JP5832215B2 - Semiconductor control device - Google Patents

Description

  The present invention relates to a mobile semiconductor control device.

  A moving body such as a vehicle is controlled by using a semiconductor module having a semiconductor element. Since the semiconductor module generates heat during data processing, it is preferably cooled. As a method for cooling the semiconductor module, for example, a heat sink is attached to the semiconductor module, and the heat of the semiconductor module is radiated through the heat sink. Here, in order to efficiently dissipate heat from the heat sink, in the conventional semiconductor control device, the semiconductor module is pressed against the heat sink by a plate-like spring member and then screwed. As a result, the semiconductor module comes into close contact with the heat sink and the thermal resistance between the two is reduced, so that the heat of the semiconductor module is easily released.

  In the conventional spring member, a plurality of screw holes used for fixing to the heat sink at the center portion are formed at equal intervals, and the peripheral portion pressed against the semiconductor module is divided into a plurality by slits. Further, when the semiconductor module is fixed to the heat sink using the spring member, the leaf spring is reinforced after attaching a reinforcing beam to the central portion of the spring member. The reinforcing beam is provided with a through hole, and the semiconductor module is screwed to the heat sink in a state where the reinforcing beam and the plate spring are overlapped.

Japanese Patent Laying-Open No. 2005-235992

However, conventionally, since a reinforcing beam separate from the spring member is required, the number of parts is large. In addition, since it is necessary to provide the spring member with a portion to which the reinforcing beam is attached, the configuration of the parts is complicated. Furthermore, since it is necessary to align the screw hole of the plate spring and the through hole of the reinforcing beam when mounting the semiconductor module, the number of assembling steps has been increased.
The present invention has been made in view of such circumstances, and an object thereof is to simplify the structure of a spring for fixing a semiconductor module.

According to one aspect of the present application, in the semiconductor control device having a spring member that presses a plurality of semiconductor modules against the cooling member, the spring member has insertion portions formed at both ends through which a fixing member fixed to the cooling member is passed. A base, ribs formed on the base across the insertion portion, and both sides of the base where the ribs are formed, and a plurality of the semiconductor modules are arranged along the base. by urging, seen including an arm to press a plurality of the semiconductor modules to the cooling member, a, of the arm portions which are arrayed with respect to said base, the other of said arm portions of the central neighboring A semiconductor control device is provided that is bent with respect to the base at an angle larger than the arm .

According to another aspect of the present invention, a semiconductor apparatus according to claim 1, characterized in that the ribs were more column array is provided.

According to another aspect of the present invention, the base, according to claim 1 or claim, characterized in that the central rib between the one of the insertion portion up to the insertion portion of the other are provided 2 is provided.

According to another aspect of the present invention, there is provided the semiconductor control device according to any one of claims 1 to 3 , wherein the arm portion is provided with a notch.

According to another aspect of the present invention, there is provided the semiconductor control device according to any one of claims 1 to 4 , wherein a through hole is provided in the arm portion.

According to another aspect of the present invention, the semiconductor control according to any one of claims 1 to 5 , wherein a tip portion of the arm portion is bent to the opposite side to the semiconductor module. An apparatus is provided.

According to another aspect of the present invention, the arm portion is bent from the base portion to the opposite side of the semiconductor module, and is then turned back to the semiconductor module side. A semiconductor control device according to any one of 5 is provided.

  According to the present invention, it is not necessary to provide a reinforcing beam, and the number of parts can be reduced. Since the plurality of semiconductor modules are pressed by the arm portion, the semiconductor modules can be securely fixed.

FIG. 1 is an exploded perspective view of the semiconductor control device according to the first embodiment of the present invention. FIG. 2 is an enlarged perspective view of a part of the semiconductor control device according to the first embodiment of the present invention. 3A is an enlarged view of a part of FIG. 1, and FIG. 3B is a cross-sectional view taken along line AA in FIG. 4A is a perspective view of the spring member according to the second embodiment, FIG. 4B is a perspective view of the spring member according to the third embodiment, and FIG. 4C is the fourth embodiment. It is a perspective view of the spring member which concerns on a form.

