JP5825898B2 - Sensor and sensor support - Google Patents

Description

  The present invention relates to a sensor for detecting a state quantity of a fluid, particularly a temperature, and a sensor support for attaching the sensor to a mounting target member.

  In semiconductor manufacturing or the like, there are processes of cleaning a semiconductor wafer or the like using a heated liquid or etching using a heated etching solution. As an apparatus for heating a liquid, for example, Patent Document 1 describes a fluid heating apparatus used in a semiconductor manufacturing cleaning liquid temperature control apparatus.

JP-A-7-98152

  In semiconductor manufacturing or the like, it is necessary to control the temperature of a liquid (fluid) for cleaning a semiconductor wafer or the like to a predetermined temperature. For this reason, the temperature of the heated liquid is detected using a sensor. In the sensor, a detection unit for detecting the temperature of the liquid is arranged in the liquid passage, but the sensor is not fixed enough due to vibration of the sensor arranged in the flow of the liquid or pressure fluctuation of the liquid. There is a risk.

  An object of the present invention is to securely attach a sensor in which a detection unit is disposed in a fluid to an attachment target.

  In the present invention, a detection unit for detecting temperature is disposed inside a cylindrical protective body, and the protective body and a signal line drawn from the detection unit are covered with resin so that a fluid passes through the passage. The sensor main body in which the part of the detection unit is disposed and the portion of the protective body seal the space between the sensor main body and the sensor attachment target member having the passage and to which the sensor main body is attached. A sensor comprising: a sealing portion; and an attachment portion for attaching the sensor body to the sensor attachment target member via the signal line portion.

  In this invention, it is preferable that the said attachment part is arrange | positioned in the position away from the said sensor attachment object member rather than the said sealing part.

  In the present invention, the sensor main body has a cylindrical member having a through hole through which the sensor body passes, and the sealing portion is provided on one end side of the cylindrical member in which the through hole opens, and the attachment portion Is preferably provided on the other end side of the cylindrical member in which the through hole is opened.

In the present invention, the sealing portion sandwiches a first sensor support member through which the protective body portion of the sensor body passes, between the support and the sensor block,
The attachment portion may sandwich a second sensor support member through which the signal line portion of the sensor body passes between the support and a fixing member attached to the other end portion of the cylindrical member. preferable.

  In this invention, it is preferable that the material of the said cylindrical member, the said 1st sensor support member, and the said 2nd sensor support member is a fluororesin.

  In the present invention, a detection unit for detecting the temperature of the fluid is disposed inside a cylindrical protective body, and the protective body and the signal line drawn from the detection unit are covered with a resin, so that the fluid passes. A sensor support that attaches a sensor body in which a portion of the detection unit is disposed in a passage to a sensor attachment target member having the passage; a tubular member having a through-hole through which the sensor body passes; and the cylinder A sealing portion that is provided at one end of the cylindrical member and seals between the sensor main body and the sensor attachment target member at the portion of the protective body, and provided at the other end of the cylindrical member And a mounting portion for mounting the sensor main body to the sensor mounting target member via the signal line portion.

  In the present invention, the cylindrical member is preferably a fluororesin.

  According to the present invention, a sensor in which a detection unit is arranged in a fluid can be reliably attached to an attachment target.

FIG. 1 is a schematic view showing an example of a semiconductor wafer processing apparatus having a fluid heating apparatus to which the sensor according to the present embodiment is applied. FIG. 2 is a cross-sectional view showing the structure of the fluid heating apparatus shown in FIG. FIG. 3 is a cross-sectional view showing a state in which the sensor according to the present embodiment is attached to a sensor book. FIG. 4 is a cross-sectional view of the sensor body. FIG. 5 is a cross-sectional view showing members for attaching the sensor according to the present embodiment to the sensor block. FIG. 6 is a perspective view of the first sensor support member and the second sensor support member. FIG. 7 is a cross-sectional view of the sensor block. FIG. 8 is a diagram illustrating a state in which the sensor according to the present embodiment is attached to the sensor block. FIG. 9 is a diagram illustrating a state in which the sensor according to the comparative example is attached to the sensor block. FIG. 10 is a cross-sectional view showing a structure of a sealing portion according to a modification of the present embodiment. FIG. 11 is a cross-sectional view showing the structure of the sealing portion according to the second modification of the present embodiment.

  A mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The configurations described below include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those that are equivalent. Furthermore, the structures described below can be combined as appropriate. The configuration can be omitted, replaced, or changed without departing from the gist of the present invention.

  The sensor according to the present embodiment includes a sensor main body that detects a state quantity (temperature, pressure, concentration, etc.) of a fluid, and a member for attaching the sensor to a fluid passage. In the following description, the state quantity of the fluid is assumed to be temperature, and a temperature sensor will be described as an example of a sensor that detects the state quantity of fluid. The sensor according to the present embodiment is not limited to a temperature sensor, and may detect a pressure, concentration, density, or the like of a fluid. Moreover, in the following, the application according to the present embodiment for detecting the temperature of the heated fluid will be described as an example, but the sensor according to the present embodiment can be applied to other applications. . In the following description, the fluid is a liquid, but may be a gas.

