JP5808939B2 - Soldering method for conductive member - Google Patents

Description

  The present invention belongs to the technical field of soldering, and relates to a method of soldering a plurality of conductive members collectively to a plurality of conductive members provided on an insulating member.

  In Patent Document 1, terminals arranged at a predetermined pitch are opposed and overlapped, a band-shaped solder is interposed between the overlapping portions, the solder is melted by heating, and the overlapping portions are soldered. In the joining method of terminals to be joined, a fitting groove having the same pitch as the terminal arrangement is formed in the solder in advance, the fitting groove is fitted to one terminal, and the other terminal is placed on the upper surface of the fitting portion. A method of joining terminals that are superposed is disclosed. Further, this document also discloses a method for joining terminals in which notches are formed between fitting grooves formed in the solder.

  In Patent Document 2, a plurality of conductive terminals are arranged at an appropriate pitch interval along the longitudinal width direction of the elongated insulating housing, and arranged so as to extend along the longitudinal width direction of the insulating housing. A coaxial cable electrical connector is disclosed in which a coaxial cable center conductor is collectively connected to each of the conductive terminals using a long solder material.

  Patent Document 3 is a heater chip that has a long iron part that generates heat when energized, and that joins the article to be joined by bringing the tip surface of the iron part into pressure contact with or close to the article to be joined. Thus, a heater chip is disclosed which has a heat radiating portion extending in a fin shape on the opposite side of the tip surface of the iron integrally with the iron portion. According to this heater chip, the temperature characteristics during energization and immediately after the end of energization can be made uniform over the entire length of the long iron part, and uniform bonding quality can be obtained in the longitudinal direction of the iron part. Patent Document 4 also discloses a similar configuration.

  Patent Document 4 is a heater chip that joins the object to be joined by pressing or approaching the object to be joined. A heater chip having a heat radiating portion extending in a fin shape on the opposite side of the tip portion of the comb-shaped iron portion is disclosed. Furthermore, according to this heater chip, even if there is no space between adjacent joints, joining is possible without affecting the heat other than the joints.

Japanese Patent Publication No. 5-57718 JP 2007-305452 A JP 2009-160617 A JP 2010-253503 A

  As described above, the plurality of first conductive members are arranged on the plurality of second conductive members provided on the insulating member using the conventional bar-shaped solder so that the respective soldered portions are arranged in a line at intervals. When soldering in a lump, the amount of solder that forms each melted and hardened connection solder may not be uniform. In that case, the connection strength is lower than the target value in the connection solder in which the solder amount is excessively small, and the gap between adjacent connection solder portions is narrower than the target value in the connection solder in which the solder amount is excessive. . In addition, solder may be left unmelted or solder balls may be formed with rounded solder. If these are left untreated, the reliability of the product may not be sufficiently secured.

  Further, a plurality of contacts are provided on the housing of the electrical connector to form a plurality of poles, and the conductors exposed from the ends of the plurality of electric wires are aligned with the plurality of contacts, and the respective soldered portions are arranged in a row at intervals. In the case of performing soldering collectively using the rod-shaped solder, if the housing is provided with an inter-electrode wall that rises in the thickness direction from between the soldering portions of the adjacent contacts, soldering is performed. Sometimes, the interelectrode wall is damaged by receiving a heat load from the rod-shaped solder heated to a high temperature.

  The present invention has been made paying attention to such points, and the object of the present invention is to provide a rod-shaped solder provided with a thick portion and a thin portion along the longitudinal direction of the second conductive member. When the first conductive member is overlaid, the heater chip is heated and pressed against the first conductive member and the thick portion, or when pressed against the thin portion, the thin portions are preceded by the thick portions. It is divided in the longitudinal direction so that each thick part forms a large part of each connection solder, thereby ensuring the solder amount of each connection solder, ensuring the connection strength of each connection solder, and It is possible to secure a gap between adjacent connecting solders, to prevent unmelted solder and generation of solder balls to improve the reliability of the product, and to adjoin like the above-mentioned interelectrode wall Example between the soldered parts of the first conductive member For example, when there is a structure such as the interelectrode wall, if the step is provided between the thick part and the thin part on the surface of the first conductive member, the structure is damaged by a thermal load. An object of the present invention is to provide a method for soldering a conductive member that can be prevented and that improves positioning accuracy by using the structure.

In order to achieve the above object, according to the first conductive member soldering method of the present invention, a plurality of first conductive members are separated from each other by a plurality of second conductive members provided on the insulating member. This is a soldering method in which soldering is performed in a lump so as to be aligned in a row in the width direction. The method of soldering this conductive member is as follows:
One rod-shaped solder extending in the width direction is arranged on one side of the thickness direction orthogonal to the width direction of the soldering portion of the plurality of second conductive members, and the one of the rod-shaped solders in the thickness direction is disposed. A first step of disposing the soldered portions of the plurality of first conductive members on the side corresponding to the soldered portions of the plurality of second conductive members,
One heater chip extending in the width direction is disposed on the one side in the thickness direction of the soldered portion of the plurality of first conductive members to cause the heater chip to generate heat and to attach the heater chip to the plurality of first chips. A second step of contacting the soldered portion of one conductive member and pressing it toward the other side in the thickness direction.
The rod-shaped solder is provided at the intervals along the width direction, and has a width equal to or greater than the width of the soldered portion of each first conductive member on the one side in the thickness direction. And a second surface having a width equal to or less than the width of the soldered portion of each second conductive member on the other side in the thickness direction. Between the plurality of thick portions corresponding to the soldered portions of the two conductive members and the adjacent thick portions, the one side surface in the thickness direction is the first surface of the thick portion. Each having a thin portion provided to be continuous, and the thickness of the thick portion is formed to be thicker than the thickness of other portions including the thin portion,
The heater chip is provided at the interval along the width direction, and from the portion corresponding to at least the center of each thick portion to the other side in the thickness direction when viewed in the thickness direction. Provided between the first iron part projecting and the first iron part adjacent to each other, and in the second step, each soldering part and each thick wall of each first conductive member by each first iron part. When the portion is heated and pressed toward the other side in the thickness direction, the thin portion contacts the surface of the thin portion when the thin portion is displaced toward the one side in the thickness direction. And a second iron part provided respectively.

  In the first step, the rod-shaped solder is disposed on one side in the thickness direction of the soldering portion of the plurality of second conductive members, and the plurality of the plurality of second conductive members are disposed on the one side in the thickness direction of the rod-shaped solder. The soldering portions of the first conductive member are respectively arranged corresponding to the soldering portions of the plurality of second conductive members, and then in the second step, the thickness of the soldering portion of the first conductive member is set. The heater chip is disposed on the one side in the vertical direction, the heater chip generates heat, and the heater chip is brought into contact with the soldered portions of the plurality of first conductive members toward the other side in the thickness direction. When pressed, the thick-walled portion and the thin-walled portion of the rod-shaped solder are melted, and the soldered portion of the first conductive member is respectively applied to the soldered portion of the second conductive member. It is soldered.

  In that case, in the second step, the soldering part and the thick parts of the first conductive members are heated by the first iron parts of the heater chip and directed toward the other side in the thickness direction. When pressed, the thick part is deformed so that the thin part is lifted toward the one side in the thickness direction and comes into contact with the second iron part and melts. It is divided in the longitudinal direction before each of the thick parts. Therefore, the bar-shaped solder is separated in the width direction at the thin portions, and the thick portions are independent. Next, each of the independent thick portions is melted and solidified between the corresponding soldered portion of each of the first conductive members and the corresponding soldered portion of each of the second conductive members. Since most of each connection solder is formed between the soldering portion of the conductive member and the soldering portion of the second conductive member, the amount of solder of each connection solder is ensured without excess or deficiency. . Therefore, the connection strength of each of the connection solders is ensured and a gap between adjacent connection solders is ensured. Further, when the rod-shaped solder is heated, the thin portions are melted before the thick portions, so that when the thick portions are melted, the thin portions are not likely to remain solid. Since the unmelted solder and solder balls are not easily generated between the connecting solders, the reliability of the product is improved. Further, when the rod-shaped solder contains a paste, the thin-walled parts are divided in the longitudinal direction at a relatively early stage after the heating of the rod-shaped solder starts, so the paste contained in the rod-shaped solder is It is easy to be eluted from the divided surface, and the rod-like solder is prevented from bursting by the gasified paste. This also makes it difficult for solder balls to be generated, improving the reliability of the product.

  Furthermore, when there is a structure such as the inter-electrode wall between the soldered portions of the adjacent first conductive members, the thin portions between the thick portions adjacent to each other are respectively included in the respective structures. opposite. Therefore, if the step is provided in the thick portion and the thin portion on the surface of the first solder member in the rod-shaped solder, the thin portion can be reliably separated from the structure. It becomes possible to prevent the structure from being damaged by the heat load. Moreover, since the thick portions fit on both sides of the structure in the width direction, the accuracy of positioning the rod-shaped solder to the soldered portion of the first conductive member is improved, and the amount of solder of each connection solder varies. To reduce.

The second conductive member soldering method according to the present invention includes a plurality of first conductive members arranged in a row in the width direction with a plurality of second conductive members provided on the insulating member, with each soldering portion spaced apart. This is a soldering method in which soldering is performed in a lump so as to line up. The method of soldering this conductive member is as follows:
One rod-shaped solder extending in the width direction is arranged on one side of the thickness direction orthogonal to the width direction of the soldering portion of the plurality of second conductive members, and the one of the rod-shaped solders in the thickness direction is disposed. A first step of disposing the soldered portions of the plurality of first conductive members on the side corresponding to the soldered portions of the plurality of second conductive members, respectively,
One heater chip extending in the width direction is disposed on the one side in the thickness direction of the soldered portion of the plurality of first conductive members to cause the heater chip to generate heat and to attach the heater chip to the plurality of first chips. A second step of contacting the soldered portion of one conductive member and pressing it toward the other side in the thickness direction.
The rod-shaped solder is provided at the intervals along the width direction, and has a width equal to or greater than the width of the soldered portion of each first conductive member on the one side in the thickness direction. And a second surface having a width equal to or less than the width of the soldered portion of each second conductive member on the other side in the thickness direction. A plurality of thick portions corresponding to the soldered portions of the two conductive members, and a thin portion provided between the adjacent thick portions, and the thickness of the thick portion is the thickness of the thin portion. It is formed thicker than the thickness of other parts including
The heater chip is provided at the interval along the width direction, and a first iron part provided at a portion corresponding to at least a central part of each of the thick portions as viewed in the thickness direction; The first protrusion protrudes to the other side in the thickness direction from the first iron portion at a portion corresponding to at least the central portion of each thin portion between the first iron portions adjacent to each other in the thickness direction. 2 iron parts.

  In the first step, the rod-shaped solder is disposed on one side in the thickness direction of the soldering portion of the plurality of second conductive members, and the plurality of the plurality of second conductive members are disposed on the one side in the thickness direction of the rod-shaped solder. The soldering portions of the first conductive member are respectively arranged corresponding to the soldering portions of the plurality of second conductive members, and then in the second step, the thickness of the soldering portion of the first conductive member is set. The heater chip is disposed on the one side in the vertical direction, the heater chip generates heat, and the heater chip is brought into contact with the soldered portions of the plurality of first conductive members toward the other side in the thickness direction. When pressed, the thick-walled portion and the thin-walled portion of the rod-shaped solder are melted, and the soldered portion of the first conductive member is respectively applied to the soldered portion of the second conductive member. It is soldered.

  In that case, when each said thin part is heated by the said 2nd iron part of the said heater chip in the said 2nd process and is pressed toward the said other side of the said thickness direction, each said 2nd iron part will be It melts in contact with the thin portions, and is divided in the longitudinal direction before the thick portions. Therefore, the bar-shaped solder is separated in the width direction at the thin portions, and the thick portions are independent. Next, each of the independent thick portions is melted and solidified between the corresponding soldered portion of each of the first conductive members and the corresponding soldered portion of each of the second conductive members. Since most of each connection solder is formed between the soldering portion of the member and the soldering portion of the second conductive member, the solder amount of each connection solder is ensured without excess or deficiency. Therefore, the connection strength of each of the connection solders is ensured and a gap between adjacent connection solders is ensured. Further, when the rod-shaped solder is heated, the thin portions are melted before the thick portions, so that when the thick portions are melted, the thin portions are not likely to remain solid. Since the unmelted solder and solder balls are not easily generated between the connecting solders, the reliability of the product is improved. Further, when the rod-shaped solder contains a paste, the thin-walled parts are divided in the longitudinal direction at a relatively early stage after the heating of the rod-shaped solder starts, so the paste contained in the rod-shaped solder is It is easy to be eluted from the divided surface, and the rod-like solder is prevented from bursting by the gasified paste. This also makes it difficult for solder balls to be generated, improving the reliability of the product.

