JP5822928B2 - Electrolytic copper foil having high strength and low warpage and method for producing the same - Google Patents
Electrolytic copper foil having high strength and low warpage and method for producing the same Download PDFInfo
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
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Description
本発明は、強度が高く、かつ反りの少ない電解銅箔及びその製造方法に関し、特に二次電池負極集電体に有用である電解銅箔に関する。 The present invention relates to an electrolytic copper foil having high strength and little warpage and a method for producing the same, and more particularly to an electrolytic copper foil useful for a secondary battery negative electrode current collector.
電気めっきによって製造される電解銅箔は、電気・電子関連産業の発展に大きく寄与しており、印刷回路材や二次電池負極集電体として不可欠の存在となっている。電解銅箔の製造の歴史は古い(特許文献1及び特許文献2参照)が、最近は二次電池負極集電体としてその有用性が再確認されている。 Electrolytic copper foil produced by electroplating greatly contributes to the development of electrical and electronic industries, and is indispensable as a printed circuit material and a secondary battery negative electrode current collector. The manufacturing history of the electrolytic copper foil is old (see Patent Document 1 and Patent Document 2), but recently its usefulness as a secondary battery negative electrode current collector has been reconfirmed.
電解銅箔の製造例を示すと、例えば電解槽の中に、直径約3000mm、幅約2500mmのチタン製又はステンレス製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。
この電解槽の中に、銅、硫酸、にかわを導入して電解液とする。そして、線速、電解液温、電流密度を調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造している。An example of production of electrolytic copper foil is as follows. For example, in an electrolytic cell, a titanium or stainless steel rotating drum having a diameter of about 3000 mm and a width of about 2500 mm and an electrode distance of about 5 mm around the drum are arranged. Deploy.
Copper, sulfuric acid, and glue are introduced into this electrolytic cell to form an electrolytic solution. Then, the linear velocity, the electrolyte solution temperature, and the current density are adjusted, copper is deposited on the surface of the rotating drum, the copper deposited on the surface of the rotating drum is peeled off, and a copper foil is continuously produced.
この電解銅箔製造方法は製造コストの低減化を図ることができ、数μ程度の極めて薄い層厚から70μ程度の厚い銅箔まで製造することが可能であり、また電解銅箔の片面が適度な粗度を有するので、樹脂との接着強度が高いという、多くの利点を有している。 This electrolytic copper foil manufacturing method can reduce the manufacturing cost, and can manufacture from a very thin layer thickness of about several μ to a thick copper foil of about 70 μm, and one side of the electrolytic copper foil is moderate. Therefore, it has many advantages such as high adhesive strength with the resin.
近年、車載用電池負極材用銅箔として電解銅箔が使用されるが、その特性として電解銅箔の強度が高いことが要求されている。従来製造されている電解銅箔は、この耐熱性の要求に応えられる特性を有しているが、ロールから銅箔を引き出した際、箔が反るという問題がある。 In recent years, an electrolytic copper foil has been used as a copper foil for a battery negative electrode material for vehicles, and the strength of the electrolytic copper foil is required as its characteristics. Conventionally manufactured electrolytic copper foils have characteristics that can meet this heat resistance requirement, but there is a problem that when the copper foil is drawn from a roll, the foil warps.
これは電解銅箔の製造工程で発生する組織に原因があると考えられる。電解銅箔を使用して電池負極材を製造する工程では、この電解銅箔の反りは、好ましくないので、極力低減するか又は全く発生しないようにする必要がある。ここで反り量の評価方法として、電解銅箔をプレスにて100mm角シートに打ち抜き、室温で30分放置した際の4角の浮き上がり量の平均値と定義し、以降の検討を進めるものとする。 This is considered to be caused by the structure generated in the manufacturing process of the electrolytic copper foil. In the process of manufacturing the battery negative electrode material using the electrolytic copper foil, the warpage of the electrolytic copper foil is not preferable, and therefore it is necessary to reduce it as much as possible or not to occur at all. Here, as an evaluation method of the warpage amount, an electrolytic copper foil is punched out into a 100 mm square sheet with a press and defined as an average value of the four-corner lift amount when left at room temperature for 30 minutes, and the subsequent examination is to be advanced .
本発明は、強度が高く、かつ反りの少ない電解銅箔及びその製造方法に関し、特に二次電池負極集電体に有用である電解銅箔を提供することを課題とする。 The present invention relates to an electrolytic copper foil having high strength and little warpage, and a method for producing the same, and an object of the present invention is to provide an electrolytic copper foil that is particularly useful for a secondary battery negative electrode current collector.
本願は、次の発明を提供するものである。
(1)常態における引張り強さ( 以下、「常態引張り強さ」と称する。) が、45kgf/mm2〜55kgf/mm2であり、100mm角の四隅の浮き上がり量の平均値が2mm以下であることを特徴とする電解銅箔。
(3)電解銅箔の断面の結晶粒が、アスペクト比が2.0未満である微細粒子とアスペクト比が2.0以上の柱状粒子からなることを特徴とする上記(1)又は(2)記載の電解銅箔。
(4)柱状粒子の面積の合計が5%〜30%であり、残余が微細粒子であることを特徴とする上記(1)〜(3)のいずれか一項に記載の電解銅箔。The present application provides the following invention.
(1) Tensile strength in a normal state (hereinafter referred to as “normal tensile strength”) is 45 kgf / mm 2 to 55 kgf / mm 2 , and an average value of lifting heights at four corners of 100 mm square is 2 mm or less. An electrolytic copper foil characterized by that.
(3) The crystal grain of the cross section of the electrolytic copper foil is composed of fine particles having an aspect ratio of less than 2.0 and columnar particles having an aspect ratio of 2.0 or more. Electrolytic copper foil of description.
(4) The electrolytic copper foil according to any one of (1) to (3) above, wherein the total area of the columnar particles is 5% to 30%, and the remainder is fine particles.
