JP5437847B2 - Rod solder and soldering method using the same - Google Patents

Description

  The present invention belongs to the technical field of soldering, and relates to a rod-shaped solder used for collectively soldering a plurality of conductive members to a plurality of conductive members provided on an insulating member.

  In Patent Document 1, terminals arranged at a predetermined pitch are opposed and overlapped, a band-shaped solder is interposed between the overlapping portions, the solder is melted by heating, and the overlapping portions are soldered. In the joining method of terminals to be joined, a fitting groove having the same pitch as the terminal arrangement is formed in the solder in advance, the fitting groove is fitted to one terminal, and the other terminal is placed on the upper surface of the fitting portion. A method of joining terminals that are superposed is disclosed. Further, this document also discloses a method for joining terminals in which notches are formed between fitting grooves formed in the solder.

  In Patent Document 2, a plurality of conductive terminals are arranged at an appropriate pitch interval along the longitudinal width direction of the elongated insulating housing, and arranged so as to extend along the longitudinal width direction of the insulating housing. A coaxial cable electrical connector is disclosed in which a coaxial cable center conductor is collectively connected to each of the conductive terminals using a long solder material.

Japanese Patent Publication No. 5-57718 JP 2007-305452 A

  As described above, the plurality of first conductive members are arranged on the plurality of second conductive members provided on the insulating member using the conventional bar-shaped solder so that the respective soldered portions are arranged in a line at intervals. When soldering in a lump, the amount of solder that forms each melted and hardened connection solder may not be uniform. In that case, the connection strength is lower than the target value in the connection solder in which the solder amount is excessively small, and the gap between adjacent connection solder portions is narrower than the target value in the connection solder in which the solder amount is excessive. . In addition, solder may be left unmelted or solder balls may be formed with rounded solder. If these are left untreated, the reliability of the product may not be sufficiently secured.

  Further, a plurality of contacts are provided on the housing of the electrical connector to form a plurality of poles, and the conductors exposed from the ends of the plurality of electric wires are aligned with the plurality of contacts, and the respective soldered portions are arranged in a row at intervals. In the case of performing soldering collectively using the rod-shaped solder, if the housing is provided with an inter-electrode wall that rises in the thickness direction from between the soldering portions of the adjacent contacts, soldering is performed. Sometimes, the interelectrode wall is damaged by receiving a heat load from the rod-shaped solder heated to a high temperature.

  The present invention has been made paying attention to such a point, and the object is to provide a thick part and a thin part along the longitudinal direction, and when the thin part is heated, Each thick part melts before each thick part to form a large part of each connection solder, thereby ensuring the amount of solder of each connection solder and ensuring the connection strength of each connection solder. It is possible to ensure the gap between the connecting solders and the adjacent connecting solder, and to prevent the unmelted solder and the generation of solder balls to improve the reliability of the product. When used when connecting the conductor of the wire to the contact of the connector, if the step is provided between the thick part and the thin part on the surface on the contact side, the interpolar wall is prevented from being damaged by a thermal load. It becomes possible to A rod-like solder positioning accuracy of the serial electrical connector is improved to provide a soldering method using the same.

In order to achieve the above object, according to the first rod-shaped solder of the present invention, a plurality of first conductive members are arranged in a row with a plurality of second conductive members provided on an insulating member, with respective soldering portions spaced apart. It is a rod-shaped solder used for soldering in a lump so that it is aligned with
When the longitudinal direction is the width direction and the thickness direction orthogonal to the width direction is taken, the first direction is provided at one side of the thickness direction. A plurality of first surfaces having a width equal to or greater than the width of the conductive member and a second surface having a width equal to or less than the width of each of the second conductive members on the other side in the thickness direction; The thick part of
A thin portion provided between each of the adjacent thick portions,
The thick part is formed thicker than other parts including the thin part.

  The plurality of first conductive members, the plurality of second conductive members, and the bar-shaped solder are connected to the first surfaces of the thick portions of the bar-shaped solder, and the first conductive members are in contact with the first surfaces. When each of the second conductive members is placed in contact with two surfaces, and each of the first conductive members is heated, the thick and thin portions of the bar-shaped solder are melted and the respective first conductive members are melted. One conductive member is soldered to each of the second conductive members.

  In that case, when the rod-shaped solder is heated, the thin-walled portions melt before the thick-walled portions, the rod-shaped solder is separated in the width direction at the thin-walled portions, and the thick-walled portions are Each is independent. Next, the independent thick portions are melted and solidified between the first conductive members and the second conductive members corresponding thereto, and the connection solders of the first conductive members and the second conductive members. Therefore, the amount of solder of each of the connecting solders is ensured without being excessive or insufficient. Therefore, the connection strength of each of the connection solders is ensured and a gap between adjacent connection solders is ensured. Further, when the rod-shaped solder is heated, the thin portions are melted before the thick portions, so that when the thick portions are melted, the thin portions are not likely to remain solid. Since the unmelted solder and solder balls are not easily generated between the connecting solders, the reliability of the product is improved.

  Further, when soldering the conductor of the electric wire to the contact of the electrical connector having a plurality of poles and the inter-electrode wall rising in the thickness direction from between the soldering portions of adjacent contacts in the housing, When the rod-shaped solder is used, the first surface of each thick portion of the rod-shaped solder is in contact with the conductor of each electric wire and the second surface is in contact with each of the contacts. The thin portions between the adjacent thick portions face each other. Therefore, if the step is provided between the thick portion and the thin portion on the contact side surface of the rod-shaped solder, the thin portion can be reliably separated from the interpolar wall. Can be prevented from being damaged by a thermal load, and the thick-walled portions are fitted on both sides in the width direction of the inter-electrode wall, so that the positioning accuracy of the bar-shaped solder to the electrical connector is improved, and each of the connections Variation in solder amount of solder is reduced.