  FIG. 1 is a schematic view showing an example of a semiconductor wafer processing apparatus having a fluid heating apparatus to which the sensor according to the present embodiment is applied. A semiconductor wafer processing apparatus 100 shown in FIG. 1 immerses a cleaned semiconductor wafer 7 such as silicon in a heated etching solution or resist stripping solution or the like in a semiconductor device manufacturing process. This is an apparatus for cleaning the wafer 7 by immersing it in heated pure water. The semiconductor wafer processing apparatus 100 includes a fluid heating device 1, a control device 2, a pump 3, a filter 4, pipes 5 </ b> A, 5 </ b> B, 5 </ b> C, 5 </ b> D as fluid passages (fluid passages), and a treatment tank 6. Including.

  The fluid outlet 6E of the processing tank 6 and the suction port 3I of the pump 3 are connected by a pipe 5A. The discharge port 3E of the pump 3 and the fluid inlet 1I of the fluid heating apparatus 1 are connected by a pipe 5B. The fluid outlet 1E of the fluid heating device 1 and the fluid inlet 4I of the filter 4 are connected by a pipe 5C. The fluid outlet 4E of the filter 4 and the fluid inlet 6I of the processing tank 6 are connected by a pipe 5D.

  The fluid heating device 1 heats the fluid and supplies it to the treatment tank 6. In this embodiment, the fluid is a liquid, and more specifically, a processing liquid HW such as an etching liquid, a resist stripping liquid, or pure water for cleaning. The control device 2 controls the operation of the fluid heating device 1. For example, the control device 2 performs control so that the temperature of the processing liquid HW heated by the fluid heating device 1 is constant, or adjusts the temperature of the processing liquid HW. At this time, the control device 2 controls the operation of the fluid heating device 1 based on the temperature of the processing liquid HW detected by a sensor (temperature sensor) included in the fluid heating device 1. The sensor will be described later.

  The pump 3 sucks the processing liquid HW in the processing tank 6 through the pipe 5A and discharges it toward the fluid heating device 1 through the pipe 5B. The processing liquid HW discharged by the pump 3 is heated while flowing in the fluid heating device 1 and discharged from the fluid outlet of the fluid heating device 1. The processing liquid HW heated by the fluid heating device 1 flows into the filter 4 after passing through the pipe 5C. The filter 4 removes foreign matters in the fluid. The processing liquid HW that has passed through the filter 4 flows into the processing tank 6 through the pipe 5D. The treatment tank 6 holds the treatment liquid HW heated by the fluid heating device 1 and immerses the semiconductor wafer 7 to wash or etch the semiconductor wafer 7 or remove the resist from the semiconductor wafer 7. do. The treatment in the treatment tank 6 varies depending on the treatment liquid HW.

  In this embodiment, the pipes 5A, 5B, 5C, and 5D are made of a high fluororesin that hardly generates impurities because the processing liquid HW passes through, but the materials of the pipes 5A, 5B, 5C, and 5D are the same. It is not limited to. Next, the fluid heating apparatus 1 included in the semiconductor wafer processing apparatus 100 will be described in detail.

  FIG. 2 is a cross-sectional view showing the structure of the fluid heating apparatus shown in FIG. The fluid heating device 1 includes a housing 10, heating containers 11A and 11B, heat shield plates 13A and 13B, an inflow pipe 14 as a liquid inflow passage, an outflow pipe 15 as a liquid outflow passage, a heater (heater) ) 16, a connecting pipe 17 as a connecting passage, a sensor (temperature sensor) 20, and a sensor block 30 as a sensor attachment target member. The housing 10 stores the devices constituting the fluid heating device 1.

  The fluid heating device 1 includes a plurality (two in this embodiment) of heating containers 11A and 11B, but the number of heating containers is not limited to a plurality. Each of the heating containers 11 </ b> A and 11 </ b> B has a plurality of heaters 16. The heater 16 uses, for example, a halogen lamp as a heat source, but the heat source of the heater 16 is not limited to this. The control device 2 controls the operation of the heater 16. For example, the control device 2 acquires the temperature of the fluid (the processing liquid HW shown in FIG. 1 in this embodiment) detected by the sensor 20, and supplies the temperature to the heater 16 so that the fluid has a predetermined temperature. The operation of the heater 16 is controlled by adjusting the electric power.

  One heating vessel 11A is connected to the inflow pipe 14, and the other heating vessel 11B is connected to the outflow pipe 15. In addition, both heating containers 11 </ b> A and 11 </ b> B are connected by a connecting pipe 17. With such a structure, the fluid that flows into the one heating container 11A from the inflow pipe 14 is heated by the heater 16, then passes through the connecting pipe 17 and flows into the other heating container 11B. Heated. Thereafter, the heated fluid flows out from the outflow pipe 15.

  In the present embodiment, the inflow pipe 14 is connected to the pipe 5B shown in FIG. Further, the outflow pipe 15 is connected to a pipe 5C shown in FIG. For this reason, the fluid discharged by the pump 3 shown in FIG. 1 flows into the one heating container 11 </ b> A through the inflow pipe 14. Further, the fluid flowing out from the other heating container 11B flows into the filter 4 shown in FIG. Since the fluid heating apparatus 1 can be applied to other than the semiconductor wafer processing apparatus 100 shown in FIG. 1, in this case, the target to which the inflow pipe 14 and the outflow pipe 15 are connected is different from the pump 3 and the filter 4. It will be.