また本願は、次の発明を提供する。
(5)アスペクト比が2.0未満である微細粒子の平均粒径が0.2μm以下あることを特徴とする上記(1)〜(4)のいずれか一項に記載の電解銅箔。
(6)二次電池負極集電体用銅箔であることを特徴とする上記(1)〜(5)のいずれか一項に記載の電解銅箔。
(7)硫酸系銅電解液を用いた電解法により電解銅箔を製造する方法において、電解液温度を60〜65°Cとし、電流密度を60〜120A/dm2として電解することを特徴とする電解銅箔の製造方法。
(8)硫酸系銅電解液を用いた電解法により電解銅箔を製造する方法において、電解液温度を60〜65°Cとし、電流密度を60〜120A/dm2として電解することにより、上記(1)〜(6)のいずれか一項に記載の電解銅箔を製造することを特徴とする電解銅箔の製造方法。The present application also provides the following invention.
(5) The electrolytic copper foil according to any one of (1) to (4) above, wherein an average particle diameter of fine particles having an aspect ratio of less than 2.0 is 0.2 μm or less.
(6) The electrolytic copper foil as described in any one of (1) to (5) above, which is a copper foil for a secondary battery negative electrode current collector.
(7) In a method for producing an electrolytic copper foil by an electrolytic method using a sulfuric acid-based copper electrolytic solution, electrolysis is performed at an electrolytic solution temperature of 60 to 65 ° C. and a current density of 60 to 120 A / dm 2. A method for producing electrolytic copper foil.
(8) In a method for producing an electrolytic copper foil by an electrolytic method using a sulfuric acid-based copper electrolytic solution, electrolysis is performed at an electrolytic solution temperature of 60 to 65 ° C. and a current density of 60 to 120 A / dm 2. The manufacturing method of the electrolytic copper foil characterized by manufacturing the electrolytic copper foil as described in any one of (1)-(6).
本発明は、強度が高く、かつ反りの少ない電解銅箔及びその製造方法に関し、特に二次電池負極集電体に有用である電解銅箔を提供できる優れた効果を有している。 The present invention relates to an electrolytic copper foil having high strength and less warpage and a method for producing the same, and particularly has an excellent effect of providing an electrolytic copper foil useful for a secondary battery negative electrode current collector.
本発明は、電解銅箔の中に、柱状の粒子と微細粒子が同時に存在するようにして、反りの発生がなく、強度を維持できる電解銅箔を提供するものである。本願発明の電解銅箔は、二次電池負極集電体用銅箔として特に有用である。
具体的には、柱状の粒子の存在が反り量を軽減させることができ、微細粒子の存在が強度を維持することができる。
すなわち、これによって電解銅箔の常態における引張り強さ( 以下、「常態引張り強さ」と称する。) を、45kgf/mm2〜55kgf/mm2とし、100mm角の四隅の浮き上がり量の平均値を2mm以下とすることができる。The present invention provides an electrolytic copper foil in which columnar particles and fine particles are present simultaneously in the electrolytic copper foil so that there is no warp and the strength can be maintained. The electrolytic copper foil of the present invention is particularly useful as a copper foil for a secondary battery negative electrode current collector.
Specifically, the presence of columnar particles can reduce the amount of warpage, and the presence of fine particles can maintain strength.
That is, thereby pulling in the normal state of the electrodeposited copper foil strength (hereinafter, referred to as "normal tensile strength."), And 45kgf / mm 2 ~55kgf / mm 2 , the average value of the floating amount of the four corners of 100mm square It can be 2 mm or less.
電流密度は高い方が、小さい粒子を形成でき、強度を高くすることができる。但し、低い場合でも本願発明の下限値を下回ることはない。むしろ反りの問題が大きい。すなわち、電流密度が60A/dm2未満では、反りを2mm以下にできる温度条件は存在しない。これは、粒子全体が大きくなって、柱状粒子が存在しても、効果が小さくなるためと考えられる。
他方、電流密度が120A/dm2を超えると全体が微細になり過ぎて、液温を上げても、柱状粒子が発生し難くなり、反りが大きくなると考えられる。The higher the current density, the smaller particles can be formed and the strength can be increased. However, even if it is low, it does not fall below the lower limit of the present invention. Rather, the problem of warping is large. That is, when the current density is less than 60 A / dm 2 , there is no temperature condition that can reduce the warp to 2 mm or less. This is presumably because the effect becomes small even when the whole particle becomes large and columnar particles are present.
On the other hand, when the current density exceeds 120 A / dm 2 , the whole becomes too fine, and even if the liquid temperature is raised, columnar particles are hardly generated, and it is considered that warpage increases.
以上から、適切な範囲は電解液温と電流密度の組み合わせが重要であることが分かる。適正な電流密度の範囲の中で、電流密度が低い場合には、液温は低いほうが望ましいと言える。また、電流密度が低い場合、もともと粒子が大きめであるため、液温を高くすると柱状粒の増加よりも全体の粒径の大きいことにより、柱状粒子があっても反りは大きくなる。
一方、適正な電流密度の範囲の中で、電流密度が高い場合には、液温が高い方が望ましい。電流密度が高い場合には、粒子径がもともと小さいため、液温がたかくないと柱状粒が発達しにくいためと考えられる。From the above, it can be seen that an appropriate range is a combination of the electrolyte temperature and the current density. When the current density is low within the range of the appropriate current density, it can be said that the liquid temperature is preferably low. In addition, when the current density is low, the particles are originally larger, and therefore, when the liquid temperature is increased, the overall particle size is larger than the increase of the columnar particles, so that the warp increases even if there are columnar particles.
On the other hand, when the current density is high in the appropriate current density range, it is desirable that the liquid temperature is high. This is probably because when the current density is high, the particle diameter is originally small, so that the columnar grains are difficult to develop unless the liquid temperature is high.