  The second bar-shaped solder of the present invention is the first bar-shaped solder, further comprising a flat surface formed on one side in the thickness direction, and recessed from the other side in the thickness direction to the thickness direction and having the width described above. One or more grooves extending in the depth direction perpendicular to the direction and the thickness direction are formed, and the thick portions are formed on both sides of the groove in the width direction, respectively, and the surface on one side of the thickness direction The thin portion is formed between the groove and the groove.

  In this way, the first bar-shaped solder can be realized with a relatively simple configuration. Further, when this rod-shaped solder is used for soldering a conductor of an electric wire to the contact of the electrical connector having the inter-electrode wall, the rod-shaped solder is arranged so that the grooves correspond to the inter-electrode walls. Since the thin wall portion can be reliably separated from each inter-electrode wall, it is possible to prevent the inter-electrode wall from being damaged by a thermal load, and to Since the thick part fits on both sides of the width direction of the space, the positioning accuracy of the bar-shaped solder to the electrical connector is improved, and the variation in the solder amount of each connection solder is reduced.

  The third rod-shaped solder of the present invention is the first or second rod-shaped solder, and the cross-sectional area when the cross-section of the thin-walled portion is cut in a plane facing the width direction in the middle of the width direction is the above. A narrow portion that is the smallest among the thin portions is formed.

  In this way, when the rod-shaped solder is heated, the narrow portion of the thin portions melts first, so that the probability that the rod-shaped solder is separated in the width direction at the thin portions is increased. Thus, the actions and effects obtained with the first or second rod-like solder can be obtained more reliably. Further, since the rod-shaped solder is separated in the width direction in the narrow portions, and the thick portions are independent of each other, the thin portions separated in the middle of the width direction into the independent thick portions. A piece of crack is absorbed. Therefore, the amount of solder of each connection solder is more accurately ensured, and variation is reduced. Therefore, the connection strength of each connection solder and the clearance between adjacent connection solders can be more reliably obtained, and the unmelted solder and solder balls are more unlikely to be generated between the connection solders. The reliability of the product will be improved.

The fourth rod-shaped solder of the present invention is the rod-shaped solder according to any one of the first to third,
A receiving portion that is recessed in the thickness direction and into which the soldering portion of the first conductive member enters is formed on the first surface of the thick portion.

  In this way, if the soldering part of the first conductive member is inserted into the receiving part during soldering, the soldering part does not move carelessly, so that the soldering workability is improved. To do.

According to the soldering method of the present invention, the plurality of first conductive members are replaced with the plurality of second conductive members provided on the insulating member by using any one of the first to fourth rod-shaped solders. The soldering method of soldering in a lump so that the soldering parts of the two are arranged in a row at intervals, and this soldering method is
The plurality of first conductive members, the plurality of second conductive members, and the bar-shaped solder are connected to the first surfaces of the thick portions of the bar-shaped solder, and the first conductive members are in contact with the first surfaces. Arranged so that each of the second conductive members is in contact with two surfaces,
Each said 1st conductive member is heated, respectively, and each said thick part and each said thin part of the said rod-shaped solder are each melt | dissolved, and each said 1st conductive member is each soldered to each said 2nd conductive member.

  In this case, when each of the first conductive members is heated, the thick portions of the bar-shaped solder are heated, the thin portions are melted before the thick portions, and the bar-shaped solder is The thin portions are separated in the width direction, and the thick portions are independent. Next, the independent thick portions are melted and solidified between the first conductive members and the second conductive members corresponding thereto, and the connection solders of the first conductive members and the second conductive members. Therefore, the amount of solder of each of the connecting solders is ensured without being excessive or insufficient. Therefore, the connection strength of each of the connection solders is ensured and a gap between adjacent connection solders is ensured. Further, when the rod-shaped solder is heated, the thin portions are melted before the thick portions, so that when the thick portions are melted, the thin portions are not likely to remain solid. Since the unmelted solder and solder balls are not easily generated between the connecting solders, the reliability of the product is improved.

  Further, when soldering the conductor of the electric wire to the contact of the electrical connector having a plurality of poles and the inter-electrode wall rising in the thickness direction from between the soldering portions of adjacent contacts in the housing, The first surface of each thick part of the bar-shaped solder is in contact with the conductor of each electric wire and the second surface is in contact with each contact, but the thick part is adjacent to each interelectrode wall. The thin-walled portions in between are opposed to each other. Therefore, if the step is provided between the thick portion and the thin portion on the contact side surface of the rod-shaped solder, the thin portion can be reliably separated from the interpolar wall. Can be prevented from being damaged by a thermal load, and the thick-walled portions are fitted on both sides in the width direction of the inter-electrode wall, so that the positioning accuracy of the bar-shaped solder to the electrical connector is improved, and each of the connections Variation in solder amount of solder is reduced.