  The pair of heat shield plates 13A and 13B included in the fluid heating device 1 are disposed on both sides of the two heating containers 11A and 11B. The heat shield plate 13 </ b> A is disposed between the two heating containers 11 </ b> A and 11 </ b> B and the housing 10. The pair of heat shield plates 13A and 13B shields heat from the heating containers 11A and 11B that become high temperature. By doing in this way, since the amount of heat transferred from the heating containers 11A and 11B to the housing 10 is reduced, the temperature rise of the housing 10 is suppressed.

  When the sensor block 30 is installed in the housing 10, it is attached in the middle of the outflow pipe 15, more specifically, between the other heating container 11B and the pipe 5C shown in FIG. The sensor block 30 has a passage (fluid passage) 33 through which a fluid passes. The sensor 20 is attached to the sensor block 30. The detection unit of the sensor 20 (in this embodiment, a part that detects the temperature of the fluid heated by the heater 16) is disposed in the fluid passage 33. The sensor block 30 can be attached to the pipe 5C or the like.

  FIG. 3 is a cross-sectional view showing a state in which the sensor according to the present embodiment is attached to a sensor book. FIG. 4 is a cross-sectional view of the sensor body. FIG. 5 is a cross-sectional view showing members for attaching the sensor according to the present embodiment to the sensor block. FIG. 6 is a perspective view of the first sensor support member and the second sensor support member. FIG. 7 is a cross-sectional view of the sensor block. As shown in FIG. 3, the sensor 20 is attached to the sensor block 30. The sensor 20 includes a sensor main body 21, a sealing portion 20S, and a mounting portion 20F.

  As shown in FIG. 4, the sensor body 21 includes a detection unit 21S that detects a fluid state quantity inside a cylindrical protection body 21G, and a signal line 21W drawn from the protection body 21G and the detection unit 21S. Are covered with the resin 21P. As shown in FIG. 3, the sensor body 21 includes a part of the detection unit 21 </ b> S, that is, a protection body 21 </ b> G in which the detection unit 21 </ b> S is disposed in the fluid passage 33 through which the fluid (processing liquid HW in this embodiment) passes. A site (detected site) 21GS is arranged. In the present embodiment, the sensor body 21 is a temperature sensor that detects the temperature of the processing liquid HW. In the present embodiment, the sensor body 21 is a platinum resistance thermometer in which a platinum resistor is used for the detection unit 21S, but other thermometers, for example, a thermocouple or a thermistor or the like is used for the detection unit 21S. It may be.

  The detection unit 21S is disposed in the protector 21G and is protected by the protector 21G. The protection body 21G is a cylindrical member with a bottom. That is, the protective body 21G is a member having a bottom portion 21GB at one end portion 21GTA of the cylinder and an opening portion 21GH at the other end portion 21GTB. The detection unit 21S is disposed on the bottom 21GB side of the protection body 21G. The signal line 21W is drawn out from the opening 21GH of the protector 21G. In the present embodiment, the protective body 21G is made of stainless steel, but the material of the protective body 21G is not limited to this. For example, the protector 21G may be quartz or ceramic.

  The resin 21P covers the protector 21G and the signal line 21W. Since the resin 21P covers the entire protector 21G, the detection site 21GS where the detection unit 21S is disposed is also covered with the resin 21P. The resin 21P is in direct contact with the treatment liquid HW. This is for minimizing the mixing of impurities into the treatment liquid HW. For this reason, in the present embodiment, a fluororesin is used as the resin 21P. Since the fluororesin hardly generates foreign matter, it is particularly suitable when the sensor body 21 is applied to a semiconductor manufacturing process where foreign matter is to be eliminated as much as possible. Further, since the fluororesin is not easily affected by acid or alkali, it is suitable when the sensor body 21 is used in an environment using a highly corrosive acid such as hydrofluoric acid or sulfuric acid. With the structure as described above, the detection unit 21S detects the temperature (state quantity) of the processing liquid HW via the protector 21G and the resin 21P.

  As shown in FIG. 3, the sealing part 20 </ b> S is a part of the protective body 21 </ b> G and seals between the sensor main body 21 and the sensor block 30. The attachment portion 20F attaches the sensor body 21 to the sensor block 30 at the portion of the signal line 21W. In the present embodiment, a sealing portion 20S and a mounting portion 20F are provided at each end portion of the sensor support body 22 as a cylindrical member. The attachment portion 20F attaches the sensor main body 21 to the sensor block 30, and the sealing portion 20S seals between the sensor main body 21 and the sensor block 30, and processes in the fluid passage 33 from between the two. The liquid HW is prevented from flowing out.

  In this embodiment, as shown in FIGS. 3 and 5, the sealing portion 20 </ b> S is provided on the first ferrule 24 </ b> A as the first sensor support member and the one end portion 22 </ b> TA side of the sensor support body 22. 1st storage part 22UA which stores 24A. Then, the sealing unit 20S interposes the first ferrule 24A between the first storage unit 22UA and the sensor block 30. With such a structure, the sealing portion 20S allows the first ferrule 24A to pass through the portion of the protective body 21G of the sensor main body 21 and the resin in the portion of the protective body 21G of the sensor main body 21 via the first ferrule 24A. 21P is deformed in the thickness direction and sealed.