  Furthermore, when there is a structure such as the inter-electrode wall between the soldered portions of the adjacent first conductive members, the thin portions between the thick portions adjacent to each other are respectively included in the respective structures. opposite. Therefore, if the step is provided in the thick portion and the thin portion on the surface of the first solder member in the rod-shaped solder, the thin portion can be reliably separated from the structure. It becomes possible to prevent the structure from being damaged by the heat load. Moreover, since the thick portions fit on both sides of the structure in the width direction, the accuracy of positioning the rod-shaped solder to the soldered portion of the first conductive member is improved, and the amount of solder of each connection solder varies. To reduce.

The third conductive member soldering method of the present invention is the above-described first or second conductive member soldering method,
The rod-shaped solder has a flat surface formed on one side in the thickness direction, and has a groove extending in the depth direction perpendicular to the width direction and the thickness direction while being recessed in the thickness direction from the other side of the thickness direction. One or two or more are formed, the thick portions are formed on both sides of the groove in the width direction, and the thin portions are formed between one surface in the thickness direction and the groove. .

  In this way, the rod-shaped solder can be realized with a relatively simple configuration. Further, when there is a structure such as the interpolar wall between the soldering portions of the adjacent first conductive members such as the interpolar wall, the rod-shaped solder has the respective grooves in the respective structures. Since the thin-walled portion can be reliably separated from each structure, it is possible to prevent the structure from being damaged by a thermal load. Since the thick part fits on both sides in the width direction of the structure, the positioning accuracy of the rod-like solder to the soldered part of the first conductive member is improved, and variation in the solder amount of each connection solder is reduced. To do.

The fourth method for soldering a conductive member according to the present invention is the soldering method for a conductive member according to any one of the first to third aspects.
In the middle of the width direction in the thin portion, a narrow portion where the cross-sectional area when the cross section is taken along the surface facing the width direction is the smallest in the thin portion is formed.

  In this way, when the rod-shaped solder is heated, the narrow portion of the thin portions melts first, so that the probability that the rod-shaped solder is separated in the width direction at the thin portions is increased. Thus, the actions and effects obtained by the soldering method for the first or second conductive member can be obtained more reliably. Further, since the rod-shaped solder is separated in the width direction in the narrow portions, and the thick portions are independent of each other, the thin portions separated in the middle of the width direction into the independent thick portions. A piece of crack is absorbed. Therefore, the amount of solder of each connection solder is more accurately ensured, and variation is reduced. Therefore, the connection strength of each connection solder and the clearance between adjacent connection solders can be more reliably obtained, and the unmelted solder and solder balls are more unlikely to be generated between the connection solders. The reliability of the product will be improved.

The fifth conductive member soldering method of the present invention may be any one of the first to fourth conductive member soldering methods described above.
A receiving portion that is recessed in the thickness direction and into which the soldering portion of the first conductive member enters is formed on the first surface of the thick portion.

  In this way, if the soldering part of the first conductive member is inserted into the receiving part during soldering, the soldering part does not move carelessly, so that the soldering workability is improved. To do.

A sixth method for soldering a conductive member of the present invention is the method for soldering a conductive member according to any one of the first to fifth aspects.
Each of the first conductive members is a conductor exposed from the end of the wire,
The insulating member is a housing of an electrical connector having a plurality of poles, and each of the second conductive members is a contact that constitutes each of the poles of the electrical connector. An inter-electrode wall that rises in the thickness direction from between the soldered parts is provided,
The plurality of first conductive members, the plurality of second conductive members, and the rod-shaped solder, and the soldered portions of the first conductive members on the first surface of the thick portions of the rod-shaped solder, respectively. When the soldering portions of the second conductive members are in contact with the second surface, the thin portions between the adjacent thick portions are in contact with the interpolar walls. Arrange them to face each other.

  By this method of soldering the conductive member, the conductor of the electric wire is soldered to the soldered portion of the contact of the electrical connector having the interelectrode wall using the rod-shaped solder. The first surface of each thick part of the rod-shaped solder is in contact with the soldered part of the conductor of each electric wire, and the second surface is in contact with the soldered part of each of the contacts. Each said thin part between the said thick part adjacent to each said interelectrode wall opposes, respectively. Therefore, if the step is provided between the thick portion and the thin portion on the contact side surface of the rod-shaped solder, the thin portion can be reliably separated from the interpolar wall. Can be prevented from being damaged by a thermal load, and the thick-walled portions are fitted on both sides in the width direction of the inter-electrode wall, so that the positioning accuracy of the bar-shaped solder to the electrical connector is improved, and each of the connections Variation in solder amount of solder is reduced.

  The soldering method for the first conductive member of the present invention includes the rod-shaped solder in which the thickened portion and the thinned portion are provided along the longitudinal direction in the soldered portion of the second conductive member, and the first soldered portion. When the soldering part of one conductive member is overlapped, and the heater chip is heated to press the soldering part and the thick part of the first conductive member, the thin parts are more than the thick parts. Since each of the thick portions was previously formed in the longitudinal direction so as to form a large part of each of the connection solders, the solder amount of each of the connection solders was ensured and the connection strength of each of the connection solders was ensured. In addition, it is possible to secure a gap between adjacent connecting solders, to prevent unmelted solder and generation of solder balls, and to improve the reliability of the product. Matching first conductive member c For example, when there is a structure such as the inter-electrode wall between the damming parts, the structure is subjected to a thermal load if a step is provided between the thick part and the thin part on the surface of the first conductive member. As a result, it is possible to prevent damage and improve positioning accuracy using the structure.

  The soldering method for the second conductive member according to the present invention includes: the rod-shaped solder in which the thickened portion and the thinned portion are provided along the longitudinal direction in the soldered portion of the second conductive member; When the soldering portion of one conductive member is overlapped, the heater chip generates heat and is pressed against the thin portion, the thin portions are divided in the longitudinal direction before the thick portions, and the thicknesses are increased. Since the meat portion forms most of each connection solder, the solder amount of each connection solder is secured, and the connection strength of each connection solder and the clearance between adjacent connection solders are ensured. In addition, it is possible to improve the reliability of the product by preventing the unmelted solder and the generation of solder balls, and between the soldered portions of the adjacent first conductive members, such as the inter-electrode wall. For example, When there is a structure, it is possible to prevent the structure from being damaged by a thermal load by providing a step between the thick part and the thin part on the surface of the first conductive member. The positioning accuracy can be improved by using the structure.

  The soldering method for the third conductive member of the present invention provides the effects obtained by the soldering method for the first or second conductive member, and further, the first conductive member with the relatively simple configuration. When a rod-like solder can be realized and there is a structure such as the inter-electrode wall between the soldering portions of the adjacent first conductive members such as the inter-electrode wall, the structure is subjected to a thermal load. It is possible to prevent damage from being caused by the above, and it is possible to improve the positioning accuracy of the first conductive member to the soldering portion, and to reduce the variation in the solder amount of each connection solder.

The fourth method for soldering a conductive member of the present invention provides the effects obtained by the soldering method for any one of the first to third conductive members, and further provides the connection solder of each of the above-mentioned connection solders. Since the amount of solder is more accurately ensured and the variation is reduced, it is possible to more reliably obtain the connection strength of each connection solder and the clearance between adjacent connection solders, and each connection solder. During this time, unmelted solder and solder balls are less likely to be generated, and the reliability of the product can be improved.

  The fifth conductive member soldering method of the present invention provides the effect obtained by the soldering method for any one of the first to fourth conductive members, and further, when soldering. The soldering part of the first conductive member is locked to the receiving part and is difficult to move carelessly, so that the soldering workability can be improved.

  The sixth method for soldering a conductive member according to the present invention provides the effect obtained by the soldering method for any one of the first to fifth conductive members, and further provides the above-mentioned inter-electrode wall. The method of soldering the conductor of an electric wire to the said contact of the electrical connector provided with this was able to be disclosed concretely.

FIG. 1 shows the electric wire when connecting a conductor of an electric wire to a contact of an electric connector using the first embodiment and the second embodiment of the method for soldering a conductive member of the present invention, the rod-shaped solder, It is the perspective view which decomposed | disassembled and showed the said electrical connector. FIG. 2 is a perspective view of the electric wire, the rod-shaped solder, and the electrical connector shown in FIG. 1 when assembled. FIG. 3 is a cross-sectional view of the bar-shaped solder in FIG. 2 taken along a cross-sectional line transverse to the longitudinal direction. FIG. 4 is a perspective view of the rod-shaped solder used in the method of soldering a conductive member according to the first embodiment and the second embodiment. Viewed from the first surface side of the thick part. FIG. 5 is a perspective view of the rod-like solder shown in FIG. Viewed from the second surface side of the thick part. FIG. 6 is a front view of the rod-shaped solder of FIG. FIG. 7 is a schematic explanatory view showing a heat fusion apparatus used in the method of soldering a conductive member according to the first embodiment. FIG. 8 is a perspective view showing a heater chip mounted on the heat fusion apparatus used in the soldering method for the conductive member of the first embodiment. FIG. 9 is a perspective view of the heater chip of FIG. 8 as seen from another angle. FIG. 10 to FIG. 13 are front views for explaining the conductive member soldering method according to the first embodiment. In any of the figures, the heater chip, the electric wire, the rod-shaped solder, and the main part of the electric connector are shown. The said electric wire represents only the soldering part and has omitted other parts. In FIG. 10, the rod-shaped solder and the electric wire are overlapped on the contact. FIG. 11 is a view corresponding to FIG. 10 showing a state where the heater chip is pressed against the electric wire. FIG. 12 is a view corresponding to FIG. 10 showing a state where the heater chip is further pressed against the electric wire. FIG. 13 is a view corresponding to FIG. 10 showing a state where the soldering is completed and the heater chip is separated from the connection solder. FIG. 14 is a perspective view of a first modification of the rod-shaped solder used in the method for soldering a conductive member according to the first embodiment and the method for soldering a conductive member according to the second embodiment. Viewed from the first surface side of the thick part. FIG. 15 is a perspective view of a first modification of the rod-shaped solder. Viewed from the second surface side of the thick part. FIG. 16 is a perspective view of a second modification of the rod-like solder used in the conductive member soldering method of the first embodiment and the conductive member soldering method of the second embodiment. Viewed from the first surface side of the thick part. FIG. 17 is a perspective view of a second modification of the rod-shaped solder. Viewed from the second surface side of the thick part. FIG. 18 is a perspective view of a third modification of the rod-like solder used in the conductive member soldering method of the first embodiment and the conductive member soldering method of the second embodiment. Viewed from the first surface side of the thick part. FIG. 19 is a perspective view of a third modification of the rod-shaped solder. Viewed from the second surface side of the thick part. FIG. 20 is an enlarged plan view of a part of a third modification of the rod-shaped solder. FIG. 21 is a perspective view of a fourth modified example of the rod-shaped solder used in the conductive member soldering method according to the first embodiment and the conductive member soldering method according to the second embodiment. Viewed from the first surface side of the thick part. FIG. 22 is a perspective view of a fourth modification of the rod-shaped solder. Viewed from the second surface side of the thick part. FIG. 23 is a front view of a fourth modification of the rod-shaped solder. FIG. 24 is a schematic explanatory view showing a heat-sealing device used in the soldering method for conductive members according to the second embodiment. FIG. 25 is a perspective view showing a heater chip attached to the heat fusion apparatus used in the soldering method of the conductive member of the second embodiment. FIG. 26 is a perspective view of the heater chip of FIG. 25 as seen from another angle. FIGS. 27 to 30 are front views for explaining a method of soldering a conductive member according to the second embodiment. In any of the figures, the heater chip, the electric wire, the rod-shaped solder, and the main part of the electric connector are shown. The said electric wire represents only the soldering part and has omitted other parts. In FIG. 27, the rod-shaped solder and the electric wire are overlaid on the contact. FIG. 28 is a view corresponding to FIG. 27 showing a state where the heater chip is pressed against the electric wire. FIG. 29 is a view corresponding to FIG. 27 showing a state where the heater chip is further pressed against the electric wire. FIG. 30 is a view corresponding to FIG. 27 showing a state where the soldering is completed and the heater chip is separated from the connection solder.

