JP2024020919A - Rfid tag and manufacturing method of the same, and rfid tag roll - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an RFID tag which achieves a low price and excellent productivity.

SOLUTION: An RFID tag 1 includes: metallized paper 4 having a paper substrate 2 and a metallized layer 3 which is formed on the paper substrate 2 wholly excluding a belt-like gap part 3b and a part or the whole of which configures two parallel antennas 3a, 3a; and an IC chip 5 mounted on the two antennas 3a, 3a in a manner to straddle the gap part 3b.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2024,JPO&INPIT

Description

TECHNICAL FIELD The present invention relates to an RFID tag with excellent productivity that can handle a wide variety of products in small quantities, a method for manufacturing the RFID tag, and an RFID tag roll.

RFID (Radio Frequency Identification) is a contactless automatic recognition technology that reads or rewrites information by communicating radio waves between a tag with a built-in memory and a reading device. It is possible to read multiple RFID tags at once from a remote location and instantly identify individuals. For example, even if a product is packed in a cardboard box, it can be read all at once from outside the box, increasing the efficiency of inspections and inventory checks. Expectations are high for the future in a variety of fields such as retail, manufacturing, distribution, education, services, and medicine. The RFID tag used is also called an IC tag, RF tag, RFID label, wireless tag, etc.

The basic configuration of a conventional RFID tag 101 is a mount 104 having a predetermined shape, an antenna 103a and an IC chip 105 transferred from an existing resin film type inlay 106 onto a partial area on the mount 104, and an IC chip 105. A cover mount 104 and a printing paper 7 having the same shape were provided from the chip 105 side. Information such as the product name, model number, price, bar code, etc. related to the individual product to which the RFID tag 101 is attached is usually printed on the printing paper 7 at the various sites described above before the RFID tag 101 is attached to the product. It will be printed.

Further, a method for manufacturing such an RFID tag 101 is as follows (see FIGS. 3 and 4).
First, an existing inlay 106 is prepared. Specifically, a long metal foil laminated film made by laminating metal foil to the resin film base material 102 is used (step S101 in FIG. 3), and the film is formed by patterning the metal foil by chemical etching. After obtaining a large number of antennas 103a continuously arranged in the longitudinal direction (step S102 in FIG. 3), an IC chip 105 (hereinafter referred to as In this book, the inlay 106 includes not only a single IC chip but also an IC chip, a strap substrate that functions as a carrier for the IC chip, and a strap with conductive pads formed on the strap substrate. An inlay roll 106R is obtained by winding up a long object including a large number of consecutive inlays 106 (step S103 in FIG. 3). Before proceeding to the next step, as shown in FIG. 4(a), the continuous body of inlays 106 (with glue and half-cuts not shown) unwound from the inlay roll 106R is divided into strips of inlays 106. To divide.
Next, as shown in FIG. 4(b), strip-shaped inlays 106 are pasted onto the elongated mount 104 at a predetermined pitch (step S104 in FIG. 3). At this time, it is pasted with glue so that the IC chip 105 side is on the outside.
Next, as shown in FIG. 4(c), the resin film base material 102 other than the area around the IC chip 105 with the half-cut as the boundary is peeled off (step S105 in FIG. 3). That is, the electrical structure of the strip-shaped inlay 106 is transferred onto the mount 104.
Next, as shown in FIG. 4(d), the mount 104 having the antenna 103a and the IC chip 105 and the long printing paper 7 with adhesive on the back are passed between the laminating rollers 20, and the antenna 103a and Both are bonded together with the IC chip 105 sandwiched therebetween to obtain a bonded body 109 (step S106 in FIG. 3).
Finally, as shown in FIG. 4(e), the long bonded body 109 is continuously punched out using the punching die 26 to form RFID tags 101 of a desired shape (step S107 in FIG. 3). ), and this is wound up as an RFID tag roll 101R.

However, in the existing inlay 106 that uses a relatively expensive resin film base material 102 and metal foil, the mounting pitch between adjacent IC chips 105 is extremely small when the inlay roll 106R is made up of a continuous inlay roll 106R (Fig. 4(a)), and the inlay roll 106R is divided into strips and pasted onto the mount 104 (see FIG. 4(c)), thereby reducing costs.
Therefore, when attaching the strip-shaped inlays 106 that are divided into pieces from the inlay roll 106R to the mount 104 (see FIG. 4(b)), it is necessary to arrange them one by one at a pitch that matches the size of the RFID tag 101. should not. Further, each time the size of the RFID tag 101 changes to a different type, it is necessary to adjust the bonding pitch of the inlay 106. As a result, these factors have become an impediment to productivity improvement.

Therefore, an object of the present invention is to solve the above problems and provide an RFID tag that is inexpensive and has excellent productivity.

A plurality of aspects will be described below as means for solving the problem. These aspects can be arbitrarily combined as necessary.

An RFID tag according to an aspect of the present invention includes a paper base material and a vapor deposition layer that is formed entirely on the paper base material except for a band-shaped gap, and that partially or entirely constitutes two antennas arranged in parallel. and an IC chip mounted across the gap between the two antennas.
In the RFID tag constructed in this way, a structure having an antenna pattern (metal-deposited paper type inlay) can be obtained by using relatively inexpensive vapor-deposited paper and simply forming slits in the vapor-deposited layer. The cost of this inlay itself can be easily suppressed.
Furthermore, since the inlay is inexpensive, there is no need to reduce the mounting pitch between adjacent IC chips in the state of the inlay roll as in the case of existing inlays, and the pitch can be made approximately the same as the external size of the RFID tag. In other words, there is no need to divide the inlay from the inlay roll and paste it on the mount at a pitch that matches the size of the RFID tag. Therefore, the RFID tag has excellent productivity.

The above-mentioned RFID tag may further include a printing paper stuck on the vapor-deposited paper and the IC chip so as to cover it from the IC chip side.
With the RFID tag configured in this manner, information such as the product name, model number, price, bar code, etc. related to the individual product to which the RFID tag is attached can be printed during the manufacture of the RFID tag or after shipping.

The RFID tag to which the above-described printing paper is attached from the IC chip side may further include a spacer layer surrounding the IC chip between the vapor-deposited paper and the printing paper.
In an RFID tag configured in this way, the printing surface of the printing paper becomes smooth by surrounding the IC chip with a spacer layer, so the ink ribbon can be brought into uniform contact with the entire area to be printed on the printing surface and the ink layer will not fall off. It can be transferred.

In the RFID tag including the above-described spacer layer, the printing paper may be attached to the spacer layer with an adhesive provided on the surface of the spacer layer on the printing paper side.
In the RFID tag configured in this manner, since there is no glue between the printing paper and the IC chip, the printing paper and the IC chip will not adhere to each other. As a result, the adhesive strength between the IC chip and the antenna is maintained strong, and the risk of disconnection between the IC chip and the antenna is reduced.