  In the present embodiment, the attachment portion 20F includes a second ferrule 24B as a first sensor support member, and a second storage portion 22UB that is provided on the other end portion 22TB side of the sensor support 22 and stores the second ferrule 24B. And a nut 23 as a fixing member for attaching the second ferrule 24B to the sensor support 22. Then, the mounting portion 20F stores the second ferrule 24B in the second storage portion 22UB, and screws the nut 23 into the other end portion 22TB side of the sensor support 22 so that the space between the nut 23 and the second storage portion 22UA. The second ferrule 24B is sandwiched between the two. With such a structure, the mounting portion 20F allows the second ferrule 24B to pass through the portion of the signal line 21W of the sensor main body 21 and the resin in the portion where the protective body 21G of the sensor main body 21 does not exist via the second ferrule 24B. 21P is deformed and fixed in the thickness direction.

  In the present embodiment, the sensor support 22, the nut 23, the first ferrule 24A, and the second ferrule 24B are all made of a fluororesin. Since the fluororesin hardly generates foreign matter, it is particularly suitable when the sensor 20 is applied to a semiconductor manufacturing process where foreign matter is to be eliminated as much as possible. In addition, since the fluororesin is not easily affected by acid or alkali, it is suitable when the sensor 20 is used in an environment using a highly corrosive acid such as hydrofluoric acid or sulfuric acid. Next, the structure of the sealing part 20S and the attachment part 20F will be described in more detail.

  The sealing portion 20S is disposed on the sensor block 30 side, and the attachment portion 20F is disposed at a position farther from the sensor block 30 than the sealing portion 20S. As described above, the sealing portion 20S is provided on the one end portion 22TA side of the sensor support 22, and the attachment portion 20F is provided on the other end portion 22TB side. For this reason, the sensor support 22 is disposed at the one end 22 TA side on the sensor block 30 side and at the other end 22 TB side away from the sensor block 30.

  The sensor support 22 is a cylindrical member having a through hole 22H penetrating from the one end 22TA toward the other end 22TB. The sensor body 21 penetrates the through hole 22H. The sensor support 22 covers a part of the sensor main body 21 that has penetrated the through hole 22H. As shown in FIG. 3, since a part of the protection body 21G of the sensor main body 21, a part of the signal line 21W, and the resin 21P covering them penetrate the through hole 22H, the sensor support 22 is , Covering these.

  The sensor support 22 has a first holding portion 22UA on the one end 22TA side. The first holding portion 22UA is a portion in which the through hole 22H is enlarged on the one end portion 22TA side, and opens to the one end portion 22TA of the sensor support body 22. That is, the through hole 22 </ b> H opens at one end 22 </ b> TA of the sensor support 22. The first holding portion 22UA has a circular inner surface. The first holding portion 22UA is provided with an internal thread 22F on the inner surface. The female screw 22F meshes with a male screw 34M (see FIG. 7) provided on a pedestal 34 of the sensor block 30 described later.

  The first holding unit 22UA holds the first ferrule 24A inside. Since the first holding portion 22UA is a portion where the diameter of the through hole 22H is enlarged, the first holding portion 22UA has a step portion 22DA. The first ferrule 24A is fitted into the inside from the opening portion 22KA of the first holding portion 22UA (that is, the opening portion of the through hole 22H). Then, the first ferrule 24A is locked to the step portion 22DA, and is stored and held in the first holding portion 22UA.

  The second holding portion 22UB that the sensor support 22 has on the other end 22TB side holds the second ferrule 24B inside. The second holding portion 22UB is a part of the through hole 22H. The through hole 22H has an inner diameter that increases toward the other end 22TB of the sensor support 22. This portion is the inclined portion 22S of the second holding portion 22UB. Accordingly, the inclined portion 22S has an inner diameter that decreases from the opening 22KB on the other end 22TB side toward the opening 22KA on the one end 22TA side. The shape of the cross section of the inclined portion 22S (the cross section when the inclined portion 22S is cut along a plane orthogonal to the through direction of the through hole 22H) is circular.

  The other end portion 22TB side of the sensor support 22 has a pedestal portion 22DB in which the diameter of the through hole 22H on the opening portion 22KB side is reduced. The pedestal 22DB is screwed with a nut 23. For this reason, the base portion 22DB has a male screw 22M that meshes with the female screw 23F of the nut 23 on the outer peripheral surface. Further, the pedestal part 22DB has the above-described second holding part 22UB. The second ferrule 24B is fitted into the second holding portion 22UB of the pedestal portion 22DB from the opening portion 22KB. Then, the nut 23 is screwed into the base portion 22DB, and the second ferrule 24B is sandwiched between the nut 23 and the inclined portion 22S of the second holding portion 22UB. The nut 23 has a through hole 23H. In the sensor main body 21 supported by the sensor support 22, the portion of the signal line 21W passes through the through hole 23H.