The second soldering method of the present invention is the first soldering method, wherein each of the first conductive members is a conductor exposed from the end of the electric wire,
The insulating member is a housing of an electrical connector having a plurality of poles, and each of the second conductive members is a contact that constitutes each of the poles of the electrical connector. An inter-electrode wall that rises in the thickness direction from between the soldered parts is provided,
The rod-shaped solder is any one of the first to fourth rod-shaped solders, and the plurality of first conductive members, the plurality of second conductive members, and the rod-shaped solders are respectively connected to the rod-shaped solders. When the first conductive members are in contact with the first surface of the thick portion, and the second conductive members are in contact with the second surface, the adjacent thick portions The thin portions are arranged so as to face the inter-electrode walls.

  By this second soldering method, the conductor of the electric wire is soldered to the contact of the electrical connector having the interelectrode wall using any one of the first to fourth rod-shaped solders. And the said 1st surface of each said thick part of the said rod-shaped solder is each contacted with the conductor of each said electric wire, and the said 2nd surface is each contacted with each said contact, respectively, but said each adjacent to said each interelectrode wall Each said thin part between thick parts opposes, respectively. Therefore, if the step is provided between the thick portion and the thin portion on the contact side surface of the rod-shaped solder, the thin portion can be reliably separated from the interpolar wall. Can be prevented from being damaged by a thermal load, and the thick-walled portions are fitted on both sides in the width direction of the inter-electrode wall, so that the positioning accuracy of the bar-shaped solder to the electrical connector is improved, and each of the connections Variation in solder amount of solder is reduced.

  The first rod-shaped solder of the present invention is provided with a thick portion and a thin portion along the longitudinal direction, and when heated, the thin portions melt before the thick portions, and the thick portions. Since each of the connection solders is formed, it is possible to secure the solder amount of each of the connection solders to ensure the connection strength of each of the connection solders and the clearance between the adjacent connection solders. It is possible to improve the reliability of the product by preventing the unmelted solder and the generation of solder balls. Further, when used when connecting the conductor of the electric wire to the contact of the electric connector having the interelectrode wall, If a step is provided between the thick wall portion and the thin wall portion on the contact side surface of the rod-shaped solder, it is possible to prevent the inter-electrode wall from being damaged by a thermal load, and to the electrical connector. Positioning precision There can be improved to reduce the variation of the solder amount of each connection solder.

  The second bar-shaped solder of the present invention can realize the first bar-shaped solder with a relatively simple configuration in addition to obtaining the effects obtained by the first bar-shaped solder. When used when connecting a conductor of an electric wire to a contact of an electrical connector having an inter-wall, it is possible to prevent the inter-electrode wall from being damaged by a thermal load, and positioning accuracy to the electrical connector. As a result, the variation in the solder amount of each connection solder can be reduced.

  In addition to obtaining the effects obtained by the first or second rod-like solder, the third rod-like solder of the present invention further ensures the amount of solder of each of the connecting solders and reduces variations. Therefore, it is possible to more surely secure the connection strength of each connection solder and the clearance between adjacent connection solders, and further generate unmelted solder and solder balls between the connection solders. The reliability of the product can be improved.

  According to the fourth rod-shaped solder of the present invention, in addition to obtaining the effect obtained by any one of the first to third rod-shaped solders, the solder of the first conductive member can be obtained as described above. Since the soldering portion is locked to the receiving portion, it is difficult to move carelessly, and the soldering workability can be improved.

  The first soldering method of the present invention can obtain the same effects as those obtained by any one of the first to fourth rod-shaped solders.

  According to the second soldering method of the present invention, in addition to obtaining the effect obtained by the first soldering method, further, any one of the first to fourth rod-shaped solders is used. The method of soldering the conductor of an electric wire to the said contact of the electrical connector provided with the said space | interval wall was able to be disclosed concretely.

FIG. 1 is a perspective view of a first embodiment of a rod-shaped solder according to the present invention. Viewed from the first surface side of the thick part. FIG. 2 is a perspective view of the first embodiment of the rod-shaped solder. Viewed from the second surface side of the thick part. FIG. 3 is a front view of the first embodiment of the rod-shaped solder. FIG. 4 is a perspective view showing the electric wire, the rod-shaped solder, and the electric connector separately when the electric wire conductor is connected to the electric connector using the first embodiment of the rod-shaped solder. . FIG. 5 is a perspective view of the electric wire, the rod-shaped solder, and the electrical connector shown in FIG. 4 when assembled. FIG. 6 is a cross-sectional view of the rod-shaped solder in FIG. 5 taken along a cross-sectional line transverse to the longitudinal direction. 7 to 12 are front views for explaining an embodiment of a soldering method using the rod-like solder of the present invention. FIG. 7 is a front view of a heat-sealing device, a holder housing holding the electric wire in the electric connector, the bar-shaped solder, and a main body housing of the electric connector. FIG. 8 is a front view of the rod-shaped solder and the main body housing, and illustrates that the former is placed on the latter. FIG. 9 is a front view of the electric wire and the holder housing, the rod-shaped solder and the main body housing, and illustrates that the former is placed on the latter. FIG. 10 is a front view when the heat-sealing device is arranged above the rod-shaped solder and the electric wire placed on the main body housing and the holder housing. FIG. 11 is a front view when the above-described heat fusion apparatus is lowered from the state of FIG. FIG. 12 is a front view when the soldering is finished and the heat sealing apparatus is retracted. FIG. 13 is a perspective view of a second embodiment of the rod-shaped solder of the present invention. Viewed from the first surface side of the thick part. FIG. 14 is a perspective view of a second embodiment of the rod-shaped solder. Viewed from the second surface side of the thick part. FIG. 15 is an enlarged plan view of a part of the second embodiment of the bar-shaped solder. FIG. 16 is a perspective view of a third embodiment of the rod-shaped solder of the present invention. Viewed from the first surface side of the thick part. FIG. 17 is a perspective view of a third embodiment of the rod-shaped solder. Viewed from the second surface side of the thick part. FIG. 18 is a front view of a third embodiment of the rod-shaped solder.