電解銅箔の組織内の粒子形状については、電解銅箔の断面を観察することにより、知ることができる。微細粒子については、アスペクト比(粒子の最大高さと最小幅の比)が2.0未満とすることができ、柱状粒子については、同様にアスペクト比が2.0以上として、両者の区別をすることができる。本発明の電解銅箔の組織内の粒子形状は、このアスペクト比によって、判別したものである。 The particle shape in the structure of the electrolytic copper foil can be known by observing the cross section of the electrolytic copper foil. For fine particles, the aspect ratio (ratio between the maximum height and minimum width of the particles) can be less than 2.0, and for columnar particles, the aspect ratio is 2.0 or more, and the two are distinguished. be able to. The particle shape in the structure of the electrolytic copper foil of the present invention is determined by this aspect ratio.
本発明においては、柱状粒子の面積の合計が10%〜55%とし、残余を微細粒子とすることができる。ここで「柱状粒子の面積」とは、電解銅箔の断面において観察できる「柱状粒子の面積」を意味する。これは、電解銅箔の反りを抑制し、かつ強度を維持できる好ましい形態である。
柱状粒子が少なすぎる場合、すなわち5%未満では反りが大きくなるので、好ましくない。また、30%を超えると逆に微細粒子が相対的に少なくなるので、強度が低下して好ましくない。したがって、柱状粒子の面積の合計が5%〜30%とするのが好適な条件と言える。In the present invention, the total area of the columnar particles can be 10% to 55%, and the remainder can be fine particles. Here, the “area of columnar particles” means “area of columnar particles” that can be observed in the cross section of the electrolytic copper foil. This is a preferred form that can suppress warping of the electrolytic copper foil and maintain strength.
When the amount of columnar particles is too small, that is, when it is less than 5%, warpage increases, which is not preferable. On the other hand, if it exceeds 30%, the number of fine particles is relatively decreased, which is not preferable because the strength is lowered. Therefore, it can be said that the preferable condition is that the total area of the columnar particles is 5% to 30%.
また、本発明においては、電解銅箔に存在する微細粒子、すなわちアスペクト比が2.0未満である微細粒子の平均粒径が0.2μm以下あることが望ましい。この微細粒子は上記の通り、強度を増加させる役割を担うものであり、平均粒径の下限値は特に制限はない。この微細粒子の平均粒径が大きくなる場合には、たとえ柱状の粒子が存在していても、反りの低減という柱状粒子の効果が減少するという傾向がある。したがって、微細粒子の平均粒径が0.2μm以下であることは、望ましい形態である。なお、二次電池負極集電体用銅箔の箔厚みに関し、20μm以下が望ましく、10μm以下がより好ましい。 Moreover, in this invention, it is desirable that the average particle diameter of the fine particle which exists in electrolytic copper foil, ie, the fine particle whose aspect ratio is less than 2.0, is 0.2 micrometer or less. As described above, the fine particles play a role of increasing the strength, and the lower limit value of the average particle size is not particularly limited. When the average particle size of the fine particles is large, even if columnar particles are present, the effect of columnar particles in reducing warpage tends to be reduced. Therefore, it is a desirable form that the average particle size of the fine particles is 0.2 μm or less. In addition, regarding the foil thickness of the copper foil for secondary battery negative electrode collectors, 20 micrometers or less are desirable and 10 micrometers or less are more preferable.
本願発明の電解銅箔は、硫酸系銅電解液を用いた電解法により電解銅箔を製造する。本願発明は、電解槽の中に、直径約3000mm、幅約2500mmのチタン製又はステンレス製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置した従来の電解銅箔製造装置を用いて、製造することができる。この装置の例は一例であり、装置の仕様に特に制限はない。 The electrolytic copper foil of the present invention is produced by an electrolytic method using a sulfuric acid-based copper electrolytic solution. The present invention relates to a conventional electrolytic copper foil in which a rotating drum made of titanium or stainless steel having a diameter of about 3000 mm and a width of about 2500 mm and an electrode is disposed with a distance of about 5 mm around the drum in an electrolytic cell. It can manufacture using a manufacturing apparatus. The example of this apparatus is an example and there is no restriction | limiting in particular in the specification of an apparatus.
この電解槽の中に、銅濃度:80〜110g/L、硫酸濃度:70〜110g/L、にかわ濃度:2.0〜10.0ppmを導入して電解液とする。
そして、線速:1.5〜5.0m/s、電解液温:60°C〜65°C、電流密度:60〜120A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造する。
すなわち、上記の通り、電解液温度を60〜65°Cとし、電流密度を60〜120A/dm2として電解することが、上記の特性を有する電解銅箔を得る好適な条件である。特に電解液温の調整は重要である。詳細は、実施例及び比較例で説明する。Into this electrolytic cell, a copper concentration: 80 to 110 g / L, a sulfuric acid concentration: 70 to 110 g / L, and a glue concentration: 2.0 to 10.0 ppm are introduced to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 1.5 to 5.0 m / s, the electrolyte temperature is adjusted to 60 ° C. to 65 ° C., and the current density is set to 60 to 120 A / dm 2 to deposit copper on the surface of the rotating drum, The copper deposited on the surface of the rotating drum is peeled off to continuously produce a copper foil.
That is, as described above, electrolysis with an electrolyte temperature of 60 to 65 ° C. and a current density of 60 to 120 A / dm 2 is a preferable condition for obtaining an electrolytic copper foil having the above characteristics. In particular, the adjustment of the electrolyte temperature is important. Details will be described in Examples and Comparative Examples.
