JP5837203B2 - 非ヘテロダイン式放射線撮像装置 - Google Patents
非ヘテロダイン式放射線撮像装置 Download PDFInfo
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- JP5837203B2 JP5837203B2 JP2014527144A JP2014527144A JP5837203B2 JP 5837203 B2 JP5837203 B2 JP 5837203B2 JP 2014527144 A JP2014527144 A JP 2014527144A JP 2014527144 A JP2014527144 A JP 2014527144A JP 5837203 B2 JP5837203 B2 JP 5837203B2
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- 238000003384 imaging method Methods 0.000 title claims description 41
- 230000005855 radiation Effects 0.000 title claims description 35
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/248—Supports; Mounting means by structural association with other equipment or articles with receiving set provided with an AC/DC converting device, e.g. rectennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/20—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a curvilinear path
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Support Of Aerials (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
Claims (19)
- 接地面層が配置される表面を有し、第1の端部及び該第1の端部の反対にある第2の端部を備え、前記第1の端部と前記第2の端部との間で前記表面が略均一な円弧を形成するように曲げられる基板と、
ミリメートル波の放射入力を受けるよう構成される複数のアンテナ素子と、
前記複数のアンテナ素子の夫々を前記基板へ機械的及び電気的に夫々結合し、前記接地面層から前記ミリメートル波の放射入力の約4分の1波長離して前記複数のアンテナ素子を保つ複数の支持要素と、
前記複数のアンテナ素子の夫々によって受信される前記ミリメートル波の放射入力を測定するよう夫々動作する複数のエネルギ検出部と
を有する非ヘテロダイン式ミリメートル波放射線撮像装置。 - 接地面層が配置される表面を有する可塑性の基板と、
放射入力を受けるよう動作する複数のアンテナ素子と、
複数の支持要素と、
前記複数のアンテナ素子によって受信される前記放射入力を測定するよう動作する複数のエネルギ検出部と
を有し、
前記複数の支持要素の夫々の支持要素は、夫々のアンテナ素子が前記接地面層から所定の距離だけ離されることを確かにしながら、前記複数のアンテナ素子の夫々を前記基板へ機械的及び電気的に結合する、非ヘテロダイン式放射線撮像装置。 - 前記複数の支持要素は、夫々のアンテナ素子と前記接地面層との間に略均一な間隔を設ける、
請求項2に記載の放射線撮像装置。 - 前記複数の支持要素は、前記複数のアンテナ素子を前記接地面層から250乃至2500ミクロンに保つ、
請求項2に記載の放射線撮像装置。 - 前記基板は非平面である、
請求項2に記載の放射線撮像装置。 - 前記基板は、第1の端部と、該第1の端部の反対にある第2の端部とを有し、
前記基板は、前記第1の端部が前記第2の端部に近接するように曲げられる、
請求項2に記載の放射線撮像装置。 - 前記基板は、第1の端部と、該第1の端部の反対にある第2の端部とを有し、
前記基板は、該基板が前記第1の端部と前記第2の端部との間に略均一な円弧を形成するように曲げられる、
請求項2に記載の放射線撮像装置。 - 前記基板は、第1の端部と、該第1の端部の反対にある第2の端部とを有し、
前記基板は、該基板が平面形状から非平面形状へ曲げられるよう動作可能であるように可塑性がある、
請求項2に記載の放射線撮像装置。 - 前記エネルギ検出部は整流回路を有する、
請求項2に記載の放射線撮像装置。 - 前記エネルギ検出部は光検知素子を有する、
請求項2に記載の放射線撮像装置。 - 前記基板は誘電体から構成される、
請求項2に記載の放射線撮像装置。 - 前記複数の支持要素は複数の金属冷間溶接を有する、
請求項2に記載の放射線撮像装置。 - 前記複数の支持要素は複数の導電接着パッチを有する、
請求項2に記載の放射線撮像装置。 - 前記複数の支持要素は複数の半田付け接続を有する、
請求項2に記載の放射線撮像装置。 - 前記複数の支持要素は複数のソケットコネクタを有する、
請求項2に記載の放射線撮像装置。 - 非ヘテロダイン式撮像アレイの複数のアンテナ素子で放射入力を受けるステップと、
前記複数のアンテナ素子の夫々のアンテナ素子を、接地面層が配置される表面を有する可塑性の基板へ、夫々のアンテナ素子が前記接地面層から所定の距離だけ離されることを確かにしながら機械的に結合するステップと、
前記複数のアンテナ素子によって受信される前記放射入力を測定するステップと
を有する方法。 - 前記複数のアンテナ素子の夫々のアンテナ素子を前記基板へ機械的に結合するステップは、前記接地面層から略一様な距離で前記アンテナ素子を保つステップを更に有する、
請求項16に記載の方法。 - 前記基板は、第1の端部と、該第1の端部の反対にある第2の端部とを有し、
前記基板は、該基板が前記第1の端部と前記第2の端部との間に略均一な円弧を形成するように曲げられる、
請求項16に記載の方法。 - 前記基板は、第1の端部と、該第1の端部の反対にある第2の端部とを有し、
前記基板は、該基板が平面形状から非平面形状へ曲げられるよう動作可能であるように可塑性がある、
請求項16に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/215,430 | 2011-08-23 | ||
US13/215,430 US8586926B2 (en) | 2011-08-23 | 2011-08-23 | Antenna-coupled antenna arrays |
PCT/US2012/034163 WO2013028236A1 (en) | 2011-08-23 | 2012-04-19 | Non- heterodyne radiation imager |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015501557A JP2015501557A (ja) | 2015-01-15 |