  As shown in FIG. 6, each of the first ferrule 24A and the second ferrule 24B is a frustoconical member, and includes an inclined portion 24S and a through hole 24H. The through hole 24H is a portion through which the sensor body 21 passes. The inclined portion 24S of the second ferrule 24B is in contact with the inclined portion 22S of the second holding portion 22UB that the pedestal portion 22DB of the sensor support 22 has. The inclined portion 24S of the first ferrule 24A is in contact with the inclined portion 22S (see FIG. 7) of the pedestal 34 of the sensor block 30. In the present embodiment, the first ferrule 24A and the second ferrule 24B both use the same member.

  As shown in FIG. 7, the sensor block 30 includes a block main body 30 </ b> B, a fluid inlet 31, a fluid outlet 32, a fluid passage 33, and a pedestal 34. The block main body 30 </ b> B has a hollow portion surrounded by a plurality of wall surfaces, and the hollow portion becomes the fluid passage 33. In the present embodiment, the block body 30B has a rectangular parallelepiped shape and has six wall surfaces. The shape of the block body 30B is not limited to a rectangular parallelepiped shape, and may be, for example, a spherical shape or a hemispherical shape. In the present embodiment, the sensor block 30 is made of a fluororesin. Since the fluororesin hardly generates impurities, it is suitable when the sensor block 30 is used in a semiconductor manufacturing process where impurities are to be removed as much as possible. In addition, since the fluororesin is not easily affected by acid or alkali, it is suitable when the sensor block 30 is used in an environment using a highly corrosive acid such as hydrofluoric acid.

  The fluid inlet 31 and the fluid outlet 32 communicate the fluid passage 33 and the outside of the sensor block 30. For example, in the fluid heating apparatus 1 shown in FIG. 2, the fluid inlet 31 and the fluid outlet 32 are connected to a part of the outflow pipe 15. Then, the processing liquid HW as a fluid flows into the fluid passage 33 from the fluid inlet 31 and the processing liquid HW flows out of the fluid outlet 32.

  The pedestal 34 is a cylindrical protrusion protruding from the outer surface of the block body 30B. The pedestal 34 has a through hole 35 penetrating from the outside of the block body 30 </ b> B toward the fluid passage 33. The through-hole 35 has a circular cross-sectional shape cut by a plane orthogonal to the penetration direction. The pedestal 34 has an inclined portion 34S whose inner diameter decreases from the opening 35HA of the through hole 35 on the outside of the block main body 30B toward the opening 35HB on the fluid passage 33 side. As described above, the inclined portion 34S is in contact with the inclined portion 24S of the first ferrule 24A. The pedestal 34 has an external thread 34M on the outer peripheral surface. The female screw 34M meshes with the female screw 22F of the first holding portion 22UA provided at the one end 21GTA of the sensor support 22 described above.

  Next, an example of a procedure for attaching the sensor main body 21 to the sensor block 30 will be described. The detection part 21GS of the sensor body 21 is inserted into and protruded from the through hole 24H of the first ferrule 24A. At this time, the one having the smaller outer diameter of the first ferrule 24A is set as the detection site 21GS side. Then, the sensor main body 21 is inserted through the through hole 22H of the sensor support 22, the through hole 24H of the second ferrule 24B, and the through hole 23H of the nut 23. At this time, the sensor support 22, the second ferrule 24 </ b> B, and the nut 23 are arranged in this order from the detection part 21 </ b> GS of the sensor main body 21 toward the signal line 21 </ b> W. The inclined portion 24S of the second ferrule 24B is opposed to the inclined portion 22S of the sensor support 22.

  Next, the detection part 21 GS of the sensor body 21 is inserted into the through hole 35 of the sensor block 30, and the detection part 21 GS is arranged in the liquid passage 33. At this time, the through hole 24 </ b> H of the first ferrule 24 </ b> A covers a part of the protector 21 </ b> G portion of the sensor body 21. Then, with the inclined portion 24S of the first ferrule 24A and the inclined portion 34S of the pedestal 34 of the sensor block 30 facing each other, the female screw 22F of the first storage portion 22UA of the sensor support 22 is replaced with the male screw 34M of the pedestal 34. Then, the sensor support 22 is fastened to the pedestal 34 of the sensor block 30. When the sensor support 22 is fastened to the pedestal 34, the step portion 22DA provided in the first storage portion 22UA of the sensor support 22 presses the inclined portion 24S of the first ferrule 24A against the inclined portion 34S of the pedestal 34. Then, due to the action of the wedge formed by the inclined portion 24S of the first ferrule 24A and the inclined portion 34S of the pedestal 34, a force that compresses the first ferrule 24A radially inward acts, and the inner diameter of the through hole 24H decreases. The through hole 24H of the first ferrule 24A tightens and deforms the resin 21P that covers the protective body 21G of the sensor body 21 from the outside.