(First embodiment)
The form for implementing this invention is demonstrated in detail below.
FIG. 1 is an exploded perspective view of the semiconductor control device of this embodiment. FIG. 2 is a perspective view of the semiconductor control device as viewed from above.
The semiconductor control device 1 has a cooling member (heat sink) 2. The upper surface (one surface) of the cooling member 2 is a flat surface, and a plurality of heat radiation fins 2A are arranged on the lower surface (the other surface). Three semiconductor modules 4 are placed on the upper surface of the cooling member 2 via an insulating sheet 3. For the insulating sheet 3, for example, a silicone rubber resin is used. The semiconductor module 4 is fixed to the cooling member 2 with screws together with a frame 5 that covers the periphery of the semiconductor module 4. Further, the semiconductor module 4 is fixed while being pressed against the cooling member 2 by the spring member 6.

The semiconductor module 4 has a semiconductor element (not shown) and a semiconductor circuit packaged with resin, and is provided with a plurality of terminals 4A for inputting and outputting signals and currents. The terminal 4A is electrically connected to a circuit of a control board (not shown). In this embodiment, the semiconductor module 4 can be used as a switching element of a three-phase motor, and three semiconductor modules 4 are provided corresponding to each of the three phases. Each semiconductor module 4 is provided with two current supply terminals 4B. The shape and number of the semiconductor modules 4 are not limited to FIG.

  The frame 5 has a frame body 5A surrounding the three semiconductor modules 4, and two beams 5B partitioning the three semiconductor modules 4 are formed in the frame body 5A so as to cross the frame body 5A. The frame 5 has two positioning pins 5C protruding upward to position and fix a member (not shown). The positioning pin 5 </ b> C is not an essential component for the frame 5.

  As shown in FIG. 1, FIG. 2 and FIG. 3 (a) and FIG. 3 (b) which is a cross-sectional view taken along the line AA of FIG. Have. The base portion 10 has one through hole (insertion portion) 12 through which a screw (fixing tool) passes at both ends in the long side direction indicated by the arrow X. The insertion part may use a notch instead of the through hole 12. Further, two ribs 13 are formed on the base portion 10 along the long side direction one by one with the through hole 12 interposed therebetween. The rib 13 is formed by bending the plate material of the spring member 6 into a U shape so as to be convex upward. These ribs 13 play a role of increasing the strength of the base 10 and also play a role of adjusting the overall spring constant of the spring member 6.

  Three arm portions 11 are extended from each of both side end portions of the base portion 10 where the ribs 13 are formed. That is, six arm portions 11 extend integrally from the base portion 10. In the present embodiment, the arm portions 11 are arranged at equal intervals in accordance with the arrangement interval of the semiconductor modules 4 in the X direction. The pair of arm portions 11 extending across the base portion 10 are disposed symmetrically with respect to the center line of the base portion 10. Note that the base portion 10 and the arm portion 11 are manufactured from an elastically deformable material.

  As shown in FIG. 3A, each arm portion 11 extends from the side surface of the rib 13 in an arrow Y orthogonal to the arrow X. Further, as shown in FIG. 3B, the distal end portion is bent so as to be disposed below the base portion 10. Here, the lower side is a direction toward the semiconductor module 4 and substantially coincides with the pressing direction of the semiconductor module 4. Among the three arm portions 11 arranged in the X direction, the bending angle of the central arm portion 11A is larger than the bending angles of the other two arm portions 11. For this purpose, the distal end portion of the central arm portion 11 </ b> A is disposed below the distal end portions of the other two arm portions 11.

  A tip portion of each arm portion 11 becomes an abutting portion 15 pressed against the upper surface of the semiconductor module 4. The contact portion 15 is folded upward, that is, on the opposite side of the semiconductor module 4, and comes into line contact with the upper surface of the semiconductor module 4. In this embodiment, one semiconductor module 4 is pressed against the cooling member 2 by a pair of arm portions 11 sandwiching the base portion 10. For this reason, it is easy to apply the pressing force of the spring member 6 to the semiconductor module 4 evenly. In addition, the number and arrangement | positioning of the arm part 11 are not limited to FIG.

Next, the assembly direction of the semiconductor control device 1 will be described.
First, the insulating sheet 3 is placed at a predetermined position on the cooling member 2. Furthermore, on the insulating sheet 3, the three semiconductor modules 4 are arranged side by side so that the terminals 4A face upward. From there, the frame 5 is arranged, and the semiconductor modules 4 are arranged one by one in the space defined by the frame 5A and the beam 5B. The semiconductor module 4 and the frame 5 are fixed to the cooling member 2 by the spring member 6 and the screw 17 when the spring member 6 is fixed to the frame 5 and the cooling member 2 by the screw 17.