  Embodiments of the present invention will be described below. 1 to 3 show a first embodiment of a rod-shaped solder according to the present invention. The rod-shaped solder 100 includes a plurality of first conductive members 222 and 230, a plurality of second conductive members 320 provided on the insulating member 310, and solder portions 222a and 230a and second portions of the first conductive members 222 and 230. The soldering part 321 of the conductive member 320 is used for soldering at a time so as to be arranged in a line at intervals in the width direction to be described later. The soldering parts 222a, 230a, and 321 are parts to be soldered in the first conductive members 222, 230 and the second conductive member 320, respectively. As shown in FIGS. 4 to 12, in the case of the first embodiment, there are three types of the first conductive members. The first first conductive member 222 is the conductor in an independent electric wire 220 in which a conductor called a core wire or a core is covered with an insulating coating 221. The second first conductive member 222 is the conductor in the electric wire 220 in which the periphery of the conductor is similarly covered with the insulating coating 221. The electric wire 220 is bundled together with a drain wire made of a conductor called a core wire or a core and covered with a conductive shield tape, and this shield tape is covered with an insulating coating 210. The electric wire 220, the drain wire, the shield tape, and the insulating coating 210 constitute a shield cable. The drain wire of the shielded cable is also the first conductive member, which becomes the third first conductive member 230. Although the number of the electric wires 220 incorporated in the electric wire 200 made of the shielded cable is two, the number of built-in wires may be one or three or more. There are two drain wires built in the electric wire 200 made of the shielded cable, but the number of built-in wires may be one, three or more, or there may be no drain wires. The end of the first conductive member 222, which is a conductor of the independent electric wire 220 and a conductor of the electric wire 220 built in the electric wire 200 made of the shielded cable, peels off the insulating coating 221 at the end of the electric wire 220. As a result, the insulating coating 221 is exposed from the end. Further, the end of the first conductive member 230 that is a conductor of the electric wire 200 made of the shielded cable is exposed from the end of the insulating coating 210 by peeling off the insulating coating 210 at the end of the electric wire 200. Yes. The insulating member 310 is a housing of the electrical connector 300 in which a contact is provided on the housing, and the second conductive member 320 is the contact. However, the first conductive member is unified by any one of the above-described independent conductor of the electric wire 220, the conductor of the electric wire 220 incorporated in the shielded cable, and the drain wire incorporated in the shielded cable. It is also possible to combine these two or three. The conductor of the electric wire to be used for the rod-shaped solder of the present invention is not limitedly interpreted by this embodiment, and is a conductor that can be exposed from the end of the electric wire. If it can be arranged in, it will be a target. In addition, the first conductive member and the second conductive member to be used for the rod-shaped solder of the present invention may be any conductive member that can be soldered, and are interpreted in a limited manner by this embodiment. There is nothing. As an example, the first conductive member is a lead of an electronic component, and the second conductive member is a conductor pattern of a printed wiring board.

  Hereinafter, the width direction, the thickness direction, and the depth direction which are orthogonal to each other will be described, and description will be made using these orientations. In the case of the first embodiment described above with reference to FIG. 7, the horizontal direction in this figure is the width direction, the vertical direction in this figure is the thickness direction, and the direction perpendicular to the paper surface in this figure is In the depth direction, the front side of the paper surface is the near side in the depth direction, and the back side of the paper surface is the back side in the depth direction. In this embodiment, the thickness direction corresponds to the vertical direction, but the thickness direction may correspond to a direction other than the vertical direction. The electrical connector 300 includes the insulating member 310 that is the housing and the plurality of second conductive members 320 that are the plurality of contacts provided on the insulating member 310. Although the insulating member 310 is formed of a synthetic resin, the insulating member may be formed of an insulating material. The insulating member 310 includes a main body housing 311 and a holder housing 312 assembled to the main body housing 311 from the upper side which is one side in the thickness direction. In this embodiment, the insulating member 310 is divided into the main body housing 311 and the holder housing 312 as described above, but may be integrated without being divided. As shown in FIGS. 4 to 6, the main body housing 311 is substantially U in a plan view by a horizontal member extending in the width direction and two vertical members extending substantially parallel from both ends to the back side in the depth direction. The main body 311a formed in a letter shape and the transverse member of the main body 311a extend from the depth side in the depth direction to the lower side, which is the other side in the thickness direction, and engage with a mating electrical connector (not shown). And a fitting portion 311b. The fitting portion 311b is fitted or detached from the mating electrical connector along the thickness direction. The upper end surface, which is one side in the thickness direction of the fitting portion 311b, is formed on the back side in the depth direction of the transverse member so as to face the upper side, which is one side in the thickness direction. Yes. In the main body 311a, a receiving portion 311d for receiving the holder housing 312 from the upper side, which is one side in the thickness direction, is formed between the opposing end surfaces of the two vertical members.