  As a result, the sensor 20 seals between the sensor body 21 and the sensor block 30, more specifically, the through hole 35 included in the sensor block 30, with the sensor support 22 and the first ferrule 24 </ b> A. Since the through hole 35 of the sensor block 30 is connected to the fluid passage 33 of the sensor block 30, the sensor support 22 and the first ferrule 24 </ b> A seal between the sensor body 21 and the fluid passage 33. At the same time, in the sensor 20, the through hole 24H of the first ferrule 24A tightens the resin 21P from the outside thereof to generate a holding force, so that the sensor support 22 causes the sensor main body 21 to block the sensor body 21 via the first ferrule 24A. It can also be attached and fixed to. In addition, the function of the sealing part 20S having the first ferrule 24A is mainly the sealing, and attachment and fixing of the sensor body 21 are secondary functions.

  When the sensor support 22 is attached to the sensor block 30, the nut 23 is screwed into the male screw 22M of the pedestal portion 22DB included in the attachment portion 20F of the sensor support 22. At this time, the inclined portion 24S of the second ferrule 24B is opposed to the inclined portion 22S of the pedestal portion 22DB. Further, the through hole 24H of the second ferrule 24B covers a part of the sensor body 21 where the protective body 21G is not provided, that is, only a part of the part where only the signal line 21W is covered with the resin 21P. As a result, the end on the side from which the signal line 21W of the protective body 21G included in the sensor body 21 is drawn is disposed in the through hole 22H.

  When the nut 23 is screwed into the pedestal portion 22DB and fastened, the nut 23 presses the inclined portion 24S of the second ferrule 24B against the inclined portion 22S of the second storage portion 22UB of the pedestal portion 22DB. Then, due to the wedge action of the inclined portion 24S of the second ferrule 24B and the inclined portion 34S of the pedestal 34, a force that compresses the second ferrule 24B radially inward acts, and the inner diameter of the through hole 24H becomes smaller. The through hole 24H of the second ferrule 24B tightens and deforms the resin 21P covering the signal line 21W of the sensor body 21 from the outside.

  As a result, in the sensor 20, the through hole 24H of the second ferrule 24B tightens the resin 21P from the outside to generate a holding force. The part where the through hole 24H of the second ferrule 24B fastens the resin 21P does not have the protector 21G. For this reason, when the through hole 24H of the second ferrule 24B tightens the resin 21P, the resin 21P is greatly deformed, and a sufficient holding force for holding the sensor body 21 can be secured. As a result, the attachment portion 20F can reliably attach and fix the sensor body 21 to the sensor block 30.

  Further, the second ferrule 24B seals between the through hole 22H of the sensor support 22 and the sensor main body 21 by the through hole 24H of the second ferrule 24B tightening and deforming the resin 21P of the sensor main body 21. You can also. The function of the mounting portion 20F having the second ferrule 24B is mainly for mounting and fixing the sensor body 21, and the sealing between the through hole 22H of the sensor support body 22 and the sensor body 21 is secondary. It is a function.

  The sensor 20 mainly exhibits the function of the sealing portion 20S sealing between the through hole 22H of the sensor support 22 and the sensor main body 21, but by any chance the sealing function of the sealing portion 20S has deteriorated. In this case, the sealing function of the sensor 20 itself can be maintained by the sealing function of the mounting portion 20F. For example, even if the sealing function of the sealing part 20S is reduced and the processing liquid HW enters from between the through hole 22H of the sensor support 22 and the sensor main body 21, the sealing function of the mounting part 20F The treatment liquid HW remains in the through hole 22H of the sensor support 22. As a result, the sensor 20 can prevent the processing liquid HW from flowing out of the sensor support 22, and therefore can exhibit very high safety and reliability.

  In the above example, the mounting portion 20F is disposed at a position farther from the sensor block 30 than the sealing portion 20S, but the positional relationship between the sealing portion 20S and the mounting portion 20F may be opposite. That is, the mounting portion 20F may be disposed on the sensor block 30 side, and the sealing portion 20S may be disposed at a position farther from the sensor block 30 than the mounting portion 20F. However, by disposing the sealing portion 20S closer to the sensor block 30 than the attachment portion 20F, the sealing portion 20S having a higher sealing function can be disposed closer to the fluid passage 33. As a result, the leakage of the processing liquid HW from the fluid passage 33 can be more effectively suppressed.

  FIG. 8 is a diagram illustrating a state in which the sensor according to the present embodiment is attached to the sensor block. FIG. 9 is a diagram illustrating a state in which the sensor according to the comparative example is attached to the sensor block. In the sensor 20 according to the present embodiment and the sensor 200 according to the comparative example, the sensor main body 21 is attached to the sensor block 30, and the detection part 21 GS of the sensor main body 21 is disposed in the liquid passage 33. As shown in FIG. 4, for example, the sensor body 21 includes a detection unit 21 </ b> S and a part of the signal line 21 </ b> W disposed in a stainless steel protection body 21 </ b> G, and the protection body 21 </ b> G is covered with a resin 21 </ b> P. . When the sensor main body 21 covers the detection unit 21S and the signal line 21W only with the resin 21P, the resin 21P is soft, and thus the processing liquid HW flowing through the fluid passage 33 may cause vibration. For this reason, after arranging the detection unit 21S and the signal line 21W (not shown) in the protective body 21G having a rigidity higher than that of the resin 21P (for example, having a larger Young's modulus), the protective body is made of the resin 21P made of a fluororesin or the like. Cover 21G. With such a structure, vibration of the sensor main body 21 due to the processing liquid HW is suppressed.