In the RFID tag including the spacer layer described above, the thickness of the vapor-deposited paper and the thickness including the spacer layer to the printing paper may be the same or similar.
In an RFID tag configured in this way, the reactions of the base materials on both sides of the vapor deposited layer that make up the antenna to stresses such as shrinkage after inspection and deformation due to handling are made uniform, so mechanical damage to the vapor deposited layer is made uniform. This reduces the burden on users. As a result, damage to the antenna is reduced and the risk of disconnection within the antenna is reduced.

In the RFID tag to which the above-mentioned printing paper is attached from the IC chip side, the IC chip side of the printing paper may be made of a cushioning material, and the IC chip may be buried in the printing paper.
In the RFID tag configured in this way, the printing surface of the printing paper becomes smooth by embedding the IC chip in the IC chip side of the printing paper, so the ink ribbon can be brought into even contact with the entire area on the printing surface where you want to print. The ink layer can be transferred without falling off.

In the above-mentioned RFID tag in which printing paper is attached from the IC chip side, the printing paper is attached to the vapor-deposited paper with the IC chip in between, using glue provided on the printing paper side of the vapor-deposited paper. Good too.
In the RFID tag configured in this manner, since there is no glue between the printing paper and the IC chip, the printing paper and the IC chip will not adhere to each other. As a result, the adhesive strength between the IC chip and the antenna is maintained strong, and the risk of disconnection between the IC chip and the antenna is reduced.

In the above-mentioned RFID tag, the paper base material of the vapor-deposited paper may be a hard material.
By using a hard paper base material for the vapor-deposited paper, the RFID tag configured in this manner suppresses shrinkage after inspection and deformation due to handling, and reduces mechanical load on the vapor-deposited layer. It also reduces the load of the IC chip sinking into the vapor-deposited paper due to external pressure applied when the IC chip is mounted. As a result, damage to the antenna is reduced and the risk of disconnection within the antenna is reduced.

The above-mentioned RFID tag further includes a protective paper stuck on the vapor-deposited paper and the IC chip so as to cover it from the IC chip side, and the paper base material of the vapor-deposited paper has a smooth print on the side opposite to the vapor-deposited layer. It may also serve as printing paper.
In the RFID tag configured in this way, the paper base material of the vapor-deposited paper also serves as printing paper with a smooth printing surface on the side opposite to the vapor-deposited layer, so the step on the protective paper side is replaced by the recess of the printer surface plate. By arranging the ink ribbon so as to absorb the ink, the ink ribbon can be brought into uniform contact with the entire area to be printed on the printing surface, and the ink layer can be transferred without omission.

In the above-mentioned RFID tag attached from the IC chip side, the printing paper has a hole or a semi-transparent part on the vapor deposition layer, and the vapor deposition layer exhibits a metallic luster pattern through the hole or the semi-transparent part. You can leave it there.
In the RFID tag configured in this way, the vapor deposition layer exhibits a metallic luster pattern through the hole or semi-transparent part, so it is possible to create a metallic or mirror effect without worrying about antenna communication failure. By utilizing this technology, it will be possible to adopt designs that change due to reflection. Therefore, it is possible to expand the possibility of responding to the designer's requests regarding the design of the RFID tag.

RFID tags with the above-mentioned printed surface may be cut into the shape of the antenna corresponding to the frequency used when using the RFID tag, even if guidelines are displayed on the printing paper for each of the multiple frequencies used. good.
With an RFID tag configured in this way, it is easy to reduce the sensitivity of the RFID tag or shorten the communication distance depending on the purpose of use, the optimum sensitivity and communication distance for the environment of the store or other facility. You will be able to adjust the direction in which you want to move.

A method for manufacturing an RFID tag according to an aspect of the present invention includes a paper base material and two antennas formed entirely on the paper base material except for slit-like gaps, and partially or entirely parallel to each other. A method for producing the above-mentioned RFID tag comprising a vapor-deposited paper having a vapor-deposited layer and an IC chip mounted across two antennas across a gap, the method comprising: The method includes the steps of removing the vapor deposited layer in the gap by physical surface processing from the vapor deposited layer formed on the entire surface including the gap, and mounting the IC chip on the antenna.

In the RFID tag manufacturing method described above, the physical surface processing may be laser etching or router processing.

An RFID tag roll according to an aspect of the present invention includes a paper base material and a vapor deposition film formed entirely on the paper base material except for a slit-like gap, and a part or all of which constitutes two antennas arranged in parallel. It is a long item consisting of a large number of the above-mentioned RFID tags, each of which has a vapor-deposited paper layer and an IC chip mounted across two antennas across the gap, and is in the form of a roll. It is wound up in the winding.

The above-mentioned RFID tag roll may include a plurality of rows of continuous RFID tags in the width direction.

According to the RFID tag, the RFID tag manufacturing method, and the RFID tag roll of the present invention, since the RFID tag antenna is constructed using a vapor-deposited layer of vapor-deposited paper, it is possible to obtain an RFID tag at low cost and with excellent productivity. Can be done.

FIG. 1 is a cross-sectional view showing an example of an RFID tag according to the first embodiment. FIG. 2 is a schematic diagram showing an example of a method of printing on an RFID tag provided with printing paper. 1 is a flowchart illustrating an example of a manufacturing process of an RFID tag in the prior art. It is a perspective view showing an example of a manufacturing process of an RFID tag in the prior art. 3 is a flowchart illustrating an example of the manufacturing process of the RFID tag according to the first embodiment. It is a perspective view showing an example of a manufacturing process of the RFID tag concerning a 1st embodiment. FIG. 3 is a comparison diagram of the manufacturing process of the RFID tag according to the first embodiment and the process of the conventional technology. FIG. 3 is an explanatory diagram showing an example of obtaining RFID tags 1 of different shapes with the same inlay. FIG. 2 is a perspective view showing an example of the process of forming an antenna and mounting an IC chip using vapor-deposited paper. It is a perspective view which shows the example of a change of the antenna pattern in an inlay. FIG. 7 is a cross-sectional view showing an example of an RFID tag according to a second embodiment. FIG. 2 is a diagram illustrating printing on an RFID tag without surface smoothness. FIG. 7 is a diagram illustrating printing on an RFID tag according to a second embodiment. FIG. 3 is a diagram illustrating an example of a disconnection between an IC chip and an antenna due to adhesive on the back side of printing paper. FIG. 7 is a cross-sectional view showing an example of an RFID tag according to a third embodiment. FIG. 7 is a cross-sectional view showing an example of an RFID tag according to a fourth embodiment. FIG. 7 is a diagram illustrating absorption of the thickness of an IC chip by printing paper for an RFID tag according to a fourth embodiment. FIG. 7 is a cross-sectional view showing an example of an RFID tag according to a fifth embodiment. FIG. 7 is a diagram illustrating another example of disconnection between an IC chip and an antenna due to adhesive on the back side of printing paper. It is a figure explaining the manufacturing process of the RFID tag based on 5th Embodiment. FIG. 7 is a cross-sectional view showing an example of an RFID tag according to a sixth embodiment. FIG. 7 is a diagram illustrating absorption of the thickness of an IC chip by printing paper with respect to an RFID tag according to a sixth embodiment. FIG. 3 is a diagram illustrating an example of a wire breakage in an antenna. FIG. 7 is a cross-sectional view showing an example of an RFID tag according to an eighth embodiment. It is a figure explaining the manufacture and printing about the RFID tag concerning an 8th embodiment. FIG. 7 is an exploded view showing an example of an RFID tag according to a ninth embodiment. FIG. 7 is an exploded view showing another example of the RFID tag according to the ninth embodiment. FIG. 7 is a plan view showing an example of an RFID tag according to a tenth embodiment.