  Each of the second conductive members 320 is formed in a substantially strip shape from a metal, and is press-fitted into the fitting portion 311b. The second conductive member may be formed of a conductive material. Each of the second conductive members 320 has a wider surface in contact with a surface on the far side in the depth direction of the fitting portion 311b except for an upper end which is one side in the thickness direction. Yes. The end portions of the second conductive members 320 are bent toward the front side in the depth direction and are in contact with the end surfaces of the fitting portions 311b. The end portions of the second conductive members 320 are soldered portions 321 of the second conductive member 320. Therefore, each said 2nd conductive member 320 is formed in the substantially L shape seeing from the said width direction.

  The holder housing 312 is formed in a substantially plate shape, and the plate thickness direction thereof substantially coincides with the thickness direction. The holder housing 312 has substantially the same dimension in the thickness direction as the main body 311a. When the holder housing 312 is brought close to the main body 311a along the thickness direction, the holder housing 312 is fitted into the receiving portion 311d.

  In the central part of the holder housing 312, caulking shells 330 for caulking the independent electric wires 220 and the electric wires 200 made of the shielded cables incorporating the electric wires 220 are placed side by side in the width direction. A mounting portion 312b is provided. A first holding portion that is recessed in a substantially U shape from one end face in the thickness direction is provided on the inner side of the holder housing 312 in the depth direction, and includes the independent electric wire 220 and the shielded cable. The electric wires 200 are fitted and held. A second holding portion that is recessed in a substantially U shape from one end face in the thickness direction is provided on the front side in the depth direction of the holder housing 312. From the independent electric wire 220 and the shielded cable, The electric wire 220 drawn from the terminal end of the electric wire 200 and the first conductive member 230 made of the drain wire drawn from the terminal end of the electric wire 200 made of the shield cable are fitted and held. Two of the wires 220 drawn from the end of the wire 200 made of the shielded cable are held together by the second holding portion. The first conductive member 230 made of the drain wire is appropriately divided, and the divided members are held by the second holding part alone or in a bundle. These holding forms by the second holding part are appropriately handled according to the specifications of the electric connector, and this embodiment limits the interpretation of the connection form of the electric wires in the electric connector targeted by the present invention. There is nothing.

  The end portions of the plurality of second conductive members 320 are arranged in the width direction on the end surface of the fitting portion 311b, and the plurality of poles of the electrical connector 300 are configured by these. The end surface of the fitting portion 311b is provided with an inter-electrode wall 311f that rises from the space between the soldering portions 321 of the adjacent second conductive members 320 to one side in the thickness direction. The inter-electrode wall 311f is formed of a synthetic resin similarly to the insulating member 310, but may be formed of an insulating material. The electrical connector to be used for the rod-shaped solder of the present invention is not limitedly interpreted by this embodiment, and a plurality of contacts are provided on the insulating member, and the soldered portions of the contacts are arranged in a row at intervals. Just line up.

  As shown in FIGS. 1 to 3, the rod-shaped solder 100 includes a plurality of thick portions 110 and thin portions 120 provided between the adjacent thick portions 110. The longitudinal direction of the bar-shaped solder 100 is coincident with the width direction. As described above, the width direction, the thickness direction, and the depth direction are orthogonal to each other. The rod-shaped solder 100 is formed in a rectangular shape with the width direction as a long side and the depth direction as a short side when viewed from the thickness direction. The shape may also be In the rod-shaped solder 100, the thickness of each thick portion 110 is the same as viewed from the depth direction, and the thickness of each thin portion 120 is the same, but for each thick portion or for each thin portion. The thicknesses do not have to match. The thick portions 110 are provided at the intervals along the width direction. In this embodiment, the interval is constant. However, since the interval is provided corresponding to the interval between the plurality of second conductive members, the size is determined accordingly. Therefore, the intervals are not constant and may be uneven. As shown in FIG. 1, the thick portion 110 has a first surface 111 having a width larger than the width of each first conductive member 222 on one side in the thickness direction. In the case of this embodiment, the width of the first surface 111 is a width obtained by dividing one surface of the rod-shaped solder 100 in the thickness direction by the number of poles. Therefore, each said 1st surface 111 is following the said width direction, and the surface of the one side of the said thickness direction of the said rod-shaped solder 100 is formed in the plane so that it may mention later. The width of the first surface may be equal to or greater than the width of each first conductive member. As shown in FIG. 2, the thick portion 110 has a second surface 112 having a width smaller than the width of each of the second conductive members 320 on the other side in the thickness direction. The width of the second surface may be the same as or smaller than the width of each of the second conductive members. As shown in FIG. 3, since the width of the first surface 111 is larger than the width of the second surface 112, the thick portion 110 is formed to be trapezoidal when viewed in the depth direction. Therefore, the dimensional ratio between the first surface and the second surface of the rod-shaped solder of the present invention is not limitedly interpreted. In the case of this embodiment, end portions 130 similar to the thin portions are provided on the outer sides in the width direction of the thick portions 110 at both ends in the width direction. The end portion 130 has the same dimension in the depth direction as the thick portion 110 and the thin portion 120. One side of the end portion 130 in the thickness direction is flush with the first surface 111. The outer side in the width direction is a side farther along the width direction than the center of the bar-shaped solder 100 in the width direction. The thick portion 110 is formed to be thicker than other portions including the thin portion 120.