この電解の表面又は裏面、さらには両面に、必要に応じて粗化処理を施すことができる。例えば、平均の表面粗さRaを0.04〜0.20μmとすることができる。この場合、平均の表面粗さRaの下限を0.04μmとする理由は、微細な粒子を形成し、密着性を良好にするためである。
これによって、例えば二次電池の活物質を極力多く塗布することが可能となり、電池の電気容量を高めることができる。他方、上限を0.20μmとする理由は、重量厚みのばらつきを少なくするためである。これによって、例えば二次電池の充放電特性を向上させることができる。これらの表面粗さは一例を示すものであり、電解銅箔の用途に応じて適宜調節できる。A roughening treatment can be applied to the surface or back surface of this electrolysis, or both surfaces as necessary. For example, the average surface roughness Ra can be set to 0.04 to 0.20 μm. In this case, the reason why the lower limit of the average surface roughness Ra is 0.04 μm is to form fine particles and improve the adhesion.
Thereby, for example, it becomes possible to apply as much active material as possible for the secondary battery, and the electric capacity of the battery can be increased. On the other hand, the reason for setting the upper limit to 0.20 μm is to reduce variation in weight thickness. Thereby, for example, the charge / discharge characteristics of the secondary battery can be improved. These surface roughnesses show an example and can be appropriately adjusted according to the use of the electrolytic copper foil.
また、二次電池用負極集電体用銅箔を例に挙げると、粗化処理面の粗化粒子の平均直径を0.1〜0.4μmとすることが望ましい。粗化粒子は、微細な粒子であると共に、その微細粒子がより均一であることが望まれる。これも、上記と同様に、電池活物質の密着性を向上させ、活物質を極力多く塗布して電池の電気容量を高めるために好ましい形態である。 Moreover, when taking a copper foil for a negative electrode current collector for a secondary battery as an example, it is desirable that the average diameter of the roughened particles on the roughened surface be 0.1 to 0.4 μm. It is desired that the roughened particles are fine particles and the fine particles are more uniform. Similarly to the above, this is a preferable mode for improving the adhesion of the battery active material and applying as much active material as possible to increase the electric capacity of the battery.
また、二次電池用負極集電体用銅箔は、粗化処理層の最大高さを0.2μm以下とすることが望ましい。これも粗化処理層の厚みばらつきを低減させ、電池活物質の密着性を向上させ、活物質を極力多く塗布して電池の電気容量を高めるために好ましい形態である。
本願発明は、この粗化粒子の厚みを0.2μm以下とする指標を基に、管理し、これを達成することが可能である。Moreover, as for the copper foil for negative electrode collectors for secondary batteries, it is desirable for the maximum height of a roughening process layer to be 0.2 micrometer or less. This is also a preferable mode for reducing the thickness variation of the roughening treatment layer, improving the adhesion of the battery active material, and increasing the electric capacity of the battery by applying as much active material as possible.
The present invention can be managed and achieved based on an index that makes the thickness of the roughened particles 0.2 μm or less.
二次電池用負極集電体用銅箔は、粗化粒子として、銅、コバルト、ニッケルの1種のめっき又はこれらの2種以上の合金めっきを形成することができる。通常、銅、コバルト、ニッケルの3者の合金めっきにより、粗化粒子を形成する。さらに、二次電池用負極集電体用銅箔は、耐熱性及び耐候(耐食)性を向上させるために、圧延銅合金箔の表裏両面の粗化処理面上に、コバルト−ニッケル合金めっき層、亜鉛−ニッケル合金めっき層、クロメート層から選択した一種以上の防錆処理層又は耐熱層及び/又はシランカップリング層を形成することが望ましい形態の要素である。 The copper foil for a negative electrode current collector for a secondary battery can form one type of plating of copper, cobalt, nickel or two or more types of alloy plating as roughened particles. Usually, roughened particles are formed by three-part alloy plating of copper, cobalt, and nickel. Furthermore, the copper foil for the negative electrode current collector for the secondary battery has a cobalt-nickel alloy plating layer on the roughened surface on both the front and back sides of the rolled copper alloy foil in order to improve heat resistance and weather resistance (corrosion resistance). It is an element of a desirable form to form one or more rust-proofing layers or heat-resistant layers and / or silane coupling layers selected from zinc-nickel alloy plating layers and chromate layers.
以上により、本発明の二次電池用負極集電体用銅箔は、表裏両面粗化処理後の圧延銅合金箔の銅箔幅方向の重量厚みばらつきを0.5%以下とすることができ、優れた二次電池用負極集電体用銅箔を提供することができる。 As described above, the copper foil for a negative electrode current collector for a secondary battery of the present invention can reduce the thickness variation in the copper foil width direction of the rolled copper alloy foil after the front and back surface roughening treatment to 0.5% or less. An excellent copper foil for a negative electrode current collector for a secondary battery can be provided.
本発明の二次電池用負極集電体用銅箔上の粗化処理を、例えば銅の粗化処理又は銅−コバルト−ニッケル合金めっき処理を施すことができる。
例えば、銅の粗化処理は、次の通りである。
銅粗化処理
Cu: 10〜25g/L
H2SO4: 20〜100g/L
温度: 20〜40°C
Dk: 30〜70A/dm2
時間: 1〜5秒The roughening treatment on the copper foil for the negative electrode current collector for the secondary battery of the present invention can be, for example, a copper roughening treatment or a copper-cobalt-nickel alloy plating treatment.
For example, the copper roughening treatment is as follows.
Copper roughening treatment Cu: 10 to 25 g / L
H 2 SO 4: 20~100g / L
Temperature: 20-40 ° C
Dk: 30 to 70 A / dm 2
Time: 1-5 seconds
また、銅−コバルト−ニッケル合金めっき処理による粗化処理は、次の通りである。電解めっきにより、付着量が15〜40mg/dm2銅−100〜3000μg/dm2コバルト−100〜500μg/dm2ニッケルであるような3元系合金層を形成するように実施する。この3元系合金層は耐熱性も備えている。Moreover, the roughening process by a copper-cobalt-nickel alloy plating process is as follows. It is carried out so as to form a ternary alloy layer having an adhesion amount of 15 to 40 mg / dm 2 copper-100 to 3000 μg / dm 2 cobalt-100 to 500 μg / dm 2 nickel by electrolytic plating. This ternary alloy layer also has heat resistance.