  Embodiments of the method for soldering a conductive member of the present invention will be described below. In the method for soldering conductive members according to the first embodiment of the present invention, the plurality of first conductive members 222 and 230 are connected to the plurality of second conductive members 320 provided on the insulating member 310, the first conductive member 222, In this soldering method, the soldering parts 222a and 230a of 230 and the soldering part 321 of the second conductive member 320 are collectively soldered so that they are arranged in a line in the width direction to be described later. The soldering parts 222a, 230a, and 321 are parts to be soldered in the first conductive members 222, 230 and the second conductive member 320, respectively. As shown in FIGS. 1 to 3 and FIGS. 10 to 13, in the case of the first embodiment, there are three types of the first conductive members. The first first conductive member 222 is the conductor in an independent electric wire 220 in which a conductor called a core wire or a core is covered with an insulating coating 221. The second first conductive member 222 is the conductor in the electric wire 220 in which the periphery of the conductor is similarly covered with the insulating coating 221. The electric wire 220 is bundled together with a drain wire made of a conductor called a core wire or a core and covered with a conductive shield tape, and this shield tape is covered with an insulating coating 210. The electric wire 220, the drain wire, the shield tape, and the insulating coating 210 constitute a shield cable. The drain wire of the shielded cable is also the first conductive member, which becomes the third first conductive member 230. Although the number of the electric wires 220 incorporated in the electric wire 200 made of the shielded cable is two, the number of built-in wires may be one or three or more. There are two drain wires built in the electric wire 200 made of the shielded cable, but the number of built-in wires may be one, three or more, or there may be no drain wires. The end of the first conductive member 222, which is a conductor of the independent electric wire 220 and a conductor of the electric wire 220 built in the electric wire 200 made of the shielded cable, peels off the insulating coating 221 at the end of the electric wire 220. As a result, the insulating coating 221 is exposed from the end. Further, the end of the first conductive member 230 that is a conductor of the electric wire 200 made of the shielded cable is exposed from the end of the insulating coating 210 by peeling off the insulating coating 210 at the end of the electric wire 200. Yes. The insulating member 310 is a housing of the electrical connector 300 in which a contact is provided on the housing, and the second conductive member 320 is the contact. However, the first conductive member is unified by any one of the above-described independent conductor of the electric wire 220, the conductor of the electric wire 220 incorporated in the shielded cable, and the drain wire incorporated in the shielded cable. It is also possible to combine these two or three. The conductor of the electric wire that is the object of the soldering method of the conductive member of the present invention is not limited to this embodiment, and is a conductor that can be exposed from the end of the electric wire. Anything that is open and can be arranged in a row is eligible. In addition, the first conductive member and the second conductive member, which are targets of the conductive member soldering method of the present invention, may be any conductive member that can be soldered, and are limited by this embodiment. There is no interpretation. As an example, the first conductive member is a lead of an electronic component, and the second conductive member is a conductor pattern of a printed wiring board.

  Hereinafter, the width direction, the thickness direction, and the depth direction which are orthogonal to each other will be described, and description will be made using these orientations. In the case of the first embodiment described above, with reference to FIG. 10, the horizontal direction in this figure is the width direction, the vertical direction in this figure is the thickness direction, and the direction perpendicular to the paper surface of this figure is In the depth direction, the front side of the paper surface is the near side in the depth direction, and the back side of the paper surface is the back side in the depth direction. In this embodiment, the thickness direction corresponds to the vertical direction, but the thickness direction may correspond to a direction other than the vertical direction. The electrical connector 300 includes the insulating member 310 that is the housing and the plurality of second conductive members 320 that are the plurality of contacts provided on the insulating member 310. Although the insulating member 310 is formed of a synthetic resin, the insulating member may be formed of an insulating material. The insulating member 310 includes a main body housing 311 and a holder housing 312 assembled to the main body housing 311 from the upper side which is one side in the thickness direction. In this embodiment, the insulating member 310 is divided into the main body housing 311 and the holder housing 312 as described above, but may be integrated without being divided. As shown in FIGS. 1 to 3, the main body housing 311 is substantially U in plan view by a horizontal member extending in the width direction and two vertical members extending substantially in parallel from the opposite ends to the back side in the depth direction. The main body 311a formed in a letter shape and the transverse member of the main body 311a extend from the depth side in the depth direction to the lower side, which is the other side in the thickness direction, and engage with a mating electrical connector (not shown). And a fitting portion 311b. The fitting portion 311b is fitted or detached from the mating electrical connector along the thickness direction. The upper end surface, which is one side in the thickness direction of the fitting portion 311b, is formed on the back side in the depth direction of the transverse member so as to face the upper side, which is one side in the thickness direction. Yes. In the main body 311a, a receiving portion 311d for receiving the holder housing 312 from the upper side, which is one side in the thickness direction, is formed between the opposing end surfaces of the two vertical members.

  Each of the second conductive members 320 is formed in a substantially strip shape from a metal, and is press-fitted into the fitting portion 311b. The second conductive member may be formed of a conductive material. Each of the second conductive members 320 has a wider surface in contact with a surface on the far side in the depth direction of the fitting portion 311b except for an upper end which is one side in the thickness direction. Yes. The end portions of the second conductive members 320 are bent toward the front side in the depth direction and are in contact with the end surfaces of the fitting portions 311b. The end portion of each second conductive member 320 becomes a soldering portion 321 of the second conductive member 320. Therefore, each said 2nd conductive member 320 is formed in the substantially L shape seeing from the said width direction.

  The holder housing 312 is formed in a substantially plate shape, and the plate thickness direction thereof substantially coincides with the thickness direction. The holder housing 312 has substantially the same dimension in the thickness direction as the main body 311a. When the holder housing 312 is brought close to the main body 311a along the thickness direction, the holder housing 312 is fitted into the receiving portion 311d.

  In the central part of the holder housing 312, caulking shells 330 for caulking the independent electric wires 220 and the electric wires 200 made of the shielded cables containing the electric wires 220 are placed side by side in the width direction. A mounting portion 312b is provided. A first holding portion that is recessed in a substantially U shape from one end face in the thickness direction is provided on the inner side of the holder housing 312 in the depth direction, and includes the independent electric wire 220 and the shielded cable. The electric wires 200 are fitted and held. A second holding portion that is recessed in a substantially U shape from one end face in the thickness direction is provided on the front side in the depth direction of the holder housing 312. From the independent electric wire 220 and the shielded cable, The electric wire 220 drawn from the terminal end of the electric wire 200 and the first conductive member 230 made of the drain wire drawn from the terminal end of the electric wire 200 made of the shield cable are fitted and held. Two of the wires 220 drawn from the end of the wire 200 made of the shielded cable are held together by the second holding portion. The first conductive member 230 made of the drain wire is appropriately divided, and the divided members are held by the second holding part alone or in a bundle. These holding forms by the second holding part correspond to the specifications of the electric connector as appropriate, and according to this embodiment, the electric wire in the electric connector targeted by the conductive member soldering method of the present invention is used. The connection form is not limitedly interpreted.

  The end portions of the plurality of second conductive members 320 are arranged in the width direction on the end surface of the fitting portion 311b, and the plurality of poles of the electrical connector 300 are configured by these. The end surface of the fitting portion 311b is provided with an inter-electrode wall 311f that rises from the space between the soldering portions 321 of the adjacent second conductive members 320 to one side in the thickness direction. The inter-electrode wall 311f is formed of a synthetic resin similarly to the insulating member 310, but may be formed of an insulating material. The electrical connector which is the object of the soldering method for the conductive member of the present invention is not limited to this embodiment, and the insulating member is provided with a plurality of contacts, and the soldering portions of the contacts are spaced apart. They may be arranged in a row, and may be electrical connectors that do not have inter-electrode walls.

  As shown in FIGS. 4 to 6, the rod-like solder 100 includes a plurality of thick portions 110 and thin portions 120 provided between the adjacent thick portions 110. The longitudinal direction of the bar-shaped solder 100 is coincident with the width direction. As described above, the width direction, the thickness direction, and the depth direction are orthogonal to each other. The rod-shaped solder 100 is formed in a rectangular shape with the width direction as a long side and the depth direction as a short side when viewed from the thickness direction. The shape may also be In the rod-shaped solder 100, the thickness of each thick portion 110 is the same as viewed from the depth direction, and the thickness of each thin portion 120 is the same, but for each thick portion or each thin portion. The thickness may not match. The thick part 110 is provided corresponding to the soldering part 321 of the plurality of second conductive members 320, respectively. The thick portions 110 are provided at the intervals along the width direction. In this embodiment, the interval is constant. However, since the interval is provided corresponding to the interval between the plurality of second conductive members, the size is determined accordingly. Therefore, the intervals are not constant and may be uneven. As shown in FIG. 4, the thick portion 110 has a first surface 111 having a width larger than the width of the soldered portion 222a of each first conductive member 222 on one side in the thickness direction. doing. The thin-walled portion 120 is provided between the adjacent thick-walled portions 110 so that the one surface in the thickness direction is continuous with the first surface 111 of the thick-walled portion 110. In the case of this embodiment, the width of the first surface 111 is a width excluding the thin portion 120 by dividing the surface on one side of the thickness direction of the rod-shaped solder 100 by the number of poles. Therefore, each said 1st surface 111 is following the said width direction via the said thin part 120, and the surface of the one side of the said thickness direction of the said rod-shaped solder 100 is formed in the plane so that it may mention later. . The width of the first surface may be equal to or greater than the width of the soldering portion of each first conductive member. As shown in FIG. 5, the thick part 110 has a second surface 112 having a width smaller than the width of the soldering part 321 of each second conductive member 320 on the other side in the thickness direction. doing. The width of the second surface may be the same as or smaller than the width of the soldered portion of each second conductive member. As shown in FIG. 6, since the width of the first surface 111 is larger than the width of the second surface 112, the thick portion 110 is formed to be trapezoidal when viewed in the depth direction. Therefore, the dimensional ratio between the first surface and the second surface of the rod-shaped solder of the present invention is not limitedly interpreted. In the case of this embodiment, end portions 130 similar to the thin portions are provided on the outer sides in the width direction of the thick portions 110 at both ends in the width direction. The end portion 130 has the same dimension in the depth direction as the thick portion 110 and the thin portion 120. One side of the end portion 130 in the thickness direction is flush with the first surface 111. The outer side in the width direction is a side farther along the width direction than the center of the bar-shaped solder 100 in the width direction. The thick portion 110 is formed to be thicker than other portions including the thin portion 120.

  In the case of the rod-like solder 100, a flat surface is formed on one side of the rod-like solder 100 in the thickness direction. The rod-like solder 100 is formed with a groove 140 that is recessed in the thickness direction from the other side of the rod-like solder 100 in the thickness direction and extends in the depth direction. Two or more grooves are formed so as to be parallel to each other, but may be one. Moreover, although the said groove | channel 140 is linear form, the said groove | channel should just extend along the said depth direction, and may be curvilinear form instead of linear form. And the said thick part 110 is formed in the said width direction both sides of the said groove | channel 140 in the said rod-shaped solder 100, respectively. In addition, the thin portion 120 is formed between the groove 140 and the one surface in the thickness direction of the rod-shaped solder 100.

  Next, the heat fusion apparatus 400 will be described with reference to FIG. The heat-sealing device 400 includes a heater head 410 provided on a frame (not shown) so as to be movable up and down. The heater head 410 includes a pair of electrode holders 411 and connecting members provided on the electrode holders 411, respectively. 412. Both ends of the heater chip 420 are connected to the two connection members 412, and a current flows through the heater chip 420 according to the voltage applied between the pair of electrode holders 411, and a first iron described later. The part 422 and the second iron part 423 generate Joule heat by resistance heat generation. Electric power is supplied from the heater power source 430 to the pair of electrode holders 411. The heater power source 430 includes a three-phase rectifier circuit 431 that converts a three-phase AC voltage into a DC voltage, an inverter 432 that electrically generates AC power from the DC power and performs reverse conversion, and a welding transformer 433. The input terminal of the inverter 432 is connected to the output terminal of the three-phase rectifier circuit 431, the primary coil of the welding transformer 433 is connected to the output terminal of the inverter, and both ends of the secondary coil of the welding transformer 433 are connected. Are connected to the pair of electrode holders 411, respectively. A temperature sensor 441 is attached to the heater chip 420, and an output signal from the temperature sensor 441 and an output signal from the current measurement circuit of the welding transformer 433 are input to the controller 450. The control unit 450 includes a microcomputer. The control unit 450 drives the inverter 432 based on an output signal from the temperature sensor 441 and an output signal from the current measurement circuit of the welding transformer 433. The circuit and the operation of the heater head 410 are controlled. The heater head 410 is provided to be movable along the thickness direction with respect to the frame. Therefore, the heater chip 420 is also provided so as to be movable along the thickness direction with respect to the frame. Then, the heater chip 420 is pressed against the object to be heated with a predetermined pressure, and a current is passed through the heater chip 420 in a predetermined pattern so that the heater chip 420 generates heat to heat the object to be heated. I have to. The heater power source 430 using the AC waveform inverter type power supply circuit described above is merely an example, and the heater power source for causing the heater chip 420 to generate resistance heat is, for example, a single-phase AC type, or other A heater power source of the form can be used. The heat-sealing device used in the present invention is not limited to the heat-sealing device 400 of this embodiment, and any device that exhibits a function of heating while pressing the object to be heated with a predetermined pressure can be used. Good.