  In the case of the rod-like solder 100, a flat surface is formed on one side of the rod-like solder 100 in the thickness direction. The rod-like solder 100 is formed with a groove 140 that is recessed in the thickness direction from the other side of the rod-like solder 100 in the thickness direction and extends in the depth direction. Two or more grooves are formed so as to be parallel to each other, but may be one. Moreover, although the said groove | channel 140 is linear form, the said groove | channel should just extend along the said depth direction, and may be curvilinear form instead of linear form. And the said thick part 110 is formed in the said width direction both sides of the said groove | channel 140 in the said rod-shaped solder 100, respectively. In addition, the thin portion 120 is formed between the groove 140 and the one surface in the thickness direction of the rod-shaped solder 100.

  Next, according to FIGS. 4 to 12, the plurality of first conductive members 222 are connected to the plurality of second conductive members 320 provided on the insulating member 310 using the rod-shaped solder 100. A soldering method will be described in which 222a, 230a, and 321 are soldered together so that they are arranged in a line at intervals. This soldering method is as follows. As shown in FIG. 7, the plurality of first conductive members 222 and 230, the rod-shaped solder 100, the plurality of second conductive members 320, and a heat fusion apparatus 400 that heats these members are prepared. . As described above and as shown in FIGS. 4 and 7, the plurality of first conductive members 222 and 230 are held by the holder housing 312, and the plurality of second conductive members 320 are the insulating members. The main body housing 311 of 310 is provided. The heat sealing apparatus 400 has a flat surface on one side in the thickness direction as a contact surface 410 and can move in the thickness direction. Then, the contact surface 410 is pressed against the object to be heated with a predetermined pressure, and the object to be heated is heated by passing a current in a predetermined pattern through the contact surface 410 to the object to be heated. is there. Depending on the current control mode, it is called a pulse heat method, a high-frequency heating method, or the like, and by this, the object to be heated can be heated while being pressed for a predetermined time. The heat-sealing device used in the present invention is not limited to the heat-sealing device 400 of this embodiment, and any device that exhibits a function of heating while pressing the object to be heated with a predetermined pressure can be used. Good. First, as shown in FIGS. 8 and 9, the plurality of first conductive members 222, 230, the plurality of second conductive members 320, and the rod-shaped solder 100 are connected to the thick portions 110 of the rod-shaped solder 100. The first conductive members 222, 230 are in contact with the first surface 111, and the second conductive members 320 are in contact with the second surface 112. That is, as shown in FIG. 8, the bar-shaped solder 100 is disposed on the insulating member 310 on one side of the body housing 311 in the thickness direction, and the second surface 112 of each thick portion 110 is disposed on the upper side. The plurality of second conductive members 320 are placed in contact with each other. As shown in FIG. 9, when the holder housing 312 is fitted into the receiving portion 311d of the main body housing 311 of the insulating member 310, the first surface 111 of the thick portion 110 of the rod-like solder 100 is placed on the first surface 111. The first conductive members 222 and 230 are placed on and in contact with each other. This is the state of FIGS. Next, as shown in FIGS. 10, 11 and 12, the first conductive members 222 and 230 are heated to melt the thick portions 110 and the thin portions 120 of the rod-shaped solder 100, respectively. The first conductive members 222 and 230 are soldered to the second conductive members 320, respectively. That is, as shown in FIG. 10, the contact surface 410 of the heat sealing apparatus 400 is brought into contact with the plurality of first conductive members 222 and 230, and the first conductive members 222 and 230 are moved in the thickness direction for the predetermined time. Heat while pressing. Then, the first conductive members 222 and 230, the rod-shaped solder 100, and the second conductive members 320 are heated by heat conduction, heat radiation, and the like, and the thick portions 110 and the respective portions of the rod-shaped solder 100 are heated. The thin portions 120 are melted and the first conductive members 222 and 230 are soldered to the second conductive members 320, respectively. During this time, since the rod-like solder 100 is melted, the soldering portions 222a and 230a of the first conductive members 222 and 230 slightly sink to the lower side which is the other side in the thickness direction. In FIG. 12, reference numeral 170 denotes connection solder formed after the bar-shaped solder 100 is melted.

  In the case of this embodiment, as described above, the first conductive members 222 and 230 are conductors exposed from the ends of the electric wires 220 and 200 such as independent electric wires and shield cables, and the insulating member 310 Is a housing of the electrical connector 300 having a plurality of poles, and each of the second conductive members 320 is a contact that constitutes each of the poles of the electrical connector 300, and the contacts of the contacts adjacent to the housing. An inter-electrode wall 311f that rises in the thickness direction from between the soldering portions 321 is provided. Therefore, in the soldering method, the plurality of first conductive members 222 and 230, the plurality of second conductive members 320, and the rod-shaped solder 100 are connected to the first thick portions 110 of the rod-shaped solder 100. When the first conductive members 222 and 230 are in contact with the surface 111 and the second conductive members 320 are in contact with the second surface 112, the adjacent thick portions 110 are adjacent to each other. The thin portions 120 are arranged so as to face the inter-electrode walls 311f.

  Therefore, in the first embodiment of the rod-shaped solder of the present invention, the plurality of first conductive members 222, 230, the plurality of second conductive members 320, and the rod-shaped solder 100 are connected to each of the above-described rod-shaped solder 100. The first conductive members 222 and 230 are in contact with the first surface 111 of the thick portion 110 and the second conductive members 320 are in contact with the second surface 112, respectively. When the first conductive members 222 and 230 are heated, the thick portions 110 and the thin portions 120 of the rod-shaped solder 100 are melted, and the first conductive members 222 and 230 become the second conductive members 320. Each is soldered.