  In the sensor 200 shown in FIG. 9, the first ferrule 24A is interposed between the nut 201 and the pedestal, and the nut 201 is screwed into the pedestal of the sensor block 30, thereby fixing the sensor body 21 and sealing the processing liquid HW. Stop. That is, the sensor 200 attaches the sensor main body 21 to the sensor block 30 and seals the processing liquid HW only by the sealing portion 20S of the sensor 20 shown in FIG. In this case, in the sensor 200, the first ferrule 24A is interposed in the protective body 21G of the sensor body 21.

  The sensor body 21 has a protective body 21G covered with a resin 21P. For this reason, in the sensor 200 of the comparative example, the force for holding the sensor main body 21 with the nut 201 and the first ferrule 24A is smaller than that without the protector 21G. As a result, the sensor 200 may be gradually removed from the sensor block 30 in a flow in which the pressure fluctuation in the fluid passage 33 increases due to a water hammer phenomenon or the like, or a flow in which a pressure impact is applied to the fluid passage 33. .

  In the sensor 20 of the present embodiment, the sealing portion 20S and the attachment portion 20F share the sealing function and the attachment and fixing function, respectively. The sealing portion 20S of the sensor 20 applies a tightening force to the resin 21P of the protective body 21G included in the sensor body 21 by the first ferrule 24A. For this reason, the sealing part 20 </ b> S of the sensor 20 has a relatively small holding force of the sensor body 21. However, the attachment portion 20F of the sensor 20 does not have the protective body 21G included in the sensor main body 21, and gives a tightening force to the resin 21P of only the signal line 21W by the second ferrule 24B. For this reason, since the attachment part 20F of the sensor 20 can increase the holding force of the sensor body 21, the sensor body 21 is reliably attached to the sensor block 30 by the attachment part 20F. Thus, according to this embodiment, the sensor 20 in which the detection unit 21S is disposed in the fluid can be reliably attached to the attachment target (sensor block 30). As a result, the sensor 20 can reduce the possibility that the sensor main body 21 comes off the sensor block 30 due to the water hammer phenomenon of the processing liquid HW flowing through the fluid passage 33 of the sensor block 30.

  Moreover, it replaces with the nut 201 of the sensor 200, and the sensor 20 is realizable by adding the sensor support body 22, the 2nd ferrule 24B, and the nut 23. FIG. Thus, the sensor 20 can reinforce the holding power of the sensor main body 21 having the protector 21 </ b> G only by adding parts and without changing existing facilities. The sensor 20 fixes the sensor body to the sensor body 21 and the sensor block 30 via the first ferrule 24A and the second ferrule 24B. Thus, since the sensor 20 uses two ferrules, the sealing function of the processing liquid HW can be improved. That is, the sensor 20 can reinforce the sealing function of the processing liquid HW only by adding components without changing existing equipment.

  In the present embodiment and its modifications, the resin 21P of the sensor body 21, the sensor support 22, the nut 23, the first ferrule 24A and the second ferrule 24B, and the sensor block 30 of the sensor 20 are all made of a fluororesin. ing. However, these are not necessarily made of fluororesin, and an appropriate material can be selected depending on the type of fluid with which the sensor 20 and the sensor block 30 are in contact. Moreover, it is not necessary to use the same material for the members (resin 21P of the sensor main body 21) and the sensor block 30 that the sensor 20 has, and select a material according to the type of fluid that the sensor 20 and the sensor block 30 are in contact with. Also good. The same applies to the following.

  FIG. 10 is a cross-sectional view showing the structure of the sealing portion according to the first modification of the present embodiment. In this modification, the sealing portion 20Sa of the sensor 20a is different in that it includes an O-ring 25 instead of the first ferrule 24A included in the sensor 20 described above. The O-ring 25 is disposed between the sensor support 22 and the base 34a of the sensor block 30a. The pedestal 34a has a recess 34U formed by partially enlarging the inner diameter of the through hole 35 on the inner diameter side of the portion facing the sensor support 22. The O-ring 25 is fitted into the recess 34U. The diameter of the O-ring is larger than the depth of the recess 34U.

  With the O-ring 25 attached to the outside of the resin 21P of the sensor main body 21 and fitted in the recess 34U of the pedestal 34a, the female screw 22F of the sensor support 22 is screwed into the male screw 34M of the pedestal 34, and the sensor support 22 is mounted on the pedestal. Fasten to 34a. At this time, a part of the protection body 21 </ b> G of the sensor body 21 is disposed in the through hole 22 </ b> H of the sensor support body 22. When the sensor support 22 is fastened to the pedestal 34a, the O-ring 25 is deformed by receiving a pressing force from the stepped portion 22DA of the sensor support 22 and the recess 34U of the pedestal 34. Due to the deformation of the O-ring 25, the space between the through hole 35 of the sensor block 30a and the resin 21P of the sensor body 21 is sealed. With such a structure, the sealing function of the sealing portion 20Sa may be realized.