  As shown in FIGS. 8 and 9, the heater chip 420 includes a main body 421, a first iron part 422, and a second iron part 423. The main body 421 is formed in a rectangular parallelepiped shape having each side along the width direction, the thickness direction, and the depth direction. The first iron part 422 and the second iron part 423 are provided on the other side of the main body 421 in the thickness direction. The first iron part 422 is provided corresponding to the soldering part 321 of the plurality of second conductive members 320, respectively. The first iron part 422 is provided at the interval along the width direction. In this embodiment, the interval is constant. However, since the interval is provided corresponding to the interval between the plurality of second conductive members, the size is determined accordingly. Therefore, the intervals are not constant and may be uneven. The first iron part 422 is provided in a part corresponding to at least the central part of each of the thick parts 110 when viewed in the thickness direction. The first iron part 422 is provided so as to protrude from the part corresponding to the central part to the other side in the thickness direction. In the case of this embodiment, the first iron part 422 is provided in a range corresponding to the second surface 112 including a part corresponding to the central part of each thick part 110 in the thickness direction. . The first iron part 422 is formed in a rectangular parallelepiped shape having each side along the width direction, the thickness direction, and the depth direction, and the other side surface of the thickness direction is in the thickness direction. It is formed on a flat surface. The depth of the first iron part 422 is the same as that of the main body 421. However, the shape of the first iron part of the present invention is not limitedly interpreted by this embodiment, and the first iron part of the present invention is provided at the intervals along the width direction. What is necessary is just to be provided so that it may each protrude in the said other side of the said thickness direction from the part corresponding to at least the center part of each said thick part seeing in the thickness direction. The second iron part 423 is provided between the adjacent first iron parts 422, and the soldering parts of the first conductive members 222 and 230 by the first iron parts 422 in a second step to be described later. 222a, 230a and each thick part 110 are heated and pressed toward the other side in the thickness direction, so that each thin part 120 is displaced toward the one side in the thickness direction. Are provided so as to be in contact with the surface of each thin portion 120. That is, in the second step, the soldering parts 222a and 230a of the first conductive members 222 and 230 and the thick parts 110 are heated by the first iron parts 422 and the other in the thickness direction. When pressed toward the side, as shown in FIG. 11, the thick portions 110 are melted, and the thin portions 120 are moved in the thickness direction by the stress acting on the thick portions 110. It is displaced toward the one side. The displacement of each of the thin portions 120 is performed so that each of the thin portions 120 is continuously connected to the first surface 111 of the thick portion 110 on both sides thereof. Since it is provided, it is assumed that when the pressing force is applied, it is caused by the stress generated in the thick portions 110 on both sides and the thin portion 120 between them.

  The method for soldering the conductive member includes a first step and a second step. In the first step, as shown in FIG. 10, one rod-like solder 100 extending in the width direction is arranged on one side in the thickness direction of the soldering portion 321 of the plurality of second conductive members 320. The soldering portions 222a and 230a of the plurality of first conductive members 222 and 230 correspond to the soldering portions 321 of the plurality of second conductive members 320 on the one side of the rod-shaped solder 100 in the thickness direction. And arranging them respectively. In this case, the second surfaces 112 of the rod-shaped solder 100 are in contact with the soldering portions 320 a of the second conductive members 320, and the first surfaces 111 of the rod-shaped solder 100 are in contact with the first surfaces 111. The soldering portions 222a and 230a of the conductive members 222 and 230 are in contact with each other. In the second step, as shown in FIGS. 11 to 13, the heat-sealing device 400 is operated, and the soldering portions 222 a and 230 a of the plurality of first conductive members 222 and 230 are in the thickness direction. One heater chip 420 extending in the width direction is disposed on the one side of the plurality of heaters, the heater chip 420 generates heat, and the heater chip 420 is attached to the soldering portions 222a of the plurality of first conductive members 222, 230, 230a is a step of making contact with 230a and pressing toward the other side in the thickness direction. When the second step is performed, the soldering portions 222a and 230a of the first conductive members 222 and 230 are heated by the heater chip 420, respectively, and the thick portions 110 and the thin portions of the rod-shaped solder 100 are heated. As shown in FIG. 13, the solder portions 222a and 230a of the first conductive members 222 and 230 are soldered to the solder portions 321 of the second conductive members 320, respectively. . Since the rod-like solder 100 is melted during the second step, the soldering portions 222a and 230a of the first conductive members 222 and 230 are slightly sunk to the other side in the thickness direction. In FIG. 13, reference numeral 170 denotes connection solder formed after the rod-shaped solder 100 is melted.

  In the case of this embodiment, as described above, the first conductive members 222 and 230 are conductors exposed from the ends of the electric wires 220 and 200 such as independent electric wires and shield cables, and the insulating member 310 Is a housing of the electrical connector 300 having a plurality of poles, and each of the second conductive members 320 is a contact that constitutes each of the poles of the electrical connector 300, and the contacts of the contacts adjacent to the housing. An inter-electrode wall 311f that rises in the thickness direction from between the soldering portions 321 is provided. Therefore, in the soldering method, the plurality of first conductive members 222 and 230, the plurality of second conductive members 320, and the rod-shaped solder 100 are connected to the first thick portions 110 of the rod-shaped solder 100. The solder portions 222a and 230a of the first conductive members 222 and 230 are in contact with the surface 111, and the solder portions 321 of the second conductive members 320 are in contact with the second surface 112, respectively. When arrange | positioning, it arrange | positions so that each said thin part 120 between the said adjacent thick parts 110 may each face each said interpolar wall 311f.

  Therefore, in the soldering method for the conductive member according to the first embodiment, in the first step, the rod-shaped solder 100 is provided on one side in the thickness direction of the soldering portion 321 of the plurality of second conductive members 320. And the soldered portions 222a and 230a of the plurality of first conductive members 222 and 230 on the one side in the thickness direction of the rod-shaped solder 100 and the soldered portions of the plurality of second conductive members 320, respectively. 321 is disposed in correspondence with each other, and in the second step, the heater chip 420 is disposed on the one side in the thickness direction of the soldering portions 222a and 230a of the first conductive members 222 and 230, The heater chip 420 generates heat and the heater chip 420 is soldered to the first conductive members 222 and 230. When it is brought into contact with 222a and 230a and pressed toward the other side in the thickness direction, the thick portions 110 and the thin portions 120 of the rod-shaped solder 100 are melted and the first conductive members 222 and 230 are melted. The soldering portions 222a and 230a are soldered to the soldering portions 321 of the second conductive members 320, respectively.

  In that case, in the second step, the soldering portions 222a and 230a and the thick portions 110 of the first conductive members 222 and 230 are heated by the first iron portions 422 of the heater chip 420 and the thick portions 110 are heated. When pressed toward the other side in the thickness direction, the thin portions 120 are displaced so as to be lifted toward the one side in the thickness direction due to deformation of the thick portions 110 and It melts in contact with each second iron part 423 and is divided in the longitudinal direction before each thick part 110. Therefore, the bar-shaped solder 100 is separated in the width direction at the thin portions 120, and the thick portions 110 are independent. Next, the independent thick portions 110 are disposed between the corresponding soldered portions 222a and 230a of the first conductive members 222 and 230 and the soldered portions 321 of the second conductive members 320, respectively. And melted and hardened to form most of the connecting solder 170 between the soldered portions 222a and 230a of the first conductive members 222 and 230 and the soldered portions 321 of the second conductive members 320. Therefore, the amount of solder of each of the connection solders 170 is ensured without being excessive or insufficient. Therefore, the connection strength of each of the connection solders 170 is ensured, and a gap between adjacent connection solders 170 is ensured. Further, when the rod-shaped solder 100 is heated, the thin portions 120 are melted before the thick portions 110, so that the thin portions 120 remain solid when the thick portions 110 are melted. Therefore, it is difficult to generate unmelted solder and solder balls between the connecting solders 170, so that the reliability of the product is improved. Further, when the rod-like solder 100 contains a paste, each thin portion 120 is divided in the longitudinal direction at a relatively early stage after the heating of the rod-like solder 100 is started. It is easy for the paste to be eluted from the cut surface, and the rod-like solder 100 is prevented from bursting by the gasified paste. This also makes it difficult for solder balls to be generated, improving the reliability of the product.

  Further, when there is a structure such as the inter-electrode wall 311f between the soldered portions 222a and 230a of the adjacent first conductive members 222 and 230, each of the structures has the adjacent thick portion 110. The thin portions 120 in between are opposed to each other. Therefore, if the step is provided in the thick portion 110 and the thin portion 120 on the surface of the rod-like solder 100 on the first conductive member 222, 230 side, the thin portion 120 is reliably separated from the structure. Therefore, it becomes possible to prevent the structure from being damaged by a thermal load. In addition, since the thick portion 110 is fitted on both sides of the structure in the width direction, the positioning accuracy of the rod-shaped solder 100 to the soldered portions 222a and 230a of the first conductive members 222 and 230 is improved. The variation in the solder amount of the connection solder 170 is reduced.

  The bar-shaped solder used in the method for soldering a conductive member of the present invention is provided with the gap in the width direction when the longitudinal direction is the width direction and the thickness direction orthogonal to the width direction is taken. A first surface having a width equal to or greater than a width of the soldered portion of each first conductive member on one side in the thickness direction and the other side in the thickness direction on the other side. A plurality of thick portions each having a second surface having a width equal to or less than the width of the soldered portion of each second conductive member and respectively corresponding to the soldered portions of the plurality of second conductive members; A thin portion provided between the adjacent thick portions so that the one side surface in the thickness direction is continuous with the first surface of the thick portion, and the thick portion It is sufficient that the thickness of the layer is thicker than the thickness of the other part including the thin portion. However, among the rod-like solders used in the conductive member soldering method according to the various embodiments, the rod-like solder 100 used in the conductive member soldering method according to the first embodiment further includes the thickness described above. A flat surface is formed on one side of the direction, and one or more grooves 140 that are recessed from the other side of the thickness direction in the thickness direction and extend in the width direction and the depth direction orthogonal to the thickness direction are formed. The thick portions 110 are formed on both sides of the groove 140 in the width direction, and the thin portions 120 are formed between the groove 140 and one surface in the thickness direction. In this way, the rod-shaped solder used in the method for soldering a conductive member of the present invention can be realized with a relatively simple configuration. Further, when the rod-shaped solder 100 is used to solder the conductors of the electric wires 220 and 200 to the contacts of the electrical connector 300 having the inter-electrode walls 311f, the rod-shaped solder 100 is attached to the inter-electrode walls 311f. The grooves 140 are arranged to correspond to each other, and the thin wall portion 120 can be reliably separated from the interpolar walls 311f. Therefore, the interpolar walls 311f are damaged by a thermal load. The thick wall portions 110 are fitted on both sides in the width direction of the inter-electrode wall 311f, so that the positioning accuracy of the bar-shaped solder 100 to the electric connector 300 is improved, and each connection solder The variation in the solder amount of 170 is reduced.

  In the method for soldering a conductive member according to the present invention, the plurality of first conductive members are divided into the plurality of second conductive members provided in the insulating member, and the soldering portions are spaced apart from each other in the width direction. Any soldering method may be used as long as it is soldered in a lump so as to be aligned in a row. However, among the conductive member soldering methods according to the various embodiments, in the case of the conductive member soldering method according to the first embodiment, the first conductive members 222 and 230 are connected to the electric wires 220 and 230. 200, the conductor exposed from the terminal end, the insulating member 310 is a housing of the electrical connector 300 having a plurality of poles, and the second conductive members 320 constitute the poles of the electrical connector 300, respectively. The housing is provided with inter-electrode walls 311f that rise in the thickness direction from between the soldering portions 321 of the adjacent contacts, and the plurality of first conductive members 222, 230, The plurality of second conductive members 320 and the rod-shaped solder 100 are connected to the first surface 111 of the thick portions 110 of the rod-shaped solder 100. When the soldering portions 222a and 230a of the first conductive members 222 and 230 are in contact with each other and the soldering portions 321 of the second conductive members 320 are in contact with the second surface 112, respectively. In addition, the thin portions 120 between the adjacent thick portions 110 are arranged so as to face the inter-electrode walls 311f, respectively. By this method of soldering the conductive member, the conductors of the electric wires 220 and 200 are soldered to the soldering portion 321 of the contact of the electrical connector having the interelectrode wall 311f by using the rod-shaped solder 100. The first surface 111 of each of the thick portions 110 of the rod-shaped solder 100 is in contact with the soldered portions 222a and 230a of the conductors of the electric wires 220 and 200, respectively, and the second surface 112 is of each of the contacts. Each of the thin portions 120 between the adjacent thick portions 110 is opposed to each of the interelectrode walls 311f. Therefore, if the step is provided in the thick wall portion 110 and the thin wall portion 120 on the contact side surface of the rod-shaped solder 100, the thin wall portion 120 can be reliably separated from the inter-electrode wall 311f. In addition, it is possible to prevent the interelectrode wall 311f from being damaged by a thermal load, and the thick wall portions 110 are fitted on both sides of the interelectrode wall 311f in the width direction. Positioning accuracy is improved, and variation in the solder amount of each connection solder 170 is reduced.