  In that case, when the rod-shaped solder 100 is heated, the thin-walled portions 120 melt before the thick-walled portions 110, and the rod-shaped solder 100 is separated in the width direction at the thin-walled portions 120, respectively. Each thick part 110 is independent. Next, the independent thick portions 110 are melted and solidified between the first conductive members 222 and 230 and the second conductive members 320 corresponding to the independent thick portions 110, respectively. Since most of the connection solders 170 of the two conductive members 320 are formed, the amount of solder of the connection solders 170 is ensured without excess or deficiency. Therefore, the connection strength of each of the connection solders 170 is ensured, and a gap between adjacent connection solders 170 is ensured. Further, when the rod-shaped solder 100 is heated, the thin portions 120 are melted before the thick portions 110, so that the thin portions 120 remain solid when the thick portions 110 are melted. Therefore, it is difficult to generate unmelted solder and solder balls between the connecting solders 170, so that the reliability of the product is improved.

  Further, the conductors of the electric wires 220 and 200 are connected to the contacts of the electrical connector 300 having a plurality of poles and having inter-electrode walls 311f rising in the thickness direction from between the soldered portions of adjacent contacts in the housing. In the case of soldering, when the rod-shaped solder 100 is used, the first surface 111 of each thick portion 110 of the rod-shaped solder 100 comes into contact with the conductors of the electric wires 220 and 200, respectively, and the second surface 112 is Each of the thin portions 120 between the adjacent thick portions 110 is opposed to each of the interpolar walls 311f, though contacting each of the contacts. Therefore, if the step is provided in the thick wall portion 110 and the thin wall portion 120 on the contact side surface of the rod-shaped solder 100, the thin wall portion 120 can be reliably separated from the inter-electrode wall 311f. It is possible to prevent the interelectrode wall 311f from being damaged by a thermal load, and the thick wall portions 110 are fitted to both sides of the interelectrode wall 311f in the width direction, so that the electric connector 300 of the rod-shaped solder 100 is provided. Positioning accuracy is improved, and variation in the solder amount of each connecting solder 170 is reduced.

  The rod-shaped solder of the present invention is provided with the interval in the thickness direction when the longitudinal direction is the width direction and the thickness direction perpendicular to the width direction is taken. A first surface having a width equal to or greater than the width of each of the first conductive members on one side and a width equal to or less than the width of each of the second conductive members on the other side in the thickness direction. A plurality of thick portions having a second surface and thin portions provided between the adjacent thick portions, and the thickness of the thick portion is the thickness of another portion including the thin portions. What is necessary is just to form thicker than this. However, among such various embodiments, the rod-like solder 100 of the first embodiment further has a flat surface formed on one side in the thickness direction, and the thickness from the other side in the thickness direction. One or more grooves 140 that are recessed in the vertical direction and extend in the depth direction perpendicular to the width direction and the thickness direction are formed, and the thick portions 110 are respectively formed on both sides of the groove 140 in the width direction. The thin portion 120 is formed between the surface on one side in the thickness direction and the groove 140. In this way, the rod-shaped solder of the present invention is realized with a relatively simple configuration. Further, when the rod-shaped solder 100 is used to solder the conductors of the electric wires 220 and 200 to the contacts of the electrical connector 300 having the inter-electrode walls 311f, the rod-shaped solder 100 is attached to the inter-electrode walls 311f. The grooves 140 are arranged to correspond to each other, and the thin wall portion 120 can be reliably separated from the interpolar walls 311f. Therefore, the interpolar walls 311f are damaged by a thermal load. The thick wall portions 110 are fitted on both sides in the width direction of the inter-electrode wall 311f, so that the positioning accuracy of the bar-shaped solder 100 to the electric connector 300 is improved, and each connection solder The variation in the solder amount of 170 is reduced.

  Next, another embodiment will be described. In these other embodiments, the configurations of the first embodiment and the modifications thereof are cited as they are, and configurations different from the configurations of the first embodiment in the other embodiments will be additionally described. 13 to 15 show a second embodiment of the rod-shaped solder of the present invention. The same reference numerals as those used in the first embodiment are used. In the first embodiment, the end surface in the depth direction of the rod-shaped solder 100 and the end surface on the back side are formed in a flat plane. On the other hand, in the second embodiment, the narrow portion in which the cross-sectional area when the cross section is taken along the plane facing the width direction is the smallest in the thin portion 120 in the middle of the thin portion 120 in the width direction. 150 is formed. Therefore, the thin portion 120 is constricted in the narrow portion 150 when viewed along the width direction. That is, in the middle of the thin portion 120 in the width direction, a concave portion 151 that is recessed from the end surface on the near side in the depth direction of the thin portion 120 to the back side is formed, and the deep side in the depth direction of the thin portion 120 is formed. A concave portion 151 is formed to be recessed from the end face to the near side, and the narrow portion 150 is formed between the concave portions 151.

  When the rod-like solder 100 of the second embodiment is heated, the narrow portion 150 of the thin portions 120 is melted first, so that the rod-like solder 100 is separated in the width direction at the thin portions. The action and effect obtained with the rod-like solder 100 of the first embodiment can be obtained more reliably. Further, since the rod-like solder 100 is separated in the width direction in each narrow portion 150 and each thick portion 110 is independent, it is separated in the middle in the width direction by each independent thick portion 110. The half cracks of each thin portion 120 are absorbed. Therefore, the solder amount of each of the connection solders 170 is more accurately ensured, and variations are reduced. Therefore, the connection strength of each connection solder 170 and the clearance between the adjacent connection solders 170 can be more reliably obtained. Further, unmelted solder and solder balls are further formed between the connection solders 170. It is difficult to produce and the reliability of the product is improved. Other configurations, operations, and effects in the second embodiment are the same as those in the first embodiment, and thus description thereof is omitted.