<First embodiment>
The RFID tag 1, the method for manufacturing the RFID tag 1, and the RFID tag roll 1R according to the first embodiment of the present invention will be explained using the drawings.
(1) Overview of RFID tag (1-1) RFID tag FIG. 1 is a cross-sectional view showing an example of an RFID tag according to the first embodiment.
The RFID tag 1 according to the first embodiment includes a vapor-deposited paper 4 having a vapor-deposited layer 3 constituting an antenna 3a, an IC chip 5 mounted on the vapor-deposited paper 4, and a printing paper 7 that covers these from the IC chip 5 side. (See Figure 1).

(1-2) Metallized Paper The vapor-deposited paper 4 constituting the RFID tag 1 will be described in more detail below.
As shown in FIG. 1, the metallized paper 4 constituting the RFID tag 1 in this embodiment is formed entirely on the paper base material 2 except for the band-shaped gap 3b, and is arranged in parallel. It includes a vapor deposition layer 3 that constitutes two antennas 3a. Since the base material of the vapor-deposited paper 4 is paper, the amount of plastic used can be reduced when the RFID tag 1 is disposed of, resulting in less burden on the environment.
As the paper base material 2, coated paper, high quality paper, medium quality paper, bleached kraft paper, unbleached kraft paper, single gloss unbleached kraft paper, liner paper, glassine paper, aramid paper, etc. can be used. The thickness of the paper base material is preferably 50 μm to 350 μm. If the thickness exceeds 350 μm, there is a problem that the vapor-deposited paper cannot be wound into a roll, and if it is less than 50 μm, there is a problem that wrinkles or breakage occur easily.

In addition, in order to form the vapor deposition layer 3 as a uniform thin film on the paper base material 2, it is preferable to provide the paper base material 2 with a smoothing layer as a base. The smoothing layer is formed by coating with a resin-based coating material. As a coating method, a gravure coater, a gravure offset coater, a blade coater, a knife coater, a die coater, etc. are used. As the resin, resin binders such as polyester, acrylic, urethane, epoxy, vinyl, chlorinated rubber, nitrified cotton, and olefin can be used.

Examples of the metal of the vapor deposition layer 3 include aluminum, copper, nickel, tin, indium, and cadmium. Among these, aluminum is preferred because it is inexpensive and can form a bright and clear layer. The vapor deposition layer can be formed by a vacuum vapor deposition method, a sputtering method, or the like. The thickness of the vapor deposited layer 3 is preferably 100 nm to 1,000 nm. If it exceeds 1,000 nm, the workability as an antenna tends to decrease, and if it is less than 100 nm, the radiation efficiency as an antenna tends to decrease.

The antenna 3a composed of the vapor deposited layer 3 has two patterns arranged in parallel. For example, as shown in FIG. 9(c), the antenna 3a is formed entirely on the paper base material 2 except for the band-shaped gap 3b, and is made up of all of the vapor deposited layer 3 divided into two by the gap 3b. be done. To form the gap 3b, only the vapor deposited layer 3 is removed by physical surface processing (see FIGS. 9(a) and 9(b)). This is because the base material on which the vapor deposition layer 3 is formed is paper, so wet processing is inappropriate.

As the physical surface processing, for example, laser etching can be used as shown in FIG. 9(b). Laser etching in this specification is a processing method in which the surface temperature is raised to the boiling point by irradiation with laser light 27 to create a state in which the vapor deposited layer 3 evaporates, and unnecessary vapor deposited layer 3 is removed using this. When irradiating the laser beam 27, it evaporates only the thickness of the vapor-deposited paper 4 on the optical path to a depth equal to the thickness of the vapor-deposited layer 3, and does not penetrate or burn the paper base material 2 below the vapor-deposited layer 3. The output is controlled as follows. Examples of the type of laser light 27 used include CO ₂ laser light.

Further, router processing may be used as the physical surface processing. The router processing in this specification is a processing method in which unnecessary vapor deposited layer 3 is removed by moving a rotary cutting tool having a cutting edge on the outer periphery so as to trace the surface of vapor deposited layer 3 of vapor deposited paper 4. When applying the tool, the spindle rotation speed, spindle rotation direction, and feed rate are controlled so that the vapor-deposited paper 4 is not deformed in the rotation direction.

(1-3) IC Chip As shown in FIG. 1, the IC chip 5 mounted on the vapor-deposited paper 4 is attached to the vapor-deposited paper 4 with glue 8 so that it straddles the two antennas 3a, 3a across the gap 3b. is attached to. Further, the IC chip 5 and the two antennas 3a, 3a are electrically connected to each other via, for example, an opening (not shown) provided in the glue 8. Note that the IC chip 5 in this specification includes not only a single IC chip but also an IC chip, a strap substrate that functions as a carrier for the IC chip, and a strap that includes conductive pads formed on the strap substrate.

The IC chip 5 used in the RFID tag 1 generally has memory areas such as RESERVED memory, EPC memory, TID memory, and USER memory. The RESERVED memory is an area for storing a password used for a lock function that protects the RFID tag 1 from unintentional writing and an invalidation function that prevents information on the RFID tag 1 from being read unnecessarily. The EPC memory is an area for code information used to identify the RFID tag 1. The TID memory is an area of manufacturer information written by the manufacturer when the RFID tag 1 is manufactured. The USER memory is an area prepared so that the user of the RFID tag 1 can freely read and write data, and some RFID tags 1 do not have this area.

Examples of the adhesive 8 for fixing the IC chip 5 include a hot melt adhesive made of a thermoplastic resin with a relatively low softening temperature such as polypropylene or polyethylene, a hot melt hand tape made from the same in the form of a tape, a urethane adhesive, Silicon-based adhesives, fluorine-based adhesives, etc. are used. In this case, conduction between the IC chip 5 and the two antennas 3a, 3a is achieved by capacitive coupling, with the glue 8 between them serving as a dielectric.