  Next, a modified example of the rod-shaped solder 100 that can be used in the method for soldering a conductive member according to the first embodiment will be described. For the rod-shaped solder 100 of these modified examples, the configurations of the rod-shaped solder 100 used in the first embodiment and the soldering method for the conductive member of the modified example are cited as they are, and the first embodiment is described in the modified example. A configuration different from the configuration of the rod-shaped solder 100 used in the soldering method of the conductive member of the embodiment will be additionally described.

  14 and 15 show a rod-shaped solder 100 according to a first modification. The same reference numerals are used as in the case of the rod-shaped solder 100 used in the method for soldering conductive members according to the first embodiment. In the case of the rod-shaped solder 100 used in the soldering method of the first embodiment, the end surface in the depth direction and the end surface on the far side of the rod-shaped solder 100 are formed in a flat plane. A flat surface is formed on one side in the thickness direction, and this flat surface is formed in a rectangular shape as viewed in the thickness direction, and the second surface 112 of the thick portion 110 of the rod-shaped solder 100 is also a flat surface. And formed in a rectangular shape when viewed in the thickness direction. On the other hand, in the case of the rod-like solder 100 of the first modified example, the thin portion 120 protrudes on both sides in the depth direction, and the groove 140 protrudes on both sides in the depth direction. Therefore, the end surface in the depth direction and the end surface on the far side of the rod-shaped solder 100 are formed as curved surfaces. In addition, a flat surface is formed on one side of the thickness direction of the rod-shaped solder 100, and when viewed in the thickness direction, the flat surface has a large dimension in the depth direction at the thin portion 120, and the width direction It is formed by waving along. Further, the second surface 112 of the thick portion 110 of the rod-shaped solder 100 is also formed in a flat plane, but when viewed in the thickness direction, both ends in the width direction are formed long in the depth direction. . That is, the rod-like solder 100 according to the first modification is provided with the gap along the width direction, and the first conductive members 222 and 230 are arranged on the one side in the thickness direction. The first surface 111 has a width equal to or greater than the width of the soldered portions 222a and 230a, and is the same as the width of the soldered portion 321 of the second conductive member 320 on the other side in the thickness direction. A plurality of thick portions 110 each having a second surface 112 having a width of less than that and corresponding to the soldered portions 321 of the plurality of second conductive members 320, and between the adjacent thick portions 110. A thin portion 120 provided so that the one surface in the thickness direction is continuous with the first surface 111 of the thick portion 110, and the thickness of the thick portion 110 is Other including the thin-walled portion 120 It is formed to be thicker than place the thickness of. The rod-like solder 100 according to the first modification has a flat surface formed on one side in the thickness direction, and is recessed from the other side in the thickness direction in the thickness direction, and also in the width direction and the thickness. One or more grooves 140 extending in the depth direction orthogonal to the direction are formed, the thick portions 110 are respectively formed on both sides of the groove 140 in the width direction, and the surface on one side of the thickness direction and the surface The thin portion 120 is formed between the groove 140. One side in the thickness direction of the rod-shaped solder 100 may be formed on a surface having irregularities instead of a flat surface. Further, the above-mentioned clear groove may not be formed by gently changing between the thick part and the thin part. Further, in the rod-shaped solder of the first modified example, the thin portion 120 protrudes on both sides in the depth direction, and the groove 140 protrudes on both sides in the depth direction. Other configurations are the same as those of the rod-like solder 100 of the first embodiment. Since the operation and effect when the rod-shaped solder 100 of the first modification is used are the same as those of the first embodiment, the description thereof is omitted.

  16 and 17 show a rod-shaped solder 100 according to a second modification. The same reference numerals are used as in the case of the rod-shaped solder 100 used in the method for soldering conductive members according to the first embodiment. In the case of the rod-like solder 100 used in the soldering method of the first embodiment, a flat surface is formed on one side of the rod-like solder 100 in the thickness direction. On the other hand, in the case of the rod-shaped solder 100 of the second modified example, each of the thin portions 120 is formed so as to rise in a U shape toward the one side in the thickness direction. One surface in the vertical direction protrudes between the first surfaces 111 adjacent to each other in the thickness direction. The groove 140 is formed deeper in the thickness direction than the rod-shaped solder 100 used in the soldering method of the first embodiment. That is, the rod-shaped solder 100 according to the second modified example is provided with the gap along the width direction, and the first conductive members 222 and 230 are arranged on the one side in the thickness direction. The first surface 111 has a width equal to or greater than the width of the soldered portions 222a and 230a, and is the same as the width of the soldered portion 321 of the second conductive member 320 on the other side in the thickness direction. A plurality of thick portions 110 each having a second surface 112 having a width of less than that and corresponding to the soldered portions 321 of the plurality of second conductive members 320, and between the adjacent thick portions 110. A thin portion 120 provided so that the one surface in the thickness direction is continuous with the first surface 111 of the thick portion 110, and the thickness of the thick portion 110 is Other including the thin-walled portion 120 It is formed to be thicker than place the thickness of. The rod-like solder 100 according to the second modification has one or more grooves 140 that are recessed in the thickness direction from the other side in the thickness direction and that extend in the width direction and the depth direction perpendicular to the thickness direction. The thick portion 110 is formed on both sides of the groove 140 in the width direction, and the thin portion 120 is formed between the surface on one side in the thickness direction and the groove 140. ing. Although the first surface of the rod-like solder 100 is formed as a flat surface, the first surface may be formed as a surface having irregularities. Further, the above-mentioned clear groove may not be formed by gently changing between the thick part and the thin part. Furthermore, the rod-shaped solder of the second modified example is formed such that each thin portion 120 is raised in a U shape toward the one side in the thickness direction, and for this reason, the rod-shaped solder 100 has the thickness direction. The one side surface of the projection protrudes to the one side in the thickness direction between the adjacent first surfaces 111. Other configurations are the same as those of the rod-like solder 100 of the first embodiment.

  If the rod-like solder 100 of the second modification is used, the soldering portions 222a and 230a of the first conductive members 222 and 230 and the thick-walled portions by the first iron portions 422 in the second step. When the thin portion 120 is displaced toward the one side in the thickness direction by the portion 110 being heated and pressed toward the other side in the thickness direction, such displacement is stable. The second iron part 423 is surely in contact with the surface of each thin part 120. Since other operations and effects when the rod-shaped solder 100 of the second modified example is used are the same as those of the first embodiment, description thereof will be omitted.

  18 to 20 show a rod-like solder 100 according to a third modification. The same reference numerals are used as in the case of the rod-shaped solder 100 used in the method for soldering conductive members according to the first embodiment. In the first embodiment, the end surface in the depth direction of the rod-shaped solder 100 and the end surface on the back side are formed in a flat plane. On the other hand, in the rod-shaped solder 100 of the third modified example, the cross-sectional area of the thin-walled portion 120 when the cross-section is taken along the plane facing the widthwise direction is the middle of the thin-walled portion 120. A narrow portion 150 that is minimized is formed. Therefore, the thin portion 120 is constricted in the narrow portion 150 when viewed along the width direction. That is, in the middle of the thin portion 120 in the width direction, a concave portion 151 that is recessed from the end surface on the near side in the depth direction of the thin portion 120 to the back side is formed, and the deep side in the depth direction of the thin portion 120 is formed. A concave portion 151 is formed to be recessed from the end face to the near side, and the narrow portion 150 is formed between the concave portions 151. That is, the rod-like solder 100 according to the third modified example is provided with the gap along the width direction, and the first conductive members 222 and 230 are arranged on the one side in the thickness direction. The first surface 111 has a width equal to or greater than the width of the soldered portions 222a and 230a, and is the same as the width of the soldered portion 321 of the second conductive member 320 on the other side in the thickness direction. A plurality of thick portions 110 each having a second surface 112 having a width of less than that and corresponding to the soldered portions 321 of the plurality of second conductive members 320, and between the adjacent thick portions 110. A thin portion 120 provided so that the one surface in the thickness direction is continuous with the first surface 111 of the thick portion 110, and the thickness of the thick portion 110 is Other including the thin-walled portion 120 It is formed to be thicker than place the thickness of. The rod-like solder 100 according to the first modification has a flat surface formed on one side in the thickness direction, and is recessed from the other side in the thickness direction in the thickness direction, and also in the width direction and the thickness. One or more grooves 140 extending in the depth direction orthogonal to the direction are formed, the thick portions 110 are respectively formed on both sides of the groove 140 in the width direction, and the surface on one side of the thickness direction and the surface The thin portion 120 is formed between the groove 140. One side in the thickness direction of the rod-shaped solder 100 may be formed on a surface having irregularities instead of a flat surface. Further, the above-mentioned clear groove may not be formed by gently changing between the thick part and the thin part. Further, the rod-like solder 100 of the third modified example has the smallest cross-sectional area in the thin wall portion 120 when the cross section of the thin wall portion 120 is crossed by the surface facing the width direction in the middle of the thin wall portion 120. A narrow portion 150 is formed. Other configurations are the same as those of the rod-like solder 100 of the first embodiment.

  When the rod-like solder 100 of the third modification is heated, the narrow portion 150 of the thin portions 120 is melted first, so that the rod-like solder 100 is separated in the width direction at the thin portions. Thus, the action and effect obtained with the rod-like solder 100 used in the method of soldering a conductive member according to the first embodiment can be obtained more reliably. Further, since the rod-like solder 100 is separated in the width direction in each narrow portion 150 and each thick portion 110 is independent, it is separated in the middle in the width direction by each independent thick portion 110. The half cracks of each thin portion 120 are absorbed. Therefore, the solder amount of each of the connection solders 170 is more accurately ensured, and variations are reduced. Therefore, the connection strength of each connection solder 170 and the clearance between the adjacent connection solders 170 can be more reliably obtained. Further, unmelted solder and solder balls are further formed between the connection solders 170. It is difficult to produce and the reliability of the product is improved. Since other operations and effects when the rod-like solder 100 of the third modification is used are the same as those of the first embodiment, description thereof is omitted.

  21 to 23 show a rod-shaped solder 100 according to a fourth modification. The same reference numerals are used as in the case of the rod-shaped solder 100 used in the method for soldering conductive members according to the first embodiment. In the conductive member soldering method according to the first embodiment, the first surface 111 of the thick portion 110 is formed in a flat plane. On the other hand, in the rod-shaped solder 100 of the fourth modified example, the soldering portions 222a of the first conductive members 222 and 230 are recessed in the thickness direction on the first surface 111 of the thick portion 110. The receiving part 160 into which 230a enters is formed. In this modification, the receiving portion 160 is recessed in an arc shape when viewed in the depth direction, and extends substantially straight from the end surface on the near side in the depth direction of the thick portion 110 to the end surface on the far side in the depth direction. ing. The depth in the thickness direction of the receiving portion 160 is set to a degree that a part of the soldering portions 222a and 230a of the first conductive members 222 and 230 in the thickness direction can enter. However, the shape of the receiving portion is not limitedly interpreted by this modification, and the receiving portion is recessed in the thickness direction on the first surface of the thick portion, and the first conductive member. It suffices if it is formed so that a part or the whole of the soldering part is inserted. That is, the rod-shaped solder 100 of the fourth modified example is provided with the interval along the width direction, and the first conductive members 222 and 230 on the one side in the thickness direction. The first surface 111 has a width equal to or greater than the width of the soldered portions 222a and 230a, and is the same as the width of the soldered portion 321 of the second conductive member 320 on the other side in the thickness direction. A plurality of thick portions 110 each having a second surface 112 having a width of less than that and corresponding to the soldered portions 321 of the plurality of second conductive members 320, and between the adjacent thick portions 110. A thin portion 120 provided so that the one surface in the thickness direction is continuous with the first surface 111 of the thick portion 110, and the thickness of the thick portion 110 is Other including the thin-walled portion 120 It is formed to be thicker than place the thickness of. The rod-like solder 100 according to the first modification is formed with a flat surface on one side in the thickness direction excluding the receiving portion 160, and is recessed from the other side in the thickness direction in the thickness direction. In addition, one or more grooves 140 extending in the depth direction orthogonal to the width direction and the thickness direction are formed, and the thick portions 110 are respectively formed on both sides of the groove 140 in the width direction. The thin portion 120 is formed between the surface on one side in the direction and the groove 140. One side in the thickness direction of the rod-shaped solder 100 may be formed on a surface having irregularities instead of a flat surface. Further, the above-mentioned clear groove may not be formed by gently changing between the thick part and the thin part. Further, the rod-like solder 100 of the fourth modified example is recessed in the thickness direction on the first surface 111 of the thick portion 110, and the soldering portions 222a of the first conductive members 222 and 230, The receiving part 160 into which 230a enters is formed. Other configurations are the same as those of the rod-like solder 100 of the first embodiment.