こうした3元系銅−コバルト−ニッケル合金めっきを形成するための一般的浴及びめっき条件は次の通りである。
(銅−コバルト−ニッケル合金めっき)
Cu:10〜20g/リットル
Co:1〜10g/リットル
Ni:1〜10g/リットル
pH:1〜4
温度:30〜50°C
電流密度Dk :20〜50A/dm2
時間:1〜5秒The general bath and plating conditions for forming such ternary copper-cobalt-nickel alloy plating are as follows.
(Copper-cobalt-nickel alloy plating)
Cu: 10-20 g / liter Co: 1-10 g / liter Ni: 1-10 g / liter pH: 1-4
Temperature: 30-50 ° C
Current density D k : 20 to 50 A / dm 2
Time: 1-5 seconds
粗化処理後、粗化面上にコバルト−ニッケル合金めっき層を形成することができる。このコバルト−ニッケル合金めっき層は、コバルトの付着量が200〜3000μg/dm2であり、かつコバルトの比率が60〜70質量%とする。この処理は広い意味で一種の防錆処理とみることができる。After the roughening treatment, a cobalt-nickel alloy plating layer can be formed on the roughened surface. The cobalt-nickel alloy plating layer has a cobalt adhesion amount of 200 to 3000 μg / dm 2 and a cobalt ratio of 60 to 70 mass%. This treatment can be regarded as a kind of rust prevention treatment in a broad sense.
コバルト−ニッケル合金めっきの条件は次の通りである。
(コバルト−ニッケル合金めっき)
Co:1〜20g/リットル
Ni:1〜20g/リットル
pH:1.5〜3.5
温度:30〜80°C
電流密度Dk :1.0〜20.0A/dm2
時間:0.5〜4秒The conditions for cobalt-nickel alloy plating are as follows.
(Cobalt-nickel alloy plating)
Co: 1-20 g / liter Ni: 1-20 g / liter pH: 1.5-3.5
Temperature: 30-80 ° C
Current density D k : 1.0 to 20.0 A / dm 2
Time: 0.5-4 seconds
コバルト−ニッケル合金めっき上に更に、亜鉛−ニッケル合金めっき層を形成することができる。亜鉛−ニッケル合金めっき層の総量を150〜500μg/dm2とし、かつニッケルの比率を16〜40質量%とする。これは、耐熱防錆層という役割を有する。A zinc-nickel alloy plating layer can be further formed on the cobalt-nickel alloy plating. The total amount of the zinc-nickel alloy plating layer is 150 to 500 μg / dm 2 and the nickel ratio is 16 to 40% by mass. This has the role of a heat and rust preventive layer.
亜鉛−ニッケル合金めっきの条件は、次の通りである。
(亜鉛−ニッケル合金めっき)
Zn:0〜30g/リットル
Ni:0〜25g/リットル
pH:3〜4
温度:40〜50°C
電流密度Dk :0.5〜5A/dm2
時間:1〜3秒The conditions for zinc-nickel alloy plating are as follows.
(Zinc-nickel alloy plating)
Zn: 0-30 g / liter Ni: 0-25 g / liter pH: 3-4
Temperature: 40-50 ° C
Current density D k : 0.5 to 5 A / dm 2
Time: 1-3 seconds
この後、必要に応じ、次の防錆処理を行うこともできる。好ましい防錆処理は、クロム酸化物単独の皮膜処理或いはクロム酸化物と亜鉛/亜鉛酸化物との混合物皮膜処理である。クロム酸化物と亜鉛/亜鉛酸化物との混合物皮膜処理とは、亜鉛塩または酸化亜鉛とクロム酸塩とを含むめっき浴を用いて電気めっきにより亜鉛または酸化亜鉛とクロム酸化物とより成る亜鉛−クロム基混合物の防錆層を被覆する処理である。 Then, the following rust prevention process can also be performed as needed. A preferable antirust treatment is a coating treatment of chromium oxide alone or a mixture coating treatment of chromium oxide and zinc / zinc oxide. Chromium oxide and zinc / zinc oxide mixture coating treatment is zinc or zinc comprising zinc oxide and chromium oxide by electroplating using a plating bath containing zinc salt or zinc oxide and chromate. It is the process which coat | covers the antirust layer of a chromium group mixture.
めっき浴としては、代表的には、K2Cr2O7、Na2Cr2O7等の重クロム酸塩やCrO3等の少なくとも一種と、水溶性亜鉛塩、例えばZnO 、ZnSO4・7H2Oなど少なくとも一種と、水酸化アルカリとの混合水溶液が用いられる。代表的なめっき浴組成と電解条件例は次の通りである。こうして得られた銅箔は、優れた耐熱性剥離強度、耐酸化性及び耐塩酸性を有する。As the plating bath, typically, at least one kind of dichromate such as K 2 Cr 2 O 7 and Na 2 Cr 2 O 7 and CrO 3 and a water-soluble zinc salt such as ZnO 4 and ZnSO 4 · 7H are used. A mixed aqueous solution of at least one kind such as 2 O and an alkali hydroxide is used. A typical plating bath composition and electrolysis conditions are as follows. The copper foil thus obtained has excellent heat resistance peel strength, oxidation resistance and hydrochloric acid resistance.