Further, the glue 8 itself used for attaching the IC chip 5 may have conductivity. In this case, there is no need for an opening or the like to establish electrical continuity between the IC chip 5 and the two antennas 3a, 3a. The conductive glue must be able to conduct electricity between the terminals on the back of the IC chip 5 and the antenna 3a while adhering the IC chip 5 to the antenna 3a, and to insulate adjacent terminals from each other to prevent short circuits. Anisotropically conductive adhesives and anisotropically conductive adhesive tapes are used.

In this specification, the IC chip 5 mounted on the vapor-deposited paper 4 provided with the vapor-deposited layer 3 constituting the antenna 3a as described above is collectively referred to as an inlay. Existing inlays are also called RFID inlays and RFID inlets.

(1-3) Printing paper As shown in FIG. 1, the printing paper 7 in this embodiment is coated with glue 8 on the vapor-deposited paper 4 and the IC chip 5 (that is, the inlay) so as to cover it from the IC chip 5 side. It is pasted.
The printing paper 7 protects the antenna 3a and the IC chip 5, and also prints information such as product name, model number, price, bar code, JAN code, component, material, size, place of origin, product type, and brand mark on the outer surface. will be written.
As with the paper base material 2 of the metallized paper 4, materials for the printing paper 7 include coated paper, high-quality paper, medium-quality paper, bleached kraft paper, unbleached kraft paper, single-gloss unbleached kraft paper, liner paper, and glassine. Paper, aramid paper, etc. can be used. Therefore, like the metallized paper 4, plastic can be reduced when the RFID tag 1 is disposed of, and the burden on the environment is small.

As a method for printing on the printing paper 7, for example, a thermal transfer printer, a laser printer, an inkjet printer, a hot stamp printing method printer (dry printer), etc. can be used. Note that the definition of printing in this specification also includes printing.
FIG. 2 is a schematic diagram showing an example of a printing method on the RFID tag 1 provided with printing paper. The example shown in FIG. 2 is printing by a thermal transfer printer, which is often used among the printing methods described above. Specifically, a long object consisting of a large number of consecutive RFID tags 1 with printing paper 7 pasted on an inlay, that is, an RFID tag roll 1R, is used, and a continuous body of RFID tags 1 is unwound from the RFID tag roll 1R. , the ink ribbon 22 with the ink layer 24 made of heat-soluble pigment ink formed on the ribbon base material 23 is sent between the surface plate 21 and the thermal head 25, and the thermal head 25 is RFIDed from the ribbon base material 23 side of the ink ribbon 22. The ink layer 24 of the ink ribbon 22 is pressed against the tag 1, melted by heat, and transferred onto the printing paper 7. In addition, in a thermal transfer printer, an ink ribbon coated with sublimable dye ink instead of heat-soluble pigment ink may be used, and the ink ribbon 22 may be sublimated by heat and transferred to the surface layer of the printing paper 7. .

In this embodiment, the glue 8 used for pasting the printing paper 7 is provided on the back side of the printing paper 7 (see FIG. 1). In the example shown in FIG. 1, the adhesive surface of the printing paper 7 does not follow the side surface of the IC chip 5, and a slight space is created.
The glue 8 used for pasting the printing paper 7 is not particularly limited, and for example, a thermosetting adhesive or a pressure-sensitive adhesive can be used. Specifically, epoxy, melamine, melamine alkyd, phenol, polyurethane resins, synthetic rubber resins, natural rubber resins, vinyl chloride resins, acrylic resins, styrene-butadiene resins, and ethylene-acetic acid. Various adhesives such as vinyl resin and vinylidene chloride resin can be used.

(2) RFID tag manufacturing method Since the RFID tag 1 according to this embodiment has the above-described configuration, the manufacturing method is also different from that of the conventional RFID tag 101. The differences between the two will be explained below.

(2-1) RFID tag manufacturing method in conventional technology This is as already explained using FIGS. 3 and 4 in the "Background technology" section.

(2-2) RFID tag manufacturing method according to the first embodiment FIG. 5 is a flowchart showing an example of the manufacturing process of the RFID tag 1 according to the first embodiment. FIG. 6 is a perspective view showing an example of the manufacturing process of the RFID tag 1 according to the first embodiment.
In manufacturing the RFID tag 1 according to the first embodiment, the inlay 106 using an existing resin film as a base material is not used.
First, an inlay 6 using vapor-deposited paper 4 is prepared. Specifically, as shown in FIG. 6(a), a long vapor-deposited paper 4 in which a vapor-deposited layer 3 is provided on a paper base material 2 is used (step S1 in FIG. 5), and the vapor-deposited layer 3 is physically removed. After obtaining antennas 3a, 3a separated by a band-shaped gap 3b extending along the longitudinal direction of the vapor-deposited paper by patterning the surface processing (step S2 in FIG. 5), the antennas 3a, 3a are straddled. A large number of IC chips 5 arranged at a predetermined pitch in the longitudinal direction of the vapor-deposited paper 4 are mounted on the inlay roll 6R (step S3 in FIG. 5).

Next, as shown in FIG. 6(b), the vapor-deposited paper 4 having the antennas 3a, 3a and the IC chip 5 unwound from the inlay roll 6R, and the long printing paper 7 with glue on the back side. is passed between laminating rollers 20 and bonded together with the antennas 3a, 3a and IC chip 5 sandwiched between them to obtain a bonded body 9 (step S4 in FIG. 5).
Finally, as shown in FIG. 6(c), the long bonded body 9 is continuously punched out using a punching die 26 to form RFID tags 1 of a desired shape in a row, and this is used as an RFID tag roll 1R. Wind it up (step S5 in FIG. 5).
The RFID tag roll 1R obtained through the above steps is separated into individual RFID tags 1 before shipping or at the site of use.

(2-3) Comparison with the prior art FIG. 7 is a comparison diagram of the manufacturing process of the RFID tag according to the first embodiment and the process of the prior art. Additionally, as a final step, printing and data writing by the user (order can be changed) is also added.
Comparing the two, the conventional technology uses metal foil in the process of preparing the first metal thin film for the antenna, whereas the RFID tag 1 according to the first embodiment uses relatively inexpensive metallized paper. There is.
Furthermore, in the process of obtaining the inlay roll 6R, in contrast to the prior art where the metal foil is once attached to the film, the RFID tag 1 according to the first embodiment does not require the effort of attaching it to the film. Furthermore, in the process of obtaining the inlay roll 6R, the metal foil is patterned by chemical etching in the conventional technology, whereas in the RFID tag 1 according to the first embodiment, the vapor deposition layer 3 is patterned by simple physical methods such as laser etching or router processing. Make slits and pattern using surface processing.
Furthermore, in the step of obtaining a tag using the inlay roll 6R, in the conventional technology, the electrical structure of the resin film type inlay is transferred onto the mount at a pitch matching the size of the tag, whereas in the first embodiment The RFID tag according to the above does not require the effort of transferring onto a mount.