  16 to 18 show a third embodiment of the rod-shaped solder according to the present invention. The same reference numerals as those used in the first embodiment are used. In the said 1st Embodiment, the 1st surface 111 of the said thick part 110 was formed in the flat plane. On the other hand, in the third embodiment, the first surface 111 of the thick portion 110 receives the soldering portions 222a and 230a of the first conductive members 222 and 230 that are recessed in the thickness direction. A portion 160 is formed. In this embodiment, the receiving portion 160 is recessed in an arc shape when viewed in the depth direction, and extends substantially straight from the end surface on the near side in the depth direction of the thick portion 110 to the end surface on the far side in the depth direction. ing. The depth in the thickness direction of the receiving portion 160 is set to a degree that a part of the soldering portions 222a and 230a of the first conductive members 222 and 230 in the thickness direction can enter. However, the shape of the receiving part is not limitedly interpreted by this embodiment, and the receiving part is recessed in the thickness direction on the first surface of the thick part, and the first conductive member. It suffices if it is formed so that a part or the whole of the soldering part is inserted.

  In the rod-like solder 100 of the third embodiment, the soldering portions 222a and 230a of the first conductive members 222 and 230 are inadvertently moved by the receiving portion 160 when soldering. This makes it difficult to improve the soldering workability. Other configurations, operations, and effects in the third embodiment are the same as those in the first embodiment, and a description thereof will be omitted.

  The bar-shaped solder of the present invention includes all embodiments in which the features of the bar-shaped solders of the above-described embodiments and modifications are combined. The soldering method of the present invention includes all the embodiments in which the features of the soldering method of the above embodiment and the modified examples are combined.

DESCRIPTION OF SYMBOLS 100 Rod-shaped solder 110 Thick part 111 1st surface 112 2nd surface 120 Thin part 140 Groove 150 Narrow part 160 Concave part 170 Connection solder 200 Electric wire (shield cable)
220 wires (independent wires)
221 Insulation coating 222 First conductive member (conductor)
222a Soldering portion 230 First conductive member (drain wire)
230a Soldering part 300 Electrical connector 310 Insulating member (housing)
311f Inter-electrode wall 320 Second conductive member (contact)
321 Soldering part 400 Thermal fusion apparatus 410 Contact surface

Claims (6)

A bar-shaped solder used to solder a plurality of first conductive members to a plurality of second conductive members provided on an insulating member in a lump so that each soldering portion is arranged in a row at intervals. There,
When the longitudinal direction is the width direction and the thickness direction orthogonal to the width direction is taken, the first direction is provided at one side of the thickness direction. A plurality of first surfaces having a width equal to or greater than the width of the conductive member and a second surface having a width equal to or less than the width of each of the second conductive members on the other side in the thickness direction; The thick part of
A thin portion provided between each of the adjacent thick portions,
The rod-shaped solder in which the thickness of the thick portion is thicker than the thickness of other portions including the thin portion.   A flat surface is formed on one side of the thickness direction, and one or more grooves that are recessed from the other side of the thickness direction in the thickness direction and extend in the width direction and the depth direction perpendicular to the thickness direction are formed. The rod-shaped member according to claim 1, wherein the thick portions are formed on both sides of the groove in the width direction, and the thin portions are formed between one surface in the thickness direction and the groove. Solder.   The narrow portion where the cross-sectional area when the cross section is taken along the surface facing the width direction is the smallest in the thin portion in the middle of the width direction in the thin portion. Rod solder.   4. The receiving portion according to claim 1, wherein a receiving portion that is recessed in the thickness direction and into which the soldering portion of the first conductive member enters is formed on the first surface of the thick portion. Term bar-shaped solder. 5. The plurality of first conductive members using the bar-shaped solder according to claim 1, and the plurality of second conductive members provided on the insulating member, each soldering portion being spaced apart. It is a soldering method that solders in a lump so as to line up in a row,
The plurality of first conductive members, the plurality of second conductive members, and the bar-shaped solder are connected to the first surfaces of the thick portions of the bar-shaped solder, and the first conductive members are in contact with the first surfaces. Arranged so that each of the second conductive members is in contact with two surfaces,
A soldering method in which the first conductive members are heated to melt the thick portions and the thin portions of the rod-shaped solder, respectively, and solder the first conductive members to the second conductive members, respectively. . Each of the first conductive members is a conductor exposed from the end of the wire,
The insulating member is a housing of an electrical connector having a plurality of poles, and each of the second conductive members is a contact that constitutes each of the poles of the electrical connector. An inter-electrode wall that rises in the thickness direction from between the soldered parts is provided,
The rod-shaped solder is the rod-shaped solder according to any one of claims 1 to 4, wherein the plurality of first conductive members, the plurality of second conductive members, and the rod-shaped solder are replaced with the rod-shaped solder. When the first conductive member is in contact with the first surface of each of the thick portions, and the second conductive member is in contact with the second surface, the adjacent thick wall The soldering method according to claim 5, wherein the thin portions between the portions are arranged so as to face the inter-electrode walls.

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