the adjacent IC cards 340 is removed by cutting along the lateral direction A.

  Thus, in the manufacturing method of the present embodiment, the slit cutting step and the slit cutting step and the cutting direction are both in the lateral direction A. For this reason, if the two cutting blades used in both steps are arranged apart by a length L7 between the center of the slit 340a and the center of the removal region 340c and simultaneously scanned in the lateral direction A, the set of slits 340a and the removal are removed. The region 340c can be processed in the same process, and the process can be shortened.

(Fourth embodiment)
Next, a fourth embodiment to which the present invention is applied will be described.
The fourth embodiment is an example of a laminating apparatus 460 for a lower layer 443 and conductive thin plates 450A and 450B.
FIG. 5 is a perspective view of a laminating apparatus 460 used in the laminating process of the fourth embodiment.
In the present embodiment, an example in which conductive thin plates 450A and 450B similar to the manufacturing method of the second embodiment are laminated on the lower layer 443 will be described.
The laminating apparatus 460 includes a lower layer feed roll unit 461, a conductive thin plate feed roll unit 462, nip roller units 463 and 464, and a take-up roll unit 465.

The lower layer feed roll unit 461 is a part that feeds out the lower layer 443 in a roll shape.
The conductive thin plate feed roll portion 462 is a portion that feeds the conductive thin plates 450A and 450B in a roll shape.
The nip roller portion 463 presses the lower layer 443 fed from the lower layer feed roll unit 461 and the conductive thin plates 450A and 450B fed from the conductive thin plate feed roll unit 462 between the upper roller 463a and the lower roller 464b. And laminate.
The nip roller portion 464 is a nip roller disposed on the downstream side of the nip roller portion 463. The nip roller portion 464 further presses the lower layer 443 and the conductive thin plates 450A and 450B between the upper roller 464a and the lower roller 464b, and securely bonds them together.
The take-up roll unit 465 is a roller that takes up the stacked lower layer 443 and the conductive thin plates 450A and 450B by being rotationally driven by a driving device (not shown).

  With the above configuration, the stacking apparatus 460 pulls out the lower layer 443 of the lower layer feed roll unit 461 and the conductive thin plates 450A and 450B of the conductive thin plate feed roll unit 462 by rotating the winding roll unit 465, The nip roller portions 463 and 464 can be pressed and laminated. Further, the laminating apparatus 460 can store the laminated lower layer 443 and the conductive thin plates 450A and 450B in a roll shape by the take-up roll unit 465.

  In addition, although this embodiment demonstrated the lamination | stacking method of the IC card similar to 2nd Embodiment, it can be diverted also to the lamination | stacking method of IC card similar to 1st or 3rd Embodiment.

(Fifth embodiment)
Next, a fifth embodiment to which the present invention is applied will be described.
The fifth embodiment is a communication system using an electromagnetic induction ticket gate 520, a relay communication device 530, and an IC card 540.
FIG. 6 is a block diagram of a ticket gate system 501 of the fifth embodiment.
FIG. 7 is a perspective view of a communication system 510 according to the fifth embodiment.

(Configuration of the ticket gate system 501)
The ticket gate system 501 is a system used for an entrance / exit gate such as a railway. The ticket gate system 501 is configured by connecting a communication system 510 to the server 502 in a conventional system in which a server 502 and a plurality of electromagnetic induction ticket gates 503 are connected. Tickets, commuter passes and the like used in the ticket gate system 501 are IC cards 504 and 540 (information storage media) in which an IC chip is built.

The server 502 includes a server storage unit 502a and a server control unit 502b.
The server storage unit 502a is a storage device such as a hard disk or a semiconductor memory element that stores programs, information, and the like necessary for the operation of the server 502.
The server storage unit 502a stores, for example, information on the IC cards 504 and 540 (boarding section, time limit, user name, etc.). The information in the server storage unit 502a is referred to as appropriate when the IC cards 504 and 540 are reissued at a ticket machine or the like.
The server control unit 502b is a control unit for comprehensively controlling the server 502, and includes, for example, a CPU. The server control unit 502b appropriately reads and executes various programs stored in the server storage unit 502a.
The electromagnetic induction ticket gate 503 is a conventional electromagnetic induction ticket gate, and can transmit and receive information to and from the conventional electromagnetic induction type IC card 504.

The communication system 510 is configured by adding a relay communication device 530 to the same electromagnetic induction ticket gate 520 (electromagnetic induction communication device) as the conventional electromagnetic induction ticket gate 503. The communication system 510 can transmit / receive information to / from the electromagnetic induction ticket gate 520 and the electrostatic coupling (capacitive coupling) type IC card 540 via the relay communication device 530.
Note that the ticket gate system 501 may be configured by only a plurality of communication systems 510 without using the electromagnetic induction ticket gate 503. Further, the communication system 510 may not be a device that combines the conventional electromagnetic induction ticket gate 520 and the communication system 510, but may be a newly-provided integrated device.

The electromagnetic induction ticket gate 520 includes a ticket gate storage unit 526 and a ticket gate control unit 527 (communication result determination control unit).
The ticket gate storage unit 526 is a storage device such as a semiconductor memory element for storing a program, information, and the like necessary for the operation of the electromagnetic induction ticket gate 520.
The ticket gate control unit 527 is a control unit for comprehensively controlling the electromagnetic induction ticket gate 520, and includes, for example, a CPU. The ticket gate control unit 527 implements various functions according to the present invention in cooperation with the hardware described above by appropriately reading and executing various programs stored in the ticket gate storage unit 526.
Since the electromagnetic induction ticket gate 520 has the same configuration as the electromagnetic induction ticket gate 503, the ticket gate storage unit 526 and the ticket gate control unit 527 are a storage unit and a control unit (see FIG. The basic configuration is the same.