(3) Variation example (3-1) Variation example 1
In the first embodiment, the outer shape is trimmed by punching, and the case of an RFID tag roll 1R in which RFID tags 1 of the same shape and size are adjacent and continuous (see FIG. 6(c)) will be illustrated and explained. However, it is not limited to this. For example, for the RFID tag roll 1R, perforations may be provided in the shape of the RFID tag 1 by punching instead of trimming (not shown). Further, as shown in FIG. 8, the RFID tag roll 1R may have RFID tags 1 (inside the punching area 31 indicated by the broken line in the figure) that are not directly adjacent to each other but are continuous at intervals.
Furthermore, in the state of the RFID tag roll 1R, in FIG. 6 there is only one row of continuums of RFID tags 1 in the width direction, but as shown in FIG. 8, there are two rows of continuums of RFID tags 1 in the width direction. You may. Alternatively, there may be multiple rows of three or more rows.

Furthermore, as shown in FIG. 8, one RFID tag roll 1R using the same inlay may have RFID tags 1 of different shapes and dimensions (inside the broken line in the figure). In this case, 1) RFID tags 1 of different shapes and dimensions may coexist, or 2) RFID tags 1 of the same shape and size may exist divided into areas in the length direction of the roll. By the way, the designs of the RFID tags 1 are not standardized and can be freely selected by the user, so there are various designs. In the case of 2) above, the RFID tag 1 can be produced in small quantities and in a wide variety of products depending on the design desired by the user.

Further, instead of forming the RFID tag roll 1R, it may be separated into individual RFID tags at the time of punching.

(3-2) Modification example 2
In the first embodiment, the pattern of the antennas 3a, 3a is made up of the entire vapor deposited layer 3 formed on the entire surface of the paper base material 2 except for the band-shaped gap 3b (FIG. 9(c) )) have been illustrated and explained, but the invention is not limited thereto. For example, the antennas 3a, 3a may be formed of only a part of the vapor deposited layer 3 formed entirely on the paper base material 2 except for the band-shaped gap 3b. That is, a pattern of band-shaped gaps 3b is provided depending on the size of the required antennas 3a, 3a.

For example, FIG. 10 is a perspective view showing an example of a change in the antenna pattern in the inlay 6. As shown in FIG.
In the variation shown in FIG. 10, the vapor deposition layer 3 formed entirely on the rectangular paper base material 2 is divided into six patterns by strip-shaped gaps 3b. Specifically, the vapor deposition layer 3 is divided into four patterns by three gaps 3b parallel to the short sides. Moreover, the inner two patterns among these four patterns are each divided into two by one gap 3b parallel to the long side. Of the six patterns, two rectangular patterns on which the IC chip 5 is mounted constitute the antennas 3a, 3a.

Not limited to the variation example shown in FIG. 10, by combining the band-shaped gap portions 3 in this way, the length of the antennas 3a, 3a constituted by the vapor deposition layer 3 can be adjusted, and a wide variety of antenna patterns can be formed. Can be done.

<Second embodiment>
FIG. 11 is a cross-sectional view showing an example of an RFID tag according to the second embodiment.
The RFID tag 1 according to the second embodiment includes a spacer layer 11 surrounding the IC chip 5 between the vapor-deposited paper 4 and the printing paper 7 (see FIG. 11). That is, the second embodiment differs from the first embodiment in that the spacer layer 11 is added as an essential component.

When the spacer layer 11 is not provided, it is not easy to transfer the ink layer 24 to the entire surface of the printing paper 7 when printing using a thermal transfer printer. This is because the printing paper 7 is directly pasted from the IC chip 5 side onto the vapor-deposited paper 4 and the IC chip 5 without providing a spacer layer 11, so in most cases, the printing surface of the RFID tag 1 is attached to the IC chip. This is because it protrudes with a thickness of 5.
In that case, when the thermal head 25 is pressed from the ribbon base material 23 side of the ink ribbon 22 against the RFID tag 1 which does not have a smooth printing surface (see FIG. 12(a)), thermal pressure of the thermal head 25 is applied. Of the printed surface of the RFID tag 1, only the protruding portion above the IC chip 5 is shown. Therefore, even if the ink layer 24 of the ink ribbon 22 is melted by heat and transferred onto the printing paper 7, the ink layer 24 is only transferred to the protruding portion of the printed surface of the RFID tag 1 above the IC chip 5 (Fig. 12(b)).
Therefore, when the spacer layer 11 is not provided, printing is performed only on the protruding portion of the IC chip 5, or printing is performed avoiding the IC chip 5.

On the other hand, when the spacer layer 11 surrounding the IC chip 5 is provided between the metallized paper 4 and the printing paper 7 as in the second embodiment, by surrounding the IC chip 5 with the spacer layer 11, the printing paper Since the printing surface of 7 becomes smooth (see FIG. 11), when the thermal head 25 is pressed against the ribbon base material 23 side of the ink ribbon 22 (see FIG. 13(a)), the ink ribbon 22 can be printed on the printing surface. Heat and pressure can be applied to the entire area evenly. Therefore, the ink layer 24 of the ink ribbon 22 can be melted by heat and transferred without falling out (see FIG. 13(b)).

Materials for the spacer layer 11 include coated paper, high-quality paper, medium-quality paper, bleached kraft paper, unbleached kraft paper, single-gloss unbleached kraft paper, liner Paper, glassine paper, aramid paper, etc. can be used. Therefore, like the vapor-deposited paper 4 and the printing paper 7, the amount of plastic used can be reduced when the RFID tag 1 is disposed of, thereby reducing the burden on the environment.

For adhesion between the spacer layer 11 and the vapor-deposited paper 4 and between the spacer layer 11 and the printing paper 7, the same material as the glue 8 used for adhering the printing paper 7 in the first embodiment can be used.

In the second embodiment, as shown in FIG. 13, the printing paper 7 is attached to the spacer layer 11 by the glue 8 formed only between the spacer layer 11 and the printing paper 7. is preferred. In particular, it is more preferable to provide the glue 8 on the surface of the spacer layer 11 on the printing paper 7 side, since patterning of the glue 8 is not necessary.
This is because in the RFID tag 1 configured in this manner, since there is no glue between the printing paper 7 and the IC chip 5, the printing paper 7 and the IC chip 5 do not adhere to each other. Since the printing paper 7 and the IC chip 5 do not adhere, the adhesive force between the IC chip 5 and the antenna 3a is maintained strong, and the risk of disconnection between the IC chip 5 and the antenna 3a is reduced.
If the printing paper 7 is attached to the spacer layer 11 with the glue 8 provided on the back side of the printing paper 7 (see FIG. 14(a)), the printing paper 7 and the IC chip 5 will be bonded together with the glue 8. There is. When the adhesive force between the antenna 3a and the IC chip 5 weakens due to the adhesive force between the printing paper 7 and the IC chip 5, the risk of disconnection between the IC chip 5 and the antenna 3a increases (see FIG. 14(b)).