(クロム防錆処理)
K2Cr2O7(Na2Cr2O7或いはCrO3):2〜10g/リットル
NaOH或いはKOH :10〜50g/リットル
ZnO 或いはZnSO4・7H2O:0.05〜10g/リットル
pH:3〜13
浴温:20〜80°C
電流密度Dk :0.05〜5A/dm2
時間:5〜30秒
アノード:Pt-Ti 板、ステンレス鋼板等
クロム酸化物はクロム量として15μg/dm2以上、亜鉛は30μg/dm2以上の被覆量が要求される。(Chromium rust prevention treatment)
K 2 Cr 2 O 7 (Na 2 Cr 2 O 7 or CrO 3 ): 2 to 10 g / liter NaOH or KOH: 10 to 50 g / liter ZnO or ZnSO 4 · 7H 2 O: 0.05 to 10 g / liter pH: 3-13
Bath temperature: 20-80 ° C
Current density D k : 0.05 to 5 A / dm 2
Time: 5 to 30 seconds Anode: Pt—Ti plate, stainless steel plate, etc. Chromium oxide requires a coating amount of 15 μg / dm 2 or more, and zinc requires a coating amount of 30 μg / dm 2 or more.
最後に、必要に応じ、銅箔と樹脂基板との接着力の改善を主目的として、防錆層上の少なくとも粗化面にシランカップリング剤を塗布するシラン処理が施される。このシラン処理に使用するシランカップリング剤としては、オレフィン系シラン、エポキシ系シラン、アクリル系シラン、アミノ系シラン、メルカプト系シランを挙げることができるが、これらを適宜選択して使用することができる。 Finally, if necessary, silane treatment for applying a silane coupling agent to at least the roughened surface on the rust preventive layer is performed mainly for the purpose of improving the adhesive force between the copper foil and the resin substrate. Examples of the silane coupling agent used for the silane treatment include olefin silane, epoxy silane, acrylic silane, amino silane, and mercapto silane, which can be appropriately selected and used. .
塗布方法は、シランカップリング剤溶液のスプレーによる吹付け、コーターでの塗布、浸漬、流しかけ等いずれでもよい。例えば、特公昭60−15654号は、銅箔の粗面側にクロメート処理を施した後シランカップリング剤処理を行なうことによって銅箔と樹脂基板との接着力を改善することを記載している。詳細はこれを参照されたい。この後、必要なら、銅箔の延性を改善する目的で焼鈍処理を施すこともある。
上記については、主として二次電池用負極集電体に適用する本願発明の電解銅箔への付加的な表面処理層について説明したが、電解銅箔の用途に応じてこれらを任意に適用できることは言うまでもない。本発明はこれらを全て包含するものである。The application method may be any of spraying a silane coupling agent solution by spraying, coating with a coater, dipping, pouring and the like. For example, Japanese Examined Patent Publication No. 60-15654 describes that the adhesion between the copper foil and the resin substrate is improved by performing a chromate treatment on the rough side of the copper foil followed by a silane coupling agent treatment. . Refer to this for details. Thereafter, if necessary, an annealing treatment may be performed for the purpose of improving the ductility of the copper foil.
About the above, although the additional surface treatment layer to the electrolytic copper foil of this invention applied mainly to the negative electrode collector for secondary batteries was demonstrated, these can be arbitrarily applied according to the use of electrolytic copper foil. Needless to say. The present invention includes all of these.
以下、実施例及び比較例に基づいて説明する。なお、本実施例はあくまで一例であり、この例のみに制限されるものではない。すなわち、本発明に含まれる他の態様または変形を包含するものである。 Hereinafter, description will be made based on Examples and Comparative Examples. In addition, a present Example is an example to the last, and is not restrict | limited only to this example. That is, other aspects or modifications included in the present invention are included.
(実施例1)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:60°C、電流密度:84A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。Example 1
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity was adjusted to 3.0 m / s, the electrolyte temperature: 60 ° C., and the current density: 84 A / dm 2 , copper was deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum was peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:50%、微細粒子の大きさ:0.2μm未満、強度(常態引張り強さ):51.4kgf/mm2、反り量:1.5mmとなった。
いずれも本願発明の条件を満足していた。この結果を、同様に表1に示す。なお、表1において、「柱状粒子」を「柱状晶」と記載しているが、両者はいずれも「柱状晶からなる粒子」の意味であり、同一の意味で使用している。以下、同様である。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 50%, the size of the fine particles was less than 0.2 μm, the strength (normal tensile strength) was 51.4 kgf / mm 2 , and the amount of warpage was 1.5 mm.
All satisfied the conditions of the present invention. The results are also shown in Table 1. In addition, in Table 1, “columnar particles” are described as “columnar crystals”, both of which mean “particles composed of columnar crystals” and are used in the same meaning. The same applies hereinafter.
なお、実施例では、電流密度を84A/dm2とした場合である。さらに、この電解銅箔の断面の粒子形状を示す顕微鏡写真を図1に示す。この図1では、アスペクト比が2.0以上である柱状粒子とアスペクト比が2.0未満である微細粒子が混在しているという特徴を示している。In the embodiment, the current density is 84 A / dm 2 . Furthermore, the microscope picture which shows the particle shape of the cross section of this electrolytic copper foil is shown in FIG. FIG. 1 shows a feature that columnar particles having an aspect ratio of 2.0 or more and fine particles having an aspect ratio of less than 2.0 are mixed.
(実施例2)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:63°C、電流密度:84A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Example 2)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 3.0 m / s, the electrolyte temperature is 63 ° C., the current density is 84 A / dm 2 , copper is deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum is peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:29%、微細粒子の大きさ:0.2μm、強度(常態引張り強さ):50.7kgf/mm2、反り量:1.7mmとなった。
いずれも本願発明の条件を満足していた。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 29%, the size of the fine particles: 0.2 μm, the strength (normal tensile strength): 50.7 kgf / mm 2 , and the warpage amount: 1.7 mm.
All satisfied the conditions of the present invention. The results are also shown in Table 1.
(実施例3)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:63°C、電流密度:109A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Example 3)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 3.0 m / s, the electrolyte temperature is 63 ° C., the current density is 109 A / dm 2 , copper is deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum is peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:42%、微細粒子の大きさ:0.2μm未満、強度(常態引張り強さ):51.1kgf/mm2、反り量:1.8mmとなった。いずれも本願発明の条件を満足していた。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 42%, the size of the fine particles was less than 0.2 μm, the strength (normal tensile strength) was 51.1 kgf / mm 2 , and the amount of warpage was 1.8 mm. All satisfied the conditions of the present invention. The results are also shown in Table 1.