The relay communication device 530 includes a relay storage unit 536 and a relay control unit 537.
The relay control unit 537 is a storage device such as a semiconductor memory element for storing programs, information, and the like necessary for the operation of the relay communication device 530.
The relay control unit 537 is a control unit for comprehensively controlling the relay communication device 530, and includes, for example, a CPU. The relay control unit 537 implements various functions according to the present invention in cooperation with the hardware described above by appropriately reading and executing various programs stored in the relay storage unit 536.
The relay control unit 537 is electrically connected to the electromagnetic induction ticket gate 520, and can check the determination and status as a result of communication between the electromagnetic induction ticket gate 520 and the IC card 540.

The IC chip 541 of the IC card 540 includes an IC chip storage unit 541a, an IC chip control unit 541b, and an analog circuit unit 541c.
The IC chip storage unit 541a is a storage circuit for storing programs, information, and the like necessary for the operation of the IC card 540. The IC chip storage unit 541a stores, for example, information such as a boarding section, a usage period, and a user's name in a rewritable manner.
The IC chip control unit 541b is a control unit for comprehensively controlling the IC card 540, and includes, for example, a CPU. The IC chip control unit 541b realizes various functions according to the present invention by appropriately reading and executing various programs stored in the IC chip storage unit 541a.
The analog circuit unit 541c includes a rectifier circuit, a modulation circuit, a demodulation circuit, a CLK extraction circuit, and the like. The analog circuit unit 541c performs AD conversion, clock generation, and the like on the signal input via the IC chip input / output terminal, and performs voltage supply, clock supply, data input / output, etc. to the IC chip control unit 541b. .

Hereinafter, the structure and the like of the communication system 510 will be described in detail.
The communication system 510 is a device disposed at each railway station. The communication system 510 reads information on the IC card 540 possessed by the user, authenticates the boarding section, use period, and the like, and opens and closes the passage door 522.
The basic configuration of the communication system 510 is the same as that of the communication system 10 of the first embodiment, and includes an electromagnetic induction ticket gate 520 and a relay communication device 530. In FIG. 7, the user walks from the near side of the communication system 510 toward the far side. In the embodiment, the front side will be described as the entrance 510a and the back side will be described as the exit 510b, regardless of whether the user enters or exits.

The electromagnetic induction ticket gate 520 is originally a device capable of transmitting and receiving information to and from the electromagnetic induction type IC card 504, similarly to the electromagnetic induction ticket gate 503, but in the embodiment, via the relay communication device 530. Thus, information can be transmitted to and received from the electromagnetic induction type IC card 540.
As shown in FIGS. 6 and 7, the electromagnetic induction ticket gate 520 includes a reader / writer 521, a passage door 522, a monitor 523, and an audio output unit 524.
The reader / writer 521 includes an R / W loop antenna 521a (an electromagnetic induction communication device side loop antenna).

As shown in FIG. 7, the passing door 522 is an open / close door provided in the casing of the electromagnetic induction ticket gate 520. The passage door 522 is driven to open and close by a driving device including a DC motor or the like.
The monitor 523 and the audio output unit 524 are notification units that notify the result of communication processing.
The monitor 523 is a display device such as a liquid crystal display device. The monitor 523 is disposed in the range of the downstream side Y2 in the transport direction Y on the case surface of the electromagnetic induction ticket gate 520. The monitor 523 outputs, for example, characters and notifies the balance, communication abnormality, and the like. Note that the relay communication device 530 is placed on the electromagnetic induction ticket gate 520 so that the monitor 523 is exposed so that the user can see the monitor 523.
The audio output unit 524 is a speaker that outputs audio. The voice output unit 524 outputs, for example, a warning sound, a voice guide, etc., and notifies a communication abnormality or the like.

The relay communication device 530 is a device that enables communication between the electromagnetic induction ticket gate 520 and the IC card 540 by being placed on the electromagnetic induction ticket gate 520.
The relay communication device 530 includes a relay loop antenna 531, a pair of conductive members 532A and 532B, an insertion port 534, a discharge port 535, and a transfer device 560.

The conductive members 532A and 532B are arranged in parallel along the transport direction Y of the IC card 540. 532A and 532B are formed of conductive rubber or the like, and are formed in a flat belt shape. The conductive members 532A and 532B are affixed to the outer peripheral surface of the lower belt 561 (see FIG. 8), and rotate together with the lower belt 561 in the transport direction Y.
As will be described later, the range on the downstream side Y2 among the movement ranges on the conductive members 532A and 532B is a stop range A1 in which the IC card 540 transported by the transport device 560 is stopped in order to determine the communication result. (Communication result determination range) (see FIG. 8).

As shown in FIG. 7, the insertion slot 534 is an entrance for the user to insert the IC card 540. The insertion slot 534 is provided with an insertion card feeder 534a and an insertion slot opening / closing door 534b (see FIG. 10).
The insertion card feeding device 534a is a device that includes a roller and a motor that rotates the roller, and guides the inserted IC card 540 to the transport device 560.
The insertion port opening / closing door 534b is a device that includes a door that opens and closes the insertion port 534, a motor that drives the opening / closing operation, and the like.

The discharge port 535 is an outlet for discharging the IC card 540 transported by the transport device 560. The discharge port 535 is provided with a discharge card feeder 535a (see FIG. 10).
The discharge card feeding device 535a is a device that includes a roller, a motor that rotates the roller, and the like, and guides the IC card 540 conveyed by the conveyance device 560 to the discharge port 535.
The transport device 560 is a device that transports the IC card 540 in the transport direction Y on the conductive members 532A and 532B. Details of the transfer device 560 will be described later.