JP5837203B2 true JP5837203B2 (ja) | 2015-12-24 |
Family
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014527144A Active JP5837203B2 (ja) | 2011-08-23 | 2012-04-19 | 非ヘテロダイン式放射線撮像装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8586926B2 (ja) |
EP (1) | EP2748891B1 (ja) |
JP (1) | JP5837203B2 (ja) |
WO (1) | WO2013028236A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8884815B2 (en) | 2011-07-22 | 2014-11-11 | Ratheon Company | Antenna-coupled imager having pixels with integrated lenslets |
US8742325B1 (en) | 2013-07-31 | 2014-06-03 | Google Inc. | Photodetector array on curved substrate |
US9322911B1 (en) * | 2013-08-27 | 2016-04-26 | Exelis, Inc. | Passive phased array imager using sub-phase sampling CMOS detectors and a smart ROIC |
US10110370B2 (en) * | 2015-05-18 | 2018-10-23 | William Marsh Rice University | Wireless synchronization of mm-wave arrays |
US10267837B2 (en) * | 2017-07-10 | 2019-04-23 | The United States of America, as Represented by the Secretary of Homeland Security | Electromagnetic radiation detection apparatus and method of detecting low levels of millimeter wave electromagnetic radiation |
FI128822B (en) | 2017-11-15 | 2020-12-31 | Teknologian Tutkimuskeskus Vtt Oy | Antenna array and method of making it |
WO2021157492A1 (ja) * | 2020-02-03 | 2021-08-12 | Agc株式会社 | アンテナ装置 |
US11502422B2 (en) * | 2020-08-27 | 2022-11-15 | Raytheon Company | Conformal RF antenna array and integrated out-of-band EME rejection filter |
TWI784680B (zh) * | 2021-08-19 | 2022-11-21 | 特崴光波導股份有限公司 | 天線結構及天線陣列結構 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US4063246A (en) | 1976-06-01 | 1977-12-13 | Transco Products, Inc. | Coplanar stripline antenna |
US6441368B1 (en) | 2000-11-17 | 2002-08-27 | Raytheon Company | Infrared/visible energy protection for millimeter wave bolometer antenna method and apparatus |
US6545646B2 (en) | 2001-07-16 | 2003-04-08 | Xerox Corporation | Integrated dipole detector for microwave imaging |
US7415244B2 (en) | 2003-08-12 | 2008-08-19 | Trey Enterprises Corp. | Multi-channel millimeter wave imaging system |
US7095027B1 (en) | 2004-02-25 | 2006-08-22 | University Of Central Florida Research Foundation, Inc. | Multispectral multipolarization antenna-coupled infrared focal plane array |
US7679057B2 (en) | 2007-10-30 | 2010-03-16 | Raytheon Company | Antenna-coupled-into-rectifier infrared sensor elements and infrared sensors |
US8884815B2 (en) * | 2011-07-22 | 2014-11-11 | Ratheon Company | Antenna-coupled imager having pixels with integrated lenslets |
-
2011
- 2011-08-23 US US13/215,430 patent/US8586926B2/en active Active
-
2012
- 2012-04-19 JP JP2014527144A patent/JP5837203B2/ja active Active
- 2012-04-19 EP EP12718819.1A patent/EP2748891B1/en active Active
- 2012-04-19 WO PCT/US2012/034163 patent/WO2013028236A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2013028236A1 (en) | 2013-02-28 |
US8586926B2 (en) | 2013-11-19 |
US20130050015A1 (en) | 2013-02-28 |
JP2015501557A (ja) | 2015-01-15 |
EP2748891A1 (en) | 2014-07-02 |
EP2748891B1 (en) | 2017-04-05 |
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