  The rod-like solder 100 of the fourth modified example is difficult to move carelessly because the soldering portions 222a and 230a of the first conductive members 222 and 230 are locked to the receiving portion 160 when soldering. Therefore, the workability of soldering can be improved. Since other operations and effects when the rod-like solder 100 of the fourth modification is used are the same as those of the first embodiment, description thereof is omitted.

  Next, a second embodiment of the conductive member soldering method of the present invention will be described. The conductive member soldering method according to the second embodiment refers to the configuration of the above-described first embodiment and the modifications thereof, and the conductive member soldering method according to the various embodiments as it is. Further, configurations different from the configurations of the first embodiment and its modified examples and the various embodiments will be described additionally.

  In the method for soldering conductive members according to the second embodiment of the present invention, the plurality of first conductive members 222 and 230 are connected to the plurality of second conductive members 320 provided on the insulating member 310. This is a soldering method in which the soldering parts 222a and 230a of 230 and the soldering part 321 of the second conductive member 320 are collectively soldered so that they are arranged in a line in the width direction at intervals. The plurality of first conductive members 222 and 230, the insulating member 310, and the plurality of second conductive members 320 are the same as those members in the first embodiment. Therefore, in the description regarding the plurality of first conductive members 222 and 230, the insulating member 310, and the plurality of second conductive members 320, the description regarding these members in the first embodiment is directly cited. Briefly, as shown in FIGS. 1 to 3 and FIGS. 27 to 30, there are three types of the first conductive members in the second embodiment. The first first conductive member 222 is the conductor in an independent electric wire 220 in which a conductor called a core wire or a core is covered with an insulating coating 221. The second first conductive member 222 is the conductor in the electric wire 220 that is included in the shielded cable and similarly covers the conductor with an insulating coating 221. The drain wire of the shielded cable is also the first conductive member, which becomes the third first conductive member 230. The insulating member 310 is a housing of the electrical connector 300 in which a contact is provided on the housing, and the second conductive member 320 is the contact. The electrical connector 300 includes the insulating member 310 that is the housing and the plurality of second conductive members 320 that are the plurality of contacts provided on the insulating member 310. The insulating member 310 includes a main body housing 311 and a holder housing 312 assembled to the main body housing 311 from the upper side which is one side in the thickness direction. A second holding portion that is recessed in a substantially U shape from one end face in the thickness direction is provided on the front side in the depth direction of the holder housing 312. From the independent electric wire 220 and the shielded cable, The electric wire 220 drawn from the terminal end of the electric wire 200 and the first conductive member 230 made of the drain wire drawn from the terminal end of the electric wire 200 made of the shield cable are fitted and held. Two of the wires 220 drawn from the end of the wire 200 made of the shielded cable are held together by the second holding portion. The first conductive member 230 made of the drain wire is appropriately divided, and the divided members are held by the second holding part alone or in a bundle. The end portions of the plurality of second conductive members 320 are arranged in the width direction on the end surface of the fitting portion 311b, and the plurality of poles of the electrical connector 300 are configured by these. The end surface of the fitting portion 311b is provided with an inter-electrode wall 311f that rises from the space between the soldering portions 321 of the adjacent second conductive members 320 to one side in the thickness direction.

  The rod-like solder 100 used in the second embodiment is the same as the rod-like solder 100 used in the first embodiment. Therefore, in the description regarding the rod-shaped solder 100, the description regarding the rod-shaped solder 100 in the first embodiment is directly referred to. However, in the case of the rod-like solder 100 used in the second embodiment, it is necessary that the one side surface in the thickness direction of the thin portion 120 is continuous with the first surface 111 of the thick portion 110. There may be a step between them. As shown in FIGS. 4 to 6, the rod-like solder 100 includes a plurality of thick portions 110 and thin portions 120 provided between the adjacent thick portions 110. The longitudinal direction of the bar-shaped solder 100 is coincident with the width direction. As described above, the width direction, the thickness direction, and the depth direction are orthogonal to each other. The rod-shaped solder 100 is formed in a rectangular shape with the width direction as a long side and the depth direction as a short side when viewed from the thickness direction. The shape may also be In the rod-shaped solder 100, the thickness of each thick portion 110 is the same as viewed from the depth direction, and the thickness of each thin portion 120 is the same, but for each thick portion or each thin portion. The thickness may not match. The thick part 110 is provided corresponding to the soldering part 321 of the plurality of second conductive members 320, respectively. The thick portions 110 are provided at the intervals along the width direction. In this embodiment, the interval is constant. However, since the interval is provided corresponding to the interval between the plurality of second conductive members, the size is determined accordingly. Therefore, the intervals are not constant and may be uneven. As shown in FIG. 4, the thick portion 110 has a first surface 111 having a width larger than the width of the soldered portion 222a of each first conductive member 222 on one side in the thickness direction. doing. In the case of the rod-like solder 100, the thin portion 120 is arranged such that the one surface in the thickness direction is continuous with the first surface 111 of the thick portion 110 between the adjacent thick portions 110. Are provided respectively. However, as described above, in the case of the second embodiment, even if the surface on the one side in the thickness direction of the thin portion 120 is not continuous with the first surface 111 of the thick portion 110. Therefore, the rod-shaped solder that can be used in the second embodiment includes the thickness between the one surface in the thickness direction of the thin portion and the first surface of the thick portion. Modification examples of the above-described bar-shaped solder in which a step is formed in the vertical direction are included. In the case of this embodiment, the width of the first surface 111 is a width excluding the thin portion 120 by dividing the surface on one side of the thickness direction of the rod-shaped solder 100 by the number of poles. Therefore, each said 1st surface 111 is following the said width direction via the said thin part 120, and the surface of the one side of the said thickness direction of the said rod-shaped solder 100 is formed in the plane so that it may mention later. . The width of the first surface may be equal to or greater than the width of the soldering portion of each first conductive member. As shown in FIG. 5, the thick part 110 has a second surface 112 having a width smaller than the width of the soldering part 321 of each second conductive member 320 on the other side in the thickness direction. doing. The width of the second surface may be the same as or smaller than the width of the soldered portion of each second conductive member. As shown in FIG. 6, since the width of the first surface 111 is larger than the width of the second surface 112, the thick portion 110 is formed to be trapezoidal when viewed in the depth direction. Therefore, the dimensional ratio between the first surface and the second surface of the rod-shaped solder of the present invention is not limitedly interpreted. In the case of this embodiment, end portions 130 similar to the thin portions are provided on the outer sides in the width direction of the thick portions 110 at both ends in the width direction. The end portion 130 has the same dimension in the depth direction as the thick portion 110 and the thin portion 120. One side of the end portion 130 in the thickness direction is flush with the first surface 111. The outer side in the width direction is a side farther along the width direction than the center of the bar-shaped solder 100 in the width direction. The thick portion 110 is formed to be thicker than other portions including the thin portion 120.

  In the case of the rod-like solder 100, a flat surface is formed on one side of the rod-like solder 100 in the thickness direction. The rod-like solder 100 is formed with a groove 140 that is recessed in the thickness direction from the other side of the rod-like solder 100 in the thickness direction and extends in the depth direction. Two or more grooves are formed so as to be parallel to each other, but may be one. Moreover, although the said groove | channel 140 is linear form, the said groove | channel should just extend along the said depth direction, and may be curvilinear form instead of linear form. And the said thick part 110 is formed in the said width direction both sides of the said groove | channel 140 in the said rod-shaped solder 100, respectively. In addition, the thin portion 120 is formed between the groove 140 and the one surface in the thickness direction of the rod-shaped solder 100.

  Next, with reference to FIG. 24, the heat sealing apparatus 400 will be described. The heat-sealing device 400 includes a heater head 410 provided on a frame (not shown) so as to be movable up and down. The heater head 410 includes a pair of electrode holders 411 and connecting members provided on the electrode holders 411, respectively. 412. Both ends of the heater chip 420 are connected to the two connection members 412, and a current flows through the heater chip 420 according to the voltage applied between the pair of electrode holders 411, and a first iron described later. The part 422 and the second iron part 423 generate Joule heat by resistance heat generation. Electric power is supplied from the heater power source 430 to the pair of electrode holders 411. The heater power source 430 includes a three-phase rectifier circuit 431 that converts a three-phase AC voltage into a DC voltage, an inverter 432 that electrically generates AC power from the DC power and performs reverse conversion, and a welding transformer 433. The input terminal of the inverter 432 is connected to the output terminal of the three-phase rectifier circuit 431, the primary coil of the welding transformer 433 is connected to the output terminal of the inverter, and both ends of the secondary coil of the welding transformer 433 are connected. Are connected to the pair of electrode holders 411, respectively. A temperature sensor 441 is attached to the heater chip 420, and an output signal from the temperature sensor 441 and an output signal from the current measurement circuit of the welding transformer 433 are input to the controller 450. The control unit 450 includes a microcomputer. The control unit 450 drives the inverter 432 based on an output signal from the temperature sensor 441 and an output signal from the current measurement circuit of the welding transformer 433. The circuit and the operation of the heater head 410 are controlled. The heater head 410 is provided to be movable along the thickness direction with respect to the frame. Therefore, the heater chip 420 is also provided so as to be movable along the thickness direction with respect to the frame. Then, the heater chip 420 is pressed against the object to be heated with a predetermined pressure, and a current is passed through the heater chip 420 in a predetermined pattern so that the heater chip 420 generates heat to heat the object to be heated. I have to. The heater power source 430 using the AC waveform inverter type power supply circuit described above is merely an example, and the heater power source for causing the heater chip 420 to generate resistance heat is, for example, a single-phase AC type, or other A heater power source of the form can be used. The heat-sealing device used in the present invention is not limited to the heat-sealing device 400 of this embodiment, and any device that exhibits a function of heating while pressing the object to be heated with a predetermined pressure can be used. Good.

  As shown in FIGS. 25 and 26, the heater chip 420 includes a main body 421, a first iron part 422, and a second iron part 423. The main body 421 is formed in a rectangular parallelepiped shape having each side along the width direction, the thickness direction, and the depth direction. The first iron part 422 and the second iron part 423 are provided on the other side of the main body 421 in the thickness direction. The first iron part 422 is provided corresponding to the soldering part 321 of the plurality of second conductive members 320, respectively. The first iron part 422 is provided at the interval along the width direction. In this embodiment, the interval is constant. However, since the interval is provided corresponding to the interval between the plurality of second conductive members, the size is determined accordingly. Therefore, the intervals are not constant and may be uneven. The first iron part 422 is provided in a part corresponding to at least the central part of each of the thick parts 110 when viewed in the thickness direction. In the case of this embodiment, the first iron part 422 is provided in a range corresponding to the second surface 112 including a part corresponding to the central part of each thick part 110 in the thickness direction. . The first iron part 422 is formed in a plane in which the other surface in the thickness direction faces the thickness direction. The depth of the first iron part 422 is the same as that of the main body 421. However, the shape of the first iron part of the present invention is not limitedly interpreted by this embodiment, and the first iron part of the present invention is provided at the intervals along the width direction. What is necessary is just to be provided in the part respectively corresponding to at least the center part of each said thick part seeing in the thickness direction. The second iron part 423 is provided at a portion corresponding to at least the central part of each thin part 120 between the first iron parts 422 adjacent to each other in the thickness direction. The second iron part 423 projects from the first iron part 422 to the other side in the thickness direction. The second iron part 423 is formed in a rectangular parallelepiped shape having each side along the width direction, the thickness direction, and the depth direction, and the surface on the other side in the thickness direction is in the thickness direction. It is formed on a flat surface. The depth of the second iron part 423 is the same as that of the main body 421. However, the shape of the first iron part of the present invention is not limitedly interpreted by this embodiment, and the second iron part of the present invention is located between the first iron parts adjacent to each other in the thickness direction. It suffices that the thin-walled portion is provided so as to protrude from the first iron portion to the other side in the thickness direction at a portion corresponding to at least the central portion. In the second step to be described later, the second iron part 423 is heated when the thin part 120 is heated by the second iron part 423 and pressed toward the other side in the thickness direction. The second iron part 423 is configured to be melted in contact with the thin parts 120 and to be divided in the longitudinal direction before the thick parts 110.