(Configuration near transfer device 560)
Next, a configuration near the transfer device 560 will be described.
FIG. 8 is a diagram illustrating an internal configuration of the relay communication device 530 according to the fifth embodiment.
FIG. 8A is a plan view of the transfer device 560 (a cross-sectional view taken along the line aa in FIG. 8B).
FIG. 8B is a side view of the transport device 560.
FIG. 8C is a perspective view of the vicinity of the transfer device 560.
The relay communication device 530 includes a transport device 560 and a rotary connector 570 (570a, 570b).
The conveying device 560 includes a lower belt 561, a lower belt driving roller 562 (562a, 562b), an upper belt 563, and an upper belt driving roller 564 (564a, 564b).

The lower belt 561 and the lower belt driving roller 562 are disposed on the lower side Z1 in the relay communication device 530.
The lower belt 561 is a flat belt wound around the lower belt driving roller 562. The lower belt 561 is made of an insulating material.
The lower belt driving rollers 562a and 562b are two rollers that rotate the lower belt 561. One of the lower belt driving rollers 562a and 562b is provided with a motor, and rotates the lower belt 561 so that the upper portion of the wound lower belt 561 rotates in the transport direction Y.

The upper belt 563 and the upper belt driving roller 564 are the same devices as the lower belt 561 and the lower belt driving roller 562, and are arranged on the upper side Z2 in the relay communication device 530.
The rotary connector 570 is a connector that relays the wires 531a and 531b from the relay loop antenna 531 and the wires 532a and 532b from the conductive members 532A and 532B. The rotary connector 570 is rotatable between one end side and the other end side. Accordingly, the wirings 531a and 531b can maintain continuity with the wirings 531a and 531b from the relay loop antenna 531 without being entangled even if they rotate following the conductive members 532A and 532B.

The conductive members 532A and 532B and the relay loop antenna 531 are connected using the rotary connector 570 as long as the relay loop antenna 531 can maintain continuity with respect to the rotating conductive members 532A and 532B. It is not limited to. For example, a connection terminal that is in sliding contact with the conductive members 532A and 532B may be connected to the relay loop antenna 531.
Further, for example, metallic rollers that are wound around the conductive members 532A and 532B and drive the conductive members 532A and 532B are provided independently, and the relay loop antenna 531 and the conductive members 532A and 532B are interposed via the rollers. May be connected.

With the above configuration, the transport device 560 sandwiches the IC card 540 inserted into the insertion slot 534 (see FIG. 7) between the conductive members 532A and 532B and the upper belt 563, and the lower belt 561 and the upper belt 563 are driven to rotate. As a result, the IC card 540 is transported to the downstream side Y2 in the transport direction Y.
Further, the transport device 560 transports the IC card 540 in a state where the conductive plates 542A and 542B of the IC card 540 and the conductive members 532A and 532B are arranged to face each other. For this reason, the conductive members 532A and 532B can maintain electrostatic coupling between the conductive plates 542A and 542B of the IC card 540 being conveyed.
Further, the conductive members 532A and 532B function so as to transport the IC card 540 in the transport direction Y by being rotationally driven with the IC card 540 sandwiched therebetween. That is, the conductive members 532 </ b> A and 532 </ b> B also function as a part of the transport device 560 and also serve as a part of the transport device 560. For this reason, the relay communication device 530 can be simplified in configuration.

(Communication stability due to deviation during transportation)
Next, communication stability associated with a deviation during the conveyance of the IC card 540 will be described.
FIG. 9 is a plan view of the IC card 540 according to the fifth embodiment and a plan view for explaining the displacement of the IC card 540.
As shown in FIG. 9A, the conductive plates 542A and 542B of the IC card 540 are arranged side by side along the longitudinal direction of the IC card 540.
For example, the outer shape of the IC card 540 is a rectangle having a long side × short side of 57.5 mm × 25 mm, and the outer shape of the conductive plates 542A and 542B is a rectangle having a long side × short side of 25 mm × 20 mm. .

As shown in FIG. 9B, the transport device 560 of the relay communication device 530 transports the IC card 540 so that the transport direction Y and the long sides 542a of the conductive plates 542A and 542B are orthogonal to each other.
Thereby, even if the IC card 540 is shifted in the left-right direction X (direction perpendicular to the transport direction Y (long side direction)), the conductive plates 542A and 542B of the IC card 540 and the conductive members 532A and 532B of the relay communication device 530 are used. Since the reduction rate of the area facing each other is reduced, the tolerance of misalignment can be improved and the communication stability can be improved.

The fact that the area reduction rate due to the shift is small will be described.
In the IC card 140 of FIG. 9C, the conductive plates 142A and 142B are elongated in the longitudinal direction of the IC card 140 and arranged side by side in the direction of the short side 142b. In the planar shape, the area of the IC card 540 is equal to the area of the IC card 140. Therefore, the length of each conductive plate in the transport direction Y is “L20 <L30”.
For example, consider a case where the IC card 540 and the IC card 140 are shifted by the length Δ in the left-right direction X as shown in FIGS. 9B and 9C. In the case of the IC card 540, the area where the conductive plates 542A, 542B and the conductive members 532A, 532B face each other decreases by “Δ × L20”, while the IC card 140 decreases by “Δ × L30”. Since “L20 <30”, “Δ × L20 <Δ × L30” holds.

As described above, the IC card 540 has a smaller amount of area reduction due to the shift than the IC card 140, and can improve communication stability.
When the IC card 540 and the IC card 140 are displaced in the transport direction Y, the area is not reduced in any case, and the same communication stability can be maintained.

  The transport device 560 transports the IC card 540 so that the longitudinal direction of the IC card 540 becomes the transport direction Y and the card surface faces the vertical direction. As a result, the conductive plates 542A and 542B are arranged side by side in the left-right direction X (the direction orthogonal to the transport direction Y), and the long side direction of the conductive plates 542A and 542B matches the transport direction Y of the IC card 540.