Regarding other points, since the explanation overlaps with the first embodiment, the explanation will be omitted. Moreover, each variation example explained in the first embodiment can also be applied to the second embodiment.

《Third embodiment》
FIG. 15 is a cross-sectional view showing an example of an RFID tag according to the third embodiment.
In the RFID tag 1 according to the third embodiment, the thickness (B) of the vapor-deposited paper 4 and the thickness (A) including the spacer layer 11 to the printing paper 7 are the same or similar (see FIG. 15). That is, the third embodiment differs from the second embodiment in that the relationship between the thicknesses of the members on both sides of the IC chip 5 is specified.

In the RFID tag 1 configured with such a thickness relationship, the reaction to stresses such as shrinkage after inspection and deformation due to handling is made uniform, so that the mechanical load on the vapor deposited layer 3 is reduced. As a result, damage to the antenna 3a is reduced and the risk of disconnection within the antenna 3a is reduced. Note that in this specification, the term "approximate thickness" means that the difference between thickness (B) and thickness (A) is within 20%.

Regarding other points, since the explanation overlaps with that of the third embodiment, the explanation will be omitted.

《Fourth embodiment》
FIG. 16 is a cross-sectional view showing an example of an RFID tag according to the fourth embodiment.
In the RFID tag 1 according to the fourth embodiment, the IC chip 5 side of the printing paper 7 is made of a cushioning material, and the IC chip 5 is embedded in the printing paper 7 (see FIG. 16). That is, the fourth embodiment differs from the first embodiment in that the IC chip 5 is buried in the printing paper 7.

As previously explained in the second embodiment, when the spacer layer 11 surrounding the IC chip 5 is not provided between the vapor-deposited paper 4 and the printing paper 7, in printing by a thermal transfer printer, the printing paper 7 It is not easy to transfer the ink layer 24 over the entire surface. Therefore, it is necessary to print only on the protruding portion of the IC chip 5 or to avoid the IC chip 5.

On the other hand, when the IC chip 5 side of the printing paper 7 is made of a cushioning material as in the fourth embodiment, the IC chip 5 is buried in the printing paper 7, so that the printing surface of the printing paper 7 becomes smooth. (See FIGS. 17(a) and 17(b)). However, if the cushioning material has too much cushioning properties, it becomes difficult to print, so the cushioning properties should be limited to a range that makes it easy to print.
When the thermal head 25 is pressed against the ribbon base material 23 side of the ink ribbon 22 in this state (see FIG. 3), the ink ribbon 22 is brought into even contact with the entire area on the printing surface where printing is desired, as in the second embodiment. , heat and pressure can be applied. Therefore, the ink layer 24 of the ink ribbon 22 can be melted by heat and transferred onto the printing paper 7 without omission (see FIG. 17(c)).

In the printing paper 7 of the fourth embodiment, the entire printing paper 7 may be made of the cushioning material as described above, or the printing paper 7 may be composed of multiple layers and the layer on the IC chip 5 side may be made of the cushioning material as described above. It may be made of material.
In the printing paper 7 of the first embodiment, examples of the materials include coated paper, high-quality paper, medium-quality paper, bleached kraft paper, unbleached kraft paper, single-gloss unbleached kraft paper, liner paper, glassine paper, and aramid paper. However, the materials that can be used for the printing paper 7 of the fourth embodiment are slightly different. Specifically, among the examples described above, glassine paper and aramid paper are not suitable for the printing paper 7 of the fourth embodiment.

Regarding other points, since the explanation overlaps with the first embodiment, the explanation will be omitted. Further, each variation example described in the first embodiment can also be applied to the fourth embodiment.

《Fifth embodiment》
FIG. 18 is a cross-sectional view showing an example of the RFID tag according to the fifth embodiment.
In the RFID tag 1 according to the fifth embodiment, the printing paper 7 is attached to the vapor-deposited paper 4 with the IC chip 5 sandwiched therebetween by glue 8 provided on the surface of the vapor-deposited paper 4 on the printing paper 7 side. (See Figure 18). That is, the fifth embodiment differs from the first embodiment in the formation position of the glue 8 for pasting the printing paper 7.

When the printing paper 7 is pasted onto the vapor-deposited paper 4 and the IC chip 5 with the adhesive 8 provided on the back side of the printing paper 7 (see FIG. 19(a)), the printing paper 7 and the IC chip 5 are attached to the adhesive 8 (see FIG. 19(a)). It may be glued with. When the adhesive force between the antenna 3a and the IC chip 5 weakens due to the adhesive force between the printing paper 7 and the IC chip 5, the risk of disconnection between the IC chip 5 and the antenna 3a increases (see FIG. 19(b)).

On the other hand, in the RFID tag 1 according to the fifth embodiment, since there is no glue between the printing paper 7 and the IC chip 5, the printing paper 7 and the IC chip 5 do not adhere to each other (Fig. 20 reference). As a result, the adhesive force between the IC chip 5 and the antenna 3a is maintained strong, and the risk of disconnection between the IC chip 5 and the antenna 3a is reduced.

Note that, as shown in FIGS. 18 and 20, when fixing the IC chip 5 and pasting the printing paper 7 are performed using the same glue 8, the glue used for pasting the printing paper 7 shown in the first embodiment may be used. 8 can be used. That is, for example, a thermosetting adhesive or a pressure sensitive adhesive can be used. Specifically, epoxy, melamine, melamine alkyd, phenol, polyurethane resins, synthetic rubber resins, natural rubber resins, vinyl chloride resins, acrylic resins, styrene-butadiene resins, and ethylene-acetic acid. Various adhesives such as vinyl resin and vinylidene chloride resin can be used.

Furthermore, fixing the IC chip 5 and pasting the printing paper 7 may be performed separately using glue 8 made of different materials. In that case, the same materials as those shown in the first embodiment can be used for the glue 8 used to fix the IC chip 5 and the glue 8 for fixing the IC chip 5, respectively.

Regarding other points, since the explanation overlaps with the first embodiment, the explanation will be omitted. Further, each variation example described in the first embodiment can also be applied to the fifth embodiment.