  The method for soldering the conductive member includes a first step and a second step. In the first step, as shown in FIG. 27, one rod-like solder 100 extending in the width direction is disposed on one side in the thickness direction of the soldering portion 321 of the plurality of second conductive members 320. The soldering portions 222a and 230a of the plurality of first conductive members 222 and 230 correspond to the soldering portions 321 of the plurality of second conductive members 320 on the one side of the rod-shaped solder 100 in the thickness direction. And arranging them respectively. In this case, the second surfaces 112 of the rod-shaped solder 100 are in contact with the soldering portions 321 of the second conductive members 320, and the first surfaces 111 of the rod-shaped solder 100 are in contact with the first surfaces 111. The soldering portions 222a and 230a of the conductive members 222 and 230 are in contact with each other. In the second step, as shown in FIGS. 28 to 30, the thickness of the soldering portions 222 a and 230 a of the plurality of first conductive members 222 and 230 is operated by operating the heat fusion apparatus 400. One heater chip 420 extending in the width direction is disposed on the one side of the plurality of heaters, the heater chip 420 generates heat, and the heater chip 420 is attached to the soldering portions 222a of the plurality of first conductive members 222, 230, 230a is a step of making contact with 230a and pressing toward the other side in the thickness direction. When the second step is performed, the soldering portions 222a and 230a of the first conductive members 222 and 230 are heated by the heater chip 420, respectively, and the thick portions 110 and the thin portions of the rod-shaped solder 100 are heated. As shown in FIG. 30, the solder portions 222a and 230a of the first conductive members 222 and 230 are soldered to the solder portions 321 of the second conductive members 320, respectively. . Since the rod-like solder 100 is melted during the second step, the soldering portions 222a and 230a of the first conductive members 222 and 230 are slightly sunk to the other side in the thickness direction. In FIG. 30, reference numeral 170 denotes connection solder formed after the rod-shaped solder 100 is melted.

  In the case of this embodiment, as described above, the first conductive members 222 and 230 are conductors exposed from the ends of the electric wires 220 and 200 such as independent electric wires and shield cables, and the insulating member 310 Is a housing of the electrical connector 300 having a plurality of poles, and each of the second conductive members 320 is a contact that constitutes each of the poles of the electrical connector 300, and the contacts of the contacts adjacent to the housing. An inter-electrode wall 311f that rises in the thickness direction from between the soldering portions 321 is provided. Therefore, in the soldering method, the plurality of first conductive members 222 and 230, the plurality of second conductive members 320, and the rod-shaped solder 100 are connected to the first thick portions 110 of the rod-shaped solder 100. The solder portions 222a and 230a of the first conductive members 222 and 230 are in contact with the surface 111, and the solder portions 321 of the second conductive members 320 are in contact with the second surface 112, respectively. When arrange | positioning, it arrange | positions so that each said thin part 120 between the said adjacent thick parts 110 may each face each said interpolar wall 311f.

  Therefore, in the soldering method for the conductive member according to the second embodiment, in the first step, the rod-shaped solder 100 is disposed on one side in the thickness direction of the soldering portion 321 of the plurality of second conductive members 320. And the soldered portions 222a and 230a of the plurality of first conductive members 222 and 230 on the one side in the thickness direction of the rod-shaped solder 100 and the soldered portions of the plurality of second conductive members 320, respectively. 321 is disposed in correspondence with each other, and in the second step, the heater chip 420 is disposed on the one side in the thickness direction of the soldering portions 222a and 230a of the first conductive members 222 and 230, The heater chip 420 generates heat and the heater chip 420 is soldered to the first conductive members 222 and 230. When it is brought into contact with 222a and 230a and pressed toward the other side in the thickness direction, the thick portions 110 and the thin portions 120 of the rod-shaped solder 100 are melted and the first conductive members 222 and 230 are melted. The soldering portions 222a and 230a are soldered to the soldering portions 321 of the second conductive members 320, respectively.

  In that case, when each said thin part 120 is heated and pressed toward the said other side of the said thickness direction by each said 2nd iron part 423 of the said heater chip 420 in the said 2nd process, each said 2nd The iron part 423 comes into contact with each thin part 120 and melts, and is divided in the longitudinal direction before each thick part 110. Therefore, the bar-shaped solder 100 is separated in the width direction at the thin portions 120, and the thick portions 110 are independent. Next, the independent thick portions 110 are disposed between the corresponding soldered portions 222a and 230a of the first conductive members 222 and 230 and the soldered portions 321 of the second conductive members 320, respectively. And melted and hardened to form most of the connecting solder 170 between the soldered portions 222a and 230a of the first conductive members 222 and 230 and the soldered portions 321 of the second conductive members 320. Therefore, the amount of solder of each of the connection solders 170 is ensured without being excessive or insufficient. Therefore, the connection strength of each of the connection solders 170 is ensured, and a gap between adjacent connection solders 170 is ensured. Further, when the rod-shaped solder 100 is heated, the thin portions 120 are melted before the thick portions 110, so that the thin portions 120 remain solid when the thick portions 110 are melted. Therefore, it is difficult to generate unmelted solder and solder balls between the connecting solders 170, so that the reliability of the product is improved. Further, when the rod-like solder 100 contains a paste, each thin portion 120 is divided in the longitudinal direction at a relatively early stage after the heating of the rod-like solder 100 is started. It is easy for the paste to be eluted from the cut surface, and the rod-like solder 100 is prevented from bursting by the gasified paste. This also makes it difficult for solder balls to be generated, improving the reliability of the product.

  Further, when there is a structure such as the inter-electrode wall 311f between the soldered portions 222a and 230a of the adjacent first conductive members 222 and 230, each of the structures has the adjacent thick portion 110. The thin portions 120 in between are opposed to each other. Therefore, if the step is provided in the thick portion 110 and the thin portion 120 on the surface of the rod-like solder 100 on the first conductive member 222, 230 side, the thin portion 120 is reliably separated from the structure. Therefore, it becomes possible to prevent the structure from being damaged by a thermal load. In addition, since the thick portion 110 is fitted on both sides of the structure in the width direction, the positioning accuracy of the rod-shaped solder 100 to the soldered portions 222a and 230a of the first conductive members 222 and 230 is improved. The variation in the solder amount of the connection solder 170 is reduced.

  The bar-shaped solder used in the method for soldering a conductive member of the present invention is provided with the gap in the width direction when the longitudinal direction is the width direction and the thickness direction orthogonal to the width direction is taken. A first surface having a width equal to or greater than a width of the soldered portion of each first conductive member on one side in the thickness direction and the other side in the thickness direction on the other side. A plurality of thick portions each having a second surface having a width equal to or less than the width of the soldered portion of each second conductive member and respectively corresponding to the soldered portions of the plurality of second conductive members; And a thin portion provided between adjacent thick portions, and the thickness of the thick portion may be larger than the thickness of other portions including the thin portion. However, among the rod-like solders used in the conductive member soldering method according to the various embodiments, the rod-like solder 100 used in the conductive member soldering method according to the first embodiment further includes the thickness described above. A flat surface is formed on one side of the direction, and one or more grooves 140 that are recessed from the other side of the thickness direction in the thickness direction and extend in the width direction and the depth direction orthogonal to the thickness direction are formed. The thick portions 110 are formed on both sides of the groove 140 in the width direction, and the thin portions 120 are formed between the groove 140 and one surface in the thickness direction. In this way, the rod-shaped solder used in the method for soldering a conductive member of the present invention can be realized with a relatively simple configuration. Further, when the rod-shaped solder 100 is used to solder the conductors of the electric wires 220 and 200 to the contacts of the electrical connector 300 having the inter-electrode walls 311f, the rod-shaped solder 100 is attached to the inter-electrode walls 311f. The grooves 140 are arranged to correspond to each other, and the thin wall portion 120 can be reliably separated from the interpolar walls 311f. Therefore, the interpolar walls 311f are damaged by a thermal load. The thick wall portions 110 are fitted on both sides in the width direction of the inter-electrode wall 311f, so that the positioning accuracy of the bar-shaped solder 100 to the electric connector 300 is improved, and each connection solder The variation in the solder amount of 170 is reduced.

  In the method for soldering a conductive member according to the present invention, the plurality of first conductive members are divided into the plurality of second conductive members provided in the insulating member, and the soldering portions are spaced apart from each other in the width direction. Any soldering method may be used as long as it is soldered in a lump so as to be aligned in a row. However, among the conductive member soldering methods according to the various embodiments, in the case of the conductive member soldering method according to the first embodiment, the first conductive members 222 and 230 are connected to the electric wires 220 and 230. 200, the conductor exposed from the terminal end, the insulating member 310 is a housing of the electrical connector 300 having a plurality of poles, and the second conductive members 320 constitute the poles of the electrical connector 300, respectively. The housing is provided with inter-electrode walls 311f that rise in the thickness direction from between the soldering portions 321 of the adjacent contacts, and the plurality of first conductive members 222, 230, The plurality of second conductive members 320 and the rod-shaped solder 100 are connected to the first surface 111 of the thick portions 110 of the rod-shaped solder 100. When the soldering portions 222a and 230a of the first conductive members 222 and 230 are in contact with each other and the soldering portions 321 of the second conductive members 320 are in contact with the second surface 112, respectively. In addition, the thin portions 120 between the adjacent thick portions 110 are arranged so as to face the inter-electrode walls 311f, respectively. By this method of soldering the conductive member, the conductors of the electric wires 220 and 200 are soldered to the soldering portion 321 of the contact of the electrical connector having the interelectrode wall 311f by using the rod-shaped solder 100. The first surface 111 of each of the thick portions 110 of the rod-shaped solder 100 is in contact with the soldered portions 222a and 230a of the conductors of the electric wires 220 and 200, respectively, and the second surface 112 is of each of the contacts. Each of the thin portions 120 between the adjacent thick portions 110 is opposed to each of the interelectrode walls 311f. Therefore, if the step is provided in the thick wall portion 110 and the thin wall portion 120 on the contact side surface of the rod-shaped solder 100, the thin wall portion 120 can be reliably separated from the inter-electrode wall 311f. In addition, it is possible to prevent the interelectrode wall 311f from being damaged by a thermal load, and the thick wall portions 110 are fitted on both sides of the interelectrode wall 311f in the width direction. Positioning accuracy is improved, and variation in the solder amount of each connection solder 170 is reduced.

  Also in the soldering method of the conductive member of the second embodiment, the first to fourth modifications of the rod-shaped solder 100 described above can be used. Therefore, in the description regarding the rod-shaped solder 100 of these modified examples, the description regarding the modified example of the rod-shaped solder 100 in the first embodiment is directly cited.

  Describing the outline, the rod-shaped solder 100 of the first modified example shown in FIGS. 14 and 15 is provided with the gap along the width direction, and the one side in the thickness direction is the above-mentioned one side. Each of the first conductive members 222, 230 has a first surface 111 having a width equal to or greater than the width of the soldered portions 222a, 230a, and each of the second conductive members 320 on the other side in the thickness direction. A plurality of thick portions 110 each having a second surface 112 having a width equal to or less than the width of the soldering portion 321 and corresponding to the soldering portions 321 of the plurality of second conductive members 320; A thin portion 120 provided between the adjacent thick portions 110 so that the surface on the one side in the thickness direction is continuous with the first surface 111 of the thick portion 110, and Thickness of the thick part 110 It is thicker than the thickness of the other portion including the thin wall portion 120. However, since the one side surface in the thickness direction of the thin portion 120 does not have to be continuous with the first surface 111 of the thick portion 110, it can be used in the second embodiment. In the rod-shaped solder, a step may be formed in the thickness direction between the surface on the one side in the thickness direction of the thin portion and the first surface of the thick portion. The rod-like solder 100 according to the first modification has a flat surface formed on one side in the thickness direction, and is recessed from the other side in the thickness direction in the thickness direction, and also in the width direction and the thickness. One or more grooves 140 extending in the depth direction orthogonal to the direction are formed, the thick portions 110 are respectively formed on both sides of the groove 140 in the width direction, and the surface on one side of the thickness direction and the surface The thin portion 120 is formed between the groove 140. One side in the thickness direction of the rod-shaped solder 100 may be formed on a surface having irregularities instead of a flat surface. Further, the above-mentioned clear groove may not be formed by gently changing between the thick part and the thin part. Further, in the rod-shaped solder of the first modified example, the thin portion 120 protrudes on both sides in the depth direction, and the groove 140 protrudes on both sides in the depth direction. Other configurations are the same as those of the rod-like solder 100 of the second embodiment. Since the operation and effect when the rod-shaped solder 100 of the first modification is used are the same as those of the second embodiment, the description thereof is omitted.