  Accordingly, the transport device 560 can always arrange the conductive plates 542A and 542B and the conductive members 532A and 532B to face each other from the upstream side Y1 to the downstream side Y2 on the conductive members 532A and 532B. For this reason, the communication system 510 can perform communication processing while carrying the IC card 540.

(Card alignment mechanism)
Next, the alignment mechanism of the IC card 540 at the time of card insertion and ejection will be described.
FIG. 10 is a plan view schematically illustrating the transport device 560, the insertion port 534, and the discharge port 535 according to the fifth embodiment.
IC card alignment devices 534c and 535c are provided inside the insertion port 534 and the discharge port 535, respectively.
When the IC card 540 is inserted into the insertion port 534 so that the longitudinal direction is the conveyance direction Y, the IC card 540 is inserted into the conveyance device 560 by the insertion card feeding device 534a. While being guided, the IC card 540 is rotated and aligned so that the longitudinal direction (that is, the direction in which the pair of conductive plates 542A and 542B are arranged) is the left-right direction X (the direction orthogonal to the transport direction Y). It is a device to let you. The IC card aligning device 534c includes a protrusion 534d that protrudes or retracts, and drives these to align the IC card 540. The configuration of the IC card aligning device 534c is not limited to this, and other known techniques for rotating a card to be conveyed can be used.

  With the above configuration, the communication system 510 can guide the IC card 540 to the transport device 560 so that the conductive members 532A and 532B and the conductive plates 542A and 542B are opposed to each other, and the IC card 540 is elongated in the longitudinal direction. Even so, it is easy to insert into the insertion port 534.

  The IC card aligning device 535c of the discharge port 535 is in the longitudinal direction while the IC card 540 transported in a state where the longitudinal direction is the left-right direction X by the transport device 560 is guided to the discharge port 535 by the discharge card feeding device 535a. Is an apparatus for rotating and aligning so as to be in the transport direction Y. The configuration of the IC card alignment device 535c is the same as that of the IC card alignment device 534c.

  Note that when the user inserts the IC card 540 into the insertion slot 534, the user may insert the IC card 540 after rotating it slightly even if the longitudinal direction is the left-right direction X. . Even in this case, by providing a device similar to the IC card aligning device 534c, the IC card 540 can be aligned and communication stability can be improved.

(Operation of Communication System 510)
Next, the operation of the communication system 510 according to the embodiment will be described.
FIG. 11 is a flowchart of the operation of the communication system 510 according to the fifth embodiment.
(IC card insertion processing)
In S1, as shown in FIGS. 6 and 7, when the user inserts the IC card 540 into the insertion port 534 at the entrance 510a, the detection unit (not shown) such as an optical sensor in the insertion port 534 is inserted. The IC card 540 is detected, and the detection information is output to the relay control unit 537. The relay control unit 537 drives the insertion card feeding device 534a according to the output of the detection unit, and guides the inserted IC card 540 to the transport device 560.
In S <b> 2, the relay control unit 537 closes and drives the insertion port opening / closing door 534 b based on the output of the detection unit of the insertion port 534 so that another IC card 540 cannot be inserted from the insertion port 534. The reason why the insertion opening / closing door 534b is driven to close is that it is difficult to determine which IC card 540 the reader / writer 521 is communicating with when another IC card 540 is inserted during the communication processing of the IC card 540. This is because it becomes a cause of abnormality in communication processing.
The user continues walking from the entrance 510a to the exit 510b.

(Card transport processing)
In S3, when a detection unit (not shown) such as an optical sensor upstream of the conductive members 532A and 532B detects the IC card 540 guided by the insertion card feeder 534a, the detection information is output to the relay control unit 537. . The relay control unit 537 drives the transport device 560 based on the output of the detection unit to start transporting the IC card 540.
(Communication processing)
In S4, while the IC card 540 is transported in the transport direction Y on the conductive members 532A and 532B, the R / W loop antenna 521a is connected to the relay loop antenna 531 by an electromagnetic induction method, and the conductive members 532A and 532B are IC cards. It is electrostatically coupled to 540 conductive plates 542A, 542B.
Thereby, the ticket gate control unit 527 starts transmission / reception of information with the IC chip 541 of the IC card 540 moving on the conductive members 532A and 532B.
In S5, the ticket gate control unit 527 reads information from the IC chip 541 and starts writing as communication processing. The ticket gate control unit 527, for example, reads information on the IC chip 541 to authenticate whether the boarding section is appropriate, and writes information on entry / exit from the ticket gate of the user to the IC chip 541.

(Transfer stop processing)
In S6, when the IC card 540 is transported to the stop range C (see FIG. 8) on the downstream side Y2 on the conductive members 532A and 532B, the detection unit such as an optical sensor disposed in the stop range C is transported. The IC card 540 is detected, and the detection information is output to the relay control unit 537. The relay control unit 537 stops driving of the transport device 560 based on the output of the detection unit and causes the IC card 540 to stay in the stop range C.

(Communication end determination process)
In S <b> 7, the relay control unit 537 determines whether communication is being performed between the ticket gate control unit 527 and the IC chip 541 based on the monitoring contents of transmission / reception between the ticket gate control unit 527 and the IC chip 541. When the relay control unit 537 determines that communication is being performed between the ticket gate control unit 527 and the IC chip 541 (S7: YES), the relay control unit 537 proceeds to S71. S7: NO), the process proceeds to S12.
In S71, the relay control unit 537 maintains the state where the IC card 540 is retained in the stop range C, and repeats the processing from S7. Thereby, the relay control unit 537 stays the IC card 540 in the stop range C until the communication is completed (S7: NO).
As a result, the relay control unit 537 does not need to match the communication processing time and the conveyance speed, so that the conveyance device 560 can be easily controlled.
Further, the ticket gate system 501 can reduce the occurrence of abnormality due to communication processing delay. The reason is as follows.
For example, even if the transport speed is set so that “time required for transport> time required for communication (no retry)”, if a communication error occurs and retry processing is performed, “time required for transport <communication The time required for the process (including retry process) ”is reached, and the communication process may not be completed when the transfer is completed, and the communication may be determined to be abnormal. In contrast, the ticket gate system 501 maintains the state in which the IC card 540 stays in the stop range C until the relay control unit 537 completes communication, so that an abnormality occurs due to communication processing delay due to retry or the like. Can be reduced.