《Sixth embodiment》
FIG. 21 is a cross-sectional view showing an example of an RFID tag according to the sixth embodiment. FIG. 22 is a diagram illustrating how the thickness of the IC chip is absorbed by the printing paper in the RFID tag according to the sixth embodiment.
In the RFID tag 1 according to the sixth embodiment, as shown in FIG. 21, the IC chip 5 side of the printing paper 7 is made of a cushioning material, and the IC chip 5 is embedded in the printing paper 7. Further, as shown in FIG. 21, in the RFID tag 1 according to the sixth embodiment, the printing paper 7 is vapor-deposited with the IC chip 5 sandwiched therebetween by the adhesive 8 provided on the printing paper 7 side surface of the vapor-deposited paper 4. It is pasted on paper 4. That is, the sixth embodiment is a combination of the configurations of the fourth embodiment and the fifth embodiment.

Regarding other points, since the explanations overlap with those of the first embodiment, the fourth embodiment, and the fifth embodiment, the explanations will be omitted. Further, each variation example described in the first embodiment can also be applied to the sixth embodiment.

《Seventh embodiment》
In the RFID tag 1 according to the seventh embodiment, the paper base material 2 of the vapor-deposited paper 4 is a hard material. That is, the seventh embodiment differs from the first embodiment in that the properties of the paper base material 2 of the vapor-deposited paper 4 to which the printing paper 7 is attached are specified.

Depending on the paper base material 2 of the vapor-deposited paper 4, the C-chip 5 may sink into the vapor-deposited paper 4 due to expansion and contraction during handling of the RFID tag 1, or external pressure applied when mounting the IC chip, and may become stuck inside the antenna 3a. This creates a risk of wire breakage (see Figure 23).

On the other hand, in the RFID tag 1 according to the seventh embodiment, by employing a hard material for the paper base material 2 of the vapor-deposited paper 4, shrinkage of the RFID tag 1 after inspection and deformation due to handling is suppressed, and the vapor-deposited layer 4 is reduced. Further, the load of the IC chip 5 sinking into the metallized paper 4 due to external pressure applied when the IC chip 5 is mounted is reduced. As a result, damage to the antenna 3a is reduced and the risk of disconnection within the antenna 3a is reduced.

In the metallized paper 4 of the first embodiment, the materials for the paper base material 2 include coated paper, high-quality paper, medium-quality paper, bleached kraft paper, unbleached kraft paper, single-gloss unbleached kraft paper, liner paper, glassine paper, and aramid paper. Although paper has been given as an example, the material of the paper base material 2 that can be used in the vapor-deposited paper 4 of the seventh embodiment is slightly different. Specifically, among the examples described above, liner paper is not suitable for the paper base material 2 used in the vapor-deposited paper 4 of the seventh embodiment.

Regarding other points, since the explanation overlaps with the first embodiment, the explanation will be omitted. Further, each variation example described in the first embodiment can also be applied to the seventh embodiment.

《Eighth embodiment》
FIG. 24 is a cross-sectional view showing an example of the RFID tag according to the eighth embodiment.
The RFID tag 1 according to the eighth embodiment includes a protective paper 12 stuck on the vapor-deposited paper 4 and the IC chip 5 so as to cover it from the IC chip 5 side, and the paper base material 2 of the vapor-deposited paper 4 is It also serves as printing paper 7 with a smooth printing surface on the opposite side from layer 3 (see FIGS. 24 and 25(a) to 25(b)). That is, the eighth embodiment differs from the first embodiment in the location of the printing surface.

In the RFID tag 1 according to the eighth embodiment, since the paper base material 2 of the vapor-deposited paper 4 also serves as the printing paper 7 whose printing surface is smooth on the side opposite to the vapor-deposited layer 3, there is a difference in level on the protective paper 12 side. By arranging the ink ribbon 22 so that it is absorbed by the concave portion of the printer surface plate 21 (see FIG. 25(c)), the ink ribbon 22 is brought into uniform contact with the entire area to be printed on the printing surface, and the ink layer 24 is transferred without omission. Can be done.

As with the printing paper 7 of the first embodiment, materials for the protective paper 12 include coated paper, high-quality paper, medium-quality paper, bleached kraft paper, unbleached kraft paper, single-gloss unbleached kraft paper, liner paper, and glassine. Paper, aramid paper, etc. can be used. Therefore, like the metallized paper 4, plastic can be reduced when the RFID tag 1 is disposed of, and the burden on the environment is small.
The glue 8 used to attach the protective paper 12 can be the same as the glue 8 used to attach the printing paper 7 in the first embodiment.

Regarding other points, since the explanation overlaps with the first embodiment, the explanation will be omitted. Further, each variation example described in the first embodiment can also be applied to the eighth embodiment.

《Ninth embodiment》
FIG. 26 is an exploded view showing an example of the RFID tag according to the ninth embodiment. FIG. 27 is an exploded view showing another example of the RFID tag according to the ninth embodiment.
In the RFID tag 1 according to the ninth embodiment, the printing paper 7 has the punched hole portion 7a (see FIG. 26) or the semi-transparent portion 7b (see FIG. 27) on the vapor deposited layer 3, and the vapor deposited layer 3 has the punched hole portion A metallic luster pattern is exhibited through the semi-transparent portion 7a or the semi-transparent portion 7b. That is, the ninth embodiment differs from the first embodiment in that the vapor deposition layer 3 is partially visible from the printing paper 7 side.

It is generally recognized that the RFID tag 1 is not compatible with metals, which can be an obstacle to radio wave communication, so conventionally, the RFID tag 1 does not have a metallic design. Therefore, the conventional RFID tag 1 has poor design.

On the other hand, in the RFID tag 1 according to the ninth embodiment, the vapor deposition layer 3 exhibits a metallic luster pattern through the hole portion 7a or the semi-transparent portion 7b, so there is no need to worry about communication failure of the antenna 3a. It is now possible to use metallic tones and mirror effects to create designs that change due to reflections, without the need for any problems. Therefore, it is possible to expand the possibility of responding to the designer's requests regarding the design of the RFID tag.

The printing paper 7 having the semi-transparent portions 7b may be, for example, a sheet of paper that is originally semi-transparent and partially formed with an opaque layer by printing or the like to form the opaque portions 7c other than the semi-transparent portions 7b. Examples of the translucent paper include glassine paper among the materials listed in the first embodiment, but the present invention is not limited thereto.
There are several techniques for making paper translucent. For example, pulp fibers are highly beaten (beating) to make them flexible, and pressure is applied to make dense paper, which reduces the voids between the pulp fibers, reduces light reflection, and makes it translucent. how to. Another method is to treat paper with sulfuric acid to turn cellulose into amyloid and make pulp fibers translucent. Another method is to infiltrate the gaps between paper pulp fibers with oil to reduce the difference in refractive index between the oil and pulp fibers, thereby reducing light reflection and making paper translucent.
The material of the opaque layer is a resin binder such as polyester resin, acrylic resin, vinyl resin, nitrified cotton resin, urethane resin, or chlorinated rubber resin, which contains a small amount of coloring agent such as ordinary pigment or dye. Examples include, but are not particularly limited to. Note that, as shown in FIG. 27, the opaque portion 7c other than the semi-transparent portion 7b covers and conceals the IC chip 5 and the gap portion 3b where the vapor deposition layer 3 is not present.