(実施例4)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:65°C、電流密度:84A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。Example 4
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 3.0 m / s, the electrolyte temperature is 65 ° C., the current density is 84 A / dm 2 , copper is deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum is peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:23%、微細粒子の大きさ:0.2μm、強度(常態引張り強さ):48.8kgf/mm2、反り量:1.4mmとなった。いずれも本願発明の条件を満足していた。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 23%, the size of the fine particles was 0.2 μm, the strength (normal tensile strength) was 48.8 kgf / mm 2 , and the amount of warpage was 1.4 mm. All satisfied the conditions of the present invention. The results are also shown in Table 1.
(実施例5)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:65°C、電流密度:97A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Example 5)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 3.0 m / s, the electrolyte temperature is 65 ° C., the current density is 97 A / dm 2 , copper is deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum is peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:32%、微細粒子の大きさ:0.2μm、強度(常態引張り強さ):49.2kgf/mm2、反り量:1.6mmとなった。いずれも本願発明の条件を満足していた。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 32%, the size of the fine particles was 0.2 μm, the strength (normal tensile strength) was 49.2 kgf / mm 2 , and the amount of warpage was 1.6 mm. All satisfied the conditions of the present invention. The results are also shown in Table 1.
(実施例6)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:65°C、電流密度:109A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Example 6)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 3.0 m / s, the electrolyte temperature is 65 ° C., the current density is 109 A / dm 2 , copper is deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum is peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:28%、微細粒子の大きさ:0.2μm、強度(常態引張り強さ):49.5kgf/mm2、反り量:1.7mmとなった。
いずれも本願発明の条件を満足していた。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 28%, the size of the fine particles: 0.2 μm, the strength (normal tensile strength): 49.5 kgf / mm 2 , and the warpage amount: 1.7 mm.
All satisfied the conditions of the present invention. The results are also shown in Table 1.
(実施例7)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:65°C、電流密度:120A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Example 7)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 3.0 m / s, the electrolyte temperature is 65 ° C., the current density is 120 A / dm 2 , copper is deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum is peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:52%、微細粒子の大きさ:0.2μm、強度(常態引張り強さ):51.0kgf/mm2、反り量:1.8mmとなった。いずれも本願発明の条件を満足していた。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 52%, the size of the fine particles: 0.2 μm, the strength (normal tensile strength): 51.0 kgf / mm 2 , and the warpage amount: 1.8 mm. All satisfied the conditions of the present invention. The results are also shown in Table 1.
(比較例1)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:57°C、電流密度:84A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Comparative Example 1)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 3.0 m / s, the electrolyte temperature is 57 ° C., the current density is 84 A / dm 2 , copper is deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum is peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:6%、微細粒子の大きさ:0.2μm未満、強度(常態引張り強さ):60.6kgf/mm2、反り量:7.5mmとなった。図2は、比較例1の電解銅箔の断面の粒子の形状を示す顕微鏡写真である。
前記実施例1の図1では、アスペクト比が2.0以上である柱状粒子とアスペクト比が2.0未満である微細粒子が混在する状態となっているのに対して、この比較例1の図2では、アスペクト比が2.0以上の柱状粒子が少なく、2.0未満の微細粒子が殆どであるという好ましくない傾向を示していた。すなわち、柱状粒子の面積の合計が10%以上という本願発明の要件を満たしていなかった。この結果を表1に示すが、実施例に比べて、反り量が増加する原因となった。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 6%, the size of the fine particles was less than 0.2 μm, the strength (normal tensile strength) was 60.6 kgf / mm 2 , and the amount of warpage was 7.5 mm. FIG. 2 is a photomicrograph showing the shape of the cross-sectional particles of the electrolytic copper foil of Comparative Example 1.
In FIG. 1 of Example 1, columnar particles having an aspect ratio of 2.0 or more and fine particles having an aspect ratio of less than 2.0 are in a mixed state. FIG. 2 shows an undesirable tendency that the number of columnar particles having an aspect ratio of 2.0 or more is small, and the fine particles having an aspect ratio of less than 2.0 are almost all. That is, the requirement of the present invention that the total area of the columnar particles was 10% or more was not satisfied. The results are shown in Table 1, which caused the amount of warpage to increase as compared with the example.
(比較例2)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:57°C、電流密度:97A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Comparative Example 2)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 3.0 m / s, the electrolyte temperature is 57 ° C., the current density is 97 A / dm 2 , copper is deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum is peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:0%、微細粒子の大きさ:0.2μm未満、強度(常態引張り強さ):64.4kgf/mm2、反り量:6.9mmとなった。いずれも本願発明の条件を満足していなかった。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 0%, the size of the fine particles was less than 0.2 μm, the strength (normal tensile strength) was 64.4 kgf / mm 2 , and the amount of warpage was 6.9 mm. None of them satisfied the conditions of the present invention. The results are also shown in Table 1.
(比較例3)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:57°C、電流密度:109A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Comparative Example 3)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 3.0 m / s, the electrolyte temperature is 57 ° C., the current density is 109 A / dm 2 , copper is deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum is peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:0%、微細粒子の大きさ:0.2μm未満、強度(常態引張り強さ):66.7kgf/mm2、反り量:8.1mmとなった。いずれも本願発明の条件を満足していなかった。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 0%, the size of the fine particles was less than 0.2 μm, the strength (normal tensile strength) was 66.7 kgf / mm 2 , and the amount of warpage was 8.1 mm. None of them satisfied the conditions of the present invention. The results are also shown in Table 1.