In S8, the ticket gate control unit 527 determines whether the information on the boarding period is appropriate, that is, whether the result of the communication process is normal, based on the contents of transmission / reception with the IC chip 541. .
When it is determined that the result of the communication process is normal (S8: YES), the ticket gate control unit 527 proceeds to S9. On the other hand, when it is determined that the result of the communication process is abnormal (S8: NO) , Go to S81.

(Passing door opening / closing process)
In S9, the ticket gate control unit 527 drives the passing door 522 to open.
In S10, when the detection unit such as an optical sensor detects that the user has passed the ticket gate toward the exit 510b, the ticket gate control unit 527 drives the passage door 522 to close based on the output of the detection unit. Or after a lapse of a certain time, the passing door 522 is driven to close, and the processing on the electromagnetic induction ticket gate 520 side is terminated, and reception of the next IC card 540 is started (S11).
(Abnormality notification processing)
In S81, the ticket gate control unit 527 maintains the passage door 522 in a closed state, and in S82, the sound output unit 524 outputs a warning sound, and the display unit displays an indication that the IC card 540 is inappropriate. Then, the user is notified that the result of the communication process is abnormal. Then, the processing on the electromagnetic induction ticket gate 520 side is terminated, and reception of the next IC card 540 is started (S11).

(Card ejection processing)
In S12, the relay control unit 537 drives the discharge conveyance mechanism to discharge the IC card 540 conveyed to the stop range C from the discharge port 535.
In addition, since the IC card 540 is a one-time ticket such as a ticket, an accommodation device for accommodating the IC card 540 may be provided at the time of participation. In this case, the relay control unit 537 (communication result determination control unit) performs communication processing between the ticket gate control unit 527 and the IC chip 541 based on the monitoring contents of transmission / reception between the ticket gate control unit 527 and the IC chip 541. What is necessary is just to determine whether it completed normally. When the relay control unit 537 determines that the operation is normally completed, the relay control unit 537 controls the storage device to store the IC card 540 in the storage container. The card 540 may be discharged.

(Insertion opening drive processing)
In S13, when a detection unit (not shown) such as an optical sensor provided in the discharge port 535 detects that the user has pulled out the IC card 540 discharged from the discharge port 535, the detection information is transmitted to the relay control unit. Output to 537. The relay control unit 537 opens the insertion opening / closing door 534b based on the output of the detection unit, ends the processing on the relay communication device 530 side, and starts accepting the next IC card 540 (S14). .
Thereby, until the communication processing of the IC card 540 is normally completed and the opening opening / closing door 534b of the passage door 522 is completely opened (S10), or until the restoration processing is completed when the communication processing is abnormal. The insertion of another IC card 540 into the insertion slot 534 can be prevented.

Through the above processing, when the communication result is normal (S8: YES), the user pulls out the IC card 540 (S12) discharged from the discharge port 535, and passes through the open door 522 that is driven to open. Then, the communication system 510 can pass through the outlet 510b.
On the other hand, when the communication result is abnormal (S8: NO), the user cannot pass through the communication system 510 because the passing door 522 is maintained at the closed position (S81), and returns to the entrance 510a. The IC card 540 (S12) discharged from the discharge port 535 can be extracted and re-inserted into the insertion port 534, or the IC card 540 can be recognized as inappropriate and a clearing process or the like can be performed.

  Also, since the conductive members 532A and 532B of the IC card 540 are belts that rotate in the transport direction Y, when the IC card 540 is transported, the conductive members 532A and 532B and the conductive plates 542A and 542B of the IC card 540 are close to each other. And maintain the opposite state. As a result, communication processing can be performed while transporting the IC card 540 using the time during which the user walks in the communication system 510, so that the gate access processing time can be shortened.

For example, a conventional electromagnetic induction type communication system can communicate even when the IC card 504 and the reader / writer are separated from each other by several tens of millimeters. Therefore, communication can be performed while the IC card 504 is approaching the reader / writer.
On the other hand, the communication distance between the IC card 540 and the reader / writer 521 of the electrostatic coupling communication system is about 2 mm as described above, and is shorter than that of the electromagnetic induction communication system. For this reason, communication is not started unless the IC card 540 is brought into close contact with the reader / writer 521. Therefore, even if the communication time between the IC card 540 and the reader / writer 521 is equivalent to the electromagnetic induction type communication system, the processing time experienced by the user is the amount of time to bring the IC card 540 closer to about 2 mm, become longer.
As described above, the communication system 510 according to the embodiment uses the time when the user walks from the entrance 510a toward the exit 510b to perform communication processing of the IC card 540, thereby reducing the processing time experienced by the user. I am trying. Thereby, the communication system 510 can suppress the congestion at the time of a user's passage, even if it uses an electrostatic coupling system.

  For example, in an electromagnetic induction communication system having a conventional transport device, the time for transporting the IC card 540 to the communicable area is “transport time 2 seconds”, and the time for communication processing after being stopped is “communication processing time” 1 second ", which took 3 seconds in total. In contrast, the communication system 510 according to the embodiment performs the communication process while transporting the IC card 540, and thus ends the communication process within “transport time 2 seconds”. For this reason, the processing time can be shortened by 1 second as compared with the prior art.