  The spring member 6 is positioned and fixed to the frame 5 with two screws 17 so as to cross the three semiconductor modules 4. At this time, the three pairs of arm portions 11 arranged in the X direction come into contact with the three semiconductor modules 4 one by one. While the arm portion 11 is bent and deformed, the semiconductor module 4 is biased toward the cooling member 2 by the restoring force of the arm portion 11. Thereby, the tightening force of the screw 17 is applied to each semiconductor module 4 by the arm portion 11, and the semiconductor module 4 is pressed against the cooling member 2. This is because the height from the insulating sheet 3 to the base portion 10 when the spring member 6 is fixed to the frame portion 5 is smaller than the sum of the height of the semiconductor module 4 and the height of the arm portion 11.

Each semiconductor module 4 is pressed against the cooling member 2 by a pair of arm portions 11. One arm portion 11 is in contact with only one semiconductor module 4. For this reason, each semiconductor module 4 is pressed against the cooling member 2 by the spring member 6 without being affected by the other semiconductor modules 4. Furthermore, the spring member 6 can realize a reliable pressing while absorbing the variation of each product of the semiconductor module 4.
Further, the arm portion 11 abuts in the vicinity of both end portions of the semiconductor module 4 one by one. Accordingly, the pressing force from the spring member 6 acts equally on one semiconductor module 4. For these reasons, the semiconductor module 4 can be reliably pressed against the cooling member 2, and the heat generated in the semiconductor module 4 can be reliably transmitted to the cooling member 2. Therefore, the semiconductor module 4 can be efficiently cooled.

Further, since the spring member 6 has one through hole 12 at each end of the base portion 10, the tightening torque generated when the screw is fixed is less likely to affect the pressing of the semiconductor module 4 by the arm portion 11. Furthermore, as compared with the conventional case where three or more screws are used and the case where a reinforcing beam is used, the number of parts can be reduced and the number of assembling steps can be reduced.
The central arm portion 11A in the arrangement direction is bent downward from the two arm portions 11 at both ends. Therefore, the central semiconductor module 4 can be prevented from being lifted and the central semiconductor module 4 can be securely fixed to the cooling member 2.
Furthermore, since the tip part of each arm part 11 is formed in a flip-up shape, the surface of the semiconductor module 4 is not damaged.

(Second Embodiment)
A second embodiment will be described with reference to the drawings. The same components as those in the first embodiment are denoted by the same reference numerals. Moreover, the description which overlaps with 1st Embodiment is abbreviate | omitted.
As shown in FIG. 4A, the spring member 21 has three pairs of arm portions 32 that can be elastically deformed from the side end portion of the base portion 10. Further, a central rib 22 is formed between the two ribs 13. The central rib 22 is formed from one through hole 12 to the other through hole 12, and the length thereof is smaller than the distance between the two through holes 12. The central rib 22 is integrally formed by, for example, pressing.
Providing the central rib 22 prevents the base 10 from being deformed or lifted, so that the semiconductor module 4 can be securely fixed. The operation and effect of the semiconductor control device 1 having the spring member 21 are the same as those in the first embodiment.

(Third embodiment)
A third embodiment will be described with reference to the drawings. The same components as those in the first embodiment are denoted by the same reference numerals. Moreover, the description which overlaps with 1st Embodiment is abbreviate | omitted.
As shown in FIG. 4B, the spring member 31 has three pairs of arm portions 32 that are elastically deformable from the side end portion of the base portion 10. Of the arm portions 32 arranged in three rows, the central arm portion 32A is bent downward from the other arm portions 32 as in FIG.

  Here, one notch portion 33 is formed on each side surface of each arm portion 32. The notch 33 reduces the area of the arm 32 in plan view, except for the contact portion 15 at the tip. Further, one through hole 34 is formed in the approximate center of each arm portion 32. The notch 33 and the through hole 34 are formed by punching a part of the arm 32 by, for example, press working.

Since the area of the arm portion 32 is reduced by the cutout portion 33 and the through hole 34, the spring constant of the arm portion 32 can be adjusted, that is, reduced. Since the arm part 32 becomes easy to deform | transform, the semiconductor module 4 can be more reliably pressed down. Here, only one of the notch 33 and the through hole 34 may be formed.
Moreover, since the notch 33 does not reduce the area of the contact portion 15, a sufficient contact area between the semiconductor module 4 and the arm portion 32 can be ensured. Other operations and effects of the semiconductor control device 1 having the spring member 21 are the same as those in the first embodiment.