(比較例4)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:60°C、電流密度:61A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Comparative Example 4)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity was adjusted to 3.0 m / s, the electrolyte temperature: 60 ° C., and the current density: 61 A / dm 2 , copper was deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum was peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:5%、微細粒子の大きさ:0.2μm未満、強度(り強さ):50.3kgf/mm2、反り量:6.2mmとなった。
いずれも本願発明の条件を満足していなかった。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 5%, the size of the fine particles was less than 0.2 μm, the strength (pile strength) was 50.3 kgf / mm 2 , and the warpage amount was 6.2 mm.
None of them satisfied the conditions of the present invention. The results are also shown in Table 1.
(比較例5)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:60°C、電流密度:109A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Comparative Example 5)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity was adjusted to 3.0 m / s, the electrolyte temperature: 60 ° C., and the current density: 109 A / dm 2 , copper was deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum was peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:6%、微細粒子の大きさ:0.2μm未満、強度(常態引張り強さ):60.4kgf/mm2、反り量:6mmとなった。いずれも本願発明の条件を満足していなかった。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 6%, the size of the fine particles was less than 0.2 μm, the strength (normal tensile strength) was 60.4 kgf / mm 2 , and the amount of warpage was 6 mm. None of them satisfied the conditions of the present invention. The results are also shown in Table 1.
(比較例6)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:63°C、電流密度:61A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Comparative Example 6)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 3.0 m / s, the electrolyte temperature is 63 ° C., the current density is adjusted to 61 A / dm 2 , copper is deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum is peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:9%、微細粒子の大きさ:0.2μm、強度(常態引張り強さ):55.3kgf/mm2、反り量:12.6mmとなった。いずれも本願発明の条件を満足していなかった。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 9%, the size of the fine particles was 0.2 μm, the strength (normal tensile strength) was 55.3 kgf / mm 2 , and the amount of warpage was 12.6 mm. None of them satisfied the conditions of the present invention. The results are also shown in Table 1.
(比較例7)
電解槽の中に、直径約3133mm、幅2476.5mmのチタン製の回転ドラムと、ドラムの周囲に5mm程度の極間距離を置いて電極を配置する。この電解槽の中に、銅濃度:90g/L、硫酸濃度:80g/L、にかわ濃度:3ppmを導入して電解液とした。
そして、線速:3.0m/s、電解液温:70°C、電流密度:109A/dm2に調節し、回転ドラムの表面に銅を析出させ、回転ドラムの表面に析出した銅を剥ぎ取り、連続的に銅箔を製造した。(Comparative Example 7)
In the electrolytic cell, a rotating drum made of titanium having a diameter of about 3133 mm and a width of 2476.5 mm and an electrode distance of about 5 mm are arranged around the drum. A copper concentration: 90 g / L, a sulfuric acid concentration: 80 g / L, and a glue concentration: 3 ppm were introduced into this electrolytic cell to obtain an electrolytic solution.
Then, the linear velocity is adjusted to 3.0 m / s, the electrolyte temperature is set to 70 ° C., and the current density is set to 109 A / dm 2 to deposit copper on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum is peeled off. The copper foil was continuously manufactured.
この条件を表1に示す。このようにして製造した電解銅箔の柱状粒子の面積比、微細粒子の大きさ、強度(常態引張り強さ)、反り量を調べた。その結果、柱状粒子の面積比:83%、微細粒子の大きさ:0.5μm、強度(常態引張り強さ):43.0kgf/mm2、反り量:0.5mmとなった。いずれも本願発明の条件を満足していなかった。この結果を、同様に表1に示す。This condition is shown in Table 1. The area ratio of the columnar particles, the size of the fine particles, the strength (normal tensile strength), and the amount of warpage of the electrolytic copper foil thus produced were examined. As a result, the area ratio of the columnar particles was 83%, the size of the fine particles: 0.5 μm, the strength (normal tensile strength): 43.0 kgf / mm 2 , and the warpage amount: 0.5 mm. None of them satisfied the conditions of the present invention. The results are also shown in Table 1.
本発明は、常態引張り強さ及び加熱引張り強さが高く、かつ反りの少ない電解銅箔を提供できるので、特に二次電池用負極集電体用電解銅箔に有用である。 INDUSTRIAL APPLICABILITY The present invention is particularly useful for an electrolytic copper foil for a negative electrode current collector for a secondary battery because it can provide an electrolytic copper foil having a high normal tensile strength and a high heating tensile strength and little warpage.
Claims (9)
または、
電解銅箔の断面の結晶粒子であるアスペクト比が2.0以上の柱状粒子の面積の合計が10%〜55%であり、電解銅箔の断面の結晶粒子の残余がアスペクト比が2.0未満である微細粒子であることを特徴とする電解銅箔、
であって、
アスペクト比が2.0未満である微細粒子の平均粒径が0.2μm以下であることを特徴とする電解銅箔。 Tensile at normal strength (hereinafter, referred to as "normal tensile strength.") Is a 45kgf / mm 2 ~55kgf / mm 2 , the average value of the floating amount of the four corners of 100mm angle is not more 2mm or less, an aspect ratio An electrolytic copper foil, wherein the average particle size of the fine particles having a particle size of less than 2.0 is 0.2 μm or less,
Or
The total area of columnar particles having an aspect ratio of 2.0 or more, which are crystal particles in the cross section of the electrolytic copper foil, is 10% to 55%, and the remaining crystal particles in the cross section of the electrolytic copper foil have an aspect ratio of 2.0. Electrolytic copper foil, characterized by being fine particles that are less than
Because
You characterized electrostatic Kaidohaku an average particle size of the fine particles having an aspect ratio of less than 2.0 is 0.2μm or less.
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TWI697574B (en) * | 2019-11-27 | 2020-07-01 | 長春石油化學股份有限公司 | Electrolytic copper foil and electrode and lithium-ion battery comprising the same |
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US5403465A (en) * | 1990-05-30 | 1995-04-04 | Gould Inc. | Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives |
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