  As described above, in the communication system 510 of the present embodiment, the conductive members 532A and 532B move together with the IC card 540 and communicate with the conductive plates 542A and 542B of the IC card 540. Since communication processing can be performed while transporting 540, gate access processing time and the like can be shortened.

(Sixth embodiment)
Next, a sixth embodiment to which the present invention is applied will be described.
Note that, in the following description and drawings, the same reference numerals or the same reference numerals are given to portions that perform the same functions as those of the above-described fifth embodiment, and overlapping descriptions will be omitted as appropriate.
FIG. 12 is a block diagram of a ticket gate system 601 according to the sixth embodiment.
FIG. 13 is a diagram illustrating an internal configuration of the relay communication device 630 according to the sixth embodiment.
FIG. 13A is a plan view of the transfer device 660 (a cross-sectional view taken along the line aa in FIG. 15B).
FIG. 13B is a side view of the transport device 660.

As shown in FIG. 12, the ticket gate system 601 of this embodiment is the same as that of the fifth embodiment in that it is connected to a server 502 and the like, and the configuration of the communication system 610 is different from that of the fifth embodiment. Different. In FIG. 12, the conventional electromagnetic induction ticket gate 503 and the like are not shown.
The electromagnetic induction ticket gate 620 includes seven reader / writers 621 (621-1 to 621-7) and seven R / W loop antennas 621a (621a-) connected to the reader / writers 621-1 to 621-7, respectively. 1-621a-7).
The relay communication device 630 includes seven relay loop antennas 631 (631-1 to 631-7) and seven sets of conductive members 632A and 632B (632A-) connected to the relay loop antennas 631-1 to 631-7. 1, 632B-1 to 632A-7, 632B-7).

  The R / W loop antennas 621a-1 to 621a-7 of the seven reader / writers 621-1 to 621-7 are respectively connected to the relay loop antennas 631-1 to 631-7 of the relay communication device 630 by electromagnetic induction. Connected by.

As shown in FIG. 13, the conductive members 632 </ b> A- 1 and 632 </ b> B- 1 are arranged in the left-right direction X and attached to the outer periphery of the lower belt 661. The same applies to the other conductive members 632A-2, 632B-2 to 632A-7, 632B-7. The seven sets of conductive members 632A-1, 632B-1 to 632A-7, 632B-7 are arranged on the lower belt 661 in the transport direction Y.
Therefore, the seven sets of conductive members 632A-1, 632B-1 to 632A-7, 632B-7 can be electrostatically coupled independently between different IC cards 640.
In the scene of FIG. 13, the conductive members 632A-1, 632B-1 to 632A-3, and 632B-3 each have three IC cards 640-1 to 640-3, and the conductive members 642A-1, 642B-1 to 642A- This is a scene in which the transport device 660 transports the IC cards 640-1 to 640-3 in the transport direction while being electrostatically coupled to 3,642B-3.

  As described above, in the communication system 610 of the present embodiment, the plurality of conductive members 632A and 632B can communicate with different IC cards 640 at the same time, so that the gate access processing time can be further shortened.

(Seventh embodiment)
Next, a seventh embodiment to which the present invention is applied will be described.
FIG. 14 is a block diagram of a communication system 710 according to the seventh embodiment.
FIG. 15 is a diagram illustrating an internal configuration of the relay communication device 730 according to the seventh embodiment.
FIG. 15A is a plan view of the transfer device 760 (a cross-sectional view taken along the line BB in FIG. 15B).
FIG. 15B is a side view of the transport device 760.
As illustrated in FIG. 14, the relay communication device 730 includes a relay storage unit 736, a relay control unit 737, a transport device 760, and conductive members 732A and 732B (732A-1, 732B-1 to 732A-, 732B-1). .

The relay storage unit 736 is a storage device such as a semiconductor memory element for storing programs, information, and the like necessary for the operation of the relay communication device 730.
The relay control unit 737 is a control unit for comprehensively controlling the relay communication device 730, and includes, for example, a CPU. The relay control unit 737 implements various functions according to the present invention in cooperation with the hardware described above by appropriately reading and executing various programs stored in the storage unit 726.

As shown in FIG. 15, the configuration of the transport device 760 is obtained by increasing the number of combinations of the conductive members 732 </ b> A and 732 </ b> B from that of the sixth embodiment and removing the configuration of the upper belt and the like. The transport device 760 transports the IC card 740 and rotationally moves the 14 sets of conductive members 732A-1, 732B-1 to 732A-14, 732B-14 in the transport direction Y.
The IC card 740 to be transported is in a state before the individual piece process (before cutting) described above, arranged in the transport direction Y, and connected in a sheet form by the lower layer and the upper layer (base material).
The sheet-like IC card 740 is wound around a delivery roller 765a and a take-up roller 765b described later.
The conveying device 760 includes a lower belt 761, a lower belt driving roller 762 (762a, 762b), a delivery roller 765a, and a take-up roller 765b.

The delivery roller 765a is a roller that stores the IC card 740 before communication in a reel shape. The delivery roller 765a is disposed on the upstream side Y1 of the transport device 760.
The take-up roller 765b is a roller that stores the IC card 740 after communication in a reel shape. The take-up roller 765b is provided with a drive motor (not shown), and is driven to rotate in the take-up direction. This drive motor is controlled by the relay control unit 737.
With the above configuration, when the take-up roller 765b is driven to rotate, the IC card 740 of the feed roller 765a can be sent out and taken up by the take-up roller 765b. Thereby, the IC card 740 is transported in the transport direction Y.