  FIG. 11 is a cross-sectional view showing the structure of the sealing portion according to the second modification of the present embodiment. In the present modification, the sealing portion 20Sb of the sensor 20b has an O-ring 25 similarly to the sensor 20a described above. In the sensor 20b, the O-ring 25 is disposed between the sensor support 22b and the pedestal 34b of the sensor block 30b, but the O-ring 25 is disposed on the sensor support 22b side. Different from 20a.

  The sensor support 22b has an inclined portion 22DAS on the side of the through hole 22Hb of the step portion 22DA. The inclined portion 22DAS is a portion where the inner diameter of the through hole 22Hb increases toward the portion where the female screw 22F is provided. The pedestal 34b has a flat portion facing the sensor support 22b. The O-ring 25 is disposed between the inclined portion 22DAS of the sensor support 22b and the pedestal 34b.

  With the O-ring 25 attached to the outside of the resin 21P of the sensor body 21 and disposed between the sensor support and the pedestal 34b, the female screw 22F of the sensor support 22b is screwed into the male screw 34M of the pedestal 34b. 22b is fastened to the base 34b. At this time, a part of the protection body 21G of the sensor body 21 is disposed in the through hole 22Hb of the sensor support body 22b. When the sensor support 22b is fastened to the base 34b, the O-ring 25 is deformed by receiving a pressing force from the inclined portion 22DAS of the sensor support 22b and the base 34b. Then, due to the deformation of the O-ring 25, the space between the through hole 35 of the sensor block 30b and the resin 21P of the sensor body 21 is sealed. With such a structure, the sealing function of the sealing portion 20Sb may be realized.

DESCRIPTION OF SYMBOLS 1 Fluid heating apparatus 1E Fluid outlet 1I Fluid inlet 2 Control apparatus 3 Pump 3E Discharge port 3I Inlet 4 Filter 4E Fluid outlet 4I Fluid inlet 5A, 5B, 5C, 5D Pipe 6 Processing tank 6E Fluid outlet 6I Fluid inlet 7 Semiconductor wafer 10 Enclosure 11A, 11B Heating container 13A, 13B Heat shield plate 14 Inflow pipe 15 Outflow pipe 16 Heater 17 Connection pipe 20, 20a, 20b, 200 Sensor 20F Mounting part 20S, 20Sa, 20Sb Sealing part 21 Sensor body 21G Protector 21 GB Bottom portion 21 GH Opening portion 21 GS Detection site 21 GTA One end portion 21 GTB Other end portion 21 P Resin 21 S Detection portion 21 W Signal line 22 Sensor support 22 DA Step portion 22 DAS Inclination portion 22 DB Pedestal portion 22 H, 22 Hb Through-hole 22 KA, 22 KB Opening portion 22 UA Part 22UB second storage part 22S Part 22TA one end part 22TB other end part 23, 201 nut 23H through hole 24A first ferrule 24B second ferrule 24H through hole 24S inclined part 25 O-rings 30, 30a, 30b sensor block 30B block main body 31 fluid inlet 32 fluid outlet 33 liquid Passage 34, 34a, 34b Pedestal 34S Inclined portion 34U Recessed portion 35 Through hole 35HA, 35HB Opening portion 100 Semiconductor wafer processing apparatus

Claims (7)

A detection unit for detecting the temperature is disposed inside the cylindrical protective body, and the signal line drawn from the protective body and the detection unit is covered with resin, and the detection unit has a passage through which a fluid passes. A sensor body in which a part is arranged;
A sealing portion that provides a tightening force to the resin of the protective body portion and seals between the sensor main body and a sensor attachment target member having the passage and to which the sensor main body is attached;
An attachment portion for attaching the sensor body to the sensor attachment target member via the resin of the signal line portion;
A sensor comprising:   The sensor according to claim 1, wherein the attachment portion is disposed at a position farther from the sensor attachment target member than the sealing portion. A cylindrical member having a through-hole through which the sensor body passes;
The sealing portion is provided on one end side of the cylindrical member where the through hole opens,
The sensor according to claim 1 or 2, wherein the attachment portion is provided on the other end portion side of the cylindrical member in which the through hole is opened. The sealing portion sandwiches a first sensor support member through which the part of the protection body of the sensor body passes between the cylindrical member and the sensor attachment target member,
The attachment portion sandwiches the second sensor support member through which the signal line portion of the sensor body passes between the tubular member and a fixing member attached to the other end portion of the tubular member. The sensor according to claim 3.   The sensor according to claim 4, wherein a material of the cylindrical member, the first sensor support member, and the second sensor support member is a fluororesin. A detection unit for detecting the temperature of the fluid is disposed inside the cylindrical protective body, and the signal line drawn from the protection body and the detection unit is covered with resin, and the detection is performed in a passage through which the fluid passes. A sensor support that attaches a sensor body in which a portion of the part is disposed to a sensor attachment target member having the passage,
A cylindrical member having a through-hole through which the sensor body passes;
A sealing portion that is provided at one end of the cylindrical member and seals a gap between the sensor main body and the sensor attachment target member by applying a clamping force to the resin of the protector portion;
An attachment portion that is provided on the other end side of the cylindrical member and attaches the sensor body to the sensor attachment target member via the resin of the signal line portion;
A sensor support.   The sensor support according to claim 6, wherein the cylindrical member is a fluororesin.

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