(Fourth embodiment)
A fourth embodiment will be described with reference to the drawings. The same components as those in the first embodiment are denoted by the same reference numerals. Moreover, the description which overlaps with 1st Embodiment is abbreviate | omitted.
As shown in FIG. 4C, the spring member 41 has the ribs 13 formed in parallel on the base 10 in two rows. Three arm portions 42 are integrally extended from the side surface of the base portion 10, that is, the side end portion where the ribs 13 are provided. Each arm portion 42 is manufactured from an elastically deformable material. Each arm portion 42 is bent at a predetermined angle from the base portion 10, that is, in a direction away from the semiconductor module 4. Of the arm portions 42 arranged in three rows, the bending angle of the central arm portion 42A is smaller than the bending angles of the other two arm portions 42A. For this reason, the distal end portion of the central arm portion 42A is disposed below the distal end portions of the other arm portions 42 as in FIG.

  Here, the three pairs of arm portions 42 have contact portions 43 in which respective tip portions are folded back to the opposite side, that is, the lower side. Since the contact portion 43 in contact with the semiconductor module 4 is formed by the folded portion, the distance from the base 10 to the contact portion 43 is longer than that in the case shown in FIG. Thus, the spring constant can be changed by increasing the distance from the base 10 to the contact portion 43. That is, adjustment of the spring constant of the arm portion 42, for example, the spring constant can be reduced, so that the arm portion 42 is easily deformed and the semiconductor module 4 can be pressed down with certainty. Here, since the contact portion 43 is formed by folding, the semiconductor module 4 is not damaged.

  In addition, since the ribs 13 are formed in two rows on both sides of the base portion 10 with the through hole 12 interposed therebetween, the area of the ribs 13 increases and the strength increases. For this purpose, the spring constant of the spring member 41 can be adjusted, for example, decreased. These ribs 13 play a role of increasing the strength of the base 10 and also play a role of adjusting the overall spring constant of the spring member 6. In the spring member 41, the ribs 13 may be arranged in a row. Other operations and effects of the semiconductor control device 1 having the spring member 41 are the same as those in the first embodiment.

The present invention can be widely applied without being limited to the above embodiments.
For example, the central rib 21 may be provided on the spring members 21 and 41. The ribs 13 of the spring members 6 and 31 may be arranged in two rows. The ribs 13 may be arranged in three or more rows. The notch 33 may be provided in the arm portion 42 of the spring member 41 or the through hole 34 may be formed. The number of arm parts 11, 32, 42 is not limited to three. Two may be arranged, or four or more may be arranged.

DESCRIPTION OF SYMBOLS 1 Semiconductor control apparatus 2 Cooling member 4 Semiconductor module 6, 21, 31, 41 Spring member 10 Base 11, 32, 42 Arm part 12 Through-hole (insertion part)
13 Rib 15 Contact part

Claims (7)

In a semiconductor control device having a spring member that presses a plurality of semiconductor modules against a cooling member,
The spring member has a base portion formed at both ends with an insertion portion through which a fixing member fixed to the cooling member passes.
A rib formed on the base portion with the insertion portion interposed therebetween;
A plurality of the semiconductor modules are pressed against the cooling member by extending from each of both sides of the base where the ribs are formed, and a plurality of the modules arranged along the base and biasing the semiconductor modules one by one. seen including an arm portion, of said arm portions which are arrayed with respect to said base, said arm portion of the center which is bent relative to the base at another angle larger than the arm on both sides A semiconductor control device. The semiconductor control device according to claim 1, wherein the ribs are arranged in a plurality of rows. The base is a semiconductor control device according to claim 1 or claim 2, characterized in that the center rib is provided between from one of the insertion portion up to the insertion portion of the other. The semiconductor control device according to any one of claims 1 to 3, characterized in that a notch to the arm portion. The semiconductor control device according to any one of claims 1 to 4, characterized in that a through-hole in said arm portion. The semiconductor control device according to any one of claims 1 to 5, characterized in that the tip portion of the arm portion is bent on the opposite side of the semiconductor module. The arm portion, after the said base portion is bent in an opposite side of the semiconductor module, a semiconductor according to any one of claims 1 to claim 5, characterized in that it is folded back the semiconductor module side Control device.

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