As shown in FIG. 15, the conductive members 732A and 732B have the length in the transport direction Y smaller than that in the sixth embodiment, and the pitch between the combinations of the conductive members 732A and 732B is shortened. Is more than the sixth embodiment. The arrangement pitch of the conductive members 732A and 732B is the same as the arrangement pitch of the IC card 740.
Relay loop antennas 731-1 to 731-14 are connected to the conductive members 732A-1, 732B-1 to 732A-14, 732B-14, respectively. The relay loop antennas 731-1 to 731-14 communicate with the reader / writers 721-1 to 721-14.

The configurations of the lower belt 761 and the lower belt driving roller 762 are the same as in the sixth embodiment.
On the other hand, the transport device 760 of this embodiment is not provided with the upper belt 663 (see FIG. 13) or the like as in the sixth embodiment. This is because, as described above, the IC card 740 is conveyed by the feed roller 765a and the take-up roller 765b. Note that an upper belt or a pressing roller may be provided to prevent the IC card 740 being conveyed from being lifted from the conductive members 732A and 732B and performing stable communication processing.

An operation of the communication system 710 will be described.
The communication system 710 performs communication processing with the IC card 740 according to the following steps.
(1) IC card transport process (information storage medium transport process)
As illustrated in FIG. 15, the relay control unit 737 drives the take-up roller 765 b to transport the plurality of IC cards 740 connected in a sheet shape in the transport direction Y.

(2) Conductive Member Moving Step The relay control unit 737 moves the plurality of conductive members 732A and 732B in the transport direction Y in synchronization with the plurality of IC cards 740.
As a method for obtaining synchronization, an optical sensor for detecting the conveyance speed and position of the IC card 740 and an optical sensor for detecting the movement speed and position of the conductive members 732A and 732B may be provided. Then, based on these detections, the relay control unit 737 may make the movement speeds of the IC card 740 and the conductive members 732A and 732B the same, and synchronize the IC card 740 and the conductive members 732A and 732B.

(3) Electrostatic coupling communication process The R / W loop antennas 721a-1 to 721a-14 of the electromagnetic induction communication device 720 and the relay loop antennas 731-1 to 731-14 of the relay communication device 730 are independent by electromagnetic induction. And communicate.
On the other hand, the plurality of conductive members 732A and 732B moving in the conductive member moving step and the conductive plates 742A and 742B of the plurality of IC cards 740 being conveyed in the IC card conveying step are electrostatically coupled independently.
For example, FIG. 15 shows that six conductive cards 732A-1, 732B-6 of six IC cards 740-1 to 740-6 include six sets of conductive members 732A-1, 732B-1. This is an example in which ˜732A-6 and 732B-6 are independently electrostatically coupled. Thereby, the control unit 727 includes R / W loop antennas 721a-1 to 721a-6, relay loop antennas 731-1 to 731-6, conductive members 732A-1, 732B-1 to 732A-6, 732B-6, Communication processing is performed with the IC chip of the IC card 740-1 via the conductive plates 742A-1, 742B-1 to 742A-6, 742B-6.

Note that the above steps are performed simultaneously, the relay communication device 730 sequentially carries the IC card 740, and the electromagnetic induction communication device 720 sequentially reads the information on the IC card 740.
Further, the communication system 710 includes the relay storage unit 736 and the relay control unit 737 of the relay communication device 730 in the electromagnetic induction communication device 720, and the relay communication device 730 and the electromagnetic induction communication device 720 are configured as an integrated device configuration. Good.

  Furthermore, the conductive members 732A and 732B may be arranged in the transport direction Y instead of the left-right direction X. In this case, since the conductive members 732A and 732B are alternately arranged, even the plurality of IC cards 340 of the third embodiment can communicate. The same applies to the sixth embodiment.

As described above, the communication system 710 of the present embodiment can communicate independently with the IC card 740 moving in the transport direction Y. Thereby, for example, the communication system 710 can shorten the inspection time of the IC card 740 and the like.
The communication system 710 can communicate with the IC card 740 connected by a base material. Thus, for example, even when the IC card 740 is shipped as a reel and cut into pieces by a ticket vending machine, such as when the IC card 740 is used for a ticket, the inspection at the time of shipment from the factory is performed. Etc. can be performed.

In the present embodiment, the IC card 740 is inspected by the communication system 710 and then wound around the winding roller 765b in a reel shape. However, the present invention is not limited to this.
The IC card 740 may be separated into a non-defective product and a defective product after being inspected by the communication system 710 and cut into pieces without being wound.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications and changes can be made as in the modifications described later, and these are also included in the present invention. Within the technical scope. In addition, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments. It should be noted that the above-described embodiment and modifications described later can be used in appropriate combination, but detailed description thereof is omitted.

(Deformation)
(1) In the embodiment, the reader / writer and the relay communication device have shown an example in which communication is performed by an electromagnetic induction method, but the present invention is not limited to this. For example, the reader / writer and the relay communication device may communicate by an electromagnetic coupling method. In this case, the IC chip provided in the IC card may be of a type that can communicate by electromagnetic coupling.
The electromagnetic coupling is in principle the same as electromagnetic induction. Further, the electromagnetic coupling type communication refers to communication by electromagnetic induction in a stationary state with the card side antenna and the reader / writer side antenna facing each other.

(2) In the embodiment, the notification unit that notifies the communication abnormality has been shown as an example provided in the electromagnetic induction ticket gate, but is not limited thereto. The notification unit may be provided in the relay communication device. In this case, when the IC card is transported to the stop range, the relay control unit determines whether there is a communication abnormality based on the contents of transmission / reception between the ticket gate control unit to be monitored and the IC chip. What is necessary is just to control an alerting | reporting part.

(3) In the embodiment, the relay communication device is an example in which the relay loop antenna, the conductive member, the transport device, and the like are integrally incorporated in one housing, but is not limited thereto. If these are systems that function as a unit, they may be provided in separate housings.