  Further, the rod-like solder 100 of the second modification shown in FIGS. 16 and 17 is provided at the intervals along the width direction, and each of the first solders on the one side in the thickness direction. The solder of each of the second conductive members 320 has a first surface 111 having a width equal to or greater than the width of the soldering portions 222a and 230a of the conductive members 222 and 230, and on the other side in the thickness direction. Adjacent to the plurality of thick portions 110 having the second surface 112 having a width equal to or less than the width of the attaching portion 321 and corresponding to the soldering portions 321 of the plurality of second conductive members 320, respectively. A thin portion 120 provided between the thick portions 110 so that the one surface in the thickness direction is continuous with the first surface 111 of the thick portion 110, and the thick portions The thickness of the portion 110 is the above thin portion It is thicker than the thickness of the other parts including 20. However, since the one side surface in the thickness direction of the thin portion 120 does not have to be continuous with the first surface 111 of the thick portion 110, it can be used in the second embodiment. In the rod-shaped solder, a step may be formed in the thickness direction between the surface on the one side in the thickness direction of the thin portion and the first surface of the thick portion. The rod-like solder 100 according to the second modification has one or more grooves 140 that are recessed in the thickness direction from the other side in the thickness direction and that extend in the width direction and the depth direction perpendicular to the thickness direction. The thick portion 110 is formed on both sides of the groove 140 in the width direction, and the thin portion 120 is formed between the surface on one side in the thickness direction and the groove 140. ing. Although the first surface of the rod-like solder 100 is formed as a flat surface, the first surface may be formed as a surface having irregularities. Further, the above-mentioned clear groove may not be formed by gently changing between the thick part and the thin part. Furthermore, the rod-shaped solder of the second modified example is formed such that each thin portion 120 is raised in a U shape toward the one side in the thickness direction, and for this reason, the rod-shaped solder 100 has the thickness direction. The one side surface of the projection protrudes to the one side in the thickness direction between the adjacent first surfaces 111. Other configurations are the same as those of the rod-like solder 100 of the second embodiment.

  When the rod-shaped solder 100 of the second modification is used, the timing at which the second iron parts 423 come into contact with the thin-walled portions 120 in the second step is faster than when the other rod-shaped solder 100 is used. Thus, the time between the contact timing and the timing at which each of the first iron portions 422 contacts each of the thick portions 110 can be made relatively large. Since other operations and effects when the rod-like solder 100 of the second modification is used are the same as those of the second embodiment, description thereof is omitted.

  Furthermore, the rod-shaped solder 100 of the third modification shown in FIGS. 18 to 20 is provided at the intervals along the width direction, and each of the first solders on the one side in the thickness direction. The solder of each of the second conductive members 320 has a first surface 111 having a width equal to or greater than the width of the soldering portions 222a and 230a of the conductive members 222 and 230, and on the other side in the thickness direction. Adjacent to the plurality of thick portions 110 having the second surface 112 having a width equal to or less than the width of the attaching portion 321 and corresponding to the soldering portions 321 of the plurality of second conductive members 320, respectively. A thin portion 120 provided between the thick portions 110 so that the one surface in the thickness direction is continuous with the first surface 111 of the thick portion 110, and the thick portions The thickness of the portion 110 is thin It is thicker than the thickness of the other parts including the parts 120. However, since the one side surface in the thickness direction of the thin portion 120 does not have to be continuous with the first surface 111 of the thick portion 110, it can be used in the second embodiment. In the rod-shaped solder, a step may be formed in the thickness direction between the surface on the one side in the thickness direction of the thin portion and the first surface of the thick portion. The rod-like solder 100 according to the third modified example has a flat surface formed on one side in the thickness direction and is recessed in the thickness direction from the other side in the thickness direction, and also in the width direction and the thickness. One or more grooves 140 extending in the depth direction orthogonal to the direction are formed, the thick portions 110 are respectively formed on both sides of the groove 140 in the width direction, and the surface on one side of the thickness direction and the surface The thin portion 120 is formed between the groove 140. One side in the thickness direction of the rod-shaped solder 100 may be formed on a surface having irregularities instead of a flat surface. Further, the above-mentioned clear groove may not be formed by gently changing between the thick part and the thin part. Further, the rod-like solder 100 of the third modified example has the smallest cross-sectional area in the thin wall portion 120 when the cross section of the thin wall portion 120 is crossed by the surface facing the width direction in the middle of the thin wall portion 120. A narrow portion 150 is formed. Other configurations are the same as those of the rod-like solder 100 of the second embodiment.

  When the rod-like solder 100 of the third modification is heated, the narrow portion 150 of the thin portions 120 is melted first, so that the rod-like solder 100 is separated in the width direction at the thin portions. Thus, the action and effect obtained with the rod-like solder 100 used in the method of soldering a conductive member according to the first embodiment can be obtained more reliably. Further, since the rod-like solder 100 is separated in the width direction in each narrow portion 150 and each thick portion 110 is independent, it is separated in the middle in the width direction by each independent thick portion 110. The half cracks of each thin portion 120 are absorbed. Therefore, the solder amount of each of the connection solders 170 is more accurately ensured, and variations are reduced. Therefore, the connection strength of each connection solder 170 and the clearance between the adjacent connection solders 170 can be more reliably obtained. Further, unmelted solder and solder balls are further formed between the connection solders 170. It is difficult to produce and the reliability of the product is improved. Since other operations and effects when the rod-like solder 100 of the third modification is used are the same as those of the second embodiment, description thereof is omitted.

  Furthermore, the rod-shaped solder 100 of the fourth modified example shown in FIGS. 21 to 24 is provided with the above-mentioned interval along the width direction. The first surface 111 having a width equal to or greater than the width of the soldering portions 222a and 230a of the first conductive members 222 and 230 on the one side in the thickness direction and the other side in the thickness direction The second conductive member 320 has a second surface 112 having a width equal to or less than the width of the soldering portion 321 of each of the second conductive members 320 and the soldering portions 321 of the plurality of second conductive members 320 respectively. Between the corresponding thick portions 110 and the adjacent thick portions 110, the one side surface in the thickness direction is provided so as to be continuous with the first surface 111 of the thick portion 110, respectively. Thin wall portion 120 and Provided, the thickness of the thick portion 110 is formed thicker than the thickness of the other portion including the thin wall portion 120. However, since the one side surface in the thickness direction of the thin portion 120 does not have to be continuous with the first surface 111 of the thick portion 110, it can be used in the second embodiment. In the rod-shaped solder, a step may be formed in the thickness direction between the surface on the one side in the thickness direction of the thin portion and the first surface of the thick portion. The rod-like solder 100 according to the first modification has a flat surface formed on one side in the thickness direction except for the receiving portion 160, and is recessed from the other side in the thickness direction in the thickness direction. One or more grooves 140 extending in the depth direction orthogonal to the width direction and the thickness direction are formed, and the thick portions 110 are formed on both sides of the width direction of the groove 140, respectively. The thin-walled portion 120 is formed between the surface on one side and the groove 140. One side in the thickness direction of the rod-shaped solder 100 may be formed on a surface having irregularities instead of a flat surface. Further, the above-mentioned clear groove may not be formed by gently changing between the thick part and the thin part. Further, the rod-like solder 100 of the fourth modified example is recessed in the thickness direction on the first surface 111 of the thick portion 110, and the soldering portions 222a of the first conductive members 222 and 230, The receiving part 160 into which 230a enters is formed. Other configurations are the same as those of the rod-like solder 100 of the second embodiment.

  The rod-like solder 100 of the fourth modified example is difficult to move carelessly because the soldering portions 222a and 230a of the first conductive members 222 and 230 are locked to the receiving portion 160 when soldering. Therefore, the workability of soldering can be improved. Since other operations and effects when the rod-shaped solder 100 of the fourth modification is used are the same as those of the second embodiment, description thereof is omitted.

  The method for soldering a conductive member of the present invention includes embodiments that combine the features of the embodiments described above and the modifications thereof. Furthermore, the embodiment described above and the modifications thereof are only a few examples of the soldering method of the conductive member of the present invention. Therefore, the soldering method for the conductive member of the present invention is not limitedly interpreted by the description of these embodiments and the modifications thereof.

DESCRIPTION OF SYMBOLS 100 Rod-shaped solder 110 Thick part 111 1st surface 112 2nd surface 120 Thin part 140 Groove 150 Narrow part 160 Receiving part 170 Connection solder 200 Electric wire (shield cable)
220 wires (independent wires)
221 Insulation coating 222 First conductive member (conductor)
222a Soldering portion 230 First conductive member (drain wire)
230a Soldering part 300 Electrical connector 310 Insulating member (housing)
311f Inter-electrode wall 320 Second conductive member (contact)
321 Soldering part 400 Thermal fusion apparatus 410 Heater head 420 Heater chip 422 First iron part 423 Second iron part

Claims (6)

A soldering method in which a plurality of first conductive members are collectively soldered to a plurality of second conductive members provided on an insulating member such that respective soldering portions are arranged in a line in the width direction at intervals. There,
One rod-shaped solder extending in the width direction is arranged on one side of the thickness direction orthogonal to the width direction of the soldering portion of the plurality of second conductive members, and the one of the rod-shaped solders in the thickness direction is disposed. A first step of disposing the soldered portions of the plurality of first conductive members on the side corresponding to the soldered portions of the plurality of second conductive members,
One heater chip extending in the width direction is disposed on the one side in the thickness direction of the soldered portion of the plurality of first conductive members to cause the heater chip to generate heat and to attach the heater chip to the plurality of first chips. A second step of contacting the soldered portion of one conductive member and pressing it toward the other side in the thickness direction,
The rod-shaped solder is provided at the intervals along the width direction, and has a width equal to or greater than the width of the soldered portion of each first conductive member on the one side in the thickness direction. And a second surface having a width equal to or less than the width of the soldered portion of each second conductive member on the other side in the thickness direction. Between the plurality of thick portions corresponding to the soldered portions of the two conductive members and the adjacent thick portions, the one side surface in the thickness direction is the first surface of the thick portion. Each having a thin portion provided to be continuous, and the thickness of the thick portion is formed to be thicker than the thickness of other portions including the thin portion,
The heater chip is provided at the interval along the width direction, and from the portion corresponding to at least the center of each thick portion to the other side in the thickness direction when viewed in the thickness direction. Provided between the first iron part projecting and the first iron part adjacent to each other, and in the second step, each soldering part and each thick wall of each first conductive member by each first iron part. When the portion is heated and pressed toward the other side in the thickness direction, the thin portion contacts the surface of the thin portion when the thin portion is displaced toward the one side in the thickness direction. The soldering method of the electrically-conductive member provided with the 2nd iron part each provided. A soldering method in which a plurality of first conductive members are collectively soldered to a plurality of second conductive members provided on an insulating member such that respective soldering portions are arranged in a line in the width direction at intervals. There,
One rod-shaped solder extending in the width direction is arranged on one side of the thickness direction orthogonal to the width direction of the soldering portion of the plurality of second conductive members, and the one of the rod-shaped solders in the thickness direction is disposed. A first step of disposing the soldered portions of the plurality of first conductive members on the side corresponding to the soldered portions of the plurality of second conductive members, respectively,
One heater chip extending in the width direction is disposed on the one side in the thickness direction of the soldered portion of the plurality of first conductive members to cause the heater chip to generate heat and to attach the heater chip to the plurality of first chips. A second step of contacting the soldered portion of one conductive member and pressing it toward the other side in the thickness direction,
The rod-shaped solder is provided at the intervals along the width direction, and has a width equal to or greater than the width of the soldered portion of each first conductive member on the one side in the thickness direction. And a second surface having a width equal to or less than the width of the soldered portion of each second conductive member on the other side in the thickness direction. A plurality of thick portions corresponding to the soldered portions of the two conductive members, and a thin portion provided between the adjacent thick portions, and the thickness of the thick portion is the thickness of the thin portion. It is formed thicker than the thickness of other parts including
The heater chip is provided at the interval along the width direction, and a first iron part provided at a portion corresponding to at least a central part of each of the thick portions as viewed in the thickness direction; The first protrusion protrudes to the other side in the thickness direction from the first iron portion at a portion corresponding to at least the central portion of each thin portion between the first iron portions adjacent to each other in the thickness direction. A method for soldering a conductive member having two iron parts.   The rod-shaped solder has a flat surface formed on one side in the thickness direction, and has a groove extending in the depth direction perpendicular to the width direction and the thickness direction while being recessed in the thickness direction from the other side of the thickness direction. One or two or more are formed, the thick portions are formed on both sides of the groove in the width direction, and the thin portions are formed between one surface in the thickness direction and the groove. The soldering method of the electrically-conductive member of Claim 1 or Claim 2.   2. A narrow portion in which the cross-sectional area when the bar-shaped solder is cross-sectioned by a surface facing the width direction is formed in the middle of the thin portion in the thin portion. The method for soldering a conductive member according to any one of claims 3 to 4.   5. The bar-shaped solder is formed with a receiving portion that is recessed in the thickness direction and into which the soldered portion of the first conductive member enters in the first surface of the thick portion. The soldering method of any 1 item | term among these. Each of the first conductive members is a conductor exposed from the end of the wire,
The insulating member is a housing of an electrical connector having a plurality of poles, and each of the second conductive members is a contact that constitutes each of the poles of the electrical connector. An inter-electrode wall that rises in the thickness direction from between the soldered parts is provided,
The plurality of first conductive members, the plurality of second conductive members, and the rod-shaped solder, and the soldered portions of the first conductive members on the first surface of the thick portions of the rod-shaped solder, respectively. When the soldering portions of the second conductive members are in contact with the second surface, the thin portions between the adjacent thick portions are in contact with the interpolar walls. 6. The method for soldering a conductive member according to claim 1, wherein the conductive members are disposed so as to face each other.

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