Furthermore, if the paper can be made partially translucent, such as by the oil impregnation method described above, it is not necessary to form an opaque layer. Furthermore, the semi-transparent part 7b may be covered with a colored transparent layer.

The printing paper 7 having the punched holes 7a is punched out to remove unnecessary portions of the printing paper 7, thereby exposing the vapor deposited layer 3 at the back. Note that in this specification, the expression "punch hole" is used for the punch hole part 7a because its function is easy to recognize, but it is not limited to the hole shape or slit shape that exists only inside the printing paper 7, and can be used for printing. In a broad sense, it includes a notch connected to the outer edge of the paper 7 and an area outside the outer edge of the printing paper 7 where the vapor-deposited paper 4 is exposed.

Regarding other points, since the explanation overlaps with the first embodiment, the explanation will be omitted. Further, each of the variations described in the first embodiment and other embodiments can also be applied to the ninth embodiment.

《10th embodiment》
FIG. 28 is a plan view showing an example of the RFID tag according to the tenth embodiment.
The RFID tag 1 according to the tenth embodiment not only displays information as a normal tag, such as product name, model number, price, barcode 30, JAN code, component, material, size, place of origin, product type, brand mark, etc. , a guideline 32 for cutting at perforations 33 or the like so that the shape of the antenna 3a corresponds to the frequency used when using the RFID tag 1 is displayed on the printing paper 7 for each of the plurality of frequencies used. (See Figure 28). That is, the tenth embodiment differs from the first embodiment in that a cutting guide is displayed.

Since the RFID tag 1 according to the tenth embodiment has a guideline 32 for cutting it, it can be easily disconnected according to the purpose of use, optimal sensitivity and communication distance in the environment of the facility such as a store. It becomes possible to easily make adjustments in the direction of decreasing the sensitivity of the RFID tag 1 or shortening the communication distance (see FIGS. 28(a) to 28(c)). As the guideline 32 for cutting, in the example shown in FIG. 28, the guideline 32 with the necessary adjustment position for each region marked next to the perforation 33 is the letters "Area A,""AreaB," and "Area C." , "Region D" is marked with an arrow. Here, the area refers to a country name, a region name, a prefecture name, a base name, a store name, etc. In addition to the area name, there are no particular limitations on the name of the product, the name of the application, etc. as long as the sensitivity and communication distance of the RFID tag 1 can be adjusted. Alternatively, the corresponding frequency may be written as is.
In the example shown in FIG. 28, the guideline 32 for cutting is displayed together with the perforation 33, but only the guideline 32 for cutting may be displayed without providing the perforation 33.

Regarding other points, since the explanation overlaps with the first embodiment, the explanation will be omitted. Further, each of the variations described in the first embodiment and other embodiments can also be applied to the ninth embodiment.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various changes can be made without departing from the gist of the invention. In particular, the multiple embodiments and modifications described in this specification can be arbitrarily combined as necessary.

1,101 RFID tag 1R, 101R RFID tag roll 2 Paper base material 3 Vapor deposited layer 3a, 103a Antenna 3b Gap portion 4 Vapor deposited paper
5,105 IC chip 6,106 Inlay 6R, 106R Inlay roll 7 Printing paper 7a Cutout pattern 7b Translucent part 7c Opaque part 8 Glue
9,109 Bonded body 11 Spacer layer 11a Through hole 12 Protective paper
20 Laminating roller 21 Printer surface plate 22 Ink ribbon 23 Ribbon base material 24 Ink layer 25 Thermal head 26 Punching die 27 Laser light 30 Print pattern 31 Area to be punched out
32 Guideline 33 Perforation 102 Resin film base material
103 Conductive layer 104 Mounting paper

Claims (15)

A vapor-deposited paper comprising a paper base material and a vapor-deposited layer that is formed entirely on the paper base material except for a slit-like gap, and that partially or entirely constitutes two antennas arranged in parallel;
An RFID tag comprising: an IC chip mounted across the two antennas across the gap. 2. The RFID tag according to claim 1, further comprising printing paper adhered to cover the vapor-deposited paper and the IC chip from the IC chip side. 3. The RFID tag according to claim 2, further comprising a spacer layer surrounding the IC chip between the vapor-deposited paper and the printing paper. 4. The RFID tag according to claim 3, wherein the printing paper is adhered to the spacer layer by an adhesive provided on a surface of the spacer layer on the printing paper side. 4. The RFID tag according to claim 3, wherein the thickness of the vapor-deposited paper and the thickness including the spacer layer to the printing paper are the same or similar. 3. The RFID tag according to claim 2, wherein the IC chip side of the printing paper is made of a cushioning material, and the IC chip is embedded in the printing paper. 3. The RFID tag according to claim 2, wherein the printing paper is adhered to the vapor-deposited paper with the IC chip interposed therebetween by glue provided on the surface of the vapor-deposited paper on the printing paper side. The RFID tag according to claim 1, wherein the paper base material of the vapor-deposited paper is a hard material. Further, a protective paper is attached on the vapor-deposited paper and the IC chip so as to cover it from the IC chip side,
2. The RFID tag according to claim 1, wherein the paper base material of the vapor-deposited paper also serves as printing paper having a smooth printing surface on the side opposite to the vapor-deposited layer. 3. The RFID tag according to claim 2, wherein the printing paper has a punched hole portion or a semi-transparent portion on the vapor deposition layer, and the vapor deposited layer exhibits a metallic luster pattern through the punched hole portion or the semitransparent portion. 10. The method according to claim 2 or 9, wherein a guideline for cutting the antenna into a shape corresponding to a frequency used when using the RFID tag is displayed on the printing paper for each of a plurality of frequencies used. RFID tag according to any of the descriptions. Using a vapor-deposited paper comprising a paper base material and a vapor-deposited layer formed entirely on the paper base material, removing the slit-shaped gap part by physical surface processing of the vapor-deposited layer in the gap part. a step of constructing two antennas in parallel using part or all of the vapor deposited layer;
A method for manufacturing an RFID tag, comprising: mounting an IC chip on the antenna so as to straddle the gap. 13. The method for manufacturing an RFID tag according to claim 12, wherein the physical surface processing is laser etching or router processing. A vapor-deposited paper comprising a paper base material and a vapor-deposited layer that is formed entirely on the paper base material except for a slit-like gap, and that partially or entirely constitutes two antennas arranged in parallel;
An RFID tag roll, which is a long object formed by a large number of consecutive RFID tags each including an IC chip mounted on the two antennas so as to straddle the gap, and is wound into a roll. 15. The RFID tag roll according to claim 14, wherein the continuous body of RFID tags exists in a plurality of rows in the width direction.

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