(4) In the embodiment, the example in which the relay communication device is provided in the railway ticket gate system has been described, but the embodiment is not limited thereto. This system can be applied to various systems such as various systems such as electronic money, employee ID system, and logistics management. For example, when an electromagnetic induction reader / writer for electronic money is provided in a register system such as a store, it is easy to provide a relay communication device that communicates with the reader / writer as in the embodiment. In addition, a conventional register system can be applied, and even a new register system can be introduced at a low cost.

10, 510, 710 Communication system 20, 720 Electromagnetic induction communication device 21, 521, 621, 721 Reader / writer 21a, 521a, 621a, 721a R / W loop antenna 26, 726 Storage unit 27, 727 Control unit 30, 530, 630 , 730 Relay communication device 31, 531, 631, 731 Relay loop antenna 32A, 32B, 532A, 532B, 632A, 632B, 732A, 732B Conductive member 40, 240, 340, 540, 640, 740 IC card 41, 241, 341 , 541 IC chip 42A, 42B, 242A, 242B, 342A, 342B, 542A, 542B, 642A, 642B, 742A, 742B Conductive plate 43, 243, 343, 443 Lower layer 44, 244, 344 Upper layer 50, 250A , 250B, 350, 450A, 450B Conductive thin plate 501, 601 Ticket gate system 520, 620 Electromagnetic induction ticket gate 523 Monitor 524 Audio output unit 526 Ticket gate storage unit 527 Ticket gate control unit 534c, 535c IC card alignment device 560, 660, 760 Transport device

Claims (11)

An electromagnetic induction communication device comprising a communication device-side loop antenna that communicates using an electromagnetic induction method or an electromagnetic coupling method, and a control unit that performs communication processing via the communication device-side loop antenna;
A relay loop antenna that communicates with the communication device-side loop antenna by an electromagnetic induction method or an electromagnetic coupling method, and a pair of relay conductive members that are connected to both ends of the relay loop antenna and disposed through slits and have conductivity. Used in a communication system comprising a relay communication device comprising
An information storage medium manufacturing method for manufacturing an information storage medium that performs communication processing with the control unit of the electromagnetic induction communication device via the relay communication device in a medium arrangement direction that is one direction. ,
A conductive plate forming step of separately forming a plurality of combinations of a pair of electrically independent conductive plates on an insulating substrate; and
The electromagnetic induction system or the electromagnetic coupling system communicates with the pair of conductive plates formed in the conductive plate forming step so as to straddle a slit formed between the pair of conductive plates and deeper than the surface of the insulating base. An IC chip placement process for placing possible IC chips ,
In the IC chip arrangement step, an insulating paste is arranged between the slit of the insulating base and the IC chip,
An information storage medium manufacturing method characterized by the above. In the information storage medium manufacturing method according to claim 1,
A conductive thin plate forming step of forming a conductive thin plate on the insulating substrate;
The conductive plate forming step includes a conductive thin plate removing step of removing a removal region which is a part of the conductive thin plate formed in the conductive thin plate forming step and separating the conductive plate,
An information storage medium manufacturing method characterized by the above. In the information storage medium manufacturing method according to claim 2,
In the conductive thin plate removing step, a removal region that is a part of the conductive thin plate is removed by cutting;
An information storage medium manufacturing method characterized by the above. In the information storage medium manufacturing method according to claim 3,
The arrangement direction of the pair of conductive plates is an orthogonal direction orthogonal to the medium arrangement direction,
The conductive thin plate removing step includes
A medium arrangement direction removing step of removing the removal region along the medium arrangement direction by cutting to form the slit;
An orthogonal direction removing step of removing the removal region along the orthogonal direction by cutting,
An information storage medium manufacturing method characterized by the above. In the information storage medium manufacturing method according to claim 3,
The arrangement direction of the pair of conductive plates is an orthogonal direction orthogonal to the medium arrangement direction,
The conductive thin plate forming step forms a pair of the conductive thin plates on the insulating base material in the orthogonal direction so as to have the slits,
The conductive thin plate removing step includes an orthogonal direction removing step of removing the removal region along the orthogonal direction of the conductive thin plate by cutting;
An information storage medium manufacturing method characterized by the above. In the information storage medium manufacturing method according to claim 3,
The arrangement direction of the pair of conductive plates is the medium arrangement direction,
The conductive thin plate removing step includes
A pair of plate-removing steps for removing the removal region between the pair of conductive plates along the orthogonal direction perpendicular to the medium arrangement direction by cutting to form the slit;
An inter-combination removal step of removing a removal region between the plurality of combinations along the orthogonal direction by cutting;
An information storage medium manufacturing method characterized by the above. In the information storage medium manufacturing method according to claim 2,
In the conductive thin plate removing step, the removal region is removed by etching,
An information storage medium manufacturing method characterized by the above. In the information storage medium manufacturing method of any one of Claim 1- Claim 7,
The conductive plate forming step includes forming the conductive plate by a plating method;
An information storage medium manufacturing method characterized by the above. In the information storage medium manufacturing method of any one of Claim 1- Claim 7,
The conductive plate forming step includes forming the conductive plate by conductive ink printing.
An information storage medium manufacturing method characterized by the above. In the information storage medium manufacturing method of any one of Claim 1- Claim 9,
In the conductive plate forming step, the interval between the conductive plates adjacent in the medium arrangement direction is made sufficiently larger than the slit between the pair of conductive plates,
An information storage medium manufacturing method characterized by the above. The information storage medium manufacturing method according to any one of claims 1 to 10,
Cutting between the combinations of the insulating base material, and comprising an individual piece process to make this information storage medium into pieces,
An information storage medium manufacturing method characterized by the above.

Images